Connectivity strengthening structure of thermosyphon heat dissipation device

By increasing the bonding area at the connection between the conduit of the loop thermosiphon radiator and the evaporation/condensation housing, the problem of insufficient pressure resistance and sealing is solved, and a higher strength and sealing resistance to saturated vapor pressure is achieved.

CN111132526BActive Publication Date: 2025-02-11ASIA VITAL COMPONENTS (CHINA) CO LTD
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Patent Information

Application Number
CN202010066805.1
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2020-01-20
Publication Date
2025-02-11
Estimated Expiration
2040-01-20

AI Technical Summary

Technical Problem

In a high-pressure saturated vapor environment, the loop thermosiphon radiator has problems such as insufficient pressure resistance and sealing and strength at the gas-liquid phase pipeline connections.

Method used

By increasing the bonding area between the conduit and the evaporation/condensing housing, the connecting parts are used to increase the effective welding or bonding bonding area, and the sealing property at the connection and the strength to withstand saturated vapor pressure.

Benefits of technology

It effectively improves the sealing and pressure resistance at the connection between the conduit and the housing, ensuring the stable operation of the heat dissipation device under a high-pressure saturated vapor environment.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention provides a connection strengthening structure of a thermosiphon heat dissipation device, comprising at least one shell, at least one connecting piece and at least one conduit. The shell is provided with at least one through hole connected to an inner chamber in the shell, one end of the conduit is connected to the inner chamber of the shell, and the connecting piece covers the connection between the shell and one end of the conduit, thereby increasing the connection area of ​​the conduit at the connection, improving the sealing performance of the connection and the strength to withstand saturated vapor pressure.
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Description

Technical Field

[0001] The invention relates to the field of loop-type thermosiphon heat dissipation, in particular to a connection strengthening structure of a thermosiphon heat dissipation device. Background Art

[0002] With the rapid development of technology, electronic products are constantly moving towards high performance, high energy, and high processing speed. The problem and management of heat dissipation caused by the high density of chipsets has become an important part of product design or development. In particular, the communication field has developed to 5G or above. The heat dissipation of the ASIC chip of the network switch (Switch) needs to be pulled to the remote fan for cooling due to the special circuit layout design of the whole machine. There is no space above the chip to install the ASIC chip heat sink. Therefore, the loop thermosyphon heat sink (LTS; Loop Thermosyphone) has become increasingly popular in the ASIC chip heat dissipation of network switches in recent years. The evaporator is used to contact the ASIC chip and the condenser with fan cooling. The gas phase tube and the liquid phase tube can be flexibly folded to connect the evaporator and the condenser according to the electronic components of the circuit board, so that the circuit layout (Layout) has a flexible design space. The loop type thermosyphon radiator uses metal such as aluminum as its structural parts, and its working mechanism is thermosyphon. Considering the driving force of its internal saturated vapor pressure, the heat transfer medium uses a refrigerant (Refrigerant) with a larger saturation or liquid ammonia as the working fluid. Taking the normal operating temperature of a specific application integrated circuit chip at 100C as an example, its saturated vapor pressure is about 1.5MPa (i.e. 1.5 times the atmospheric pressure), or even higher. Since the high pressure saturated vapor pressure is generated inside the loop type thermosyphon radiator, it has a negative impact on the pressure resistance of the loop type thermosyphon radiator itself and the sealing and strength of the gas-liquid phase pipeline connection.

[0003] Therefore, how to solve the above problems is the direction that the designers of this case and the relevant manufacturers engaged in this industry are eager to study and improve. Summary of the invention

[0004] In order to improve the above-mentioned problems, an object of the present invention is to increase the joint area of ​​the connection between the conduit and the evaporation / condensation shell by means of the connector, thereby improving the sealing performance of the connection and the strength to withstand saturated vapor pressure.

[0005] Another object of the present invention is to increase the effective welding or bonding area by combining the evaporation shell and the condensation shell with the connecting end of the conduit and the through-hole flange through the connecting piece.

