Compliant Radiator

Abstract

Compliant heat sink. A heat sink apparatus, test system, and method may be used to test an electronic device. The heat sink may include a hollow shell. The hollow shell may define an inner cavity. The hollow shell may include a contact surface. The heat sink may include a working fluid. The working fluid may be contained in the inner cavity. The hollow shell may be configured to be physically compliant. The hollow shell may be physically compliant such that the hollow shell conforms to the shape of a test surface in response to an applied pressure. The test surface may be a top surface of a semiconductor. The test surface may be curved or otherwise lack conformity. The hollow shell may conform to the curvature or lack of conformity of the test surface such that there is a minimum gap between the hollow shell and the surface.

Description

Background Art

[0001] Electronic devices (e.g., transistors or semiconductors) generate heat when operating. As electronic devices are optimized and performance increases, electronic devices generate more heat per unit area (e.g., watts per square millimeter). As the amount of heat per unit area increases, traditional heat dissipation techniques may not be sufficient to regulate the temperature of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0002] In the accompanying drawings, which are not necessarily drawn to scale, the same reference numerals may describe similar components in different views. The same numerals with different letter suffixes may represent different instances of similar components. The accompanying drawings generally illustrate various embodiments discussed in this document by way of example and not limitation.

[0003] Figure 1 A portion of a first test system according to an example of the present subject matter is shown, including a first heat sink and a device under test.

[0004] Figure 2 A portion of a test system according to an example of the present subject matter is shown, wherein a first heat sink is in communication with a device under test.

[0005] Figure 3 An example according to the present subject is shown Figure 1-2 An example of one or more first protrusions of a first heat sink.

[0006] Figure 4 An example according to the present subject is shown Figure 1-2 Another example of the one or more first protrusions of the first heat sink.

[0007] Figure 5 Examples of one or more second protrusions according to examples of the present subject matter are shown.

[0008] Figure 6 A second heat sink according to examples of the present subject matter is shown.

[0009] Figure 7 A third heat sink according to examples of the present subject matter is shown.

[0010] Figure 8 A portion of a second test system according to an example of the present subject matter is shown, including a first heat sink and a device under test.

[0011] Fig. 9 A schematic representation of a third test system 900 according to examples of the present subject matter is shown.

[0012] Fig.10 A method for dissipating heat in an electronic device according to an example of the present subject matter is shown. DETAILED DESCRIPTION

[0013] Among other things, the inventors have recognized that embodiments herein can dissipate a large amount of heat generated in a small area. Among other things, the inventors have recognized that embodiments herein can reduce the amount of thermal resistance at the interface between an electronic device and a heat sink. This subject matter may include the use of a heat sink. The heat sink may include a working fluid. The heat sink may include a hollow shell. The hollow shell may define an inner cavity. The hollow shell may include a contact surface. The hollow shell may be configured to be physically compliant. The hollow shell may be physically compliant so that the shell conforms to the shape of the test surface in response to an applied pressure. The test surface may be the top surface of a semiconductor. The surface may be curved or non-uniform. The hollow shell may conform to the curvature of the test surface or the lack of consistency so that there is a minimum gap between the hollow shell and the test surface.

[0014] Reducing the thermal resistance at the interface (e.g., between the contact surface and the test surface) can improve heat transfer from the electronic device to the heat sink. The thermal resistance at the interface can be reduced by increasing the intimacy (e.g., the amount of contact) between the electronic device and the heat sink. The thermal resistance can be reduced by allowing the shape of the contact surface to conform to (e.g., mimic, match, bend, yield or comply with) the shape of the electronic device. In an example, the semiconductor may include a top surface. The top surface may be convex (e.g., dome-shaped). In addition, the top surface may be non-uniform (e.g., rough or undulating). The curvature (or lack of consistency) of the top surface may prevent the entire contact surface of the heat sink from being in communication with the top surface. Configuring the contact surface to be physically compliant can allow for the heat sink to conform to the shape of the top surface (e.g., curvature), thereby allowing for more surface area of ​​the contact surface to be in communication with the top surface. Configuring the contact surface to be physically compliant can allow for an increase in thermal conductivity (e.g., a reduction in thermal resistance) compared to using only a thermal interface material between a non-physical compliant heat sink and the top surface.

[0015] Aspect 1 may include or use subject matter (such as an apparatus, system, device, method, device for performing an action, or a device-readable medium including instructions that, when executed by a device, can cause the device to perform an action), such as may include or use a heat sink. The heat sink may include a hollow shell. The hollow shell may define an inner cavity. The hollow shell may include a contact surface. The heat sink may include a working fluid. The hollow shell may be configured to be physically compliant. The hollow shell may be configured to be physically compliant so that the hollow shell conforms to the shape of an interface surface (e.g., a test surface) in response to an applied pressure.

[0016] Aspect 2 may include or use the subject matter of Aspect 1, or may optionally be combined with the subject matter of Aspect 1 to optionally include or use that the applied pressure may be between 20 pounds per square inch and 90 pounds per square inch.

[0017] Aspect 3 may include or use the subject matter of one or any combination of aspects 1 or 2, or may optionally be combined with the subject matter of one or any combination of aspects 1 or 2 to optionally include or use a fluid transport material.The fluid transport material may be positioned in the lumen.

[0018] Aspect 4 may include or use the subject matter of Aspect 3, or may optionally be combined with the subject matter of Aspect 3 to optionally include or use that the fluid transport material may include a textured surface within the lumen.

[0019] Aspect 5 may include or use the subject matter of one or any combination of aspects 3 or 4, or may optionally be combined with the subject matter of one or any combination of aspects 3 or 4 to optionally include or use that the fluid transport material may be positioned at the periphery of the lumen.

