A photoelectric conversion device packaging structure

Abstract

The present invention provides a photoelectric conversion device packaging structure, which includes a packaging backplane, a first heat-conducting packaging adhesive layer, a second packaging adhesive layer, a plurality of photovoltaic cells, a third packaging adhesive layer and a tempered glass plate. The packaging backplane includes a metal plate, the upper surface of the metal plate has a plurality of heat-conducting elastic columns, and the lower surface of the metal plate has a plurality of metal blocks, so that the metal plate has excellent heat dissipation performance, shock resistance and water vapor barrier performance, ensuring that the photoelectric conversion efficiency of the photovoltaic cell is not attenuated, ensuring that its output power is stable, and suitable for long-term use.

Description

Technical Field

[0001] The present invention relates to the field of photovoltaic technology, and in particular to a photoelectric conversion device packaging structure. Background Art

[0002] With the development and progress of science and technology, the demand for energy has also increased dramatically. Among them, the commonly used energy comes from fossil energy such as oil, coal and natural gas. Due to the limited total reserves of petrochemical energy and the fact that it is a non-renewable energy source, the world is facing a severe energy situation, making it increasingly urgent for people to explore emerging renewable energy sources such as wind energy, geothermal energy and solar energy. Among them, solar energy, as an inexhaustible green renewable energy, has gradually attracted widespread attention, and solar cell related technologies have also been booming. The photovoltaic backplane is located on the outermost layer on the back of the photovoltaic module, protecting the photovoltaic cells from moisture and oxygen in the outdoor environment. There are two types of existing photovoltaic backplanes: one is a coated composite backplane film, which is a three-layer structure with a composite fluorine film or EVA film on both sides of the PET polyester film, and the common structures are TPT, TPE, KPK, etc.; the other is a coated backplane film, which is a fluorine resin coated on both sides of the PET polyester film, and is dried and cured to form a film. The temperature increase of the photovoltaic module will seriously affect the photoelectric conversion efficiency of the cell, resulting in a significant decrease in the efficiency of the cell, so the heat dissipation performance and stability of the photovoltaic backplane will affect the conversion efficiency and service life of the photovoltaic cell. Summary of the invention

[0003] The object of the present invention is to overcome the above-mentioned deficiencies of the prior art and provide a photoelectric conversion device packaging structure.

[0004] To achieve the above object, the present invention provides a photoelectric conversion device packaging structure, the photoelectric conversion device packaging structure comprising:

[0005] A packaging backplane, the packaging backplane comprises a metal plate, a polyethylene terephthalate layer is bonded to the upper surface of the metal plate, a first fluorine-containing polymer layer is bonded to the upper surface of the polyethylene terephthalate layer, an ethylene-vinyl acetate copolymer layer is arranged on the upper surface of the first fluorine-containing polymer layer, a plurality of through holes penetrating the ethylene-vinyl acetate copolymer layer, the first fluorine-containing polymer layer and the polyethylene terephthalate layer are arranged on the upper surface of the metal plate, a plurality of the through holes all expose the upper surface of the metal plate, a thermally conductive elastic column is embedded in each of the through holes, the upper end of the thermally conductive elastic column is exposed to the ethylene-vinyl acetate copolymer layer, the bottom surface of the thermally conductive elastic column is in contact with the metal plate, and the thermally conductive elastic column comprises a metal column , a silicone rubber layer is provided on the side surface of the metal column, an EVA bonding layer is provided on the surface of the silicone rubber layer, a natural rubber layer is bonded to the lower surface of the metal plate, a polyethylene naphthalate layer is bonded to the lower surface of the natural rubber layer, a second fluoropolymer layer is bonded to the lower surface of the polyethylene naphthalate layer, a plurality of rectangular openings penetrating the second fluoropolymer layer, the polyethylene naphthalate layer and the natural rubber layer are provided on the lower surface of the metal plate, the plurality of rectangular openings are arranged in parallel and expose the lower surface of the metal plate, a metal block is embedded in each of the rectangular openings, the top surface of the metal block is in contact with the lower surface of the metal plate, and the bottom surface of the metal block is flush with the lower surface of the second fluoropolymer layer;

