LED packaging glue molding structure and method

Abstract

The present invention provides an LED encapsulation glue molding structure and a method thereof. The LED encapsulation glue molding structure is used to perform encapsulation glue molding operations on an LED substrate, and the LED encapsulation glue molding structure includes: a printing screen, a plurality of printing ports are provided on the printing screen, and the plurality of printing ports are arranged one-to-one corresponding to the openings of a bowl-cup structure groove on the LED substrate; a scraper, and the scraper is used to scrape the encapsulation glue into each printing port to fill the bowl-cup structure groove and solidify it. The application of the technical solution of the present invention can solve the problem of low production efficiency in the prior art when encapsulation glue molding is performed on an LED substrate with a bowl-cup design structure.

Description

Technical Field

[0001] The present invention relates to the technical field of LED production technology, and in particular to an LED packaging adhesive molding structure and a method thereof. Background Art

[0002] Traditional LED packaging glue molding methods mainly include molding and dispensing. The molding method is mainly used for LED substrates of flat brackets to mold specific lens structures to meet the different light type requirements of LED lamps of flat brackets. In the prior art, the packaging glue molding of LED substrates with bowl-cup design structures can only be produced by dispensing. Due to the simple process of dispensing, it is widely used in LED packaging structures. However, the disadvantage of dispensing is low production efficiency and can only dispense glue one by one. Summary of the invention

[0003] The object of the present invention is to provide an LED encapsulation glue molding structure and method thereof, aiming to solve the problem of low production efficiency in the prior art when encapsulation glue molding is performed on an LED substrate with a bowl-cup design structure.

[0004] In order to solve the above technical problems, the technical solution of the present invention is: to provide an LED packaging glue molding structure, which is used to perform packaging glue molding operations on the LED substrate. The LED packaging glue molding structure includes: a printing screen, on which a plurality of printing ports are opened, and the plurality of printing ports are arranged one by one corresponding to the openings of the bowl-cup structure groove on the LED substrate; a scraper, which is used to scrape the packaging glue into each printing port to fill the bowl-cup structure groove and solidify it into shape.

[0005] Optionally, each printing port is provided with a flange, and when the printing screen is placed on the LED substrate, the flange extends into the groove of the bowl-cup structure, and the flange is attached to the groove wall of the bowl-cup structure groove.

[0006] Optionally, the extension length of each flange is smaller than the width of the groove wall of the bowl-cup structure groove.

[0007] Optionally, the rubber scraping surface of the scraper is in the shape of a plane.

[0008] Optionally, a recess for accommodating the packaging glue material is provided on the scraping surface of the scraper.

[0009] According to another aspect of the present invention, there is provided a method for forming an LED encapsulation adhesive, comprising the following steps: placing a printed screen on an LED substrate, and arranging the printing openings on the printed screen in one-to-one correspondence with the openings of a bowl-cup structure groove on the LED substrate; covering the surface of the printed screen with encapsulation adhesive; and using a scraper to scrape the encapsulation adhesive into each of the printing openings along a predetermined direction, and allowing the encapsulation adhesive to fill the bowl-cup structure groove.

[0010] Optionally, a stamping process is used to manufacture the printing opening on the printing screen.

[0011] Optionally, after the packaging glue fills the groove of the bowl-cup structure, the printing screen is separated from the LED substrate, and then the LED substrate is kept horizontally placed and shaken back and forth to allow the packaging glue to fill the groove of the bowl-cup structure.

[0012] In the present invention, through the LED packaging glue molding structure, multiple bowl-cup structure grooves can be filled with packaging glue at one time, the production efficiency is improved, and the bowl-cup structure grooves will not be missed and not packaged, and the packaging yield is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is a schematic diagram of the main structure of an embodiment of the packaging glue molding structure of the present invention;

[0014] Figure 2 yes Figure 1 Schematic diagram of the cross-sectional structure of AA;

[0015] Figure 3 It is a schematic diagram of a structure in which a scraper of one embodiment of the packaging glue molding structure of the present invention is placed on a printing screen;

[0016] Figure 4 is a first diagram of an operation of scraping packaging glue material according to an embodiment of the packaging glue molding structure of the present invention;

[0017] Figure 5 is a second diagram of the packaging glue material scraping operation of the embodiment of the packaging glue molding structure of the present invention;

[0018] Figure 6 It is a schematic structural diagram of an embodiment of the encapsulation adhesive molding structure of the present invention after the encapsulation adhesive material is filled. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0020] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0021] It should also be noted that the directional terms such as left, right, up, and down in this embodiment are merely relative concepts or are based on the normal use status of the product and should not be considered as restrictive.

