A test module and a test device

Abstract

The present invention discloses a test module and a test device. The test module includes an upper needle plate assembly and a lower needle plate assembly. The lower needle plate assembly includes a bottom plate and a carrier plate, the carrier plate is provided with a placement position for placing a test plate, the carrier plate is slidably connected to the bottom plate, and the carrier plate can slide into and out of the feed port of the test device relative to the bottom plate. The upper needle plate assembly is located above the lower needle plate assembly, and is used to test the test plate located on the lower needle plate assembly. The upper needle plate assembly can move up and down relative to the carrier plate. By setting the test module to the above-mentioned drawer-type sliding mode, the work efficiency can be improved and the operation of the test device can be made more convenient.

Description

Technical Field

[0001] The invention relates to the field of testing, and in particular to a testing module and testing equipment. Background Art

[0002] In the manufacture of electronic equipment, a large number of PCB boards are needed. For example, in the communication equipment industry, a large number of PCB boards with power amplification functions are needed. In order to ensure the reliability of the equipment, the manufactured PCB boards need to be tested to ensure the quality of the PCB boards. The existing testing equipment is inefficient and inconvenient to use when testing PCB boards. Summary of the invention

[0003] To solve the problem of inconvenient testing, a testing module and a testing device are provided.

[0004] The present application provides a test module. The test module includes an upper needle plate assembly and a lower needle plate assembly. The lower needle plate assembly includes a bottom plate and a carrier plate, the carrier plate is provided with a placement position for placing a test plate, the carrier plate is slidably connected to the bottom plate, and the carrier plate can slide into and out of the feed port of the test device relative to the bottom plate; the upper needle plate assembly is located above the lower needle plate assembly and is used to test the test plate located on the lower needle plate assembly, and the upper needle plate assembly can move up and down relative to the carrier plate.

[0005] Preferably, a guide rail and a first driving member are provided on the bottom plate, the carrier plate is slidably disposed on the guide rail, and the first driving member is used to push the carrier plate to slide along the guide rail into and out of the feed port of the testing device.

[0006] Preferably, the lower needle plate assembly includes a heat dissipation device, which is fixed to the bottom plate, and is located between the carrier plate and the bottom plate after sliding into the feed port.

[0007] Preferably, it also includes a guiding device, which connects the upper needle plate assembly and the bottom plate, and is used for the upper needle plate assembly to move up and down.

[0008] Preferably, the guiding device includes a connecting column and a second driving member, one end of the connecting column is fixed to the base plate, and the connecting column passes through the upper needle plate assembly, and the second driving member is used to drive the upper needle plate assembly to slide along the connecting column.

[0009] Preferably, the upper needle plate assembly includes a RF head test component, a third drive component and a mounting plate, a mounting bracket is fixed to the side of the mounting plate facing away from the base plate, the third drive component is fixed to the mounting bracket, the RF head test component is connected to the third drive component, and a through hole is provided on the mounting plate, which is opposite to the RF head of the RF head test component, and the third drive component can drive the RF head test component to reciprocate up and down so that the RF head passes through the through hole.

[0010] Preferably, it also includes a collection plate, which is located on the side of the mounting plate facing away from the base plate, at least two of the RF head test components are fixed on the collection plate, and the collection plate is connected to the third driving member, and the third driving member can drive the collection plate to reciprocate up and down.

[0011] Preferably, the RF head test component includes a base, a RF head and an elastic member, the base is fixed to the assembly plate, two ends of the RF head pass through the assembly plate and the base respectively, and can move up and down within a range jointly limited by the assembly plate and the base, and the elastic member is connected to the RF head to cushion the upward movement of the RF head.

[0012] Preferably, the base also includes a pedestal and a sliding plate, the pedestal has a sliding groove, and one side of the pedestal with a slot is fixed to the plate surface of the assembly plate facing away from the mounting plate, the RF head passes through the bottom of the sliding groove, and a guide column is protruding from the bottom of the sliding groove toward the slot; the sliding plate is located in the sliding groove, the RF head and the guide column pass through the sliding plate, the elastic member is sleeved on the guide column, the RF head can be extended and retracted within the range of the sliding groove, and when the RF head retracts, it drives the sliding plate to slide toward the bottom of the sliding groove and compresses the elastic member.

