A high temperature resistant graphene heating plate

Abstract

The present invention discloses a high temperature resistant graphene heating plate, comprising a microcrystalline glass plate, a flaky graphene sintered layer and a conductive part. A flaky graphene sintered layer formed by sintering a flaky graphene mixture is integrally arranged on one side of the microcrystalline glass plate, and two groups of conductive parts that do not contact each other are arranged on the surface of the flaky graphene sintered layer. Since the flaky graphene sintered layer fixed on one side of the microcrystalline glass plate after sintering has a stable physical structure, the structure is very stable, and the combination with the microcrystalline glass plate is tighter, and it is not easy to burst at high temperature. Moreover, no glue is used for bonding, and the problem of glue melting will not occur at high temperature. After testing, it is confirmed that the heating temperature of the graphene heating plate produced by this method can be as high as 550 degrees to 600 degrees, which greatly improves the heating temperature of the graphene heating plate compared with the prior art.

Description

Technical Field

[0001] The invention relates to the field of heating plates, in particular to a high-temperature resistant graphene heating plate. Background Art

[0002] Heating plates are a common heating method for heating objects, and graphene is a new heating carrier. By electrifying a graphene sheet, it can generate high temperature. However, due to the high cost of complete graphene sheets, the existing graphene heating plates are made by mixing graphene sheet powder with a specific glue, coating it on a microcrystalline glass plate, and then hardening it. However, there is a serious problem with the graphene heating plates produced by this process. The heating temperature of the graphene heating plate can only be heated to 230-300 degrees. When the temperature exceeds this, the working state of the graphene heating plate is very unstable, the glue will be molten, and the graphene heating plate will easily explode. Summary of the invention

[0003] In order to solve the above technical problems, the object of the present invention is to provide a graphene heating plate that can withstand higher temperatures.

[0004] The technical solution adopted by the present invention to solve the problem is: a high temperature resistant graphene heating plate, comprising:

[0005] A glass-ceramic plate, wherein a flaky graphene sintered layer formed by sintering a flaky graphene mixture is integrally provided on one side of the glass-ceramic plate;

[0006] Two sets of conductive parts are located on the surface of the flaky graphene sintered layer without contacting each other.

[0007] As a further improvement of the above technical solution, a mesh-shaped process groove is provided on the surface of one side of the microcrystalline glass plate corresponding to the flaky graphene sintered layer.

[0008] As a further improvement of the above technical solution, the conductive part is a conductive silver paste, and two groups of conductive silver pastes are symmetrically arranged along two sides of the flaky graphene sintered plate.

[0009] As a further improvement of the above technical solution, the area of ​​the flaky graphene sintered layer is smaller than that of the microcrystalline glass plate, the flaky graphene sintered layer is located in the middle of the microcrystalline glass plate, and the conductive silver paste covers the edge of the flaky graphene sintered layer and the surface of the microcrystalline glass plate at the same time.

[0010] As a further improvement of the above technical solution, the flaky graphene mixture includes 30-50% by mass of flaky graphene, 10-40% of carbon crystal powder, 1-5% of an auxiliary agent, and 1-5% of a catalyst.

[0011] As a further improvement of the above technical solution, a tubular graphene heat-conducting layer is provided on the other surface of the microcrystalline glass plate.

[0012] As a further improvement of the above technical solution, the side of the microcrystalline glass plate corresponding to the tubular graphene thermal conductive layer is a frosted surface.

[0013] As a further improvement of the above technical solution, the tubular graphene heat-conducting layer is composed of 70-90% by mass of high-temperature resistant ink and 10-30% by mass of tubular graphene powder.

[0014] As a further improvement of the above technical solution, the thickness of the tubular graphene heat-conducting layer is 30-50 microns.

[0015] As a further improvement of the above technical solution, the outer sides of the flaky graphene sintered layer and the conductive coating are covered with an insulating layer.

[0016] The beneficial effects of the present invention are as follows: a flaky graphene sintered layer formed by sintering a flaky graphene mixture is integrally provided on one side of the microcrystalline glass plate, and two groups of conductive parts that do not contact each other are provided on the surface of the flaky graphene sintered layer. Since the flaky graphene sintered layer fixed to one side of the microcrystalline glass plate after sintering has a stable physical structure, the structure is very stable, the combination with the microcrystalline glass plate is tighter, and it is not easy to burst at high temperatures. Moreover, no glue is used for bonding, and the problem of glue melting will not occur at high temperatures. After experiments, it is confirmed that the heating temperature of the graphene heating plate produced by this method can be as high as 550 to 600 degrees. Compared with the prior art, the heating temperature of the graphene heating plate is greatly improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention will be further explained below in conjunction with the accompanying drawings and specific implementation methods.