[0006] a first thermally conductive packaging adhesive layer, wherein the first thermally conductive packaging adhesive layer covers the packaging back plate, and the upper end of the thermally conductive elastic column exposed from the ethylene-vinyl acetate copolymer layer is embedded in the first thermally conductive packaging adhesive layer;

[0007] a second packaging adhesive layer, wherein the second packaging adhesive layer covers the first thermally conductive packaging adhesive layer;

[0008] A plurality of photovoltaic cells are laid on the second packaging adhesive layer;

[0009] a third encapsulation adhesive layer, the third encapsulation adhesive layer covering the photovoltaic cell and the second encapsulation adhesive layer;

[0010] A tempered glass plate is arranged on the third packaging adhesive layer.

[0011] As the above photoelectric conversion device packaging structure, further, the material of the metal plate is one of aluminum, copper, iron and aluminum-magnesium alloy, the thickness of the metal plate is 200-500 microns, the thickness of the polyethylene terephthalate layer is 1-3 mm, the thickness of the first fluorine-containing polymer layer is 200-500 microns, and the thickness of the ethylene-vinyl acetate copolymer layer is 100-150 microns.

[0012] As the above photoelectric conversion device packaging structure, further, the material of the metal column is aluminum or copper, the diameter of the metal column is 5-10 mm, the thickness of the silicone rubber layer is 5-10 mm, and the thickness of the EVA bonding layer is 50-100 μm.

[0013] As the above photoelectric conversion device packaging structure, further, the thickness of the natural rubber layer is 1-3 mm, the thickness of the polyethylene naphthalate layer is 0.5-1 mm, the thickness of the second fluorine-containing polymer layer is 100-200 μm, the material of the metal block is aluminum or copper, and the size of the rectangular opening is the same as the size of the metal block.

[0014] As the above photoelectric conversion device packaging structure, further, the first thermally conductive packaging adhesive layer includes EVA resin and thermally conductive nanoparticles, the thermally conductive nanoparticles are one of aluminum oxide, aluminum nitride, boron nitride, silicon nitride, and magnesium oxide, the particle size of the thermally conductive nanoparticles is 100-200 nanometers, and the material of the second packaging adhesive layer and the third packaging adhesive layer is EVA.

[0015] As for the above photoelectric conversion device packaging structure, further, the thickness of the first thermally conductive packaging adhesive layer is 300-500 microns, the thickness of the second packaging adhesive layer is 50-150 microns, the thickness of the third packaging adhesive layer is 200-300 microns, and the length of the upper end of the thermally conductive elastic column embedded in the first thermally conductive packaging adhesive layer is 150-400 microns.

[0016] As the above photoelectric conversion device packaging structure, further, the photovoltaic cell is a single crystal silicon photovoltaic cell, a polycrystalline silicon photovoltaic cell or a gallium arsenide photovoltaic cell.

[0017] As the above photoelectric conversion device packaging structure, further, the material of the first fluorine-containing polymer layer and the second fluorine-containing polymer layer is polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinylidene fluoride, polyvinyl fluoride, ethylene-chlorotrifluoroethylene copolymer or ethylene-tetrafluoroethylene copolymer.

[0018] Compared with the prior art, the beneficial effects of the present invention are:

