Automatic shelling machine

Abstract

The present invention relates to an automatic shell loading machine, comprising a semiconductor device conveying unit, a center column loading unit, a shell loading unit and a shell unloading unit. The semiconductor device conveying unit first delivers the semiconductor device placed on the positioning plate to the center column loading unit to load the center column, then delivers it to the shell loading unit to load the shell, and finally returns to the initial position. The shell loading unit sets the shell grabbed from the shell unloading unit on the semiconductor device on the positioning plate. The present invention adopts machinery to replace manual labor, reduces labor intensity, improves product quality, and improves production efficiency.

Description

Technical Field

[0001] The invention relates to the field of mechanical automation, in particular to an automatic shelling machine. Background Art

[0002] Some semiconductor devices consist of three parts: a welding base plate, a center column and a shell. At the current stage, the semiconductor device is manually placed on the welding base plate for assembly. The center column is first installed on the semiconductor for initial positioning, and then the center column is manually pressed into the welding base plate. Finally, the shell is manually installed on the semiconductor device and then welded to the base plate. This is inefficient and has poor consistency. Summary of the invention

[0003] The purpose of the present invention is to solve the above problems existing in the prior art and provide an automatic shelling machine. The present invention adopts machinery to replace manual labor, reduces labor intensity, improves product quality and improves production efficiency.

[0004] To achieve the above purpose, the technical solution adopted by the present invention is as follows:

[0005] An automatic shell loading machine is characterized in that it includes a semiconductor device conveying unit, a center column loading unit, a shell loading unit and a shell unloading unit. The semiconductor device conveying unit first conveys the semiconductor device placed on a positioning plate to the center column loading unit to load the center column, then conveys it to the shell loading unit to load the shell, and finally returns to the initial position. The shell loading unit puts the shell grabbed from the shell unloading unit on the semiconductor device on the positioning plate.

[0006] The shell loading unit includes a shell loading mechanism, a vertical moving mechanism and a horizontal moving mechanism. The horizontal moving mechanism is fixedly arranged above the semiconductor device conveying unit. The horizontal moving mechanism is fixedly connected to the vertical moving mechanism. The horizontal moving mechanism drives the vertical moving mechanism to move horizontally. The vertical moving mechanism is fixedly connected to the shell loading mechanism. The vertical moving mechanism drives the shell loading mechanism to take out and load the shell.

[0007] The shell loading mechanism comprises a connecting component, a shell loading component and a guide column. One end of the connecting component is fixedly connected to the vertical moving mechanism, and the other end of the connecting component is fixedly connected to the shell loading component and the guide column. The shell loading component cooperates with the guide column to shell the semiconductor device.

[0008] The shelling component includes a shelling cylinder, a pressure block, a guide rod, a connecting block, a shelling component and a guide block. The shelling cylinder is fixedly connected to the connecting component, the upper end of the guide block is fixedly connected to the piston rod of the shelling cylinder through the connecting block, the lower end of the guide block is fixedly connected to the guide rod, the guide rod is fixedly connected to the upper end of the pressure block, and the lower end of the pressure block is fixedly connected to the shelling component.

[0009] The connecting component includes a connecting plate, an upper cross plate and a lower cross plate. The upper part of the connecting plate is fixedly connected to a vertically arranged screw slide, the middle part is fixedly connected to the upper cross plate, and the lower part is fixedly connected to the lower cross plate. The upper surface of the upper cross plate is fixedly connected to the shell cylinder, the piston rod of the shell cylinder passes through the upper cross plate and is fixedly connected to the upper end of the connecting block, the lower end of the connecting block is fixedly connected to the guide block, the guide rod passes through the lower cross plate and slides up and down on the upper cross plate, the upper end of the guide rod is fixedly connected to the guide block, the lower end of the guide block is fixedly connected to the upper end of the pressure block, and the lower end of the pressure block is fixedly connected to the shell component.

[0010] A limiting block is arranged on the upper surface of the lower transverse plate, and the limiting block is located below the guide block and is used for limiting the position of the guide block.

[0011] The vertical moving mechanism is a vertically arranged screw slide, and the slider of the vertically arranged screw slide is fixedly connected to the connecting component. The horizontal moving mechanism is a horizontally arranged screw slide, and the slider of the horizontally arranged screw slide is fixedly connected to the vertically arranged screw slide.

[0012] At least one group of the housing components is provided, and at least two guide pillars are provided.

[0013] The center column unit comprises a support frame and a positioning cylinder. The support frame is fixedly arranged in the middle of the semiconductor device conveying unit, and the positioning cylinder is fixed on the support frame.

[0014] The shell unloading unit comprises a unloading platform and an inclined unloading track, the feed end of the unloading track is connected to the discharge port of the unloading platform, and the discharge end of the unloading track transports the shell to the shell loading component.