[0013] The present application also provides a testing device, which includes a frame and the testing module as described above, wherein the testing module is installed in the frame, a feeding port is provided on the frame, and a carrier plate of the testing module can slide into and out of the feeding port.

[0014] By setting the test module as the above-mentioned sliding drawer to replace the PCB board to be tested, there is no need to open the test equipment when replacing it. It is only necessary to slide the carrier board out of the feed port, which makes the replacement of PCB boards very convenient and improves work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of an embodiment of a testing device of the present application;

[0016] Figure 2 for Figure 1A schematic diagram of a state of the test device shown in;

[0017] Figure 3 for Figure 2 A schematic diagram showing an upper mold assembly and a lower mold assembly of a test module in a separated state;

[0018] Figure 4 for Figure 3 A schematic diagram of the upper mold assembly in one state shown in FIG.

[0019] Figure 5 for Figure 4 Schematic diagram of the radio head test components shown in .

[0020] Description of reference numerals: test module 10 upper needle plate assembly 100 mounting plate 110 third cylinder 120 RF head test component 130 base 131 pedestal 1311 slide groove 1315 guide column 1312 groove bottom 1313 notch 1314 RF head 132 blocking portion 1321 elastic member 133 sliding plate 134 mounting bracket 140 assembly plate 150 connecting plate 160 test needle 170 lower needle plate assembly 200 bottom plate 210 guide rail 211 first cylinder 212 carrier plate 220 heat dissipation device 230 guide device 240 connecting column 241 second cylinder 242 test equipment 20 frame 21 main body 23 upper cover 24 feeding port 22 PCB board 30

[0021] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0024] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0025] like Figures 1 to 3 As shown, the present application discloses a test device 20. The test device 20 is used to test a PCB board. The test device 20 includes a frame 21 and a test module 10, the test module 10 is installed in the frame 21, and a feed port 22 is provided on the frame 21. The test module 10 includes a lower needle plate assembly 200 and an upper needle plate assembly 100. The lower needle plate assembly 200 includes a bottom plate 210 and a carrier plate 220, and a placement position for placing a test board (the PCB board 30 is used as an example in this embodiment) is provided on the carrier plate 220, and the carrier plate 220 is slidably connected to the bottom plate 210, and the carrier plate 220 can slide into and out of the feed port 22 of the test device 20 relative to the bottom plate 210. The upper needle plate assembly 100 is located above the lower needle plate assembly 200, and is used to test the test board located on the lower needle plate assembly 200, and the upper needle plate assembly 100 can move up and down relative to the carrier plate 220.

[0026] For ease of explanation and understanding, Figure 1 A rectangular coordinate system is established as shown in the figure. The frame 21 includes a main body 23 and an upper cover 24. The test module 10 is installed on the main body 23. The upper cover 24 is used to cover the test module 10. The feed port 22 is located on the upper cover 24. At the same time, a computer and other related electrical components for testing are also installed in the main body 23.

[0027] The placement position on the carrier 220 for placing the PCB board 30 refers to the position where the PCB board 30 can be stably located. In an embodiment, a placement slot is set at this position, and the PCB board 30 is placed in the placement slot when it needs to be tested; or a fixture can be set at this position, and the PCB board 30 is fixed at this position by the fixture. Through the above arrangement, when the PCB board 30 needs to be tested, the carrier 220 slides forward and slides out of the feed port 22, and the PCB board 30 to be tested can be placed in the placement slot. Then the carrier 220 slides backward and slides into the feed port 22. At this time, the carrier 220 is located below the upper needle plate assembly 100, and the upper needle plate assembly 100 moves downward until it moves to a preset position, and the upper needle plate assembly 100 can test the PCB board 30 assembly on the carrier 220. After the test is completed, the upper needle plate assembly 100 moves upward, and the carrier 220 slides out of the feed port 22, and the PCB board 30 to be tested is replaced. By setting the test module 10 as the above-mentioned sliding drawer to replace the PCB board 30 to be tested, there is no need to open the test equipment 20 when replacing it. It is only necessary to slide the carrier board 220 out of the feed port 22, making the replacement of the PCB board 30 very convenient and improving work efficiency.

