Wafer plating equipment for wafer wet process equipment

Abstract

The present invention discloses a wafer electroplating device for wafer wet process equipment, comprising a plating tank shell with a cavity for electroplating, wherein the plating tank shell is provided with adjacent and detachable wafer hanger parts and a plating diffusion and shielding part, wherein the wafer hanger part is provided with a single-sided exposure port for exposing one side of the plating surface of the wafer, and the plating diffusion and shielding part is provided with a multi-stage guide surface directly opposite to the single-sided exposure port. The wafer electroplating device for wafer wet process equipment provided by the present invention has a compact overall structural arrangement, a sophisticated internal structure and comprehensive functions, and multiple wafers can be electroplated at the same time through the wafer hanger part, and each wafer is plated on only one side of the surface, and the plating liquid can be fully diffused through the multi-stage guide surface of the plating diffusion and shielding part to ensure that the plating liquid is evenly plated on the wafer to meet the requirement of uniform thickness.

Description

Technical Field

[0001] The invention relates to a wafer electroplating device for wafer wet process equipment. Background Art

[0002] Wafer refers to the silicon chip used in the manufacture of silicon semiconductor integrated circuits. Because of its round shape, it is called a wafer. During manufacturing, a layer of conductive metal needs to be electroplated on the wafer, and the conductive metal layer needs to be processed to form a conductive circuit. During the electroplating process, the electroplating liquid needs to be evenly distributed on the wafer as much as possible. Therefore, an efficient wafer electroplating device for wafer wet process equipment is needed. Summary of the invention

[0003] The purpose of the present invention is to overcome the deficiencies in the prior art and to provide a wafer electroplating device for wafer wet process equipment.

[0004] To achieve the above objectives, the following technical solutions are used:

[0005] A wafer electroplating device for wafer wet process equipment includes a plating tank shell with a plating cavity, wherein the plating tank shell is provided with adjacent and removable wafer hanger parts and plating diffusion and shielding parts, wherein the wafer hanger part is provided with a single-sided exposure port for exposing one side of the plating surface of the wafer, and the plating diffusion and shielding part is provided with a multi-stage guide surface directly opposite to the single-sided exposure port.

[0006] Preferably, a plating liquid pipeline and an inner shell support are provided in the plating tank shell, the plating liquid pipeline is arranged at the bottom of the plating tank shell, the inner shell support is arranged at the bottom and both sides of the plating tank shell, the wafer hanger part and the plating diffusion and shielding part are installed on the inner shell support, and then the plating liquid pipeline sprays the plating liquid from bottom to top to the wafer hanger part.

[0007] Preferably, a plurality of electroplating liquid spray holes for spraying upwards are evenly arranged on the electroplating liquid pipeline.

[0008] Preferably, the electroplating tank shell divides the cavity by a partition to form a middle main cavity and two side secondary cavities. The electroplating liquid pipeline, the wafer hanger part and the electroplating diffusion and shielding part are all installed in the middle main cavity. The bottom of the electroplating tank shell is provided with a plurality of external liquid inlet pipes and liquid discharge pipes. The liquid inlet pipe is connected to the electroplating liquid pipeline, and the liquid discharge pipe is connected to the two side secondary cavities.

[0009] Preferably, a drainage slit is provided on the upper portion of the partition, and the middle main chamber is communicated with the secondary chambers on both sides through the drainage slit.

[0010] Preferably, the support body inside the shell includes a supporting bottom block and a supporting side plate, the supporting bottom block is arranged astride the electroplating liquid pipeline, the supporting side plate is provided with a supporting boss, the wafer hanger part and the electroplating diffusion and shielding part are respectively supported on the supporting bottom block and the supporting boss and thus are located directly above the electroplating liquid pipeline.

[0011] Preferably, a mounting bayonet is provided at the bottom of the partition, and two ends of the supporting bottom block are respectively clamped in the mounting bayonet.

[0012] Preferably, the supporting side plate is provided with a slot extending in the height direction, the bottom end of the slot is close to the supporting boss, and the two sides of the wafer hanger part are respectively detachably inserted into the slot, so that the single-sided exposed port is close to the electroplating diffusion and shielding part.

[0013] Preferably, a socket is provided at the top of the slot, and arms are provided on both sides of the wafer hanger, and the arms are inserted into the socket; a hook is provided on the supporting bottom block for corresponding insertion of the bottom edge of the wafer hanger.

[0014] Preferably, the wafer hanger portion includes a circuit conductive substrate and a cover base, and a plurality of wafer mounting openings are respectively opened on the circuit conductive substrate, and the circuit conductive substrate includes a sealing surface side and a plating surface side, and the cover base is sealed on the wafer mounting opening by the sealing surface side and then forms the single-sided exposed opening on the plating surface side, and the wafer is installed between the circuit conductive substrate and the cover base and then the plating surface side of the wafer is exposed at the wafer mounting opening.

