Driving chip, display substrate, display device and manufacturing method of display device

Abstract

The present invention discloses a driving chip, a display substrate, a display device and a method for manufacturing the display device. The driving chip according to the present invention comprises a substrate and a plurality of connecting bumps and a plurality of supporting bumps arranged on the substrate, wherein the plurality of connecting bumps comprises at least one group of connecting bumps arranged along a first direction, and the plurality of supporting bumps comprises supporting bumps respectively located between adjacent connecting bumps arranged along the first direction. Through the arrangement of the supporting bumps, the probability of problems such as signal line breakage occurring during the manufacture of the display device is effectively reduced, and the yield rate of the finished product is improved.

Description

Technical Field

[0001] The present invention relates to the field of display driving, and more specifically, to a driving chip, a display substrate, a display device and a method for manufacturing the display device. Background Art

[0002] Flexible substrates are increasingly widely used in display devices due to their thinness, lightness and good impact resistance. When manufacturing such display devices, the flexible substrate is generally fixed on a glass substrate first, and then the flexible display panel manufacturing process is carried out. Such a process is compatible with existing LCD devices. After the flexible display panel is manufactured, the flexible substrate is separated from the glass substrate, and a film material (back film) is attached to the back of the flexible substrate to flatten the flexible substrate. Then, processes such as chip-on-film (COF) bonding are carried out to achieve driving chip (driving chip, also known as driver IC, which usually has an integrated circuit) bonding. However, COF has a high cost, and its circuit cannot be made too thin and cannot correspond to high-resolution products.

[0003] Directly bonding the driver chip (COP: Chip on plastic) to the flexible display panel is the future development direction. However, the driver chip has a high hardness. When it is pressed and bonded to the flexible display panel, it is affected by the large bonding pressure, which can easily cause the connection bump on the driver chip to sink and the flexible display panel to deform, which in turn causes the metal wiring connected to the connection pad on the flexible display panel to break, resulting in product defects such as open circuit or short circuit. Summary of the invention

[0004] The object of the present invention is to provide a flexible display device with low cost, high resolution and high yield.

[0005] To this end, the first aspect of the present invention provides a driving chip, including a substrate and a plurality of connecting bumps and a plurality of supporting bumps arranged on the substrate, the plurality of connecting bumps including at least one group of connecting bumps arranged along a first direction, and the plurality of supporting bumps including supporting bumps respectively located between adjacent connecting bumps arranged along the first direction.

[0006] Furthermore, the plurality of connecting bumps further include at least one group of connecting bumps arranged along a second direction, the second direction is different from the first direction, and the plurality of supporting bumps include supporting bumps respectively located between adjacent connecting bumps arranged along the second direction.

[0007] Furthermore, the plurality of connecting bumps further include a connecting bump group arranged along a second direction, the second direction is different from the first direction, and the plurality of supporting bumps include supporting bumps arranged along the second direction correspondingly disposed on at least one side of the connecting bump group arranged along the second direction.

[0008] Furthermore, the plurality of supporting bumps further include a supporting bump located at at least one end of the connecting bumps arranged along the first direction.

[0009] Furthermore, the plurality of supporting bumps further include a supporting bump located at at least one end of the connecting bumps arranged along the second direction.

[0010] Furthermore, the driving chip includes an input region and an output region, the input region includes a plurality of input bumps, the output region includes a plurality of output bumps, and the connecting bumps are input bumps or output bumps.

[0011] Furthermore, the driving chip includes an input area and an output area, and the supporting bumps further include supporting bumps regularly arranged in the middle area of ​​the driving chip.

[0012] Furthermore, the thickness of the supporting bump is less than or equal to the thickness of the connecting bump.

[0013] A second aspect of the present invention provides a display substrate, comprising at least one group of connection pads arranged along a first direction on the display substrate, and the display substrate further comprises support pads arranged between adjacent connection pads arranged along the first direction.

[0014] Furthermore, the display substrate further includes at least one group of connection pads arranged along a second direction, the second direction is different from the first direction, and support pads are arranged between adjacent connection pads arranged along the second direction.

