A patch type tilt ball switch and its integrated pressing production process

Abstract

The invention relates to a patch type tilt ball switch and an integrated pressing production process thereof, comprising an upper cover plate, a middle plate, an angle clamping plate, a lower cover plate and a conductive ball. A first metal conductive layer is provided on the inner side of the upper cover plate, a large circular hole for placing the conductive ball is provided at the center of the middle plate, a second metal conductive layer is provided on the inner wall of the large circular hole and the surface of the middle plate, a small circular hole for limiting the conductive ball is provided at the center of the angle clamping plate, a third metal conductive layer is provided on the inner wall of the small circular hole and the surface of the angle clamping plate, a fourth metal conductive layer is provided on the inner side of the lower cover plate, a welding pad is provided on the outer side of the lower cover plate, the small circular hole in the angle clamping plate effectively limits the ball to roll and trigger the switch within a certain tilt angle range, and prevents the ball from rolling and causing false triggering when the product does not meet the angle function requirements in application. The third metal conductive layer of the angle clamping plate has various structural forms, so that the switch can have omni-directional, unidirectional, bidirectional and multi-directional detection functions, and the functions are complete and meet the requirements.

Description

Technical Field

[0001] The present invention relates to the field of surface mount ball switches, and more particularly to a surface mount tilt ball switch and its integrated pressing production process. Background Art

[0002] Ball-type tilt sensing switches change the opening and closing state of the switch by sensing the change of the tilt angle of the ball and then transmit the sensing result to the circuit device product. They are commonly used to implement triggering circuits, tilt sensing, motion detection and other wake-up functions, such as: various intelligent digital electronic products, anti-tilt functions of electrical appliances, controllers, remote control shaking start, smart wearables, electronic watches, pedometers, automotive electronics, smart furniture, door and window devices, smart electronic toys, LED lights, automatic tilt devices, gas meters, smart manhole covers, and circuit conversion triggering functions under various tilt sensing or inspection and protection applications for controlling angles. The existing ball-type tilt switches have relatively simple structures, cannot achieve multiple functions, have limited detection directions, low production efficiency, insufficient service life, and large volumes, and cannot meet the requirements of flexible setting of more angles. Summary of the Invention

[0003] In view of the technical problems of the existing technology such as simple structure, small function, and low production efficiency, the present invention provides a surface mount tilt ball switch and its production process. The specific technical solutions are as follows:

[0004] A surface mount tilt ball switch includes an upper cover plate, a middle plate, an angle positioning plate, a lower cover plate and a conductive ball. The upper cover plate covers the upper part of the middle plate. A first metal conductive layer is provided on the inner side of the upper cover plate. A large round hole for placing the conductive ball is provided at the center of the middle plate. A second metal conductive layer is provided on the inner wall of the large round hole and the surface of the middle plate. The angle positioning plate is covered under the middle plate. A small round hole for limiting the conductive ball is provided at the center of the angle positioning plate. A third metal conductive layer is provided on the inner wall of the small round hole and the surface of the angle positioning plate. The diameter of the large round hole is larger than the diameter of the conductive ball, and the diameter of the conductive ball is larger than the diameter of the small round hole. The lower cover plate is covered under the angle positioning plate. A fourth metal conductive layer is provided on the inner side of the lower cover plate, and a solder pad is provided on the outer side of the lower cover plate.

[0005] As a preferred solution of the present invention, when the surface mount tilt ball switch is of the normally open type, the first metal conductive layer and the second metal conductive layer are in contact to form a first electrical shock conductor, and the third metal conductive layer and the fourth metal conductive layer are in contact to form a second electrical shock conductor. When placed flat, the conductive ball only contacts the second electrical shock conductor. When the conductive ball reaches the tilt angle, it rolls and contacts the first electrical shock conductor and the second electrical shock conductor respectively to achieve conduction.

[0006] As a preferred embodiment of the present invention, when the patch type tilt ball switch is of the normally closed type, the first metal conductive layer, the second metal conductive layer, and the third metal conductive layer are in contact to form a first electric shock conductor, and the fourth metal conductive layer serves as a second electric shock conductor alone. When placed flat, the conductive ball is in contact with the third metal conductive layer and the fourth metal conductive layer; thereby realizing the normally closed connection between the first electric shock conductor and the second electric shock conductor. When the conductive ball reaches the tilt angle, it rolls and contacts the first electric shock conductor and separates from the second electric shock conductor to achieve disconnection.

