An electrostatic suppressor module

Abstract

The present invention discloses an electrostatic suppressor module, comprising a substrate, a plurality of inner electrodes are arranged on the surface of the substrate, the inner electrodes include an outer connection portion extending to the outer side of the substrate and an inner connection portion extending to the inner side of the substrate, the inner connection portion is provided with two inner connection ports; an electrostatic suppression module for electrostatic protection is connected between the adjacent inner connection ports of two adjacent inner electrodes; the inner connection portion and the electrostatic suppression module are sequentially arranged and connected at intervals and connected end to end to form a circumferential closed structure. The electrostatic suppressor module realizes the integrated modularization of multiple electrostatic suppressor units, and different external connection portions can form a series-parallel connection between each electrostatic suppressor unit. Compared with the prior art, the present invention can significantly reduce the position of the electrostatic protection circuit occupied by the PCB board, making the electrostatic protection circuit on the circuit board simpler and facilitating the design and maintenance of the circuit.

Description

Technical Field

[0001] The invention belongs to the technical field of electrostatic protection, and in particular relates to an electrostatic suppressor module. Background Art

[0002] With the popularization of high-frequency signal transmission interfaces such as HDMI and USB3.0, and the increasing transmission rates of communication and network signals, higher capacitance will cause signal attenuation and distortion during high-speed signal transmission. Therefore, electrostatic suppressors with small capacitance are used when performing ESD protection on circuits.

[0003] However, there are often many interfaces on the same circuit board that require electrostatic protection. When multiple interfaces use multiple separate chip-type electrostatic suppressors, the circuit area is often too large, resulting in complex circuits and bringing hidden dangers in circuit design and maintenance. Summary of the invention

[0004] Purpose of the invention: In order to overcome the defects of the prior art, the present invention provides a small-sized electrostatic suppressor module which integrates multiple electrostatic suppressors and is suitable for PCB wiring.

[0005] In order to achieve the above-mentioned purpose, the electrostatic suppressor module of the present invention can adopt the following technical solutions:

[0006] An electrostatic suppressor module comprises a substrate on which a plurality of inner electrodes are arranged, wherein the inner electrodes are provided with an outer connection portion extending toward the outer side of the substrate and an inner connection portion extending toward the inner side of the substrate, wherein the inner connection portion comprises two inner connection ports; an electrostatic suppression module for electrostatic protection is arranged between adjacent inner connection ports of two adjacent inner electrodes; the inner connection portions and the electrostatic suppression module are sequentially arranged and connected in sequence and are connected end to end to form a circumferentially closed structure.

[0007] The present invention arranges a plurality of electrostatic suppression modules for ESD electrostatic protection on a substrate, and uses internal electrodes to sequentially connect the electrostatic suppression modules to form a circumferentially closed structure, and correspondingly arranges external connection parts to form a plurality of electrostatic suppressor units, thereby realizing the integrated modularization of a plurality of electrostatic suppressors, and different external connection parts can form a series-parallel connection between the electrostatic suppressor units. Compared with the prior art, the present invention can significantly reduce the position of the electrostatic protection circuit occupied by the PCB board, making the electrostatic protection circuit on the circuit board simpler and facilitating the design and maintenance of the circuit.

[0008] Furthermore, the circumferential closed structure is a regular polygon, and the electrostatic suppression module is located in the middle of each side of the regular polygon.

[0009] The static suppression module is made of antistatic material, which includes 100 parts by weight of a primary mixed slurry, 10 to 30 parts by weight of an insulating coating material, and 40 to 70 parts by weight of a conductive metal powder;

[0010] The primary mixed slurry comprises insulating isolation powder, solvent and dispersant, wherein the insulating isolation powder accounts for 49-70% of the total weight, the solvent accounts for 29-50% of the total weight, and the dispersant accounts for 0.1-1% of the total weight.