[0015] A third aspect of the present invention provides a display device, comprising:

[0016] A flexible display panel comprises a display substrate and a connection pad arranged on the display substrate; and

[0017] A driver chip according to the first aspect of the present invention;

[0018] The connection bumps on the driving chip correspond one-to-one to the connection pads on the display substrate and are electrically connected.

[0019] Furthermore, the connection protrusion is connected to the corresponding connection pad by crimping and binding.

[0020] Furthermore, the size of the connection pad is larger than the size of the corresponding connection bump.

[0021] Furthermore, the flexible display panel also includes a support pad formed on the display substrate and corresponding to the support bump of the driving chip.

[0022] A fourth aspect of the present invention provides a method for manufacturing a display device, the method comprising the following steps:

[0023] A flexible display panel is provided, comprising a display substrate and a connection pad arranged on the display substrate;

[0024] Providing a driving chip according to the first aspect of the present invention;

[0025] The connection bumps on the driving chip are aligned one by one with the connection pads on the display substrate and are electrically connected.

[0026] Furthermore, the connection bumps are electrically connected to the corresponding connection pads by crimping and binding.

[0027] The beneficial effects of the present invention are as follows:

[0028] In the technical solution described in the present invention, by at least arranging supporting bumps between adjacent connecting bumps arranged in rows of the driving chip, and further by directly combining the driving chip with the flexible display panel to form a low-cost and high-resolution display device, the probability of problems such as signal line breakage occurring during the production of the display device is effectively reduced, thereby improving the yield of finished products. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The specific implementation modes of the present invention are further described in detail below in conjunction with the accompanying drawings.

[0030] Figure 1 FIG. 1 is a schematic diagram showing a driving chip according to a first embodiment of the present invention.

[0031] Figure 2 A schematic diagram showing the connection between a display substrate and a driver chip in an output region of a driver chip according to a second embodiment of the present invention is shown.

[0032] Figure 3 FIG. 4 is a schematic diagram of a driving chip in a third embodiment of the present invention.

[0033] Figure 4 FIG. 4 is a schematic diagram of a driver chip according to a fourth embodiment of the present invention.

[0034] Figure 5 A photo showing the prior art driving chip and the flexible display panel after being crimped and bound;.

[0035] Figure 6 The schematic diagram of the defective structure of the crimping binding between the driving chip and the flexible display panel in the prior art is shown.

[0036] Figure 7The manufacturing process of the display device according to the embodiment of the present invention is shown. DETAILED DESCRIPTION

[0037] In order to more clearly illustrate the present invention, the present invention is further described below in conjunction with preferred embodiments and accompanying drawings. Similar components in the accompanying drawings are represented by the same reference numerals, and each component is not drawn to scale. It should be understood by those skilled in the art that the content described below is illustrative rather than restrictive, and should not be used to limit the scope of protection of the present invention.

[0038] Those skilled in the art will appreciate that the driver chip includes an input area and an output area that are usually arranged adjacent to the edge of the chip, the input area includes a plurality of input bumps, and the output area includes a plurality of output bumps. In the present invention, the term "connection bump" refers to an input bump or an output bump in the input area or output area of ​​the driver chip that is used to electrically connect to a connection pad on a flexible display panel or to electrically connect to a flexible printed circuit board FPC. The connection bump is electrically connected to the drive circuit in the driver chip, and the input signal from the FPC is processed and output to the flexible display panel to achieve driving and control of the display panel. In the present invention, the term "support bump" refers to a bump that has no signal or electrical conduction function and can play a supporting role.