[0028] The bottom plate 210 is provided with a guide rail 211 and a first driving member, the carrier plate 220 is slidably disposed on the guide rail 211, and the first driving member is used to push the carrier plate 220 to slide in and out of the feed port 22 of the test device 20 along the guide rail 211. Specifically, the upper surface of the bottom plate 210 is provided with a guide rail 211 extending in the front-to-back direction, and the carrier plate 220 is slidably disposed on the guide rail 211, so that the carrier plate 220 can slide forward and backward relative to the bottom plate 210 to slide in and out of the feed port 22. Among them, the first driving member includes a first cylinder 212, which is fixed to the rear side of the bottom plate 210 and drives the carrier plate 220 to slide forward and backward along the guide rail 211.

[0029] The lower needle plate assembly 200 includes a heat sink 230, which is fixed on the carrier 220 and is located between the carrier 220 and the bottom plate 210 after the carrier 220 slides into the feed port 22. After the carrier 220 slides into the feed port 22, the heat sink 230 is located below the carrier 220. The bottom of the placement slot is hollow, so that the PCB board 30 on the carrier 220 is directly opposite to the heat sink 230, and the two are close to each other. When the PCB board 30 is tested, the PCB board 30 will emit a lot of heat. The heat sink 230 can quickly guide the upper heat of the PCB board 30 to avoid the PCB board 30 from being overheated.

[0030] It also includes a guide device 240, which connects the upper needle plate assembly 100 and the bottom plate 210, and the guide device 240 is used to move the upper needle plate assembly 100 up and down. The upper needle plate assembly 100 is moved up and down by the guide device 240. Among them, the guide device 240 includes a guide column 1312 and a second driving member, one end of the guide column 1312 is fixed on the bottom plate 210, and the guide column 1312 is penetrated by the upper needle plate assembly 100, and the second driving member is used to drive the upper needle plate assembly 100 to slide along the guide column 1312. In this embodiment, there are 4 guide columns 1312, which are evenly distributed on the four corners of the bottom plate 210, so that the upper needle plate assembly 100 can slide up and down stably along the guide column 1312. The second driving member includes two sets of second cylinders 242, which are fixed on the left and right sides of the base plate 210, and the two second cylinders 242 are connected to the upper needle plate assembly 100. The upper needle plate assembly 100 is driven by the two second cylinders 242 to slide up and down stably along the guide column 1312.

[0031] The upper needle plate assembly 100 includes an RF head test component 130, a third drive member and a mounting plate 110. A mounting bracket 140 is fixed to the side of the mounting plate 110 facing away from the base plate 210. The third drive member is fixed to the mounting bracket 140. The RF head test component 130 is connected to the third drive member. A through hole (not shown in the figure) is provided on the mounting plate 110, which is opposite to the RF head 132 of the RF head test component 130. The third drive member can drive the RF head test component 130 to reciprocate up and down so that the RF head 132 passes through the through hole.