[0015] Preferably, a mounting port unit is provided around each of the wafer mounting ports, and the mounting port unit includes a cover groove formed on one side of the covering surface for the cover plate base to be adapted to be mounted in the cover groove, and a plurality of wire grooves are connected around the cover groove for installing wires.

[0016] Preferably, a base cushion layer is provided at the center of the mounting surface of the cover base, and a wafer positioning frame is provided around the base cushion layer. The end of the wire extends to the wafer positioning frame, and a conductive connecting ring piece is provided on the wafer positioning frame and is connected to the wire through the conductive connecting ring piece. The wafer is adapted to be installed in the wafer positioning frame and thus electrically connected to the wire. The bottom surface of the cover groove extends circumferentially toward the wafer mounting opening and thus forms an circumferential outer edge on one side of the electroplating surface. A protective pad ring is provided on the conductive connecting ring piece, and the circumferential outer edge is pressed onto the protective pad ring. The wafer is exposed at the center of the circumferential outer edge to form the single-sided exposed opening.

[0017] Preferably, the base cushion layer comprises a plurality of cushion blocks of insulating material which are evenly arranged in an annular direction layer by layer so that the wafer can be laid flat; or, the base cushion layer comprises a plurality of suction cups of insulating material which are evenly arranged in an annular direction layer by layer so as to suck the flat wafer.

[0018] Preferably, a plurality of annular grooves are provided around the wafer positioning frame, and a plurality of annular protrusions are convexly provided on the bottom surface of the cover groove, and the annular protrusions are correspondingly clamped in the annular grooves.

[0019] Preferably, the protective gasket is made of insulating material and is covered on the outer surface of the conductive connection ring piece. The conductive connection ring piece and the wafer positioning frame are bonded to each other through the ring surface. The conductive connection ring piece is provided with a conductive contact piece, which extends out of the protective gasket and is then connected to the wire.

[0020] Preferably, the mounting port unit includes a connecting outer ring arranged on one side of the electroplating surface, the connecting outer ring is embedded in and surrounds the annular outer edge, the connecting outer ring is fastened to the cover plate base, a fastening ring plate is fastened on the connecting outer ring, and the fastening ring plate is spaced from the annular outer edge to be separated from the wafer.

[0021] Preferably, the electroplating diffusion and shielding part includes a liftable diffusion guide component, which includes a lifting cylinder and a lifting beam. Installation openings are respectively provided on both sides of the electroplating tank shell, and both ends of the lifting beam respectively pass through the electroplating tank shell through the installation openings. The lifting cylinder is arranged on both sides of the outside of the electroplating tank shell to lift the lifting beam. A diffusion guide plate is hung under the lifting beam, which is close to the single-sided exposed port, thereby forming the multi-stage guide surface.

[0022] Preferably, a guide baffle is provided at the installation opening, and a lifting travel groove is opened on the guide baffle, and both ends of the lifting beam are lifted and lowered in the lifting travel groove.

[0023] Preferably, the diffusion guide plate is a replaceable grid structure.

[0024] Preferably, the grating structure comprises a plurality of replaceable swing grating plates hung side by side under the lifting beam, and swingable multi-stage blades are evenly distributed on the plate surface of the swing grating plates.

[0025] Preferably, the grid structure includes a plurality of replaceable side diffusion grids hung side by side under the lifting beam, and two rows of oblique grids are provided on the surface of the side diffusion grids, and each row of oblique grids extends from the center line of the surface to both sides of the surface.

[0026] Preferably, the grid structure comprises a plurality of replaceable unidirectional diffusion grids hung side by side under the lifting beam, a single inclined grid being provided on the surface of the unidirectional diffusion grid, and the single inclined grid extending from one side of the surface to the other side of the surface.

[0027] Preferably, the electroplating diffusion and shielding part includes a shielding assembly supported on the supporting side plate and adjacent to the diffusion guide plate, the shielding assembly includes a cathode shielding plate and an anode shielding plate connected to each other, the cathode shielding plate is provided with a flange opening, the anode shielding plate is provided with a shielding corrugated ring, and the shielding corrugated ring is exposed at the flange opening.

[0028] Preferably, a plurality of the shielding components are hung side by side under a mounting beam, and two ends of the mounting beam are respectively supported on side shoulders of the supporting side plates.

[0029] Preferably, the electroplating diffusion and shielding part includes a slot base supported on the supporting bottom block and the supporting boss, and the diffusion guide plate and the shielding component are respectively inserted in parallel on the slot base.

