Chip testing device

Abstract

The present invention relates to the field of testing technology, and discloses a chip testing device, including a test seat assembly, a heating assembly, a temperature measuring assembly and a controller, wherein the test seat assembly includes a fixed plate assembly and a conductive member; the heating assembly is partially arranged in the fixed plate assembly; the temperature measuring assembly can be slidably inserted into the heating assembly, and can contact with the chip to measure the temperature of the chip; the peripheral controller is spaced apart from the test seat assembly, and is electrically connected to the heating assembly and the temperature measuring assembly, and the peripheral controller includes a display module for inputting a preset temperature and displaying a temperature measurement result. In the chip testing device provided by the present invention, the peripheral controller and the display module both work at room temperature, which prolongs the service life of the peripheral controller and the display module, and the preset temperature can be adjusted during the test process, thereby improving the flexibility of temperature control; in addition, the temperature measuring assembly can realize direct measurement of the chip temperature, thereby improving the accuracy of the measurement.

Description

Technical Field

[0001] The present invention relates to the field of testing technology, and in particular to a chip testing device. Background Art

[0002] In order to ensure the performance of the chip under high temperature, it is usually necessary to use a chip testing device with a heating function to perform a high temperature test on the chip. The existing chip testing device with a heating function usually includes a heating component, a temperature measuring component and a controller. The heating component is used to heat the chip, the temperature measuring component is used to measure the chip temperature, and the controller is used to control the power supply of the heating component to turn on or off to control the temperature of the chip.

[0003] However, the controller in the existing chip testing device is generally directly set in the device. As the heating component heats the chip, the temperature of the controller will also rise accordingly, causing the controller to work at a high temperature. Long-term operation at a high temperature will cause the working stability and reliability of the controller to decrease, greatly shortening the service life of the controller. At the same time, the display module used to display the temperature measurement results is generally also directly set on the chip testing device, causing the display module to also work at a high temperature, greatly reducing the service life of the display module. In addition, most of the existing temperature measurement components do not directly measure the chip temperature, but represent the temperature of the chip through indirect measurement, such as by measuring the temperature of the chamber where the chip is placed or the temperature of the outer shell of the measuring test device to represent the temperature of the chip. The accuracy of this temperature measurement result is poor and cannot accurately reflect the temperature of the chip, which not only affects the accuracy of the chip test results, but also easily causes the actual temperature of the chip to be too high. Therefore, a new chip testing device is urgently needed to solve the above technical problems. Summary of the invention

[0004] Based on the above, the purpose of the present invention is to provide a chip testing device to solve the technical problems existing in the existing chip testing devices, such as the short service life of the controller and the inaccurate measurement of the temperature measuring component.

[0005] To achieve the above object, the present invention adopts the following technical solutions:

[0006] A chip testing device, comprising:

[0007] A test socket assembly, comprising a fixed plate assembly and a conducting member, wherein the chip is arranged in the fixed plate assembly and is connected to an external test circuit through the conducting member;

[0008] A heating assembly, partially disposed in the fixing plate assembly, for heating the chip;

[0009] A temperature measuring component, which is slidably disposed in the heating component and can contact the chip to measure the temperature of the chip;

[0010] The peripheral controller is spaced apart from the test socket assembly and is electrically connected to the heating assembly and the temperature measuring assembly. The peripheral controller includes a display module for inputting a preset temperature and displaying a temperature measurement result.

[0011] Furthermore, the heating assembly comprises a heating body and a heat transfer body, and the heating body is detachably inserted into the heat transfer body.

[0012] Furthermore, the heat transfer body includes a heat transfer plate and a heat sink, the heat sink is arranged on the heat transfer plate, and the heat transfer plate can contact with the top surface of the chip.

[0013] Furthermore, the temperature measurement component includes a temperature sensor, a test hole is opened on the heating component, the temperature sensor is slidably arranged in the test hole, and the temperature sensor can pass through the test hole to contact the top surface of the chip.

[0014] Furthermore, the temperature measuring component also includes an elastic member and a sleeve, the sleeve is fixed in the test hole, one end of the temperature sensor can be slidably inserted into the sleeve, a flange is provided on the temperature sensor, the elastic member is sleeved on the temperature sensor, and one end of the elastic member abuts against the end face of the sleeve, and the other end of the elastic member abuts against the flange.