[0020] Aspect 6 may include or use the subject matter of one or any combination of aspects 3 to 5, or may optionally be combined with the subject matter of one or any combination of aspects 3 to 5 to optionally include or use that the fluid transport material may include a wicking material.

[0021] Aspect 7 may include or use the subject matter of aspect 6, or may optionally be combined with the subject matter of aspect 6 to optionally include or use that the wicking material may include sintered metal.

[0022] Aspect 8 may include or use the subject matter of one or any combination of aspects 3 to 7, or may optionally be combined with the subject matter of one or any combination of aspects 3 to 7 to optionally include or use at least one protrusion extending from the top surface of the lumen. A gap may exist between the at least one protrusion and a portion of the fluid transport material.

[0023] Aspect 9 may include or use the subject matter of one or any combination of aspects 3 to 8, or may optionally be combined with the subject matter of one or any combination of aspects 3 to 8 to optionally include or use that the fluid transport material may define a void in the lumen.

[0024] Aspect 10 may include or use the subject matter of one or any combination of aspects 1 to 9, or may optionally be combined with the subject matter of one or any combination of aspects 1 to 9 to optionally include or use one or more protrusions extending from the top surface of the inner cavity. The one or more protrusions may extend toward the lower surface of the inner cavity. The one or more protrusions may extend from the lower surface of the inner cavity. The one or more protrusions may extend toward the upper surface of the inner cavity.

[0025] Aspect 11 may include or use the subject matter of one or any combination of Aspect 10, or may optionally be combined with the subject matter of one or any combination of Aspect 10 to optionally include or use that the protrusions may be linear.

[0026] Aspect 12 may include or use the subject matter of one or any combination of aspects 10 or 11, or may optionally be combined with the subject matter of one or any combination of aspects 10 or 11 to optionally include or use that the protrusion may be configured to deflect in response to an applied force.

[0027] Aspect 13 may include or use the subject matter of one or any combination of aspects 1 to 12, or may optionally be combined with the subject matter of one or any combination of aspects 1 to 12 to optionally include or use that the hollow housing may include a pedestal. The pedestal may extend outward from the inner cavity. The pedestal may include a contact surface.

[0028] Aspect 14 may include or use the subject matter of one or any combination of aspects 1 to 13, or may optionally be combined with the subject matter of one or any combination of aspects 1 to 13 to optionally include or use one or more through holes. The one or more through holes may extend from the top surface of the heat sink to the bottom surface of the heat sink. The one or more through holes may extend through the contact surface.

[0029] Aspect 15 may include or use a subject matter (such as an apparatus, system, device, method, apparatus for performing an action, or an apparatus-readable medium including instructions that, when executed by the device, can cause the device to perform an action), such as may include or use a heat dissipation system. The heat dissipation system may include a heat sink. The heat sink may include a hollow shell. The hollow shell may define an inner cavity. The hollow shell may include a contact surface. The heat sink may include a working fluid. The hollow shell may be configured to cooperate with an electronic device. The hollow shell may be configured to be physically compliant. The hollow shell may be configured to be physically compliant so that the hollow shell conforms to the shape of the electronic device in response to applied pressure. The heat dissipation system may include a heat sink connected to the heat sink.

[0030] Aspect 16 may include or use the subject matter of aspect 15, or may optionally be combined with the subject matter of aspect 15 to optionally include or use that the applied pressure may be between 20 pounds per square inch (PSI) and 90 PSI.

[0031] Aspect 17 may include or use the subject matter of one or any combination of aspects 15 or 16, or may optionally be combined with the subject matter of one or any combination of aspects 15 or 16 to optionally include or use a controller. The controller may be configured to actuate a cooling unit. Actuation of the cooling unit may adjust the temperature of the electronic device.

[0032] Aspect 18 may include or use the subject matter of one or any combination of aspects 15 to 17, or may optionally be combined with the subject matter of one or any combination of aspects 15 to 17 to optionally include or use a manifold. The manifold may be positioned in the lumen.

[0033] Aspect 19 may include or use the subject matter of one or any combination of aspects 15 to 18, or may optionally be combined with the subject matter of one or any combination of aspects 15 to 18 to optionally include or use a pump. The pump may be configured to deliver a working fluid. The pump may be in communication with a fluid delivery feature or manifold.

[0034] Aspect 20 may include or use the subject matter of one or any combination of aspects 15 to 19, or may optionally be combined with the subject matter of one or any combination of aspects 15 to 19 to optionally include or use a digital pattern generator. The digital pattern generator may be configured to transmit a signal to an electronic device.

[0035] Aspect 21 may include or use the subject matter of one or any combination of aspects 15 to 20, or may optionally be combined with the subject matter of one or any combination of aspects 15 to 20 to optionally include or use that the electronic device may be a first electronic device. The heat dissipation system may include a robotic arm. The robotic arm may be configured to position a heat sink close to the first electronic device or the second electronic device.

[0036] Aspect 22 may include or use subject matter (such as an apparatus, system, device, method, means for performing an action, or a device-readable medium including instructions that, when executed by a device, can cause the device to perform an action), such as may include or use a method for dissipating heat in an electronic device. The method may include positioning a heat sink proximate to a first electronic device. The method may include mating a contact surface of the heat sink with the first electronic device. The method may include applying pressure to the heat sink so that the contact surface conforms to the shape of the first electronic device. The method may include maintaining the pressure for a first time interval.