[0007] As a preferred embodiment of the present invention, the third metal conductive layer is arranged in a circular ring shape with small round holes formed on the inner walls of all parts to form an omnidirectional induction structure.

[0008] As a preferred embodiment of the present invention, the third metal conductive layer is in a local shape connection with small round holes formed on the inner walls to form a unidirectional induction structure.

[0009] As a preferred embodiment of the present invention, there are two third metal conductive layers that are separated from each other to form a bidirectional induction structure.

[0010] As a preferred embodiment of the present invention, there are multiple third metal conductive layers that are arranged equidistantly around the central axis of the small round hole, and adjacent third metal conductive layers are separated from each other to form a multi-directional induction structure.

[0011] As a preferred embodiment of the present invention, the small round hole is combined with the large round hole to form a limiting step.

[0012] A patch type tilt ball switch includes an upper cover plate, a middle plate, an angle positioning plate, a lower cover plate, and a conductive ball. The upper cover plate is covered above the middle plate. The inner side of the upper cover plate is provided with a first metal conductive layer, which is semicircular to form a unidirectional induction structure or there are two that are separated from each other to form a bidirectional induction structure; or there are multiple that are separated from each other and arranged equidistantly in a circular pattern to form a multi-directional induction structure. A large round hole for placing the conductive ball is provided at the center of the middle plate. The inner wall of the large round hole and the surface of the middle plate are provided with a second metal conductive layer. The angle positioning plate is covered below the middle plate. A small round hole for limiting the conductive ball is provided at the center of the angle positioning plate. The inner wall of the small round hole and the surface of the angle positioning plate are provided with a third metal conductive layer. The diameter of the large round hole is larger than the diameter of the conductive ball, and the diameter of the conductive ball is larger than the diameter of the small round hole. The lower cover plate is covered below the angle positioning plate. The inner side of the lower cover plate is provided with a fourth metal conductive layer, and the outer side of the lower cover plate is provided with a solder pad.

[0013] A patch type tilt ball switch integrated pressing production process includes the following steps,

[0014] ① Press and integrate the angle positioning plate and the lower cover plate together. The third metal conductive layer of the angle positioning plate is located above, and the fourth metal conductive layer of the lower cover plate is located above while the solder pad is located below;

[0015] ②Press-fit and integrate the middle plate above the angle positioning plate, with the second metal conductive layer of the middle plate on the upper side;

[0016] ③Put the conductive ball into the large round hole of the angle positioning plate. Since the diameter of the large round hole is larger than that of the conductive ball, and the diameter of the conductive ball is larger than that of the small round hole, the bottom of the conductive ball will be movably embedded in the small round hole, and the small round hole forms a limiting step. The combination of the small round hole and the large round hole forms a limiting step;

[0017] ④Cover the upper cover plate above the middle plate, with the first metal conductive layer of the upper cover plate on the upper side.

[0018] Beneficial effects: Compared with the traditional ball switch, the patch type tilt ball switch of the present invention adds an angle positioning plate between the middle plate and the lower cover plate. The diameter of the small round hole in the angle positioning plate is smaller than that of the conductive ball to form a step limiting structure, effectively restricting the ball from rolling and triggering the switch only within a certain tilt angle range, preventing the ball from rolling and causing mis-triggering when the product does not meet the angle function requirements during application. At the same time, due to the diverse structural forms of the third metal conductive layer of the angle positioning plate, the switch can have omnidirectional, unidirectional, bidirectional, and multi-directional detection functions, and the functions are complete to meet the requirements. In addition, the metal conductive layer of the upper cover plate can also have diverse structural forms, enabling the switch to have omnidirectional, unidirectional, bidirectional, and multi-directional detection functions. The integrated press-fit production process can realize the mass production of the patch type tilt ball switch, improve production efficiency, reduce costs, with diverse and advanced structures and strong practicability, providing better competitive advantages for the product. Description of the Drawings

[0019] Figure 1 is the three-dimensional exploded view of the present invention.

[0020] Figure 2 is the schematic diagram of the positions of the respective metal conductive layers in each plate of the present invention.

[0021] Figure 3 is the structural schematic diagram of the present invention.