[0015] Furthermore, it also includes a knob assembly, which is connected to the heating assembly and is used to lock the heating assembly against the chip.

[0016] Furthermore, it also includes a test cover, which is arranged above the fixed plate assembly. The test cover is provided with a switch hole, and the knob assembly part is rotatably arranged in the switch hole.

[0017] Furthermore, the knob assembly includes a knob, a transmission member, a bearing and a pad arranged in sequence from top to bottom, the knob is fixedly connected to the transmission member, the transmission member is rotatably arranged in the switch hole, and the bottom surface of the transmission member abuts against the bearing, the bearing is arranged in a bearing groove on the pad, the heating assembly is fixed on the pad, the pad is installed on the test cover, and the pad can move relative to the test cover.

[0018] Furthermore, the knob, the transmission member, the bearing and the backing plate are all provided with heat dissipation holes, and the heat dissipation holes are combined to form a heat dissipation channel, and the heat dissipation plate is arranged in the heat dissipation channel.

[0019] Furthermore, the fixed plate assembly includes a guide plate, a fixed plate and a bottom plate arranged in sequence from top to bottom, the guide plate is provided with a chip hole, the chip can be fixed in the chip hole, the fixed plate and the bottom plate are both provided with a step hole, the conductive part is passed through the step hole.

[0020] The beneficial effects of the present invention are:

[0021] The chip testing device provided by the present invention, on the one hand, by setting an external controller, when the heating component heats the chip, the external controller will not rise with the increase of the temperature of the chip, so that the external controller always works at room temperature, ensuring the stability and reliability of the operation of the external controller, and extending the service life of the external controller; at the same time, by setting a display module on the external controller, the display module can also work at room temperature, extending the service life of the display module, and the preset temperature can be adjusted according to demand during the test process, thereby improving the flexibility of chip temperature control. In addition, by setting a temperature measuring component that can contact the chip, direct measurement of the chip temperature can be achieved, greatly improving the accuracy of the temperature measurement result, thereby ensuring the accuracy of the chip test result, and avoiding the occurrence of the actual temperature of the chip being too high; at the same time, the temperature measuring component can be slidably inserted into the heating component, which can prevent the temperature measuring component from pressing too much on the chip, thereby protecting the chip and the temperature measuring component. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

[0023] Figure 1 is a schematic diagram of the structure of a chip testing device provided by an embodiment of the present invention;

[0024] Figure 2 is a cross-sectional side view of a chip testing device provided by an embodiment of the present invention;

[0025] Figure 3 is an exploded diagram of a chip testing device provided by an embodiment of the present invention;

[0026] Figure 4 is a top view of a chip testing device provided by an embodiment of the present invention;

[0027] Figure 5 is a structural schematic diagram of a temperature measurement component in a chip testing device provided by an embodiment of the present invention;

[0028] Figure 6 It is a schematic structural diagram of a chip testing device provided by an embodiment of the present invention at another angle.

[0029] In the figure:

[0030] 10-chip;

[0031] 1-test seat assembly; 11-fixed plate assembly; 111-guide plate; 112-fixed plate; 113-bottom plate; 12-conducting member;

[0032] 2-heating assembly; 21-heating body; 22-heat transfer body; 221-heat transfer plate; 222-heat dissipation plate; 23-positioning pin;

[0033] 3-temperature measuring component; 31-temperature sensor; 32-elastic member; 33-sleeve;

[0034] 4- Peripheral controller;

[0035] 5-knob assembly; 51-knob; 511-limiting slot; 52-transmission member; 53-bearing; 54-pad; 55-limiting column;

[0036] 6-test cover; 61-switch hole;

[0037] 7-Locking assembly. DETAILED DESCRIPTION

[0038] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0039] like Figure 1-Figure 3As shown, this embodiment provides a chip testing device, including a test seat assembly 1, a heating assembly 2, a temperature measuring assembly 3 and an external controller 4, wherein the test seat assembly 1 includes a fixed plate assembly 11 and a conductive member 12, the chip 10 is arranged in the fixed plate assembly 11, and is connected to the external test circuit through the conductive member 12; the heating assembly 2 is partially arranged in the fixed plate assembly 11, and is used to heat the chip 10; the temperature measuring assembly 3 can be slidably penetrated in the heating assembly 2, and can contact with the chip 10 to measure the temperature of the chip 10; the external controller 4 is spaced from the test seat assembly 1, and is electrically connected to the heating assembly 2 and the temperature measuring assembly 3, and the external controller 4 includes a display module for inputting a preset temperature and displaying a temperature measurement result. In this embodiment, the conductive member 12 is a probe; the display module can be a touch screen, and the preset temperature is directly input by touch, or it can be a non-touch screen, and the preset temperature is input by a button in the display module.