[0019] In the photoelectric conversion device packaging structure of the present invention, through holes are formed in the multi-layer resin layer, and a thermally conductive elastic column is embedded in each of the through holes, so that in the formation of a thicker backplane, multiple thermally conductive elastic columns respectively form multiple heat dissipation paths, which can quickly conduct the heat generated by the photovoltaic cell to the metal plate, and a natural rubber layer, a polyethylene naphthalate layer and a second fluorine-containing polymer layer are arranged on the lower surface of the metal plate, and a rectangular opening is formed to embed the metal block, ensuring that it has excellent thermal conductivity. At the same time, the presence of the metal plate can effectively prevent water vapor from invading the photoelectric conversion device packaging structure, thereby making it have excellent anti-PID performance. By optimizing the structure of the thermally conductive elastic column, the thermally conductive elastic column includes a metal column, a silicone rubber layer and an EVA bonding layer, so that the thermally conductive elastic column has excellent thermal conductivity and excellent buffering performance, and a natural rubber layer is arranged on the lower surface of the metal plate, which further improves the buffering performance of the packaging structure. Even if the packaging structure collides, the presence of the thermally conductive elastic column can ensure that the photovoltaic cell is not damaged. The upper end of the thermally conductive elastic column is embedded in the first thermally conductive packaging adhesive layer, increasing the area of ​​the thermally conductive elastic column and the first thermally conductive packaging layer, further improving the stability and thermal conductivity of the photoelectric conversion device packaging structure. The surface of the packaging backplane has an ethylene-vinyl acetate copolymer layer, and there is an ultra-thin second packaging adhesive layer between the first thermally conductive packaging adhesive layer and the photovoltaic cell layer, so that the photoelectric conversion device packaging structure is easier to bond together. Compared with the existing solar panels, by optimizing the specific structure of the photoelectric conversion device packaging structure of the present invention and the specific dimensions of each layer, the photoelectric conversion device packaging structure of the present invention is thicker as a whole, has excellent heat dissipation performance, shock resistance and water vapor barrier performance, ensures that the photoelectric conversion efficiency of the photovoltaic cell is not attenuated, ensures that its output power is stable, and is suitable for long-term use. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of the photoelectric conversion device packaging structure of the present invention.

[0021] Figure 2 It is a structural schematic diagram of the bottom surface of the thermally conductive elastic column of the present invention.

[0022] Figure 3 It is a top view of the packaging back plate of the present invention.

[0023] Figure 4 It is a bottom view of the packaging back plate of the present invention. DETAILED DESCRIPTION

[0024] like Figure 1-4As shown, the present invention proposes a photoelectric conversion device packaging structure, the photoelectric conversion device packaging structure comprises: a packaging backplane 1, the packaging backplane comprises a metal plate 11, a polyethylene terephthalate layer 12 is bonded to the upper surface of the metal plate 11, a first fluorinated polymer layer 13 is bonded to the upper surface of the polyethylene terephthalate layer 12, an ethylene-vinyl acetate copolymer layer 14 is arranged on the upper surface of the first fluorinated polymer layer 13, and a plurality of fluoropolymer layers 14 are arranged on the upper surface of the metal plate 11, which penetrate the ethylene-vinyl acetate copolymer layer 14, the first fluoropolymer layer 13 and the polyethylene terephthalate copolymer layer 14. The through holes 15 of the ethylene glycol layer 12 are all exposed to the upper surface of the metal plate 11, and a thermally conductive elastic column 2 is embedded in each of the through holes 15. The upper end of the thermally conductive elastic column 2 is exposed to the ethylene-vinyl acetate copolymer layer 14, and the bottom surface of the thermally conductive elastic column 2 is in contact with the metal plate 11. The thermally conductive elastic column 2 includes a metal column 21, and a silicone rubber layer 22 is provided on the side surface of the metal column 21. The surface of the silicone rubber layer 22 is provided with an EVA bonding layer 23. A natural rubber layer 16 is bonded to the lower surface of the metal plate 11, and the lower surface of the natural rubber layer 16 The metal plate 11 is bonded with a polyethylene naphthalate layer 17, and a second fluorinated polymer layer 18 is bonded to the lower surface of the polyethylene naphthalate layer 17. A plurality of rectangular openings 19 penetrating the second fluorinated polymer layer 18, the polyethylene naphthalate layer 17, and the natural rubber layer 16 are provided on the lower surface of the metal plate 11. The plurality of rectangular openings 19 are arranged in parallel and expose the lower surface of the metal plate 11. A metal block 3 is embedded in each of the rectangular openings 19. The top surface of the metal block 3 contacts the lower surface of the metal plate 11, and the bottom surface of the metal block 3 contacts the second fluorinated polymer layer 18. The lower surface of the material layer 18 is flush; a first thermally conductive packaging adhesive layer 4, the first thermally conductive packaging adhesive layer 4 covers the packaging backplane 1, and the upper end of the thermally conductive elastic column 2 exposed in the ethylene-vinyl acetate copolymer layer 14 is embedded in the first thermally conductive packaging adhesive layer 4; a second packaging adhesive layer 5, the second packaging adhesive layer 5 covers the first thermally conductive packaging adhesive layer 4; a plurality of photovoltaic cells 6 are laid on the second packaging adhesive layer 5; a third packaging adhesive layer 7, the third packaging adhesive layer 7 covers the photovoltaic cells 6 and the second packaging adhesive layer 5; a tempered glass plate 8, the tempered glass plate 8 is arranged on the third packaging adhesive layer 7.

