Vehicle drive module assembly

Abstract

The present invention discloses a vehicle-mounted drive module assembly, including a film capacitor, an IGBT single tube, a water-cooled plate, and a drive plate. The water-cooled plate includes a heat sink and a cooling base plate that are screwed together. The heat sink is provided with a thermal pad in the middle of its length direction. Both sides of the thermal pad on the upper surface of the heat sink are provided with insulating thermal conductive sheets. Both ends of the heat sink are provided with film capacitor mounting surfaces. The film capacitor is provided with the IGBT single tube pressed between the film capacitor and the insulating thermal conductive pad through the film capacitor mounting surface provided on the heat sink, and the pins of the film capacitor and the IGBT single tube pins are welded into one body with solder after passing through the drive plate. The product of the present invention can ensure that the current consistency passing through all the IGBT single tubes on the upper bridge arm and the lower bridge arm is good, and the product has good heat dissipation performance and is simple and quick to assemble.

Description

Technical Field

[0001] The invention belongs to the technical field of controllers, and in particular relates to a vehicle-mounted drive module assembly. Background Art

[0002] The on-board motor controller currently on the market is composed of an insulated gate bipolar transistor (IGBT) module, a thin film capacitor, a driver board, a heat sink, a main control board, a copper busbar, etc. The structural design and adjustment are designed according to customer needs, which is a large workload and high cost. In addition, the heat dissipation performance of the thin film capacitor used to connect to the insulated gate bipolar transistor in the prior art is poor, which can easily cause damage to the single tube of the insulated gate bipolar transistor, causing the entire system to fail; in addition, the existing on-board motor controller heat sink generally uses an internal rib structure for heat dissipation. This structure has the problem of insufficient heat exchange between the heat dissipation rib and the cooling water, and has a poor cooling effect on the IGBT module, which can easily cause the IGBT module to overheat or be damaged. Summary of the invention

[0003] In view of the problems existing in the prior art, the purpose of the design of the present invention is to provide a vehicle-mounted drive module assembly, which replaces the IGBT module with IGBT single tubes in parallel, welds specially designed thin-film capacitors and IGBT single tubes, and finally forms a drive module assembly with the thin-film capacitors, IGBT single tubes, drive plates, and water-cooling plates.

[0004] The present invention is achieved through the following technical solutions:

[0005] The vehicle-mounted drive module assembly is characterized in that it includes a thin film capacitor, an IGBT single tube arranged in parallel, a water cooling plate, and a driving plate. The water cooling plate includes a heat sink and a cooling base plate which are screwed together. The heat sink is provided with a thermal pad in the middle position along its length direction. Insulating thermal conductive sheets are provided on both sides of the thermal pad on the upper surface of the heat sink. Thin film capacitor mounting surfaces are provided at both ends of the heat sink. The thin film capacitor presses the IGBT single tube between the thin film capacitor and the insulating thermal conductive pad through the thin film capacitor mounting surface provided on the heat sink, and the pins of the thin film capacitor and the IGBT single tube are welded into one with solder after passing through the driving board.

[0006] The vehicle-mounted drive module assembly is characterized in that the thin film capacitor includes a shell and a three-phase output copper bar, a positive copper bar and a negative copper bar which are encapsulated inside the shell by epoxy resin, and a battery cell welded between the positive copper bar and the negative copper bar. The bottom surface of the shell forms a potting surface, and a heat conductive component for reducing the internal temperature of the thin film capacitor is also arranged in the shell.

[0007] The vehicle-mounted drive module assembly is characterized in that the positive copper busbar is provided with a positive pin, the negative copper busbar is provided with a negative pin, three-phase pins are provided on both sides of the three-phase output copper busbar, the positive pins and negative pins are provided on both sides of the shell, and are arranged crosswise with the corresponding three-phase pins.

