A double-layer flexible circuit board bending machine

Abstract

The present invention discloses a double-layer flexible circuit board bending machine, wherein a conveying device is arranged on one side of a frame, a visual positioning mechanism is arranged on the conveying device, and a manipulator loading and unloading mechanism is arranged on the upper part of the conveying device; an array of double-layer flexible circuit board bending mechanisms is arranged on the frame, a handling mechanism is arranged at the discharge end of the double-layer flexible circuit board bending mechanism, an AOI positioning and detection mechanism is located above the double-layer flexible circuit board bending mechanism, and a pre-dialing and pre-pressing mechanism is located in front of the double-layer flexible circuit board bending mechanism; the present invention automatically completes the actions from separation of double-layer flexible circuit boards to film tearing, and from lamination of double-layer circuit boards to shaping and bending by the equipment, which effectively saves manpower and improves the accuracy of bending, with a one-time yield rate of up to 99.7%; in terms of scalability, the core technology of the product is not only suitable for bending of flexible circuit boards of tablet computer displays, but also can meet the bending of flexible circuit boards of mobile phones and other products using flexible circuit boards, especially the most popular flexible AMOLED display technology.

Description

Technical Field

[0001] The invention relates to the technical field of flexible circuit board production equipment, and in particular to a double-layer flexible circuit board bending machine. Background Art

[0002] As display panel technology matures, consumers have higher requirements for display experience, and narrow frame technology has become the most eye-catching design, because it has a more extreme visual effect, and can also reduce the size of the body, indirectly improving the portability of the whole machine. As the core component of the display module, the touch module has a narrow frame, which brings the narrow edge of the driver circuit board to 3mm, and the height after bending is required to be ≤1.35mm, which is extremely demanding.

[0003] However, in the existing actual production, the production is carried out by manual cooperation with tooling fixtures, but this production has the following defects:

[0004] 1) Bending is difficult, resulting in low efficiency. Usually, a production line requires 8 to 10 people to complete it at the same time to meet the upstream and downstream beat balance, resulting in serious waste of manpower;

[0005] 2) Using manual bending with fixtures to control accuracy can easily cause rebound and glue layer shedding after bending, and the accuracy cannot meet the requirements and needs to be repaired, especially when the second layer of flexible circuit boards is attached to the first layer. Therefore, the yield rate can only be maintained at about 65%. Of the remaining 35% of defective products, nearly 1% are scrapped and cannot be repaired during the repair process, resulting in serious material cost losses. Summary of the invention

[0006] The present invention provides a double-layer flexible circuit board bending machine with high automation, simple structure, convenient operation and excellent comprehensive performance, so as to solve the technical problems of low production efficiency and high product defect rate in the prior art.

[0007] In order to solve the above-mentioned technical problems, the present invention provides the following technical solutions: a double-layer flexible circuit board bending machine, comprising: a frame, a conveying device, a visual positioning mechanism, a manipulator loading and unloading mechanism, a double-layer flexible circuit board bending mechanism, a handling mechanism, an AOI positioning and detection mechanism, a pre-dialing and pre-pressing mechanism, a film tearing mechanism and a film clamping mechanism;

[0008] The conveying device is arranged on one side of the frame and is used to transport the product;

[0009] The visual positioning mechanism is arranged on the conveying device, and is used to position the upper and lower parts of the products transported by the conveying device, to ensure that the mechanism for taking the products will not deviate, and to provide accurate position information for subsequent product bending;

[0010] The manipulator loading and unloading mechanism is arranged on the upper part of the conveying device, and is used to grab the products transported by the conveying device and then transport them to the rack;

[0011] The double-layer flexible circuit board bending mechanism, conveying mechanism, AOI positioning and detection mechanism, pre-dialing and pre-pressing mechanism, film tearing mechanism and film clamping mechanism are all arranged on the top of the frame;

[0012] The double-layer flexible circuit board bending mechanism array is arranged on the frame, and is used to attach the bottom layer flexible circuit board to the surface layer flexible circuit board, and then press the bonded double-layer flexible circuit board to a designated position;

[0013] The conveying mechanism is arranged at the discharge end of the double-layer flexible circuit board bending mechanism, and is used to convey the qualified products to the next process;

[0014] The AOI positioning and detection mechanism is located above the double-layer flexible circuit board bending mechanism, and is used to position the product and detect whether the process film has been torn off, and monitor the entire bending process, and finally detect the finished product after bending;

[0015] The pre-dialing and pre-pressing mechanism is located in front of the double-layer flexible circuit board bending mechanism, and is used to bend the product; the film tearing mechanism and the film clamping mechanism are arranged beside the double-layer flexible circuit board bending mechanism, and are used to tear off the protective film on the double-layer flexible circuit board.