[0022] like Figure 1 , Figure 2 , Figure 4 and Figure 5 As shown, the LED encapsulation glue molding structure of this embodiment is used to perform encapsulation glue molding operations on the LED substrate 100. The LED encapsulation glue molding structure includes a printing screen 10 and a scraper 20. The printing screen 10 is provided with a plurality of printing ports 11. The plurality of printing ports 11 are arranged one-to-one corresponding to the openings of the bowl-cup structure groove on the LED substrate 100. The scraper 20 is used to scrape the encapsulation glue 200 into each printing port 11 to fill the bowl-cup structure groove and solidify it into shape.

[0023] The printing opening 11 on the printing screen 10 is set one by one with the bowl-cup structure groove on the LED substrate 100 where the encapsulation adhesive 200 needs to be installed, and then the encapsulation adhesive 200 is scraped into the printing opening 11 by the scraper 20 and introduced into the bowl-cup structure groove for curing and encapsulation. By using the LED encapsulation adhesive molding structure of this embodiment, the encapsulation adhesive 200 can be filled into multiple bowl-cup structure grooves at one time, the production work efficiency is improved, and the bowl-cup structure groove will not be missed and not encapsulated, and the encapsulation yield rate is high.

[0024] The printing ports 11 of the printing screen 10 of this embodiment are arranged one-to-one according to the design structure of the bowl-cup structure groove on the LED substrate 100, so that the shape and size of the printing port 11 are arranged one-to-one with the shape and size of the bowl-cup structure groove.

[0025] like Figure 5 As shown, the diameter d of each printing opening 11 on the printing screen 10 is smaller than the diameter D of the groove of the bowl-cup structure groove on the LED substrate 100. In addition, each printing opening 11 is provided with a flange 12. When the printing screen 10 is placed on the LED substrate 100, the flange 12 extends into the bowl-cup structure groove, and the flange 12 is attached to the groove wall of the bowl-cup structure groove. In this way, the flange 12 corresponds to the bowl-cup structure groove, and can be used as a positioning member to position the printing screen 10 on the LED substrate 100, and the encapsulation glue 200 can be introduced into the bowl-cup structure groove through the flange 12, so that the filling operation of the encapsulation glue 200 is simpler and more convenient. At the same time, the smaller diameter printing opening 11 can also prevent the encapsulation glue 200 from penetrating into the edge position of the bowl-cup structure groove of the LED substrate 100.

[0026] like Figure 2 , Figure 4 and Figure 5As shown in FIG. 1 , after the bowl-cup structure groove is filled with the encapsulating adhesive 200, in order to facilitate the separation of the printing screen 10 from the LED substrate 100, the extension length of each flange 12 is designed to be smaller than the width of the groove wall of the bowl-cup structure groove, so that the distance of the flange 12 filled with the encapsulating adhesive 200 is shorter, so that the printing screen 10 is easy to separate. After the printing screen 10 is separated from the LED substrate 100, the encapsulating adhesive 200 quickly overflows the original space of the flange 12, and then the encapsulating adhesive 200 begins to solidify, as shown in FIG. Figure 6 , which shows the LED component after curing is completed.

[0027] The packaging glue 200 of this embodiment can be a thermosetting material such as silicone, epoxy, etc. Further, according to the needs of the LED product, materials such as phosphors and diffusion powders can be mixed in the packaging glue 200, and then the filling operation can be performed.

[0028] In this embodiment, the scraping surface of the scraper 20 is in the shape of a plane. Figure 3 As shown, the scraper 20 may also be provided with a recess on the scraping surface for accommodating the encapsulating adhesive 200. In this case, the bowl-cup structure grooves on the LED substrate 100 are distributed in a rectangular array, and one recess on the scraper 20 corresponds to a row of bowl-cup structure grooves on the LED substrate 100. This can facilitate the encapsulating adhesive 200 to be more easily filled into the bowl-cup structure grooves when scraping the encapsulating adhesive 200. Specifically, the multiple recesses on the scraping surface of the scraper 20 form a wavy profile, or the multiple recesses form a zigzag profile, or the contours of the multiple recesses are formed by combining a wavy profile and a zigzag profile. Of course, the contour shape of the recess on the scraping surface of the scraper 20 can also be other forms.

