A heat sink for ultra-thin mainframe case
By introducing spherical spacer blocks, central vertical sheets and spacer limit structures into ultra-thin heat sinks, as well as compressive design of adhesive and metal ion clips, the traditional heat sink limit fixation and uniform thermal grease are solved. The problem of low application and toughness improves heat dissipation and service life.
Patent Information
- Application Number
- CN201910550356.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2019-06-24
- Publication Date
- 2025-01-14
- Estimated Expiration
- 2039-06-24
AI Technical Summary
Traditional heat sinks are difficult to fix at a limit, resulting in wear; they are not convenient to apply thermally conductive grease evenly, resulting in poor heat dissipation effect; the toughness strength of the wave-type sheet is low and the service life is short.
Design an ultra-thin heat sink including sheet base, wave-shaped sheet body, compressive structure, spacer seat and positioning hole, and limit fixation is achieved through spherical spacer blocks, central vertical sheets and spacer seats; use transverse fitting strips and flow guide grooves The thermal grease is uniformly applied with the central connecting groove; the toughness of the wave-type sheet is improved by adhesive, microwire mesh, metal ion clips and compressive corrugated wires.
It reduces the wear of the wave-type sheet, improves the heat dissipation effect, extends the service life, ensures uniform contact of the thermally conductive grease, enhances the toughness of the sheet, and avoids breakage.
Smart Images
Figure CN110149788B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of heat-conducting materials, in particular to a heat sink for an ultra-thin mainframe case. Background Art
[0002] With the vigorous development of high technology, electronic products are becoming more intelligent and complex, the size of electronic components is becoming smaller, and the density per unit area is getting higher and higher. The direct impact of this situation is that the heat generated by electronic products during operation is getting bigger and bigger. In order to conduct the heat energy generated, it is necessary to dissipate the heat, so the corresponding heat sink is needed.
[0003] There are many kinds of heat sinks on the market, but their functions are relatively simple and there are still some problems. They are gradually unable to meet people's needs. The specific problems are as follows:
[0004] (1) It is difficult to limit and fix the corrugated sheet body in the traditional heat sink, which leads to mutual friction and wear.
[0005] (2) It is not easy to evenly apply thermal grease to traditional heat sinks of this type, which makes it difficult for the thermal grease to evenly contact the host chip, greatly reducing the heat dissipation effect;
[0006] (3) The traditional corrugated sheet of this type of heat sink has low toughness and strength, which makes it easy to break and has a short service life. Summary of the invention
[0007] The purpose of the present invention is to provide a heat sink for an ultra-thin mainframe case to solve the problems raised in the above background technology that the heat sink is difficult to limit and fix the corrugated sheet body, it is not convenient to evenly apply thermal grease, and the toughness and strength of the corrugated sheet body are low.
[0008] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a heat sink for an ultra-thin mainframe case, comprising a sheet base, a corrugated sheet body, a pressure-resistant structure, a spacer seat and a positioning hole, wherein positioning holes are provided at the corner positions of the sheet base surface, and the surface of the sheet base is provided with corrugated sheets at equal intervals, and the surface of the sheet base between adjacent corrugated sheets is provided with spacers at equal intervals, and the interior of the corrugated sheet body is provided with a pressure-resistant structure.
[0009] Preferably, a central cavity is provided at the center of the substrate, a copper substrate is provided at the center of the central cavity, and aluminum auxiliary sheets are provided inside the substrates on both sides of the central cavity.
[0010] Preferably, two groups of equally spaced second heat dissipation holes are provided on the outer wall on one side of the substrate, one end of the second heat dissipation holes extends to the interior of the central cavity and is connected to the outer wall of the copper substrate, and two groups of equally spaced first heat dissipation holes are provided on the outer wall on the side of the substrate away from the second heat dissipation holes, one end of the first heat dissipation holes extends to the interior of the central cavity and is connected to the outer wall of the copper substrate.