[0030] Preferably, the slot base includes a plurality of slot units spaced adjacent to each other, each slot unit including a rear abutment groove and a front side groove for detachably inserting a pair of the diffusion guide plates and the shielding assembly, the rear abutment groove is formed between the rear back surface and the two side walls of the slot unit, the front side grooves are respectively embedded in the two side walls of the slot unit, the two sides of the diffusion guide plate are respectively inserted in the front side grooves, and the shielding assembly is inserted in the rear abutment groove.

[0031] Preferably, a plurality of corresponding pairs of the front side grooves are provided on both side walls of the slot unit, and there is a uniform spacing between two adjacent pairs of the front side grooves, so that the diffusion guide plate can be adjustably inserted into a pair of the front side grooves.

[0032] The beneficial effects of the wafer electroplating device for the wafer wet process equipment of the present invention include:

[0033] 1) Through the wafer hanger part, multiple wafers can be electroplated at the same time, and each wafer is plated on only one side of the surface. The electroplating diffusion and shielding part's multi-step guide surface can fully diffuse the plating solution to ensure that the plating solution is evenly plated on the wafer (i.e., the thickness is uniform);

[0034] 2) The electroplating tank shell is provided with an electroplating liquid pipeline and an inner shell support body, and the wafer hanger part and the electroplating diffusion and shielding part are stably supported and arranged directly above the electroplating liquid pipeline through the inner shell support body, so that the electroplating liquid pipeline can spray the electroplating liquid from bottom to top;

[0035] 3) The chamber in the electroplating tank shell is divided into three chambers, primary and secondary, by a partition. The middle main chamber is mainly used to install the wafer hanger part and the electroplating diffusion and shielding part to facilitate electroplating, while the secondary chambers on both sides can be used to discharge the electroplating liquid; when the electroplating liquid accumulates to a certain height in the main chamber, the excess electroplating liquid can enter the secondary chambers on both sides through the drainage slits on the partition to prevent the electroplating liquid in the main chamber from overflowing, thereby promoting the overall self-flow of the electroplating liquid;

[0036] 4) A slot in the height direction is provided on the support side plate, a socket is provided at the top of the slot, and a hook is provided on the support bottom block. The three cooperate to stably insert the wafer hanger part vertically; and the slot is close to the support boss, so that the wafer hanger part and the electroplating diffusion and shielding part are directly opposite and close to each other, so that the electroplating liquid can be fully diffused to the single-sided exposure port of the wafer hanger part;

[0037] 5) The electroplating diffusion and shielding part includes a diffusion guide component that can be lifted and lowered and a shielding component that can be detached and replaced. The diffusion guide plate of the diffusion guide component is a replaceable grid plate structure, including a swinging grid plate, a diffusion grid plate on both sides and a unidirectional diffusion grid plate, which can be used in combination to form a variety of diversion and diffusion forms, so that the electroplating solution can be fully diverted and diffused. When the grid plate needs to be replaced, it can be lifted by a lifting motor and then replaced; and the shielding component can make all the electric lines formed by the anode and cathode act on the wafer surface, so as to achieve relative concentration without divergence and waste. When it needs to be replaced, the shielding component can be further plugged in and taken out to achieve replacement;

[0038] 6) By setting the slot base, the vertical installation position of the shielding assembly can be further accurately positioned, and the vertical relative (front and back) position between the diffusion guide plate and the wafer hanger part and the shielding assembly can be further accurately fine-tuned and controlled;

[0039] 7) The wafer hanger part includes a circuit conductive substrate and a cover base, and a plurality of wafer mounting openings are respectively opened on the circuit conductive substrate. The circuit conductive substrate includes a sealing surface side and a plating surface side. The cover base is sealed from the sealing surface side to the wafer mounting opening, and then a single-side exposure opening is formed on the plating surface side to expose only the plating surface side of the wafer;

[0040] 8) After the cover base is fitted into the cover groove, the wafer can be positioned and installed in the positioning frame of the cover base, and then energized through the conductive connecting ring and the wire, and pressed under the annular outer edge with the protective pad ring to form a stable installation conductive structure. The wafer can be exposed at the center of the annular outer edge, and then electroplating can be performed;

[0041] 9) The base cushion can be a cushion made of insulating material for placing the wafer flat, or a suction cup structure for sucking the wafer;

[0042] 10) The annular grooves around the wafer positioning frame and the annular protrusions of the cover grooves are matched to form annular limit stops;

[0043] 11) The protective gasket ring can be made of insulating material and covered on the outer surface of the conductive connecting ring piece to protect the circuit;

[0044] 12) A connecting outer ring is provided on one side of the electroplating surface, and the connecting outer ring can be used to fasten the connecting cover base and cooperate with the fastening ring piece to further strengthen and protect the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 It is a schematic diagram of the overall structure of the wafer electroplating device used in the wafer wet process equipment of the present invention.

