Processing equipment

Abstract

A box loading mechanism is provided to prevent an operator from accidentally touching the box during the transportation of a wafer unit or the processing of a wafer. The box loading mechanism is attached to a processing device for processing a plate-shaped workpiece, wherein the box loading mechanism comprises: a loading table on which a box for storing the workpiece is loaded; a frame portion, which is arranged on the side of the loading table, and the frame portion has an opening for the workpiece to pass through when the workpiece is transported from the box loaded on the loading table; a door portion, which is arranged on the side of the frame portion opposite to the loading table and closes the opening; a cover portion, which is arranged on the loading table side of the frame portion and is configured to protect the side of the box loaded on the loading table except for a part of the frame portion side; and a lifting mechanism, which raises and lowers the cover portion between a protection position for protecting the side of the box except for a part of the frame portion side and a retreat position below the protection position.

Description

Technical Field

[0001] The present invention relates to a cassette mounting mechanism for mounting a cassette for storing wafers and the like. Background Art

[0002] A workpiece such as a silicon wafer having devices such as IC (integrated circuit) and LSI (Large Scale Integration) formed on the front side is ground on the back side to a predetermined thickness and then divided into individual device chips by a cutting device or the like.

[0003] Usually, before processing the wafer using a processing device such as a grinding device or a cutting device, a wafer unit is first formed. For example, a wafer is placed in the opening of a metal ring frame, and a circular belt having an area larger than the opening of the ring frame is attached to the ring frame and the wafer. Thus, a wafer unit is formed in which the wafer, the ring frame, and the belt are integrated.

[0004] The wafer unit is stored in a cassette that can store a plurality of wafer units (see, for example, Patent Document 1). By storing a plurality of wafer units in the cassette, it is easy to collectively transport the plurality of wafer units.

[0005] A box loading mechanism for loading the box is provided in the processing device. After the box is loaded on the box loading mechanism, each wafer unit is moved out of the box into the processing device by a transport unit provided in the processing device. After the wafer is processed in the processing device, the wafer unit is moved from the processing device into the box. In this way, each wafer unit is transported between the box and the processing device by the transport unit.

[0006] Patent Document 1: Japanese Patent Application Publication No. 2000-91411

[0007] However, when the wafer unit is transported between the cassette and the processing device or when the wafer is processed in the processing device, there is a case where the operator accidentally touches the cassette and causes the cassette to move. When the cassette moves, the processing device is usually stopped for safety reasons, interrupting the transport of the wafer unit and the processing of the wafer. Summary of the invention

[0008] The present invention has been made in view of the above problem, and an object of the present invention is to provide a cassette placement mechanism that prevents an operator from accidentally touching a cassette during transport of a wafer unit or during processing of a wafer.

[0009] According to one embodiment of the present invention, there is provided a box loading mechanism, which is attached to a processing device for processing a plate-shaped workpiece, wherein the box loading mechanism comprises: a loading table on which a box for storing the workpiece is loaded; a frame portion, which is arranged on the side of the loading table, the frame portion having an opening for the workpiece to pass through when the workpiece is transported from the box loaded on the loading table; a door portion, which is arranged on the side of the frame portion opposite to the loading table and closes the opening portion; a cover portion, which is arranged on the loading table side of the frame portion and is configured to protect the side portion of the box loaded on the loading table except for a portion of the frame portion side; and a lifting mechanism, which causes the cover portion to be raised and lowered between a protection position for protecting the side portion of the box except for the portion of the frame portion side and a retreat position below the protection position.

[0010] Preferably, the box loading mechanism is constructed such that: the door portion moves from a closed position closing the opening portion to an open position opening the opening portion under the condition that the cover portion rises to the protection position, and the cover portion is lowered to the retreat position under the condition that the door portion moves from the open position to the closed position.

[0011] In addition, it is preferable that the cassette placement mechanism further includes a foot switch portion, which is provided below the placement table and can operate the lifting mechanism.

[0012] A cassette placement mechanism according to one embodiment of the present invention includes a cover portion configured to protect the side portion of the cassette placed on the placement table except for a portion of the frame portion. This prevents an operator from accidentally touching the cassette when a workpiece is transported between the cassette and a processing device or when the workpiece is processed in the processing device. Therefore, interruption of processing and transport of a plate-shaped workpiece in the processing device can be prevented. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a perspective view of the processing device and the cassette mounting mechanism according to the first embodiment.

[0014] Figure 2 It is a three-dimensional diagram of the cover and the moving mechanism.

[0015] Figure 3 Yes Figure 2 A partial cross-sectional side view obtained by enlarging area A.

[0016] Figure 4 It is a perspective view showing the situation during the transfer operation.

[0017] Figure 5 This is a perspective view showing the state after the processing and conveying work is completed.