[0011] Preferably, a center linkage groove is provided on the outer wall of the film base away from the corrugated film body, and transverse bonding strips are provided on the outer walls of the film base at both ends of the center linkage groove, and longitudinal bonding strips are provided on the outer walls of the film base on both sides of the center linkage groove, and guide grooves are provided on the outer walls on one side of the longitudinal bonding strip and the transverse bonding strip, and one end of the guide groove extends to the interior of the center linkage groove.
[0012] Preferably, the compression-resistant structure is provided with adhesive, microwire mesh, metal ion clip and compression-resistant corrugated wire in sequence from the inside to the outside, adhesive is provided at the center position inside the corrugated sheet, and microwire mesh is pasted inside the corrugated sheet on both sides of the adhesive, and metal ion clip is provided inside the corrugated sheet on the side of the microwire mesh away from the adhesive, and compression-resistant corrugated wire is provided at the center position inside the metal ion clip.
[0013] Preferably, a central vertical piece is provided at the central position of the surface of the spacer seat, and the planes where the two ends of the central vertical piece are located are coplanar with the planes where the two ends of the corrugated sheet body are located, and spherical spacer blocks are provided on both outer side walls of the central vertical piece, and one end of the spherical spacer block is fixedly connected to the outer wall of the corrugated sheet body.
[0014] Compared with the prior art, the invention has the following beneficial effects: the heat sink of the ultra-thin mainframe case not only reduces the wear of the corrugated sheet body when the heat sink is used, improves the heat dissipation effect when the heat sink is used, but also prolongs the service life of the heat sink;
[0015] (1) By providing a spherical spacer block, a central vertical sheet and a spacer seat, the bottom of adjacent corrugated sheet bodies are spaced and limited by the spacer seat, and then the spherical spacer block is arranged above the spacer seat by the central vertical sheet to space the top of adjacent corrugated sheet bodies, thereby realizing the function of limiting and fixing the heat sink, avoiding contact between adjacent corrugated sheet bodies, thereby reducing the wear of the corrugated sheet bodies when the heat sink is used;
[0016] (2) By providing the transverse bonding strip, the guide groove, the central linkage groove and the longitudinal bonding strip, the thermal conductive silicone grease can be evenly applied to the four sides of the substrate through the transverse bonding strip and the longitudinal bonding strip, and then the thermal conductive silicone grease can be applied to the center of the substrate through the central linkage groove. At the same time, the guide groove can allow the central linkage groove and the transverse bonding strip to circulate with the thermal conductive silicone grease inside the guide groove, so that the thermal conductive silicone grease can evenly contact the host chip, thereby improving the heat dissipation effect when the heat sink is used;
[0017] (3) By providing an adhesive, a microwire mesh, a metal ion clip and a compression-resistant corrugated wire, the microwire mesh is bonded to the inside of the corrugated sheet by the adhesive, so that the toughness and strength of the corrugated sheet are improved, and then the metal ion clip's own good compression resistance and the compression-resistant corrugated wire enhance its toughness and strength, further improving the toughness and strength of the corrugated sheet, avoiding its breakage, and thus extending the service life of the heat sink. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 It is a front view structural schematic diagram of the present invention;
[0019] Figure 2 It is a rear view structural schematic diagram of the present invention;
[0020] Figure 3 It is a schematic diagram of the side cross-sectional structure of the substrate of the present invention;
[0021] Figure 4 It is a schematic diagram of an enlarged cross-sectional structure of the compression-resistant structure of the present invention.