[0037] Aspect 23 may include or use the subject matter of Aspect 22, or may optionally be combined with the subject matter of Aspect 22 to optionally include or use the method may include separating the contact surface from the first electronic device. The method may include positioning a heat sink proximate to the second electronic device. The method may include mating the contact surface with the second electronic device. The method may include applying pressure to the heat sink so that the contact surface conforms to the shape of the second electronic device. The method may include maintaining the pressure for a second time interval.

[0038] Aspect 24 may include or use the subject matter of one or any combination of Aspects 22 or 23, or may optionally be combined with the subject matter of one or any combination of Aspects 22 or 23 to optionally include or use that applying pressure to the radiator may include applying a pressure between 20 pounds per square inch and 90 pounds per square inch.

[0039] Aspect 25 may include or use the subject matter of one or any combination of Aspects 22 to 24, or may optionally be combined with the subject matter of one or any combination of Aspects 22 to 24 to optionally include or use that the method may include transmitting a signal via an electronic device.

[0040] Each of these non-limiting examples may stand alone or may be combined with one or more of the other examples in various permutations or combinations.

[0041] This summary is intended to provide an overview of the subject matter of the present patent application. It is not intended to provide an exclusive or exhaustive explanation of the invention.

[0042] Figure 1 A portion of a first test system 100 according to an example of the present subject matter is shown, including a first heat sink 110 and a device under test 120. The first heat sink 110 may include a hollow housing 130, a base 140, an inner cavity 150, a fluid delivery material 160, a void 170, a first set of protrusions 180A, a second set of protrusions 180B, and a third set of protrusions 180C. The device under test may include an electronic device 121. The electronic device 121 may include a semiconductor. The electronic device 121 may have a top surface. The top surface may be uniform. The top surface may be non-uniform. The top surface of the electronic device 121 may be domed, rounded, non-uniform, or otherwise configured such that the top surface is not a flat surface.

[0043] The hollow housing 130 may include an upper surface 131, a lower surface 132, and a contact surface 133. The contact surface 133 may be configured to cooperate with an interface surface (e.g., a test surface). The interface surface may be a top surface of the electronic device 121. The hollow housing may include a base 140. The base 140 may extend outside the inner cavity 150 (e.g., protrude from the inner cavity 150). The base 140 may include the contact surface 133.

[0044] The hollow shell 130 can define an inner cavity 150. The inner cavity 150 can include a fluid transport material 160. The fluid transport material 160 can be configured to allow for or assist in the flow of a working fluid throughout the inner cavity 150. The fluid transport material 160 can include a textured surface within the inner cavity 150. In other words, the wall of the inner cavity 150 (e.g., the inner wall of the hollow shell 130) can be textured and provide the fluid transport material 160. The fluid transport material 160 can include a wicking material. The fluid transport material 160 can include a sintered metal. The wicking material can include a sintered metal. The fluid transport material 160 can be positioned at the periphery of the inner cavity 150 (e.g., along the wall of the inner cavity 150). A void 170 can be included in the inner cavity 150. The fluid transport material 160 can define the void 170.

[0045] The first heat sink 110 may optionally include at least one of a first set 180A of protrusions, a second set 180B of protrusions, and a third set 180C of protrusions, but the subject matter is not limited thereto. The first set 180A of protrusions, the second set 180B of protrusions, and the third set 180C of protrusions may extend from the top surface of the inner cavity 150 toward the bottom surface of the inner cavity 150. The first set 180A of protrusions, the second set 180B of protrusions, and the third set 180C of protrusions may extend from the bottom surface of the inner cavity 150 toward the top surface of the inner cavity. As discussed herein, the first set 180A of protrusions, the second set 180B of protrusions, and the third set 180C of protrusions may provide tunable stiffness and compliance with the first heat sink 110.

[0046] Figure 2 A portion of a first test system 100 according to an example of the present subject matter is shown, wherein a first heat sink 110 is in communication with a device under test 120. The device under test 120 can generate heat during operation. The heat generated by the device under test 120 can be transferred into the first heat sink 110 (e.g., through the contact surface 133 and / or the base 140). Compared to conventional technologies such as heat sinks, the heat sink 110 can allow for an increase in the amount of heat transfer from the device under test 120. The heat sink 110 can provide a larger surface area to dissipate heat from the device under test 120.

[0047] When heat is transferred to the first heat sink 110, the working fluid that can be contained in the inner cavity 150 can also be heated. The working fluid may include water, ammonia, methanol, ethanol, various chlorofluorocarbon-based refrigerants, or the like. However, other working fluids may be used depending on the required properties (e.g., vapor pressure, boiling point, and material compatibility). The working fluid may be in a liquid state before being heated. As the working fluid is heated, the working fluid may change physical state (e.g., boil, or become gaseous). The working fluid may then flow from the fluid transport material 160 into the gap 170. In an example, the top surface of the inner cavity 150 may be colder than the bottom surface of the inner cavity. When the gaseous working fluid flows in the gap, the working fluid may communicate with the fluid transport material 160 located on the top surface of the inner cavity 150.

[0048] The communication of the working fluid with the top surface (or other surface, such as the sidewall) of the inner cavity 150 can allow for the transfer of heat to the top surface (or other surface) of the inner cavity 150. The communication of the working fluid with the top surface of the inner cavity 150 can cause the working fluid to condense and return to a liquid state. The working fluid can condense within the fluid transport material 160. The fluid transport material 160 can be configured to allow for the condensed working fluid to flow within the fluid transport material 160. The fluid transport material 160 can be configured to allow for the condensed working fluid to flow back toward the lower surface of the inner cavity 150. The fluid transport material 160 can be configured to allow for the condensed working fluid to flow back toward a heat source (e.g., the device under test 120). The working fluid can flow through the fluid transport material 160 due to capillary action.