[0015] The semiconductor device conveying unit includes a screw slide and a positioning plate. The positioning plate is arranged on the slide of the screw slide. The initial position of the slide is arranged on the right end of the screw slide. The slide slides on the screw slide to first convey the semiconductor device placed on the positioning plate to the positioning cylinder for positioning, then convey it to the shell grasping assembly for shell loading, and finally return to the initial position.

[0016] The positioning plate comprises a guide sleeve and a positioning pin for positioning the semiconductor device. The positioning pin is fixed on the positioning plate, and the guide sleeve is fixed in the positioning plate and is used for cooperating with the guide column for positioning.

[0017] The advantages of adopting the present invention are:

[0018] 1. The present invention adopts machinery to replace manual labor, reduces labor intensity, improves product quality, and improves production efficiency.

[0019] Second, the vertical moving mechanism is provided in the present invention to achieve the purpose of enabling the shell loading mechanism to grab the shell and load the shell onto the semiconductor device.

[0020] 3. The lateral moving mechanism provided in the present invention achieves the purpose of enabling the shell loading mechanism to move back and forth between the shell grabbing station and the shell loading station.

[0021] Fourth, the shell loading mechanism provided in the present invention can quickly grab and load shells; it cooperates with the vertical moving mechanism and the horizontal moving mechanism to achieve the effect of automatic shell loading, thereby increasing the shell loading efficiency.

[0022] 5. The limit block provided in the present invention can limit the downward limit position of the guide block, thereby avoiding damage to the shell and reducing the qualified rate of the shell.

[0023] 6. The central column installation unit provided in the present invention realizes automatic and rapid fixing of the central column on the semiconductor device, thereby increasing production efficiency.

[0024] 7. The positioning pins provided in the present invention can effectively fix the semiconductor device, making it easier to package the semiconductor device; the guide sleeve and the guide column cooperate to ensure the positioning accuracy during packaging. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a structural schematic diagram of the present invention;

[0026] Figure 2 It is a front view of the present invention;

[0027] Figure 3 A top view of the present invention;

[0028] Figure 4 It is a left side view of the present invention;

[0029] Figure 5 It is a schematic diagram of the mechanism of embodiment 4 of the present invention;

[0030] Figure 6 For the present invention Figure 5 The main view;

[0031] Figure 7 For the present invention Figure 5 Left view of;

[0032] Figure 8 For the present invention Figure 5 A top view of

[0033] The numbers in the figure are: 1. connecting parts, 2. shell loading cylinder, 3. connecting block, 4. guide block, 5. guide rod, 6. pressure block, 7. shell loading parts, 8. limit block, 9. semiconductor device, 10. center column, 11. positioning plate, 12. shell, 13. shell loading mechanism, 14. positioning pin, 15. guide sleeve, 16. guide column, 17. rib plate, 18. center column loading unit, 19. support frame, 20. positioning cylinder, 21. screw slide, 22. slide, 23. vertically arranged screw slide, 24. horizontally arranged screw slide, 25. shell loading unit, 26. shell unloading unit, 27. unloading track, 28. unloading platform, 29. shell loading mechanism. DETAILED DESCRIPTION

[0034] Example 1

[0035] An automatic shell loading machine includes a semiconductor device conveying unit, a center column loading unit 18, a shell loading unit 25 and a shell unloading unit 26. The semiconductor device conveying unit first conveys the semiconductor device 9 placed on a positioning plate 11 to the center column loading unit 18 to load the center column 10, then conveys it to the center column loading unit 18 to load the center column 10 and the shell loading unit 25 to load the shell, and finally returns to the initial position. The shell loading unit 25 puts the shell grabbed from the shell unloading unit 26 onto the semiconductor device 9 on the positioning plate 11.

[0036] The shell loading unit 25 includes a shell loading mechanism 13, a vertical moving mechanism and a horizontal moving mechanism. The horizontal moving mechanism is fixedly arranged above the semiconductor device conveying unit. The horizontal moving mechanism is fixedly connected to the vertical moving mechanism. The horizontal moving mechanism drives the vertical moving mechanism to move horizontally. The vertical moving mechanism is fixedly connected to the shell loading mechanism 13. The vertical moving mechanism drives the shell loading mechanism 13 to take out and load shells.

[0037] The shell loading unit 25 includes a shell loading mechanism 13, a vertical moving mechanism and a horizontal moving mechanism. The shell loading mechanism is arranged above the semiconductor device conveying unit. The shell loading mechanism 13 is connected to the vertical moving mechanism. The vertical moving mechanism drives the shell loading mechanism 13 to move up and down. The vertical moving mechanism is connected to the horizontal moving mechanism. The horizontal moving mechanism drives the shell loading mechanism 13 to move back and forth between the shell removing station and the shell loading station.