[0032] The side of the mounting plate 110 facing away from the base plate 210 is the upper side of the mounting plate 110. The third driving member includes a third cylinder 120 and a connecting plate 160, and the third cylinder 120 is fixed on the connecting plate 160. The mounting bracket 140 is located on the upper surface of the mounting plate 110. When assembling the upper needle plate assembly 100, the RF head test component 130 can be connected to the third cylinder 120 first, and then the third cylinder 120 can be connected to the connecting plate 160, so that the RF head test component 130, the third cylinder 120 and the connecting plate 160 form a whole, and then the whole is fixed to the mounting bracket 140, so that the third cylinder 120 and the RF head test component 130 can be installed on the mounting plate 110. This modular installation method can make the installation of the upper needle plate assembly 100 more convenient. Among them, the connecting plate 160 is located above the third cylinder 120, and the RF head test component 130 is located below the third cylinder 120. The third cylinder 120 drives the RF head test component 130 to move up and down, so that the RF head 132 of the RF head test component 130 can pass through the through hole through the mounting plate 110 to expose a part, so that when the upper needle plate assembly 100 moves downward to a certain position, the RF head 132 abuts against the PCB board 30 on the carrier board 220, and then tests the PCB board 30. The upper needle plate assembly 100 also includes a test needle 170 and a shielding plate (not shown in the figure), the test needle 170 is located on the upper plate surface of the mounting plate 110, and the shielding plate is located on the lower plate surface of the mounting plate 110.

[0033] Combination Figure 4 and Figure 5 As shown, the upper needle plate assembly 100 also includes a collection plate 150, which is located on the side of the mounting plate 110 facing away from the bottom plate 210, at least two RF head test components 130 are fixed on the collection plate 150, and the collection plate 150 is connected to the third driving member, and the third driving member can drive the collection plate 150 to reciprocate up and down. In this example, there are multiple RF head test components 130, and the RF head test components 130 are all fixed on the collection plate 150, and the collection plate 150 is installed on the third cylinder 120, so that the third cylinder 120 can drive the multiple RF head test components 130 to move up and down at the same time by driving the collection plate 150 to move up and down. Through the above arrangement, the installation of the upper needle plate assembly 100 is more convenient and the structure is more concise.

[0034] The RF head test component 130 includes a base 131, a RF head 132 and an elastic member 133. The base 131 is fixed on the assembly plate 150. The two ends of the RF head 132 pass through the assembly plate 150 and the base 131 respectively, and can move up and down within a range jointly restricted by the assembly plate 150 and the base 131. The elastic member 133 is connected to the RF head 132 to buffer the upward movement of the RF head 132. The base 131 is fixed on the upper plate surface of the assembly plate 150. The assembly plate 150 and the base 131 are both provided with clearance holes for the two ends of the RF head 132 to pass through respectively. The portion of the RF head 12 located between the clearance holes of the assembly plate 150 and the base 131 has a blocking portion 1321. The blocking portion 1321 is larger than the two clearance holes, so that the RF head 132 can be prevented from sliding out of the assembly plate 150 or the base 131, so that the RF head 132 can move up and down within a range jointly restricted by the two. The elastic member 133 is connected to the RF head 132, so that when the upper needle plate assembly 100 moves downward under the action of the second cylinder 242 to test the PCB board 30, when the RF head 132 abuts against the PCB board 30, due to the action of the elastic member 133, the RF head 132 can retract upward to avoid hard contact between the RF head 132 and the PCB board 30, which is beneficial to protecting the PCB board 30 and the RF head 132.

[0035] Combination Figure 5 As shown, the base 131 also includes a base 1311 and a sliding plate 134. The base 1311 has a sliding groove 1315. The side of the base 1311 with the notch 1314 is fixed to the plate surface of the assembly plate 150 facing away from the mounting plate 110. The RF head 132 passes through the groove bottom 1313 of the sliding groove 1315. The groove bottom 1313 of the sliding groove 1315 is provided with a guide column 1312 protruding toward the notch 1314. The sliding plate 134 is located in the sliding groove 1315. The RF head 132 and the guide column 1312 both pass through the sliding plate 134. The elastic member 133 is sleeved on the guide column 1312. The RF head 132 can be extended and retracted within the range of the sliding groove 1315. When the RF head retracts, it drives the sliding plate 134 to slide toward the groove bottom 1313 of the sliding groove 1315 and compresses the elastic member 133.