[0049] The hollow shell 130 can be configured to be physically compliant such that the hollow shell 130 responds to applied pressure (e.g., as caused by Figure 2 121). The hollow housing 130 may be physically compliant, such as by mimicking, matching, bending, or yielding to the shape of the surface, and thereby allowing the shape of the contact surface 133 to conform to the shape of the electronic device 121. In an example, the contact surface 133 may conform to the rounded top surface of the electronic device 121 (e.g., matching the shape of the rounded top surface of the electronic device 121). In an example, the base 140 may contribute to the physical compliance of the heat sink 110. In an example, the hollow housing 130 may contribute to the physical compliance of the heat sink 110.

[0050] In an example, the heat sink 110 may be placed near the device under test 120 (e.g., in Figure 11). The heat sink 110 can be placed in communication with the device under test 120, such as the top surface of the electronic device 121. Pressure can be applied to the heat sink 110 (e.g., perpendicular to the top surface of the heat sink 110). The pressure can be applied by a robotic arm or a test device. The applied pressure can be between 20 pounds per square inch and 90 pounds per square inch. The applied pressure can be sufficient to cause elastic deformation of the contact surface 133. The applied pressure can cause the hollow housing 130 to conform to the shape of the test surface (e.g., the top surface of the electronic device 121).

[0051] The conformability of the hollow housing 130 to the test surface can improve heat transfer from the electronic device 121 to the heat sink 110. Heat transfer from the electronic device 121 to the heat sink 110 can be improved by reducing the amount of thermal resistance between the electronic device 121 and the heat sink 110 (or conversely, increasing the amount of thermal conductivity between the electronic device 121 and the heat sink 110). In examples where the heat sink 110 cannot conform to the shape of the electronic device 121, there may be a gap between the electronic device 121 and the heat sink 110. The curvature of the top surface of the electronic device 121 may prevent the entire contact surface 133 of the heat sink 110 from communicating with the top surface.

[0052] The gap may hinder heat transfer and negatively affect temperature regulation of the electronic device 121. In an example, air may fill the gap and provide a low heat transfer rate between the electronic device 121 and the heat sink 110. A thermal interface material may be used to fill the gap and may reduce thermal resistance compared to air. The thermal interface material may have a higher thermal conductivity than air and improve heat transfer between the electronic device 121 and the heat sink 110. Gaps may be more likely to occur during manufacturing electrical testing of the electronic device 121 because thermal interface materials may not be used during those tests. Thermal interface materials may not be used during testing because they may affect other manufacturing operations.

[0053] However, by configuring the first heat sink 110 to conform to the shape of the electronic device 121, and partially or completely eliminating the gap between the electronic device 121 and the first heat sink 110, the amount of heat transfer can be improved compared to a gap filled with thermal interface material or air. The conformity of the first heat sink 110 to the shape of the electronic device 121 can improve heat transfer because the thermal conductivity of air is less than the thermal conductivity of the heat sink 110. In an example, the thermal conductivity of air is less than 0.05 watts per meter Kelvin. The hollow housing 130 may include copper. The thermal conductivity of copper may be 401 watts per meter Kelvin. The conformity of the heat sink 110 to the shape of the electronic device 121 can improve heat transfer because the thermal conductivity of the first heat sink 110 may be greater than the thermal conductivity of the thermal interface material. In an example, the thermal interface material may have a thermal conductivity of 2.9 watts per meter Kelvin. As discussed herein, the hollow housing 130 may include copper. Copper may have a thermal conductivity of 401 watts per meter Kelvin.

[0054] In an example, the top surface of the electronic device 121 may not be completely smooth. The top surface of the electronic device 121 may have microscopic surface roughness or imperfections. The contact surface 133 of the first heat sink 110 may also have microscopic surface roughness or imperfections. The thermal interface material combined with the physically compliant first heat sink 110 can be used to further improve the heat transfer between the electronic device 121 and the first heat sink 110.

[0055] Figure 3 An example according to the present subject is shown Figure 1-2 An example of one or more first protrusions 300 of the first heat sink 110. The first heat sink 110 may include a first set 180A of protrusions. The first heat sink 110 may include a second set 180B of protrusions. Each of the first set 180A of protrusions and / or the second set 180B of protrusions may include one or more first protrusions 300. The one or more first protrusions 300 may be linear. The one or more first protrusions 300 may have a cross-section of a circular, square, rectangular, polygonal, or irregular shape. The first set 180A of protrusions may extend from the top surface of the inner cavity 150 toward the bottom surface of the inner cavity 150. The first set 180A of protrusions may be in communication with the fluid transport material 160. The first set 180A of protrusions may extend through the fluid transport material 160. The third set 180C of protrusions may be configured similarly to the first set 180A of protrusions. Figure 1 ).

[0056] The second set of protrusions 180B may extend from the top surface of the inner cavity 150 toward the bottom surface of the inner cavity 150. The second set of protrusions 180B may be in communication with the fluid transport material 160. The second set of protrusions 180B may extend through the fluid transport material 160. The second set of protrusions 180B may be in communication with the base 140 (e.g., a portion of the inner cavity 150 corresponding to the base 140). The position, orientation, and size of the first set of protrusions 180A, the second set of protrusions 180B, and the third set of protrusions 180C may be changed, fine-tuned, or otherwise designed to meet the specific needs required for the testing of the device under test 120 (e.g., the device under test 120). Figure 1-2 ) (eg, the applied pressure required to induce compliance of the first heat sink 110 ).