[0016] Furthermore, the flexible circuit board bending machine also includes a waste film suction mechanism, which is fixed on the frame and is used to recover the protective film torn off from the double-layer flexible circuit board.

[0017] Furthermore, the double-layer flexible circuit board bending mechanism includes: a conveying module, a tooling fixture, a third bracket and a clamping mechanism, the third bracket is arranged above the frame, the clamping mechanism is fixedly connected to the third bracket, the conveying module is arranged above the frame, and the tooling fixture is movably arranged above the conveying module.

[0018] Furthermore, the transport mechanism includes: a transport module, a transport connecting block, a transport cylinder, a first support frame and a suction cup, the transport module is arranged above the frame, the transport connecting block is connected to the transport module, the transport cylinder is connected to the transport connecting block, the first support frame is connected to the transport cylinder, and a suction cup is provided below the first support frame.

[0019] Furthermore, the AOI positioning and detection mechanism includes: a second support frame, a camera fixing seat and an industrial camera, the second support frame is arranged above the frame, the camera fixing seat is connected to the second support frame, and the industrial camera is connected to the camera fixing seat.

[0020] Furthermore, the pre-dial and pre-pressing mechanism includes: a pre-dial up and down moving mechanism, a pre-dial front and back moving mechanism, a pre-pressing connecting block, a pre-dial plate, a pre-pressing pushing cylinder and a pressure head. The pre-dial front and back moving mechanism is connected to the frame, the pre-dial up and down moving mechanism is connected to the pre-dial front and back moving mechanism, the pre-pressing connecting block is connected to the pre-dial up and down moving mechanism, a pre-dial plate is provided below the pre-pressing connecting block, a pre-pressing pushing cylinder is provided above the pre-pressing connecting block, and a pressure head is provided at the end of the piston rod of the pre-pressing pushing cylinder.

[0021] Furthermore, the film tearing mechanism includes: a film tearing moving mechanism, a first film tearing cylinder, a first film tearing clamp, a second film tearing cylinder and a second film tearing clamp. The film tearing moving mechanism is arranged above the frame, the first film tearing cylinder is connected to the film tearing moving mechanism, the first film tearing clamp is connected to the first film tearing cylinder, the second film tearing cylinder is connected to the film tearing moving mechanism, and the second film tearing clamp is connected to the second film tearing cylinder.

[0022] Furthermore, the film clamping mechanism comprises: a film clamping moving mechanism, a film clamping cylinder and a film clamping block, the film clamping moving mechanism is connected to the frame, a film clamping cylinder is arranged above the film clamping moving mechanism, and the film clamping block is connected to the film clamping cylinder.

[0023] Furthermore, the conveying device includes: a product conveying line and a defective product conveying line, the product conveying line is arranged beside the frame, and the defective product conveying line is arranged above the product conveying line. The product conveying line is used to convey qualified products clamped by the loading and unloading mechanism of the manipulator, and the defective product conveying line is used to convey unqualified products after detection.

[0024] Furthermore, the clamping mechanism includes: a first motor conveying device, a clamping connection plate, a first clamping device, a second motor conveying device, and a second clamping device. The first motor conveying device is arranged above the third bracket, the clamping connection plate is connected to the first motor conveying device, the first clamping device is arranged in front of the clamping connection plate, the second motor conveying device is connected to the clamping connection plate, and the second clamping device is connected to the second motor conveying device. The first motor conveying device drives the clamping connection plate to move forward, thereby pushing the first clamping device and the second motor conveying device to move forward, the first clamping device is actuated to clamp and fix the product downward, the second motor conveying device is actuated to drive the second clamping device to move, the second clamping device is actuated to clamp and fix the product again.