[0038] The shell loading mechanism 13 includes a connecting component 1, a shell loading component and a guide column 16. One end of the connecting component 1 is fixedly connected to the vertical moving mechanism, and the other end of the connecting component 1 is fixedly connected to the shell loading component and the guide column 16. The shell loading component and the guide column 16 cooperate to shell the semiconductor device 9.

[0039] The shelling component includes a shelling cylinder 2, a pressure block 6, a guide rod 5, a connecting block 3, a shelling component 7 and a guide block 4. The shelling cylinder 2 is fixedly connected to the connecting component 1, the upper end of the guide block 4 is fixedly connected to the piston rod of the shelling cylinder 2 through the connecting block 3, the lower end of the guide block 4 is fixedly connected to the guide rod 5, the guide rod 5 is fixedly connected to the upper end of the pressure block 6, and the lower end of the pressure block 6 is fixedly connected to the shelling component 7.

[0040] The connecting component 1 includes a connecting plate, an upper cross plate and a lower cross plate. The upper part of the connecting plate is fixedly connected to a vertically arranged screw slide 23, the middle part is fixedly connected to the upper cross plate, and the lower part is fixedly connected to the lower cross plate. The upper surface of the upper cross plate is fixedly connected to the shell cylinder 2. The piston rod of the shell cylinder 2 passes through the upper cross plate and is fixedly connected to the upper end of the connecting block 3. The lower end of the connecting block 3 is fixedly connected to the guide block 4. The guide rod 5 passes through the lower cross plate and slides up and down on the upper cross plate. The upper end of the guide rod 5 is fixedly connected to the guide block 4. The lower end of the guide block 4 is fixedly connected to the upper end of the pressure block 6. The lower end of the pressure block 6 is fixedly connected to the shell component 7.

[0041] A limit block 8 is disposed on the upper surface of the lower transverse plate, and the limit block 8 is located below the guide block 4 to limit the position of the guide block 4 .

[0042] The vertical moving mechanism is a vertically arranged screw slide 23 , and the slider of the vertically arranged screw slide 23 is fixedly connected to the connecting component 1 .

[0043] The lateral movement mechanism is a screw slide 24 arranged transversely, and a slider of a slide 22 of the screw slide 24 arranged transversely is fixedly connected to a screw slide 21 arranged vertically.

[0044] At least one group of the housing components is provided, and at least two guide pillars 16 are provided.

[0045] The center column installation unit 18 includes a support frame 19 and a positioning cylinder 20 . The support frame 19 is fixedly disposed in the middle of the semiconductor device conveying unit, and the positioning cylinder 20 is fixed on the support frame 19 .

[0046] The shell unloading unit 26 includes a unloading platform 28 and an inclined unloading track 27 , the feed end of the unloading track 27 is connected to the discharge port of the unloading platform 28 , and the discharge end of the unloading track 27 transports the shell to the shell loading component.

[0047] The semiconductor device conveying unit includes a screw slide 21 and a positioning plate 11. The positioning plate 11 is arranged on a slide 22 of the screw slide 21. The initial position of the slide 22 is set at the right end of the screw slide 21. The slide 22 slides on the screw slide 21 to convey the semiconductor device 9 placed on the positioning plate 11 to the positioning cylinder 20 for positioning, and then conveys it to the shell grasping assembly for shell loading, and finally returns to the initial position.

[0048] The positioning plate 11 includes a guide sleeve 15 and a positioning pin 14 for positioning the semiconductor device 9 . The positioning pin 14 is fixed on the positioning plate 11 . The guide sleeve 15 is fixed in the positioning plate 11 and is used to cooperate with the guide column 16 for positioning.

[0049] The shell loading cylinder 2, the positioning cylinder 20, the screw slide 21, the vertically arranged screw slide 23, and the horizontally arranged screw slide 24 are all controlled by a PLC controller.

[0050] Example 2

[0051] An automatic shell loading machine includes a semiconductor device conveying unit, a center column loading unit 18, a shell loading unit 25 and a shell unloading unit 26. The semiconductor device conveying unit first conveys the semiconductor device 9 placed on a positioning plate 11 to the center column loading unit 18 to load the center column 10, then conveys it to the center column loading unit 18 to load the center column 10 and the shell loading unit 25 to load the shell, and finally returns to the initial position. The shell loading unit 25 puts the shell grabbed from the shell unloading unit 26 onto the semiconductor device 9 on the positioning plate 11.

[0052] The shell loading unit 25 includes a shell loading mechanism 13, a vertical moving mechanism and a horizontal moving mechanism. The horizontal moving mechanism is fixedly arranged above the semiconductor device conveying unit. The horizontal moving mechanism is fixedly connected to the vertical moving mechanism. The horizontal moving mechanism drives the vertical moving mechanism to move horizontally. The vertical moving mechanism is fixedly connected to the shell loading mechanism 13. The vertical moving mechanism drives the shell loading mechanism 13 to take out and load shells.