[0057] The heat sink 110 may include one or more through holes 310. The one or more through holes 310 may extend from the top surface of the heat sink 110 to the bottom surface of the heat sink 110. The one or more through holes 310 may be configured to provide a thermal interface material (e.g., to the contact surface 133). The one or more through holes 310 may extend through the contact surface 133 and / or the base 140. The one or more through holes 310 may be configured as a vacuum line. Configuring the through holes 310 as a vacuum line may allow the device under test 120 to be transported from a first location to a second location. Configuring the through holes 310 as a vacuum line may assist the compliance of the heat sink 110 with the device under test 120. The vacuum line may assist compliance by generating a force that contributes to the deflection of the contact surface 133. The one or more through holes 310 may be positioned adjacent to the first set 180A of protrusions, the second set 180B of protrusions, and the third set 180C of protrusions.

[0058] Figure 4 An example according to the present subject is shown Figure 1-2 Another example of one or more first protrusions 300 of the first heat sink 110. The second set of protrusions 180B may extend from the top surface of the inner cavity 150. There may be a gap 400 between the end of the first set of protrusions 180B and the fluid transport material. The gap 400 may be between the first set of protrusions 180B and the base 140. The size of the gap 400 may vary for each of the first protrusions 300 of the second set of protrusions 180B. In other words, each of the first protrusions 300 of the second set of protrusions 180B may protrude a different distance from the top surface of the inner cavity 150. The first set of protrusions 180A and the third set of protrusions 180C (shown in FIG. 1 ) may be configured similarly to the second set of protrusions 180B. Figure 1 middle).

[0059] Figure 51 shows an example of one or more second protrusions 500 according to an example of the present subject matter. The one or more second protrusions 500 may be included in the first set 180A of protrusions, the second set 180B of protrusions, or the third set 180C of protrusions ( Figure 1 ). One or more second protrusions 500 can be configured to deflect in response to an applied force. One or more second protrusions 500 can be configured as springs, wherein the second protrusions 500 are displaced in response to an applied force. The stiffness of the second protrusions 500 can be varied, fine-tuned, or otherwise designed to meet the specific needs required for the testing of the device under test 120.

[0060] Additionally, combinations of configurations of the first protrusion 300 and / or the second protrusion 500 may be used within the same set of protrusions (e.g., the second set of protrusions 180B) to meet specific needs of the testing of the device under test 120. In an example, the second set of protrusions may include both the second protrusion 500 and the first protrusion 300, both of which are arranged such that the second protrusion 500 deflects in response to an applied force and the first protrusion 300 limits the range of travel of the heat sink 110 (e.g., limits the compliance of the base 140). Additionally, the first set of protrusions 180A and the third set of protrusions 180C ( Figure 1 ) can be configured to prevent the hollow shell 130 from deflecting in certain areas (e.g., in the contact surface 133 or the outer area of ​​the base 140). Preventing the deflection of the hollow shell 130 in certain areas can allow for the hollow shell 130 to bend only in certain areas such as the base 140.

[0061] Figure 6 A second radiator 610 according to an example of the present subject matter is shown. The second radiator 610 can be included in the first test system 100. The second radiator 610 can include the hollow housing 130, the inner cavity 150, the first pump 620, the condenser 630, the expansion valve 640, the first manifold 650A, the second manifold 650B, the first fluid line 660A, the second fluid line 660B, the third fluid line 660C, and the fourth fluid line 660D. The radiator 610 may include a fluid delivery feature 160. The radiator 610 may include a working fluid. The fluid delivery feature 160 may be in communication with the second manifold 650B or included in the second manifold 650B. The second radiator 610 may include a base (e.g., Figure 1-5 base 140).

[0062] The second heat sink 610 can operate similarly to the first heat sink 110. In an example, the second heat sink can be configured to receive heat from the device under test (e.g., Figure 1 and 2The heat generated by the device under test 120 may cause the working fluid to change state (eg, boil).

[0063] The second heat sink 610 can utilize a refrigeration cycle. The working fluid can be a refrigerant. In an example, the heat generated by the device under test can cause the working fluid at the bottom of the inner cavity 150 (for example, in the fluid delivery feature 160 or the second manifold 650B) to change from a liquid state (or a mixed liquid and gas state) to a gaseous state. The hollow shell 130 can be an evaporator. The gaseous working fluid can flow out of the fluid delivery feature 160 or the second manifold 650B. The working fluid can enter the inner cavity 150. The flow of the working fluid can transfer heat from the lower surface of the second heat sink 610 to the upper surface of the second heat sink 610.

[0064] The first pump 620 can make (or assist) the working fluid flow throughout the second radiator 610. The first pump 620 can be a compressor. The first pump 620 can make the working fluid flow from the inner cavity 150 into the first working fluid pipeline 660A. The second radiator 610 may include a condenser 630. The first pump 620 can be connected to the condenser 630 through the second fluid pipeline 660B. The condenser 630 can make the gas working fluid into a liquid state. The condenser 630 can be connected to a heat sink (not shown). The flow of the working fluid can transfer heat from the lower surface of the second radiator 610 to the condenser 630. The second radiator 610 can be connected to the expansion valve 640 through the third working fluid pipeline 660C. The expansion valve 640 can make the liquid working fluid change from a liquid state to a gaseous state, or a mixture of a liquid state and a gaseous state. The expansion valve 640 can cause the temperature of the working fluid to decrease. A fourth working fluid line 640D may be used to deliver the working fluid from the expansion valve 640 to the second manifold 650B.