[0008] The vehicle-mounted thin-film capacitor is characterized in that the thermal conductive component includes a positive thermal conductive column arranged on the positive copper busbar and a three-phase thermal conductive column arranged on the three-phase output copper busbar. The three-phase output copper busbar is also provided with a through hole for the positive thermal conductive column to pass through. The through hole and the three-phase thermal conductive column are arranged crosswise in sequence. A circle of grooves are provided on the positive thermal conductive column and the three-phase thermal conductive column, and the grooves are potted inside the epoxy resin. The lower ends of the positive thermal conductive column and the three-phase thermal conductive column protrude from the potting cover and are in contact with the thermal conductive pad.

[0009] The vehicle-mounted drive module assembly is characterized in that the IGBT single tube is fixed on the insulating heat conductive sheet by a pressure strip, and the other end of the pressure strip is fixed on the heat sink by a screw. After the IGBT single tube is installed, the C pole of the upper bridge arm IGBT single tube is aligned with the positive pin of the thin film capacitor, the e pole of the upper bridge arm IGBT single tube is aligned with the three-phase pin of the thin film capacitor, the C pole of the lower bridge arm IGBT single tube is aligned with the three-phase pin of the thin film capacitor, and the e pole of the lower bridge arm IGBT is aligned with the negative pin of the thin film capacitor. The drive board includes an upper bridge arm drive board and a lower bridge arm drive board, and the upper bridge arm drive board and the lower bridge arm drive board are respectively installed on both sides of the thin film capacitor to ensure that the pins of the thin film capacitor and the pins of the IGBT single tube are inserted into the drive boards on both sides, and surface-mounted copper blocks are welded between the IGBT C pole inserted on the upper bridge arm drive board and the positive pin of the thin film capacitor, between the e pole and the three-phase pin of the thin film capacitor, between the IGBT C pole inserted on the lower bridge arm drive board and the three-phase pin of the thin film capacitor, and between the e pole and the negative pin of the thin film capacitor.

[0010] The vehicle-mounted drive module assembly is characterized in that an inwardly concave cooling water channel is arranged on the cooling base plate, and heat dissipation column assemblies extending into the cooling water channel are densely arranged on the lower bottom surface of the heat dissipation plate, and a sealing ring mounting surface is provided on the upper edge of the cooling water channel and is sealedly connected to the lower bottom surface of the heat dissipation plate.

[0011] The vehicle-mounted drive module assembly is characterized in that a water inlet and a water outlet are provided at one end of the cooling base plate, and a water channel partition extends from the junction of the water inlet and the water outlet into the cooling water channel, and the water channel partition divides the cooling water channel into a water inlet area and a water outlet area, and the water inlet area and the water outlet area are connected at one end away from the water inlet and the water outlet.

[0012] The vehicle-mounted drive module assembly is characterized in that the heat dissipation column assembly includes a prismatic heat dissipation column and a triangular heat dissipation column, the triangular heat dissipation column extends into the edge of the cooling water channel, and the diamond heat dissipation column is located inside the area surrounded by the triangular heat dissipation column.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] 1) Ensure that the current passing through all IGBTs on the upper and lower arms is consistent;

[0015] 2) The setting of the thermal conductive component can effectively conduct the heat on the copper bar inside the film capacitor to the heat sink;

[0016] 3) The heat dissipation area of ​​a single-tube IGBT is increased, the heat dissipation of a single-tube IGBT is increased, and the system reliability is improved;

[0017] 4) The water cooling plate, film capacitor, driver board, IGBT single tube and three-phase line are formed into a modular product, which is convenient for transplanting the modular product into the product required by the customer, simplifying the installation procedure and improving work efficiency.

