Inverter

Abstract

The present invention relates to an inverter, which is particularly used for an electric drive unit of a vehicle. The inverter has a plurality of functional components. The inverter has a carrier device. The carrier device is plate-shaped, wherein the carrier device extends along an extension plane. The carrier device has a main body, which has a first mounting surface for mounting a first subset of the functional components of the inverter and a second mounting surface for mounting a second subset of the functional components of the inverter. Here, the first mounting surface and the second mounting surface are arranged away from each other. The main body of the carrier device is shaped to act as a cooling body for the functional components of the inverter. The first subset of the functional components is mounted on the side of the first mounting surface of the carrier device. The second subset of the functional components is mounted on the side of the second mounting surface of the carrier device.

Description

Technical Field

[0001] The invention relates to an inverter, in particular for an electric drive unit of a vehicle. Background Art

[0002] The drive inverter can, for example, cool only a small number of components on the cooling surface, in particular actively cool them. US 2016 / 0126802 A1 discloses a drive device having a converter unit and a heat sink. Summary of the invention

[0003] Based on this background, the invention provides an improved inverter according to the independent claim. Advantageous embodiments are derived from the dependent claims and the subsequent description.

[0004] According to embodiments of the present invention, in particular, cooling structures on both sides can be provided for dissipating heat from an inverter or other rectifier, wherein the cooling structures can also act as load-bearing structures. Thus, different components in the inverter can be cooled, for example, actively and additionally or alternatively passively or directly and additionally or alternatively indirectly, by a cooling body having a cooling plane.

[0005] Therefore, a carrier device can be provided, which can also be used as a cooling body with a single cooling plane in the inverter, wherein the cooling plane can be used on both sides to cool the components of the inverter. Advantageously, optimal full utilization of the cooling surface and cooling of different components can be achieved. Therefore, the carrier device can function not only as a cooling body but also as a supporting structure of the inverter. In this way, not only an advantageous thermal connection of the functional component to the carrier device can be achieved, but also, for example, an improved accuracy of the current sensor of the inverter, as well as reduced material input, reduced busbar cross section or similar advantages, for example in terms of semiconductor chip area, can be achieved.

[0006] In particular, an inverter for an electric drive unit of a vehicle has a plurality of functional components and a carrier device. The carrier device is shaped in a plate shape and extends along an extension plane. The carrier device has a main body, which has a first mounting surface for mounting a first subset of the functional components of the inverter and a second mounting surface for mounting a second subset of the functional components of the inverter. The first mounting surface and the second mounting surface are arranged away from each other. The main body of the carrier device is shaped to act as a cooling body for the functional components of the inverter. The first subset of the functional components is mounted on the side of the first mounting surface of the carrier device, and the second subset of the functional components is mounted on the side of the second mounting surface of the carrier device.

[0007] The vehicle can be a motor vehicle, such as a car, a truck or other commercial vehicle. The drive unit can be an electric motor. The electric motor can be operated by means of alternating current. For example, the drive unit can be used to drive the vehicle. The inverter can be implemented as a drive inverter, a pulse inverter or other rectifier. In this case, the inverter can be electrically connected between the drive unit and an energy storage device (such as a dry cell). The functional component is thermally coupled to the carrier device or can be thermally coupled to the carrier device. In this case, when the functional component is placed on the placement surface of the carrier device, direct or indirect thermal contact can be established between the carrier device and the functional component.

[0008] According to an embodiment, the carrier device can be formed of a heat-conducting material. For example, the carrier device can be formed of a metal material. This embodiment provides the following advantages: the heat dissipation of the functional component can be achieved by conducting heat via the carrier device, for example, via the housing.

[0009] At least one channel for guiding a cooling medium can also be formed in the carrier device. Here, when the inverter is running, a fluid as a cooling medium can be transmitted through at least one channel of the carrier device. This embodiment provides the following advantages: the cooling power can be increased.

[0010] In this case, the carrier device can have two fluid connections for guiding the cooling medium through the at least one channel. Thus, the carrier device can have, for example, an input connection and an output connection as fluid connections. Alternatively, the carrier device can have more than two fluid connections. This embodiment offers the advantage that when using this cooling concept of the inverter, a reduction in the number of cooling medium interfaces can be achieved.