[0046] Figure 2 For the corresponding Figure 1 Another perspective structural diagram of .

[0047] Figure 3 For Figure 1 Schematic diagram of the three-dimensional structure after the plating tank shell is hidden.

[0048] Figure 4 For the corresponding Figure 3 Schematic diagram of the back structure.

[0049] Figure 5 For Figure 3 Exploded diagram of the base.

[0050] Figure 6 For the corresponding Figure 5 Schematic diagram of the back structure.

[0051] Figure 7 It is a schematic diagram of the three-dimensional structure of the electroplating tank shell in the wafer electroplating device for the wafer wet process equipment of the present invention.

[0052] Figure 8 For the corresponding Figure 7 Schematic diagram of the top view structure.

[0053] Fig. 9 for Figure 5 or Figure 6 Schematic diagram of the enlarged structure of the plating liquid pipeline inside the shell of the middle plating tank and the support body inside the shell.

[0054] Fig.10 for Figure 7 Medium plating tank shell and Fig. 9 Schematic diagram of the assembly structure of the electroplating solution pipeline and the support body inside the shell.

[0055] Fig.11 For the general Figure 8 The wafer holder is installed separately in Fig. 9Schematic diagram of the assembly structure on the support body inside the middle shell.

[0056] Fig.12 for Figure 7 or Figure 8 Schematic diagram of the structure of the electroplating surface side of the middle wafer hanger.

[0057] Fig.13 For the corresponding Fig.12 Schematic diagram of the structure of the wafer hanger part with its cover surface side.

[0058] Fig.14 For the corresponding Fig.13 A schematic diagram of the structure of the sealing surface side of the middle line conductive substrate.

[0059] Fig.15 For the corresponding Fig.12 or Fig.13 Schematic diagram of the three-dimensional structure of the middle cover base.

[0060] Fig.16 For Fig.12 Schematic diagram of the internal structure after the circuit conductive substrate is hidden.

[0061] Fig.17 For the corresponding Fig.16 Schematic diagram of the enlarged structure of area A in the middle.

[0062] Fig.18 For the corresponding Fig.17 Schematic diagram of the structure of the conductive connecting ring piece.

[0063] Fig.19 For the corresponding Fig.17 Schematic diagram of the structure of the wafer positioning frame.

[0064] Fig. 20 It is a schematic diagram of the enlarged structure corresponding to area B in 16.

[0065] Fig.21 For the corresponding Fig. 20 Schematic diagram of the assembly structure of the protective gasket ring and the conductive connecting ring piece.

[0066] Fig. 22 For the corresponding Fig.12 Schematic diagram of the enlarged structure of the middle Z region.

[0067] Fig.23 For the general Figure 7 The electroplating diffusion and shielding parts are installed separately in Fig. 9 Schematic diagram of the assembly structure on the support body inside the middle shell.

[0068] Fig.24 For the corresponding Fig.23 Schematic diagram of the three-dimensional structure of the diffusion guide component.

[0069] Fig.25 For Fig. 27 Schematic diagram of the structure of different replaceable forms of the grid structure.

[0070] Fig.26 For the corresponding Fig.23 Schematic diagram of the three-dimensional structure of the middle shielding component.

[0071] Fig. 27 For the corresponding Fig.23 Schematic diagram of the assembly structure of the electroplating diffusion and shielding part, its slot base and shielding components.

[0072] Fig.28 For the corresponding Fig. 27 Schematic diagram of the planar structure of the middle slot base. DETAILED DESCRIPTION

[0073] The present invention is described in detail below in conjunction with the accompanying drawings:

[0074] Figure 1 and Figure 2 The internal structure and bottom structure of the wafer electroplating device for the wafer wet process equipment of the present application are shown from upper and lower oblique angles respectively, wherein the electroplating tank shell 1 is in a transparent state.

[0075] like Figures 1 to 6 As shown, a wafer electroplating device for a wafer wet process equipment comprises an electroplating tank shell 1 having an electroplating cavity, wherein the electroplating tank shell 1 is provided with an adjacent and removable wafer hanger part 2 and an electroplating diffusion and shielding part 3, wherein the wafer hanger part 2 is provided with a single-sided exposure port for exposing one side of the electroplating surface of the wafer 99, and the electroplating diffusion and shielding part 3 is provided with a multi-stage guide surface directly opposite to the single-sided exposure port. Specifically:

[0076] like Figures 3 to 6 As shown, a plating liquid pipeline 4 and an inner shell support 5 are provided in the plating tank shell 1, the plating liquid pipeline 4 is provided at the bottom of the plating tank shell 1, the inner shell support 5 is provided at the bottom and both sides of the plating tank shell 1, the wafer hanger part 2 and the plating diffusion and shielding part 3 are installed on the inner shell support 5, and then the plating liquid pipeline 4 sprays the plating liquid from bottom to top to the wafer hanger part 2.

