Process method for improving interlayer alignment accuracy in multilayer co-fired ceramic circuit processing

Abstract

The invention discloses a process method for improving interlayer alignment accuracy in multilayer co-fired ceramic circuit processing. The process method comprises a step of inhibiting deformation of raw ceramic and a step of coating with an adhesive coating before lamination. The step of inhibiting deformation of the raw ceramic comprises: firstly, carrying out demoulding and aging on the raw ceramic, then carrying out secondary lamination on the aged raw ceramic, eliminating a residual stress between a film and the raw ceramic, and reducing a deformation quantity to below 0.03% from conventional over 0.06%; the step of coating with the adhesive coating before lamination comprises the following steps: before the raw ceramic is laminated, coating the raw ceramic with one layer of adhesive coating on a hot plate with a temperature of 35 DEG C to 50 DEG C, implementing adhering of adjacent layers of raw ceramic after lamination, integrally fixing each layer of raw ceramic, and then proceeding a subsequent process. The adhesive coating can be decomposed and discharged at a temperature interval of 400 to 600 DEG C, does not interfere performance of a circuit substrate and has excellent compatibility. The process method disclosed by the invention has the advantages of low cost, wide application range and convenience in use; interlayer alignment accuracy of the circuit substrate can be effectively improved; alignment accuracy is below 30mu m.

Description

technical field

[0001] The invention belongs to the field of multilayer co-fired ceramic circuit processing, and specifically relates to a process method for improving interlayer alignment accuracy in multilayer co-fired ceramic circuit processing. Alignment accuracy. Background technique

[0002] The multi-layer co-fired ceramic circuit represented by LTCC (low temperature co-fired ceramic) has outstanding advantages such as high integration density, microwave / digital / control multi-functional hybrid integration, excellent high-frequency performance, etc., and has gradually become a miniaturized, high-performance T It is the first choice to implement circuit substrates such as / R components, frequency sources, and phased array antennas, and has been widely used in aviation, aerospace, missile-borne, ship-borne and other fields.

[0003] The conventional production process of multi-layer co-fired ceramic circuit boards is: raw porcelain cutting→green porcelain drilling→green...

Examples

Embodiment 1

[0046] 1) After the raw porcelain is cut into the standard process size, tear off the Mylar film 2 that comes with the raw porcelain from the green porcelain 1, as shown in figure 1 shown.

[0047] 2) Dry the green porcelain 1 without film at 60°C for 30 minutes to obtain green porcelain 3 with proper deformation, such as figure 2 shown.

[0048] 3) Paste the organic film 4 coated with a 1 μm low-viscosity coating on one side on the deformed green porcelain 3, as shown in image 3 shown. The thickness of the organic membrane 4 is 50 μm.

[0049] 4) The raw porcelain after the second film is like Figure 4 As shown, the green ceramic 3 and the organic film 4 are well bonded, and the green ceramic can maintain a low amount of deformation during the process of multilayer co-fired ceramic circuits.

[0050] 5) The processing is completed by conventional multi-layer ceramic circuit processes such as punching, filling, printing, stripping, and lamination.

Embodiment 2

[0052] 1) After the raw porcelain is cut into the standard process size, tear off the Mylar film 2 that comes with the raw porcelain from the green porcelain 1, as shown in figure 1 shown.

[0053] 2) The green porcelain 1 without film is placed naturally in a 100,000-class purification environment for 8 hours to obtain green porcelain 3 with proper deformation, such as figure 2 shown.

[0054] 3) Paste the organic diaphragm 4 coated with a 2.5 μm low-viscosity coating on one side on the deformed raw porcelain 3, as shown in image 3 shown. The thickness of the organic membrane 4 is 75 μm.

[0055] 4) The raw porcelain after the second film is like Figure 4 As shown, the green ceramic 3 and the organic film 4 are well bonded, and the green ceramic can maintain a low amount of deformation during the process of multilayer co-fired ceramic circuits.

[0056] 5) The conventional multilayer ceramic circuit technology of punching, hole filling, printing, stripping, lamination...

Embodiment 3

[0066] 1) Tear off the Mylar film A-2 of the original green porcelain A from the green porcelain A-1, and then stick the organic film B coated with the adhesive coating B-1 on a hot stage at 40°C On the back of the green porcelain, the bonding coating is in contact with the back of the green porcelain to form a new structure C. see Figure 5-7 .