[0065] Figure 7 A third radiator 710 according to an example of the present subject matter is shown. The third radiator can be included in the first test system 100. The third radiator 710 can operate similarly to the second radiator 610. The third radiator 710 can include a hollow housing 130, an inner cavity 150, a second pump 720, a condenser 630, a first manifold 650A, a second manifold 650B, a first fluid line 660A, a second fluid line 660B, and a third fluid line 660C. The radiator 710 may include a fluid delivery feature 160. The third radiator 710 may include a working fluid. The fluid delivery feature 160 may be in communication with the second manifold 650B or included in the second manifold 650B. The third radiator 710 may include a base (e.g., Figure 1-5 base 140).

[0066] The second pump 720 may include an accumulator. The accumulator may be configured to allow the volume expansion of the working fluid due to boiling. The second pump 720 may be configured to deliver the working fluid when the working fluid is in a mixed physical state (e.g., the working fluid includes both gaseous and liquid states). The pump 720 may enable (or assist) the working fluid to flow in the third radiator 710. The condenser 630 may enable the gaseous working fluid to become a liquid state. The condenser 630 may be communicated with a heat sink (not shown).

[0067] The third heat sink 710 can operate similarly to the first heat sink 110 or the second heat sink 610. In an example, the third heat sink 710 can be configured to transfer heat from the device under test (e.g., Figure 1 and 2 The heat generated by the device under test 120) may cause the working fluid to change state (e.g., boil). The flow of the working fluid may transfer heat from the lower surface of the third radiator 610 to the condenser 630. The third radiator 710 may be configured to allow the working fluid to flow through the third radiator 710 in a liquid, mixed, and / or gaseous state. Including an accumulator in the second pump 720 may allow for the working fluid to partially change state (e.g., be in a mixed physical state) and flow throughout the third radiator 710 without damaging the second pump 720.

[0068] Figure 8 A portion of a second test system 800 according to an example of the present subject matter is shown. The second test system 800 may include the first test system 100. The second test system 800 may include a first heat sink 110 (eg, Figure 1-2 The second test system 800 may include a second heat sink 610 ( Figure 6 The second test system 800 may include a third heat sink 710 ( Figure 7 ). The second test system 800 may include multiple heat sinks (e.g., one or more of the first heat sink 110, one or more of the second heat sink 610, one or more of the third heat sink 710, or a combination thereof). The second test system 800 may include an electronic device 820. The second test system 800 may include additional electronic devices. The second test system 800 may be configured to test multiple electronic devices.

[0069] The second test system 800 may include a heat sink 830. The heat sink 830 may be in communication with the heat sink 110. The heat sink 830 may be configured to dissipate heat from the first heat sink 810. The electronic device 820 may be mated with a socket 840 and may be in electrical communication with the socket 840. The socket 840 may be coupled to a substrate 850 (e.g., a printed circuit board). The socket 840 may be configured to route electrical signals from the electronic device 820 to the substrate 850.

[0070] Fig. 9 1 shows a schematic representation of a third test system 900 according to an example of the present subject matter. The third test system 900 may include the first test system 100. The third test system 900 may include the second test system 800. In an example, the third test system 900 includes a first heat sink 110 (in Figure 1-5 and Figure 8 ) and electronic device 820 (shown in Figure 8 ).

[0071] The third test system 900 may include a digital pattern generator 910. The digital pattern generator 910 may be configured to transmit a signal to the electronic device 820. The signal transmitted to the electronic device 820 may be used to test the operating characteristics of the electronic device 820. Testing the operating characteristics of the electronic device 820 may ensure that the electronic device 820 performs within the design specifications. The signal transmitted to the electronic device 820 may cause the electronic device 820 to generate heat. The third test system 900 may include a controller 920. The controller 920 may be configured to actuate a cooling unit 930. The cooling unit may be configured to dissipate heat, thereby regulating the temperature of the electronic device 820.

[0072] The third test system 900 may include a robotic arm 940. The robotic arm 940 may be configured to position the first heat sink 110 proximate to the electronic device 820. The robotic arm 940 may be configured to position the first heat sink 110 proximate to an additional electronic device, such as the electronic device 121 (in Figure 1 and 2 ). The mechanical arm 940 can be configured to transfer the electronic device 820 from the first position to the second position. The controller 920 can communicate with the heat sink 110, the electronic device 820, the pattern generator 910, the cooling unit 930 and / or the mechanical arm 940, and control or coordinate the operation of the heat sink 110, the electronic device 820, the pattern generator 910, the cooling unit 930 and / or the mechanical arm 940.

[0073] Fig.10A method 1000 for dissipating heat in an electronic device according to an example of the present subject matter is shown. The method 1000 may include approaching a first electronic device (eg, Figure 1-2 Electronic equipment 121 or Figure 8 electronic device 820) to position a heat sink (e.g., Figure 1-5 and the first heat sink 110 of 8-9 or Figure 6 The method 1000 may include, at operation 1020, placing a contact surface (eg, Figure 1-5 The method 1000 may include applying pressure to the heat sink at operation 1030 so that the contact surface conforms to the shape of the first electronic device. The method 1000 may include maintaining the pressure for a first time interval at operation 1040. The method 1000 may include separating the contact surface from the first electronic device. The method 1000 may additionally include positioning the heat sink proximate to the second electronic device. The method 1000 may also include mating the contact surface with the second electronic device. The method 1000 may include applying pressure to the heat sink so that the contact surface conforms to the shape of the second electronic device. The method 1000 may further include maintaining the pressure for a second time interval. The method 1000 may include applying pressure to the heat sink including applying a pressure between 20 pounds per square inch and 90 pounds per square inch. The method 1000 may include transmitting a signal through the electronic device.

