A test device and a wafer automatic test machine

Abstract

The present invention discloses a testing device and a wafer automatic testing machine, which belong to the field of wafer testing technology. The testing device includes a testing platform, and also includes a carrier and a rotating worktable rotatably arranged on the carrier, wherein the testing platform is arranged on the upper part of the rotating worktable; an adjusting column is arranged at the bottom of the rotating worktable, and the adjusting column passes through the carrier and is rotatably connected to the carrier; an adjusting rod is arranged at the bottom of the adjusting column, and the adjusting rod is pushed, and the adjusting rod can drive the adjusting column and the rotating worktable to rotate. A wafer automatic testing machine includes the above-mentioned testing device. The present invention realizes that the position of the testing platform in the horizontal plane is adjustable by arranging the testing platform on the rotating worktable and rotatably connecting the rotating worktable with the carrier.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer testing, and in particular to a testing device and a wafer automatic testing machine. Background Art

[0002] In the existing wafer automatic tester, the wafer to be tested is placed on the fixture of the test tooling and contacts the probe on the test board to complete the program test and obtain the test results. However, according to the different size structures of the wafer to be tested and the size structures of the test board, it is necessary to adaptively adjust the position of the fixture on the horizontal plane so that the wafer is in full contact with the test board to ensure the smooth progress of the test process.

[0003] Therefore, it is urgent to provide a testing device and a wafer automatic testing machine to solve the above problems. Summary of the invention

[0004] The object of the present invention is to provide a testing device and a wafer automatic testing machine, which can realize the position adjustment of the testing table on the horizontal plane.

[0005] In order to achieve the above objectives, the following technical solutions are provided:

[0006] A testing device includes a test bench, a carrier and a rotating worktable rotatably arranged on the carrier, wherein the test bench is arranged on the upper part of the rotating worktable; an adjusting column is provided at the bottom of the rotating worktable, the adjusting column passes through the carrier and is rotatably connected to the carrier; an adjusting rod is provided at the bottom of the adjusting column, and the adjusting rod is pushed so that the adjusting rod can drive the adjusting column and the rotating worktable to rotate.

[0007] Preferably, the axis of the adjusting rod is perpendicular to the axis of the adjusting column.

[0008] Preferably, the adjusting rod is configured to vertically penetrate the adjusting column.

[0009] Preferably, an adjustment block is provided on the side of the carrier, a strip groove is provided on a side of the adjustment block close to the adjustment column, and the free end of the adjustment rod is arranged in the strip groove.

[0010] Preferably, a first spiral differential head is also provided on the adjustment block, and a measuring rod of the first spiral differential head can extend into the adjustment block and abut against the adjustment rod. The fine-tuning knob of the first spiral differential head is rotated to change the extension length of the measuring rod of the first spiral differential head, thereby driving the adjustment rod to move in the strip groove.

[0011] Preferably, the adjusting block is further provided with a first locking bolt, and the first locking bolt is configured to lock the adjusting rod.

[0012] Preferably, the testing device also includes a lifting mechanism and a supporting mechanism, the supporting mechanism includes a supporting top plate and a supporting bottom plate that are parallel to each other and spaced apart, and a supporting vertical plate arranged between the supporting top plate and the supporting bottom plate, the carrier is arranged between the supporting top plate and the supporting bottom plate, and the lifting mechanism is configured to be able to drive the carrier close to or away from the supporting top plate.

[0013] Preferably, the testing device further comprises a height adjustment mechanism, and the height adjustment mechanism is configured to be able to adjust the height of the supporting top plate relative to the supporting bottom plate.

[0014] Preferably, the height adjustment mechanism includes a third spiral differential head arranged on the support top plate, and the measuring rod of the third spiral differential head passes through the support top plate and abuts against the top surface of the support vertical plate. The fine-tuning knob of the third spiral differential head is rotated to change the extension length of the measuring rod of the third spiral differential head, thereby driving the support top plate to move closer to or away from the support bottom plate.

[0015] A wafer automatic testing machine comprises the testing device described in any one of the above schemes.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] The present invention arranges a test table on a rotating worktable, and rotatably connects the rotating worktable with a carrier, and utilizes a push adjustment rod to complete the rotation of the rotating worktable and the test table, so that the position of the test table in a horizontal plane can be adjusted, so that a chip placed on the test table can fully contact with a test board, thereby ensuring the smooth progress of the test process. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of a wafer automatic testing machine according to an embodiment of the present invention;

[0019] Figure 2 It is a front view of a wafer automatic tester according to an embodiment of the present invention;

[0020] Figure 3 This is a schematic diagram of the structure of a rack in an embodiment of the present invention;

[0021] Figure 4 This is a schematic structural diagram of a tray device in an embodiment of the present invention;

[0022] Figure 5 This is a schematic diagram of the structure of a material tray in an embodiment of the present invention;

[0023] Figure 6 for Figure 4 A local enlarged schematic diagram of the middle A;

[0024] Figure 7 This is a schematic diagram of the structure of a transfer device in an embodiment of the present invention;

[0025] Figure 8 It is a schematic structural diagram of a transfer device in an embodiment of the present invention after removing the second substrate;

[0026] Fig. 9 for Figure 8 A partial enlarged schematic diagram of point B in the middle;

[0027] Fig.10 It is a structural schematic diagram of a testing device in an embodiment of the present invention;

[0028] Fig.11 is a side view of a testing device in an embodiment of the present invention;

[0029] Fig.12 for Fig.10 A partial enlarged schematic diagram of point C in the middle;

[0030] Fig.13 A partial structural diagram of a testing device according to an embodiment of the present invention Figure 1 ;

[0031] Fig.14 A partial structural diagram of a testing device according to an embodiment of the present invention Figure 2 ;

[0032] Fig.15 A partial structural diagram of a testing device according to an embodiment of the present invention Figure 3 .

[0033] Reference numerals:

[0034] 100- tray; 101- groove;

[0035] 1-frame; 11-main body; 12-carrying platform; 121-through slot; 13-baffle; 14-carrying plate;

[0036] 2-tray device; 21-mounting top plate; 211-through-beam sensor; 22-mounting bottom plate; 23-connecting rod; 24-tray support block; 25-first driving mechanism; 251-lifting platform; 2511-first shading plate; 252-driving motor; 26-first photoelectric switch; 27-positioning block; 28-guide block; 281-connecting part; 282-guide part; 2821-first guide surface; 2822-second guide surface; 2823-positioning surface;

[0037] 3-transfer device; 31-first base; 311-first slide rail; 312-second photoelectric switch; 32-second base; 321-second slide rail; 322-third photoelectric switch; 323-accommodating groove; 33-first driving assembly; 331-first driving source; 332-first driving wheel; 333-first driven wheel; 334-first conveyor belt; 335-first belt connecting member; 3351-first fixed plate; 3352-second fixed plate; 336 -first mounting frame; 34-second driving assembly; 341-second driving source; 342-second driving wheel; 343-second driven wheel; 344-second conveyor belt; 345-second belt connecting member; 346-second mounting frame; 35-first slider; 36-second slider; 361-fourth shading plate; 37-nozzle assembly; 371-nozzle cylinder; 372-nozzle fixing plate; 373-nozzle body; 374-air control valve; 375-second guide rod;