[0018] Instruction Manual

[0019] Figure 1 This is a schematic diagram of the installation structure of the present invention;

[0020] Figure 2 for Figure 1 Schematic diagram of the structure after removing the shell;

[0021] Figure 3 Schematic diagram of the structure of the negative electrode copper bar;

[0022] Figure 4 Schematic diagram of the structure of the positive copper busbar;

[0023] Figure 5 This is a schematic diagram of the structure of three output copper bars;

[0024] Figure 6 This is a schematic diagram of the installation structure of the positive copper bar, negative copper bar, and three-phase output copper bar;

[0025] Figure 7 for Figure 6 A schematic diagram of the structure from another angle;

[0026] Figure 8 It is a schematic diagram of the film capacitor structure;

[0027] Fig. 9 This is a schematic diagram of the structure of the film capacitor installed on the heat sink;

[0028] Fig.10 for Fig. 9Schematic diagram of internal installation relationship;

[0029] Figure 11-Figure 14 This is the installation relationship diagram of different pins of film capacitors and IGBT pins;

[0030] Fig.15 It is a schematic diagram of the structure of the water cooling plate;

[0031] Fig.16 It is a schematic diagram of the structure of the water cooling plate from a top view;

[0032] Fig.17 It is a schematic diagram of the assembly process of the cooling base plate and the heat sink;

[0033] Fig.18 It is a schematic diagram of the cooling base plate structure;

[0034] Fig.19 It is a schematic diagram of the structure of the cooling base plate from a top view;

[0035] Fig. 20 This is the bottom structure diagram of the heat sink;

[0036] Fig.21 for Fig. 20 A top view of the structure;

[0037] Fig. 22 is the water flow direction diagram;

[0038] In the figure, 1-film capacitor, 101-shell, 102-three-phase output copper busbar, 103-positive copper busbar, 104-negative copper busbar, 105-battery core, 106-filling cover, 107-positive pin, 108-negative pin, 109-three-phase pin, 110-positive thermal conductive column, 111-three-phase thermal conductive column, 112-through hole, 113-groove, 2-IGBT single tube, 201-C pole of upper bridge arm IGBT single tube, 202-e pole of upper bridge arm IGBT single tube, 203-C pole of lower bridge arm IGBT single tube , 204-e-pole of the lower bridge arm IGBT single tube, 3-water cooling plate, 301-heat sink, 302-cooling base plate, 303-thermal pad, 304-insulating thermal conductive sheet, 305-film capacitor mounting surface, 306-cooling water channel, 307-sealing ring mounting surface, 308-water inlet, 309-water outlet, 310-water channel partition, 311-prismatic heat dissipation column, 312-triangular heat dissipation column, 4-drive board, 401-upper bridge arm drive board, 402-lower bridge arm drive board, 5-pressing strip, 6-screw, 7-label copper block. DETAILED DESCRIPTION

[0039] The present invention is further described in detail below with reference to the accompanying drawings, and specific implementation methods are given.

[0040] like Figure 1-2As shown, the present invention provides a vehicle-mounted drive module assembly, including a thin film capacitor, an IGBT single tube arranged in parallel, a water cooling plate, and a drive plate, wherein the thin film capacitor is a specially designed capacitor, the IGBT single tube replaces the traditional IGBT module, the specially designed thin film capacitor is welded to the IGBT single tube, and finally the thin film capacitor, the IGBT single tube, the drive plate, and the water cooling plate are formed into a drive module assembly to achieve good current consistency and good heat dissipation on the product IGBT single tube.

[0041] Specifically, the water-cooled plate includes a heat sink and a cooling base plate which are screwed together. A thermal pad is provided in the middle of the heat sink along its length direction. Insulating thermal conductive sheets are provided on both sides of the thermal pad on the upper surface of the heat sink. Thin-film capacitor mounting surfaces are provided at both ends of the heat sink. The thin-film capacitor is pressed against the IGBT single tube and arranged between the thin-film capacitor and the insulating thermal conductive pad through the thin-film capacitor mounting surface provided on the heat sink. The pins of the thin-film capacitor and the pins of the IGBT single tube are soldered into one after passing through the driver board.

