Device and method for laser transmission of microchip

Abstract

The present invention discloses a device and method for laser transmission of microchips, which are used for transmitting microchips. The microchip is bonded to a thermal tape, which is placed directly above a receiving substrate, and a low-power laser is used to selectively irradiate the microchip under the thermal tape. The thermal tape becomes less sticky due to heat, and the microchip bonded at the hot spot falls to the corresponding position of the receiving substrate under the action of gravity to complete the transmission process. The transmission method has a simple structural design, high transmission efficiency, and low device cost, and is suitable for the precise transmission of microchips and fragile micro devices.

Description

Technical Field

[0001] The invention belongs to the field of microchip manufacturing and relates to a device and method for laser transmission of a microchip. Background Art

[0002] Microchips are widely used in mobile phones, computers, medical devices, industrial control and other products and systems, and are the core cornerstone of high-end manufacturing. With the continuous development of the chip industry, microchips have become a development trend, but the existing microchip transmission technology cannot meet the current application needs. Existing microchip transmission mostly uses robot clamping to transmit microchips through physical contact. This transmission method has a slow transmission speed and is prone to damage to the edge of the chip. An efficient non-contact transmission method is urgently needed. Summary of the invention

[0003] The purpose of the present invention is to overcome the shortcomings of the above-mentioned prior art and to provide a device and method for laser transmission of microchips, which can achieve accurate transmission of the microchip to a specified position of a chip receiving substrate through a non-contact transmission method, thereby avoiding damage to the edge of the microchip during the transmission process.

[0004] In order to achieve the above object, the present invention adopts the following technical solutions:

[0005] A laser transmission microchip device comprises a substrate, a three-dimensional motion platform, a first support frame and a laser;

[0006] The three-dimensional motion platform is fixed on the substrate, a sample stage is arranged on the top of the three-dimensional motion platform, two ends of the sample stage extend upward, a thermal tape with a microchip is arranged on the top of the sample stage, two ends of the thermal tape are fixed on the top of two extension sections of the sample stage, the microchip is located at the bottom of the thermal tape, and a chip receiving substrate is arranged in the middle of the sample stage;

[0007] The first support frame is fixed on the base plate, the laser is fixed on the first support frame, the laser is located directly above the sample stage, and the output end of the laser faces the sample stage.

[0008] Preferably, a second support frame is provided on the substrate, a first CCD camera is fixed on the second support frame, the first CCD camera lens is arranged downward, and the first CCD camera is located above one of the horizontal axes of the three-dimensional motion platform.

[0009] Preferably, a three-dimensional manual displacement platform is arranged on the substrate, a second CCD camera is fixed on the top of the three-dimensional manual displacement platform, and the lens of the second CCD camera is arranged horizontally and faces the sample stage.

[0010] Furthermore, the three-dimensional manual displacement platform includes a first-level manual linear slide, a second-level manual linear slide and a third-level manual linear slide. The first-level manual linear slide is fixed on the base plate; the second-level manual linear slide is fixed on the first-level manual linear slide by bolts, and the first-level manual linear slide and the second-level manual linear slide are perpendicular in the horizontal direction; an L-shaped connecting piece is provided on the top of the second-level manual linear slide, one side of the L-shaped connecting piece is vertically arranged, and the third-level manual linear slide is vertically fixed on the vertical side of the L-shaped connecting piece.

[0011] Preferably, the first support frame includes a support column and a support rod, the support column is vertically arranged, the bottom end of the support column is fixed on the base plate, and the support rod is horizontally fixed to the top end of the support column through a cross connector.

[0012] Preferably, the distance between the thermal adhesive tape and the chip receiving substrate is 2-5 mm.

[0013] A laser transmission microchip method based on any of the above-mentioned devices comprises the following steps;

[0014] Step 1: Place the chip receiving substrate in the middle of the sample stage, and fix the two ends of the thermal tape with the microchip attached to the top of the two extension sections of the sample stage;

[0015] Step 2, controlling the three-dimensional motion platform to move the sample stage, and moving the placement point of the chip receiving substrate where the microchip needs to be placed to just below the laser;

[0016] Step 3, start the laser, emit a laser beam downward, ablate the thermal tape, and release the microchip from the thermal tape to the chip receiving substrate;

[0017] Step 4, repeating steps 2 and 3 until all placement points on the chip receiving substrate are placed with microchips, completing the laser transmission of the microchip at each placement point, turning off the laser, and removing the thermal tape and the chip receiving substrate.