[0022] In the figure: 1. sheet base; 2. corrugated sheet body; 3. spherical spacer block; 4. central vertical sheet; 5. pressure-resistant structure; 501. adhesive; 502. microwire mesh body; 503. metal ion clip; 504. pressure-resistant corrugated wire body; 6. spacer seat; 7. positioning hole; 8. transverse bonding strip; 9. guide groove; 10. central linkage groove; 11. longitudinal bonding strip; 12. copper substrate; 13. central clamping cavity; 14. aluminum auxiliary sheet; 15. first heat dissipation hole; 16. second heat dissipation hole. DETAILED DESCRIPTION
[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0024] See also Figure 1-4, an embodiment of the present invention: a heat sink for an ultra-thin mainframe case, comprising a substrate 1, a corrugated sheet body 2, a pressure-resistant structure 5, a spacer seat 6 and a positioning hole 7, positioning holes 7 are provided at the corner positions of the surface of the substrate 1, and the surface of the substrate 1 is provided with a corrugated sheet body 2 with equal spacing, a central clamping cavity 13 is provided at the central position inside the substrate 1, and a copper substrate 12 is provided at the central position inside the central clamping cavity 13, and aluminum auxiliary sheets 14 are provided inside the substrate 1 on both sides of the central clamping cavity 13, two groups of equally spaced second heat dissipation holes 16 are provided on the outer wall of one side of the substrate 1, one end of the second heat dissipation hole 16 extends to the inside of the central clamping cavity 13 and is connected to the outer wall of the copper substrate 12, and two groups of equally spaced first heat dissipation holes 15 are provided on the outer wall of the substrate 1 away from the second heat dissipation hole 16, one end of the first heat dissipation hole 15 extends to the inside of the central clamping cavity 13 and is connected to the outer wall of the copper substrate 12, so as to facilitate the transfer of heat energy;
[0025] A central linkage groove 10 is provided on the outer wall of the film base 1 on the side away from the corrugated film body 2, and transverse bonding strips 8 are provided on the outer walls of the film base 1 at both ends of the central linkage groove 10, and longitudinal bonding strips 11 are provided on the outer walls of the film base 1 on both sides of the central linkage groove 10, and a guide groove 9 is provided on the outer wall on one side of the longitudinal bonding strip 11 and the transverse bonding strip 8, and one end of the guide groove 9 extends to the inside of the central linkage groove 10, so as to evenly apply thermal conductive silicone grease;
[0026] The surface of the sheet base 1 between adjacent corrugated sheet bodies 2 is provided with equally spaced spacing seats 6, a central vertical sheet 4 is provided at the center position of the surface of the spacing seat 6, and the planes where the two ends of the central vertical sheet 4 are located are coplanar with the planes where the two ends of the corrugated sheet body 2 are located, and spherical spacing blocks 3 are provided on both outer side walls of the central vertical sheet 4, and one end of the spherical spacing block 3 is fixedly connected to the outer wall of the corrugated sheet body 2, so as to facilitate the spacing and limiting fixing of adjacent corrugated sheet bodies 2;
[0027] The corrugated sheet 2 is provided with a compression-resistant structure 5, which is provided with an adhesive 501, a microwire mesh 502, a metal ion clip 503 and a compression-resistant corrugated wire 504 in sequence from the inside to the outside. The adhesive 501 is provided at the center of the corrugated sheet 2, and the corrugated sheet 2 on both sides of the adhesive 501 is pasted with the microwire mesh 502, and the corrugated sheet 2 on the side of the microwire mesh 502 away from the adhesive 501 is provided with a metal ion clip 503, and the center of the metal ion clip 503 is provided with a compression-resistant corrugated wire 504;
[0028] The microwire mesh 502 is bonded to the inside of the corrugated sheet 2 by adhesive 501, so that the toughness strength of the corrugated sheet 2 is improved, and then the toughness strength is enhanced by the good compressive resistance of the metal ion clip 503 itself and the compressive corrugated wire body 504, thereby further improving the toughness strength of the corrugated sheet 2 and avoiding its breakage.