[0042] like Figure 3-8 The specific structure of the film capacitor shown includes a shell and a three-phase output copper bar, a positive copper bar and a negative copper bar which are potted inside the shell by epoxy resin, and a battery cell welded between the positive copper bar and the negative copper bar. The bottom surface of the shell forms a potting surface, and a heat-conducting component for reducing the internal temperature of the film capacitor is also arranged in the shell. A positive electrode pin is arranged on the positive copper bar, a negative electrode pin is arranged on the negative copper bar, and three-phase pins are arranged on both sides of the three-phase output copper bar. The positive electrode pin and the negative electrode pin are arranged on both sides of the shell and are arranged crosswise with the corresponding three-phase pins.

[0043] Among them, the heat-conducting component includes a positive heat-conducting column arranged on the positive copper bar, a three-phase heat-conducting column arranged on the three-phase output copper bar, and a through hole for the positive heat-conducting column to pass through is also arranged on the three-phase output copper bar. The through hole and the three-phase heat-conducting column are arranged crosswise in sequence. A circle of grooves are arranged on the positive heat-conducting column and the three-phase heat-conducting column, and the grooves are potted inside the epoxy resin. The lower ends of the positive heat-conducting column and the three-phase heat-conducting column are protruding from the potting surface and contacted and connected with the thermal pad. Of course, the heat-conducting column can also be arranged on one, two or all three of the positive copper bar, the negative copper bar or the three-phase output copper bar according to actual design needs.

[0044] like Figure 9-14As shown, the installation relationship of the film capacitor, IGBT single tube and heat sink is as follows: first, the insulating heat conductive sheet is attached to the heat sink, and then the IGBT single tube is attached to the insulating heat conductive sheet, the IGBT single tube is pressed with a pressure strip, and the thermal pad in contact with the positive thermal conductive column and the three-phase thermal conductive column of the film capacitor is attached to the radiator. The film capacitor is locked on the heat sink, and the C pole of the upper bridge arm IGBT is aligned with the positive copper bar of the film capacitor, and the e pole of the upper bridge arm IGBT is aligned with the three-phase copper bar of the film capacitor. The C pole of the lower bridge arm IGBT is aligned with the three-phase copper bar of the film capacitor, and the e pole of the lower bridge arm IGBT is aligned with the negative copper bar of the film capacitor. The drive board includes an upper bridge arm drive board and a lower bridge arm drive board, and the upper bridge arm drive board and the lower bridge arm drive board are respectively installed on both sides of the film capacitor. Ensure that the pins of the film capacitor and the IGBT pins are inserted into the drive boards on both sides. A surface-mount copper block is welded between the IGBT C pole inserted on the upper bridge arm driver board and the positive copper bar pin of the film capacitor, a surface-mount copper block is welded between the e pole and the three-phase copper bar pin of the film capacitor, a surface-mount copper block is welded between the IGBT C pole inserted on the lower bridge arm driver board and the three-phase copper bar pin of the film capacitor, and a surface-mount copper block is welded between the e pole and the negative copper bar pin of the film capacitor. Solder the IGBT pin and the film capacitor pin into one to ensure the high current passing capacity. The thermal conductive column assembly at the bottom of the film capacitor conducts the heat of the positive copper bar, three-phase copper bar, and IGBT single tube inside the film capacitor to the heat dissipation plate through the thermal pad on the heat dissipation plate.

[0045] During installation, install the insulating heat-conducting sheet on the heat sink, press the IGBT tube on the heat sink with the pressure strip, and lock the other end of the pressure strip on the heat sink with screws. Attach a thermal pad to the heat sink, and then install the film capacitor on the heat sink. The thermal column directly contacts the thermal pad. Finally, insert the upper and lower bridge arm drive boards from both sides respectively, fix them on the film capacitor housing with screws, and solder the film capacitor pins, IGBT pins, and the drive board label copper block together with soldering.