[0053] The shell loading mechanism 13 includes a connecting component 1, a shell loading component and a guide column 16. One end of the connecting component 1 is fixedly connected to the vertical moving mechanism, and the other end of the connecting component 1 is fixedly connected to the shell loading component and the guide column 16. The shell loading component and the guide column 16 cooperate to shell the semiconductor device 9.

[0054] The shelling component includes a shelling cylinder 2, a pressure block 6, a guide rod 5, a connecting block 3, a shelling component 7 and a guide block 4. The shelling cylinder 2 is fixedly connected to the connecting component 1, the upper end of the guide block 4 is fixedly connected to the piston rod of the shelling cylinder 2 through the connecting block 3, the lower end of the guide block 4 is fixedly connected to the guide rod 5, the guide rod 5 is fixedly connected to the upper end of the pressure block 6, and the lower end of the pressure block 6 is fixedly connected to the shelling component 7.

[0055] The connecting component 1 includes a connecting plate, an upper cross plate and a lower cross plate. The upper part of the connecting plate is fixedly connected to a vertically arranged screw slide 23, the middle part is fixedly connected to the upper cross plate, and the lower part is fixedly connected to the lower cross plate. The upper surface of the upper cross plate is fixedly connected to the shell cylinder 2. The piston rod of the shell cylinder 2 passes through the upper cross plate and is fixedly connected to the upper end of the connecting block 3. The lower end of the connecting block 3 is fixedly connected to the guide block 4. The guide rod 5 passes through the lower cross plate and slides up and down on the upper cross plate. The upper end of the guide rod 5 is fixedly connected to the guide block 4. The lower end of the guide block 4 is fixedly connected to the upper end of the pressure block 6. The lower end of the pressure block 6 is fixedly connected to the shell component 7.

[0056] A limit block 8 is disposed on the upper surface of the lower transverse plate, and the limit block 8 is located below the guide block 4 and is used to limit the position of the guide block 4 .

[0057] The vertical moving mechanism is a vertically arranged screw slide 23 , and the slider of the vertically arranged screw slide 23 is fixedly connected to the connecting component 1 .

[0058] The lateral movement mechanism is a screw slide 24 arranged transversely, and a slider of a slide 22 of the screw slide 24 arranged transversely is fixedly connected to a screw slide 21 arranged vertically.

[0059] The housing component is provided in one group, and the guide pillars 16 are provided in two groups.

[0060] The center column installation unit 18 includes a support frame 19 and a positioning cylinder 20 . The support frame 19 is fixedly disposed in the middle of the semiconductor device conveying unit, and the positioning cylinder 20 is fixed on the support frame 19 .

[0061] The positioning cylinder 20 is provided to fix the center column 10 on the semiconductor device 9.

[0062] The shell unloading unit 26 includes a unloading platform 28 and an inclined unloading track 27 , the feed end of the unloading track 27 is connected to the discharge port of the unloading platform 28 , and the discharge end of the unloading track 27 transports the shell to the shell loading component.

[0063] The semiconductor device conveying unit includes a screw slide 21 and a positioning plate 11. The positioning plate 11 is arranged on a slide 22 of the screw slide 21. The initial position of the slide 22 is set at the right end of the screw slide 21. The slide 22 slides on the screw slide 21 to convey the semiconductor device 9 placed on the positioning plate 11 to the positioning cylinder 20 for positioning, and then conveys it to the shell grasping assembly for shell loading, and finally returns to the initial position.

[0064] The positioning plate 11 includes a guide sleeve 15 and a positioning pin 14 for positioning the semiconductor device 9. The positioning pin 14 is fixed on the positioning plate 11. Eight positioning pins 14 are provided, and two pins are grouped together to form a semiconductor device 9 positioning frame from four directions. The semiconductor device 9 is arranged in the positioning frame, and a center column 10 is placed in the middle of the semiconductor device 9. The guide sleeve 15 is fixed in the positioning plate 11. The slide 22 on the screw slide 21 moves to the bottom of the center column installation unit 18. The positioning cylinder 20 presses the center column 10 downward to fix it on the semiconductor device 9. After the above steps are completed, the slide 22 moves to the shell installation unit 25, and the guide column 16 falls into the guide sleeve 15 to position the positioning plate 11. The shell installation mechanism 13 shells the semiconductor device 9 at the same time.

[0065] Example 3

[0066] An automatic shell loading machine includes a semiconductor device conveying unit, a center column loading unit 18, a shell loading unit 25 and a shell unloading unit 26. The semiconductor device conveying unit first conveys the semiconductor device 9 placed on a positioning plate 11 to the center column loading unit 18 to load the center column 10, then conveys it to the center column loading unit 18 to load the center column 10 and the shell loading unit 25 to load the shell, and finally returns to the initial position. The shell loading unit 25 puts the shell grabbed from the shell unloading unit 26 onto the semiconductor device 9 on the positioning plate 11.