[0018] Preferably, step 2 further includes the following steps:

[0019] Step 1, control the three-dimensional motion platform to move the sample stage, move any point of the thermal tape to directly under the laser, and start the laser to perform ablation recording of the reference point;

[0020] Step 2, using the thermal tape as a plane, establishing plane coordinates, with the reference point as the origin of the coordinates;

[0021] Step 3, controlling the three-dimensional motion platform to move the sample stage, moving the test point and each placement point in turn to below the lens of the first CCD camera, and recording the coordinates of each placement point according to the distance moved by the three-dimensional motion platform;

[0022] Step 4, according to the order and distance of the movement of the three-dimensional motion platform in step 4, control the three-dimensional motion platform to move the sample stage, move the reference point to directly under the laser, and then move the three-dimensional motion platform according to the coordinates of each placement point to perform laser transmission.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] The device of the present invention places a sample stage on a three-dimensional motion platform, and can move the sample stage by controlling the three-dimensional motion platform. A chip receiving substrate is placed at the bottom of the sample stage, and thermal tapes are fixed on the edges of both sides of the sample stage, and a microchip is adhered to the thermal tapes. The microchip is placed directly below the receiving substrate. The laser is focused on the center of the microchip through the three-dimensional motion platform, so that the laser beam is emitted by the laser to ablate the thermal tape, so that the microchip is released from the thermal tape to the chip receiving substrate. Through this non-contact transmission method, the microchip is accurately transmitted to the specified position of the chip receiving substrate, avoiding damage to the edge of the microchip during the transmission process.

[0025] Furthermore, by setting up the first CCD camera, the position coordinates of the center point of each microchip on the thermal tape can be obtained through the movement of the three-dimensional motion platform.

[0026] Furthermore, by providing a second CCD camera, the release of the microchip from the thermal tape can be observed through the second CCD camera, and the release process of the microchip and whether it is successfully released to the placement point of the chip receiving substrate can be observed.

[0027] Furthermore, by connecting the support column and the support rod of the first support frame through a cross connector, the lifting and position adjustment of the laser can be realized, which facilitates the installation and removal of the laser.

[0028] The method of the present invention controls a three-dimensional motion platform to simultaneously move the thermal tape and the chip receiving substrate on the sample stage, and sequentially moves each placement point on the chip receiving substrate to directly under the laser for laser transmission. The non-contact transmission method is used to achieve precise transmission of the microchip to the specified position of the chip receiving substrate, thereby avoiding damage to the edge of the microchip during the transmission process.

[0029] Furthermore, by moving the reference point and each placement point in turn to the bottom of the lens of the first CCD phase, the coordinates of each placement point are recorded according to the distance moved by the three-dimensional motion platform, so that the placement point can be accurately moved to the bottom of the laser through the coordinate position, avoiding errors caused by manual proofreading and improving the accuracy of laser transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1It is a structural schematic diagram of the present invention;

[0031] Figure 2 It is a schematic diagram of the sample stage structure of the present invention;

[0032] Figure 3A A schematic diagram of the laser transmission process of the present invention;

[0033] Figure 3B It is a second schematic diagram of the laser transmission process of the present invention;

[0034] Figure 3C The third schematic diagram of the laser transmission process of the present invention;

[0035] Figure 3D Schematic diagram of the laser transmission process of the present invention.