[0018] Figure 6(A) is a diagram showing step S10 of placing a box on a mounting table, Figure 6 (B) is a diagram showing step S20 of raising the cover portion to the protection position, Figure 6 (C) is a diagram showing step S30 of carrying out the conveying and processing operation after the door portion is moved to the open position, Figure 6 (D) is a diagram showing step S40 of moving the door portion to the closed position, Figure 6 (E) is a diagram showing step S50 of lowering the cover portion to the retracted position.

[0019] Figure 7 It is a perspective view of the processing device and the box mounting mechanism of the second embodiment.

[0020] Figure 8 It is a perspective view of the foot switch part of 3rd Embodiment.

[0021] Description of symbols

[0022] 1: Wafer (workpiece); 2: Processing device; 2a: Front; 3: Belt; 4: Monitor; 5: Ring frame; 6: Transfer arm; 8: Control unit; 9: Wafer unit; 10: Cassette loading mechanism; 12: Base; 12a: Opening; 12b: Pedal (foot switch); 14: Loading table; 16: Cover; 16a: First side; 16b: Second side; 16c: Front; 16d: Upper end; 18: Lifting mechanism; 20: Bracket; 20a: First straight line; 20b: Second straight line; 20c: Third straight line; 20d: First corner; 20e: First 2 corners; 22a, 22b: rodless cylinder; 24a, 24b: body; 24c, 24d: cylinder barrel; 24e, 24f: base; 24g, 24h: slider; 24i, 24j: guide rail; 26: frame; 26a: front; 26b: back; 26c: opening; 26d: caster; 28: door; 30: box; 32a: 1st side; 32b: 2nd side; 32c: connecting part; 32d: handle; 32e: shelf; 32f: locking part side; 32g: loading and unloading part side; A: area; 40: light emitting element; 42: light receiving element. DETAILED DESCRIPTION

[0023] An embodiment of one aspect of the present invention will be described with reference to the drawings. Figure 1 1 is a perspective view of a processing device 2 and a cassette mounting mechanism 10 according to a first embodiment. The processing device 2 is a device for processing a workpiece, for example, a laser processing device for irradiating a workpiece with a laser beam, a cutting device for cutting a workpiece, a grinding device for grinding a workpiece, or a polishing device for grinding a workpiece.

[0024] The processing device 2 has a housing made of metal or the like, and a touch panel monitor 4 is arranged on the front face 2a of the housing. The monitor 4 serves as an input device for the operator to input instructions to the processing device 2 and a display device for displaying images of the workpiece, processing conditions, processing results, etc.

[0025] For example, the operator can set processing conditions for the processing device 2 via the monitor 4 by touching buttons displayed on the monitor 4. In addition, the monitor 4 displays an image of the workpiece captured by a not-shown imaging device provided in the processing device 2.

[0026] A cassette placement mechanism 10 is provided at a predetermined position different from the monitor 4 on the front surface 2a of the housing of the processing device 2. The cassette placement mechanism 10 of the present embodiment is a structure that is separate from the processing device 2 and is additionally mounted on the processing device 2.

[0027] The cassette placement mechanism 10 includes a base 12 having a substantially rectangular parallelepiped housing formed of a metal material such as stainless steel. An opening is provided at the top of the base 12, and a placement table 14 on which the cassette 30 is placed is provided above the opening.

[0028] The mounting table 14 is a rectangular plate-like member formed of a metal material such as stainless steel and is disposed substantially horizontally on the base 12. The mounting table 14 has an area smaller than the opening of the base 12 and larger than the bottom surface of the case 30.

[0029] The stage 14 is supported by a lifting unit (not shown) that is movable in the height direction (Z-axis direction). The lifting unit is located inside the housing of the base portion 12. The lifting unit moves the stage 14 in the height direction, thereby adjusting the height position of the stage 14.

[0030] A pressing pin (not shown) is provided on the upper surface of the mounting table 14 so as to protrude therefrom and is movable up and down. A first sensor unit (not shown) for detecting contact of the pressing pin is provided inside the mounting table 14 .

[0031] When the cartridge 30 is placed on the stage 14 , the pressing pin is pressed down and contacts the first sensor section provided in the stage 14 , and a predetermined signal indicating that the cartridge 30 is placed on the stage 14 is transmitted from the first sensor section to the control section 8 described later.

[0032] A second sensor unit (not shown) having a light emitting element and a light receiving element is provided on a frame unit 26 (described in detail later) disposed on the side of the mounting table 14 . The second sensor unit detects whether the wafer unit 9 exists in the cassette 30 .

[0033] A substantially rectangular box 30 formed of metal or resin is placed on the upper surface of the mounting table 14. The box 30 is a storage container for storing a plurality of workpieces. The box 30 of this embodiment has a pair of plate-like side portions (i.e., a first side portion 32a and a second side portion 32b).