[0011] The inverter can have, in particular, a semiconductor module with at least one semiconductor element and a printed circuit board, an AC connection, a DC connection, at least one capacitor, an optional interference suppression unit and a current sensor as functional components. The interference suppression unit can be an EMC filter (EMC = electromagnetic compatibility) or a similar device. This embodiment offers the advantage that the functional components can be not only mechanically held but also thermally influenced or cooled via the carrier device. The cooling of the individual functional components can be realized actively and additionally or alternatively passively or directly and additionally or alternatively indirectly.

[0012] In this case, the DC connection can be arranged on the side of the first mounting surface of the carrier device. The AC connection can be arranged on the side of the second mounting surface of the carrier device. In this case, the AC connection can extend along the extension plane in the side edge region of the carrier device. The side edge region can extend at least partially within the base surface of the carrier device. This embodiment offers the advantage that the spatial separation between the DC connection and the AC connection and effective cooling of the same can be achieved in a simple manner.

[0013] Furthermore, the interference suppression unit and additionally or alternatively at least one capacitor can be arranged on the side of the first mounting surface of the carrier device. The current sensor and additionally or alternatively the semiconductor module can be arranged on the side of the second mounting surface of the carrier device. This embodiment provides the following advantages: effective cooling of the functional components and an advantageous arrangement of the functional components can be achieved.

[0014] The carrier device may also have a plurality of fastening struts for fastening the circuit board of the semiconductor module. In this case, the fastening struts may extend away from the second mounting surface on the side of the second mounting surface. This embodiment provides the advantage that a simple and space-saving fastening of the semiconductor module on the carrier device can be achieved.

[0015] In this case, at least one semiconductor element can be arranged between the circuit board and the carrier device. In this case, at least one semiconductor element can be arranged in direct thermal contact with the second mounting surface. This embodiment offers the advantage that at least one semiconductor element can be mounted in a space-saving and protected manner and effectively cooled.

[0016] Furthermore, the carrier device can have a capacitor housing in which the at least one capacitor is arranged. This embodiment offers the advantage that the at least one capacitor can be accommodated in a protected and safe manner and further heat dissipation can optionally also be achieved via the capacitor housing. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention is explained in more detail by way of example with reference to the accompanying drawings.

[0018] Figure 1 shows a schematic diagram of a vehicle having an energy storage device, a drive unit and an inverter according to an embodiment;

[0019] Figure 2 A diagram showing an inverter according to an embodiment;

[0020] Figure 3 Show Figure 2 Schematic diagram of the inverter.

[0021] In the following description of preferred exemplary embodiments of the present invention, identical or similar reference numerals are used for elements which are illustrated in different figures but have similar functions, wherein a repeated description of these elements is omitted. DETAILED DESCRIPTION

[0022] Figure 1The schematic diagram of a vehicle 100 with an electrical energy storage device 102, a drive unit 104 and an inverter 110 according to an exemplary embodiment is shown. The vehicle 100 is a motor vehicle. The energy storage device 102 represents a dry cell, a battery or the like. The drive unit 104 is designed as an electric machine, for example an electric motor which can be operated with alternating current.

[0023] The inverter 110 is electrically connected between the energy storage device 102 and the drive unit 104. In this case, the inverter 110 is connected to the energy storage device 102 by means of a DC line. In addition, the inverter 110 is connected to the drive unit 104 by means of an AC line. Therefore, the inverter 110 is designed to provide an AC power for operating the drive unit 104 while using the DC power from the energy storage device 102.

[0024] Figure 2 FIG. 1 shows a diagram of an inverter 110 according to an embodiment. In this case, the inverter 110 corresponds to or is similar to Figure 1 The inverter 110 is therefore provided for an electric drive unit for a vehicle. The inverter 110 has a carrier device 220 and a plurality of functional components. The carrier device 220 acts as a carrier and serves as a cooler or cooling body for the functional components. In this case, the functional components are arranged on the carrier device 220.