[0036] Among them: 1-X-axis motion platform; 2-Y-axis motion platform; 3-Z-axis motion platform; 4-base plate; 5-connecting plate; 6-right-angle connector; 7-L-shaped sample stage base; 8-sample stage; 9-thermal tape; 10-microchip; 11-chip receiving base plate; 12-laser; 13-laser fixing part; 14-support rod; 15-cross connector; 16-support column; 17-first CCD camera; 18-first macro lens; 19-camera fixing plate; 20-first fixed pillar; 21-second fixed pillar; 22-third fixed pillar; 23-right-angle fixed foot block; 24-second CCD camera; 25-second macro lens; 26-first-level manual linear slide; 27-second-level manual linear slide; 28-third-level manual linear slide; 29-camera fixing part; 30-L-shaped connector; 31-connecting block. DETAILED DESCRIPTION

[0037] The present invention is further described in detail below in conjunction with the accompanying drawings:

[0038] like Figure 1 As shown, the laser transmission microchip device of the present invention includes a substrate 4, a three-dimensional motion platform, a first support frame, a second support frame, a three-dimensional manual displacement platform, a laser 12, a CCD camera and a macro lens.

[0039] The substrate 4 adopts a shock-absorbing platform, and the three-dimensional motion platform is fixed on the substrate 4. The three-dimensional motion platform is composed of three precision electric displacement platforms, which are used to accurately control the three-dimensional motion of the sample stage 8. It specifically includes: an X-axis motion platform 1, a Y-axis motion platform 2 and a Z-axis motion platform 3. The X-axis motion platform 1 is fixed to the shock-absorbing platform by screw connection. The Y-axis motion platform 2 is fixed to the X-axis motion platform 1 through a connecting plate 5. The Z-axis motion platform 3 is fixed to the Y-axis motion platform 2 through a right-angle connector 6. An L-shaped sample stage base 7 is installed on the Z-axis motion platform 3 to fix the sample stage 8 required for the experiment. The sample stage 8 and the L-shaped sample stage base 7 are matched in concave and convex shape through the concave structure at the bottom of the sample stage 8 and the convex structure at the top of the L-shaped sample stage base 7, thereby achieving stable fixation of the sample stage 8 and facilitating the replacement of sample stages 8 with other functions.

[0040] like Figure 2 As shown, the sample stage 8 is a U-shaped structure, the top of the two side walls is used to fix the thermal tape 9, the microchip 10 is bonded to the bottom of the thermal tape 9, and the bottom of the U-shaped structure is used to hold the chip receiving substrate 11. The distance between the thermal tape 9 and the chip receiving substrate 11 is 2-5mm.

[0041] The first support frame is fixed on the substrate 4, and the laser 12 is fixed on the first support frame. The laser 12 is located directly above the sample stage 8, and the output end of the laser 12 faces the sample stage 8. The laser 12 is fixed on the shock-absorbing platform through a laser fixture 13, a support rod 14, a cross connector 15, and a support column 16. The laser fixture 13 is composed of a rectangular block and a round tube, and threaded holes are provided on the rectangular block and the round tube, wherein the laser 12 passes through the round tube and is fixed to the round tube by a set screw. The laser fixture 13 is bolted to the support rod 14 through the threaded hole on the rectangular block. The support column 16 is connected to the support rod 14 through a cross connector 15. The lifting and position adjustment of the laser 12 can be achieved through the cross connector 15.

[0042] A second support frame is provided on the substrate 4, and the second support frame includes three parts: a camera fixing plate 19, three fixing pillars, and a plurality of right-angle fixing foot blocks 23. A first CCD camera 17 is fixed on the second support frame, and the lens of the first CCD camera 17 is arranged directly downward. The first CCD camera 17 is connected to a first macro lens 18, and the first CCD camera 17 and the first macro lens 18 are connected by threads. The first CCD camera 17 is connected to a first fixing pillar 20 in the horizontal direction by bolts using a camera fixing plate 19, and the three fixing pillars are fixed by a plurality of right-angle fixing foot blocks 23, which are connected by bolts. The first fixing pillar 20 is connected to a second fixing pillar 21 and a third fixing pillar 22 in the vertical direction by bolts using two right-angle fixing foot blocks 23, respectively. The second fixing pillar 21 and the third fixing pillar 22 are connected to the shock-absorbing platform by bolts using two right-angle fixing foot blocks 23, respectively. The first CCD camera 17 is located above one of the horizontal axes of the three-dimensional motion platform.