[0034] The upper portions of the first side surface portion 32a and the second side surface portion 32b are connected to each other via a plurality of rod-shaped connecting portions 32c. In addition, the lower portions of the first side surface portion 32a and the second side surface portion 32b are also connected to each other via a plurality of rod-shaped connecting portions 32c.

[0035] In addition, if Figure 1 As shown, two connecting parts 32c are provided on the upper part of the first side part 32a, but the number of connecting parts 32c is not limited to two, and can be one or more than three. In addition, the shape of the connecting part 32c is not limited to a rod shape, and can also be a plate shape.

[0036] The plurality of connection portions 32c on the upper sides of the first side surface portion 32a and the second side surface portion 32b are connected to each other by a handle 32d. The operator can carry the cassette 30 by holding the handle 32d.

[0037] The first side surface portion 32a and the second side surface portion 32b each have a plurality of shelves 32e on the inner side surfaces facing each other. A plurality of shelves 32e are provided at predetermined intervals along the height direction of the box 30. In the present embodiment, one wafer unit 9 is supported by a pair of shelves 32e located at the same height position among the shelves 32e facing each other.

[0038] The wafer unit 9 is formed by placing a wafer (workpiece) 1 in the opening of a metal annular frame 5 and bonding the annular frame 5 and the wafer 1 together with a circular tape 3 having a larger area than the opening of the annular frame 5 .

[0039] In this embodiment, a plurality of wafer units 9 are stored by a plurality of pairs of shelves 32e so as to overlap in the height direction of the cassette 30. In this way, a plurality of pairs of shelves 32e form a storage space for storing a plurality of wafers 1. In addition, in addition to a wafer unit 9, a wafer 1 may be directly supported by a pair of shelves 32e.

[0040] A locking structure (not shown) for locking the workpiece is provided at one end of the shelf 32e. In the present embodiment, one end of the shelf 32e is referred to as the locking portion side 32f, and the other end of the shelf 32e (i.e., the side opposite to the locking portion side 32f) is referred to as the loading and unloading portion side 32g.

[0041] The locking portion side 32f and the loading / unloading portion side 32g of the cassette 30 are open areas without plate-shaped surface members. The wafer unit 9 is loaded from the cassette 30 to the outside through the loading / unloading portion side 32g of the cassette 30 and loaded from the outside into the cassette 30.

[0042] In addition, the box 30 is not limited to Figure 1 For example, plate-shaped surface members may be provided on the locking portion side 32f, the upper portion and the lower portion of the box 30, and only the loading and unloading portion side 32g may be completely opened. In addition, the box 30 may also be a FOUP (Front Opening Unified Pod: front-opening wafer transfer box) type box.

[0043] A cover portion 16 is provided on the inner side of the base portion 12 and on the outer side of the side of the mounting table 14. The cover portion 16 of the present embodiment is composed of three substantially rectangular resin plate members, and when the cassette 30 is mounted on the mounting table 14, the cover portion 16 is configured to protect the side portions (i.e., the first side portion 32a, the second side portion 32b, and the locking portion side 32f) of the cassette 30 except for a part (i.e., the loading and unloading portion side 32g).

[0044] The cover portion 16 includes a first side portion 16a and a second side portion 16b facing each other, and a front portion 16c connected to one end of the first side portion 16a and the second side portion 16b. The first side portion 16a, the second side portion 16b, and the front portion 16c have the same length in the height direction (i.e., the Z-axis direction), and each length is longer than the length from the lower end to the upper end of the box 30.

[0045] The inner surfaces of the first side surface portion 16a and the second side surface portion 16b are parallel to each other, and the inner surface of the front portion 16c is perpendicular to the inner surfaces of the first side surface portion 16a and the second side surface portion 16b. The other end sides of the first side surface portion 16a and the second side surface portion 16b and the upper and lower parts of the cover portion 16 are completely open.

[0046] The cover 16 and the lifting mechanism 18 (see Figure 2 and Figure 3 ) is connected. The cover 16 is raised and lowered relative to the box 30 placed on the mounting table 14 by the lifting mechanism 18. Here, the cover 16 is raised and lowered by the lifting mechanism 18 relative to the box 30 placed on the mounting table 14. Figure 2 and Figure 3 The lifting mechanism 18 will be described.

[0047] Figure 2 1 is a perspective view of the cover 16 and the lifting mechanism 18. The lifting mechanism 18 has a bracket 20 formed of metal. The bracket 20 is connected to the lower part of the cover 16 and is integrated with the cover 16.

[0048] The bracket 20 includes a first linear portion 20a connected to the lower portion of the first side portion 16a of the cover portion 16, a second linear portion 20b connected to the lower portion of the second side portion 16b, and a third linear portion 20c connected to the lower portion of the front portion 16c.