[0022] Figure 4 is the structural schematic diagram of the patch type tilt ball switch of the present invention in the normally open state when placed flat.

[0023] Figure 5 is the structural schematic diagram of the patch type tilt ball switch of the present invention in the normally open state when tilted.

[0024] Figure 6 is the structural schematic diagram of the patch type tilt ball switch of the present invention in the normally closed state when placed flat.

[0025] Figure 7 is the structural schematic diagram of the patch type tilt ball switch of the present invention in the normally closed state when tilted.

[0026] Figure 8 It is a schematic structural diagram of Embodiment 1 of the third metal conductive layer of the present invention.

[0027] Figure 9 It is a schematic structural diagram of Embodiment 2 of the third metal conductive layer of the present invention.

[0028] Figure 10 It is a schematic structural diagram of Embodiment 3 of the third metal conductive layer of the present invention.

[0029] Figure 11 It is a schematic structural diagram of Embodiment 4 of the third metal conductive layer of the present invention.

[0030] Figure 12 It is a schematic diagram of the pad on the outer side of the lower cover plate of the present invention.

[0031] Figure 13 It is a schematic structural diagram of the angle positioning plate being a single plate when there are two small round holes in the present invention.

[0032] Figure 14 It is a schematic structural diagram of the angle positioning plate being a composite plate when there are two small round holes in the present invention.

[0033] Figure 15 It is an exploded perspective view of Embodiment 2 of the present invention.

[0034] Figure 16 It is a schematic structural diagram of Embodiment 2 of the upper cover plate of Embodiment 2 of the present invention.

[0035] Figure 17 It is a schematic structural diagram of Embodiment 3 of the upper cover plate of Embodiment 2 of the present invention. Detailed Embodiments

[0036] The following further describes the detailed embodiments of the present invention with reference to the accompanying drawings:

[0037] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the indicated position or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0038] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "linkage" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. It can be the communication inside two components or a line connection, such as a connection by a printed circuit board integration process. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0039] As Figures 1 - 3 shown, Embodiment 1: A surface-mounted tilt ball switch includes an upper cover plate 1, a middle plate 2, an angle positioning plate 3, a lower cover plate 4, and a conductive ball 5. The upper cover plate 1 covers the upper part of the middle plate 2. A first metal conductive layer 11 is provided on the inner side of the upper cover plate 1. A large round hole 21 for placing the conductive ball 5 is provided at the center of the middle plate 2. Under normal conditions, the large round hole 21 does not contact the metal ball. A second metal conductive layer 22 is provided on the inner wall of the large round hole and the surface of the middle plate. The angle positioning plate 3 is covered under the middle plate 2. A small round hole 31 for limiting the conductive ball 5 is provided at the center of the angle positioning plate 3. A third metal conductive layer 32 is provided on the inner wall of the small round hole and the surface of the angle positioning plate. The diameter of the large round hole is larger than the diameter of the conductive ball, and the diameter of the conductive ball is larger than the diameter of the small round hole. The small round hole forms a limiting step. In this embodiment, there is 1 small round hole. The small round hole can also be two holes with different sizes. The inner side of the semi-through hole formed by not drilling through the hole forms a step. The lower cover plate 4 is covered under the angle positioning plate 3. A fourth metal conductive layer 41 is provided on the inner side of the lower cover plate 4. The metal conductive layer is made by electroplating process. A solder pad 42 is provided on the outer side of the lower cover plate 4. The upper cover plate 1, the middle plate 2, the angle positioning plate 3, and the lower cover plate 4 are PCB substrates.

[0040] Example 1, as Figure 4 and 5 shown, when the surface-mounted tilt ball switch is of the normally open type, the first metal conductive layer 11 and the second metal conductive layer 22 are in contact to form a first electrical conductor 1a. The first electrical conductor is connected to one of the solder pads at the bottom of the lower cover plate 4. The third metal conductive layer 32 is arranged on the left side. The third metal conductive layer 32 and the fourth metal conductive layer 41 are in contact to form a second electrical conductor 1b. The second electrical conductor 1b is connected to the other solder pad of the lower cover plate 4. When placed flat, the conductive ball 5 only contacts the second electrical conductor 1a. At this time, the switch is in an open circuit state, that is, normally open. When the conductive ball 5 reaches the tilt angle, it rolls and contacts the first electrical conductor 1a and the second electrical conductor 1b respectively to achieve conduction. At this time, the switch is in a closed state to trigger the induction circuit.