[0038] 4-test device; 40-angle adjustment mechanism; 401-rotating workbench; 402-adjusting block; 4021-strip groove; 403-adjusting column; 404-adjusting rod; 405-first spiral differential head; 406-first locking bolt; 407-locking nut; 41-support mechanism; 411-support top plate; 412-support bottom plate; 413-support vertical plate; 4131-fourth photoelectric switch; 414-support support plate; 415-support rod; 42-lifting mechanism; 421-lifting drive source; 422-first connecting plate; 43-test bench assembly; 431-test bench; 432-carrier; 433-positioning bar; 434-propelling structure; 434 1-push cylinder; 4342-push plate; 4343-push ejector pin; 4344-third guide rod; 44-test plate assembly; 441-test plate; 442-pressing plate; 443-spring plate; 444-limiting baffle; 45-buffer structure; 451-buffer connecting block; 452-buffer; 46-linear guide structure; 461-third slider; 462-third slide rail; 47-displacement adjustment mechanism; 471-cross guide displacement platform; 472-second spiral differential; 473-second locking bolt; 48-height adjustment mechanism; 481-third spiral differential head; 482-cross guide structure; 483-fourth locking bolt; 49-second connecting plate;

[0039] 5-Display device. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0041] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0042] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0043] In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or are the positions or positional relationships in which the inventive product is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0044] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "disposed" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0045] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0046] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0047] Embodiment 1

[0048] refer to Figure 1 and 2 As shown, this embodiment discloses a wafer automatic test machine, including a frame 1, a transfer device 3 arranged on the frame 1, a tray device 2, a test device 4 and a display device 5. The frame 1 is also provided with an electric control device, which mainly includes a PLC module, which is used to control the timing actions of each device of the integrated wafer automatic test machine to realize the automatic operation of the wafer test. The display device 5 is configured to display the operating status and test results of each device, so as to facilitate manual real-time monitoring of the test process.

[0049] Specifically, refer to Figure 3The rack 1 includes a main body 11 and a bearing platform 12 disposed on the upper part of the main body 11. The main body 11 is used to accommodate the electronic control device; the bearing platform 12 is used to bear the transfer device 3 and the tray device 2; optionally, the bearing platform 12 is made of marble to stably support the transfer device 3 and the tray device 2. The rack 1 also includes a baffle 13 disposed on the outside of the bearing platform 12; the baffle 13 is a U-shaped structure, so that the baffle 13 can surround the entire loading platform and the transfer device 3 and the tray device 2 thereon to prevent the outside from interfering with the operation of the transfer device 3 or touching the tray device 2; the test device 4 is disposed at the open end of the U-shaped baffle 13, so that the transfer device 3 can transfer the wafers on the tray device 2 to the test device 4 at the open end for testing. Optionally, the rack 1 also includes a bearing plate 14, and the test device 4 is disposed on the bearing plate 14. One end of the carrier plate 14 is detachably connected to the main body 11, and the other end is detachably connected to the carrier platform 12, to ensure the stability of the positional relationship between the test device 4 and the tray device 2. Furthermore, the carrier plate 14 and the carrier platform 12 are connected by a wedge-shaped reinforcing plate to improve the stability of the carrier plate 14. Optionally, the display device 5 is arranged on the side wall of the main body 11 through a universal bracket, so that it does not affect the testing process of the entire automatic testing machine and can also be flexibly changed in placement position.

[0050] In order to improve the efficiency of wafer testing, multiple test devices 4 are provided, and the multiple test devices 4 are arranged linearly along the first direction. In this embodiment, five test devices 4 are provided, so five wafers can be tested at the same time, which significantly improves the efficiency of wafer testing; of course, in some other embodiments, according to the test time of each wafer and the limit of the moving speed of the transfer device 3, the number of test devices 4 set or the test devices 4 in use can be further specifically limited.

[0051] The tray device 2 is used to carry the tray 100, on which the wafer is placed. There are multiple tray devices 2, which can be divided into three categories. The first category is an empty tray device, which is used to carry an empty tray without wafers placed thereon. The second category is a tray device to be tested, on which the tray 100 carried by the empty tray is placed an untested wafer. The third category is a classification tray device. Since the test results of the wafer can be divided into multiple levels, the classification tray device is also divided into multiple according to the level of the test results. Each level corresponds to a classification tray device, and the wafers that have been tested are placed on the tray 100 of the classification tray device representing the corresponding level according to the test results. The above three types of tray devices 2 are set so that the automatic test machine can automatically classify and store the wafers according to the test results, which effectively improves the automation and intelligence of the wafer test. In this embodiment, there are twelve tray devices 2, and the twelve tray devices 2 can be optionally distributed in a matrix on the carrying platform 12, wherein one empty tray device, one tray device to be tested, and ten classification tray devices are set. Of course, during the specific implementation, the number of classification tray devices can be further limited according to the grade classification of the chip test results; at the same time, the number of empty tray devices and the tray devices to be tested is set to at least one; according to the different numbers of trays 100 that each tray device 2 can carry, the different numbers of chips that can be placed on each tray 100, and the different transfer methods of the transfer device 3, the empty tray devices and the tray devices to be tested can be set to multiple.

[0052] In this embodiment, after all the wafers carried by the tray 100 on the tray device to be tested are taken, the remaining empty trays will be transferred to the empty tray device by the transfer device 3; for the empty tray device, the empty trays carried on it can be transferred by the transfer device 3 to the corresponding classification tray device for classification and storage of the wafers that have completed the test; thereby realizing the turnover of the empty trays in the wafer testing process, improving the utilization rate of the tray 100, and further improving the test efficiency and intelligence of the wafer automatic test. In specific implementation, when the automatic test machine is initially started, it should be ensured that the empty tray device is provided with a number of empty trays to achieve the continuity of the transfer of empty trays between different types of tray devices 2.

[0053] Embodiment 2

[0054] This embodiment provides a tray device 2 that can be used in the wafer automatic test machine in the first embodiment. Figure 4The tray device 2 includes a mounting top plate 21 and a mounting bottom plate 22. Optionally, the mounting top plate 21 and the mounting bottom plate 22 are spaced apart and connected by a connecting rod 23, and the connecting rod 23 is vertically disposed between the mounting top plate 21 and the mounting bottom plate 22. Further, in order to enable the automatic tester to test more wafers, each tray device 2 is configured to allow multiple trays 100 to be stacked in the space between the mounting top plate 21 and the mounting bottom plate 22 in the vertical direction. The transfer device 3 completes the reciprocating movement of the wafer on the top tray 100 between the tray device 2 and the testing device 4 according to the instructions, or completes the transfer of empty trays between the tray device to be tested and the empty tray device, and between the empty tray device and the classification tray device. Further, optionally, the carrying platform 12 is provided with the same number of through slots 121 as the tray device 2, the through slots 121 run through the entire carrying platform 12 and are connected to the inside of the main body 11, and each through slot 121 is provided with a corresponding tray device 2, so that the tray 100 stacked between the mounting top plate 21 and the mounting bottom plate 22 can be stored in the main body 11, making full use of the space of the rack 1 and compressing the size of the entire wafer automatic tester. Among them, the mounting top plate 21 is fixedly connected to the carrying platform 12 to achieve the fixation of the tray device 2 and the carrying platform 12. Optionally, the fixing method can be bolt fixing or clamping, but is not limited to the above methods. The mounting top plate 21 is a frame structure, the material tray 100 is a plate-shaped structure, the topmost material tray 100 is placed in the frame structure of the mounting top plate 21, and the centers of the two coincide with each other; optionally, the material tray 100 and the inner frame of the mounting top plate 21 are both rectangular structures, and the four sides of the material tray 100 are arranged parallel to the four sides of the inner frame of the mounting top plate 21. Further, refer to Figure 5 The tray 100 is provided with a plurality of grooves 101 for storing wafers. Further, the wafers on the tray 100 are arranged in a matrix, so that the transfer device 3 can obtain the specific position of the wafer and the position to which the wafer needs to be moved according to the rectangular coordinates.