[0025] Further, the material of the metal plate 11 is one of aluminum, copper, iron and aluminum-magnesium alloy, the thickness of the metal plate 11 is 200-500 microns, the thickness of the polyethylene terephthalate layer 12 is 1-3 mm, the thickness of the first fluoropolymer layer 13 is 200-500 microns, the thickness of the ethylene-vinyl acetate copolymer layer 14 is 100-150 microns, the thickness of the natural rubber layer 16 is 1-3 mm, the thickness of the polyethylene naphthalate layer 17 is 0.5-1 mm, the thickness of the second fluoropolymer layer 18 is 100-200 microns, the material of the metal block 3 is aluminum or copper, and the size of the rectangular opening 19 is the same as that of the metal block 3. By optimizing the specific thickness of each layer, the backplane has excellent thermal conductivity, shock resistance and weather resistance.

[0026] Furthermore, the metal column 21 is made of aluminum or copper, the diameter of the metal column 21 is 5-10 mm, the thickness of the silicone rubber layer 22 is 5-10 mm, and the thickness of the EVA bonding layer 23 is 50-100 μm. By optimizing the specific structure and parameters of the thermally conductive elastic column, each thermally conductive elastic column has excellent anti-seismic performance.

[0027] Further, the first thermally conductive packaging adhesive layer 4 includes EVA resin and thermally conductive nanoparticles, the thermally conductive nanoparticles are one of aluminum oxide, aluminum nitride, boron nitride, silicon nitride, and magnesium oxide, the particle size of the thermally conductive nanoparticles is 100-200 nanometers, and the second packaging adhesive layer 5 and the third packaging adhesive layer 7 are made of EVA. By selecting the material of the thermally conductive nanoparticles, it is ensured that the first thermally conductive packaging layer has excellent thermal conductivity, and by optimizing the particle size of the thermally conductive nanoparticles, the first thermally conductive packaging layer has excellent bonding performance and is not easy to peel off.

[0028] Further, the thickness of the first heat-conductive packaging adhesive layer 4 is 300-500 microns, the thickness of the second packaging adhesive layer 5 is 50-150 microns, the thickness of the third packaging adhesive layer 7 is 200-300 microns, and the length of the upper end of the heat-conductive elastic column 2 embedded in the first heat-conductive packaging adhesive layer 4 is 150-400 microns. The provision of the second packaging adhesive layer 5 ensures the overall sealing performance of the photoelectric conversion device packaging structure, and the specific selection of the length of the heat-conductive elastic column embedded in the first heat-conductive packaging adhesive layer ensures that the heat-conductive elastic column is firmly bonded to the first heat-conductive packaging adhesive layer while conducting heat quickly.

[0029] Furthermore, the photovoltaic cell 6 is a monocrystalline silicon photovoltaic cell, a polycrystalline silicon photovoltaic cell or a gallium arsenide photovoltaic cell.

[0030] Furthermore, the first fluorine-containing polymer layer 13 and the second fluorine-containing polymer layer 18 are made of polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinylidene fluoride, polyvinyl fluoride, ethylene-chlorotrifluoroethylene copolymer or ethylene-tetrafluoroethylene copolymer, so that the packaging backplane has excellent weather resistance.