[0025] Compared with the prior art, the present invention has the following advantages:

[0026] 1) From double-layer flexible circuit board separation to film tearing, from double-layer circuit board bonding to shaping and bending, all actions are completed automatically by the equipment, which effectively saves manpower and improves the accuracy of bending, with a one-time yield rate of up to 99.7%;

[0027] 2) Make full use of the stress characteristics of the flexible circuit board, and adopt the wedge principle, limit principle, and mechanical guidance principle in the core component structure design. The action design adopts the difference compensation principle and structure, and the visual guidance alignment principle, so the operation is stable and reliable;

[0028] 3) The core component structure design is miniature and precise, which effectively solves the successful grasping and tearing of small products. In addition to improving the first-time success rate of the product, it also effectively reduces the space occupied by the equipment.

[0029] 4) High speed brings high output. Compared with the current technical solutions, the production capacity is increased by 8 to 10 times.

[0030] 5) Promotability: The core technology of this product is not only suitable for the bending of flexible circuit boards for tablet computer displays, but also for the bending of flexible circuit boards for mobile phones, especially the most popular flexible AMOLED display technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present invention;

[0032] Figure 2 It is a schematic diagram of an enlarged part of the structure of an embodiment of the present invention;

[0033] Figure 3 for Figure 1 A is an enlarged view of the middle image.

[0034] Explanation of reference numerals: frame 1, conveying device 2, visual positioning mechanism 3, manipulator loading and unloading mechanism 4, double-layer flexible circuit board bending mechanism 5, handling mechanism 6, AOI positioning mechanism 7, pre-dialing and pre-pressing mechanism 8, film tearing mechanism 9 and film clamping mechanism 10, waste film suction mechanism 11, product conveying line 21, defective product conveying line 22, conveying module 51, tooling fixture 52, third bracket 53, clamping mechanism 54, handling module 61, handling connecting block 62, handling cylinder 63, first support frame 64, dialing The lower moving mechanism 81, the pre-shifting front and rear moving mechanism 82, the pre-pressing connecting block 83, the pre-shifting plate 84, the pre-pressing pushing cylinder, the pressure head 86, the film tearing moving mechanism 91, the first film tearing cylinder 92, the first film tearing clamp 93, the second film tearing cylinder 94, the second film tearing clamp 95, the film clamping moving mechanism 101, the film clamping cylinder 102, the film clamping block 103, the first motor conveying device 541, the clamping connecting plate 542, the first clamping device 543, the second motor conveying device 544, and the second clamping device 545. DETAILED DESCRIPTION

[0035] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0036] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0037] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein, for example. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0038] Now, exemplary embodiments according to the present application will be described in more detail with reference to the accompanying drawings. However, these exemplary embodiments may be implemented in a variety of different forms and should not be construed as being limited to the embodiments described herein. It should be understood that these embodiments are provided to make the disclosure of the present application thorough and complete, and to fully convey the concepts of these exemplary embodiments to those of ordinary skill in the art. In the accompanying drawings, for the sake of clarity, the thickness of the layers and regions may be enlarged, and the same reference numerals are used to represent the same devices, and thus their descriptions will be omitted.

[0039] Please see attached Figure 1 ~Attached Figure 3 As shown: a double-layer flexible circuit board bending machine, including: a frame 1, a conveying device 2, a visual positioning mechanism 3, a manipulator loading and unloading mechanism 4, a double-layer flexible circuit board bending mechanism 5, a conveying mechanism 6, an AOI positioning and detection mechanism 7, a pre-dialing and pre-pressing mechanism 8, a film tearing mechanism 9 and a film clamping mechanism 10;

[0040] The conveying device 2 is arranged on one side of the frame 1 and is used to transport products;

[0041] The visual positioning mechanism 3 is arranged on the conveying device 2, and is used to position the upper and lower parts of the products transported by the conveying device 2, to ensure that the mechanism for taking the products will not deviate, and to provide accurate position information for subsequent product bending;

[0042] The manipulator loading and unloading mechanism 4 is arranged on the upper part of the conveying device 2, and is used to grab the products transported by the conveying device 2 and then transport them to the frame 1;

[0043] The double-layer flexible circuit board bending mechanism 5, the conveying mechanism 6, the AOI positioning and detection mechanism 7, the pre-dialing and pre-pressing mechanism 8, the film tearing mechanism 9 and the film clamping mechanism 10 are all arranged on the top of the frame 1;

[0044] The double-layer flexible circuit board bending mechanism 5 is arranged in an array on the frame 1, and is used to attach the bottom layer flexible circuit board to the surface layer flexible circuit board, and then press the bonded double-layer flexible circuit board to a designated position;