[0055] Furthermore, since a plurality of stacked trays 100 are provided on the tray device 2, each time a tray 100 is rotated out or transferred in, the overall height of the stacked trays 100 on the tray device 2 will change. In order to ensure that the transfer device 3 completes the transfer of the chips or trays 100 of each tray device 2 within a horizontal plane at the same height, the topmost tray 100 of each tray device 2 should be maintained at the same horizontal plane. Therefore, the tray device 2 also includes a tray support block 24 for supporting the trays 100 and a first driving mechanism 25 for driving the tray support block 24 to rise and fall; the trays 100 are stacked on the tray support block 24 in a vertical direction, and driven by the first driving mechanism 25, all the trays 100 are driven to rise and fall as a whole. In specific implementation, when the top tray 100 of the tray device 2 is transferred, the first drive mechanism 25 drives the tray 100 to move up by the height of a tray 100 as a whole, so that the next tray 100 moves to the position of the transferred tray 100, so that the transfer device 3 can perform subsequent operations on the new tray 100 at the same position; when the transfer device 3 transfers a new tray 100 to a certain tray device 2, the first drive mechanism 25 drives the tray 100 to move down by the height of a tray 100 as a whole, so that the original top tray 100 can be stored in the space between the mounting top plate 21 and the mounting bottom plate 22, and the transfer device 3 performs subsequent operations on the new top tray 100. Furthermore, when a batch of wafers have been completely tested and need to be taken out by the automatic test machine, the first drive mechanism 25 is used to raise the tray support block 24 to the highest height, so that all stacked trays 100 can be taken out of the automatic test machine. In this embodiment, the plane where the optional carrying platform 12 is located is the transfer plane.

[0056] Optionally, still refer to Figure 4The first driving mechanism 25 includes a lifting platform 251 and a driving motor 252. The material tray support block 24 is arranged on the lifting platform 251. The main body of the driving motor 252 is arranged on the mounting base plate 22. The output shaft of the driving motor 252 extends out of the mounting base plate 22 and is connected to the lifting platform 251 through a screw nut structure. The nut of the screw nut structure is fixed to the lifting platform 251. The screw of the screw nut is connected to the output shaft of the driving motor 252. Through the threaded connection between the screw and the nut, the conversion from rotary motion to linear motion is realized, and then the lifting platform 251 is lifted up and down, so that the material tray support block 24 can move freely between the mounting top plate 21 and the mounting base plate 22. In some other embodiments, the first driving mechanism 25 can also adopt a cylinder lifting structure or a gear rack lifting structure. Optionally, in order to improve the lifting accuracy of the lifting platform 251, a first guide through hole is provided on the lifting platform 251, and a first guide rod is provided on at least one of the mounting top plate 21 and the mounting bottom plate 22. The first guide rod is arranged in the first guide through hole, and the guiding effect is achieved by the relative sliding of the first guide rod in the first guide through hole. Further optionally, a first guide sleeve is arranged in the first guide through hole to ensure smoothness during the guiding process. Optionally, in this embodiment, the connecting rod 23 can be used as the first guide rod. Optionally, the lifting platform 251 and the tray support block 24 are integrally formed to facilitate the synchronization of the lifting drive.

[0057] In order to limit the descending height of the tray support block 24, a first photoelectric switch 26 is installed on the bottom plate 22, and a first shading plate 2511 is provided at the lower part of the lifting platform 251. When the lifting platform 251 descends to the point where the first shading plate 2511 is located between the transmitting end and the receiving end of the first photoelectric switch 26, the first photoelectric switch 26 is triggered to generate a signal that the lifting platform 251 has descended to the limit position, thereby preventing the lifting platform 251 from further descending.

[0058] Furthermore, a first positioning protrusion is provided on the upper surface of the material tray 100, and a first positioning groove is provided on the lower surface of the material tray 100. The material tray 100 is engaged with the first positioning groove of the material tray 100 above it through the first positioning protrusion, and is engaged with the first positioning protrusion of the material tray 100 below it through the first positioning groove, so as to achieve stable stacking of two adjacent material trays 100. Furthermore, the first positioning protrusion and the first positioning groove of the material tray 100 can be rectangular structures adapted to the material tray 100, and accordingly, the groove 101 for holding the wafer is opened on the first positioning protrusion. Of course, in other embodiments, the first positioning groove can also be provided on the upper surface of the material tray 100, and the first positioning protrusion can be provided on the lower surface of the material tray 100, and the groove 101 can be opened in the first positioning groove, and the material tray 100 can also be stably stacked by adopting the mutual engagement method. Furthermore, a positioning block 27 is provided on the upper surface of the tray support block 24. When a first positioning groove is provided on the lower surface of the tray 100, the outer contour of the positioning block 27 is matched with the inner contour of the first positioning groove, so that the lowermost tray 100 can be stably placed on the tray support block 24, which plays a role in positioning the tray 100 and preventing it from shaking. When a first positioning protrusion is provided on the lower surface of the tray 100, a positioning slot is provided on the positioning block 27, and the inner contour of the positioning slot is matched with the outer contour of the first positioning protrusion, which still plays a role in positioning the lowermost tray 100. Optionally, the positioning block 27 can be integrally formed with the tray support block 24, or can be detachably connected; the detachable connection method can facilitate the replacement of the positioning block 27 according to the specific structure of the tray 100.

[0059] When a large number of trays 100 are stacked in the vertical direction, due to the accumulation of assembly errors and the existence of their own deflection, the trays 100 as a whole cannot remain vertical, but will tilt or twist to a certain extent, causing the position of the tray 100 at the top to shift. The position of the shifted tray 100 will affect the accuracy of the transfer device 3 in taking and placing the wafer, affecting the continuity of the test process. In order to solve the above problem, refer to Figure 4 and Figure 6A guide block 28 is provided on the side of the inner frame of the mounting top plate 21. The guide block 28 includes a vertically arranged connection portion 281 and a guide portion 282. The connection portion 281 is connected to the mounting top plate 21. The guide portion 282 is provided with a first guide surface 2821 and a positioning surface 2823 connected sequentially from bottom to top on the side away from the mounting top plate 21. The positioning surface 2823 is parallel to the vertical direction. The first guide surface 2821 is inclined relative to the positioning surface 2823, that is, the end of the first guide surface 2821 that is not connected to the positioning surface 2823 is closer to the mounting top plate 21 than the end of the first guide surface 2821 that is connected to the positioning surface 2823. Therefore, when the material tray 100 rises from the bottom, the material tray 100 is positioned under the guidance of the first guide surface 2821. The position of the material tray 100 is corrected and gradually moves toward the center of the inner frame until the material tray 100 moves up to the space enclosed by the positioning surface 2823; further, a second guide surface 2822 connected to the upper part of the positioning surface 2823 is provided on the side wall of the guide block 28 away from the mounting top plate 21; the second guide surface 2822 is inclined relative to the positioning surface 2823, that is, the end of the second guide surface 2822 not connected to the positioning surface 2823 is closer to the mounting top plate 21 than the end of the second guide surface 2822 connected to the positioning surface 2823. When the material tray 100 relatively descends, the material tray 100 can be corrected in position under the guidance of the second guide surface 2822, and gradually moves toward the center of the inner frame until the material tray 100 moves down to the space enclosed by the positioning surface 2823. Further optionally, when the mounting top plate 21 is a rectangular structure, guide blocks 28 are provided on the four sides of its inner frame, so that the material tray 100 can be deflected to the middle under the guidance of the guide blocks 28 at four different positions when it is lifted or lowered, and the position is corrected, thereby ensuring the accuracy of the position of the material tray 100 in the inner frame of the mounting top plate 21, and improving the efficiency of the position correction of the material tray 100. Optionally, when only one guide block 28 is provided on each side, the guide block 28 is provided at the middle position of a side of the mounting top plate 21. Further, in some other embodiments, each side of the inner frame of the mounting top plate 21 is not limited to having only one guide block 28, and two or more guide blocks may be provided.