[0029] Working principle: When the heat sink is in use, first, the bottoms of adjacent corrugated sheets 2 are spaced and limited by the spacer seat 6, and then the spherical spacer block 3 is set above the spacer seat 6 by the central vertical sheet 4 to limit the tops of adjacent corrugated sheets 2, so as to avoid contact between adjacent corrugated sheets 2 and reduce the wear of the corrugated sheets 2. After that, the thermal grease can be evenly applied to the four sides of the sheet base 1 through the transverse bonding strip 8 and the longitudinal bonding strip 11, and then the thermal grease is applied to the center of the sheet base 1 through the central linkage groove 10. At the same time, the guide groove 9 can make the central linkage groove 10 and the transverse bonding strip 8 and the thermal grease inside the guide groove 9 circulate, so as to make the thermal grease evenly It is in contact with the host chip to improve the heat dissipation effect of the heat sink. The microwire mesh 502 is bonded to the inside of the corrugated sheet 2 through the adhesive 501, so that the toughness and strength of the corrugated sheet 2 are improved. The metal ion clip 503 has its own good compressive resistance and the compressive corrugated wire 504 has its toughness and strength enhanced, which further improves the toughness and strength of the corrugated sheet 2 to avoid its breakage and extend the service life of the heat sink. Finally, the copper substrate 12 and the aluminum auxiliary sheet 14 have their own good thermal conductivity to transfer heat energy. At the same time, the first heat dissipation hole 15 and the second heat dissipation hole 16 further assist in the introduction and extraction of heat, thereby completing the use of the heat sink.
[0030] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.
Claims
1. A heat sink for an ultra-thin mainframe case, comprising a base (1), a corrugated sheet body (2), a pressure-resistant structure (5), a spacer seat (6) and a positioning hole (7), characterized in that: Positioning holes (7) are provided at the corner positions of the surface of the substrate (1), and the surface of the substrate (1) is provided with equally spaced corrugated sheets (2), and the surface of the substrate (1) between adjacent corrugated sheets (2) is provided with equally spaced spacing seats (6), and a pressure-resistant structure (5) is provided inside the corrugated sheets (2). A central linkage groove (10) is provided on the outer wall of the substrate (1) on the side away from the corrugated sheets (2), and transverse bonding strips (8) are provided on the outer walls of the substrate (1) at both ends of the central linkage groove (10), and longitudinal bonding strips (11) are provided on the outer walls of the substrate (1) on both sides of the central linkage groove (10), and guide grooves (9) are provided on the outer walls on one side of the longitudinal bonding strip (11) and the transverse bonding strip (8), and one end of the guide groove (9) extends to the inside of the central linkage groove (10), and the pressure-resistant structure (5) is provided with adhesive (501), micro adhesive (502) and adhesive (503) in sequence from the inside to the outside. A wire mesh body (502), a metal ion clip (503) and a compression-resistant corrugated wire body (504); an adhesive (501) is provided at the center position inside the corrugated sheet body (2); microwire mesh bodies (502) are adhered inside the corrugated sheet body (2) on both sides of the adhesive (501); a metal ion clip (503) is provided inside the corrugated sheet body (2) on the side of the microwire mesh body (502) away from the adhesive (501); a compression-resistant corrugated wire body (504) is provided at the center position inside the metal ion clip (503); a central vertical sheet (4) is provided at the center position of the surface of the spacer seat (6); the planes where the two ends of the central vertical sheet (4) are located are coplanar with the planes where the two ends of the corrugated sheet body (2) are located; spherical spacer blocks (3) are provided on the two outer side walls of the central vertical sheet (4); one end of the spherical spacer block (3) is fixedly connected to the outer wall of the corrugated sheet body (2).
2. The heat sink of an ultra-thin mainframe case according to claim 1, characterized in that: A central cavity (13) is provided at the center of the substrate (1), a copper substrate (12) is provided at the center of the central cavity (13), and aluminum auxiliary sheets (14) are provided inside the substrate (1) on both sides of the central cavity (13).
3. The heat sink of an ultra-thin mainframe case according to claim 2, characterized in that: Two groups of equally spaced second heat dissipation holes (16) are provided on the outer wall of one side of the substrate (1), one end of the second heat dissipation hole (16) extends to the interior of the central cavity (13) and is connected to the outer wall of the copper substrate (12), and two groups of equally spaced first heat dissipation holes (15) are provided on the outer wall of the substrate (1) away from the second heat dissipation holes (16), one end of the first heat dissipation hole (15) extends to the interior of the central cavity (13) and is connected to the outer wall of the copper substrate (12).
Citation Information
Patent Citations
Anti-deforming efficient cooling radiator
CN204045330U
Cooling fin of ultrathin mainframe box
CN210351971U