[0006] To achieve the above-mentioned purpose, the present invention provides a connectivity enhancement structure of a thermal siphon heat dissipation device, comprising: at least one shell, defining an inner chamber having a working fluid, and at least one through hole penetrating the shell to connect to the chamber, the through hole having a through hole flange; at least one conduit, having a body extending therefrom with a connecting end inserted into the through hole through the through hole flange to connect to the inner chamber, and another connecting end connected to another shell; at least one connecting piece, having a first end and a second end and a combining channel penetrating the first end and the second end, the through hole flange of the shell and the connecting end of the conduit respectively penetrate into the combining channel from the first end and the second end and are covered by the connecting piece.

[0007] The connecting end of the aforementioned catheter protrudes into the inner chamber.

[0008] The aforementioned connecting piece is circular or polygonal.

[0009] The connecting piece is a ring body or a polygonal hollow body.

[0010] The coupling channel of the connecting member is provided with a receiving portion for receiving the through-hole flange of the shell, and a second portion for receiving the connecting end of the conduit.

[0011] The aforementioned through hole flange has a free end, and the accommodating portion of the combined channel has a first limiting portion corresponding to the free end.

[0012] The connecting end is radially tapered and extends along the axial direction, and the connecting end has a connecting end tube diameter that is smaller than a main body tube diameter of the main body.

[0013] In detail, the connection strengthening structure of the thermosiphon heat dissipation device of the present invention comprises: an evaporation shell, having a first and a second through hole, respectively having a first through hole flange and a second through hole flange, and defining an evaporation chamber inside the evaporation shell and containing a working liquid; a condensation shell, having a third and a fourth through hole, respectively having a third through hole flange and a fourth through hole flange, and defining a condensation chamber inside the condensation shell to contain the working liquid; at least two conduits for connecting the evaporation chamber and the condensation chamber, wherein each conduit has a body extending from two connection ends, and the two connection ends of one conduit are respectively connected from the vapor shell to the condensation chamber. The first through-hole flange of the steam shell is inserted into the first through-hole, and the third through-hole flange of the condensing shell is inserted into the third through-hole, and the two connecting ends of another conduit are respectively inserted from the second through-hole flange of the steam shell into the second through-hole, and the fourth through-hole flange of the condensing shell is inserted into the fourth through-hole; wherein a connecting piece is respectively sleeved between the first, second, third and fourth through-hole flanges and the connecting ends of the two conduits, and each connecting piece has a first end, a second end and a combining channel penetrating the first end and the second end, and the connecting ends of the first, second, third and fourth through-hole flanges and the conduit respectively penetrate the combining channel from the first end and the second end and are covered by the connecting piece.

[0014] Each connecting end of each of the aforementioned conduits protrudes into the evaporation chamber and the condensation chamber respectively.

[0015] The outer shape of each of the aforementioned connecting pieces is circular or polygonal.

[0016] Each of the aforementioned connecting pieces is a ring body or a polygonal hollow body.

[0017] The coupling channel of each of the aforementioned connecting pieces is provided with a receiving portion for receiving the first, second, third and fourth through-hole flanges, and a second portion for receiving the connecting end of the conduit.

[0018] The first, second, third and fourth through-hole flanges have a free end, and the accommodating portion of the combined channel has a first limiting portion corresponding to the free end.

[0019] The first through hole is arranged on a side surface of the evaporation shell, the second through hole is arranged on a top surface of the evaporation shell, the third through hole is arranged on a side surface of the condensation shell, and the fourth through hole is arranged on a top surface of the condensation shell.

[0020] The two conduits mentioned above are respectively a gas phase conduit and a liquid phase conduit.

[0021] The aforementioned connecting ends are radially tapered from both ends of the body and extend along the axial direction, and each connecting end has a connecting end tube diameter smaller than a body tube diameter of the body.

[0022] The present invention increases the joint area of ​​the connection between the conduit and the evaporation shell and the condensation shell by means of the connector, so that the effective welding or bonding joint area is increased, and the sealing performance of the connection and the strength of withstanding the saturated vapor pressure are improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1A It is a three-dimensional exploded schematic diagram of the present invention;

[0024] Figure 1B It is a schematic diagram of a three-dimensional combination of the present invention;

[0025] Figure 1C is a cross-sectional schematic diagram of a connecting piece of the present invention;

[0026] Figure 2A and Figure 2B It is a partial cross-sectional schematic diagram of the evaporation shell and the condensation shell of the present invention;

[0027] FIG. 3A to FIG. 3D Schematic cross-sectional views of various implementations of the connector of the present invention.