[0067] The shell loading unit 25 includes a shell loading mechanism 13, a vertical moving mechanism and a horizontal moving mechanism. The horizontal moving mechanism is fixedly arranged above the semiconductor device conveying unit. The horizontal moving mechanism is fixedly connected to the vertical moving mechanism. The horizontal moving mechanism drives the vertical moving mechanism to move horizontally. The vertical moving mechanism is fixedly connected to the shell loading mechanism 13. The vertical moving mechanism drives the shell loading mechanism 13 to take out and load shells.

[0068] The shell loading mechanism 13 includes a connecting component 1, a shell loading component and a guide column 16. One end of the connecting component 1 is fixedly connected to the vertical moving mechanism, and the other end of the connecting component 1 is fixedly connected to the shell loading component and the guide column 16. The shell loading component and the guide column 16 cooperate to shell the semiconductor device 9.

[0069] The shelling component includes a shelling cylinder 2, a pressure block 6, a guide rod 5, a connecting block 3, a shelling component 7 and a guide block 4. The shelling cylinder 2 is fixedly connected to the connecting component 1, the upper end of the guide block 4 is fixedly connected to the piston rod of the shelling cylinder 2 through the connecting block 3, the lower end of the guide block 4 is fixedly connected to the guide rod 5, the guide rod 5 is fixedly connected to the upper end of the pressure block 6, and the lower end of the pressure block 6 is fixedly connected to the shelling component 7.

[0070] The connecting component 1 includes a connecting plate, an upper cross plate and a lower cross plate. The upper part of the connecting plate is fixedly connected to a vertically arranged screw slide 23, the middle part is fixedly connected to the upper cross plate, and the lower part is fixedly connected to the lower cross plate. The upper surface of the upper cross plate is fixedly connected to the shell cylinder 2. The piston rod of the shell cylinder 2 passes through the upper cross plate and is fixedly connected to the upper end of the connecting block 3. The lower end of the connecting block 3 is fixedly connected to the guide block 4. The guide rod 5 passes through the lower cross plate and slides up and down on the upper cross plate. The upper end of the guide rod 5 is fixedly connected to the guide block 4. The lower end of the guide block 4 is fixedly connected to the upper end of the pressure block 6. The lower end of the pressure block 6 is fixedly connected to the shell component 7.

[0071] A limit block 8 is disposed on the upper surface of the lower transverse plate, and the limit block 8 is located below the guide block 4 and is used to limit the position of the guide block 4 .

[0072] The vertical moving mechanism is a vertically arranged screw slide 23 , and the slider of the vertically arranged screw slide 23 is fixedly connected to the connecting component 1 .

[0073] The lateral movement mechanism is a screw slide 24 arranged transversely, and a slider of a slide 22 of the screw slide 24 arranged transversely is fixedly connected to a screw slide 21 arranged vertically.

[0074] The number of the housing components is two or more, and the number of the guide pillars 16 is two or more.

[0075] The center column installation unit 18 includes a support frame 19 and a positioning cylinder 20 . The support frame 19 is fixedly disposed in the middle of the semiconductor device conveying unit, and the positioning cylinder 20 is fixed on the support frame 19 .

[0076] The shell unloading unit 26 includes a unloading platform 28 and an inclined unloading track 27 , the feed end of the unloading track 27 is connected to the discharge port of the unloading platform 28 , and the discharge end of the unloading track 27 transports the shell to the shell loading component.

[0077] The semiconductor device conveying unit includes a screw slide 21 and a positioning plate 11. The positioning plate 11 is arranged on a slide 22 of the screw slide 21. The initial position of the slide 22 is set at the right end of the screw slide 21. The slide 22 slides on the screw slide 21 to convey the semiconductor device 9 placed on the positioning plate 11 to the positioning cylinder 20 for positioning, and then conveys it to the shell grasping assembly for shell loading, and finally returns to the initial position.

[0078] The positioning plate 11 includes a guide sleeve 15 and a positioning pin 14 for positioning the semiconductor device 9. The positioning pin 14 is fixed on the positioning plate 11. The guide sleeve 15 is fixed in the positioning plate 11 and is used to cooperate with the guide column 16 for positioning. Eight positioning pins 14 form a unit, and two are grouped to form a semiconductor device 9 positioning frame from four directions. The number and position of the positioning frames correspond to the shell components, and the number and position of the guide sleeves 15 are consistent with the number of displacement steps of the semiconductor device 9.

[0079] Example 4

[0080] The controller used in this device is Mitsubishi FX3U-64MT AC220V.

