A dustproof structure for MEMS devices and a MEMS microphone packaging structure

Abstract

The present invention discloses a dustproof structure for a MEMS device and a MEMS microphone packaging structure, the dustproof structure comprises a mesh membrane, a first carrier and a second carrier, the first carrier has a through first opening, the second carrier has a through second opening; the first carrier and the second carrier are respectively arranged on both sides of the mesh membrane, the mesh membrane is spaced between the first opening and the second opening; the first carrier and / or the second carrier are configured to be fixed on the MEMS device. The arrangement of the first carrier and the second carrier of the present invention plays a good supporting and protective role on the mesh membrane, which can avoid direct contact damage to the mesh membrane, and the first opening and the second opening are arranged relative to the through hole on the mesh membrane, providing a smooth passage for air, which is convenient for the transmission of sound.

Description

Technical Field

[0001] The present invention belongs to the technical field of acoustic-electric conversion, and in particular, the present invention relates to a dustproof structure for a MEMS device and a MEMS microphone packaging structure. Background Art

[0002] With the rapid development of electroacoustic technology, various electroacoustic products emerge in an endless stream. Microphone, as a transducer that converts sound into electrical signals, is one of the most important devices in electroacoustic products. Nowadays, microphones have been widely used in many different types of electronic products such as mobile phones, tablets, laptops, VR devices, AR devices, smart watches, and smart wearables. In recent years, for microphone packaging structures, the design of their structures has become the focus and hotspot of research for technicians in this field.

[0003] The existing microphone packaging structure is usually composed of a housing with a housing cavity, in which components such as chip components (for example, MEMS chips and ASIC chips) are fixed; and a sound pickup hole is also provided on the housing. However, it is found in long-term applications that dust, impurities and other particles and foreign objects are easily introduced into the microphone's housing cavity through the sound pickup hole, and these particles and foreign objects will cause certain damage to components such as chip components in the housing cavity, which will eventually affect the acoustic performance and service life of the microphone.

[0004] In view of the above problems, the current solution is usually to set a corresponding isolation component on the sound pickup hole of the microphone packaging structure to prevent the entry of external particles, foreign objects, etc. The existing isolation component includes a support part and an isolation mesh. When using the isolation component, the isolation component is installed on the sound pickup hole. However, the existing isolation component is easily damaged because the isolation mesh is directly exposed and the strength of the isolation mesh itself is relatively low, which further affects the sound quality of the microphone. Summary of the invention

[0005] An object of the present invention is to provide a dustproof structure for a MEMS device and a MEMS microphone packaging structure.

[0006] According to a first aspect of the present invention, there is provided a dustproof structure for a MEMS device, comprising:

[0007] a mesh membrane configured to be sound-permeable;

[0008] A first carrier and a second carrier, the first carrier having a first through opening, and the second carrier having a second through opening;

[0009] The first carrier and the second carrier are respectively arranged on both sides of the grid membrane, and the grid membrane is spaced between the first opening and the second opening;

[0010] The first carrier and / or the second carrier is configured to be fixed on a MEMS device.

[0011] Optionally, the grid membrane includes an isolation net and a fixing portion, the fixing portion is connected around the isolation net, the fixing portion is fixedly connected to the first carrier and the second carrier, and the isolation net is spaced between the first opening and the second opening.

[0012] Optionally, the mesh membrane has a thickness ranging from 0.3 micrometers to 0.7 micrometers.

[0013] Optionally, the thickness of the first carrier and / or the second carrier is in the range of 25 microns to 55 microns.

[0014] Optionally, the first carrier and the second carrier have the same structural size.

[0015] Optionally, the first carrier and the second carrier are made of the same material.

[0016] Optionally, the grid membrane is a multi-layer structure, the grid membrane at least includes an upper grid membrane and a lower grid membrane, the first carrier is fixedly connected to the upper grid membrane, and the second carrier is fixedly connected to the lower grid membrane.

[0017] Optionally, the upper grid membrane and the lower grid membrane are bonded to form a fixed connection.

[0018] Optionally, the materials of the first carrier and the second carrier are photolithography materials, and the photolithography materials used to form the first carrier and the second carrier are pre-formed on both sides of the grid film, and the first carrier and the second carrier are formed through a photolithography process.