[0028] Explanation of the reference numerals: evaporation shell 11; evaporation chamber 111; capillary structure 112; condensation shell 12; condensation chamber 121; flow channel 1211; fin 1212; conduit 13, 14; body 131, 141; radial tapering portions 1312, 1412; conduit flow channels 132, 142; connecting ends 133, 134, 143, 144; first through hole 151; first through hole flange 1511; second through hole 152; second through hole flange 1521; third through hole 153; third through hole flange 1531; fourth through hole 154; fourth through hole flange 1541; working liquid 16; connecting piece 17; first end 171; second end 172; chamfer 1721; combining channel 174; accommodating portion 1741; limiting platform 1742. DETAILED DESCRIPTION

[0029] The above-mentioned objects and the structural and functional characteristics of the present invention will be described based on the preferred embodiments shown in the accompanying drawings.

[0030] The present invention comprises: at least one shell, defining an inner chamber having a working fluid, and at least one through hole penetrating the shell to connect with the chamber, the through hole having a through hole flange; at least one conduit having a connection end inserted into the through hole through the through hole flange to connect with the inner chamber, and another connection end connected with another shell; at least one connecting piece having a first end and a second end and a combining channel penetrating the first end and the second end, the through hole flange of the shell and the connecting end of the conduit respectively penetrate into the combining channel from the first end and the second end to be covered by the connecting piece, and the connecting piece increases the combining area with the connecting end of the conduit.

[0031] The structure of this case will be described in detail below.

[0032] Please refer to Figure 1A It is a three-dimensional exploded schematic diagram of the present invention; Figure 1B Schematic diagram of the three-dimensional combination of the present invention Figure 1C is a cross-sectional schematic diagram of a connecting piece of the present invention; Figure 2A and Figure 2B It is a partial cross-sectional schematic diagram of the evaporation shell and the condensation shell of the present invention. As shown in the figure, the present invention includes an evaporation shell 11, a condensation shell 12 and at least two conduits 13 and 14 connecting the evaporation shell 11 and the condensation shell 12, and a plurality of connectors 17 are respectively arranged at the connection between the evaporation shell 11 and the condensation shell 12 and the two conduits 13 and 14. The evaporation shell 11 is used as a thermal contact end to contact at least one heat generating element, and then heat exchanges with the heat generating element to transfer heat to the condensation shell 12, and the condensation shell 12 is used as a heat dissipation end to dissipate heat to the external environment. In one embodiment, the condensation shell 12 can be equipped with a fan and / or a radiator to increase the heat dissipation rate.

[0033] The evaporation housing 11 is, for example, an evaporator, and defines an evaporation chamber 111 therein. The evaporation chamber 111 is provided with a capillary structure 112 and a working liquid 16 (eg, Figure 2A ). The capillary structure 112 is, for example, a metal powder sintered body or a grid or a micro-channel, and the working liquid 16 is, for example but not limited to, a heat transfer medium with a saturated vapor pressure of about 1.5 MPa (i.e., 1.5 times the atmospheric pressure) or greater than 1.5 MPa, such as a refrigerant or ammonia. A first through hole 151 and a second through hole 152 are respectively provided on a side surface and a top surface of the evaporation shell 11 to communicate with the evaporation chamber 111. An outer edge of the first through hole 151 has a first through hole flange 1511, and an outer edge of the second through hole 152 has a second through hole flange 1521. The first through hole flange 1511 and the second through hole flange 1521 protrude outward from a surface of the evaporation shell 11.

[0034] The condensation housing 12 is, for example, a condenser, and defines a condensation chamber 121 inside to accommodate the working liquid 16 (eg, Figure 2B ), the condensation chamber 121 is, for example, a hollow chamber or is provided with a flow channel 1211 and a plurality of fins 1212 as shown in this figure. A third through hole 153 and a fourth through hole 154 are respectively provided on a side surface and a top surface of the condensation shell 12 to communicate with the condensation chamber 121. An outer edge of the third through hole 153 has a third through hole flange 1531, and an outer edge of the fourth through hole 154 has a fourth through hole flange 1541. The third through hole flange 1531 and the fourth through hole flange 1541 protrude outward from a surface of the condensation shell 12.