[0039] like Figure 1As shown, the first embodiment of the present invention provides a driving chip, including a substrate 100 and a plurality of connecting bumps 111, 121 and a plurality of supporting bumps 112, 122 arranged on the substrate. The driving chip includes an input area 110 and an output area 120, which are respectively arranged adjacent to the two long sides of the driving chip, so as to facilitate the electrical connection between the driving chip and the flexible display panel. In the input area 110 of the driving chip, a group of connecting bumps arranged in the direction of the row are included, and a first supporting bump 112 is respectively arranged between adjacent connecting bumps. In the output area 120 of the driving chip, two groups of connecting bumps are arranged in the direction of the row, and a first supporting bump 122 is respectively arranged between each group of adjacent connecting bumps in the row direction. It should be understood that the number of connecting bumps and the number of rows of connecting bumps, the size of the connecting bumps, and the shape and size of the first supporting bumps can be set as needed. In different areas, the sizes of connecting bumps of different groups can be the same or different. The sizes of the first supporting bumps located between the connecting bumps in different areas can be the same or different. If the first support bump is too small, it cannot evenly disperse or withstand the pressure of the connection bump in the crimping binding process and the pressure of the flexible display panel to prevent the deformation of the flexible display panel, and the flexible display panel is prone to deformation, resulting in wiring breakage. If the first support bump is too large, it is difficult to accurately position the support bump between adjacent connection pads of the flexible display panel, which may affect the effective electrical connection between the driver chip connection bump and the flexible display panel connection pad. Those skilled in the art can determine the specific size of the connection bump and the first support bump based on the layout of the connection bump, the layout of the first support bump, and the wiring scheme of the display panel.

[0040] Figure 1 As further shown in FIG. 1 , as a preferred embodiment, the driver chip further includes second support bumps 152 located at both ends of a group of connection bumps arranged along a row. In another preferred embodiment, the driver chip further includes a second support bump 162 located in the middle area of ​​the driver chip between the input area and the output area. Figure 1 The second support bumps in the middle area are arranged regularly while the support bumps in the edge area are arranged in an incompletely corresponding manner. It should be understood that the layout of the second support bumps in the middle area is not limited to that shown in the figure. The second support bumps should be arranged as evenly and symmetrically as possible to avoid deformation of the driver chip under stress. Different from the first support bumps 112, 122 located between the connecting bumps, the second support bumps 152 located in the edge area and the second support bumps 162 located in the center area both play a role in preventing the driver chip from being deformed during the crimping and binding process, which may affect the electrical performance or even cause cracking.

[0041] Figure 2A schematic diagram showing the corresponding electrical connection relationship between the driver chip connection bump and the connection pad of the flexible display panel according to the second embodiment of the present invention is shown. In this embodiment, the output area 120 of the driver chip 100 is connected to the flexible display panel 200. For example, as shown in the figure, the output area of ​​the driver chip includes two groups of connection bumps 121 arranged in rows. A first support bump is respectively arranged between some adjacent connection bumps in the direction of the row, see area A, and there is no support bump between some connection bumps, such as area B, and two first support bumps are arranged between other adjacent connection bumps. The size of the connection pad 210 is generally larger than the size of the corresponding connection bump, and the first support bump corresponds to the connection pad one by one and is electrically connected. In this embodiment, the wiring of the connection pad extends between the connection pads arranged in rows, and the first support bump is arranged in rows between the connection bumps. On the one hand, this arrangement provides support for the flexible display panel, especially the area between the corresponding connection pads of the flexible display panel, to prevent the flexible display panel from deforming in an electrical connection process such as crimping and binding, resulting in the breakage of the connection wiring. On the other hand, not arranging the support bumps between the rows of connection bumps can avoid applying pressure to the connection wiring between the rows and causing deformation during the binding process. In this way, the quality of the connection wiring of the flexible display panel during the binding process of the driver chip and the flexible display panel is effectively improved, and the process stability and product quality of the entire display device are improved.

[0042] The technicians of the present invention have found that a low-cost and high-resolution flexible display device can be obtained by directly electrically connecting the driver chip to the display device of the flexible display panel. In the embodiment of the present invention, at least a first supporting bump is provided between adjacent connecting bumps arranged in a row on the driver chip to reduce the blank area between each connecting bump, so that when the connecting bump is electrically connected to the flexible display panel, especially when the electrical connection is performed by crimping binding, the first supporting bump can play a role in supporting the flexible display panel, greatly reducing the deformation probability and degree of the flexible display panel during electrical connection, and further reducing the occurrence of defects such as disconnection or short circuit caused by deformation or breakage of the metal signal line connecting the connecting bump and the display device on the flexible display panel due to force, thereby improving the product yield.