[0067] 2) Fabricate through holes 1-1, conductor patterns 1-2, and cavities 1-3 in the first layer of the product on structure C using conventional processes. J-1 is a through hole for optical alignment, and J-2 is an alignment hole for pin stacking, such as Figure 8 shown.

[0068] 3) According to the method in 2), the processing of each layer of raw porcelain except the last layer is completed on the new structure C, such as Figure 9-10 shown.

[0069] 4) Use the conventional process to complete the through hole L-1, the conductor pattern L-2, the through hole J-1 for optical alignment, and the alignment hole J-2 for pin lam...

technical field

[0001] The invention belongs to the field of multilayer co-fired ceramic circuit processing, and specifically relates to a process method for improving interlayer alignment accuracy in multilayer co-fired ceramic circuit processing. Alignment accuracy. Background technique

[0002] The multi-layer co-fired ceramic circuit represented by LTCC (low temperature co-fired ceramic) has outstanding advantages such as high integration density, microwave / digital / control multi-functional hybrid integration, excellent high-frequency performance, etc., and has gradually become a miniaturized, high-performance T It is the first choice to implement circuit substrates such as / R components, frequency sources, and phased array antennas, and has been widely used in aviation, aerospace, missile-borne, ship-borne and other fields.

[0003] The conventional production process of multi-layer co-fired ceramic circuit boards is: raw porcelain cutting→green porcelain drilling→green...

Examples

Embodiment 1

[0046] 1) After the raw porcelain is cut into the standard process size, tear off the Mylar film 2 that comes with the raw porcelain from the green porcelain 1, as shown in figure 1 shown.

[0047] 2) Dry the green porcelain 1 without film at 60°C for 30 minutes to obtain green porcelain 3 with proper deformation, such as figure 2 shown.

[0048] 3) Paste the organic film 4 coated with a 1 μm low-viscosity coating on one side on the deformed green porcelain 3, as shown in image 3 shown. The thickness of the organic membrane 4 is 50 μm.

[0049] 4) The raw porcelain after the second film is like Figure 4 As shown, the green ceramic 3 and the organic film 4 are well bonded, and the green ceramic can maintain a low amount of deformation during the process of multilayer co-fired ceramic circuits.

[0050] 5) The processing is completed by conventional multi-layer ceramic circuit processes such as punching, filling, printing, stripping, and lamination.

Embodiment 2

[0052] 1) After the raw porcelain is cut into the standard process size, tear off the Mylar film 2 that comes with the raw porcelain from the green porcelain 1, as shown in figure 1 shown.

[0053] 2) The green porcelain 1 without film is placed naturally in a 100,000-class purification environment for 8 hours to obtain green porcelain 3 with proper deformation, such as figure 2 shown.

[0054] 3) Paste the organic diaphragm 4 coated with a 2.5 μm low-viscosity coating on one side on the deformed raw porcelain 3, as shown in image 3 shown. The thickness of the organic membrane 4 is 75 μm.

[0055] 4) The raw porcelain after the second film is like Figure 4 As shown, the green ceramic 3 and the organic film 4 are well bonded, and the green ceramic can maintain a low amount of deformation during the process of multilayer co-fired ceramic circuits.

[0056] 5) The conventional multilayer ceramic circuit technology of punching, hole filling, printing, stripping, lamination...

Embodiment 3

[0066] 1) Tear off the Mylar film A-2 of the original green porcelain A from the green porcelain A-1, and then stick the organic film B coated with the adhesive coating B-1 on a hot stage at 40°C On the back of the green porcelain, the bonding coating is in contact with the back of the green porcelain to form a new structure C. see Figure 5-7 .

[0067] 2) Fabricate through holes 1-1, conductor patterns 1-2, and cavities 1-3 in the first layer of the product on structure C using conventional processes. J-1 is a through hole for optical alignment, and J-2 is an alignment hole for pin stacking, such as Figure 8 shown.

[0068] 3) According to the method in 2), the processing of each layer of raw porcelain except the last layer is completed on the new structure C, such as Figure 9-10 shown.

[0069] 4) Use the conventional process to complete the through hole L-1, the conductor pattern L-2, the through hole J-1 for optical alignment, and the alignment hole J-2 for pin lam...

Images