[0035] The two conduits 13 and 14 serve as a gas phase conduit for guiding the gaseous working liquid 16 and a liquid phase conduit for guiding the liquid working liquid 16, respectively. In the present embodiment, the conduit 13 (gas phase conduit) is located above the conduit 14 (liquid phase conduit), which is beneficial for the working liquid converted into gaseous state by heat in the evaporation shell 11 to enter the condensation shell 12 through the conduit 13; then the working liquid converted into liquid state by heat dissipation in the condensation shell 12 flows back to the evaporation shell 11 through the conduit 14. Furthermore, the present embodiment diagram shows that the diameter of the conduit 13 is preferably smaller than the diameter of the conduit 14. The conduits 13 and 14 respectively have a main body 131, 141 and a conduit flow channel 132 and 142 (such as Figure 2A and Figure 2B ).

[0036] The body 131 of the conduit 13 extends with two connecting ends 133 and 134 which are respectively inserted into the second through hole 152 of the evaporation shell 11 and the fourth through hole 154 of the condensation shell 12, and slightly protrudes to the evaporation chamber 111 and the condensation chamber 121, thereby connecting the evaporation chamber 111 and the condensation chamber 121 through the conduit flow channel 132. In one embodiment, a radial tapered portion 1312 is respectively provided between the body 131 and the connecting ends 133 and 134, and the radial tapered portions 1312 are tapered from the body 131 to the connecting ends 133 and 134, thereby making the pipe diameters of the connecting ends 133 and 134 smaller than the pipe diameter of the body 131.

[0037] Similarly, the body 141 of the conduit 14 extends with two connecting ends 143 and 144 which are respectively inserted into the first through hole 151 of the evaporation shell 11 and the third through hole 153 of the condensation shell 12, and slightly protrude to the evaporation chamber 111 and the condensation chamber 121, thereby connecting the evaporation chamber 111 and the condensation chamber 121 through the conduit flow channel 142. In one embodiment, a radially tapered portion 1412 is respectively provided between the body 141 and the connecting ends 143 and 144, and the radially tapered portions 1412 are tapered from the body 141 to the connecting ends 143 and 144, thereby making the pipe diameters of the connecting ends 143 and 144 smaller than the pipe diameter of the body 141.

[0038] The implementation of the conduits 13 and 14 is not limited thereto. In an alternative implementation, the bodies 131 and 141 of the conduits 13 and 14 and the two connecting ends 133, 134, 143 and 144 have the same diameter, and the radial tapered portion is omitted.

[0039] The connecting members 17 are respectively disposed at the connection between the second and fourth through holes 152, 154 and the two connecting ends 133, 134 of the conduit 13, and at the connection between the first through hole 151 and the third through hole 153 and the two connecting ends 143, 144 of the conduit 14. Each connecting member 17 surrounds and covers the two connecting ends 133, 134, 143, 144 of the conduits 13, 14 and the first, second, third and fourth through hole flanges 1511, 1521, 1531, 1541.

[0040] Each connecting member 17 has a first end 171 and a second end 172 and a connecting passage 174 extending through the first end 171 and the second end 172 (eg, Figure 1C). The inner diameter of the aforementioned connecting passage 174 is matched with the diameter of the connecting ends 133, 134, 143 and 144 of the conduits 13 and 14, and is smaller than the diameter of the main bodies 131 and 141 of the conduits 13 and 14. In the present embodiment, the second end 172 of the connecting member 17 is provided with a chamfer 1721 to allow the two connecting ends 133, 134, 143 and 144 of the conduits 13 and 14 to be smoothly inserted into the connecting passage 174.

[0041] In addition, the combined channel 174 is provided with a receiving portion 1741 adjacent to the first end 171 to receive the first, second, third and fourth through-hole flanges 1511, 1521, 1531, 1541 disposed on the steam housing 11 and the condensation housing 12. The receiving portion 1741 has a stop platform 1742 corresponding to one end of the first, second, third and fourth through-hole flanges 1511, 1521, 1531, 1541. The two connecting ends 133, 134, 143, 144 of the conduits 13 and 14 are inserted into the combined channel 174 and the first, second, third and fourth through-holes 151, 152, 153, 154 from the second end 172 of the connecting member 17. In addition, the first, second, third and fourth through-hole flanges 1511 , 1521 , 1531 , 1541 are inserted into the accommodating portion 1741 from the first end 171 of the connecting member 17 until one end of the first, second, third and fourth through-hole flanges 1511 , 1521 , 1531 , 1541 abuts against the limiting platform 1742 .