[0040] When the chip testing device is working, the chip 10 is first fixed on the fixed plate assembly 11, and the chip 10 is connected to the external test circuit by using the conductive piece 12. Then, the preset temperature is input into the peripheral controller 4 according to the test requirements, and the heating assembly 2 starts to heat the chip 10. During the heating process, the temperature measuring assembly 3 will test the temperature of the chip 10 in real time and transmit the temperature measurement result to the external controller 4. When the temperature measurement result is higher than the preset temperature, the external controller 4 will cut off the power supply of the heating assembly 2. After cutting off the power supply, when the temperature measurement result is lower than the preset temperature, the external controller 4 will turn on the power supply of the heating assembly 2 again, so that the temperature of the chip 10 is consistent with the preset temperature during the entire test process.

[0041] The chip testing device provided in this embodiment, on the one hand, by setting the peripheral controller 4, when the heating component 2 heats the chip 10, the peripheral controller 4 will not rise with the increase of the temperature of the chip 10, so that the peripheral controller 4 always works at room temperature, ensuring the stability and reliability of the peripheral controller 4, and extending the service life of the peripheral controller 4; at the same time, by setting the display module on the peripheral controller 4, the display module can also work at room temperature, extending the service life of the display module, and the preset temperature can be adjusted according to the needs during the test process, thereby improving the flexibility of the temperature control of the chip 10. In addition, by setting the temperature measuring component 3 that can contact with the chip 10, the direct measurement of the temperature of the chip 10 can be achieved, which greatly improves the accuracy of the temperature measurement result, thereby ensuring the accuracy of the chip test result, and avoiding the situation where the actual temperature of the chip 10 is too high; at the same time, the temperature measuring component 3 can be slidably arranged in the heating component 2, which can prevent the temperature measuring component 3 from pressing too much on the chip 10, thereby protecting the chip 10 and the temperature measuring component 3.

[0042] Specifically, the heating assembly 2 includes a heating body 21 and a heat transfer body 22. The heating body 21 is detachably inserted into the heat transfer body 22, and the heating body 21 is located in the middle of the heat transfer body 22. Inserting the heating body 21 into the heat transfer body 22 can ensure the stability of the cooperation between the two. In addition, the heat generated by the heating body 21 is transferred to the chip 10 through the heat transfer body 22, so that the chip 10 can be heated more evenly. In this embodiment, the heating body 21 is cylindrical, and the heat transfer body 22 is a heat transfer copper block. In order to prevent the cylindrical heating body 21 from rotating in the heat transfer body 22, the heating body 21 is fixed by a positioning pin 23.

[0043] like Figure 3 As shown, the heat transfer body 22 provided in this embodiment includes a heat transfer plate 221 and a heat sink 222. The heat sink 222 is disposed on the heat transfer plate 221, and the heat transfer plate 221 can contact the top surface of the chip 10. The heat transfer plate 221 can heat the entire top surface of the chip 10, and when the temperature of the chip 10 is too high, the heat sink 222 can effectively dissipate heat to reduce the impact of high temperature on the chip 10.

[0044] Specifically, Figure 4 As shown, the temperature measuring component 3 includes a temperature sensor 31, and a test hole is provided on the heating component 2. The temperature sensor 31 is slidably disposed in the test hole, and the temperature sensor 31 can pass through the test hole to contact the chip 10. The temperature sensor 31 is slidably disposed in the test hole, which can prevent excessive pressure between the temperature sensor 31 and the chip 10, thereby avoiding damage to the temperature sensor 31 and / or the chip 10, and protecting the temperature sensor 31 and the chip 10.