[0043] In a preferred example, the thickness of the supporting protrusions 112 , 122 , 152 , 162 is less than or equal to the thickness of the connecting protrusion 111 .

[0044] The “thickness” here refers to the height of the connecting bump and the supporting bump protruding from the surface of the driving chip in a direction perpendicular to the substrate.

[0045] When the thickness of the first supporting bumps 112 , 122 between adjacent connecting bumps is less than or equal to the thickness of the connecting bumps 111 , 121 , the supporting bumps 112 , 122 can not only play a good supporting role but also improve the connection reliability of the connecting bumps 111 , 121 .

[0046] Specifically, when the thickness of the supporting bumps 112, 122, 152, and 162 is the same as the thickness of the connecting bumps 111 and 121, during the electrical connection between the driving chip and the flexible display panel, the force on the flexible display panel is more balanced and the degree of bending deformation is smaller, thereby greatly reducing the risk of circuit breaks or short circuits caused by breakage of the metal signal lines on the flexible display panel.

[0047] When the thickness of the first support bump and the second support bump is less than the thickness of the connecting bump, the flexible display panel will be deformed to a certain extent until it contacts the support bump, but the deformation is relatively small, which can well prevent the metal signal line from breaking. The thickness of the support bump can be set according to actual needs. In a preferred example, the thickness of the support bump is 1 / 2 to 7 / 8, 3 / 4-7 / 8, etc. of the thickness of the connecting bump 111.

[0048] In a preferred example, the distance between the first supporting bump 112 and the adjacent connecting bump 111 is 30 μm-40 μm. It is understood that, at this time, the distance between the two can be any value or range between 30 μm and 40 μm. For example, the distance between the two is 30 μm, 32 μm, 34 μm, 36 μm, 38 μm, etc.

[0049] Usually, the material of the connecting bumps 111, 121 on the driver chip can be selected from metal materials with good ductility and conductivity, such as gold. When the driver chip is electrically connected to the flexible display panel, the connecting bumps 111, 121 will be depressed, deformed and extended to a certain extent under the action of pressure. Limiting the distance between the first supporting bumps 112, 122 and the adjacent connecting bumps 111 to 30μm-40μm can effectively prevent the connection between the supporting bumps 112, 122 and the adjacent connecting bumps 111, 121 and when the driver chip is electrically connected to the flexible display panel, the connection pad and the adjacent first supporting bumps 112, 122 are too small to align the position, resulting in overlapping short circuits, or the supporting effect of the supporting bumps 112, 122 is not obvious due to the distance being too large.

[0050] In a preferred embodiment, the length of the first support bumps 112, 122 along the row direction is 8μm-15μm. The length of the first support bumps 112, 122 along the row direction refers to the distance between the two points on the upper surface of the support bump 112 that are farthest apart in the row direction. The length of the support bumps 112, 122 is selected to play a supporting role to prevent deformation of the flexible display panel, but to prevent the adjacent connection pads from overlapping on the same first support bump due to their excessive length, thereby causing a short circuit.

[0051] In another preferred example, the support bumps 112, 122 and the connecting bumps 111, 121 are made of the same material. For example, materials with good ductility and conductivity, such as gold, can be selected. Of course, according to different production needs, the specific materials, process parameters, etc. can be flexibly adjusted to match the production equipment. It can be understood that the support bumps 112, 122 and the connecting bumps 111, 121 of the same material have similar hardness and can also be made by the same manufacturing process, which is easy to produce.

[0052] In yet another preferred example, the size of the first supporting protrusion is smaller than that of the adjacent connecting protrusion.

[0053] Specifically, in this article, the size of the supporting bump is smaller than the size of the adjacent connecting bump, which may be that the length of the supporting bump along the row direction is smaller than the length of the connecting bump, or the width of the first supporting bump perpendicular to the row direction is smaller than the width of the adjacent connecting bump. Furthermore, those skilled in the art can understand that, in this case, the area of ​​the first supporting bump is smaller than the area of ​​the adjacent connecting bump.