[0046] like Figure 15-22 As shown, a concave cooling water channel is arranged on the cooling bottom plate, and a heat dissipation column assembly extending into the cooling water channel is densely arranged on the lower bottom surface of the heat dissipation plate. The heat dissipation column assembly includes a prism-shaped heat dissipation column and a triangular heat dissipation column. The triangular heat dissipation column extends into the edge of the cooling water channel, and the diamond-shaped heat dissipation column is located inside the area surrounded by the triangular heat dissipation column. The upper edge of the cooling water channel is provided with a sealing ring mounting surface that is sealed and connected to the lower bottom surface of the heat dissipation plate. A water inlet and a water outlet are arranged at one end of the cooling bottom plate, and a water channel partition extends from the junction of the water inlet and the water outlet into the cooling water channel. The water channel partition divides the cooling water channel into a water inlet area and a water outlet area, and the water inlet area and the water outlet area are connected at one end away from the water inlet and the water outlet.

[0047] The water-cooled plate has densely arranged diamond-shaped heat dissipating columns with internal protrusions and triangular heat dissipating columns protruding on both sides of the water channel, so that the cooling water hits the edges of the prismatic heat dissipating columns when flowing, and the water flow is dispersed to both sides of the edge, and then hits the edge on the next side again, thereby increasing the contact surface of each heat dissipating column and forming good heat dissipation for each heat dissipating column. The water flow finally hits the triangular heat dissipating columns on the side of the cooling water channel, forming turbulence on the triangular heat dissipating columns, thereby increasing the heat dissipation capacity of the heat dissipating columns on the side. The above-mentioned arrangement allows sufficient heat exchange between the heat dissipating columns and the cooling water, thereby reducing the water resistance of the water channel.

[0048] The present invention integrates a three-phase output copper bar, a positive copper bar, a negative copper bar and a film capacitor into one body, wherein the positive copper bar and the three-phase copper bar are on one side of the film capacitor, and the negative copper bar and the three-phase copper bar are on the other side of the film capacitor. The positive copper bar inside the film capacitor is welded with a heat-conducting column that exceeds the film capacitor filling surface. The three-phase copper bars inside the film capacitor are respectively welded with heat-conducting columns that protrude from the film capacitor filling surface. The bottom heat dissipation surface in the IGBT single tube is connected to the collector (C), the upper bridge arm collector (C) of the IGBT single tube is connected to the positive copper bar of the film capacitor, and part of the heat is conducted to the radiator through the positive copper bar heat-conducting column in the input circuit, and the lower bridge arm collector (C) of the single tube IGBT is connected to the three-phase copper bar of the film capacitor, and part of the heat is conducted to the radiator through the three-phase copper bar heat-conducting column in the output circuit.

Claims

1. The vehicle drive module assembly is characterized by The invention comprises a film capacitor (1), an IGBT single tube (2) arranged in parallel, a water cooling plate (3), and a driving plate (4); the water cooling plate (3) comprises a heat sink (301) and a cooling base plate (302) arranged in a screw connection; a heat conducting pad (303) is arranged at the middle position of the heat sink (301) along its length direction; insulating heat conducting sheets (304) are arranged on both sides of the heat conducting pad (303) on the upper surface of the heat sink (301); film capacitor mounting surfaces (305) are arranged at both ends of the heat sink (301); and the film capacitor (1) is connected to the film capacitor mounting surface arranged on the heat sink (301). (305) The IGBT single tube (2) is pressed and arranged between the film capacitor (1) and the insulating thermally conductive gasket (304), and the pins of the film capacitor (1) and the IGBT single tube (2) are passed through the driving board (4) and then soldered into one body; the film capacitor (1) comprises a shell (101) and a three-phase output copper bar (102), a positive copper bar (103) and a negative copper bar (104) which are encapsulated in the shell (101) by epoxy resin, and a battery cell (105) which is welded between the positive copper bar (103) and the negative copper bar (104); the bottom surface of the shell (101) A filling cover (106) is formed, and a heat-conducting component for reducing the internal temperature of the film capacitor (1) is also arranged in the shell (101); a positive electrode pin (107) is arranged on the positive copper busbar (103), a negative electrode pin (108) is arranged on the negative copper busbar (104), and three-phase pins (109) are arranged on both sides of the three-phase output copper busbar (102); the positive electrode pin (107) and the negative electrode pin (108) are arranged on both sides of the shell (101) and are arranged crosswise with the corresponding three-phase pins (109); the heat-conducting component includes a positive electrode pin (107) and a negative electrode pin (108) arranged on the positive copper busbar (103); A positive heat-conducting column (110) and a three-phase heat-conducting column (111) arranged on the three-phase output copper bar (102); the three-phase output copper bar (102) is also provided with a through hole (112) for the positive heat-conducting column (110) to pass through; the through hole (112) and the three-phase heat-conducting column (111) are arranged crosswise in sequence; the positive heat-conducting column (110) and the three-phase heat-conducting column (111) are both provided with a circle of grooves (113); the grooves (113) are potted in epoxy resin; the lower ends of the positive heat-conducting column (110) and the three-phase heat-conducting column (111) are both protruding from the potting surface and are in contact with the thermal pad.