[0081] An automatic shell loading machine includes a semiconductor device conveying unit, a center column loading unit 18, a shell loading unit 25 and a shell unloading unit 26. The semiconductor device conveying unit first conveys the semiconductor device 9 placed on a positioning plate 11 to the center column loading unit 18 to load the center column 10, then conveys it to the shell loading unit 25 to load the shell, and finally returns to the initial position. The shell loading unit 25 puts the shell grabbed from the shell unloading unit 26 on the semiconductor device 9 on the positioning plate 11.

[0082] The shell loading unit 25 includes a shell loading mechanism 13, a vertical moving mechanism and a horizontal moving mechanism. The horizontal moving mechanism is fixedly arranged above the semiconductor device conveying unit. The horizontal moving mechanism is fixedly connected to the vertical moving mechanism. The horizontal moving mechanism drives the vertical moving mechanism to move horizontally. The vertical moving mechanism is fixedly connected to the shell loading mechanism 13. The vertical moving mechanism drives the shell loading mechanism 13 to take out and load shells.

[0083] The shell loading mechanism 13 includes a connecting component 1, a shell loading component and a guide column 16. One end of the connecting component 1 is fixedly connected to the vertical moving mechanism, and the other end of the connecting component 1 is fixedly connected to the shell loading component and the guide column 16. The shell loading component and the guide column 16 cooperate to shell the semiconductor device 9.

[0084] The shelling component includes a shelling cylinder 2, a pressure block 6, a guide rod 5, a connecting block 3, a shelling member 7 and a guide block 4. The shelling cylinder 2 is fixedly connected to the connecting member 1. The upper end of the guide block 4 is fixedly connected to the piston rod of the shelling cylinder 2 through the connecting block 3. The lower end of the guide block 4 is fixedly connected to the guide rod 5. The guide rod 5 is fixedly connected to the upper end of the pressure block 6. The lower end of the pressure block 6 is fixedly connected to the shelling member 7. The shell is made of plastic, and the shape of the finished shell has a certain shrinkage. The shelling member 7 adopts the shrinkage of the shell, and the shell is grabbed by the shelling member 7 by shrinking the size of the inner frame of the shell to fit the shelling member 7.

[0085] The connecting component 1 includes a connecting plate, an upper cross plate and a lower cross plate. The upper part of the connecting plate is fixedly connected to a vertically arranged screw slide 23, the middle part is fixedly connected to the upper cross plate, and the lower part is fixedly connected to the lower cross plate. The upper surface of the upper cross plate is fixedly connected to the shell cylinder 2, and the piston rod of the shell cylinder 2 passes through the upper cross plate and is fixedly connected to the upper end of the connecting block 3. The lower end of the connecting block 3 is fixedly connected to the guide block 4. The guide rod 5 passes through the lower cross plate and slides up and down on the upper cross plate. The upper end of the guide rod 5 is fixedly connected to the guide block 4, and the lower end of the guide block 4 is fixedly connected to the upper end of the pressure block 6. The lower end of the pressure block 6 is fixedly connected to the shell component 7; a rib plate 17 is fixedly connected between the upper cross plate and the lower cross plate.

[0086] A limit block 8 is disposed on the upper surface of the lower transverse plate, and the limit block 8 is located below the guide block 4 and is used to limit the position of the guide block 4 .

[0087] The vertical moving mechanism is a vertically arranged screw slide 23, the slider of which is fixedly connected to the connecting component 1, and the horizontal moving mechanism is a horizontally arranged screw slide 24, the slider of which is fixedly connected to the vertically arranged screw slide 21, and the vertically arranged screw slide 22 and the horizontally arranged screw slide 24 are both driven by a servo motor. The models of the screw slide 21 are HK60-L05-S150-FO-A1, HK60-L05-S300-FO-A1, HK60-L05-S850-FO-A1, etc.

[0088] The housing components are provided in three groups, the guide pillars 16 are provided in two groups, the housing components and the guide pillars 16 are provided at intervals and are located in a straight line. Three semiconductor devices 9 can be housinged each time, and each semiconductor device 9 is assembled separately without interfering with each other.

[0089] The center column installation unit 18 includes a support frame 19 and a positioning cylinder 20 . The support frame 19 is fixedly disposed in the middle of the semiconductor device conveying unit, and the positioning cylinder 20 is fixed on the support frame 19 .

[0090] The number of the positioning cylinders 20 is three.