[0011] In order to achieve the above-mentioned purpose of the invention, the electrostatic suppressor module of the present invention can also adopt the following technical scheme: an electrostatic suppressor module, including a substrate, an inner electrode ring is arranged on the substrate, a plurality of electrostatic suppression modules for electrostatic protection are arranged on the inner electrode ring, and an external connection portion extending to the outside of the substrate is arranged on the inner electrode ring between adjacent electrostatic suppression modules.

[0012] Wherein, the inner electrode ring is in a regular polygon structure, and the electrostatic suppression module is arranged in the middle position of each side of the regular polygon. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a structural schematic diagram of an electrostatic suppressor module with three external connecting parts of the present invention;

[0014] Figure 2 It is a structural schematic diagram of an electrostatic suppressor module with four external connecting parts of the present invention;

[0015] Figure 3 It is a structural schematic diagram of an electrostatic suppressor module with six external connecting parts of the present invention;

[0016] Figure 4 It is a schematic structural diagram of an electrostatic suppressor module with eight external connecting parts according to the present invention. DETAILED DESCRIPTION

[0017] The present invention is further described in detail below with reference to the accompanying drawings.

[0018] Reference Figures 1 to 4The present invention provides a small electrostatic suppressor module suitable for PCB wiring that integrates multiple electrostatic suppressors. The electrostatic suppressor module includes a substrate 1, and a plurality of internal electrodes 2 arranged on the surface of the substrate 1, wherein the internal electrode 2 includes an external connection portion 4 extending to the outside of the substrate 1 and an internal connection portion extending to the inside of the substrate, that is, the external connection portion 4 extends to the side edge of the substrate 1, and the internal connection portion faces the center direction of the substrate 1. The internal connection portion includes two internal connection ports, and an electrostatic suppression module 3 for ESD electrostatic protection is connected between the adjacent internal connection ports of two adjacent internal electrodes 2. The internal connection portion and the electrostatic suppression module 3 are arranged and connected in sequence at intervals and connected end to end to form a circumferential closed structure. Preferably, the internal connection portion and the electrostatic suppression module 3 are connected and arranged in a regular polygon structure, and the electrostatic suppression module is located in the middle of each side of the regular polygon. Thereby, the capacitance and antistatic performance of each electrostatic suppressor unit are kept consistent.

[0019] Alternatively, the electrostatic suppressor module includes a substrate 1 and an inner electrode ring arranged on the surface of the substrate 1. The inner electrode ring is a circumferentially closed structure. When implemented, it can be set to a ring, a regular polygon, etc. In order to realize the modularization of multiple electrostatic suppressors, multiple electrostatic suppression modules 3 are arranged on the inner electrode ring, and an external connection portion 4 extending to the outside of the substrate 1 is arranged on the inner electrode ring between adjacent electrostatic suppression modules 3. By arranging inner electrode rings of different shapes on the substrate 1, and arranging multiple electrostatic suppression modules 3 for ESD electrostatic protection on the inner electrode ring, multiple electrostatic suppressor units are integrated on one substrate, and series-parallel connection of each electrostatic suppressor unit can be formed between different external connections, which can significantly reduce the space occupied by the PCB board and bring convenience to the design of the electrostatic protection circuit of the circuit board. Similarly, as a preference, the inner electrode ring is a regular polygon structure, and the electrostatic suppression module 3 is arranged in the middle position of each side of the regular polygon. Thereby, the consistency of the capacitance and antistatic performance of each electrostatic suppressor unit can be guaranteed.