[0054] In this embodiment, there is no specific requirement for the specific shape of the first supporting protrusions 112 and 122, as long as they can play a supporting role. In a preferred example, the shape of the supporting protrusion is cylindrical, elliptical, rectangular or cube-shaped. In this case, the surface of the supporting protrusion that plays a supporting role is relatively large, and the effect of preventing the flexible display panel from bending and deforming is prominent, thereby preventing the metal signal line from breaking.

[0055] In order to further improve the force balance of the flexible display panel during the electrical connection process, in a preferred example, the driver chip also includes a second supporting protrusion 162 arranged in the middle area between the signal input area 110 and the signal output area 120 .

[0056] In a further preferred example, the plurality of second supporting protrusions 162 may be arranged in a single row ( Figure 1 ) or multiple lines ( Figure 3), evenly distributed between the input area and the output area of ​​the driver chip, and can be symmetrical or asymmetrical. The arrangement makes the driver chip evenly stressed, avoiding deformation and damage of the driver chip itself, and improving product yield.

[0057] In addition, in the embodiment of the present invention, the material and shape of the supporting bumps 152 and 162 can be the same as those of the first supporting bumps 112 and 122. Accordingly, the connecting bumps and the supporting bumps can be manufactured by the same manufacturing process.

[0058] In a third embodiment of the present invention, a driver chip is provided, such as Figure 3 As shown, the driver chip includes an input area 110 and an output area 120 arranged along the long side, and the output area 120 includes three groups of connection bumps 121 and first support bumps 122 arranged along the row direction. The arrangement of the input area connection bumps and the first support bumps is the same as that of the first embodiment and will not be repeated here. In this embodiment, the driver chip 100 further includes an output area 130 arranged adjacent to the two short sides of the driver chip. Specifically, the output area 130 includes three columns of connection bumps 131 arranged along the column direction, and a first support bump 132 is respectively arranged between adjacent connection bumps in each column, which is used to avoid the breakage of the wiring on the flexible display panel caused by the large gap between the connection bumps in the process of electrically connecting the driver chip to the flexible display panel, thereby improving the product quality. It can be understood that the flexible display panel includes connection pads corresponding to the connection bumps of the output area 130 of the driver chip, and the first support bump is located between the corresponding connection pads to reduce the gap between the connection pads and improve the quality of the display device.

[0059] According to a preferred example of this embodiment, the second support block 162 is disposed in the middle of the driving chip along the row direction to provide support for the driving chip.

[0060] In a fourth embodiment of the present invention, a driver chip is provided, such as Figure 4As shown, the driver chip includes an input area 110 and an output area 120 arranged along the long side, and the output area 120 includes three groups of connection bumps 121 and first support bumps 122 arranged along the row direction. The arrangement of the input area connection bumps and the first support bumps is the same as that of the first embodiment and will not be repeated here. In this embodiment, the driver chip 100 further includes an output area 140 arranged adjacent to the two short sides of the driver chip. Specifically, the output area 140 includes a connection bump group of three columns of connection bumps 141 arranged along the column direction. The outer sides of the connection bump group are respectively provided with first support bumps 132 arranged along the column, which correspond to the adjacent connection bumps one by one, respectively, to avoid the breakage of the wiring on the flexible display panel caused by the connection setting in the process of electrically connecting the driver chip to the flexible display panel, thereby improving the product quality. It can be understood that the flexible display panel includes connection pads corresponding to the connection bumps of the output area 140 of the driver chip one by one, and the first support bumps are located outside the corresponding connection pads to reduce the gap between the connection pads and improve the quality of the display device. Further, the output area 140 includes a connection bump group of three columns of connection bumps 141 and first support bumps 142 arranged along the columns on both sides of the connection bump group. After reading the present invention, those skilled in the art can reasonably arrange the positions and sizes of the support bumps as needed to solve the technical problems of the present invention.