[0029] According to another aspect of the present invention, a method for molding LED packaging adhesive is provided.

[0030] The LED encapsulation glue molding method includes the following steps: placing a printing screen 10 on an LED substrate 100, and setting the printing openings 11 on the printing screen 10 to correspond one to one with the openings of the bowl-cup structure groove on the LED substrate 100; covering the encapsulation glue material 200 on the surface of the printing screen 10; using a scraper 20 to scrape the encapsulation glue material 200 into each printing opening 11 along a predetermined direction, and allowing the encapsulation glue material 200 to fill the bowl-cup structure groove.

[0031] In this forming method, a stamping process is used to manufacture the printing port 11 on the printing screen 10. According to the actual design needs, the printing port 11 is punched out on a thin steel plate using a stamping machine to form the printing screen 10. This is convenient and quick, and the process is simple and has a high precision compliance rate, that is, the coaxiality between the printing port 11 and the groove of the bowl and cup structure.

[0032] After the encapsulation adhesive 200 fills the bowl-cup structure groove, the printing screen 10 is separated from the LED substrate 100. At this time, since the flange 12 on the printing screen 10 is separated from the bowl-cup structure groove, the space vacated by the flange 12 is not filled with the encapsulation adhesive 200. Therefore, the LED substrate 100 is kept horizontally placed and reciprocatedly shaken to fill the bowl-cup structure groove with the encapsulation adhesive 200. Then the LED substrate 100 is placed still to be cured and formed.

[0033] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An LED packaging adhesive molding structure, characterized in that: Used for performing packaging glue molding operation on an LED substrate (100), the LED packaging glue molding structure comprising: A printing screen (10), wherein a plurality of printing openings (11) are provided on the printing screen (10), and the plurality of printing openings (11) are arranged in one-to-one correspondence with the openings of the bowl-cup structure groove on the LED substrate (100); A scraper (20), the scraper (20) being used to scrape the encapsulating adhesive (200) into each of the printing ports (11) to fill the grooves of the bowl-cup structure and solidify and shape the grooves; Each of the printing ports (11) is provided with a flange (12), and when the printing screen (10) is placed on the LED substrate (100), the flange (12) extends into the bowl-cup structure groove, and the flange (12) is attached to the groove wall of the bowl-cup structure groove; The printing screen (10) is formed by punching out a thin steel plate; The extension length of each flange (12) is smaller than the width of the groove wall of the bowl-cup structure groove.

2. The LED packaging adhesive molding structure according to claim 1, characterized in that: The rubber scraping surface of the scraper (20) is in the shape of a plane.

3. The LED packaging adhesive molding structure according to claim 1, characterized in that: A recess for accommodating the packaging adhesive (200) is provided on the scraping surface of the scraper (20).

4. A method for molding LED packaging glue, characterized in that: The LED packaging adhesive molding method is operated by using the LED packaging adhesive molding structure according to any one of claims 1 to 3, and the LED packaging adhesive molding method comprises the following steps: Placing a printing screen (10) on an LED substrate (100), and making the printing openings (11) on the printing screen (10) correspond to the openings of the bowl-cup structure groove on the LED substrate (100) one by one, and each printing opening (11) is provided with a flange (12), and when the printing screen (10) is placed on the LED substrate (100), the flange (12) extends into the bowl-cup structure groove, and the flange (12) is attached to the groove wall of the bowl-cup structure groove; Covering the packaging adhesive (200) on the surface of the printing screen (10); A scraper (20) is used to scrape the encapsulating adhesive material (200) into each of the printing openings (11) along a predetermined direction, and the encapsulating adhesive material (200) fills the groove of the bowl-cup structure.

5. The LED packaging adhesive molding method according to claim 4, characterized in that: The printing opening (11) on the printing screen (10) is manufactured using a stamping process.

6. The LED packaging adhesive molding method according to claim 4, characterized in that: After the encapsulating adhesive (200) fills the bowl-cup structure groove, the printing screen (10) is separated from the LED substrate (100), and then the LED substrate (100) is kept horizontally placed and reciprocatedly shaken to allow the encapsulating adhesive (200) to fill the bowl-cup structure groove.

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