[0060] The mounting top plate 21 is provided with a mounting groove, and the connecting portion 281 of the guide block 28 is connected to the mounting groove, while the guiding portion 282 of the guide block 28 is provided outside the mounting groove. Optionally, the connecting portion 281 is fixedly connected to the mounting top plate 21 by a first bolt. Specifically, a first through hole is provided on the groove wall of the mounting groove, and a second through hole is provided on the connecting portion 281. After the first bolt passes through the second through hole and the first through hole in sequence, a nut is used to complete the fixing of the guide block 28 to the mounting top plate 21. Furthermore, the second through hole is an elongated hole, and the second through hole extends in a direction perpendicular to the side edge of the corresponding guide block 28 for installation. By changing the position of the first bolt in the elongated hole, the distance between the positioning surface 2823 of the guide block 28 and the side edge on which the guide block 28 is provided can be adjusted, thereby improving the applicability of the tray device 2. Personnel can reasonably adjust the installation position of the guide block 28 according to the actual size of the tray 100 or the difference in the gap error between the tray 100 and the positioning surface 2823, and reasonably set the size of the space enclosed by the positioning surface 2823, so that the center of the tray 100 located in the space can coincide with the center of the mounting top plate 21, thereby avoiding a large displacement of the position of the tray 100 and ensuring the accurate loading of the transfer device 3.

[0061] In order to monitor whether the topmost tray 100 is placed in the frame structure of the top plate 21, a through-beam sensor 211 is provided on the inner frame of the top plate 21. Figure 4 and Figure 6 Specifically, the through-beam sensor 211 has a transmitter and a receiver that are separated from each other in structure and whose optical axes are oppositely placed, and are respectively located on two oppositely arranged sides of the inner frame, and the light emitted by the transmitter directly enters the receiver. When the tray 100 is placed in the frame structure of the top plate 21, the light between the transmitter and the receiver is blocked by the tray 100, and the through-beam sensor 211 generates a signal that the tray 100 is located in the inner frame of the frame of the top plate 21.

[0062] Embodiment 3

[0063] This embodiment provides a transfer device 3 that can be used in the wafer automatic tester in the first embodiment. The transfer device 3 is configured to realize the movement of the tray 100 between different tray devices 2 and the wafer between the tray device 2 and the test device 4 to complete the material picking or placing action. Figure 7 and Figure 8The transfer device 3 includes a first slide rail 311, a first drive assembly 33, a second slide rail 321, a second drive assembly 34 and a nozzle assembly 37. The nozzle assembly 37 includes a nozzle body 373, which is used to directly absorb the material tray 100 or the wafer. The first drive assembly 33 is configured to drive the nozzle assembly 37 to move along the first slide rail 311, and the second drive assembly 34 is configured to drive the nozzle assembly 37 and the first slide rail 311 to move along the second slide rail 321 as a whole. The extension directions of the first slide rail 311 and the second slide rail 321 are perpendicular to each other. In this embodiment, the extension directions of the first slide rail 311 and the second slide rail 321 can be respectively understood as the X-axis and the Y-axis in the rectangular coordinate system of the transfer plane. The drive assembly can receive instructions from the system to drive the nozzle assembly 37 to move along the X-axis and the Y-axis to the corresponding coordinate position of the transfer plane to absorb the material tray 100 or the wafer at this position. In this embodiment, the X-axis is the first direction and the Y-axis is the second direction. Further, the transfer device 3 also includes a first base 31 provided with a first slide rail 311 and a second base 32 provided with a second slide rail 321, a first drive assembly 33 is provided on the first base 31, and a second drive assembly 34 is provided on the second base 32, and the second drive assembly 34 directly drives the first base 31 to move relative to the second base 32, so as to realize the movement of the first slide rail 311 relative to the second slide rail 321. Further optionally, the carrying platform 12 can be directly used as the second base 32.

[0064] Specifically, the first driving assembly 33 includes a first driving source 331, a first driving wheel 332, a first driven wheel 333, a first conveyor belt 334 wound around the first driving wheel 332 and the second driven wheel 343, and a first belt connecting member 335 fixed on the first conveyor belt 334. The first belt connecting member 335 is provided with a first slider 35 on the side close to the first slide rail 311, and a suction nozzle body 373 is provided on the side of the first belt connecting member 335 away from the first slide rail 311; the first driving source 331 and the first driving wheel 332 are arranged at one end of the first slide rail 311, and the first driven wheel 333 is arranged at the other end of the first slide rail 311. The first driving source 331 drives the first conveyor belt 334 to rotate, and the first belt connecting member 335 moves synchronously with the first conveyor belt 334. The precise guidance in the first direction is achieved through the sliding cooperation between the first slider 35 and the first slide rail 311. At the same time, the suction nozzle body 373 can move synchronously with the first belt connecting member 335 to achieve displacement of the suction nozzle body 373 in the first direction. Optionally, the first driving source 331 includes a servo motor and a reducer, and the output end of the reducer is connected to the first driving wheel 332. Optionally, in order to improve the stability of the nozzle assembly 37 moving along the first slide rail 311, refer to Figure 8, two first slide rails 311 are arranged on the first base 31, and two first sliders 35 are arranged on the corresponding first belt connecting member 335. Each first slider 35 is slidably arranged on a first slide rail 311. The arrangement of two first slide rails 311 improves the stability of the movement of the nozzle assembly 37 and the accuracy of the transfer along the first direction. Of course, in the specific implementation, the number of first slide rails 311 is not limited to two in the present embodiment, and more may be arranged. Optionally, the first driving source 331 is fixed to the first base 31 through a first mounting plate, and the first driven wheel 333 is relatively fixed to the first base 31 through a first mounting frame 336 to meet the transmission operation of the first conveyor belt 334. Optionally, the first base 31 can be made of a profile, and a slide groove along the first direction is opened on the profile. The first mounting frame 336 is provided with a first threaded through hole. The second bolt is screwed into the first threaded through hole and the slide groove in sequence to fix the first mounting frame 336 on the first base 31. By fine-tuning the position of the first mounting frame 336 on the profile, the tension of the first conveyor belt 334 can be adjusted to ensure the smooth progress of the conveying process.