[0020] In order to achieve ultra-low capacitance and high electrostatic impact life of each electrostatic suppressor unit and meet the requirements of high-speed transmission signal lines, the electrostatic suppression module 3 can be made of antistatic material. The antistatic material includes conductive metal powder, isolation insulation powder, insulation coating material, dispersant and solvent. In normal state, that is, when there is no electrostatic discharge, the metal conductive particles of the conductive metal powder are separated by insulating materials, presenting a high resistance state of GΩ level; when subjected to transient static electricity, the tip discharge between adjacent metal conductive particles, when the breakdown voltage of the insulating material is reached, it is instantly turned on, and its on-resistance is very small, the current generated by the loop is discharged to the ground, and the voltage is embedded to a low value, thereby protecting the original. By adopting the antistatic material and reasonably controlling the groove spacing, that is, reasonably controlling the span of the electrostatic suppressor module between adjacent inner electrodes, the ultra-low capacitance and high electrostatic impact life of each electrostatic suppressor unit can be achieved to meet the requirements of high-speed transmission signal lines. Preferably, the width of the groove along the longitudinal direction of the electrode side is 20 to 100 μm.

[0021] The preparation of the electrostatic suppressor module comprises the following steps:

[0022] First, a substrate 1 is provided, and a surface pattern of the substrate is designed, that is, a pattern presented on the surface of the substrate of the electrostatic suppressor module is designed.

[0023] The antistatic material is prepared by uniformly mixing insulating isolation powder, solvent and dispersant, and ball milling to obtain a primary mixed slurry; wherein the insulating isolation powder accounts for 49-70% of the total weight, the solvent accounts for 29-50% of the total weight, and the dispersant accounts for 0.1-1% of the total weight; then taking 100 parts by weight of the primary mixed slurry, adding 10-30 parts by weight of insulating coating material and 40-70 parts by weight of conductive metal powder in sequence, mixing and rolling, and adjusting the slurry viscosity to 20,000-60,000 Pa·S to obtain the antistatic material. Among them, the insulating isolation powder can use spherical silica powder with a particle size D50 of 1.0-4.0μm and a relative dielectric constant of 3.88 at 1MHZ; the solvent is a mixture of pine oil and ethylene glycol butyl ether, wherein pine oil accounts for 20-60% of the total mass and ethylene glycol butyl ether accounts for 40-80% of the total mass; the dispersant is soybean lecithin with a long solvent chain and strong adsorption capacity; the conductive metal powder can choose spherical nickel powder, silver powder or aluminum powder with a particle size D50 of 0.2-1.0μm; the insulating coating material can choose phenolic resin, epoxy resin or silicone resin with a low dielectric constant, which can ensure that the antistatic material can be attached to the substrate after printing and curing, and can also ensure that the insulating isolation powder particles and the conductive metal powder particles are completely wrapped and the relative positions between them are fixed, and at the same time, static electricity is discharged at the tip between the conductive metal powder particles to release energy, thereby realizing the electrostatic protection function.

[0024] Printing substrate surface graphics, using a screen with a designed substrate surface graphics, printing metal paste or conductive glue on the surface of substrate 1, and then drying and curing to form, the thickness of the electrode formed after curing is 20±3μm. For printing metal paste, one or more mixed pastes of silver palladium and copper can be selected for high temperature sintering; for printing conductive glue, low temperature drying can be used. In this embodiment, when printing metal paste, it is placed in a 150℃ box furnace for drying for 20 minutes, and then sintered at a maximum temperature of about 850℃ for 15 to 20 minutes to cure; the conductive glue is directly dried in a 150℃ oven. Among them, the substrate 1 can be selected from high frequency, that is, materials with a relative dielectric constant of less than 6, an insulation resistance of more than 500MΩ, and a breakdown voltage of more than 1000V / μm at ≥1MHz. For example, alumina ceramics, aluminum nitride ceramics or FR-4 epoxy glass fiber board.

[0025] Etching grooves: using laser to etch grooves for filling antistatic materials on the electrode pattern formed in the previous step, and cutting and separating the electrodes. Preferably, the width of the grooves is controlled to be 20 to 100 μm. After etching, clean the material residue inside the grooves.

[0026] Filling the antistatic material, using a screen to print the prepared antistatic material in all the grooves etched in the previous step, and then curing and forming, the thickness of the cured antistatic material is 20±2μm, forming an electrostatic suppression module. In this embodiment, the antistatic material is first dried in an oven at 120°C for 12 hours, and then baked in an oven at 150°C for 1 hour to cure and form, to ensure that the solvent in the antistatic material can be completely volatilized.