[0061] In another embodiment of the present invention, a display substrate is provided, comprising at least one group of connection pads arranged along a first direction on the display substrate, and support pads are arranged between adjacent connection pads arranged along the first direction. In the case where the thickness of the support bump is less than the connection thickness, the support pads can be arranged at positions corresponding to the support bumps on the flexible display panel to make the driving chip and the flexible display panel bear force uniformly.

[0062] In a preferred example, the display substrate further includes at least one group of connection pads arranged along a second direction, the second direction is different from the first direction, and support pads are arranged between adjacent connection pads arranged along the second direction.

[0063] In another embodiment of the present invention, a display device is provided, the display device comprising:

[0064] A flexible display panel comprises a display substrate and a connection pad arranged on the display substrate; and

[0065] A driver chip provided according to the above embodiment;

[0066] The connection bumps on the driving chip correspond one-to-one to the connection pads on the display substrate and are electrically connected.

[0067] In a preferred example, the size of the connection pad is larger than the size of the corresponding connection bump, so that after electrical connection, the outer contour of the connection pad is larger than the outer contour of the connection bump. In this way, the connection bump can be located as far as possible below the connection pad, increasing the contact area between the two and improving the reliability of the electrical connection.

[0068] In the display device shown in this embodiment, the flexible display panel is a corresponding flexible display panel of conventional structure in the art, for example, it also includes a display device, which is not described here. In the flexible display panel, a corresponding connection pad is provided on the flexible circuit board, one end of which is electrically connected to the connection bump located in the signal input area of ​​the driver chip, and the other end is connected to the wiring in the flexible circuit board through the corresponding metal signal line; Figure 2 In the flexible display panel, the display device is electrically connected to the connection pad 210 formed on the display substrate 200 through the corresponding metal signal line 220. In addition, the flexible display panel also includes a base substrate combined with the display substrate 200 through a pressure-sensitive adhesive, and the base substrate includes but is not limited to a flexible PET substrate.

[0069] In this embodiment, the display device may include but is not limited to: a liquid crystal panel, an OLED panel, a liquid crystal television, a liquid crystal display, electronic paper, a digital photo frame, a mobile phone, a tablet computer, and an electrophoretic display device.

[0070] In the display device described in this embodiment, the flexible display device formed by directly electrically connecting the driver chip to the corresponding flexible display panel has a high resolution; at the same time, since the driver chip is directly electrically connected to the flexible display panel, the COF binding step is omitted, and the corresponding production cost is also lower; in addition, when the connection bumps 111, 121 on the driver chip are electrically connected to the corresponding connection pads 211, especially when the electrical connection method of crimping binding is adopted, the support bumps 112, 122 in the driver chip provide support force for crimping binding, so that the force on the flexible display panel is more balanced, and the degree and probability of deformation due to force during the electrical connection process are reduced, thereby reducing the occurrence of defects such as circuit disconnection or disconnection caused by the metal signal line 220 on its surface due to deformation. According to a preferred example, the flexible display panel also includes a connection pad formed on the display substrate corresponding to the support bump of the driver chip, thereby further reducing the deformation of the flexible display panel.

[0071] As a comparison, Figure 5 The figure shows that when the existing driver chip without the first supporting bump is pressed and bound to the flexible display panel, the metal signal line 220' on the flexible display panel is pressed and broken. This figure is a cross-sectional view of the driver chip breaking from the connecting bump 111'. It can be seen from the figure that the metal signal line is usually prone to breakage near the junction of the connecting pad and the metal signal line, see the oval area in the figure. Figure 6 It can be further seen that during the crimping and binding process, due to the pressure, the pressure-sensitive adhesive 300' connecting the base substrate 400' and the display substrate 200' is squeezed and flows toward the blank space around the connecting bump 111' on the driving chip body 100', so that the flexible display substrate 200' is also deformed and squeezed, thereby further promoting the breakage of the metal signal line.

[0072] In a preferred example, the connection bump is crimped and bonded to the corresponding connection pad 210. The crimping and bonding process is simple and easy to implement and has high connection reliability. In addition, the support bumps on the driver chip can prevent the risk of the metal signal line 220 being broken due to deformation of the flexible display panel due to the large gap between adjacent connection bumps during crimping and bonding, which greatly improves the application efficiency of the crimping and bonding technology.