[0091] The shell unloading unit 26 includes a discharge platform 28 and an inclined unloading track 27, the feed end of the unloading track 27 is connected to the discharge port of the discharge platform 28, and the discharge end of the unloading track 27 transports the shell to the shell loading component; the shell is placed on the discharge platform 28, and the unloading track 27 is provided with 3 parallel tracks, the shell is placed on the unloading track 27, the shell slides downward, the slide 22 of the vertically arranged screw slide 23 drives the shell loading component downward, the shell loading cylinder 2 drives the shell loading component 7 to cover the shell and reset, the slide 22 of the horizontally arranged screw slide 24 drives the vertically arranged screw slide 23 to slide, and at the same time the vertically arranged screw slide 23 drives the shell loading mechanism 13 to slide, the slide 22 of the vertically arranged screw slide 23 drives the shell loading mechanism 13 downward, the guide column 16 falls into the guide sleeve 15 for positioning, and the shell loading cylinder 2 drives the shell loading component 7 downward to complete the shell loading of the semiconductor device 9.

[0092] The semiconductor device conveying unit includes a screw slide 21 and a positioning plate 11. The positioning plate 11 is arranged on a slide 22 of the screw slide 21. The initial position of the slide 22 is arranged at the right end of the screw slide 21. The slide 22 slides on the screw slide 21 to first convey the semiconductor device 9 placed on the positioning plate 11 to the positioning cylinder 20 for positioning, then convey it to the shell grasping assembly for shell loading, and finally return to the initial position. The models of the screw slide 21 are HK60-L05-S150-FO-A1, HK60-L05-S300-FO-A1, HK60-L05-S850-FO-A1, etc.

[0093] The positioning plate 11 includes a guide sleeve 15 and a positioning pin 14 for positioning the semiconductor device 9. The positioning pin 14 is fixed on the positioning plate 11. The guide sleeve 15 is fixed in the positioning plate 11 and is used to cooperate with the guide column 16 for positioning. Eight positioning pins 14 form a unit, and two are grouped to form a semiconductor device 9 positioning frame from four directions. The number and position of the positioning frames correspond to the shell components, and the number and position of the guide sleeves 15 correspond to the number of guide columns 16.

[0094] Five rows of positioning frames are arranged on the positioning plate 11 , three positioning frames are arranged in each row, guide sleeves 15 are arranged between each row of positioning frames, and the positions between each row of positioning frames and the guide sleeves 15 correspond to the housing components and the guide pillars 16 .

[0095] The specific operation process is as follows:

[0096] (1) First, place the positioning plate 11 on the slide 22 of the screw slide 21, place the semiconductor device 9 in the positioning frame of the positioning plate 11, arrange 15 the semiconductor devices 9 neatly, and place the center column 10 in the middle of the semiconductor device 9;

[0097] (2) The slide 22 of the screw slide 21 is driven by a servo motor to slide, thereby driving the positioning plate 11 to move to the position of the center column unit 18, so that the center column 10 on the first row of semiconductor devices 9 corresponds to the piston rod of the positioning cylinder 20;

[0098] (3) The piston rod of the cylinder of the center column unit 18 moves downward to fix the center column 10 of the first row of semiconductor devices 9 on the semiconductor devices 9, and the positioning plate 11 moves so that the center column 10 on the second row of semiconductor devices 9 corresponds to the piston rod of the positioning cylinder 20. The positioning cylinder 20 repeats the above action 5 times;

[0099] (4) The positioning plate 11 moves to the shell loading unit 25;

[0100] (5) The shell loading mechanism 13 drives the shell loading member 7 to grab the shell and grab the shell to the first row position of the positioning plate 11;

[0101] (6) The shell loading mechanism 13 moves downward as a whole, and the guide column 16 and the guide sleeve 15 cooperate with each other to ensure the positioning accuracy. After the positioning is completed, the shell loading cylinder 2 drives the connecting block 3, the guide rod 5, the pressure block 6 and the shell loading member 7 to move downward to assemble the shell onto the semiconductor device 9.

[0102] (7) After the first row of semiconductor devices 9 are shelled, the shell loading mechanism 13 is reset, and the positioning plate 11 moves to the second row shell loading position. The shell loading mechanism 13 repeats the above steps (5) and (6) to grab the shell and shell the semiconductor devices 9; the shell grabbing and shell loading of the semiconductor devices 9 are repeated 5 times. After completion, the positioning plate 11 is reset by the servo motor, and the action is completed;

[0103] (8) Replace the positioning plate 11 and repeat the above steps (1), (2), (3), (4), (5), (6), and (7).