[0041] Example 2, as Figure 6 and 7As shown in the figure, when the surface-mount tilt ball switch is of the normally-closed type, the first metal conductive layer 11, the second metal conductive layer 22, and the third metal conductive layer 32 are in contact to form a first electric shock conductor 1a. The first electric shock conductor is connected to one of the pads at the bottom of the lower cover plate 4. The first metal conductive layer 11, the second metal conductive layer 22, and the third metal conductive layer 32 are all arranged on the right side at the same time. The third metal conductive layer 32 is circularly arranged with small holes on the entire inner wall. The fourth metal conductive layer 41 serves as a second electric shock conductor 1b alone. The second electric shock conductor 1b is connected to another pad of the lower cover plate 4. When placed flat or with an insufficient tilt angle, the conductive ball 5 is in contact with the third metal conductive layer 32 and the fourth metal conductive layer 41. Thus, the first electric shock conductor 1a and the second electric shock conductor 1b are connected in a normally-closed manner. At this time, the switch is in the on state, i.e., normally closed. When the conductive ball 5 reaches the tilt angle, it rolls and contacts the first electric shock conductor 1a and separates from the second electric shock conductor 1b to achieve disconnection. At this time, the switch is in the open state, i.e., normally open.

[0042] As Figure 8 shown, the third metal conductive layer 32 is circularly arranged with small holes on the entire inner wall to form an omnidirectional induction structure. At this time, as long as the conductive ball 5 rolls and tilts in any direction, the switch can be triggered. As Figure 9 shown, the third metal conductive layer 32 is arranged in a partial shape connected to the inner wall of the small hole to form a unidirectional induction structure. The partial shape refers to an area smaller than the area of the small hole. At this time, as long as the conductive ball 5 only rolls and tilts towards the third metal conductive layer 32, the switch can be triggered. As Figure 10 shown, there are two third metal conductive layers 32 and they are separated from each other to form a bidirectional induction structure (also separated from each other inside the hole). At this time, as long as the conductive ball 5 only rolls and tilts towards the third metal conductive layer 32 on the left or right side, the switch can be triggered to connect different circuits. As Figure 11 shown, there are multiple third metal conductive layers 32 and they are arranged in an equal circular arrangement around the central axis of the small hole (also independent of each other inside the hole). Preferably, there are 8 third metal conductive layers. The included angle between adjacent third metal conductive layers is 45 degrees and they are separated from each other to form a multi-directional induction structure to trigger multiple circuits. At this time, as long as the conductive ball 5 only rolls and tilts towards the third metal conductive layer 32 in a specific direction, the switch can be triggered to connect different circuits, and a specific angle can be detected. By changing the third metal conductive layer 32, multi-functional triggering can be achieved, and the functional usage range can be expanded. Of course, in Embodiment 3 and Embodiment 4 of the third metal conductive layer 32, as Figure 13 and 14 shown, the separated third metal conductive layers 32 can also be connected, so as to achieve the triggering of the opening and closing of one circuit at multiple angles. Unidirectional induction, bidirectional induction, and multi-directional induction can be applied to normally-open switches. Omnidirectional induction is only applicable to normally-closed switches.

[0043] As Figure 15As shown in the figure, Embodiment 2: A patch type tilt ball switch, comprising an upper cover plate 1, a middle plate 2, an angle positioning plate 3, a lower cover plate 4 and a conductive ball 5. The upper cover plate 1 is covered above the middle plate 2. A first metal conductive layer 11 is provided on the inner side of the upper cover plate 1. The first metal conductive layer 11 is semicircular to form a unidirectional induction structure, or there are two and they are separately formed to form a bidirectional induction structure; or there are multiple and they are separately arranged in an equal circumference to form a multi-directional induction structure. A large round hole 21 for placing the conductive ball 5 is provided at the center of the middle plate 2. A second metal conductive layer 22 is provided on the inner wall of the large round hole and the surface of the middle plate. The angle positioning plate 3 is covered below the middle plate 2. A small round hole 31 for limiting the conductive ball 5 is provided at the center of the angle positioning plate 3. A third metal conductive layer 32 is provided on the inner wall of the small round hole and the surface of the angle positioning plate. The third metal conductive layer 32 completely covers the small round hole. The diameter of the large round hole is greater than the diameter of the conductive ball, the diameter of the conductive ball is greater than the diameter of the small round hole, and the small round hole forms a limiting step. The lower cover plate 4 is covered below the positioning plate 3. A fourth metal conductive layer 41 is provided on the inner side of the lower cover plate 4. The metal conductive layer is made by electroplating process. A solder pad 42 is provided on the outer side of the lower cover plate 4.