[0019] According to a second aspect of the present invention, a MEMS microphone packaging structure is provided, comprising:

[0020] A shell having a receiving cavity, wherein the shell is provided with a sound hole, and the sound hole connects the inside and the outside of the shell;

[0021] A microphone device, wherein the microphone device is fixedly disposed in the housing;

[0022] The dustproof structure, at least the first carrier of the dustproof structure is fixedly connected to the housing;

[0023] The mesh membrane closes the sound hole; and / or the mesh membrane is spaced between the sound hole and the microphone device.

[0024] Compared with the prior art, one technical effect of the present invention is:

[0025] The present invention discloses a dustproof structure for a MEMS device, comprising a grid membrane, a first carrier and a second carrier, wherein the first carrier has a through first opening, and the second carrier has a through second opening; the first carrier and the second carrier are respectively arranged on both sides of the grid membrane, and the arrangement of the first carrier and the second carrier of the present invention plays a good supporting and protecting role for the grid membrane.

[0026] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0028] Figure 1 A schematic structural diagram of a dustproof structure for a MEMS device according to the present invention;

[0029] Figure 2 A schematic diagram of a grid membrane structure of a dustproof structure for a MEMS device according to the present invention;

[0030] Figure 3 A schematic cross-sectional view of a dustproof structure for a MEMS device according to the present invention;

[0031] Figure 4 It is a schematic diagram of the structure of the photolithography stage of a dustproof structure for MEMS devices of the present invention;

[0032] Figure 5 It is a schematic diagram of the structure of the photolithography stage of a dustproof structure for MEMS devices of the present invention;

[0033] Figure 6 It is a schematic diagram of the structure of the photolithography stage of a dustproof structure for MEMS devices of the present invention;

[0034] Figure 7 It is a structural schematic diagram of another dust-proof structure for MEMS devices of the present invention;

[0035] Figure 8 It is a structural schematic diagram of a MEMS microphone packaging structure of the present invention;

[0036] Fig. 9 It is a structural schematic diagram of another MEMS microphone packaging structure of the present invention.

[0037] Among them: 100-dustproof structure; 1-mesh membrane; 101-isolation net; 102-fixing part; 103-upper mesh membrane; 104-lower mesh membrane; 2-first carrier; 3-second carrier; 4-first opening; 5-second opening; 6-housing; 7-sound hole; 8-microphone device; 9-first supporting part; 10-second supporting part; 11-protective layer; 12-first adhesive layer; 13-substrate. DETAILED DESCRIPTION

[0038] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless otherwise specifically stated.

[0039] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0040] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0041] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0042] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0043] Reference Figure 1 and Figure 3 The present invention discloses a dustproof structure 100 for a MEMS device, comprising:

[0044] A mesh membrane 1, a first carrier 2 and a second carrier 3, wherein the mesh membrane 1 is configured to allow sound to pass through; the first carrier 2 has a through first opening 4, and the second carrier 3 has a through second opening 5; the first carrier 2 and the second carrier 3 are respectively arranged on both sides of the mesh membrane 1, and the mesh membrane 1 is spaced between the first opening 4 and the second opening 5;

[0045] The first carrier 2 and / or the second carrier 3 is configured to be fixed on a MEMS device.

[0046] The mesh membrane 1 has a plurality of through holes through which air can pass, thereby facilitating the transmission of sound. The first carrier 2 and the second carrier 3 are respectively arranged on both sides of the mesh membrane 1, which can provide good support and protection for the mesh membrane 1 and avoid direct contact damage to the mesh membrane 1. The first opening 4 and the second opening 5 are arranged relative to the through holes on the mesh membrane 1, providing a smooth passage for air and facilitating the transmission of sound.

[0047] Alternatively, see Figure 1 and Figure 2 The grid membrane 1 includes an isolation net 101 and a fixing portion 102 , wherein the fixing portion 102 is connected around the isolation net 101 , the fixing portion 102 is fixedly connected to the first carrier 2 and the second carrier 3 , and the isolation net 101 is spaced between the first opening 4 and the second opening 5 .

[0048] Since many through holes are opened on the isolation net 101 of the grid membrane 1, the strength of the isolation net 101 is relatively low. The dense fixing part 102 around the isolation net 101 can increase the structural strength of the grid membrane 1, and the fixing part 102 is fixedly connected to the first carrier 2 and the second carrier 3, thereby ensuring the structural stability of the dustproof structure 100.