[0025] The carrier device 220 is plate-shaped or shaped as a cooling plate. Here, the carrier device 220 extends along an extension plane or cooling plane. The carrier device 220 has a body 222, which has a first placement surface 224 for placing a first subset of functional components and a second placement surface 226 for placing a second subset of functional components. The first placement surface 224 and the second placement surface 226 are arranged on opposite sides of the body 222. The body 222 is implemented as a cooling body for cooling the functional components. Figure 2 In the figure, the carrier device 220 is emphasized by the dashed line boundary only for the purpose of illustration.

[0026] Although in Figure 2 Although not shown in detail in the figure, the carrier device 220 is formed of a heat-conducting material, for example, a metal material. In addition, at least one channel for guiding a cooling medium can be formed in the carrier device 220. Thus, active cooling of at least a portion of the functional components can be achieved. According to an embodiment, the carrier device 220 can also have two fluid connections for guiding a cooling medium through at least one channel in the carrier device 220.

[0027] exist Figure 2In the illustration of FIG. 1 , among the functional components of the inverter 110, only a direct current connection 230 or a direct current bus track or a DC busbar (DC=direct current), an alternating current connection 240, at least one capacitor 250 or an intermediate circuit capacitor 250, a capacitor housing 255 for at least one capacitor 250, a current sensor 260 and at least one semiconductor element 270 of a semiconductor module or a power module are shown by way of example. Furthermore, a direct current line 235 (for example in the form of a DC busbar) is shown for electrically contacting the capacitor 250.

[0028] Via the DC connection 230 , the inverter 110 can communicate with an electrical energy storage device, such as Figure 1 Via the AC connection 240, the inverter 110 can be connected to an electric drive unit, such as Figure 1 drive unit connection.

[0029] The DC connector 230, the DC line 235, the at least one capacitor 250 and the capacitor housing 255 are arranged on the side of the first mounting surface 224 of the carrier device 220 and mounted on the carrier device 220. The AC connector 240, the current sensor 260 and the at least one semiconductor element 270 are arranged on the side of the second mounting surface 226 of the carrier device 220 and mounted on the carrier device 220. The semiconductor module having the at least one semiconductor element 270 will be discussed in more detail later.

[0030] exist Figure 2 It can be seen from the illustration that the AC connection 240 is arranged along the extension plane in the side edge region of the carrier device 220. The DC connection 230 is also arranged in the side edge region of the carrier device 220. In this case, the side edge region of the carrier device 220 is arranged between the DC connection 230 and the AC connection 240. Figure 2 In the illustration of FIG. 2 , at least one capacitor 250 is also arranged between the DC connection 230 and the DC line 235 . Furthermore, a current sensor 260 is arranged between the AC connection 240 and at least one semiconductor element 270 .

[0031] The inverter 110 may also have further functional components, such as a discharge resistor and the like, and may additionally or alternatively have further functional components.

[0032] refer to Figure 2 , a possible concept for cooling the functional components shown will now be briefly described. Active and / or direct cooling can be achieved by means of the carrier device 220 for the current sensor 260, the at least one semiconductor element 270 and the at least one capacitor 250. The carrier device 220 can also achieve passive or active or indirect or direct cooling of the AC connection 240.

[0033] Figure 3 Show Figure 2 FIG. 1 is a diagram of an inverter 110. Figure 3 1 shows an inverter 110 in a further perspective view. In this case, the second mounting surface is covered by a carrier device 220. The functional components include a DC connection 230, an AC connection 240, a capacitor housing 255 for at least one capacitor or intermediate circuit capacitor, and a circuit board 375 or printed wiring board for a semiconductor module.

[0034] Optionally, the interference suppression unit is arranged on the side of the first mounting surface 224 of the carrier device 220 and is mounted on the carrier device 220. According to the embodiment, the interference suppression unit is arranged adjacent to the capacitor housing 255 and / or is implemented as a part of the capacitor housing. The interference suppression unit is, for example, a filter for electromagnetic compatibility or an EMC filter.

[0035] The circuit board 375 is arranged on the side of the second mounting surface of the carrier device 220 and is mounted on the carrier device 220. At least one semiconductor element of the semiconductor module is arranged between the circuit board 375 and the carrier device 220. The carrier device 220 also has a plurality of fastening pillars 328 for fastening the circuit board 375 of the semiconductor module on the carrier device 220. The fastening pillars 328 extend away from the second mounting surface on the side of the second mounting surface of the carrier device 220. The fastening pillars 328 are exemplarily cylindrically shaped.