[0065] The second driving assembly 34 includes a second driving source 341, a second driving wheel 342, a second driven wheel 343, a second conveyor belt 344 wound around the second driving wheel 342 and the second driven wheel 343, and a second belt connector 345 fixed on the second conveyor belt 344. The second belt connector 345 is connected to the first base 31, so that when the second driving source 341 drives the second conveyor belt 344 to rotate, the second conveyor belt 344 can drive the entire first base 31 to move. In order to ensure that the first base 31 and the suction nozzle body 373 thereon move along the second direction, a second slide rail 321 is provided on the upper part of the second base 32, and a second slider 36 is provided on the lower part of the first base 31. The first base 31 is precisely guided along the second direction by the sliding cooperation of the second slider 36 on the second slide rail 321. Optionally, in this embodiment, the second drive assembly 34 is arranged in the middle position of the second base 32, and the second slide rail 321 is provided with two, and the two second slide rails 321 are symmetrically arranged on both sides of the second drive assembly 34, so that the arrangement can evenly transmit the driving force, so that the first base 31 as a whole can move evenly and synchronously along the second direction, avoiding the deviation of one side. Optionally, the second drive source 341 has the same structure as the first drive source 331, and both use a servo motor and a reducer to generate the driving force. Optionally, a receiving groove 323 is provided on the second base 32, and the second drive assembly 34 is arranged in the receiving groove 323 to hide the second drive assembly 34, which can not only avoid interference with the suction nozzle assembly 37 moving along the first slide rail 311, but also reduce the size of the wafer automatic test machine. Further optionally, the second drive source 341 is fixed to the second base 32 through a second mounting plate, and the second driven wheel 343 is relatively fixed to the second base 32 through a second mounting frame 346 to meet the transmission operation of the second conveyor belt 344. Optionally, a second threaded through hole is provided on the second base 32, and an adjustment long hole is provided on the second mounting bracket 346. The second mounting bracket 346 is fixed to the second base 32 by screwing a third bolt into the adjustment long hole and the second threaded through hole in sequence. By fine-tuning the position of the third bolt in the adjustment long hole, the tension of the second conveyor belt 344 can be changed to improve the conveying efficiency.

[0066] Further, refer to Figure 8 and Fig. 9The nozzle assembly 37 includes a nozzle cylinder 371, a nozzle fixing plate 372 and a nozzle body 373 arranged on the nozzle fixing plate 372. The output end of the nozzle cylinder 371 is connected to the nozzle fixing plate 372, thereby driving the nozzle fixing plate 372 and the nozzle body 373 to rise and fall, thereby completing the picking and unloading of the material tray 100 or the chip; further, the nozzle assembly 37 also includes an air-controlled valve 374, the input end of the nozzle cylinder 371 is connected to the air-controlled valve 374, and the air-controlled valve 374 is communicatively connected to the electronic control device of the testing machine to receive the signal of the electronic control device to control the action of the nozzle cylinder 371. Optionally, a first fixed plate 3351 is provided above the first belt connecting member 335, and a second fixed plate 3352 is provided below the first belt connecting member 335, and the second fixed plate 3352 is optionally vertically connected to the first belt connecting member 335; an air control valve 374 is connected to the first fixed plate 3351, and a suction nozzle cylinder 371 is provided on the second fixed plate 3352, and the output end of the suction nozzle cylinder 371 extends vertically downward from the second fixed plate 3352 and is connected to the suction nozzle fixed plate 372, driving the suction nozzle fixed plate 372 to move closer to or away from the second fixed plate 3352; the arrangement of the first fixed plate 3351 and the second fixed plate 3352 enables the suction nozzle assembly 37 as a whole to move synchronously along the first slide rail 311 following the first belt connecting member 335, thereby ensuring the stability and consistency of the suction nozzle assembly 37 during operation. Furthermore, one of the nozzle fixing plate 372 and the second fixing plate 3352 is provided with a second guide rod 375, and the other is provided with a second guide through hole, and the second guide rod 375 is inserted into the second guide through hole to achieve the guiding effect when the nozzle cylinder 371 drives the nozzle fixing plate 372 to rise and fall, so as to avoid the nozzle body 373 from being offset and failing to accurately pick up and unload materials. In this embodiment, the second guide rod 375 is provided on the nozzle fixing plate 372, and the second guide through hole is provided on the second fixing plate 3352. Optionally, a second guide sleeve is provided on the second fixing plate 3352, and the second guide sleeve is sleeved on the outer periphery of the second guide rod 375 to ensure the guiding effect of the second guide rod 375.

[0067] In this embodiment, there are multiple suction nozzle bodies 373, which can be divided into three categories according to the different objects to be sucked. One category is the tray suction nozzle body, which is used to suck the tray 100 and move the tray 100 from the tray device to be tested to the empty tray device, or from the empty tray device to the classification tray device; the second category is the material taking suction nozzle body, which is used to suck the wafer to be tested on the tray 100 in the tray device to be tested and move it to the test device 4; the third category is the unloading suction nozzle body, which is used to suck the wafer that has completed the test on the test device 4 and move it to the tray 100 of the corresponding classification tray device according to the test results. Further, the number of each type of suction nozzle body 373 is not specifically limited, but each type of suction nozzle body 373 is correspondingly provided with a suction nozzle fixing plate 372 and a suction nozzle cylinder 371, so that the actions of different types of suction nozzle bodies 373 do not interfere with each other. Specifically, in this embodiment, since the tray device 2 is a rectangular structure, four tray suction nozzle bodies are provided, and the four tray suction nozzle bodies are distributed in a rectangular shape on their corresponding suction nozzle fixing plates 372, and each tray suction nozzle body can suck a side of the tray 100 correspondingly, ensuring a strong suction of the tray 100, and thus the smooth progress of the transfer process; in addition, in this embodiment, the material taking suction nozzle body and the material unloading suction nozzle body are both provided as one, and are respectively fixed on the corresponding suction nozzle fixing plates 372, and driven to rise and fall by the corresponding suction nozzle cylinder. Optionally, at least two second guide through holes are provided on each suction nozzle fixing plate 372 to achieve the guidance of the corresponding suction nozzle body 373.

[0068] Optionally, in this embodiment, protective covers are provided on the outer sides of the first driving wheel 332, the first driven wheel 333, the second driving wheel 342 and the second driven wheel 343 to maintain the beauty of the entire testing machine and prevent people from touching the driving components. Figure 7 Two second photoelectric switches 312 are provided on the first substrate 31, and the two second photoelectric switches 312 are spaced apart along the first direction, and their positions respectively represent the two extreme positions that the suction nozzle assembly 37 can reach along the first direction. Correspondingly, a second shading plate is provided on the first fixed plate 3351. When the first conveyor belt 334 drives the first fixed plate 3351 to move along the first direction, the second shading plate can be located at the transmitting end and the receiving end of the second photoelectric switch 312 to generate a signal that the suction nozzle assembly 37 moves to that position and transmit it to the electronic control device. Similarly, two third photoelectric switches 322 are also spaced apart on the second base body 32 and are located beside the second slide rail 321, respectively representing the two extreme positions that the nozzle assembly 37 can reach along the second direction; accordingly, a third light shielding plate is provided on the second slider 36. When the second conveyor belt 344 drives the second slider 36 to move along the second direction, the third light shielding plate can be located at the transmitting end and the receiving end of the third photoelectric switch 322 to generate a signal that the nozzle assembly 37 moves to that position and transmit it to the electronic control device.