[0049] Optionally, the thickness of the mesh membrane 1 ranges from 0.3 microns to 0.7 microns. Since the mesh membrane 1 is used on a MEMS device, there are high requirements for its size. The thickness of the mesh membrane 1 can achieve a good dustproof effect if it is in a relatively low range. However, if the mesh membrane 1 is too thin, the strength is too low and it is easy to be damaged. However, if the mesh membrane 1 is too thick, on the one hand, the size and weight of the dustproof structure 100 are increased, and on the other hand, it is not convenient for air to pass through, resulting in difficulty in sound transmission.

[0050] Optionally, the thickness of the first carrier 2 and / or the second carrier 3 is in the range of 25 microns to 55 microns. In order to provide good support and protection for the grid film 1, the first carrier 2 and the second carrier 3 need to have a certain thickness, but the thickness should not be too high. If the thickness of the first carrier 2 and the second carrier 3 is too large, the size and weight of the dustproof structure 100 are increased, which is not suitable for application in MEMS devices.

[0051] Optionally, the first carrier 2 and the second carrier 3 have the same structural dimensions. The same structural dimensions of the first carrier 2 and the second carrier 3 facilitate rapid manufacturing and assembly, improve the efficiency of manufacturing and assembly, and improve the applicability of the dustproof structure 100, so that it can be flexibly used in both the forward and reverse directions.

[0052] Optionally, the first carrier 2 and the second carrier 3 are made of the same material. When the first carrier 2 and the second carrier 3 are made of the same material, rapid manufacturing and assembly can also be facilitated, the efficiency of manufacturing and assembly can be improved, and the applicability of the dustproof structure 100 can be improved.

[0053] Alternatively, see Figure 7 The mesh film 1 is a multi-layer structure, and the mesh film 1 at least includes an upper mesh film 103 and a lower mesh film 104. The first carrier 2 is fixedly connected to the upper mesh film 103, and the second carrier 3 is fixedly connected to the lower mesh film 104. Of course, the multi-layer structure of the mesh film 1 can also be a combination of three layers, four layers or more layers, as long as the size, quality and dustproof effect can be taken into account.

[0054] On the one hand, since a large number of through holes are opened on the mesh membrane 1, the structural strength of the mesh membrane 1 is relatively weak, so the structural strength and service life of the mesh membrane 1 can be improved by compounding the upper mesh membrane 103 and the lower mesh membrane 104; on the other hand, the material and through hole size of the upper mesh membrane 103 and the lower mesh membrane 104 can be the same or different. When the material and through hole size of the upper mesh membrane 103 and the lower mesh membrane 104 are different, it can achieve the effect of filtering impurities such as dust of different types and sizes, thereby improving the applicability of the dustproof structure 100.

[0055] Optionally, the upper mesh film 103 and the lower mesh film 104 are bonded to form a fixed connection. Specifically, the upper mesh film 103 and the lower mesh film 104 are bonded by the first adhesive layer 12, and the bonding can be done by double-sided adhesive or glue. The bonding connection method is flexible and convenient to operate, and has high connection strength and good effect.

[0056] Optionally, the materials of the first carrier 2 and the second carrier 3 are photolithography materials, and the photolithography materials used to constitute the first carrier 2 and the second carrier 3 are pre-formed on both sides of the grid film 1, and the first carrier 2 and the second carrier 3 are formed through a photolithography process.

[0057] Specifically, see Figure 4 , Figure 5 and Figure 6 , the photolithography process comprises the following steps:

[0058] A supporting portion is provided on the second carrier 3;

[0059] Disposing the first carrier 2 opposite to the photolithography equipment;

[0060] A mask is arranged on a side of the first carrier 2 close to the photolithography device, and a through hole is arranged on the mask at a position opposite to the first opening 4;

[0061] The photolithography equipment performs photolithography on the first carrier 2 to obtain the first carrier 2 having the first opening 4;

[0062] The mask is removed, and a protective layer 11 is provided on a side of the first carrier 2 close to the photolithography device;

[0063] Disposing the second carrier 3 opposite to the photolithography equipment;

[0064] A mask is arranged on a side of the second carrier 3 close to the photolithography device, and a through hole is arranged on the mask at a position opposite to the second opening 5;

[0065] The photolithography equipment performs photolithography on the second carrier 3 to obtain the second carrier 3 having the second opening 5;

[0066] The mask and the protective layer 11 are removed to obtain the dust-proof structure 100 .