2. The vehicle-mounted drive module assembly as claimed in claim 1, characterized in that The IGBT single tube (2) is pressed and fixed on the insulating heat conductive sheet (304) by means of a pressure strip (5), and the other end of the pressure strip (5) is fixed on the heat dissipation plate (301) by means of a screw (6). After the IGBT single tube (2) is installed, the C pole (201) of the upper bridge arm IGBT single tube is aligned with the positive electrode pin (107) of the thin film capacitor, the e pole (202) of the upper bridge arm IGBT single tube is aligned with the three-phase pin (109) of the thin film capacitor, the C pole (203) of the lower bridge arm IGBT single tube is aligned with the three-phase pin (109) of the thin film capacitor, and the e pole (204) of the lower bridge arm IGBT is aligned with the negative electrode pin (108) of the thin film capacitor. The driving board (4) comprises an upper bridge arm driving board (401) and a lower bridge arm driving board (402). The upper bridge arm driving board (401) and the lower bridge arm driving board (402) are respectively installed on both sides of the thin film capacitor (1), ensuring that the pins of the thin film capacitor (1) and the pins of the IGBT single tube (2) are inserted into the driving boards (4) on both sides, and the IGBT inserted into the upper bridge arm driving board (401) Surface mounted copper blocks (7) are welded between the C pole and the positive pin (107) of the thin film capacitor, between the e pole and the three-phase pin (109) of the thin film capacitor, between the C pole of the IGBT inserted on the lower bridge arm drive board (402) and the three-phase pin (109) of the thin film capacitor, and between the e pole and the negative pin (108) of the thin film capacitor.

3. The vehicle-mounted drive module assembly according to claim 1, characterized in that The cooling bottom plate (302) is provided with an inwardly concave cooling water channel (306), the lower bottom surface of the heat sink (301) is densely provided with heat sink column assemblies extending into the cooling water channel (306), and the upper edge of the cooling water channel (306) is provided with a sealing ring mounting surface (307) sealedly connected to the lower bottom surface of the heat sink (301).

4. The vehicle-mounted drive module assembly as claimed in claim 3, characterized in that A water inlet (308) and a water outlet (309) are provided at one end of the cooling base plate (302), and a water channel partition (310) extends from the junction of the water inlet (308) and the water outlet (309) into the cooling water channel (306), and the water channel partition (310) divides the cooling water channel (306) into a water inlet area and a water outlet area, and the water inlet area and the water outlet area are connected at one end away from the water inlet (308) and the water outlet (309).

5. The vehicle-mounted drive module assembly as described in claim 3 is characterized in that the heat dissipation column assembly includes a prismatic heat dissipation column (311) and a triangular heat dissipation column (312), the triangular heat dissipation column (312) extends into the edge of the cooling water channel (306), and the diamond heat dissipation column (311) is located inside the area enclosed by the triangular heat dissipation column (312).

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