[0045] The conveying mechanism 6 is provided at the discharge end of the double-layer flexible circuit board bending mechanism 5 and is used to convey the qualified products to the next process;

[0046] The AOI positioning and detection mechanism 7 is located above the double-layer flexible circuit board bending mechanism 5, and is used to position the product and detect whether the process film is torn off, and monitor the entire bending process, and finally detect the finished product after bending;

[0047] The pre-dialing and pre-pressing mechanism 8 is located in front of the double-layer flexible circuit board bending mechanism 5 and is used to perform bending operations on the product;

[0048] The film tearing mechanism 9 and the film clamping mechanism 10 are arranged beside the double-layer flexible circuit board bending mechanism 5 and are used to tear off the protective film on the double-layer flexible circuit board.

[0049] The controller is arranged inside the frame 1, and the controller adopts the existing commercially available PLC controller. The circuit board to be bent continuously moves along the conveying device 2 toward the direction of the manipulator loading and unloading mechanism 4. The visual positioning mechanism 3 identifies and locates the circuit board above the conveying device 2, and transmits the corresponding positioning information to the controller. After the controller processes the information transmitted by the visual positioning mechanism 3, it gives the manipulator loading and unloading mechanism 4 an action instruction, so that the manipulator loading and unloading mechanism 4 can accurately grasp the product, and transport the product to the double-layer flexible circuit board bending mechanism 5 for bending processing; the AOI positioning and detection mechanism 7 identifies and locates the product in the tooling fixture 52, and transmits the corresponding positioning information to the controller. After the controller processes the information transmitted by the AOI positioning and detection mechanism 7, it gives the conveying module 51 another action instruction, and transports the tooling fixture 52 to the bottom of the clamping mechanism 54, so as to facilitate accurate bending after tearing the film; the clamping mechanism After the product is pressed, the pre-dial and pre-pressing mechanism 8 is activated and inserted into the middle of the product to separate the upper flexible circuit board and the lower flexible circuit board. The film clamping mechanism 10 is activated to clamp the upper flexible circuit board that is pushed open. The film clamping mechanism 10 is activated to tear off the adhesive protective film below the upper flexible circuit board and above the lower flexible circuit board, and the torn adhesive protective film is transported to the waste film suction mechanism 11 for recycling; after the film tearing is completed, the pre-dial and pre-pressing mechanism 8 is activated again to effectively adhere the adhesive of the upper flexible circuit board to the lower flexible circuit board; after the upper flexible circuit board and the lower flexible circuit board are adhered, the pre-dial and pre-pressing mechanism 8 continues to act to bend the upper flexible circuit board and the lower flexible circuit board, and the AOI positioning and detection mechanism 7 monitors the bending process in real time and performs visual inspection on the finished product after bending. If the inspection is qualified, the corresponding product is transported to the product conveying line 21, and if the inspection determines that it is an unqualified product, it is transported to the defective product conveying line 22.

[0050] The flexible circuit board bending machine also includes a waste film suction mechanism 11, which is fixed on the frame 1 and is used to recover the protective film torn off from the double-layer flexible circuit board. The waste film suction mechanism 11 includes: a receiving hopper, an air pump and a waste collection bucket. The receiving hopper is arranged above the frame 1, one end of the air pump is connected to the receiving hopper, and the other end is connected to the waste collection bucket. The air pump and the waste collection bucket are arranged inside the frame 1; when the air pump is activated, the film tearing mechanism 9 transports the torn protective film to the top of the receiving hopper, and the protective film falling into the receiving hopper is transported to the waste collection bucket under the negative pressure suction of the air pump. Within the set time, the protective film in the waste collection bucket is cleaned.

[0051] The double-layer flexible circuit board bending mechanism 5 includes: a conveying module 51, a jig 52, a third bracket 53 and a clamping mechanism 54. The third bracket 53 is arranged above the frame 1. The clamping mechanism 54 is fixedly connected to the third bracket 53. The conveying module 51 is arranged above the frame 1. The jig 52 is movably arranged above the conveying module 51. The conveying module 51 is used to drive the jig 52 to move, push the jig 52 to the edge of the frame 1, obtain the product to be bent conveyed by the manipulator loading and unloading mechanism 4, and then convey the jig 52 to the bottom of the third bracket 53. The clamping mechanism 54 then clamps the product above the jig 52, so that the film tearing mechanism 9 can perform the film tearing process and the pre-dipping and pre-pressing mechanism 8 can perform the bending process. After the bending is completed, the conveying module 51 conveys the jig 52 to the edge of the frame 1 for product unloading.