[0069] Embodiment 4

[0070] This embodiment provides a test device 4 that can be used in the wafer automatic tester in the first embodiment to complete the test of the wafer. Fig.10 and Fig.11 The test device 4 includes a support mechanism 41, a lifting mechanism 42, a test bench assembly 43 and a test board assembly 44. The support mechanism 41 plays a role in supporting the entire test device 4; the test bench assembly 43 includes a test bench 431 for placing the wafer to be tested; the test board assembly 44 includes a test board 441. The lifting mechanism 42 is used to drive the test bench 431 to rise and fall, so that the wafer to be tested placed thereon contacts with the test board 441 to complete the test. Further, the test device 4 can output the test results to the electronic control device, which determines the classification level of the wafer according to the test results and transmits a signal to the transfer device 3. The transfer device 3 transfers the wafer after the test to the tray 100 of the corresponding classification tray device according to the signal instruction.

[0071] Furthermore, the test bench assembly 43 also includes a carrier 432, and the test bench 431 is arranged on the upper part of the carrier 432. The upper surface of the test bench 431 is provided with a test plane, and the wafer is placed on the test plane. Since the position of the test board 441 remains relatively fixed during the test process, in order to ensure that the wafer is in full contact with the test board 441 each time, the placement position of each wafer to be tested on the test plane should remain fixed. In order to solve the above problem, refer to Fig.12The test bench assembly 43 also includes a positioning bar 433 disposed on the test plane and a pushing structure 434 disposed on the test bench 431. The positioning bar 433 is protruding from the test plane. After the wafer to be tested is placed on the test plane, the pushing structure 434 can push the wafer to be tested until it abuts against the side wall of the positioning bar 433, thereby completing the positioning of the wafer to be tested. Furthermore, the shape structure of the wafer to be tested is adapted to the shape structure surrounded by the side wall of the positioning bar 433, so as to ensure that the wafer fully abuts against the side wall of the positioning bar 433 and maintain the stability of the wafer position. Optionally, in this embodiment, the wafer is set to a regular rectangular structure, so a first positioning bar 433 and a second positioning bar 433 perpendicular to each other can be provided on the test plane, both of which protrude a certain height from the test plane, and one end of the first positioning bar 433 abuts against the side wall of the second positioning bar 433, so that the first positioning bar 433 and the side wall of the second positioning bar 433 form a right angle structure; when the wafer is placed on the test plane, the pushing structure 434 is used to repeatedly push the wafer to be tested so that its two perpendicular sides can abut against the side walls of the first positioning bar 433 and the second positioning bar 433 respectively, and the wafer to be tested reaches a fixed position, and the wafer to be tested at this position can fully contact the test board 441 after rising, so as to ensure the smooth progress of the test. Further, the first positioning bar 433 extends along the fourth direction, and the second positioning bar 433 extends along the fifth direction, and the fifth direction is perpendicular to the fourth direction. In this embodiment, the fourth direction and the fifth direction are both parallel to the horizontal plane.

[0072] Specifically, refer again to Fig.12The pushing structure 434 includes a pushing cylinder 4341, a pushing plate 4342 connected to the output end of the pushing cylinder 4341, and a plurality of pushing pins 4343 arranged on the pushing plate 4342. The free ends of the pushing pins 4343 can abut against the wafer to be tested placed on the test table 431. In specific implementation, the pushing cylinder 4341 moves, driving the pushing plate 4342 and the pushing pins 4343 thereon to move in a specific direction until the wafer to be tested on the test plane is pushed to abut against the side wall of the positioning bar 433. Optionally, in order to increase the accuracy of the pushing direction, the pushing structure 434 also includes a third guide rod 4344 arranged on the test table 431 and a third guide through hole arranged on the pushing plate 4342. The third guide rod 4344 is arranged in the third guide through hole to realize the sliding guide of the pushing plate 4342. Optionally, a third guide sleeve is arranged in the third guide through hole to ensure the smoothness of the relative sliding of the third guide rod 4344. Further, the pushing structure 434 includes two, namely, a first pushing structure and a second pushing structure, which are used to push the wafer to be tested along the fourth direction and along the fifth direction respectively. Therefore, the pushing directions of the pushing cylinders 4341 of the first pushing structure and the second pushing structure are respectively consistent with the fourth direction and the fifth direction, and the extending directions of the pushing pins 4343 and the third guide rods 4344 are also consistent with the pushing direction. Optionally, in this embodiment, the test bench 431 is a rectangular parallelepiped structure, and the first pushing structure and the second pushing structure are respectively arranged on two sides of the test bench 431 that are perpendicular to each other. Further optionally, in order to ensure the stability of the pushing pin 4343 moving along the fourth direction or the fifth direction, a pin groove can be provided on the test plane, and the pin groove extends along the fourth direction or the fifth direction. The pushing pin 4343 is arranged in the pin groove, which further limits the displacement of the pushing pin 4343 and ensures that the pushing pin 4343 can move along a specific direction; the pushing pin 4343 is arranged to protrude a certain height from the test plane to contact with the wafer to be tested to complete the pushing. Optionally, depending on the size of the wafer, the number of the pushing pins 4343 of each pushing structure 434 may be two, three or more, so as to achieve the effect of fully contacting the wafer and evenly pushing the wafer.

[0073] refer to Fig.11 and 13The support mechanism 41 includes a support top plate 411 and a support bottom plate 412 which are parallel to each other and spaced apart, and a support vertical plate 413 which is vertically arranged between the support top plate 411 and the support bottom plate 412. The support bottom plate 412 is connected to the bearing plate 14. The test plate assembly 44 is arranged on the support top plate 411, and the test bench assembly 43 is arranged between the support top plate 411 and the support bottom plate 412. Further, in order to improve the stability of the support mechanism 41, a support support plate 414 which is parallel to the support bottom plate 412 is also arranged on the support vertical plate 413, and the support support plate 414 is connected to the support bottom plate 412 by a support rod 415 to strengthen the supporting function of the support mechanism 41. Optionally, the test bench assembly 43 and the support rod 415 are respectively arranged on the different sides of the support vertical plate 413, which can prevent the interference between the support rod 415 and the test bench assembly 43 and further improve the stability of the support vertical plate 413.