[0067] The support portion may include a first support portion 9 and a second support portion 10 . Specifically, the first support portion 9 may be an organic layer directly connected to the second carrier 3 , and the second support portion 10 may be a silicon wafer layer connected to the first support portion 9 .

[0068] The MEMS device may be a MEMS microphone, a MEMS sensor, a MEMS chip, a MEMS switch, etc.

[0069] See also Figure 8 and Fig. 9 The present invention also discloses a MEMS microphone packaging structure, including:

[0070] A housing 6 having a receiving cavity is provided, and a sound hole 7 is provided on the housing 6, and the sound hole 7 connects the inside and the outside of the housing 6;

[0071] A microphone device 8, wherein the microphone device 8 is fixedly disposed in the housing 6;

[0072] The dustproof structure 100, at least the first carrier 2 of the dustproof structure 100 is fixedly connected to the housing 6;

[0073] The mesh membrane 1 closes the sound hole 7 ; and / or, the mesh membrane 1 is spaced between the sound hole 7 and the microphone device 8 .

[0074] The first carrier 2 of the dustproof structure 100 can be fixedly connected to the housing 6. In order to improve the stability of the connection of the dustproof structure 100, both the first carrier 2 and the second carrier 3 can be fixedly connected to the housing 6. In addition, the dustproof structure 100 can be arranged on the outer side of the housing 6 opposite to the sound hole 7, or on the inner side of the housing 6 opposite to the sound hole 7, or further directly arranged around the microphone device 8 in the housing 6. It can be directly arranged around multiple microphone devices 8, or only around important microphone devices 8 such as chips. The dustproof structure 100 around the microphone device 8 and the dustproof structure 100 at the sound hole 7 can also play a dual protective role.

[0075] Specifically, the housing 6 includes a substrate 13, the sound hole 7 is arranged on the substrate 13, the dustproof structure 100 closes the sound hole 7, the microphone device 8 includes a MEMS chip, the dustproof structure 100 is spaced between the sound hole 7 and the MEMS chip, and the dustproof structure 100 and the MEMS chip can be directly connected or not connected, forming a Figure 8 The spacer support structure.

[0076] Although some specific embodiments of the present invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A dustproof structure for a MEMS device, characterized in that: include: Grid a membrane, the mesh membrane being configured to be sound-permeable; A first carrier and a second carrier, the first carrier having a first through opening, and the second carrier having a second through opening; The first carrier and the second carrier are respectively arranged on both sides of the grid membrane, and the grid membrane is spaced between the first opening and the second opening; The first carrier and / or the second carrier are configured to be fixed on the MEMS device; The grid membrane comprises an isolation net and a fixing portion, wherein the fixing portion is connected around the isolation net, the fixing portion is fixedly connected to the first carrier and the second carrier, and the isolation net is spaced between the first opening and the second opening; The isolation net is provided with a plurality of through holes; The grid membrane is a multi-layer structure, and the grid membrane at least includes an upper grid membrane and a lower grid membrane. The first carrier is fixedly connected to the upper grid membrane, and the second carrier is fixedly connected to the lower grid membrane.

2. The dustproof structure according to claim 1, characterized in that: The thickness of the grid film ranges from 0.3 micrometers to 0.7 micrometers.

3. The dustproof structure according to claim 1, characterized in that: The thickness of the first carrier and / or the second carrier is in the range of 25 micrometers to 55 micrometers.

4. The dustproof structure according to claim 1, characterized in that: The first carrier and the second carrier have the same structural size.

5. The dustproof structure according to claim 1, characterized in that: The first carrier and the second carrier are made of the same material.

6. The dustproof structure according to claim 1, characterized in that: The upper grid membrane and the lower grid membrane are bonded to form a fixed connection.

7. The dustproof structure according to any one of claims 1 to 5, characterized in that: The materials of the first carrier and the second carrier are photolithography materials. The photolithography materials used to form the first carrier and the second carrier are pre-formed on both sides of the grid film, and the first carrier and the second carrier are formed through a photolithography process.

8. A MEMS microphone packaging structure, characterized in that: include: A shell having a receiving cavity, wherein the shell is provided with a sound hole, and the sound hole connects the inside and the outside of the shell; A microphone device, wherein the microphone device is fixedly disposed in the housing; The dustproof structure according to any one of claims 1 to 7, wherein at least the first carrier is fixedly connected to the housing; The mesh membrane closes the sound hole; and / or the mesh membrane is spaced between the sound hole and the microphone device.

Images