[0031] Example 1

[0032] like Figure 1-4 As shown, the present invention proposes a photoelectric conversion device packaging structure, the photoelectric conversion device packaging structure comprises: a packaging backplane 1, the packaging backplane comprises a metal plate 11, a polyethylene terephthalate layer 12 is bonded to the upper surface of the metal plate 11, a first fluorinated polymer layer 13 is bonded to the upper surface of the polyethylene terephthalate layer 12, an ethylene-vinyl acetate copolymer layer 14 is arranged on the upper surface of the first fluorinated polymer layer 13, and a plurality of fluoropolymer layers 14 are arranged on the upper surface of the metal plate 11, which penetrate the ethylene-vinyl acetate copolymer layer 14, the first fluoropolymer layer 13 and the polyethylene terephthalate copolymer layer 14. The through holes 15 of the ethylene glycol layer 12 are all exposed to the upper surface of the metal plate 11, and a thermally conductive elastic column 2 is embedded in each of the through holes 15. The upper end of the thermally conductive elastic column 2 is exposed to the ethylene-vinyl acetate copolymer layer 14, and the bottom surface of the thermally conductive elastic column 2 is in contact with the metal plate 11. The thermally conductive elastic column 2 includes a metal column 21, and a silicone rubber layer 22 is provided on the side surface of the metal column 21. The surface of the silicone rubber layer 22 is provided with an EVA bonding layer 23. A natural rubber layer 16 is bonded to the lower surface of the metal plate 11, and the lower surface of the natural rubber layer 16 The metal plate 11 is bonded with a polyethylene naphthalate layer 17, and a second fluorinated polymer layer 18 is bonded to the lower surface of the polyethylene naphthalate layer 17. A plurality of rectangular openings 19 penetrating the second fluorinated polymer layer 18, the polyethylene naphthalate layer 17, and the natural rubber layer 16 are provided on the lower surface of the metal plate 11. The plurality of rectangular openings 19 are arranged in parallel and expose the lower surface of the metal plate 11. A metal block 3 is embedded in each of the rectangular openings 19. The top surface of the metal block 3 contacts the lower surface of the metal plate 11, and the bottom surface of the metal block 3 contacts the second fluorinated polymer layer 18. The lower surface of the material layer 18 is flush; a first thermally conductive packaging adhesive layer 4, the first thermally conductive packaging adhesive layer 4 covers the packaging backplane 1, and the upper end of the thermally conductive elastic column 2 exposed in the ethylene-vinyl acetate copolymer layer 14 is embedded in the first thermally conductive packaging adhesive layer 4; a second packaging adhesive layer 5, the second packaging adhesive layer 5 covers the first thermally conductive packaging adhesive layer 4; a plurality of photovoltaic cells 6 are laid on the second packaging adhesive layer 5; a third packaging adhesive layer 7, the third packaging adhesive layer 7 covers the photovoltaic cells 6 and the second packaging adhesive layer 5; a tempered glass plate 8, the tempered glass plate 8 is arranged on the third packaging adhesive layer 7.

[0033] The metal plate 11 is made of aluminum, with a thickness of 350 microns, the polyethylene terephthalate layer 12 is 2 mm thick, the first fluoropolymer layer 13 is 400 microns thick, and the ethylene-vinyl acetate copolymer layer 14 is 120 microns thick. The metal column 21 is made of aluminum, with a diameter of 8 mm, the silicone rubber layer 22 is 8 mm thick, and the EVA bonding layer 23 is 80 microns thick. The natural rubber layer 16 is 2 mm thick, the polyethylene naphthalate layer 17 is 0.7 mm thick, and the second fluoropolymer layer 18 is 150 microns thick. The metal block 3 is made of aluminum, and the size of the rectangular opening 19 is the same as that of the metal block 3. The first heat-conductive packaging adhesive layer 4 includes EVA resin and heat-conductive nanoparticles, the heat-conductive nanoparticles are aluminum oxide, and the particle size of the heat-conductive nanoparticles is 150 nanometers. The second packaging adhesive layer 5 and the third packaging adhesive layer 7 are made of EVA. The thickness of the first heat-conductive packaging adhesive layer 4 is 400 microns, the thickness of the second packaging adhesive layer 5 is 100 microns, and the thickness of the third packaging adhesive layer 7 is 250 microns. The length of the upper end of the heat-conductive elastic column 2 embedded in the first heat-conductive packaging adhesive layer 4 is 300 microns. The photovoltaic cell 6 is a single crystal silicon photovoltaic cell. The material of the first fluorine-containing polymer layer 13 and the second fluorine-containing polymer layer 18 is polytetrafluoroethylene.