[0045] Furthermore, if Figure 5 As shown, the temperature measuring assembly 3 also includes an elastic member 32 and a sleeve 33. The sleeve 33 is fixed in the test hole. One end of the temperature sensor 31 can be slidably inserted into the sleeve 33. The temperature sensor 31 is provided with a flange. The elastic member 32 is sleeved on the temperature sensor 31, and one end of the elastic member 32 abuts against the end surface of the sleeve 33, and the other end of the elastic member 32 abuts against the flange. In this embodiment, the elastic member 32 is a spring, and the temperature sensor 31 slides up and down in the sleeve 33 by compression and extension of the spring, thereby avoiding excessive pressure on the temperature sensor 31 abutting against the chip 10.

[0046] The chip testing device provided in this embodiment further includes a knob assembly 5, which is connected to the heating assembly 2 and is used to lock the heating assembly 2 against the chip 10. That is, the knob assembly 5 can control the heating assembly 2 to contact or break contact with the chip 10. When the heating assembly 2 is in contact with the chip 10, the heating assembly 2 can heat the chip 10.

[0047] Furthermore, it also includes a test cover 6, which is arranged above the fixed plate assembly 11. The test cover 6 is provided with a switch hole 61. The knob assembly 5 is partially rotatably arranged in the switch hole 61. The test cover 6 is conducive to ensuring the stability and reliability of the operation of the knob assembly 5.

[0048] Specifically, the knob assembly 5 includes a knob 51, a transmission member 52, a bearing 53 and a backing plate 54 which are arranged in sequence from top to bottom. The knob 51 is fixedly connected to the transmission member 52. The transmission member 52 is rotatably arranged in the switch hole 61, and the bottom surface of the transmission member 52 abuts against the bearing 53. The bearing 53 is arranged in the bearing groove on the backing plate 54. The heating assembly 2 is fixed on the backing plate 54. The backing plate 54 is installed on the test cover 6, and the backing plate 54 can move relative to the test cover 6. In this embodiment, the knob 51 and the transmission member 52 are fixedly connected by bolts matching with the threaded holes on the top surface of the transmission member 52; the outer wall of the transmission member 52 matches with the switch hole 61 of the test cover 6 by threads; the backing plate 54 is fixed to the bottom surface of the test cover 6 by springs and bolts, the spring is sleeved on the bolts, the bolts pass through the connection holes on the backing plate 54 from below and match with the threaded holes on the test cover 6, and the diameter of the connection holes is larger than the diameter of the bolts. When the knob 51 is rotated, the knob 51 will drive the transmission member 52 to rotate synchronously, and at the same time the transmission member 52 will move downward relative to the test cover 6, and exert a downward pressure on the bearing 53 and the pad 54. Under the action of this pressure, the spring will be compressed, causing the pad 54 to move downward, and then the pad 54 will drive the heating component 2 to move downward, so that the heating component 2 contacts the chip 10.

[0049] In order to control the downward moving distance of the heating component 2, a semicircular limit groove 511 is opened on the knob 51, and a limit column 55 is set, and one end of the limit column 55 is fixed on the test cover 6. The other end of the limit column 55 cooperates with the limit groove 511 to limit the rotation angle of the knob 51, thereby controlling the downward moving distance of the heating component 2 and preventing the heating component 2 from moving too far downward and causing damage to the chip 10.

[0050] Furthermore, the knob 51, the transmission member 52, the bearing 53 and the pad 54 are all provided with heat dissipation holes, and the heat dissipation holes are combined to form a heat dissipation channel, and the heat dissipation plate 222 is arranged in the heat dissipation channel. Through the cooperation of the heat dissipation plate 222 and the heat dissipation channel, a directional heat dissipation effect can be achieved.

[0051] In this embodiment, the fixed plate assembly 11 includes a guide plate 111, a fixed plate 112 and a base plate 113 which are arranged in sequence from top to bottom. The guide plate 111 is provided with a chip hole, and the chip 10 can be fixed in the chip hole. The fixed plate 112 and the base plate 113 are both provided with step holes, and the conductive member 12 is passed through the step holes. One end of the conductive member 12 is in contact with the bottom surface of the chip 10, and the other end of the conductive member 12 is conductive to the external test circuit.