[0049] The first straight portion 20a and the third straight portion 20c constitute a first corner portion 20d, and the second straight portion 20b and the third straight portion 20c constitute a second corner portion 20e. A first linear guide is provided near the first corner portion 20d, and a second linear guide is provided at the second corner portion 20e.

[0050] The first linear guide is composed of a substantially rectangular parallelepiped metal slider 24g and an elongated plate-shaped metal guide rail 24i, and the second linear guide is similarly composed of a substantially rectangular parallelepiped metal slider 24h and an elongated plate-shaped metal guide rail 24j.

[0051] The guide rails 24i and 24j are arranged outside the bracket 20, and the side surfaces of the guide rails 24i and 24j are substantially parallel to the side surfaces of the first and second linear portions 20a and 20b and the first and second side surfaces 16a and 16b.

[0052] The guide rails 24i and 24j are connected to one side of the sliders 24g and 24h so as to be movable in the vertical direction. The first corner 20d of the bracket 20 is connected to the upper part of the slider 24g, and the second corner 20e of the bracket 20 is connected to the upper part of the slider 24h.

[0053] A rodless cylinder 22a is provided at a position inside the first linear guide relative to the first linear portion 20a, and another rodless cylinder 22b is provided at a position inside the second linear guide relative to the second linear portion 20b. The rodless cylinders 22a and 22b have rectangular parallelepiped bodies 24a and 24b formed of metal.

[0054] The other side portion of the slider 24g located on the opposite side to the one side portion of the slider 24g is fixed to the body portion 24a of the rodless cylinder 22a. Similarly, the other side portion of the slider 24h is fixed to the body portion 24b of the rodless cylinder 22b. In this way, the bracket 20 is supported by the rodless cylinders 22a and 22b via the first and second linear guides.

[0055] The body parts 24a and 24b have cylindrical through openings. Cylindrical cylinder tubes 24c and 24d formed of metal are arranged in the through openings, and the cylindrical cylinder tubes 24c and 24d are arranged along the extending direction of the guide rails 24i and 24j. The body parts 24a and 24b are configured to be movable along the height direction of the cylinder tubes 24c and 24d.

[0056] A cylindrical piston (not shown) is provided inside the cylinders 24c and 24d so as to be slidable in the longitudinal direction of the cylinders 24c and 24d. A magnet is provided in the piston, and magnets are provided in the body parts 24a and 24b so as to surround the piston. The magnet of the piston is magnetically coupled to the magnet of the body parts 24a and 24b.

[0057] The bottom of the cylinders 24c and 24d is provided with bases 24e and 24f, and the top is provided with a head cover (not shown). For example, when air is supplied from the bases 24e and 24f to the inside of the cylinders 24c and 24d and the air is exhausted from the head cover, the piston rises relative to the cylinders 24c and 24d.

[0058] Similarly, when air is exhausted from the bases 24e and 24f and air is supplied from the head cover to the inside of the cylinders 24c and 24d, the piston moves down relative to the cylinders 24c and 24d. In this way, the piston slides in the vertical direction inside the cylinders 24c and 24d, and the body parts 24a and 24b also slide in the vertical direction.

[0059] As described above, the body parts 24 a and 24 b are fixed to the bracket 20 via the sliders 24 g and 24 h , and therefore, the cover part 16 can be raised or lowered via the bracket 20 by sliding the body parts 24 a and 24 b up and down. Figure 3 Yes Figure 2 A partial cross-sectional side view obtained by enlarging area A.

[0060] The cover 16 is moved by the lifting mechanism 18 to a protection position (see Figure 1 ) and the retreat position to the inner side of the base portion 12 (refer to Figure 5 ) between (ie, raised and lowered). The protection position in this embodiment refers to a position where the cover 16 covers the first side surface 32a, the second side surface 32b, and the locking portion 32f of the box 30 placed on the mounting table 14.

[0061] When the cover 16 is in the protection position, the upper end 16d of each side portion of the cover 16 (i.e., the first side portion 16a, the second side portion 16b, and the front portion 16c) is located above the top portion of the box 30. Thus, the cover 16 protects the side of the box 30.

[0062] In addition, the retreat position in the present embodiment refers to a position where the cover 16 is located below the protection position and is hidden inside the base 12. When the cover 16 is in the retreat position, the upper end 16d of each side portion of the cover 16 is located at the same position as or lower than the mounting table 14. At this time, the cover 16 does not protect the box 30, so the operator can easily enter the box 30.

[0063] Here, return Figure 1 The frame portion 26 is disposed at a position opposite to the front portion 16c (i.e., to the side of the back side of the mounting table 14) and at a predetermined distance (e.g., several mm) from the other end of the first side portion 16a and the second side portion 16b relative to the mounting table 14. The frame portion 26 is a plate-shaped member formed of a metal material such as stainless steel, and stands substantially perpendicular to the floor surface.