[0074] Here is a set of technical solutions:

[0075] 1. A radiator, comprising:

[0076] a hollow housing defining an interior cavity and including a contact surface configured to mate with the interface surface;

[0077] a working fluid in the inner cavity; and

[0078] Therein, the hollow shell is configured to be physically compliant such that the hollow shell conforms to the shape of the interface surface in response to an applied pressure.

[0079] 2. A radiator according to technical solution 1, wherein the applied pressure is between 20 pounds per square inch and 90 pounds per square inch.

[0080] 3. The radiator according to Technical Solution 1 also includes a fluid transport material located in the inner cavity.

[0081] 4. A heat sink according to technical solution 3, wherein the fluid transport material includes a textured surface within the inner cavity.

[0082] 5. The radiator according to technical solution 3, wherein the fluid transport material is positioned at the periphery of the inner cavity.

[0083] 6. A heat sink according to technical solution 3, wherein the fluid transport material includes a wicking material.

[0084] 7. A heat sink according to technical solution 6, wherein the wicking material comprises sintered metal.

[0085] 8. The heat sink according to technical solution 3 further includes at least one protrusion extending from the top surface of the inner cavity, and wherein there is a gap between the at least one protrusion and a portion of the fluid transport material.

[0086] 9. The heat sink according to technical solution 3, wherein the fluid transport material defines a void in the inner cavity.

[0087] 10. The heat sink according to technical solution 1 further includes one or more protrusions extending from the top surface of the inner cavity toward the lower surface of the inner cavity.

[0088] 11. The heat sink according to technical solution 10, wherein the protrusion is linear.

[0089] 12. The heat sink according to technical solution 10, wherein the protrusion is configured to deflect in response to an applied force.

[0090] 13. The heat sink according to technical solution 1, wherein the hollow shell includes a base, which extends outward from the inner cavity and includes a contact surface.

[0091] 14. The heat sink according to technical solution 1 further includes one or more through holes extending from the top surface of the heat sink to the bottom surface of the heat sink.

[0092] 15. A heat dissipation system, comprising:

[0093] Radiator, including:

[0094] a hollow housing defining an interior cavity and including a contact surface;

[0095] working fluid; and

[0096] wherein the hollow housing is configured to mate with an electronic device, and wherein the hollow housing is configured to be physically compliant such that the hollow housing conforms to the shape of the electronic device in response to applied pressure;

[0097] A heat absorbing device connected to a radiator.

[0098] 16. A system according to technical solution 15, wherein the applied pressure is between 20 pounds per square inch (PSI) and 90 PSI.

[0099] 17. The system according to technical solution 15 also includes a controller, which is configured to actuate the cooling unit to adjust the temperature of the electronic device.

[0100] 18. The system according to technical solution 15 also includes a manifold located in the inner cavity.

[0101] 19. The system according to technical solution 18 also includes a pump, which is configured to deliver the working fluid and wherein the pump is connected to the fluid delivery feature.

[0102] 20. The system according to technical solution 16 also includes a digital pattern generator, which is configured to transmit the signal to an electronic device.

[0103] 21. A system according to technical solution 16, wherein the electronic device is a first electronic device, and further includes a robotic arm, wherein the robotic arm is configured to position the heat sink close to the first electronic device or the second electronic device.

[0104] 22. A method for dissipating heat in an electronic device, comprising:

[0105] positioning a heat sink proximate to the first electronic device;

[0106] engaging a contact surface of the heat sink with a first electronic device; and

[0107] Pressure is applied to the heat sink so that the contact surface conforms to the shape of the first electronic device.

[0108] 23. The method according to technical solution 22 also includes maintaining the pressure for a first time interval.

[0109] 24. The method according to technical solution 22 further includes:

[0110] separating the contact surface from the first electronic device;

[0111] positioning a heat sink proximate to a second electronic device;

[0112] engaging the contact surface with a second electronic device;

[0113] applying pressure to the heat sink so that the contact surface conforms to the shape of the second electronic device; and

[0114] The pressure is maintained for a second time interval.

[0115] 25. The method according to technical solution 22, wherein applying pressure to the radiator includes applying a pressure between 20 pounds per square inch and 90 pounds per square inch.

[0116] Various Attentions

[0117] The above description includes reference to the accompanying drawings, which form a part of the detailed description. The accompanying drawings illustrate specific embodiments in which the present invention can be implemented by way of illustration. These embodiments are also referred to as "examples" in this article. Such examples may include elements other than those shown or described. However, the inventors also contemplate examples that only provide those elements shown or described. In addition, the inventors also contemplate examples using any combination or arrangement of those elements shown or described with respect to a specific example (or one or more aspects thereof) or with respect to other examples (or one or more aspects thereof) shown or described herein.

[0118] In the event of inconsistent usages between this document and any document so incorporated by reference, the usage in this document shall control.

[0119] In this document, the terms "a" or "an" are used as is common in patent literature to include one or more than one, independent of any other instance or use of "at least one" or "one or more." In this document, the term "or" is used to indicate non-exclusivity, or such that "A or B" includes "A but not B," "B but not A," and "A and B," unless otherwise indicated. In this document, the terms "including" and "in which" are used as the plain English equivalents of the respective terms "comprising" and "wherein." Furthermore, in the following claims, the terms "including" and "comprising" are open-ended, i.e., systems, devices, articles, compositions, formulas, or processes that include elements other than the elements listed after such terms in a claim are still considered to fall within the scope of the claim. Furthermore, in the following claims, the terms "first," "second," and "third," etc. are used merely as labels and are not intended to impose numerical requirements on their objects.