[0073] Since there is a certain alignment accuracy error during the electrical connection process, which will affect the reliability of the electrical connection, in order to further solve this problem, in a preferred example, the connection pad is larger than the size of the corresponding connection bump electrically connected thereto, so that after the electrical connection, the outer contour of the connection pad is larger than the outer contour of the connection bump. In this way, when the two are connected, the connection bump can be located on one side of the connection pad as much as possible, and the contact area between the two is larger, thereby improving the reliability of the electrical connection.

[0074] In another embodiment of the present invention, a method for manufacturing a display device is provided. Figure 7 As shown, the production method comprises the following steps:

[0075] S100: providing a driving chip according to the above embodiment.

[0076] S200: providing a flexible display panel, which includes a display substrate and a connection pad disposed on the display substrate.

[0077] Among them, the production of flexible display panels is an existing technology, and those skilled in the art can produce them according to their needs. Figure 3 , Figure 4 For example, the display device:

[0078] Providing a substrate 400;

[0079] Providing a display substrate 200, which includes a connection pad 210 formed on the display substrate 200 and a metal signal line 220 connected to the connection pad 210;

[0080] The display substrate 200 is bonded to the base substrate 400 via a pressure sensitive adhesive 300 .

[0081] S300: Aligning the connection bumps on the driving chip with the connection pads on the display substrate one by one and electrically connecting them.

[0082] by Figure 2 For example, the connection bump 121 at the signal output end 120 of the driver chip is electrically connected to the corresponding connection pad 210 on the display substrate 200, and the first support bump 121 at the signal output end of the driver chip is located between the corresponding adjacent connection pads 210. The corresponding connection pad 210 is connected to the display device on the flexible display panel through the metal signal line 220.

[0083] It can be understood that the connection pad 210 connected to the connection bump 121 located in the signal output area 120 on the driving chip is electrically connected to the flexible circuit board of the flexible display panel through the corresponding metal signal line 220 .

[0084] In the manufacturing method, the driver chip is directly electrically connected to the flexible display panel to form a display device with lower cost and higher resolution than COF binding; in addition, the first supporting bump and the second supporting bump set on the driver chip both provide supporting force, so that the force on the flexible display panel is more balanced during the electrical connection process, thereby reducing the degree and probability of its deformation due to force, and further reducing the risk of circuit breaking or disconnection caused by breakage of metal signal lines on its surface due to deformation.

[0085] In a preferred example, the connection bump is electrically connected to the corresponding connection pad by crimping and binding. During the crimping and binding process, due to the presence of a certain binding pressure and the high hardness of the driver chip, the flexible display panel may be deformed and the metal signal line on the display panel may be broken. In this embodiment, the first support bump and the second support bump provided on the driver chip can solve this problem well.

[0086] In another preferred example, the size of the connection pad is larger than the size of the corresponding connection bump electrically connected thereto, so as to ensure that when the two are connected, the connection bump is located below the connection pad as much as possible, and the contact area between the two is larger, thereby improving the reliability of the electrical connection.

[0087] In this embodiment, the display device may include but is not limited to: a liquid crystal panel, an OLED panel, an LCD TV, a liquid crystal display, an electronic paper, a digital photo frame, a mobile phone, a tablet computer, an electrophoretic display device, and any other product or component with a display function.

[0088] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not limitations on the implementation methods of the present invention. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is impossible to list all the implementation methods here. All obvious changes or modifications derived from the technical solution of the present invention are still within the protection scope of the present invention.