[0027] Make a protective layer, print epoxy resin or phenolic resin or silicone resin on the substrate, and cover the electrode pattern and antistatic material on the surface of substrate 1, that is, cover the inner electrode and the electrostatic suppression module, or cover the inner electrode ring, the electrostatic suppression module and the external connection part. Then cure and form to protect the electrode and the electrostatic suppression module. In this embodiment, the protective layer is cured by baking in a 120°C oven for 1 hour to ensure that there are no cracks and micropores on the surface of the resin after molding, thereby improving the reliability of the product in different temperature and humidity environments; at the same time, it can also be more firmly combined with substrate 1.

[0028] Then, the substrate 1 is divided into strips and granules. After completing the above five steps, the substrate 1 is divided into strips, sputtered, and granules to form chips that meet the size specifications.

[0029] Five groups of antistatic materials were prepared by the above method. A mixed slurry was first prepared. The mass proportions of the raw materials used are shown in Table 1:

[0030] Table 1: The mass ratio of each raw material in the primary mixed slurry

[0031]

[0032] The prepared primary mixed slurry is then used to prepare the antistatic material. The mass ratio of the raw materials used is shown in Table 2:

[0033] Table 2 The mass ratio of each raw material in antistatic materials

[0034]

[0035] The viscosity of the slurry of the five groups of antistatic materials L1 to L5 prepared above is 20,000 Pa·S, 30,000 Pa·S, 40,000 Pa·S, 50,000 Pa·S and 60,000 Pa·S respectively. The preparation method of the electrostatic suppressor module is adopted, and the five groups of antistatic materials are used to prepare electrostatic suppressor modules with three external connections, four external connections, six external connections and eight external connections respectively, and the specific performance of each electrostatic suppressor module is tested. In the experiment, the inner electrode ring of each electrostatic suppressor module is set in a regular polygon, so as to ensure that the capacitance and antistatic performance of each electrostatic suppressor unit remain consistent.

[0036] Furthermore, in order to ensure the accuracy of the experimental data, a plurality of ESD suppressor modules with the same number of external connections were prepared for each group of antistatic materials. Then, the capacitance and antistatic performance of each ESD suppressor unit of these ESD suppressor modules with the same number of external connections were measured respectively, and a large amount of data on the capacitance of each ESD suppressor unit was obtained, and the data was summarized in Tables 3 to 6.

[0037] Reference Figure 1 For an ESD suppressor module with three external connections, the groove etching width is 20 μm, and the capacitance of each ESD suppressor unit and the specific performance parameters of the ESD suppressor module are shown in Table 3:

[0038] Table 3 Performance parameters of the ESD suppressor module with three external connections

[0039]

[0040] Reference Figure 2 For the ESD suppressor module with four external connections, the groove etching width is 40 μm. The capacitance of each ESD suppressor unit and the specific performance parameters of the ESD suppressor module are shown in Table 4:

[0041] Table 4 Performance parameters of the ESD suppressor module with four external connections

[0042]

[0043] Reference Figure 3For the ESD suppressor module with six external connections, the groove etching width is 80 μm. The capacitance of each ESD suppressor unit and the specific performance parameters of the ESD suppressor module are shown in Table 5:

[0044] Table 5 Performance parameters of the ESD suppressor module with six external connections

[0045]

[0046] Reference Figure 4 For the ESD suppressor module with eight external connections, the groove etching width is 100 μm. The capacitance of each ESD suppressor unit and the specific performance parameters of the ESD suppressor module are shown in Table 6:

[0047] Table 6 Performance parameters of the ESD suppressor module with eight external connections

[0048]

[0049]

[0050] It can be concluded from the experimental data in Tables 3 to 6 that the preparation method of the antistatic material in the present invention can prepare an antistatic material with stable performance and basically consistent performance. In other words, when the antistatic material is prepared, as long as the raw materials and the raw material ratio requirements in the preparation method are strictly followed, the prepared antistatic material is used in the electrostatic suppressor module of the present invention, and the obtained electrostatic suppressor module can maintain stable performance and the performance is basically consistent.

