A chip flip packaging equipment

Abstract

The present invention discloses a chip flip packaging device, comprising a gripping mechanism, a horizontal positioning mechanism and a lens mechanism, wherein the gripping mechanism is provided with at least one gripping head, and the lens mechanism is mounted on the gripping head; the gripping mechanism is provided on the horizontal positioning mechanism; a first wafer mechanism is provided on one side of the gripping mechanism, and the first wafer mechanism is vertically arranged with the horizontal positioning mechanism. The chip flip packaging device provided by the present invention enables the UPH to reach above 20K, thereby improving the production efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and in particular to a chip flip packaging device. Background Art

[0002] Semiconductor chips are widely used in daily life. Flip-chip packaging technology is generally used for their processing. The existing flip-chip packaging technology often packages the first layer of chip and carrier board together. The packaging method uses the chip facing down to the substrate, without wire bonding, forming the shortest circuit, reducing resistance, using metal balls for connection, reducing the package size, improving electrical performance, and solving the problem of BGA needing to expand the volume to increase the number of pins. The WAFER wafer structure and the PANEL (or lead) structure are both on the same plane. In order to ensure that the two structures do not interfere, the grasping part needs to move a large range of 600MM-800MM. The existing technical structure has a large grasping movement range, and the chip picking, photo identification, and chip bonding are serial work, which is time-consuming and labor-intensive. Therefore, the UPH can only reach 10K, and the processing efficiency is low. Summary of the invention

[0003] The purpose of the present invention is to provide a chip flip packaging device to solve the problems existing in the above-mentioned prior art, so that the UPH reaches above 20K and the production efficiency is improved.

[0004] To achieve the above object, the present invention provides the following solutions:

[0005] The present invention provides a chip flip packaging device, comprising a grasping mechanism, a horizontal positioning mechanism and a lens mechanism, wherein the grasping mechanism is provided with at least one grasping head, and the lens mechanism is installed on the grasping head; the grasping mechanism is arranged on the horizontal positioning mechanism; a first wafer mechanism is arranged on one side of the grasping mechanism, and the first wafer mechanism is arranged vertically to the horizontal positioning mechanism.

[0006] Optionally, the first wafer mechanism includes a substrate, a wafer table is arranged on the substrate, and a pressure plate is installed on the wafer table; the substrate is connected to an X-axis motor and a Y-axis motor, the wafer table is connected to an R-axis motor, and the pressure plate is connected to a Z-axis motor.

[0007] Optionally, the gripping mechanism includes a rotary motor, which is disposed on the horizontal positioning mechanism, and the gripping heads are arranged at equal intervals on a turntable of the rotary motor.

[0008] Optionally, the grabbing head is connected to a vacuum pump via an external pipe.

[0009] Optionally, guide rails are arranged at equal intervals on the turntable of the rotary motor, and a slider is arranged on the grabbing head; the guide rails and the slider are cooperatively connected.

[0010] Optionally, the horizontal positioning mechanism is a track wire guide mechanism, the track wire guide mechanism includes a wire guide and a clamping claw conveying device, and the rotary motor is arranged on the clamping claw conveying device.

[0011] Optionally, the horizontal positioning mechanism is a plate mechanism, on which a copper foil layer substrate is arranged, on which a circuit pattern is drawn; the plate mechanism is respectively provided with an X-direction mechanism and a Y-direction mechanism, and the X-direction mechanism and the Y-direction mechanism are used to control the horizontal movement of the copper foil layer substrate.

[0012] Optionally, the horizontal positioning mechanism is a second wafer mechanism, and the second wafer mechanism has the same structure as the first wafer mechanism.

[0013] The chip flip packaging equipment provided by the present invention has achieved the following technical effects compared with the prior art:

[0014] The flip chip packaging equipment provided by the present invention has a simple overall structure and is easy to operate. The horizontal positioning mechanism is on a horizontal plane, the first wafer mechanism is placed vertically, and the two form a 90° angle. Multiple grabbing heads are placed on a turntable, and 4, 8, 12, or 16 grabbing heads can be installed, so that multiple grabbing heads can grab wafers at the same time. Multiple grabbing heads can take wafers, take pictures, and stick wafers at the same time, and the UPH can reach more than 20K, thereby improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0016] Figure 1 This is a schematic diagram of the lens mechanism of the chip flip packaging device of the present invention;