[0064] A substantially rectangular opening 26c is provided in the substantially upper half of the frame 26, which passes through from the front 26a to the back 26b of the frame 26. The opening 26c is a through opening in the shape of a rectangular parallelepiped, and the size of the opening 26c on the front 26a and the back 26b is substantially the same as or larger than the size of the loading / unloading section 32g of the box 30. Therefore, the opening 26c allows the wafer unit 9 to pass through.

[0065] A door portion 28 is disposed on the back side 26b of the substantially upper half of the frame portion 26. The door portion 28 is substantially rectangular and has an area larger than the opening area on the back side 26b of the opening portion 26c. The door portion 28 is a part of the cassette placement mechanism 10. The door portion 28 of the present embodiment is configured to slide and move along the height direction (i.e., the Z-axis direction) of the frame portion 26 by a moving unit (not shown).

[0066] The door 28 of the present embodiment is, for example, in a closed position (ie, a closed position) in which the back surface 26b of the opening 26c is completely closed. Figure 1 The position of the door portion 28 shown in the figure, i.e., the upper position) and the open position in which the back side 26b of the opening portion 26c is fully opened (i.e., Figure 4 The door portion 28 is moved by the moving unit in a manner such that the door portion 28 is in the position shown, that is, the lower position.

[0067] The back side of the base 12 is connected to a substantially lower half region (ie, a region below the opening 26c) of the frame 26. Further, a plurality of casters 26d are provided below the frame 26 to contact the floor surface.

[0068] The casters 26d are provided, for example, in the width direction ( Figure 1 The casters 26d are used to move the box mounting mechanism 10 independently of the processing device 2.

[0069] like Figure 1 As shown, the cassette placement mechanism 10 of this embodiment is mounted on the processing device 2. In particular, the frame 26 and the door 28 are embedded in the processing device 2 so that the front surface 26a of the frame 26 is substantially parallel to the front surface 2a of the housing of the processing device 2.

[0070] A transfer arm 6 is disposed at a position facing the opening 26c inside the processing device 2. The transfer arm 6 has a substantially U-shaped hand, and a suction mechanism such as a suction pad for suctioning the wafer unit 9 is provided on one side of the hand.

[0071] The transfer arm 6 moves its hand to below the wafer unit 9 stored in the cassette 30 , and suctions the wafer unit 9 with its hand to transfer the wafer unit 9 to an alignment table (not shown) disposed inside the processing apparatus 2 .

[0072] The movement of the transfer arm 6 and the like is controlled by a control unit 8 provided in the processing device 2. The control unit 8 is, for example, a computer, and includes a CPU, a RAM, a hard disk drive, and the like which are interconnected via a main controller.

[0073] The CPU performs calculations and processing according to programs and data stored in storage units such as RAM and hard disk drives. The CPU reads the programs stored in the storage unit, so that the control unit 8 can function as a specific means of cooperation between software and the above-mentioned hardware resources.

[0074] The control unit 8 is electrically connected not only to the transfer arm 6 but also to the monitor 4. When the cassette placement mechanism 10 is mounted on the processing apparatus 2, the control unit 8 is electrically connected to the cassette placement mechanism 10.

[0075] The control unit 8 receives instructions from the operator through the monitor 4 and controls the operation of each unit. For example, the control unit 8 receives instructions to move the cover 16 and the door 28 through the monitor 4 and controls the movement of the lifting mechanism 18 and the moving unit to reflect the instructions.

[0076] Next, use Figure 1 , Figure 4 as well as Figure 5 The movement of the transfer arm 6, the cover 16, and the door 28 when the wafer 1 is processed by the processing apparatus 2 will be described. When the door 28 is in the closed position and the cover 16 is in the retracted position, the operator places the cassette 30 on the stage 14.

[0077] When the cartridge 30 is placed on the stage 14 , the above-mentioned pressing pin is pressed, and information a indicating that the cartridge 30 is present on the stage 14 is transmitted from the first sensor portion of the stage 14 to the control portion 8 .

[0078] When the wafer unit 9 exists in the cassette 30, the second sensor unit transmits information b indicating this to the control unit 8. The information a and b are used as a precondition when the processing device 2 starts unloading the wafer unit 9 from the cassette 30, for example.

[0079] Next, the operator sends an instruction to the control unit 8 to raise the cover 16 to the protection position via the monitor 4. The control unit 8 controls the movement of the lifting mechanism 18, for example, based on the receipt of the information a and b, to raise the cover 16 to the protection position (see Figure 1 ).

[0080] After the cover 16 reaches the protection position, the control unit 8 controls the movement of the moving unit to lower the door 28 to the open position (see Figure 4 After the door 28 is moved to the open position, the control unit 8 controls the movement of the lifting unit to adjust the height position of the mounting table 14 so that the height position of the wafer unit 9 in the box 30 coincides with the height position of the transfer arm 6 .