[0043] A three-dimensional manual displacement platform is provided on the substrate 4, and a second CCD camera 24 is fixed on the top of the three-dimensional manual displacement platform. The lens of the second CCD camera 24 is horizontally arranged, facing the sample stage 8. The second CCD camera 24 is connected to a second macro lens 25, and the second CCD camera 24 and the second macro lens 25 are connected by threads.

[0044] The three-dimensional manual displacement platform includes a first-level manual linear slide 26, a second-level manual linear slide 27 and a third-level manual linear slide 28, which serve as the X, Y and Z axes respectively. The first-level manual linear slide 26 is fixed to the base plate 4 by bolts using a connecting block 31; the second-level manual linear slide 27 is fixed to the first-level manual linear slide 26 by bolts, and the first-level manual linear slide 26 and the second-level manual linear slide 27 are perpendicular in the horizontal direction; an L-shaped connector 30 is provided on the top of the second-level manual linear slide 27, one side of the L-shaped connector 30 is vertically arranged, and the third-level manual linear slide 28 is vertically fixed on the vertical side of the L-shaped connector 30. The second macro lens 25 is connected to the third-level manual linear slide 28 by bolts using a camera fixing member 29, and a through hole is provided in the middle of the camera fixing member 29, which is nested on the second macro lens 25.

[0045] When using the present device for laser transmission on a microchip 10, FIG. 3A to FIG. 3DAs shown, the cut microchip 10 is transferred to the thermal tape 9. The chip receiving substrate 11 is placed under the thermal tape 9 with the microchip 10 bonded thereto, and is kept at a relatively close distance to the thermal tape 9. The microchip 10 is moved to the focal position of the laser 12. Finally, the laser beam is focused on the surface of the thermal tape 9. At room temperature, the thermal tape 9 has a viscosity similar to that of ordinary tape. When the laser beam is focused on the thermal tape 9, the surface temperature of the thermal tape 9 increases, and its viscosity decreases rapidly, and the microchip 10 falls from under the thermal tape 9 to the chip receiving substrate 11 under the action of gravity. The specific process is:

[0046] Step 1: Place the chip receiving substrate 11 at the middle position of the bottom of the sample stage 8 , and fix the two ends of the thermal tape 9 with the microchip 10 attached to the top of the extension sections on both sides of the sample stage 8 .

[0047] Step 2: Control the three-dimensional motion platform to move the sample stage 8, move any point of the thermal tape 9 to directly below the laser 12, and start the laser 12 to perform ablation recording of the reference point.

[0048] Step 3: Use the thermal adhesive tape 9 as a plane to establish plane coordinates, with the reference point as the origin of the coordinates.

[0049] Step 4, control the three-dimensional motion platform to move the sample stage 8, move the reference point and each placement point in turn to under the lens of the first CCD camera 17, and record the coordinates of each placement point according to the distance moved by the three-dimensional motion platform.

[0050] Step five, according to the order and distance of the movement of the three-dimensional motion platform in step four, control the three-dimensional motion platform to move the sample stage 8 and move the reference point to be directly below the laser 12.

[0051] Step six, control the movement of the three-dimensional motion platform, move according to the coordinates of each placement point, move each placement point in turn to directly under the laser 12, perform laser transmission, start the laser 12, emit a laser beam downward, ablate the thermal tape 9, and release the microchip 10 from the thermal tape 9 to the chip receiving substrate 11.

[0052] Step seven, until all the placement points on the chip receiving substrate 11 are placed with microchips 10, the laser transmission of the microchip 10 at each placement point is completed, the laser 12 is turned off, and the thermal tape 9 and the chip receiving substrate 11 are removed.

[0053] The above contents are only for explaining the technical idea of ​​the present invention and cannot be used to limit the protection scope of the present invention. Any changes made on the basis of the technical solution in accordance with the technical idea proposed by the present invention shall fall within the protection scope of the claims of the present invention.