[0036] refer to Figure 3 , now we will again describe possible concepts for cooling the functional components shown. Active and / or direct cooling can be achieved for the DC connection 230 by means of the carrier device 220. Passive or indirect cooling can be achieved for the interference suppression unit by means of the carrier device 220. Passive or indirect or partially active or direct cooling can be achieved for the circuit board 375 by means of the carrier device 220.

[0037] If an embodiment includes an “and / or” relationship between a first feature and a second feature, this can be understood as follows: the embodiment has the first feature and the second feature according to one embodiment, and has either only the first feature or only the second feature according to another embodiment.

[0038] Reference numerals list

[0039] 100 Vehicles

[0040] 102 Energy Storage

[0041] 104 Drivers

[0042] 110 Inverter

[0043] 220 Bearing Equipment

[0044] 222 Main Body

[0045] 224 First mounting surface

[0046] 226 Second mounting surface

[0047] 230 DC connector

[0048] 235 DC lines

[0049] 240 AC connector

[0050] 250 Intermediate circuit capacitor

[0051] 255 capacitor housing

[0052] 260 Current Sensor

[0053] 270 Semiconductor components

[0054] 328 Fastening pillar

[0055] 375 Circuit Board

Claims

1. An inverter (110), wherein: The inverter (110) has a plurality of functional components (230, 240, 250, 260, 270, 375), characterized in that: The inverter (110) has a support device (220) extending along an extension plane and formed in a plate-like manner. The carrier device (220) has a main body (222), the main body having a first placement surface (224) for placing a first subset of functional components (230, 240, 250, 260, 270, 375) of the inverter (110) and a second placement surface (226) for placing a second subset of functional components (230, 240, 250, 260, 270, 375) of the inverter (110), wherein the first mounting surface (224) and the second mounting surface (226) are arranged away from each other, The body (222) of the carrier device (220) is shaped to function as a cooling body for functional components (230, 240, 250, 260, 270, 375) of the inverter (110). wherein a first subset of the functional components (230, 240, 250, 260, 270, 375) is arranged on a side of a first arrangement surface (224) of the carrier device (220), wherein a second subset of the functional components (230, 240, 250, 260, 270, 375) is arranged on a side of a second arrangement surface (226) of the carrier device (220), The inverter (110) comprises a semiconductor module (270, 375) having at least one semiconductor element (270) and a printed circuit board (375), an AC connection (240), a DC connection (230), at least one capacitor (250) and a current sensor (260) as functional components. and wherein the DC connector (230) is arranged on the side of the first arrangement surface (224) of the carrier device (220), The AC connector (240) is arranged on a side of the second placement surface (226) of the carrier device (220). The AC connector (240) extends along an extension plane in a side edge region of the carrier device (220).

2. The inverter (110) according to claim 1, characterized in that: The carrier device (220) is formed from a heat-conducting material.

3. The inverter (110) according to claim 1 or 2, characterized in that: At least one channel for conducting a cooling medium is formed in the carrier device (220).

4. The inverter (110) according to claim 3, characterized in that: The carrier device (220) has two fluid connections for conducting a cooling medium through the at least one channel.

5. The inverter (110) according to claim 1, characterized in that: The at least one capacitor (250) is arranged on a side of a first arrangement surface (224) of the carrier device (220), Therein, the current sensor (260) and / or the semiconductor module (270, 375) are mounted on a side of a second mounting surface (226) of the carrier device (220).

6. The inverter (110) according to claim 1, characterized in that: The carrier device (220) has a plurality of fastening struts (328) for fastening a circuit board (375) of the semiconductor module (270, 375), Therein, the fastening strut (328) extends on a side of the second seating surface (226) away from the second seating surface (226).

7. The inverter (110) according to claim 1, characterized in that: The at least one semiconductor element (270) is arranged between the circuit board (375) and the carrier device (220).

8. The inverter (110) according to claim 1, characterized in that: A capacitor housing (255) is provided in which at least one capacitor (250) is arranged.

9. The inverter (110) according to claim 1, characterized in that: The inverter is used in an electric drive unit (104) of a vehicle (100).

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