[0044] Specifically, as Figure 15 shown, the principle of the first metal conductive layer 11 being semicircular to form a unidirectional induction structure is that according to the specified functional tilt orientation, the first metal conductive layer 11 is separated from the metal conductors of the middle plate 2 and the angle positioning plate 3. The metal conductive beads in the bin touch the circuit conductors on the inner side of the upper cover plate through inclined rolling, so that the two electric shock conductors are energized through the metal conductive beads to trigger a one-way detection.

[0045] Specifically, as Figure 16 shown, the principle of the first metal conductive layer 11 being two and separately formed to form a bidirectional induction structure is that two first metal conductive layers 11 are respectively provided on the inner side of the upper cover plate 1 according to the specified functional tilt orientation. Each first metal conductive layer 11 is respectively connected to each solder pad pin on the outer side of the fourth-layer lower cover plate to form a circuit conductor. The second-layer middle plate metal conductive layer and the third-layer angle positioning plate metal conductive layer body are connected to the outer side solder pad pins of the fourth layer to form a circuit conductor. The metal conductive beads in the switch are normally in the second-layer and third-layer round hole circuit bins and do not contact any circuit conductors of the first layer. When the switch is tilted in two directions respectively, the metal conductive beads in the bin will roll to make the two electric shock bodies contact and be energized, thus forming a bidirectional normally open ball switch. As Figure 17 shown, the small round hole can be formed by two holes with different sizes, and the inner side of the semi-through hole formed by not drilling through the hole forms a step.

[0046] Specifically, as Figure 17As shown in the figure, the first metal conductive layer 11 has a plurality of mutually separate and equally circumferentially arranged to form a multi-directional induction structure. The first metal conductive layer 11 is set according to the functional inclination direction. Each circuit conductor is respectively connected to each pad pin on the outer side of the fourth-layer lower cover plate to form each circuit conductor. The second-layer middle plate metal conductive layer and the circuit conductors of the third-layer metal conductive layer are connected to form a common conductor and are connected to the pad pins specified on the outer side of the fourth-layer lower cover plate to form common pad pins. The metal conductive beads in the switch are normally not in contact with any circuit conductors of the first layer in the circular hole circuit chambers of the second and third layers. When the switch is tilted in multiple directions respectively, the metal conductive beads in the chamber will roll to make the two electric shock bodies contact and conduct electricity, thus forming a multi-directional normally open ball switch.

[0047] A patch-type tilt ball switch integrated pressing production process includes the following steps.

[0048] ① Press and integrate the angle positioning plate and the lower cover plate into one body. The third metal conductive layer of the angle positioning plate is located above, and the fourth metal conductive layer of the lower cover plate is located above while the pads are located below.

[0049] ② Press and integrate the middle plate above the angle positioning plate. The second metal conductive layer of the middle plate is located above.

[0050] ③ Put the conductive balls into the large circular holes of the angle positioning plate. Since the diameter of the large circular holes is larger than the diameter of the conductive balls, and the diameter of the conductive balls is larger than the diameter of the small circular holes, the bottom of the conductive balls will be movably embedded in the small circular holes, and the small circular holes form a limiting step. The combination of the small circular holes and the large circular holes forms a limiting step.

[0051] ④ Cover the upper cover plate above the middle plate. The first metal conductive layer of the upper cover plate is located above.

[0052] Adopting the integrated pressing production process can realize mass production of patch-type tilt ball switches, improve production efficiency, reduce costs, with diverse and advanced structures and strong practicability, providing better competitive advantages for products.

[0053] The above content is a further detailed description of the present invention in combination with specific preferred implementation manners. It cannot be determined that the specific implementation of the present invention is only limited to these descriptions. For those of ordinary skill in the technical field to which the present invention belongs, without departing from the concept of the present invention, several simple deductions or substitutions can still be made, which should all be regarded as belonging to the protection scope of the present invention.