[0077] like Figure 7 and Figure 8 As shown, the plating tank shell 1 is divided into the chamber by a partition 10 to form a middle main chamber 100 and two side secondary chambers 101, the plating liquid pipeline 4, the wafer hanger part 2 and the plating diffusion and shielding part 3 are all installed in the middle main chamber 100, (can be combined with Figure 2) The bottom of the electroplating tank housing 1 is provided with a plurality of external liquid inlet pipes 12, valve ball pipes 120 and liquid discharge pipes 14. The liquid inlet pipes 12 and valve ball pipes 120 are connected to the middle main chamber 100, and the liquid discharge pipes 14 are connected to the secondary chambers 101 on both sides. Figure 3 A drainage slit 16 is provided on the upper portion of the partition plate 10 , and the middle main chamber 100 is communicated with the secondary chambers 101 on both sides through the drainage slit 16 .

[0078] like Fig. 9 As shown, a plurality of plating liquid spray holes 40 for spraying upward are evenly arranged on the plating liquid pipeline 4. The shell support body 5 includes a support bottom block 50 and a support side plate 52, and the support side plate 52 is integrally fixed to the inner walls of both sides of the shell support body 5. The support bottom block 50 is straddled on the plating liquid pipeline 4, and a support boss 54 is provided on the support side plate 52. The wafer hanger part 2 and the electroplating diffusion and shielding part 3 are respectively supported on the support bottom block 50 and the support boss 54 and are thus located directly above the plating liquid pipeline 4. Preferably, the plating liquid pipeline 4 is located between the vertical plane where the wafer hanger part 2 is located and the vertical plane where the electroplating diffusion and shielding part 3 is located.

[0079] Combination Figure 7 , Figure 8 and Fig.10 The bottom of the partition 10 is provided with a plurality of mounting bayonet holes 13 corresponding to each other, and the two ends of the supporting bottom block 50 are respectively clamped in the mounting bayonet holes 13. The liquid inlet pipe 12 is connected to the electroplating liquid pipeline 4 to transport the electroplating liquid.

[0080] like Figures 9 to 11 As shown, the support side plate 52 is provided with a slot 56 extending in the height direction, the bottom end of the Y-shaped slot 56 is close to the support boss 54, and the two sides of the wafer hanger part 2 are respectively detachably inserted into the slot 56, so that the single-sided exposed opening of the wafer hanger part 2 is close to the multi-stage guide surface of the electroplating diffusion and shielding part 3. Further, a socket 58 is provided corresponding to the top of the slot 56, and support arms 222 are provided on both sides of the wafer hanger part 2, and the support arms 222 are inserted into the socket 58; the support bottom block 50 is provided with a hook 51 for the corresponding insertion of the bottom edge of the wafer hanger part 2.

[0081] Fig.12The structure of the electroplating surface side of the wafer hanger of the present application is shown. In the figure, there are three single-sided exposed openings from left to right for installing three wafers 99, among which the exposed opening a1 in the middle is installed with a wafer 99 that has been fastened and is to be electroplated, the exposed opening a2 on the left is installed with a wafer 99 that has not been fastened, and the exposed opening a3 on the right is not installed with a wafer 99, thereby exposing the internal structure of the opening.

[0082] Fig.13 The structure of the wafer hanger of the present application on one side of the cover surface is shown. In the figure, the exposed openings a2 and a3 on the left and right sides are blocked, while the exposed opening a1 in the middle is not blocked.

[0083] like Figures 12 to 15 As shown, the wafer hanger part 2 includes a circuit conductive substrate 20 and a cover base 21, and a plurality of wafer mounting openings 22 are respectively opened on the circuit conductive substrate 20. The circuit conductive substrate 20 includes a sealing surface side and a plating surface side. The cover base 21 is sealed on the wafer mounting opening 22 by the sealing surface side and then forms the single-sided exposed opening on the plating surface side. The wafer 99 is installed between the circuit conductive substrate 20 and the cover base 21 and then the plating surface side of the wafer 99 is exposed at the wafer mounting opening 22.

[0084] exist Fig.12 In the figure, the wafers at three locations are connected to the cathode and anode 98 / 97 through the wire 23. The cathode and anode 98 / 97 are plate-shaped and are respectively installed above the circuit conductive substrate 20.