[0120] Unless the context indicates otherwise, geometric terms such as "parallel," "perpendicular," "circular," or "square" are not intended to require absolute mathematical precision. Instead, such geometric terms allow for variations due to manufacturing or equivalent functions. For example, if an element is described as "circular" or "generally circular," the description still includes components that are not exactly circular (e.g., components that are slightly elliptical or multi-sided polygons).

[0121] The method examples described herein may be at least partially machine or computer implemented. Some examples may include a computer-readable medium or machine-readable medium encoded with instructions, which may be operable to configure an electronic device to perform the method described in the above example. The implementation of this method may include code, such as microcode, assembly language code, higher-level language code, or the like. Such code may include computer-readable instructions for performing various methods. The code may form part of a computer program product. In addition, in an example, the code may be tangibly stored on one or more volatile, non-temporary or non-volatile tangible computer-readable media, such as during execution or at other times. Examples of these tangible computer-readable media may include, but are not limited to, hard disks, removable disks, removable optical disks (e.g., compact disks and digital video disks), cassettes, memory cards or sticks, random access memory (RAM), read-only memory (ROM), and the like.

[0122] The above description is intended to be illustrative rather than restrictive. For example, the above examples (or one or more aspects thereof) can be used in combination with each other. When reviewing the above description, other embodiments may be used by such as those of ordinary skill in the art. An abstract is provided to comply with 37C.FR§1.72(b) to allow readers to quickly determine the nature of the present technology disclosure. It is understood at the time of submission that it will not be used to interpret or limit the scope or meaning of the claims. Moreover, in the above specific embodiments, various features may be grouped together to simplify the present disclosure. This should not be interpreted as intending that the disclosed features that are not claimed for protection are essential to any claim. On the contrary, the subject matter of the invention may be less than all the features of a specific disclosed embodiment. Therefore, the following claims are incorporated into the specific embodiments as examples or embodiments, wherein each claim itself is a separate embodiment, and it is expected that such embodiments can be combined with each other in various combinations or arrangements. The scope of the present invention should be determined with reference to the attached claims together with the full scope of the equivalents given to such claims.

Claims

1. A radiator, comprising: a hollow housing defining an interior cavity and including a contact surface configured to mate with the interface surface; a working fluid in the inner cavity; and one or more protrusions extending from the top surface of the lumen toward the lower surface of the lumen; Therein, the hollow shell is configured to be physically compliant such that the hollow shell conforms to the shape of the interface surface in response to an applied pressure.

2. The heat sink of claim 1, wherein the applied pressure is between 20 psi and 90 psi.

3. The heat sink of claim 1 further comprising a fluid transport material located in the interior cavity.

4. The heat sink of claim 3, wherein the fluid transport material comprises a textured surface within the interior cavity.

5. The heat sink of claim 3, wherein the fluid transport material is positioned at a periphery of the inner cavity.

6. The heat sink of claim 3, wherein the fluid transport material comprises a wicking material.

7. The heat sink of claim 6, wherein the wicking material comprises a sintered metal.

8. The heat sink of claim 3, further comprising at least one protrusion extending from the top surface of the inner cavity, and wherein a gap exists between the at least one protrusion and a portion of the fluid transport material.

9. The heat sink of claim 3, wherein the fluid transport material defines voids within the interior cavity.

10. The heat sink of claim 1, wherein the protrusion is linear.

11. The heat sink of claim 1, wherein the protrusion is configured to deflect in response to an applied force.

12. The heat sink of claim 1 or 2, wherein the hollow housing comprises a base extending outwardly from the inner cavity and comprising the contact surface.

13. The heat sink of claim 1, further comprising one or more through holes extending from a top surface of the heat sink to a bottom surface of the heat sink.

14. A heat dissipation system, comprising: Radiator, including: a hollow housing defining an interior cavity and including a contact surface; working fluid; and one or more protrusions extending from the top surface of the lumen toward the lower surface of the lumen; wherein the hollow housing is configured to mate with an electronic device, and wherein the hollow housing is configured to be physically compliant such that the hollow housing conforms to the shape of the electronic device in response to applied pressure; A heat absorbing device connected to a radiator.

15. The system of claim 14, wherein the applied pressure is between 20 pounds per square inch (PSI) and 90 PSI.

16. The system of claim 14, further comprising a controller configured to actuate the cooling unit to adjust the temperature of the electronic device.

17. The system of claim 14, further comprising a manifold positioned within the lumen.

18. The system of claim 17, further comprising a pump configured to deliver the working fluid, and wherein the pump is in communication with the fluid delivery feature.

19. The system of claim 15, further comprising a digital pattern generator configured to transmit the signal to an electronic device.

20. The system of claim 15, wherein the electronic device is a first electronic device, and further comprising a robotic arm, wherein the robotic arm is configured to position the heat sink proximate the first electronic device or the second electronic device.

21. A method for dissipating heat in an electronic device, comprising: positioning a heat sink proximate to the first electronic device; engaging a contact surface of the heat sink with a first electronic device; and applying pressure to the heat sink so that the contact surface conforms to the shape of the first electronic device; The heat sink includes a hollow shell defining an inner cavity and one or more protrusions extending from a top surface of the inner cavity toward a lower surface of the inner cavity.

22. The method of claim 21 further comprising maintaining the pressure for a first time interval.

23. The method according to claim 21, further comprising: separating the contact surface from the first electronic device; positioning a heat sink proximate to a second electronic device; engaging the contact surface with a second electronic device; applying pressure to the heat sink so that the contact surface conforms to the shape of the second electronic device; as well as The pressure is maintained for a second time interval.

24. The method of claim 21, wherein applying pressure to the heat sink comprises applying a pressure between 20 pounds per square inch and 90 pounds per square inch.

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