[0034] Example 2

[0035] This embodiment provides another photoelectric conversion device packaging structure. Compared with the embodiment 1, the only difference is that the material of the metal plate 11 is copper, the thickness of the metal plate 11 is 500 microns, the thickness of the polyethylene terephthalate layer 12 is 3 mm, the thickness of the first fluorine-containing polymer layer 13 is 200 microns, and the thickness of the ethylene-vinyl acetate copolymer layer 14 is 150 microns. The material of the metal column 21 is copper, the diameter of the metal column 21 is 10 mm, the thickness of the silicone rubber layer 22 is 10 mm, and the thickness of the EVA bonding layer 23 is 100 microns. The thickness of the natural rubber layer 16 is 1 mm, the thickness of the polyethylene naphthalate layer 17 is 1 mm, the thickness of the second fluorine-containing polymer layer 18 is 200 microns, and the material of the metal block 3 is copper. The thermally conductive nanoparticles in the first thermally conductive packaging adhesive layer 4 are aluminum nitride, and the particle size of the thermally conductive nanoparticles is 200 nanometers. The thickness of the first heat-conductive packaging glue layer 4 is 500 microns, the thickness of the second packaging glue layer 5 is 150 microns, the thickness of the third packaging glue layer 7 is 200 microns, and the length of the upper end of the heat-conductive elastic column 2 embedded in the first heat-conductive packaging glue layer 4 is 400 microns. The photovoltaic cell 6 is a polycrystalline silicon photovoltaic cell. The material of the first fluorine-containing polymer layer 13 and the second fluorine-containing polymer layer 18 is ethylene-chlorotrifluoroethylene copolymer.

[0036] Example 3

[0037] This embodiment provides another photoelectric conversion device packaging structure. Compared with the embodiment 1, the only difference is that the material of the metal plate 11 is iron, the thickness of the metal plate 11 is 200 microns, the thickness of the polyethylene terephthalate layer 12 is 1 mm, the thickness of the first fluorine-containing polymer layer 13 is 500 microns, and the thickness of the ethylene-vinyl acetate copolymer layer 14 is 100 microns. The material of the metal column 21 is copper, the diameter of the metal column 21 is 5 mm, the thickness of the silicone rubber layer 22 is 5 mm, and the thickness of the EVA bonding layer 23 is 50 microns. The thickness of the natural rubber layer 16 is 3 mm, the thickness of the polyethylene naphthalate layer 17 is 0.5 mm, the thickness of the second fluorine-containing polymer layer 18 is 100 microns, and the material of the metal block 3 is copper. The thermally conductive nanoparticles in the first thermally conductive packaging glue layer 4 are magnesium oxide, and the particle size of the thermally conductive nanoparticles is 100 nanometers. The thickness of the first heat-conductive packaging glue layer 4 is 300 microns, the thickness of the second packaging glue layer 5 is 50 microns, the thickness of the third packaging glue layer 7 is 300 microns, and the length of the upper end of the thermally conductive elastic column 2 embedded in the first heat-conductive packaging glue layer 4 is 150 microns. The photovoltaic cell 6 is a gallium arsenide photovoltaic cell. The material of the first fluorine-containing polymer layer 13 and the second fluorine-containing polymer layer 18 is polyvinylidene fluoride.