Claims

1. A patch type tilt ball switch, characterized in that: It includes an upper cover plate, a middle plate, an angle clamping plate, a lower cover plate and a conductive ball. The upper cover plate is covered on the middle plate. The inner side of the upper cover plate is provided with a first metal conductive layer. A large circular hole for placing the conductive ball is provided at the center of the middle plate. The inner wall of the large circular hole and the surface of the middle plate are provided with a second metal conductive layer. The middle plate is covered with an angle clamping plate below. A small circular hole for limiting the conductive ball is provided at the center of the angle clamping plate. The inner wall of the small circular hole and the surface of the angle clamping plate are provided with a third metal conductive layer. The diameter of the large circular hole is larger than the diameter of the conductive ball, and the diameter of the conductive ball is larger than the diameter of the small circular hole. The lower cover plate is covered below the angle clamping plate. The inner side of the lower cover plate is provided with a fourth metal conductive layer, and the outer side of the lower cover plate is provided with a welding pad. When the patch-type tilt ball switch is of normally open type, the first metal conductive layer and the second metal conductive layer are in contact with each other to form a first electric shock conductor, and the first electric shock conductor is connected to one of the pads at the bottom of the lower cover. The third metal conductive layer is arranged on the left side, and the third metal conductive layer is in contact with the fourth metal conductive layer to form a second electric shock conductor, and the second electric shock conductor is connected to another pad of the lower cover. When placed flat, the conductive ball is only in contact with the second electric shock conductor. At this time, the switch is in an open circuit state, i.e., normally open. When the conductive ball reaches the tilt angle, it rolls and contacts the first electric shock conductor and the second electric shock conductor respectively to achieve conduction. At this time, the switch is in an on state to trigger the induction circuit. When the patch-type tilt ball switch is of normally closed type, the first metal conductive layer, the second metal conductive layer, and the third metal conductive layer are in contact to form a first electric shock conductor, and the first electric shock conductor is connected to one of the pads at the bottom of the lower cover. The first metal conductive layer, the second metal conductive layer, and the third metal conductive layer are all arranged on the right side at the same time. The fourth metal conductive layer is used alone as the second electric shock conductor, and the second electric shock conductor is connected to another pad of the lower cover. When it is placed flat or the tilt angle is not enough, the conductive ball contacts the third metal conductive layer and the fourth metal conductive layer; thereby realizing the normally closed connection between the first electric shock conductor and the second electric shock conductor. At this time, the switch is in the on state, that is, normally closed. When the conductive ball reaches the tilt angle, it rolls and contacts the first electric shock conductor and separates from the second electric shock conductor to achieve disconnection. At this time, the switch is in the circuit-breaking state, that is, normally open. The third metal conductive layer is a circular ring with small circular holes arranged all over the inner wall to form an omnidirectional sensing structure. Alternatively, the third metal conductive layer is a local shape forming a unidirectional sensing structure, Alternatively, the third metal conductive layers are two and are separated from each other to form a bidirectional sensing structure. Alternatively, there are multiple third metal conductive layers and they are arranged in a circle around the central axis of the small circular hole, and adjacent third metal conductive layers are separated to form a multi-directional sensing structure.

2. The patch type tilt ball switch according to claim 1, characterized in that: The small circular hole is combined with the large circular hole to form a limiting step.

3. A patch type tilt ball switch integrated pressing production process, characterized in that: The method for producing the patch type tilt ball switch according to claim 1 or 2 comprises the following steps: ① Press and integrate the angle clamping plate and the lower cover plate, with the third metal conductive layer of the angle clamping plate located on the upper side, the fourth metal conductive layer of the lower cover plate located on the upper side and the pad located on the lower side; ② Press and integrate the middle plate onto the angle clamping plate, with the second metal conductive layer of the middle plate located on top; ③Put the conductive ball into the large circular hole of the middle plate. Since the diameter of the large circular hole is larger than that of the conductive ball, and the diameter of the conductive ball is larger than that of the small circular hole, the bottom of the conductive ball will be movably embedded in the small circular hole, and the small circular hole will form a limiting step. The small circular hole and the large circular hole are combined to form a limiting step; ④ Press and integrate the upper cover onto the middle plate.

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