[0081] Then, the control unit 8 controls the movement of the transfer arm 6, so that the transfer arm 6 carries the wafer unit 9 out of the cassette 30 into the processing apparatus 2. Then, the wafer 1 is processed in the processing apparatus 2. Figure 4 It is a perspective view showing the situation during the transfer operation.

[0082] In this embodiment, during the transportation of the wafer unit 9 and the processing of the wafer 1, the cover 16 surrounds the first side portion 32a, the second side portion 32b and the locking portion side 32f of the box 30 (i.e., the outer peripheral side of the box 30 except the loading and unloading portion side 32g).

[0083] Thus, during the transportation of the wafer unit 9 and the processing of the wafer 1, it is possible to prevent the operator from accidentally touching the cassette 30 and the wafer unit 9. Therefore, it is possible to prevent the transportation and processing from being interrupted.

[0084] In addition, unlike the FOUP type cassette, the wafer units 9 stored in the cassette 30 of the present embodiment are exposed to the external environment. Therefore, when the outer peripheral side of the cassette 30 other than the loading / unloading portion side 32g is not surrounded by the cover 16, there is a concern that the operator may accidentally touch the wafer unit 9 and injure the operator's hand, or the wafer 1 may be moved.

[0085] However, in this embodiment, the cover 16 surrounds the outer peripheral side of the cassette 30 except the loading / unloading portion 32g, thereby preventing the operator from accidentally touching the wafer 1 and injuring the operator's hand or moving the wafer 1.

[0086] After the processing is completed, each wafer 1 is transferred into the cassette 30 by the transfer arm 6. After all the wafers 1 are transferred into the cassette 30, the control unit 8 moves the door 28 to the closed position and then lowers the cover 16 to the retracted position. Thus, the processing and transfer operation of the wafer 1 is completed. Figure 5 This is a perspective view showing the state after the processing and conveying work is completed.

[0087] Next, use Figure 6 The details of the operation sequence of the cover 16 and the door 28 will be described. When the cover 16 is in the retracted position and the door 28 is in the closed position, the operator places the cassette 30 on the placement table 14 (step S10). Figure 6 (A) is a diagram showing step S10 of placing the cassette 30 on the mounting table 14 .

[0088] After S10, the above information a and b are sent to the control unit 8, and the control unit 8 confirms that the cassette 30 exists on the mounting table 14 and the wafer unit 9 exists in the cassette 30. Alternatively, the control unit 8 may display the meaning of receiving the information a and b on the monitor 4, so that the operator can confirm the existence of the cassette 30 and the wafer unit 9.

[0089] Then, when the operator sends an instruction to raise the cover 16 to the control unit 8 via the monitor 4, the control unit 8 controls the movement of the lifting mechanism 18 to raise the cover 16 (S20). Figure 6 (B) is a diagram showing step S20 of raising the cover 16 to the protection position. Figure 6 The state of the box loading mechanism 10 shown in (B) is the same as Figure 1 The state of the cassette mounting mechanism 10 shown corresponds to this.

[0090] In step S20, when the cover 16 is raised to the protection position by the lifting mechanism 18, the cover 16 surrounds the outer peripheral side of the box 30 except the loading and unloading part side 32g. At this time, the position of the door 28 is maintained at the closed position to close the opening 26c.

[0091] After S20, the operator sends a processing start instruction to the control unit 8 via the monitor 4. When the control unit 8 receives the processing start instruction, the cover 16 is raised to the protection position, and the door 28 is moved from the closed position to the open position. Then, the control unit 8 controls the movement of the transfer arm 6 to carry the wafer unit 9 out of the box 30 to the processing device 2 (S30).

[0092] Then, the wafer 1 is processed inside the processing device 2 ( S30 ). Figure 6 (C) is a diagram showing step S30 of carrying out the conveying and processing operation after the door portion 28 is moved to the open position. Figure 6 The state of the box loading mechanism 10 shown in (C) is the same as Figure 4 The state of the cassette mounting mechanism 10 shown corresponds to this.

[0093] When the processing of the wafer unit 9 is completed and all the wafer units 9 are carried into the cassette 30, S30 is ended. After S30, the control unit 8 controls the movement of the moving unit to move the door 28 from the open position to the closed position (S40). Figure 6 (D) is a diagram showing step S40 of moving the door portion 28 to the closed position.

[0094] After step S40, the control unit 8 controls the movement of the lifting mechanism 18 to lower the cover 16 to the retreat position (S50) on the condition that the door 28 moves from the open position to the closed position. Thus, the operator can enter the stage 14. For example, the operator carries out the box 30 containing the processed wafer unit 9 from the stage 14.

[0095] Figure 6 (E) is a diagram showing a step (S50) of lowering the cover portion 16 to the retreat position. Figure 6 The state of the box loading mechanism 10 shown in (E) is the same as Figure 5 The state of the cassette mounting mechanism 10 shown corresponds to this.