[0018] Figure 1 It is a front structural schematic diagram of a preferred embodiment of the present invention;

[0019] Figure 2 for Figure 1 Schematic diagram of the AA-direction dissection surface structure;

[0020] Figure 3 It is a schematic diagram of the back structure of a preferred embodiment of the present invention;

[0021] Figure 4 This is a schematic diagram of the structure after removing the insulating layer in a preferred embodiment of the present invention;

[0022] Figure 5 Schematic diagram of the structure of a glass-ceramic plate in a preferred embodiment of the present invention. DETAILED DESCRIPTION

[0023] This section will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present invention, but it cannot be understood as a limitation on the scope of protection of the present invention.

[0024] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0025] In the description of the present invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0026] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0027] Reference Figures 1 to 5 , a high temperature resistant graphene heating plate, comprising:

[0028] A glass-ceramic plate 10, wherein a flake graphene sintered layer 20 formed by sintering a flake graphene mixture is integrally provided on one side of the glass-ceramic plate 10, and the actual sintering process is to first coat the graphene mixture on the glass-ceramic plate 10 and then sinter the graphene mixture integrally with the glass-ceramic plate 10, so that the flake graphene sintered layer 20 is more tightly combined with the glass-ceramic plate 10;

[0029] Two groups of conductive parts are located on the surface of the flaky graphene sintered layer 20 without contacting each other.

[0030] Two groups of conductive parts are located on the surface of the flaky graphene sintered layer 20 without contacting each other.

[0031] A flaky graphene sintered layer 20 formed by sintering a flaky graphene mixture is integrally provided on one side of the microcrystalline glass plate 10, and two groups of conductive parts that do not contact each other are provided on the surface of the flaky graphene sintered layer 20. Since the flaky graphene sintered layer 20 fixed to one side of the microcrystalline glass plate 10 after sintering has a stable physical structure, the structure is more stable, and the combination with the microcrystalline glass plate 10 is tighter, and it is not easy to burst at high temperatures. Moreover, no glue is used for bonding, and the problem of glue melting will not occur at high temperatures. After experiments, it is confirmed that the heating temperature of the graphene heating plate produced by this method can be as high as 550 to 600 degrees. Compared with the prior art, the heating temperature of the graphene heating plate is greatly improved.

[0032] Further improvement is made, in order to make the current run more regularly when the sheet-like graphene sintered layer 20 is powered on to generate heat, thereby reducing energy loss, it is preferred that a mesh process groove 11 is provided on the surface of the microcrystalline glass plate 10 corresponding to the sheet-like graphene sintered layer 20. Through the mesh process groove 11, when the sheet-like graphene sintered layer 20 is sintered, a mesh path will be formed thereon, and these mesh paths have a certain difference in thickness from the surrounding graphene sintered layers, so that most of the current can flow along these mesh paths, so that the current flow is more standardized, thereby reducing the unnecessary loss of electric energy.

[0033] As a further improvement, the conductive part is preferably a conductive silver paste 40, and two groups of conductive silver pastes 40 are symmetrically arranged along the two sides of the sheet-like graphene sintered plate. The conductive part can also be a copper wire sintered integrally on the sheet-like graphene sintered plate.

[0034] For further improvement, it is preferred that the area of ​​the flaky graphene sintered layer 20 is smaller than that of the microcrystalline glass plate 10, and the flaky graphene sintered layer 20 is located in the middle of the microcrystalline glass plate 10. At this time, it is preferred that the conductive silver paste 40 covers the edge of the flaky graphene sintered layer 20 and the surface of the microcrystalline glass plate 10 at the same time.

[0035] Further improvement, after experimental analysis, preferably the flake graphene sintered layer 20 includes 30-50% flake graphene, 10-40% carbon crystal powder, 1-5% auxiliary agent, and 1-5% catalyst by mass. At this time, the flake graphene sintered layer 20 formed by sintering is more stable.