[0074] refer to Fig.10 and Fig.13 , the lifting mechanism 42 includes a lifting drive source 421 and a first connecting plate 422 connected to the output end of the lifting drive source 421, the first connecting plate 422 is connected to the carrier 432 of the test bench assembly 43 through the second connecting plate 49, and the lifting drive source 421 drives the first connecting plate 422, the second connecting plate 49 and the carrier 432 to lift and lower along the third direction, so as to achieve the approach and distance between the test bench assembly 43 and the test board assembly 44. In this embodiment, the third direction is a vertical direction, which is perpendicular to the horizontal plane and can be understood as the Z axis in the rectangular coordinate system. Optionally, the lifting drive source 421 adopts a rodless cylinder, the main body of the rodless cylinder is fixed on the supporting vertical plate 413, and the lifting slider of the rodless cylinder is connected to the first connecting plate 422, and the lifting slider drives the first connecting plate 422 to move. In some other embodiments, the lifting drive source 421 can also adopt a screw nut lifting structure or a gear rack lifting structure. Furthermore, the lifting mechanism 42 and the test bench assembly 43 are arranged on the opposite sides of the support vertical plate 413, that is, the lifting mechanism 42 is arranged between the support support plate 414 and the support bottom plate 412, so that the lifting mechanism 42 will not interfere with the movement of the test bench assembly 43. Optionally, two second connecting plates 49 are provided, and the two second connecting plates 49 are symmetrically distributed relative to the support vertical plate 413, so that the test bench assembly 43 is lifted and lowered evenly. Optionally, refer to Fig.13In order to prevent the test bench assembly 43 from rising or falling beyond the preset range and causing damage to the device, two fourth photoelectric switches 4131 are respectively arranged at the upper and lower parts of the support vertical plate 413, respectively representing the limit positions of the test bench 431 that can rise and fall, and a fourth light shielding plate 361 is arranged on the second connecting plate 49. When the second connecting plate 49 drives the test bench assembly 43 to rise and fall until the fourth light shielding plate 361 is located between the transmitting end and the receiving end of the fourth photoelectric switch 4131, the fourth photoelectric switch 4131 is triggered to generate a signal to prevent the test bench 431 from further rising and falling. Furthermore, in order to buffer the impact of the test board 441 contacting the wafer, a buffer structure 45 is respectively arranged at the upper and lower parts of the first connecting plate 422. When the first connecting plate 422 is about to rise or fall to the limit position, the buffer structure 45 can contact the supporting bottom plate 412 or the supporting top plate 411 to play a buffering effect. Optionally, the buffer structure 45 includes a buffer connection block 451 and a buffer 452 vertically arranged on the buffer connection block 451, and the buffer connection block 451 is connected to the first connection plate 422. Optionally, the second connection plate 49 can be directly connected to the buffer connection block 451 to achieve the synchronous driving of the buffer 452 and the test bench assembly 43 by the first connection plate 422. In this embodiment, the buffer 452 is selected to use the ACA-1007 oil pressure buffer of AirTac.

[0075] Furthermore, in order to improve the accuracy of the lifting mechanism 42 driving the test bench 431 to lift along the third direction, a linear guide structure 46 is further provided between the test bench assembly 43 and the support vertical plate 413. Fig.10 , 11 15, the linear guide structure 46 includes a third slider 461 disposed on the carrier 432 and a third slide rail 462 disposed on the support vertical plate 413, the third slide rail 462 extends along the third direction, and the third slider 461 is slidably disposed on the third slide rail 462 to achieve sliding guidance of the test bench assembly 43 in the third direction. Optionally, the carrier 432 and the third slider 461 are connected by a third connecting plate, and the third connecting plate is vertically connected to the second connecting plate 49 to improve the stability of the lifting and lowering of the test bench 431.

[0076] Specifically, refer to Fig.11The test board assembly 44 also includes a pressure plate 442 disposed below the support top plate 411. Two pressure plates 442 are provided, and are respectively disposed on both sides of the support top plate 411 along the length direction. A spring plate 443 is disposed below each pressure plate 442. The spring plate 443 clamps the test board 441 between the pressure plate 442 and the spring plate 443 by its own elastic force. The pressure plate 442 has a certain thickness, so that a gap is provided between the test board 441 and the support top plate 411 to buffer the impact when the wafer contacts the test board 441, so as to achieve uniform and sufficient contact between the wafer and the test board 441. Optionally, a limit stopper 444 is also provided on the side of the support top plate 411 to limit the installation of the test board 441.

[0077] In order to improve the test accuracy, the test table 431 needs to be calibrated and adjusted before each use, so that the pre-placed position of the wafer to be tested on the test plane can correspond to the test board 441 as much as possible, and the wafer to be tested can be fully contacted with the test board 441 after the test table 431 is raised. Fig.10 , 14 15, the test device 4 includes an angle adjustment mechanism 40, which includes a rotating table 401 rotatably arranged on a carrier 432, the rotating table 401 and the carrier 432 are rotatably connected through a bearing structure, and the test table 431 is arranged on the upper part of the rotating table 401, and the test table 431 can rotate relative to the carrier 432 with the rotating table 401 to adjust the angle of the test table 431 in the horizontal plane. Further, the angle adjustment mechanism 40 also includes an adjustment column 403 vertically arranged at the bottom of the rotating table 401, the adjustment column 403 vertically penetrates the entire carrier 432 and is rotatably connected with the carrier 432 through the above-mentioned bearing structure, and the adjustment column 403 can be a cylindrical structure; an adjustment rod 404 is arranged at the bottom of the adjustment column 403, and the adjustment rod 404 is pushed so that it can drive the adjustment column 403 and the rotating table 401 to rotate, which is convenient for the staff to operate. Furthermore, the axis of the adjusting rod 404 is perpendicular to the axis of the adjusting column 403, so that the adjusting column 403 and the rotating table 401 can be pushed to rotate with a relatively small thrust. Optionally, the adjusting rod 404 is vertically arranged to penetrate the entire adjusting column 403, so as to increase the action area between the adjusting rod 404 and the adjusting column 403, so that the pushing of the adjusting column 403 by the adjusting rod 404 is more convenient and labor-saving. Furthermore, in order to make the angle adjustment of the test bench 431 within a certain range and avoid excessive deflection of the test bench 431, an adjusting block 402 is provided on the side of the carrier 432, and a strip groove 4021 is provided on the side wall of the adjusting block 402 close to the adjusting column 403 (see for details). Fig.14), the extension direction of the strip groove 4021 is located in the horizontal plane, and the free end of the adjusting rod 404 is arranged in the strip groove 4021. The free end of the adjusting rod 404 is located at different positions in the strip groove 4021, and the adjusting column 403 and the rotating workbench 401 rotate at different angles until the free end of the adjusting rod 404 abuts against the groove wall at the end of the strip groove 4021, thereby blocking the further movement of the adjusting rod 404, so that the rotating workbench 401 can be adjusted in a limited angle range to avoid the occurrence of over-adjustment. Furthermore, in order to quantify the angle adjustment, a first spiral differential head 405 is provided on the adjustment block 402. The measuring rod of the first spiral differential head 405 extends into the adjustment block 402 and abuts against the side wall of the adjustment rod 404. The fine-tuning knob of the first spiral differential head 405 is rotated to change the extension length of the measuring rod, thereby driving the adjustment rod 404 to move in the strip groove 4021. The adjustment angle of the adjustment rod 404 can be understood through the reading of the first spiral differential head 405, thereby quantifying the angle adjustment. Furthermore, the measuring rod of the first spiral differential head 405 is vertically abutted against the adjustment rod 404. Furthermore, a first locking bolt 406 is also provided on the adjustment block 402. After the angle adjustment is completed, the first locking bolt 406 locks the adjustment rod 404 to restrict it from moving further and keep the angle of the test bench 431 fixed. Optionally, an external thread is also provided on the side wall of the adjusting column 403 located between the lower part of the carrier 432 and the upper part of the adjusting rod 404, and the locking nut 407 locks the adjusting column 403 and the bearing structure through a threaded connection to ensure that the adjusting column 403 can drive the rotating workbench 401 to rotate on the same horizontal plane without deviation.