[0085] like Fig.14 and Fig.15 As shown, a mounting port unit is provided around each of the wafer mounting ports 22, and the mounting port unit includes a cover groove 24 formed on one side of the covering surface for the cover base 21 to be adapted and clamped in the cover groove 24, and a plurality of wire grooves 25 are connected around the cover groove 24 for installing the wires 23.

[0086] Fig.16 The internal structure of the electroplating surface of the wafer hanger 2 of the present application is further shown. In the figure, the wafer 99 at the exposure opening a1 in the middle position is fastened and waiting for electroplating, the wafer 99 at the exposure opening a2 on the left position is only pressed but not fastened, and the wafer 99 is not installed at the exposure opening a3 on the right position, thereby completely exposing the internal structure of the location.

[0087] Combination Figures 15 to 19As shown, a protruding base cushion layer 210 is provided at the center of the mounting surface of the cover base 21, and a wafer positioning frame 211 is provided around the base cushion layer 210. The end of the wire 23 extends to the wafer positioning frame 211, and a conductive connecting ring piece 212 is provided on the wafer positioning frame 211 and is connected to the wire 23 through the conductive connecting ring piece 212. Fig. 20 As shown, the wafer 99 is adapted to be installed in the center of the wafer positioning frame 211 and is further electrically connected to the wire 23 . It can be seen that the wafer positioning frame 211 is equivalent to a conductive base.

[0088] Combination Fig.14 and Fig. 22 As shown, the bottom surface of the cover groove 24 extends circumferentially toward the wafer mounting opening 22 and forms a circumferential outer edge 26 on one side of the electroplating surface. Fig. 20 and Fig. 22 As shown, the conductive connecting ring sheet 212 is provided with a protective gasket ring 213, and the annular outer edge 26 is pressed on the protective gasket ring 213. Fig.12 and Fig. 22 As shown, the wafer 99 is exposed at the center of the circumferential outer edge 26 to form the single-sided exposure opening.

[0089] like Fig.15 or Fig.17 As shown, the base cushion layer 210 includes a plurality of cushion blocks made of insulating material (such as rubber) and are evenly arranged in a circumferential direction layer by layer so that the wafer 99 can be laid flat; or, the base cushion layer 210 includes a plurality of suction cups made of insulating material (such as rubber) and are evenly arranged in a circumferential direction layer by layer so as to suck the flat wafer 99.

[0090] like Fig.19 As shown, the wafer positioning frame 211 is provided with a plurality of annular slots 214 around its periphery. Fig.14 As shown, a plurality of annular protrusions 240 are convexly provided on the bottom surface of the cover groove 24 , and the annular protrusions 240 are correspondingly clamped in the annular clamping groove 214 to form an annular limit to determine the annular installation orientation of the wafer positioning frame 211 .

[0091] like Fig.18 , Fig.19 As shown, the lower ring surface of the conductive connecting ring sheet 212 is attached to the upper ring surface of the wafer positioning frame 211, as shown in FIG. Fig.21 As shown, the protective gasket ring 213 is made of insulating material and is coated on the outer surface of the conductive connecting ring piece 212 (in the figure, the protective gasket ring 213 and the conductive connecting ring piece 212 are turned over to reveal the assembly relationship of the two ring bodies), and the conductive connecting ring piece 212 is provided with a conductive contact piece 215, and the conductive contact piece 215 extends out of the protective gasket ring 213 and is further connected to the wire 23.

[0092] like Fig.12 and Fig. 22 As shown, the mounting port unit includes a connecting outer ring 27 provided on one side of the electroplating surface, the connecting outer ring 27 is embedded and surrounds the outside of the annular outer edge 26, and a fastening ring piece 28 is fastened and installed on the connecting outer ring 27, and the fastening ring piece 28 is spaced from the annular outer edge 26 by a gasket 280 to be spaced from the wafer 99. Further, as Fig. 22 The connecting outer ring 27 is provided with a plurality of connecting holes 270, such as Fig.13 and Fig.15 A plurality of cover holes 219 are arranged around the cover base 21, and the connecting holes 270 correspond to the cover holes 219 in front and back. A connecting bolt can be passed through the connecting hole 270, and the connecting bolt passes through the circuit conductive substrate 20 and is screwed into the cover hole 219, thereby fastening the connecting outer ring 27 to the cover base 21.

[0093] like Figure 23 to Figure 25 As shown, the electroplating diffusion and shielding part 3 includes a diffusion guide component 30 that can be raised and lowered. The diffusion guide component 30 includes a lifting cylinder 302 and a lifting beam 304. Figure 7 As shown, the two sides of the electroplating tank housing 1 are respectively provided with mounting openings 17, Figure 1 As shown, the two ends of the lifting beam 304 pass through the plating tank shell 1 through the installation opening 17, and the lifting cylinder 302 is fixedly installed on both sides of the outside of the plating tank shell 1 to lift the lifting beam 304. Fig.24 As shown, a plurality of diffusion guide plates 300 are hung under the lifting beam 304 to form the multi-stage guide surface, and the diffusion guide plates 300 should be close to the above-mentioned single-sided exposed opening.