[0052] The transport mechanism 6 includes: a transport module 61, a transport connection block 62, a transport cylinder 63, a first support frame 64 and a suction cup. The transport module 61 is arranged above the frame 1, the transport connection block 62 is connected to the transport module 61, the transport cylinder 63 is connected to the transport connection block 62, the first support frame 64 is connected to the transport cylinder 63, and a suction cup is arranged below the first support frame 64. The mobile module drives the transport connection block 62 to move forward and backward, and then drives the transport cylinder 63 to move forward and backward to the top of the tooling fixture 52 to be unloaded, the transport cylinder 63 pushes the first support frame 64 to move downward, so that the suction cup absorbs the product above the tooling fixture 52, and then the transport cylinder 63 drives the first support frame 64 to move upward, and the mobile module drives the transport cylinder 63 to move to the transition bracket, and the product is placed on the transition bracket, and then the robot loading and unloading mechanism 4 takes out the product on the transition bracket and transports it to the corresponding conveyor line.

[0053] The AOI positioning and detection mechanism 7 includes: a second support frame 71, a camera fixing seat 72 and an industrial camera 73. The second support frame 71 is arranged above the frame 1, the camera fixing seat 72 is connected to the second support frame 71, and the industrial camera 73 is connected to the camera fixing seat 72. The industrial camera 73 is also called a visual sensor. The industrial camera 73 takes a picture of the target object and converts it into an electrical signal that can be processed by the control system after a specific algorithm calculation, so as to measure the position of the target object; the industrial camera 73 is used to take a picture and compare the product above the tooling fixture 52. After the controller calculates and processes, it can be known whether the product above the tooling fixture 52 is directly below the clamping mechanism 54. If there is a deviation, the controller will give the corresponding movement instruction to the conveying module 51, and convey the product to the directly below the clamping mechanism 54, so as to accurately operate the subsequent film tearing and bending actions; by adjusting the position of the camera fixing seat 72, the position of the industrial camera 73 is moved, so that the industrial camera 73 can adapt to different types of products.

[0054] The pre-dialing and pre-pressing mechanism 8 comprises: a pre-dialing up-and-down moving mechanism 81, a pre-dialing front-and-back moving mechanism 82, a pre-pressing connecting block 83, a pre-dialing plate 84, a pre-pressing pushing cylinder and a pressing head 86. The pre-dialing front-and-back moving mechanism 82 is connected to the frame 1, the pre-dialing up-and-down moving mechanism 81 is connected to the pre-dialing front-and-back moving mechanism 82, the pre-pressing connecting block 83 is connected to the pre-dialing up-and-down moving mechanism 81, a pre-dialing plate 84 is provided below the pre-pressing connecting block 83, a pre-pressing pushing cylinder is provided above the pre-pressing connecting block 83, and a pressing head 86 is provided at the end of the piston rod of the pre-pressing pushing cylinder. Specifically, the front end surface of the pre-dialing plate 84 is provided with an inclined surface for contacting with the flexible circuit board, which helps to quickly push the lower flexible circuit board to bond with the upper flexible circuit board.

[0055] The pre-dial forward and backward moving mechanism 82 drives the pre-dial up and down moving mechanism 81 to move forward and backward, and the pre-dial up and down moving mechanism 81 drives the pre-pressing connecting block 83 to move up and down, and at the same time can drive the pre-dial plate 84 and the pre-pressing pushing cylinder to move up and down; when the upper flexible circuit board and the lower flexible circuit board are bonded, the pre-dial forward and backward moving mechanism 82 drives the pre-dial up and down moving mechanism 81 to move forward, so that the pre-dial plate 84 pushes the lower flexible circuit board to move upward, so that the lower flexible circuit board and the upper flexible circuit board are gradually bonded; after the bonding is completed, the bending process is carried out, the pre-pressing pushing cylinder pushes the pressure head 86 to extend outward, and the pre-dial up and down moving mechanism 81 drives the pre-pressing connecting block 83 to move downward, so that the pressure head 86 acts on the bonded double-layer flexible circuit board to complete the bending process.