[0036] Further improvement, in order to increase the thermal conductivity, preferably a tubular graphene heat conducting layer 30 is provided on the other side of the microcrystalline glass plate 10. Although the tubular graphene has a poor thermodynamic effect, it has a super high thermal conductivity efficiency and can quickly transfer the heat generated by the sheet graphene sintered layer 20 on the other side of the microcrystalline glass plate 10 to the bottom of the cooker. Compared with directly using the microcrystalline glass plate 10 for heat conduction, the heat conduction efficiency is stronger.

[0037] Further improvement is made to increase the adhesion of the tubular graphene heat-conducting layer 30 on the unsintered microcrystalline glass plate 10. Preferably, the side of the microcrystalline glass plate 10 corresponding to the tubular graphene heat-conducting layer 30 is a frosted surface.

[0038] As a further improvement, the tubular graphene heat-conducting layer 30 is preferably composed of 70-90% by mass of high temperature resistant ink and 10-30% by mass of tubular graphene powder.

[0039] As a further improvement, it is preferred that the thickness of the tubular graphene heat-conducting layer 30 is 30-50 microns.

[0040] Further improvement is made, considering the safety performance, preferably, the outside of the flaky graphene sintered layer 20 and the conductive coating is covered with an insulating layer 50. By covering the insulating layer 50, the user cannot directly touch the flaky graphene sintered layer 20 and the conductive coating, thereby increasing the safety factor. Of course, it is not necessary to cover the insulating layer 50 on the outside of the conductive coating and the flaky graphene sintered layer 20. It can also be prevented from contacting the flaky graphene sintered layer 20 and the conductive coating by a structure to prevent electric shock, such as by installing the shell of the graphene heating plate to prevent the user from contacting.

[0041] The above are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural changes made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or directly or indirectly applied in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A high temperature resistant graphene heating plate, characterized in that: include: A glass-ceramic plate (10), wherein a flaky graphene sintered layer (20) formed by sintering a flaky graphene mixture is integrally provided on one side of the glass-ceramic plate (10); Two groups of conductive parts, the two groups of conductive parts are located on the surface of the flaky graphene sintered layer (20) without contacting each other; A mesh-shaped process groove (11) is provided on a surface of one side of the microcrystalline glass plate (10) corresponding to the flake graphene sintered layer (20).

2. A high temperature resistant graphene heating plate as claimed in claim 1, characterized in that: include: The conductive part is a conductive silver paste (40), and two groups of conductive silver pastes (40) are symmetrically arranged along two sides of the sheet-shaped graphene sintered plate.

3. A high temperature resistant graphene heating plate as claimed in claim 2, characterized in that: include: The area of ​​the flaky graphene sintered layer (20) is smaller than that of the microcrystalline glass plate (10); the flaky graphene sintered layer (20) is located in the middle of the microcrystalline glass plate (10); and the conductive silver paste (40) covers the edge of the flaky graphene sintered layer (20) and the surface of the microcrystalline glass plate (10) at the same time.

4. A high temperature resistant graphene heating plate as claimed in claim 1, characterized in that: include: The flaky graphene mixture comprises 30-50% by mass of flaky graphene, 10-40% of carbon crystal powder, 1-5% of an auxiliary agent and 1-5% of a catalyst.

5. A high temperature resistant graphene heating plate as claimed in claim 1, characterized in that: include: A tubular graphene heat-conducting layer (30) is provided on the other surface of the microcrystalline glass plate (10).

6. A high temperature resistant graphene heating plate as claimed in claim 5, characterized in that: include: The side surface of the microcrystalline glass plate (10) corresponding to the tubular graphene heat-conducting layer (30) is a frosted surface.

7. A high temperature resistant graphene heating plate as claimed in claim 5, characterized in that: include: The tubular graphene heat-conducting layer (30) is composed of 70-90% by mass of high-temperature-resistant ink and 10-30% by mass of tubular graphene powder.

8. A high temperature resistant graphene heating plate as claimed in claim 5, characterized in that: include: The thickness of the tubular graphene heat-conducting layer (30) is 30-50 micrometers.

9. A high temperature resistant graphene heating plate as claimed in claim 1, characterized in that: include: The outer sides of the flaky graphene sintered layer (20) and the conductive coating are covered with an insulating layer (50).

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