[0078] Further, refer to Fig.10 , 11and 12, the test device 4 also includes a displacement adjustment mechanism 47, the displacement adjustment mechanism 47 includes a cross-guide displacement platform 471 disposed between the rotating workbench 401 and the test bench 431, the cross-guide displacement platform 471 is disposed as a whole on the rotating workbench 401, and can rotate synchronously with the rotating workbench 401; the loading surface of the cross-guide displacement platform 471 is connected to the bottom surface of the test bench 431, thereby driving the test bench assembly 43 as a whole to move synchronously with the loading surface. Optionally, the cross-guide displacement platform 471 in this embodiment is mainly used to realize the displacement of the test bench 431 along the fourth direction and the fifth direction, so the second spiral differential 472 head and the second spiral differential 472 head are respectively disposed on the two mutually perpendicular side walls of the cross-guide displacement platform 471 to realize the quantification of the displacement of the test bench 431 in two directions. Furthermore, a second locking bolt 473 and a third locking bolt are respectively provided on two mutually perpendicular side walls of the cross-guide displacement platform 471. After the test bench 431 is adjusted to the correct position under the adjustment of the cross-guide displacement platform 471, the second locking bolt 473 and the third locking bolt are used to lock the loading surface of the cross-guide displacement platform 471 so that it can no longer move.

[0079] By setting the above-mentioned angle adjustment mechanism 40 and displacement adjustment mechanism 47, the test table 431 can be rotated in the horizontal plane, and displacement adjustment can be performed in the fourth direction and the fifth direction, so that the test plate 441 corresponds to the wafer to be tested. However, in the third direction, due to the different thicknesses between different wafers and different test plates 441, before mass testing, it is necessary to calibrate and adjust the height between the support top plate 411 and the support bottom plate 412 of the test device 4 to ensure that the wafer to be tested can always be fully in contact with the test plate 441 under the lifting and driving of the lifting mechanism 42 at a specific lifting distance in a cycle. Therefore, the test device 4 also includes a height adjustment mechanism 48, reference Fig.10 and Fig.14The height adjustment mechanism 48 includes a third spiral differential head 481 disposed on the support top plate 411. The measuring rod of the third spiral differential head 481 extends along the third direction, and after passing through the support top plate 411, it abuts against the top surface of the support vertical plate 413. The fine-tuning knob of the third spiral differential head 481 is rotated to change the extension length of the measuring rod, thereby driving the support top plate 411 to approach or move away from the support bottom plate 412 along the third direction, thereby changing the distance between the test plate 441 and the test table 431 disposed on the support top plate 411, until it can be ensured that the wafer to be tested can fully contact the test plate 441 under a specific lifting displacement. Furthermore, the support top plate 411 and the support vertical plate 413 are slidably connected by a cross guide rail structure 482, and the cross guide rail structure 482 can realize high-precision and smooth linear motion of the support top plate 411 relative to the support vertical plate 413, thereby improving the accuracy of the movement of the support top plate 411 along the third direction. Furthermore, the cross guide rail structure 482 includes a fourth slide rail provided on the support vertical plate 413 and a fourth slider provided on the support top plate 411, and the fourth slide rail extends along the third direction to realize the guidance of the support top plate 411 in the third direction. Optionally, two cross guide rail structures 482 are provided, and are respectively arranged on both sides of the support top plate 411. Furthermore, the height adjustment mechanism 48 also includes a fourth locking bolt 483, which locks the cross guide rail structure 482 after the height adjustment of the support top plate 411 is completed to prevent the fourth slider and the fourth slide rail from sliding relative to each other again.

[0080] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A testing device, comprising a testing bench assembly (43), wherein the testing bench assembly (43) comprises a testing bench (431), characterized in that: The test bench (431) is provided on the upper part of the rotary workbench (401), and a test plane is provided on the upper surface of the test bench (431); an adjusting column (403) is provided at the bottom of the rotary workbench (401), and the adjusting column (403) passes through the carrier (432) and is rotatably connected to the carrier (432); an adjusting rod (404) is provided at the bottom of the adjusting column (403) to push the adjusting rod (404) to move ...3) to move the adjusting rod (403) to move the adjusting rod (403) to move the adjusting rod (404) to move the adjusting rod (403) to move the adjusting rod (404) to move the adjusting rod (403) to move the adjusting rod (403) to move the adjusting rod (403) to move the adjusting rod (403) to move the adjusting rod (404) An adjusting rod (404), wherein the adjusting rod (404) can drive the adjusting column (403) and the rotating worktable (401) to rotate; the test table assembly (43) further comprises a positioning bar (433) arranged on the test plane and a pushing structure (434) arranged on the test table (431), wherein the positioning bar (433) is arranged to protrude from the test plane, and after the wafer to be tested is placed on the test plane, the pushing structure (434) can push the wafer to be tested until it abuts against the side wall of the positioning bar (433); The testing device further comprises a lifting mechanism (42) and a supporting mechanism (41), wherein the supporting mechanism (41) comprises a supporting top plate (411) and a supporting bottom plate (412) which are parallel to each other and spaced apart, and a supporting vertical plate (413) arranged between the supporting top plate (411) and the supporting bottom plate (412), wherein the carrier (432) is arranged between the supporting top plate (411) and the supporting bottom plate (412), and the lifting mechanism (42) is configured to be able to drive the carrier (432) to approach or move away from the supporting top plate (411); The test device further comprises a test plate assembly (44), wherein the test plate assembly (44) comprises a test plate (441) and a pressure plate (442) arranged below the support top plate (411), wherein two pressure plates (442) are arranged and are respectively arranged on both sides of the support top plate (411) along the length direction, and a spring plate (443) is arranged below each of the pressure plates (442), wherein the spring plate (443) clamps the test plate (441) between the pressure plate (442) and the spring plate (443) by its own elastic force; the position of the test plate (441) remains relatively fixed during the test; and the test device further comprises a height adjustment mechanism (48), wherein the height adjustment mechanism (48) is configured to be able to adjust the height of the support top plate (411) relative to the support bottom plate (412); The height adjustment mechanism (48) includes a third spiral differential head (481) disposed on the support top plate (411); a measuring rod of the third spiral differential head (481) passes through the support top plate (411) and abuts against the top surface of the support vertical plate (413); the fine-tuning knob of the third spiral differential head (481) is rotated to change the extension length of the measuring rod of the third spiral differential head (481), thereby driving the support top plate (411) to move closer to or farther from the support bottom plate (412).

2. The testing device according to claim 1, characterized in that: The axis of the adjusting rod (404) is perpendicular to the axis of the adjusting column (403).

3. The testing device according to claim 2, characterized in that: The adjusting rod (404) is configured to vertically penetrate the adjusting column (403).

4. The testing device according to claim 1, characterized in that: An adjusting block (402) is provided on the side of the carrier (432), a strip groove (4021) is provided on one side of the adjusting block (402) close to the adjusting column (403), and a free end of the adjusting rod (404) is arranged in the strip groove (4021).

5. The testing device according to claim 4, characterized in that: The adjusting block (402) is also provided with a first spiral differential head (405), the measuring rod of the first spiral differential head (405) can extend into the adjusting block (402) and abut against the adjusting rod (404), and the fine adjustment knob of the first spiral differential head (405) is rotated to change the extension length of the measuring rod of the first spiral differential head (405), thereby driving the adjusting rod (404) to move in the strip groove (4021).

6. The testing device according to claim 4, characterized in that: The adjusting block (402) is also provided with a first locking bolt (406), and the first locking bolt (406) is configured to lock the adjusting rod (404).

7. A wafer automatic tester, characterized in that: A testing device comprising any one of claims 1 to 6.

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