[0096] After S50, the operator may place a new cassette 30 containing unprocessed wafers 1 on the mounting table 14. After S50, the operator may return to S10 again and repeat the steps of S20, S30, and S40 in sequence.

[0097] Next, the second embodiment will be described. The cassette placement mechanism 10 of the second embodiment has an opening 12a at a position below the placement table 14 on the front side of the base 12, and a pedal (foot switch) 12b is provided in the opening 12a so as to be exposed to the outside. For example, the pedal 12b is provided so as to protrude from the opening 12a at least in part. Figure 7 It is a perspective view of the processing device 2 and the cassette mounting mechanism 10 according to the second embodiment.

[0098] Instead of operating the lifting mechanism 18 by touching the monitor 4 with the hand, the operator can also operate the lifting mechanism 18 via the control unit 8 by stepping on the pedal 12 b with the foot to raise and lower the cover 16 between the protection position and the retreat position.

[0099] For example, Figure 6 As shown in (A), when there is a box 30 on the mounting table 14 (that is, the control unit 8 receives the above-mentioned information a), when the operator steps on the pedal 12b, the control unit 8 controls the movement of the lifting mechanism 18 to raise the cover 16 to the protection position. On the other hand, when there is no box 30 on the mounting table 14, the control unit 8 does not move the cover 16 even if the operator steps on the pedal 12b.

[0100] Furthermore, before the wafer unit 9 is transported or the wafer 1 is processed, if the operator steps on the pedal 12b again after the cover 16 is raised to the protection position, the control unit 8 may lower the cover 16 to the retreat position.

[0101] In addition, for example Figure 6 As shown in (E), after the conveying and processing operation is completed, when the operator steps on the pedal 12b, the control unit 8 controls the movement of the lifting mechanism 18 to lower the cover 16 to the retracted position. In contrast, during the conveying and processing operation, even if the operator steps on the pedal 12b, the control unit 8 does not move the cover 16. This prevents the conveying and processing from being interrupted due to the erroneous operation of the pedal 12b.

[0102] Thus, the operator can raise or lower the cover 16 simply by stepping on the pedal 12b. When the operator stands on the front side of the cassette mounting mechanism 10 and cannot reach the monitor 4 with his hands or when the operator's hands are occupied, the operator can raise or lower the cover 16 with his feet, thereby improving the working efficiency.

[0103] Next, the third embodiment will be described. The cassette placement mechanism 10 of the third embodiment includes a foot switch portion instead of the pedal 12b, and the foot switch portion includes a light emitting element 40 and a light receiving element 42. This point is different from the second embodiment. Figure 8 It is a perspective view of the foot switch part of 3rd Embodiment.

[0104] The light emitting element 40 and the light receiving element 42 are arranged at a position closer to the inner side of the base portion 12 than the opening portion 12a. The light receiving element 42 is arranged on the inner side of one side surface of the base portion 12. On the other hand, the light emitting element 40 is arranged inside the base portion 12 so as to be opposed to the light receiving element 42. The light emitting surface of the light emitting element 40 and the light receiving surface of the light receiving element 42 are arranged to have a length exceeding the width of the opening portion 12a so as to sandwich a space extending from the opening portion 12a to the inner side of the base portion 12.

[0105] An optical system such as a lens (not shown) is provided on the light emitting surface of the light emitting element 40, and the light emitting element 40 irradiates infrared or near-infrared light L toward the light receiving surface of the light receiving element 42 through the optical system. As a result, a detection line composed of light L is formed at a position inside the base portion 12 relative to the opening 12a.

[0106] For example, the operator puts his foot into the opening 12a to temporarily block the light L. In this case, the light receiving element 42 sends a predetermined signal to the control unit 8 to operate the lifting mechanism 18. The control unit 8 operates the lifting mechanism 18 according to the predetermined signal to lift the cover 16 between the protection position and the retreat position.

[0107] In the third embodiment, the operator can also operate the lifting mechanism 18 by shielding the light L with his feet instead of touching the monitor 4 with his hands to operate the lifting mechanism 18 and lift the cover 16 between the protection position and the retreat position.

[0108] Therefore, the operator can raise or lower the cover 16 simply by putting his feet into the opening 12a. When the operator stands on the front side of the cassette mounting mechanism 10 and cannot reach the monitor 4 with his hands or when the operator's hands are occupied, the operator can raise or lower the cover 16 with his feet, thereby improving the working efficiency.

[0109] in addition, Figure 8 The light emitting element 40 and the light receiving element 42 shown in the figure constitute a so-called transmission detection type sensor unit, but may also constitute a so-called reflection detection type sensor unit. For example, the light emitting surface of the light emitting element 40 and the light receiving surface of the light receiving element 42 are arranged in parallel inside the base part 12 so as to face the inner side of one side surface of the base part 12.