Claims

1. A display device, characterized in that: include: A flexible display panel, comprising a display substrate and connection pads arranged on the display substrate, and support pads arranged between adjacent connection pads arranged along a first direction; as well as, A driving chip, comprising a substrate and a plurality of connecting bumps and a plurality of supporting bumps arranged on the substrate, wherein the plurality of connecting bumps comprises at least one group of connecting bumps arranged along a first direction, and the plurality of supporting bumps comprises supporting bumps respectively located between adjacent connecting bumps arranged along the first direction; the driving chip comprises an input area and an output area, and the supporting bumps further comprises a middle area supporting bump regularly arranged in the middle of the driving chip; the thickness of the supporting bump is less than or equal to the thickness of the connecting bump; the area of ​​the supporting bump is less than the area of ​​the adjacent connecting bump, the shape of the supporting bump is cylindrical, elliptical, cuboid or cube, and the distance between the supporting bump and its adjacent connecting bump is greater than or equal to 30 μm and less than or equal to 40 μm; The connecting bumps on the driving chip correspond one-to-one with the connecting pads on the display substrate and are electrically connected. The supporting bumps on the driving chip correspond one-to-one with the supporting pads on the display substrate. When the thickness of the supporting bumps is less than the connection thickness formed by the connecting bumps and the connecting pads, supporting pads are arranged at the supporting bump positions. The wiring of the connecting pads extends between the rows of connecting pads arranged in rows, and the supporting bumps are arranged in rows between the connecting bumps.

2. The display device according to claim 1, characterized in that The plurality of connecting bumps further include at least one group of connecting bumps arranged along a second direction, the second direction being different from the first direction, and the plurality of supporting bumps include supporting bumps respectively located between adjacent connecting bumps arranged along the second direction.

3. The display device according to claim 1, characterized in that The plurality of connecting bumps further include a connecting bump group arranged along a second direction, the second direction being different from the first direction, and the plurality of supporting bumps include supporting bumps arranged along the second direction and correspondingly disposed on at least one side of the connecting bump group arranged along the second direction.

4. The display device according to claim 1, characterized in that The plurality of supporting bumps further include a supporting bump located at at least one end of the connecting bumps arranged along the first direction.

5. The display device according to claim 2 or 3, characterized in that: The plurality of supporting bumps further include a supporting bump located at at least one end of the connecting bumps arranged along the second direction.

6. The display device according to claim 1, characterized in that: The driving chip includes an input region and an output region, the input region includes a plurality of input bumps, the output region includes a plurality of output bumps, and the connecting bumps are input bumps or output bumps.

7. The display device according to claim 6, characterized in that: The display substrate further includes at least one group of connection pads arranged along a second direction, the second direction being different from the first direction, and support pads are arranged between adjacent connection pads arranged along the second direction.

8. The display device according to claim 1, characterized in that: The size of the connection pad is larger than the size of the corresponding connection bump.

9. A method for manufacturing a display device, characterized in that: The steps include: A driver chip is provided, comprising a substrate and a plurality of connection bumps and a plurality of support bumps arranged on the substrate, wherein the plurality of connection bumps include at least one group of connection bumps arranged along a first direction, and the plurality of support bumps include support bumps respectively located between adjacent connection bumps arranged along the first direction; the driver chip includes an input area and an output area, and the support bumps further include support bumps in a middle area regularly arranged in the middle of the driver chip; the thickness of the support bumps is less than or equal to the thickness of the connection bumps, the area of ​​the support bumps is less than the area of ​​the adjacent connection bumps, the shape of the support bumps is cylindrical, elliptical, cuboid or cube, and the distance between the support bumps and the adjacent connection bumps is greater than or equal to 30 μm and less than or equal to 40 μm; the wiring of the connection pads extends between the connection pads arranged in a row, and the support bumps are arranged in a row between the connection bumps; A flexible display panel is provided, comprising a display substrate and connection pads arranged on the display substrate, support pads arranged between adjacent connection pads arranged along a first direction, the connection bumps on the driving chip correspond one-to-one with the connection pads on the display substrate and are electrically connected, the support bumps on the driving chip correspond one-to-one with the support pads on the display substrate, and when the thickness of the support bumps is less than the connection thickness formed by the connection bumps and the connection pads, support pads are arranged at the positions of the support bumps; The connection bumps on the driving chip are aligned one by one with the connection pads on the display substrate and are electrically connected.

10. The manufacturing method according to claim 9, characterized in that: The connection bumps are electrically connected to the corresponding connection pads by crimping and binding.

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