[0042] Since the coupling channel 174 of the connector 17 is coupled with the two connecting ends 133, 134 of the conduit 13 and the two connecting ends 143, 144 of the conduit 14, and the accommodating portion 1741 is coupled with the first, second, third and fourth through-hole flanges 1511, 1521, 1531, 1541, the coupling area of ​​the connection between the evaporation shell 11 and the condensation shell 12 and the two conduits 13, 14 is increased, so that the effective coupling area is increased.

[0043] When the present invention is implemented, each connecting member 17 is first sleeved on the two connecting ends 133, 134, 143 and 144 of the conduits 13 and 14, respectively, and then the connecting ends 133, 134, 143 and 144 of the conduits 13 and 14 are inserted into the first, second, third and fourth through holes 151, 152, 153 and 154, and the first, second, third and fourth through hole flanges 1511, 1521, 1531 and 1541 are inserted into the accommodating portion 1741. Then, a combining means is used to combine the connecting members 17 with the connecting ends 133, 134, 143 and 144 and the first, second, third and fourth through hole flanges 1511, 1521, 1531 and 1541.

[0044] However, the present invention is not limited thereto. In an alternative implementation, the connector 17 is first sleeved on the first, second, third and fourth through hole flanges 1511, 1521, 1531, 1541, and then the connecting ends 133, 134, 143 and 144 of the conduits 13 and 14 are inserted into the combining channel 174 of the connector 17 and the first, second, third and fourth through holes 151, 152, 153, 154, and then combined by a combining means.

[0045] The bonding means described in this embodiment are, for example but not limited to, welding (including brazing or ultrasonic welding) or bonding. If welding is used, solder is used as the bonding medium, and if bonding is used, adhesive is used as the bonding medium. The evaporation shell 11, the condensation shell 12, the two conduits 13, 14, and the aforementioned connecting parts 17 are made of, for example, metal (including aluminum, aluminum alloy, copper, titanium, titanium alloy, stainless steel) or non-metal. In the same embodiment, the evaporation shell 11, the condensation shell 12, the two conduits 13, 14, and the aforementioned connecting parts 17 can be made of the same material, different materials, or composite materials.

[0046] Please continue to refer to Figure 3A-3D 1 is a cross-sectional schematic diagram of various different implementations of the connector of the present invention. As shown in the figure, the outer shape of these connectors 17 is circular or polygonal, such as hexagonal, quadrilateral or triangle, etc. If it is circular, the connector 17 is a ring (such as Figure 3A ), if it is a polygon, the connecting member 17 is a polygonal hollow body (such as FIG. 3B to FIG. 3D ).

[0047] The present invention increases the connection area of ​​the conduits 13 and 14 and the evaporation shell 11 and the condensation shell 12 by means of the connection piece 17, so that the effective welding or bonding connection area is increased, and the sealing performance of the connection and the strength to withstand saturated vapor pressure are improved.

[0048] The above description is only illustrative rather than restrictive of the present invention. Those skilled in the art will understand that many modifications, changes or equivalents may be made without departing from the spirit and scope defined by the claims, but all will fall within the scope of protection of the present invention.

Claims

1. A connection strengthening structure of a thermosiphon heat dissipation device, characterized in that: Include: At least one shell, defining an inner chamber containing a working fluid, and at least one through hole penetrating the shell and communicating with the chamber, the through hole having a through hole flange; At least one conduit has a body extending therefrom with a connecting end, the connecting end is inserted into the through hole through the through hole flange to communicate with the inner chamber, and another connecting end extending from the body is connected to another shell; At least one connecting piece has a first end, a second end and a connecting channel, the connecting channel runs through the first end and the second end, the through-hole flange of the shell and the connecting end of the conduit penetrate into the connecting channel and are covered by the connecting piece.

2. The connection strengthening structure of the thermosiphon heat dissipation device according to claim 1, characterized in that: The connecting end of the catheter protrudes into the inner chamber.

3. The connection strengthening structure of the thermosiphon heat dissipation device according to claim 1, characterized in that: The connecting piece is circular or polygonal.