Claims

1. A laser transmission microchip device, characterized in that: It comprises a substrate (4), a three-dimensional motion platform, a first support frame and a laser (12); The three-dimensional motion platform is fixed on the substrate (4), a sample platform (8) is arranged on the top of the three-dimensional motion platform, both ends of the sample platform (8) extend upward, a thermal tape (9) with a microchip (10) is arranged on the top of the sample platform (8), both ends of the thermal tape (9) are fixed on the top of two extension sections of the sample platform (8), the microchip (10) is located at the bottom of the thermal tape (9), and a chip receiving substrate (11) is arranged in the middle of the sample platform (8); The first support frame is fixed on the substrate (4), the laser (12) is fixed on the first support frame, the laser (12) is located directly above the sample stage (8), and the output end of the laser (12) faces the sample stage (8); A second support frame is arranged on the base plate (4), a first CCD camera (17) is fixed on the second support frame, the lens of the first CCD camera (17) is arranged downwards, and the first CCD camera (17) is located above one of the horizontal axes of the three-dimensional motion platform; A three-dimensional manual displacement platform is arranged on the substrate (4), a second CCD camera (24) is fixed on the top of the three-dimensional manual displacement platform, and the lens of the second CCD camera (24) is arranged horizontally and faces the sample stage (8); The three-dimensional manual displacement platform comprises a first-level manual linear slide (26), a second-level manual linear slide (27) and a third-level manual linear slide (28), wherein the first-level manual linear slide (26) is fixed on a base plate (4); the second-level manual linear slide (27) is fixed on the first-level manual linear slide (26) by bolts, and the first-level manual linear slide (26) and the second-level manual linear slide (27) are perpendicular in the horizontal direction; an L-shaped connecting piece (30) is arranged on the top of the second-level manual linear slide (27), one side of the L-shaped connecting piece (30) is arranged vertically, and the third-level manual linear slide (28) is vertically fixed on the vertical side of the L-shaped connecting piece (30).

2. A laser transmission microchip device according to claim 1, characterized in that: The first support frame comprises a support column (16) and a support rod (14); the support column (16) is arranged vertically, the bottom end of the support column (16) is fixed on the base plate (4), and the support rod (14) is horizontally fixed to the top end of the support column (16) via a cross connection piece (15).

3. A laser transmission microchip device according to claim 1, characterized in that: The distance between the thermal adhesive tape (9) and the chip receiving substrate (11) is 2-5 mm.

4. A laser transmission microchip method based on the device according to any one of claims 1 to 3, characterized in that: The steps include: Step 1: placing the chip receiving substrate (11) in the middle of the sample stage (8), and fixing the two ends of the thermal tape (9) with the microchip (10) attached to the top of the two extension sections of the sample stage (8); Step 2, controlling the three-dimensional motion platform to move the sample stage (8) and move the placement point of the chip receiving substrate (11) where the microchip (10) needs to be placed to directly below the laser (12); Step 3, starting the laser (12) to emit a laser beam downward to ablate the thermal tape (9) so that the microchip (10) is released from the thermal tape (9) onto the chip receiving substrate (11); Step 4, repeating steps 2 and 3 until all placement points on the chip receiving substrate (11) are placed with microchips (10), completing laser transmission of the microchip (10) at each placement point, turning off the laser (12), and removing the thermal tape (9) and the chip receiving substrate (11).

5. A laser transmission microchip method according to claim 4, characterized in that: Step 2 also includes the following steps: Step 1, controlling the three-dimensional motion platform to move the sample stage (8), moving any point of the thermal tape (9) to directly below the laser (12), and starting the laser (12) to perform ablation recording of the reference point; Step 2, using the thermal tape (9) as a plane, establishing plane coordinates, with the reference point as the coordinate origin; Step 3, controlling the three-dimensional motion platform to move the sample stage (8), moving the test point and each placement point in turn to below the lens of the first CCD camera (17), and recording the coordinates of each placement point according to the distance moved by the three-dimensional motion platform; Step 4, according to the order and distance of the movement of the three-dimensional motion platform in step (3), the three-dimensional motion platform is controlled to move the sample stage (8) and move the reference point to the bottom of the laser (12). The subsequent movement of the three-dimensional motion platform is carried out according to the coordinates of each placement point to perform laser transmission.

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