[0017] Figure 2 It is a schematic diagram of the grabbing mechanism of the chip flip packaging equipment of the present invention;

[0018] Figure 3 This is a schematic diagram of the first wafer structure of the chip flip-chip packaging equipment of the present invention;

[0019] Figure 4 This is a schematic structural diagram of a first embodiment of a chip flip-chip device according to the present invention;

[0020] Figure 5 It is a schematic diagram of the track lead mechanism of the chip flip packaging equipment of the present invention;

[0021] Figure 6 This is a schematic structural diagram of a second embodiment of a chip flip-chip packaging device according to the present invention;

[0022] Figure 7 This is a schematic diagram of the structure of the chip flip packaging equipment board of the present invention;

[0023] Figure 8 It is a schematic structural diagram of a third embodiment of a chip flip-chip packaging device of the present invention;

[0024] Explanation of the accompanying drawings: 1 is a gripping mechanism, 2 is a horizontal positioning mechanism, 3 is a lens mechanism, 4 is a gripping head, 5 is a first wafer mechanism, 6 is a second wafer mechanism, 7 is a substrate, 8 is a wafer table, 9 is a pressure plate, 10 is an X-axis motor, 11 is a Y-axis motor, 12 is an R-axis motor, 13 is a Z-axis motor, 14 is a rotary motor, 15 is a track lead mechanism, 16 is a lead, 17 is a clamping claw transport device, 18 is a plate mechanism, 19 is a copper foil layer substrate, 20 is an X-axis mechanism, and 21 is a Y-axis mechanism. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] The purpose of the present invention is to provide a chip flip packaging device to solve the problems existing in the above-mentioned prior art, so that the UPH reaches above 20K and the production efficiency is improved.

[0027] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0028] The present invention provides a chip flip packaging device, such as Figure 1 , Figure 2 and Figure 3 As shown, it includes a grasping mechanism 1, a horizontal positioning mechanism 2 and a lens mechanism 3. The grasping mechanism 1 is provided with at least one grasping head 4, and the lens mechanism 3 is installed on the grasping head 4; the grasping mechanism 1 is arranged on the horizontal positioning mechanism 2; a first wafer mechanism 5 is arranged on one side of the grasping mechanism 1, and the first wafer mechanism 5 is arranged vertically to the horizontal positioning mechanism.

[0029] Embodiment 1

[0030] The horizontal positioning mechanism 2 of the chip flip packaging device provided by the present invention is a second wafer mechanism 6, and the second wafer mechanism 6 has the same structure as the first wafer mechanism 5. Figure 3 and Figure 4As shown, the wafer mechanism (WAFER) is a carrier mechanism for the wafer; the wafer refers to the silicon wafer used in the manufacture of silicon semiconductor integrated circuits. Because of its round shape, it is called a wafer; various circuit element structures can be processed on the silicon wafer to become an IC product with specific electrical properties. The first wafer mechanism 5 and the second wafer mechanism 6 include a substrate 7, on which a circular wafer table 8 is arranged, and a pressing plate 9 is installed on the wafer table 8; the substrate 7 is connected to an X-axis motor 10 and a Y-axis motor 11, the wafer table 8 is connected to an R-axis motor 12, and the pressing plate 9 is connected to a Z-axis motor 13. The main function of the Z-axis motor 13 is to lift and lower the pressing plate 9 in the Z direction to facilitate the replacement of the wafer. The pressing plate 9 acts to press the blue film on the wafer so that the blue film is in a taut state, so that each silicon wafer on the wafer is separated, which is convenient for each silicon wafer to pick up and mount. The main function of the R-axis motor 12 is to rotate the wafer table 8 to a certain angle so that the wafer angle meets the use angle requirements and improves the accuracy. The X-axis motor 10 and the Y-axis motor 11 are used to move the wafer mechanism in the horizontal direction.

[0031] The grabbing mechanism 1 includes a rotary motor 14, which is arranged on a horizontal positioning mechanism, and the grabbing heads 4 are arranged at equal intervals on the rotating disk of the rotary motor 14. The grabbing heads 4 are connected to a vacuum pump through an external pipe. Guide rails are arranged at equal intervals on the rotating disk of the rotary motor 14, and a slider is arranged on the grabbing head 4; the guide rails and the slider are connected in a coordinated manner.

[0032] The rotary motor 14 plays a role of multi-head high-speed rotation; the grabbing head 4 and the rotary disk of the rotary motor 14 are matched with a slider and a guide rail structure, which can move up and down in Z direction. The grabbing head 4 is connected to an external air pipe for vacuum suction of chips and compressed gas release of chips.