[0094] like Fig.10 The installation opening 17 is provided with a guide baffle 18. Fig.23 As shown, a lifting travel slot 19 is opened on the guide baffle 18, and both ends of the lifting beam 304 are lifted and lowered in the lifting travel slot 19.

[0095] like Fig.24 and Fig.25 As shown, the diffusion guide plate 300 is a replaceable grid structure.

[0096] Preferably, Fig.24 As shown, the grid plate structure includes a plurality of replaceable swinging grating plates hung side by side under the lifting beam 304, and swingable multi-stage blades 306 are evenly arranged on the plate surface of the swinging grating plate. Fig.25As shown, the grid structure includes a plurality of replaceable two-side diffusion grids 308 hung side by side under the lifting beam 304, and two rows of oblique grids 309 are provided on the plate surface of the two-side diffusion grids 308, and each row of oblique grids 309 extends from the center line of the plate surface to both sides of the plate surface. Alternatively, the grid structure includes a plurality of replaceable one-way diffusion grids 307 hung side by side under the lifting beam 304, and a single oblique grid 305 is provided on the plate surface of the one-way diffusion grid 307, and the single oblique grid 305 extends from one side of the plate surface to the other side of the plate surface. In this way, the diffusion guide plate 300 of the present application can form three diversion and diffusion forms, namely, swinging up and down, from the middle to both sides, and from one side to the other side.

[0097] like Fig.23 and Fig.26 As shown, the electroplating diffusion and shielding part 3 includes a shielding component 31 supported on the supporting side plate 52 and adjacent to the inner side of the diffusion guide plate 300, and the shielding component 31 includes a cathode shielding plate 310 and an anode shielding plate 312 that are interconnected, and the cathode shielding plate 310 is provided with a flange opening 314, and the anode shielding plate 312 is provided with a shielding corrugated ring 316, and the shielding corrugated ring 316 is exposed at the flange opening 314.

[0098] like Fig. 27 As shown, a plurality of the shielding components 31 are hung side by side under the mounting beam 318 , and both ends of the mounting beam 318 are respectively supported on the side shoulders of the supporting side plate 52 .

[0099] Combination Fig. 27 and Fig.28 As shown, the electroplating diffusion and shielding part 3 includes a slot base 32 supported on the supporting bottom block 50 and the supporting boss 54, and the diffusion guide plate 300 and the shielding assembly 31 are respectively inserted in parallel on the slot base 32 along the vertical plane.

[0100] like Fig.28 As shown, the slot base 32 includes a plurality of slot units spaced adjacent to each other, each slot unit including a rear abutment groove 320 and a front side groove 322 for detachably inserting a pair of the diffusion guide plates 300 and the shielding assembly 31, the rear abutment groove 320 is formed between the rear back surface and the two side walls 324 of the slot unit, the front side grooves 322 are respectively embedded in the two side walls 324 of the slot unit, the two sides of the diffusion guide plate 300 are respectively inserted in the front side grooves 322, and the shielding assembly 31 is inserted in the rear abutment groove 320.

[0101] Furthermore, corresponding pairs of the front side grooves 322 are respectively provided on the two side walls 324 of the slot unit, and there is a uniform spacing between two adjacent pairs of the front side grooves 322. Therefore, the diffuser guide plate 300 can be inserted into a pair of the front side grooves 322 in a forward and backward adjustable manner.

[0102] After having the above structural features, the present invention can be implemented according to the following process:

[0103] During the on-site implementation, Figure 5 and Figure 6 As shown, since the anode plating line requires uniform distribution, and the flow of the plating solution is larger in the middle and relatively smaller on both sides, the plating solution needs to be diffused, and different plating solutions need to go in different directions. Then, the present application guides the diffusion through a replaceable grid structure. During electroplating, the plating solution is directly sprayed upward through the plating solution pipeline 4, and after passing through the grid structure, it is automatically diffused and evenly flows to the exposed port on the wafer hanger part 2, thereby uniformly plating one side of the wafer.

[0104] After completing the above implementation process, the following features of this application should be reflected:

[0105] The wafer electroplating device for wafer wet process equipment provided by the present invention has a compact overall structural arrangement, a sophisticated internal structure and comprehensive functions. Through the wafer hanger part, multiple wafers can be electroplated at the same time, and each wafer is plated on only one side of the surface. The electroplating diffusion and shielding part's multi-stage guide surface can make the plating liquid fully diffuse to ensure that the plating liquid is evenly plated on the wafer to meet the uniform thickness requirement.