[0052] The chip testing device provided in this embodiment further includes a locking assembly 7 for locking the test cover 6 and the fixed plate assembly 11. Specifically, one side of the test cover 6 is rotatably connected to the fixed plate assembly 11, and the other side of the test cover 6 can be fixedly connected to the fixed plate assembly 11 through the locking assembly 7. The test cover 6 is rotatably connected to the fixed plate assembly 11, which can facilitate the placement of the chip 10 into or removal from the chip hole. The locking assembly 7 can stably connect the test cover 6 to the fixed plate assembly 11, thereby ensuring the stability of the operation of the heating assembly 2 and the temperature measuring assembly 3.

[0053] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A chip testing device, characterized in that: include: A test socket assembly (1) comprises a fixed plate assembly (11) and a conductive member (12); a chip (10) is arranged in the fixed plate assembly (11) and is conductively connected to an external test circuit via the conductive member (12); A heating component (2), partially disposed in the fixing plate component (11), and used for heating the chip (10), the heating component (2) comprising a heating body (21) and a heat transfer body (22), the heating body (21) being detachably inserted into the heat transfer body (22); A temperature measuring component (3) is slidably arranged in the heating component (2) and is capable of contacting the chip (10) to measure the temperature of the chip (10); the temperature measuring component (3) comprises a temperature sensor (31); a test hole is provided on the heating component (2); the temperature sensor (31) is slidably arranged in the test hole, and the temperature sensor (31) is capable of passing through the test hole to contact the chip (10); an external controller (4) arranged at a distance from the test socket assembly (1) and electrically connected to the heating assembly (2) and the temperature measurement assembly (3); the external controller (4) comprising a display module for inputting a preset temperature and displaying a temperature measurement result; The temperature measuring component (3) further comprises an elastic member (32) and a sleeve (33), wherein the sleeve (33) is fixed in the test hole, one end of the temperature sensor (31) is slidably inserted into the sleeve (33), a flange is provided on the temperature sensor (31), the elastic member (32) is sleeved on the temperature sensor (31), and one end of the elastic member (32) abuts against an end surface of the sleeve (33), and the other end of the elastic member (32) abuts against the flange.

2. The chip testing device according to claim 1, characterized in that: The heat transfer body (22) comprises a heat transfer plate (221) and a heat dissipation plate (222); the heat dissipation plate (222) is arranged on the heat transfer plate (221); and the heat transfer plate (221) is capable of contacting the top surface of the chip (10).

3. The chip testing device according to claim 2, characterized in that: It also comprises a knob assembly (5), which is connected to the heating assembly (2) and is used to lock the heating assembly (2) against the chip (10).

4. The chip testing device according to claim 3, characterized in that: It also comprises a test cover (6) which is arranged above the fixing plate assembly (11); a switch hole (61) is provided on the test cover (6); and a portion of the knob assembly (5) is rotatably arranged in the switch hole (61).

5. The chip testing device according to claim 4, characterized in that: The knob assembly (5) comprises a knob (51), a transmission member (52), a bearing (53) and a backing plate (54) which are arranged in sequence from top to bottom. The knob (51) is fixedly connected to the transmission member (52). The transmission member (52) is rotatably arranged in the switch hole (61), and the bottom surface of the transmission member (52) abuts against the bearing (53). The bearing (53) is arranged in a bearing groove on the backing plate (54). The heating assembly (2) is fixed on the backing plate (54). The backing plate (54) is installed on the test cover (6), and the backing plate (54) can move relative to the test cover (6).

6. The chip testing device according to claim 5, characterized in that: The knob (51), the transmission member (52), the bearing (53) and the pad (54) are all provided with heat dissipation holes, and the heat dissipation holes are combined to form a heat dissipation channel, and the heat dissipation plate (222) is arranged in the heat dissipation channel.

7. The chip testing device according to claim 1, characterized in that: The fixing plate assembly (11) comprises a guide plate (111), a fixing plate (112) and a bottom plate (113) which are arranged in sequence from top to bottom; the guide plate (111) is provided with a chip hole, and the chip (10) can be fixed in the chip hole; the fixing plate (112) and the bottom plate (113) are both provided with a step hole, and the conductive member (12) is inserted into the step hole.

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