[0036] The sliding range of the RF head 132 is between the notch 1314 and the bottom 1313 of the slide groove 1315, and four guide posts 1312 are provided, and the four guide posts 1312 are evenly distributed around, and the elastic member 133 includes a spring. The RF head 132 has a blocking portion 1321, and the blocking portion 1321 is located between the sliding plate 134 and the assembly plate 150. In the process of the RF head 132 moving upward and retracting after abutting against the PCB board 30, the RF head 132 drives the sliding plate 134 to slide upward along the guide post 1312 through the blocking portion 1321, and compresses the spring, which plays a buffering role in the retraction of the RF head 132. The cooperation between the sliding plate 134 and the guide post 1312 can compress the spring more evenly, so that the retraction of the RF head 132 is more stable, and uneven force is avoided.

[0037] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A test module for testing equipment to perform PCB board testing, characterized in that: include: A lower needle plate assembly, comprising a bottom plate and a carrier plate, wherein the carrier plate is provided with a placement position for placing the test plate, the carrier plate is slidably connected to the bottom plate, and the carrier plate can slide into and out of the feed port of the test device relative to the bottom plate; An upper needle plate assembly, located above the lower needle plate assembly, and used for testing the test plate located on the lower needle plate assembly, wherein the upper needle plate assembly can move up and down relative to the carrier plate; The upper needle plate assembly includes a radio frequency head test component, a third driving member and a mounting plate, a mounting bracket is fixed to the side of the mounting plate facing away from the bottom plate, the third driving member is fixed to the mounting bracket, the radio frequency head test component is connected to the third driving member, a through hole is provided on the mounting plate facing the radio frequency head of the radio frequency head test component, and the third driving member can drive the radio frequency head test component to reciprocate up and down so that the radio frequency head passes through the through hole; It also includes a collection plate, which is located on the side of the mounting plate facing away from the bottom plate, at least two of the radio frequency head test components are fixed on the collection plate, and the collection plate is connected to the third driving member, and the third driving member can drive the collection plate to reciprocate up and down; The RF head test component includes a base, a RF head and an elastic member, wherein the base is fixed to the assembly plate, two ends of the RF head pass through the assembly plate and the base respectively, and can move up and down within a range jointly limited by the assembly plate and the base, and the elastic member is connected to the RF head to buffer the upward movement of the RF head; The base also includes a base and a sliding plate, the base has a slide groove, the side of the base with a notch is fixed to the plate surface of the assembly plate facing away from the mounting plate, the radio frequency head passes through the bottom of the slide groove, and the bottom of the slide groove is protruded with a guide column toward the notch; The sliding plate is located in the slide groove, the RF head and the guide column pass through the sliding plate, the elastic member is sleeved on the guide column, and the RF head can be extended and retracted within the range of the slide groove. When the RF head retracts, it drives the sliding plate to slide toward the bottom of the slide groove and compresses the elastic member.

2. The test module according to claim 1, characterized in that: The bottom plate is provided with a guide rail and a first driving member, the carrier plate is slidably arranged on the guide rail, and the first driving member is used for pushing the carrier plate to slide along the guide rail into and out of the feed port of the testing device.

3. The test module according to claim 1, characterized in that: The lower needle plate assembly comprises a heat dissipation device, which is fixed on the bottom plate and is located between the carrier plate and the bottom plate after sliding into the feed port.

4. The test module according to claim 1, characterized in that: It also includes a guiding device, which connects the upper needle plate assembly and the bottom plate, and is used for the upper needle plate assembly to move up and down.

5. The test module according to claim 4, characterized in that: The guiding device includes a connecting column and a second driving member, one end of the connecting column is fixed to the bottom plate, and the connecting column passes through the upper needle plate assembly, and the second driving member is used to drive the upper needle plate assembly to slide along the connecting column.

6. A testing device, characterized in that: The testing device comprises a frame and a testing module as described in any one of claims 1 to 5, wherein the testing module is installed in the frame, a feed port is provided on the frame, and a carrier plate of the testing module can slide in and out of the feed port.

Images