[0056] The film tearing mechanism 9 includes: a film tearing moving mechanism 91, a first film tearing cylinder 92, a first film tearing clamp 93, a second film tearing cylinder 94 and a second film tearing clamp 95. The film tearing moving mechanism 91 is arranged above the frame 1, the first film tearing cylinder 92 is connected to the film tearing moving mechanism 91, the first film tearing clamp 93 is connected to the first film tearing cylinder 92, the second film tearing cylinder 94 is connected to the film tearing moving mechanism 91, and the second film tearing clamp 95 is connected to the second film tearing cylinder 94. The film-tearing moving mechanism 91 is used to drive the first film-tearing cylinder 92 and the second film-tearing cylinder 94 to move. The first film-tearing cylinder 92 is used to drive the first film-tearing clamp 93 to move, so as to take and place the adhesive protective film of the upper flexible circuit board. The second film-tearing cylinder 94 is used to drive the second film-tearing clamp 95 to move, so as to take and place the adhesive protective film of the lower flexible circuit board. After the first film-tearing clamp 93 and the second film-tearing clamp 95 both clamp the protective film, the film-tearing moving mechanism 91 is actuated to drive the first film-tearing cylinder 92 and the second film-tearing cylinder 94 to move toward the waste film suction mechanism 11, so as to realize the film-tearing action, and the torn protective film is collected by the waste film suction mechanism 11. The film clamping mechanism 10 comprises: a film-clamping moving mechanism 101, a film-clamping cylinder 102 and a film-clamping block 103. The film-clamping moving mechanism 101 is connected to the frame 1. A film-clamping cylinder 102 is arranged above the film-clamping moving mechanism 101, and the film-clamping block 103 is connected to the film-clamping cylinder 102. The film clamping moving mechanism 101 drives the film clamping cylinder 102 to move, and then drives the film clamping block 103 to move above the product. The film clamping cylinder 102 moves, driving the film clamping block 103 to clamp the product above the tooling fixture 52 to ensure the stability of the product when tearing the film.

[0057] The conveying device 2 includes: a product conveying line 21 and a defective product conveying line 22. The product conveying line 21 is arranged beside the frame 1, and the defective product conveying line 22 is arranged above the product conveying line 21. The product conveying line 21 is used to convey qualified products clamped by the manipulator loading and unloading mechanism 4, and the defective product conveying line 22 is used to convey unqualified products after detection.

[0058] The clamping mechanism 54 includes: a first motor conveying device 541, a clamping connection plate 542, a first clamping device 543, a second motor conveying device 544 and a second clamping device 545. The first motor conveying device 541 is arranged above the third bracket 53, the clamping connection plate 542 is connected to the first motor conveying device 541, the first clamping device 543 is arranged in front of the clamping connection plate 542, the second motor conveying device 544 is connected to the clamping connection plate 542, and the second clamping device 545 is connected to the second motor conveying device 544. The first motor conveying device 541 drives the clamping connection plate 542 to move forward, thereby pushing the first clamping device 543 and the second motor conveying device 544 to move forward, the first clamping device 543 is actuated to clamp and fix the product downward, the second motor conveying device 544 is actuated to drive the second clamping device 545 to move, the second clamping device 545 is actuated to clamp and fix the product again.