[0106] The embodiments of the present invention are only used to illustrate the present invention and do not constitute a limitation on the scope of the claims. Other substantially equivalent substitutes that can be thought of by those skilled in the art are all within the protection scope of the present invention.

Claims

1. A wafer electroplating device for a wafer wet process equipment, characterized in that: The invention comprises an electroplating tank shell having an electroplating cavity, wherein the electroplating tank shell is provided with adjacent and detachable wafer hanger parts and electroplating diffusion and shielding parts, wherein the wafer hanger part is provided with a single-sided exposure port for exposing one side of the electroplating surface of the wafer, and the electroplating diffusion and shielding part is provided with a multi-stage guide surface directly facing the single-sided exposure port. The electroplating tank shell is provided with an electroplating liquid pipeline and an inner shell support body, the electroplating liquid pipeline is arranged at the bottom of the electroplating tank shell, the inner shell support body is arranged at the bottom and both sides of the electroplating tank shell, the wafer hanger part and the electroplating diffusion and shielding part are installed on the inner shell support body, and then the electroplating liquid pipeline sprays the electroplating liquid to the wafer hanger part from bottom to top, The electroplating diffusion and shielding part includes a diffusion guide component that can be raised and lowered, and the diffusion guide component includes a lifting cylinder and a lifting beam. The two sides of the electroplating tank shell are respectively provided with installation openings, and the two ends of the lifting beam pass through the electroplating tank shell through the installation openings respectively. The lifting cylinder is arranged on the outer sides of the electroplating tank shell to lift the lifting beam. A diffusion guide plate close to the single-sided exposed port is hung under the lifting beam to form the multi-stage guide surface. The electroplating liquid pipeline is evenly arranged with a plurality of electroplating liquid spray holes for spraying upward.

2. The wafer electroplating device for wafer wet process equipment according to claim 1, characterized in that: The wafer hanger part includes a circuit conductive substrate and a cover base, and a plurality of wafer mounting openings are respectively opened on the circuit conductive substrate. The circuit conductive substrate includes a sealing surface side and a plating surface side. The cover base is sealed on the wafer mounting opening by the sealing surface side and then forms the single-sided exposed opening on the plating surface side. The wafer is installed between the circuit conductive substrate and the cover base and then the plating surface side of the wafer is exposed at the wafer mounting opening.

3. The wafer electroplating device for wafer wet process equipment according to claim 2, characterized in that: A mounting port unit is arranged around each wafer mounting port, and the mounting port unit includes a cover groove formed on one side of the cover surface for the cover base to be adapted and mounted in the cover groove, and a plurality of wire grooves are connected around the cover groove for installing wires.

4. The wafer electroplating device for wafer wet process equipment according to claim 3, characterized in that: A basic cushion layer is provided at the center of the mounting surface of the cover base, and a wafer positioning frame is provided around the basic cushion layer. The end of the wire extends to the wafer positioning frame, and a conductive connecting ring piece is provided on the wafer positioning frame and is connected to the wire through the conductive connecting ring piece. The wafer is adapted to be installed in the wafer positioning frame and thus electrically connected to the wire. The bottom surface of the cover groove extends circumferentially toward the wafer mounting opening and thus forms an circumferential outer edge on one side of the electroplating surface. A protective pad ring is provided on the conductive connecting ring piece, and the circumferential outer edge is pressed onto the protective pad ring. The wafer is exposed at the center of the circumferential outer edge to form the single-sided exposed opening.

5. The wafer electroplating device for wafer wet process equipment according to claim 4, characterized in that: The basic cushion layer includes a plurality of cushion blocks made of insulating material and is evenly arranged in a circumferential direction layer by layer for the wafer to be laid flat.

6. The wafer electroplating device for wafer wet process equipment according to claim 4, characterized in that: A plurality of annular clamping grooves are arranged around the wafer positioning frame, and a plurality of annular protrusions are convexly arranged on the bottom surface of the cover groove, and the annular protrusions are correspondingly clamped in the annular clamping grooves.

7. The wafer electroplating device for wafer wet process equipment according to claim 4, characterized in that: The protective gasket is made of insulating material and covers the outer surface of the conductive connection ring. The conductive connection ring and the wafer positioning frame are bonded to each other through the ring surface. The conductive connection ring is provided with a conductive contact, which extends out of the protective gasket and is further connected to the wire.

8. The wafer electroplating device for wafer wet process equipment according to claim 1, characterized in that: A guide baffle is provided at the installation opening, and a lifting travel groove is provided on the guide baffle. Both ends of the lifting beam are lifted and lowered in the lifting travel groove.

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