4. The connection strengthening structure of the thermosiphon heat dissipation device according to claim 1, characterized in that: The connecting piece is a ring body or a polygonal hollow body.

5. The connection strengthening structure of the thermosiphon heat dissipation device according to claim 1, characterized in that: The combining channel of the connecting piece is provided with an accommodating portion for accommodating the through hole flange of the shell.

6. The connection strengthening structure of the thermosiphon heat dissipation device according to claim 5, characterized in that: The accommodating portion of the combined channel has a limiting platform corresponding to one end of the through hole flange.

7. The connection strengthening structure of the thermosiphon heat dissipation device according to claim 1, characterized in that: The pipe diameter of the connecting end is smaller than the pipe diameter of the main body, and a radially tapered portion is provided between the main body and the connecting end.

8. The connection strengthening structure of the thermosiphon heat dissipation device according to claim 1, characterized in that: The pipe diameter of the connecting end is equal to the pipe diameter of the main body.

9. A connection strengthening structure of a thermosiphon heat dissipation device, characterized in that: Include: An evaporation shell, wherein the first through hole and the second through hole have a first through hole flange and a second through hole flange respectively, and an evaporation chamber defined inside the evaporation shell has a working liquid; A condensation shell, wherein the third through hole and the fourth through hole have a third through hole flange and a fourth through hole flange respectively, and a condensation chamber defined inside the condensation shell contains the working liquid; At least two conduits are used to connect the evaporation chamber and the condensation chamber, wherein the body of each conduit extends with two connection ends, and the two connection ends of one conduit are respectively inserted into the first through hole from the first through hole flange of the evaporation shell and the third through hole flange of the condensation shell into the third through hole, and the two connection ends of the other conduit are respectively inserted into the second through hole from the second through hole flange of the evaporation shell and the fourth through hole flange of the condensation shell into the fourth through hole; wherein a connecting piece is respectively sleeved between the first through hole flange, the second through hole flange, the third through hole flange and the fourth through hole flange and the connection ends of the two conduits, and each connecting piece has a first end and a second end and a combining channel penetrating the first end and the second end, and the first through hole flange, the second through hole flange, the third through hole flange and the fourth through hole flange and the connection ends of the conduit respectively penetrate into the combining channel from the first end and the second end, and are covered by the connecting piece.

10. The connection strengthening structure of the thermosiphon heat dissipation device according to claim 9, characterized in that: Each connecting end of each conduit protrudes into the evaporation chamber and the condensation chamber respectively.

11. The connection strengthening structure of the thermosiphon heat dissipation device according to claim 9, characterized in that: The outer shape of each connecting piece is circular or polygonal.

12. The connection strengthening structure of the thermosiphon heat dissipation device according to claim 9, characterized in that: Each of the connecting pieces is a ring body or a polygonal hollow body.

13. The connection strengthening structure of the thermosiphon heat dissipation device according to claim 9, characterized in that: The combining channel of each connecting member is provided with an accommodating portion for accommodating the first through-hole flange, the second through-hole flange, the third through-hole flange and the fourth through-hole flange.

14. The connection strengthening structure of the thermosiphon heat dissipation device according to claim 13, characterized in that: Each accommodating portion of the combined channel has a limiting platform corresponding to one end of the first through-hole flange, the second through-hole flange, the third through-hole flange and the fourth through-hole flange.

15. The connection strengthening structure of the thermosiphon heat dissipation device according to claim 9, characterized in that: The first through hole is arranged on a side surface of the evaporation shell, the second through hole is arranged on a top surface of the evaporation shell, the third through hole is arranged on a side surface of the condensation shell, and the fourth through hole is arranged on a top surface of the condensation shell.

16. The connection strengthening structure of the thermosiphon heat dissipation device according to claim 9, characterized in that: The two conduits are respectively a gas phase conduit and a liquid phase conduit.

17. The connection strengthening structure of the thermosiphon heat dissipation device according to claim 9, characterized in that: The diameter of each connecting end of each conduit is smaller than the diameter of the body, and a radially tapered portion is provided between the body and the connecting end.

18. The connection strengthening structure of the thermosiphon heat dissipation device according to claim 9, characterized in that: The diameter of each connecting end of each conduit is equal to the diameter of the body.

Citation Information

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    CN106255850A

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