[0059] The specific implementation process of the present invention is as follows: the circuit board to be bent continuously moves along the conveying device 2 toward the manipulator loading and unloading mechanism 4, the visual positioning mechanism 3 identifies and locates the circuit board above the conveying device 2, and transmits the corresponding positioning information to the controller, the controller processes the information transmitted by the visual positioning mechanism 3, and gives the manipulator loading and unloading mechanism 4 an action instruction, so that the manipulator loading and unloading mechanism 4 accurately grabs the product and transports the product to the tooling fixture 52, the conveying module 51 drives the tooling fixture 52 to move to the bottom of the clamping mechanism 54, the AOI positioning and detection mechanism 7 performs positioning calculation on the product on the tooling fixture 52 to ensure that the tooling fixture 52 is directly under the clamping mechanism 54. First, fix the product above the jig 52: the first motor conveying device 541 drives the clamping connecting plate 542 to move toward the jig 52, so that the first clamping device 543 is above the jig 52, the first clamping device 543 is actuated to clamp and fix the product downward, the second motor conveying device 544 is actuated again to drive the second clamping device 545 to move, the second clamping device 545 is actuated to clamp and fix the product again; after the product is fixed, separate the double-layer flexible circuit board: the pre-dial pre-pressing mechanism 8 is actuated, the pre-dial front and rear moving mechanism 82 drives the pre-dial up and down moving mechanism 81 to move, and pushes the pre-dial plate 84 to insert between the upper flexible circuit board and the lower flexible circuit board, so that the upper flexible circuit board The circuit board is lifted up, the film clamping mechanism 10 is activated, the film clamping moving mechanism 101 drives the film clamping cylinder 102 to move, drives the film clamping block 103 to move above the product, and the film clamping cylinder 102 is activated, driving the film clamping block 103 to clamp the upper flexible circuit board; after the double-layer flexible circuit board is separated, the film is torn off: the film tearing mechanism 9 is activated, the film tearing moving mechanism 91 drives the first film tearing cylinder 92 and the second film tearing cylinder 94 to move to the left side of the product, the first film tearing cylinder 92 drives the first film tearing jaw 93 to move, clamps the adhesive protective film of the upper flexible circuit board, the second film tearing cylinder 94 drives the second film tearing jaw 95 to move, clamps the adhesive protective film of the lower flexible circuit board, and the film tearing moving mechanism 91 is activated again The first film-tearing cylinder 92 and the second film-tearing cylinder 94 are driven to move to the top of the waste film suction mechanism 11, and the first film-tearing cylinder 92 drives the first film-tearing jaw 93 to open, so that the clamped adhesive protective film falls into the receiving hopper, and the second film-tearing cylinder 94 drives the second film-tearing jaw 95 to open, so that the clamped adhesive protective film falls into the receiving hopper, and the film-tearing action is completed, and the film-tearing moving mechanism 91 drives the first film-tearing cylinder 92 and the second film-tearing cylinder 94 to return to the origin; after the film-tearing is completed, the double-layer flexible circuit board is bonded: the pre-dial forward and backward moving mechanism 82 drives the pre-dial up and down moving mechanism 81 to move forward, so that the pre-dial plate 84 pushes the lower flexible circuit board to move upward, so that the lower flexible circuit board and the upper flexible circuit board are gradually bonded;After the bonding is completed, the bending is performed: the pre-pressing cylinder pushes the pressure head 86 to extend outward, and the pre-shifting up and down moving mechanism 81 drives the pre-pressing connecting block 83 to move downward, so that the pressure head 86 acts on the double-layer flexible circuit board after bonding, so that the front end of the double-layer flexible circuit board is clamped under the pressure head 86. As the pre-shifting up and down moving mechanism 81 continues to move downward, the double-layer flexible circuit board is pressed between the pressure head 86 and the tooling fixture 52 to complete the bending process; the AOI positioning and detection mechanism 7 monitors the entire bending process. If the detection is qualified, the product is conveyed to the product conveying line 21. If the detection is unqualified, the product is conveyed to the defective product conveying line 22. ;

[0060] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, ordinary technicians in the relevant field should understand that after reading the specification of this application, the technicians can still modify or replace the specific implementation mode of the present invention with equivalents, but these modifications or changes do not deviate from the scope of protection of the pending claims of the present application.