Claims

1. An automatic shelling machine, characterized in that: It comprises a semiconductor device conveying unit, a center column installation unit (18), a shell installation unit (25) and a shell unloading unit (26), wherein the semiconductor device conveying unit first transports the semiconductor device (9) placed on the positioning plate (11) to the center column installation unit (18) to install the center column (10), then transports it to the shell installation unit (25) to install the shell, and finally returns to the initial position, wherein the shell installation unit (25) sleeves the shell grabbed from the shell unloading unit (26) onto the semiconductor device (9) on the positioning plate (11); The shell loading unit (25) comprises a shell loading mechanism (13), a vertical moving mechanism and a horizontal moving mechanism, wherein the horizontal moving mechanism is fixedly arranged above the semiconductor device conveying unit, the horizontal moving mechanism is fixedly connected to the vertical moving mechanism, the horizontal moving mechanism drives the vertical moving mechanism to move horizontally, the vertical moving mechanism is fixedly connected to the shell loading mechanism (13), and the vertical moving mechanism drives the shell loading mechanism (13) to remove shells and load shells; The shell loading mechanism (13) comprises a connecting component (1), a shell loading component and a guide column (16); one end of the connecting component (1) is fixedly connected to the vertical moving mechanism; the other end of the connecting component (1) is fixedly connected to the shell loading component and the guide column (16); the shell loading component and the guide column (16) cooperate to shell the semiconductor device (9); The positioning plate (11) comprises a guide sleeve (15) and a positioning pin (14) for positioning the semiconductor device (9). The positioning pin (14) is fixed on the positioning plate (11), and the guide sleeve (15) is fixed in the positioning plate (11) and is used to cooperate with the guide column (16) for positioning. Eight positioning pins (14) are provided, and two of them are arranged in a group to form a semiconductor device (9) positioning frame from four directions, and the semiconductor device (9) is arranged in the positioning frame. The slide table (22) on the screw slide table (21) moves to the bottom of the center column unit (18), and the positioning cylinder (20) presses the center column (10) downward to fix it on the semiconductor device (9). After the above steps are completed, the slide table (22) moves to the shell unit (25), and the guide column (16) falls into the guide sleeve (15) to position the positioning plate (11). The shell mechanism (13) shells the semiconductor device (9) at the same time.

2. An automatic shelling machine as claimed in claim 1, characterized in that: At least one group of the housing components is provided, and at least one guide column (16) is provided.

3. An automatic shelling machine as claimed in claim 1, characterized in that: The shell-loading component comprises a shell-loading cylinder (2), a pressure block (6), a guide rod (5), a connecting block (3), a shell-loading component (7) and a guide block (4); the shell-loading cylinder (2) is fixedly connected to the connecting component (1); the upper end of the guide block (4) is fixedly connected to the piston rod of the shell-loading cylinder (2) through the connecting block (3); the lower end of the guide block (4) is fixedly connected to the guide rod (5); the guide rod (5) is fixedly connected to the upper end of the pressure block (6); and the lower end of the pressure block (6) is fixedly connected to the shell-loading component (7).

4. An automatic shelling machine as claimed in claim 3, characterized in that: The connecting component (1) comprises a connecting plate, an upper horizontal plate and a lower horizontal plate. The upper part of the connecting plate is fixedly connected to a vertically arranged screw slide (23), the middle part is fixedly connected to the upper horizontal plate, and the lower part is fixedly connected to the lower horizontal plate. The upper surface of the upper horizontal plate is fixedly connected to the shell cylinder (2). The piston rod of the shell cylinder (2) passes through the upper horizontal plate and is fixedly connected to the upper end of the connecting block (3). The lower end of the connecting block (3) is fixedly connected to the guide block (4). The guide rod (5) passes through the lower horizontal plate and slides up and down on the upper horizontal plate. The upper end of the guide rod (5) is fixedly connected to the guide block (4). The lower end of the guide block (4) is fixedly connected to the upper end of the pressure block (6). The lower end of the pressure block (6) is fixedly connected to the shell component (7).

5. An automatic shelling machine as claimed in claim 4, characterized in that: A limit block (8) is provided on the upper surface of the lower transverse plate, and the limit block (8) is located below the guide block (4) and is used to limit the position of the guide block (4).

6. An automatic shelling machine as claimed in claim 1, characterized in that: The center column unit (18) comprises a support frame (19) and a positioning cylinder (20); the support frame (19) is fixedly arranged in the middle of the semiconductor device conveying unit, and the positioning cylinder (20) is fixed on the support frame (19).

7. An automatic shelling machine as claimed in claim 1, characterized in that: The shell unloading unit (26) comprises a unloading platform (28) and an inclined unloading track (27), wherein a feed end of the unloading track (27) is connected to a discharge port of the unloading platform (28), and a discharge end of the unloading track (27) transports the shell to the shell loading component.

8. An automatic shelling machine as claimed in claim 1, characterized in that: The semiconductor device conveying unit comprises a screw slide (21) and a positioning plate (11); the positioning plate (11) is arranged on a slide (22) of the screw slide (21); the initial position of the slide (22) is arranged at the right end of the screw slide (21); the slide (22) slides on the screw slide (21) to first convey the semiconductor device (9) placed on the positioning plate (11) to the positioning cylinder (20) for positioning, then convey it to the shell grasping assembly for shell loading, and finally return to the initial position.

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