[0033] Embodiment 2

[0034] This embodiment is a further improvement made on the basis of the first embodiment. In this embodiment, the horizontal positioning mechanism 2 is changed into a track guide mechanism. Figure 5 and Figure 6 As shown, the track lead mechanism 15 includes a lead 16 and a gripper conveying device 17, and the rotary motor 14 is arranged on the gripper conveying device. The lead 16 is a carrier of the semiconductor chip package, and the gripper conveying device 17 mainly functions to clamp the lead 16 and convey the lead 16 horizontally in the X direction, so as to facilitate the chip to be attached to the designated position.

[0035] Embodiment 3

[0036] This embodiment is a further improvement made on the basis of the first embodiment. In this embodiment, the horizontal positioning mechanism 2 is changed into a plate mechanism 18. Figure 7 and Figure 8As shown, a copper foil layer substrate 19 is arranged on the plate mechanism 18, which is a carrier of semiconductor packaging. A circuit pattern is drawn on the copper foil layer substrate 19, and a chip is pasted thereon to form a circuit; an X-direction mechanism 20 and a Y-direction mechanism 21 are respectively arranged on the plate mechanism 18, and the X-direction mechanism 20 and the Y-direction mechanism 21 control the copper foil layer substrate 19 to move horizontally to a specified position according to the data parameters taken by the lens mechanism 3.

[0037] The lens mechanism 3 is a chip placement and camera positioning accuracy mechanism; by taking pictures, the chip or patch area positioning is calculated to calculate the difference, which is convenient for the alignment and positioning of the horizontal positioning mechanism.

[0038] The chip flip packaging equipment provided by the present invention has a simple overall structure, reasonable layout, space saving and convenient use. Multiple grabbing heads are placed on the turntable, and 4, 8, 12, or 16 heads can be installed, so that the chips can be grabbed at the same time. Multiple grabbing heads can take chips, take pictures, and stick chips at the same time in parallel, and the UPH can reach more than 20K, which greatly improves the production efficiency.

[0039] The present invention may also adopt other similar preferred schemes based on the above embodiments, for example, the horizontal positioning mechanism 2 and the first wafer mechanism 5 may be arranged relatively parallel, and the gripping mechanism 1 and the lens mechanism 3 may be arranged between the relatively parallel horizontal positioning mechanism 2 and the first wafer mechanism 5.

[0040] The present invention uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only used to help understand the method and core ideas of the present invention. At the same time, for those skilled in the art, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A chip flip packaging device, characterized in that: The invention comprises a gripping mechanism, a horizontal positioning mechanism and a lens mechanism, wherein at least one gripping head is arranged on the gripping mechanism, and the lens mechanism is mounted on the gripping head; the gripping mechanism is arranged on the horizontal positioning mechanism; a first wafer mechanism is arranged on one side of the gripping mechanism, and the first wafer mechanism is arranged vertically with the horizontal positioning mechanism; the first wafer mechanism comprises a substrate, a wafer table is arranged on the substrate, and a pressure plate is installed on the wafer table; the substrate is connected to an X-axis motor and a Y-axis motor, the wafer table is connected to an R-axis motor, and the pressure plate is connected to a Z-axis motor; the gripping mechanism comprises a rotary motor, the rotary motor is arranged on the horizontal positioning mechanism, the gripping head, etc. The gripping head is connected to a vacuum device through an external pipe; guide rails are arranged at equal intervals on the turntable of the rotary motor, and a slider is arranged on the gripping head; the guide rails and the slider are connected in a cooperative manner; the horizontal positioning mechanism is a track lead mechanism, the track lead mechanism includes a lead and a gripper conveying device, and the rotary motor is arranged on the gripper conveying device; the horizontal positioning mechanism is a plate mechanism, a copper foil layer substrate is arranged on the plate mechanism, and a circuit pattern is drawn on the copper foil layer substrate; the plate mechanism is respectively provided with an X-direction mechanism and a Y-direction mechanism, and the X-direction mechanism and the Y-direction mechanism are used to control the horizontal movement of the copper foil layer substrate.

2. The flip chip packaging equipment according to claim 1, characterized in that: The horizontal positioning mechanism is a second wafer mechanism, and the second wafer mechanism has the same structure as the first wafer mechanism.

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