Claims

1. A double-layer flexible circuit board bending machine, characterized in that: include: Rack, conveying device, visual positioning mechanism, manipulator loading and unloading mechanism, double-layer flexible circuit board bending mechanism, handling mechanism, AOI positioning and detection mechanism, pre-dialing and pre-pressing mechanism, film tearing mechanism and film clamping mechanism; The conveying device is arranged on one side of the frame and is used to transport the product; The visual positioning mechanism is arranged on the conveying device, and is used to position the upper and lower parts of the products transported by the conveying device, to ensure that the mechanism for taking the products will not deviate, and to provide accurate position information for subsequent product bending; The manipulator loading and unloading mechanism is arranged on the upper part of the conveying device, and is used to grab the products transported by the conveying device and then transport them to the rack; The double-layer flexible circuit board bending mechanism, conveying mechanism, AOI positioning and detection mechanism, pre-dialing and pre-pressing mechanism, film tearing mechanism and film clamping mechanism are all arranged on the top of the frame; The double-layer flexible circuit board bending mechanism array is arranged on the frame, and is used to attach the bottom layer flexible circuit board to the surface layer flexible circuit board, and then press the bonded double-layer flexible circuit board to a designated position; The conveying mechanism is arranged at the discharge end of the double-layer flexible circuit board bending mechanism, and is used to convey the qualified products to the next process; The AOI positioning and detection mechanism is located above the double-layer flexible circuit board bending mechanism, and is used to position the product and detect whether the process film has been torn off, and monitor the entire bending process, and finally detect the finished product after bending; The pre-dialing and pre-pressing mechanism is located in front of the double-layer flexible circuit board bending mechanism and is used to perform bending operations on the product; The film tearing mechanism and the film clamping mechanism are arranged beside the double-layer flexible circuit board bending mechanism, and are used to tear off the protective film on the double-layer flexible circuit board; The double-layer flexible circuit board bending mechanism includes: a conveying module, a tooling fixture, a third bracket and a clamping mechanism, the third bracket is arranged above the frame, the clamping mechanism is fixedly connected to the third bracket, the conveying module is arranged above the frame, and the tooling fixture is movably arranged above the conveying module; The pre-dialing pre-pressing mechanism comprises: a pre-dialing up-and-down moving mechanism, a pre-dialing front-and-back moving mechanism, a pre-pressing connecting block, a pre-dialing plate, a pre-pressing pushing cylinder and a pressing head. The pre-dialing front-and-back moving mechanism is connected to the frame, the pre-dialing up-and-down moving mechanism is connected to the pre-dialing front-and-back moving mechanism, the pre-pressing connecting block is connected to the pre-dialing up-and-down moving mechanism, a pre-dialing plate is provided below the pre-pressing connecting block, a pre-pressing pushing cylinder is provided above the pre-pressing connecting block, and a pressing head is provided at the end of the piston rod of the pre-pressing pushing cylinder; The clamping mechanism includes: a first motor conveying device, a clamping connecting plate, a first clamping device, a second motor conveying device and a second clamping device. The first motor conveying device is arranged above the third bracket, the clamping connecting plate is connected to the first motor conveying device, the first clamping device is arranged in front of the clamping connecting plate, the second motor conveying device is connected to the clamping connecting plate, and the second clamping device is connected to the second motor conveying device.

2. A double-layer flexible circuit board bending machine according to claim 1, characterized in that: The double-layer flexible circuit board bending machine also includes a waste film suction mechanism, which is fixed on the frame and is used to recover the protective film torn off from the double-layer flexible circuit board.

3. A double-layer flexible circuit board bending machine according to claim 1, characterized in that: The transport mechanism includes: a transport module, a transport connection block, a transport cylinder, a first support frame and a suction cup. The transport module is arranged above the frame, the transport connection block is connected to the transport module, the transport cylinder is connected to the transport connection block, the first support frame is connected to the transport cylinder, and a suction cup is arranged below the first support frame.

4. A double-layer flexible circuit board bending machine according to claim 1, characterized in that: The AOI positioning and detection mechanism includes: a second support frame, a camera fixing seat and an industrial camera, the second support frame is arranged above the frame, the camera fixing seat is connected to the second support frame, and the industrial camera is connected to the camera fixing seat.

5. The double-layer flexible circuit board bending machine according to claim 1, characterized in that: The film tearing mechanism includes: a film tearing moving mechanism, a first film tearing cylinder, a first film tearing clamp, a second film tearing cylinder and a second film tearing clamp. The film tearing moving mechanism is arranged above the frame, the first film tearing cylinder is connected to the film tearing moving mechanism, the first film tearing clamp is connected to the first film tearing cylinder, the second film tearing cylinder is connected to the film tearing moving mechanism, and the second film tearing clamp is connected to the second film tearing cylinder.

6. A double-layer flexible circuit board bending machine according to claim 1, characterized in that: The film clamping mechanism comprises: a film clamping moving mechanism, a film clamping cylinder and a film clamping block. The film clamping moving mechanism is connected to the frame. A film clamping cylinder is arranged above the film clamping moving mechanism. The film clamping block is connected to the film clamping cylinder.

7. A double-layer flexible circuit board bending machine according to claim 1, characterized in that: The conveying device comprises: a product conveying line and a defective product conveying line. The product conveying line is arranged beside the frame, and the defective product conveying line is arranged above the product conveying line.

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