[0051] In addition, it can also be concluded from the above-mentioned large number of experiments that the ESD suppressor module can achieve ultra-low capacitance and high electrostatic shock life of each ESD suppressor unit, meeting the requirements of high-speed transmission signal lines.

[0052] Of course, under the premise of satisfying the structure of the electrostatic suppressor module described in the present invention, existing antistatic materials or electrostatic suppressors sold on the market can also be used to replace the antistatic materials of the present invention as an electrostatic suppression module to specifically implement the electrostatic suppressor module described in the present invention. In this way, the purpose of the invention of integrating multiple electrostatic suppressors into a small module can be achieved. It only needs to be able to present a high-resistance state of GΩ level in normal state, that is, when there is no static electricity release; and in the case of transient static electricity, it can discharge and conduct instantly, discharge the current generated by the circuit to the ground, and clamp the voltage to a low value, thereby protecting the original part.

[0053] The above description is only a preferred embodiment of the present invention. It should be pointed out that several deductions or substitutions can be made without departing from the concept of the present invention, and these deductions or substitutions should be regarded as the protection scope of the present invention.

Claims

1. An electrostatic suppressor module, characterized in that: A substrate is provided with a plurality of inner electrodes on the surface of the substrate, the inner electrodes include an outer connection portion extending toward the outer side of the substrate and an inner connection portion extending toward the inner side of the substrate, the inner connection portion is provided with two inner connection ports; an electrostatic suppression module for electrostatic protection is connected between adjacent inner connection ports of two adjacent inner electrodes; the inner connection portions and the electrostatic suppression modules are sequentially arranged and connected at intervals and connected end to end to form a circumferential closed structure; The circumferential closed structure is in the form of a regular polygon, and the electrostatic suppression module is located in the middle of each side of the regular polygon.

2. The electrostatic suppressor module according to claim 1, characterized in that: The static suppression module is made of antistatic material; the antistatic material includes 100 parts by weight of a primary mixed slurry, 10 to 30 parts by weight of an insulating coating material, and 40 to 70 parts by weight of a conductive metal powder; The primary mixed slurry comprises insulating isolation powder, solvent and dispersant, wherein the insulating isolation powder accounts for 49-70% of the total weight, the solvent accounts for 29-50% of the total weight, and the dispersant accounts for 0.1-1% of the total weight.

3. The electrostatic suppressor module according to claim 1, characterized in that: A protective layer is also provided on the surface of the substrate, and the protective layer covers the inner electrode and the static electricity suppression module.

4. An electrostatic suppressor module, characterized in that: The invention comprises a substrate, an inner electrode ring is arranged on the substrate, a plurality of electrostatic suppression modules for electrostatic protection are arranged on the inner electrode ring, and an external connection portion extending to the outside of the substrate is arranged on the inner electrode ring between adjacent electrostatic suppression modules; The inner electrode ring is in a regular polygonal structure, and the electrostatic suppression module is arranged in the middle of each side of the regular polygon.

5. The electrostatic suppressor module according to claim 4, characterized in that: The static suppression module is made of antistatic material; the antistatic material includes 100 parts by weight of a primary mixed slurry, 10 to 30 parts by weight of an insulating coating material, and 40 to 70 parts by weight of a conductive metal powder; The primary mixed slurry comprises insulating isolation powder, solvent and dispersant, wherein the insulating isolation powder accounts for 49-70% of the total weight, the solvent accounts for 29-50% of the total weight, and the dispersant accounts for 0.1-1% of the total weight.

6. The electrostatic suppressor module according to claim 4, characterized in that: A protective layer is also provided on the surface of the substrate, and the protective layer covers the inner electrode ring, the electrostatic suppression module and the external connection part.

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