[0110] In this case, a space extending from the opening 12a to the inside of the base portion 12 is sandwiched between the light emitting element 40 and the light receiving element 42 and the inside of one side surface of the base portion 12. The light emitting element 40 transmits light L to the inside of one side surface of the base portion 12 through an optical system such as a lens (not shown), and the light receiving element 42 receives reflected light from the inside of one side surface of the base portion 12. That is, the inside of one side surface of the base portion 12 functions as a reflector.

[0111] The operator puts his foot into the opening 12a, thereby shielding the light L and its reflected light, and thus the amount of light received by the light receiving element 42 changes. When the amount of light received changes by a predetermined amount or more, the light receiving element 42 sends a predetermined signal to the control unit 8 to operate the lifting mechanism 18. The control unit 8 operates the lifting mechanism 18 according to the predetermined signal, and raises and lowers the cover 16 between the protection position and the retreat position.

[0112] In addition, the light L can be used as a recognition sensor for the processing device 2 to recognize an automatic transport device (AGV: Automatic Guided Vehicle) such as a box transport device. For example, an automatic transport device (not shown) moving on the floor has a protrusion protruding horizontally in front of its moving direction.

[0113] In this case, when the automatic transport device comes to the front of the cassette placement mechanism 10, the protrusion enters the opening 12a, and the light L is blocked by the protrusion, the processing device 2 can recognize that the automatic transport device has come to the front of the cassette placement mechanism 10. Then, the cassette 30 is placed on the placement table 14 from the automatic transport device (step S10), and then the above-mentioned steps S20 to S50 are sequentially performed.

[0114] In addition, the structure and method of the above embodiment can be appropriately changed and implemented as long as they do not depart from the scope of the purpose of the present invention. The lifting mechanism 18 of this embodiment is a so-called magnet type rodless cylinder 22a, 22b, but the rodless cylinder 22a, 22b can also be other structures such as a slot type.

[0115] In addition, for example, the above-mentioned cover portion 16 is composed of three surfaces, namely the first side portion 16a, the second side portion 16b and the front portion 16c, but as long as it does not hinder the lifting and lowering movement of the cover portion 16, a cover component can also be provided on a part of the upper part of the cover portion 16 or the back portion located on the opposite side of the front portion 16c.

Claims

1. A processing device for processing a plate-shaped workpiece, the processing device being provided with a cassette mounting mechanism, characterized in that: The processing device has a control unit electrically connected to the box loading mechanism. The box loading mechanism has: A mounting table on which a box for storing the workpiece is mounted; a frame portion disposed on the side of the mounting table, the frame portion having an opening portion through which the workpiece passes when the workpiece is transported from the box mounted on the mounting table; A door portion, which is arranged on a side of the frame portion opposite to the mounting table, closing the opening portion; a cover portion, which is provided on the mounting platform side of the frame portion and is configured to protect the side portion of the box mounted on the mounting platform except for a portion on the frame portion side; a lifting mechanism that lifts the cover portion between a protection position for protecting the side portion of the box except the portion on the frame portion side and a retreat position below the protection position; A foot switch unit is provided below the mounting platform and is capable of causing the lifting mechanism to operate; as well as a sensor unit that transmits predetermined information indicating that the cartridge is placed on the placement table to the control unit, The cover portion comprises: a first side portion and a second side portion, each of which is in the shape of a plate, and the first side portion and the second side portion are arranged to face each other; and a plate-shaped front portion, which connects the first side portion and the second side portion at one end side located on the side opposite to the frame portion, and the upper portion of the cover portion located above the mounting table is always open. When the control unit receives the predetermined information from the sensor unit and an instruction to raise the cover unit is sent to the control unit via the foot switch unit, the control unit moves the cover unit from the retreat position to the protection position.

2. The processing device according to claim 1, characterized in that: The box loading mechanism is composed of: The door portion is moved from a closed position for closing the opening portion to an open position for opening the opening portion under the condition that the cover portion is raised to the protection position, and The cover part is lowered to the retreat position under the condition that the door part moves from the open position to the closed position.

3. The processing device according to claim 1 or 2, characterized in that: When an instruction to raise the cover portion is sent to the control portion via the foot switch portion during the conveyance of the workpiece and during the processing of the workpiece, the control portion does not move the cover portion from the protection position to the retreat position.

4. The processing device according to claim 1 or 2, characterized in that: The foot switch unit includes another sensor unit of a transmission detection method or a reflection detection method having a light emitting element and a light receiving element.

5. The processing device according to claim 1 or 2, characterized in that: The processing device is a laser processing device that irradiates the workpiece with a laser beam, a cutting device that cuts the workpiece, a grinding device that grinds the workpiece, or a polishing device that grinds the workpiece.

Images