[0038] The above is a preferred embodiment of the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A photoelectric conversion device packaging structure, characterized in that: The photoelectric conversion device packaging structure comprises: A packaging backplane, the packaging backplane comprises a metal plate, a polyethylene terephthalate layer is bonded to the upper surface of the metal plate, a first fluorine-containing polymer layer is bonded to the upper surface of the polyethylene terephthalate layer, an ethylene-vinyl acetate copolymer layer is arranged on the upper surface of the first fluorine-containing polymer layer, a plurality of through holes penetrating the ethylene-vinyl acetate copolymer layer, the first fluorine-containing polymer layer and the polyethylene terephthalate layer are arranged on the upper surface of the metal plate, a plurality of the through holes all expose the upper surface of the metal plate, a thermally conductive elastic column is embedded in each of the through holes, the upper end of the thermally conductive elastic column is exposed to the ethylene-vinyl acetate copolymer layer, the bottom surface of the thermally conductive elastic column is in contact with the metal plate, and the thermally conductive elastic column comprises a metal column , a silicone rubber layer is provided on the side surface of the metal column, an EVA bonding layer is provided on the surface of the silicone rubber layer, a natural rubber layer is bonded to the lower surface of the metal plate, a polyethylene naphthalate layer is bonded to the lower surface of the natural rubber layer, a second fluoropolymer layer is bonded to the lower surface of the polyethylene naphthalate layer, a plurality of rectangular openings penetrating the second fluoropolymer layer, the polyethylene naphthalate layer and the natural rubber layer are provided on the lower surface of the metal plate, the plurality of rectangular openings are arranged in parallel and expose the lower surface of the metal plate, a metal block is embedded in each of the rectangular openings, the top surface of the metal block is in contact with the lower surface of the metal plate, and the bottom surface of the metal block is flush with the lower surface of the second fluoropolymer layer; a first thermally conductive packaging adhesive layer, wherein the first thermally conductive packaging adhesive layer covers the packaging back plate, and the upper end of the thermally conductive elastic column exposed from the ethylene-vinyl acetate copolymer layer is embedded in the first thermally conductive packaging adhesive layer; a second packaging adhesive layer, wherein the second packaging adhesive layer covers the first thermally conductive packaging adhesive layer; A plurality of photovoltaic cells are laid on the second packaging adhesive layer; a third encapsulation adhesive layer, the third encapsulation adhesive layer covering the photovoltaic cell and the second encapsulation adhesive layer; A tempered glass plate, the tempered glass plate being arranged on the third packaging adhesive layer; Among them, the first thermally conductive packaging adhesive layer includes EVA resin and thermally conductive nanoparticles, the thermally conductive nanoparticles are one of aluminum oxide, aluminum nitride, boron nitride, silicon nitride, and magnesium oxide, and the particle size of the thermally conductive nanoparticles is 100-200 nanometers. The material of the second packaging adhesive layer and the third packaging adhesive layer is EVA.

2. The photoelectric conversion device packaging structure according to claim 1, characterized in that: The material of the metal plate is one of aluminum, copper, iron and aluminum-magnesium alloy, the thickness of the metal plate is 200-500 microns, the thickness of the polyethylene terephthalate layer is 1-3 mm, the thickness of the first fluoropolymer layer is 200-500 microns, and the thickness of the ethylene-vinyl acetate copolymer layer is 100-150 microns.

3. The photoelectric conversion device packaging structure according to claim 2, characterized in that: The material of the metal column is aluminum or copper, the diameter of the metal column is 5-10 mm, the thickness of the silicone rubber layer is 5-10 mm, and the thickness of the EVA bonding layer is 50-100 μm.

4. The photoelectric conversion device packaging structure according to claim 1, characterized in that: The thickness of the natural rubber layer is 1-3 mm, the thickness of the polyethylene naphthalate layer is 0.5-1 mm, the thickness of the second fluorine-containing polymer layer is 100-200 μm, the material of the metal block is aluminum or copper, and the size of the rectangular opening is the same as the size of the metal block.

5. The photoelectric conversion device packaging structure according to claim 1, characterized in that: The thickness of the first thermally conductive packaging adhesive layer is 300-500 microns, the thickness of the second packaging adhesive layer is 50-150 microns, the thickness of the third packaging adhesive layer is 200-300 microns, and the length of the upper end of the thermally conductive elastic column embedded in the first thermally conductive packaging adhesive layer is 150-400 microns.

6. The photoelectric conversion device packaging structure according to claim 1, characterized in that: The photovoltaic cell is a single crystal silicon photovoltaic cell, a polycrystalline silicon photovoltaic cell or a gallium arsenide photovoltaic cell.

7. The photoelectric conversion device packaging structure according to claim 1, characterized in that: The material of the first fluorine-containing polymer layer and the second fluorine-containing polymer layer is polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinylidene fluoride, polyvinyl fluoride, ethylene-chlorotrifluoroethylene copolymer or ethylene-tetrafluoroethylene copolymer.

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