A multi-laser combined multi-axis turning and milling composite machine tool and its machining method

Abstract

The present invention provides a multi-laser combined multi-axis turning and milling compound machine tool and a processing method thereof, including a frame, wherein the frame is respectively provided with a first laser processing area, a second laser processing area, and an X-axis motion component, wherein the first laser processing area includes a first laser processing component and a first motion component; the second laser processing area includes a second laser processing component and a second motion component; and the X-axis motion component is located below the first laser processing component and the second laser processing component. The present invention combines nanosecond, picosecond, and femtosecond lasers to respectively perform rough, semi-finishing, and finishing of tools, realizes turning and milling compound processing through a multi-axis motion platform design, realizes one-time clamping and processing of complex-profile tools, effectively improves processing efficiency and processing quality, solves the problems that general laser processing cannot realize complex-profile tool processing, and low processing efficiency and poor quality caused by multiple clamping, and is of great significance to improving the manufacturing level of high-end tools in my country.

Description

Technical Field

[0001] The invention belongs to the technical field of laser processing equipment, and in particular relates to a multi-laser combined multi-axis turning and milling compound machine tool and a processing method thereof. Background Art

[0002] With the rapid development of 3C electronics, automobiles, molds, aerospace and other fields, typical difficult-to-process materials are widely used, and the requirements for processing quality and efficiency are constantly increasing. In order to meet the processing needs of materials in key fields, cutting tool materials are developing in the direction of superhardness, tool profiles tend to be complex, and higher requirements are placed on precision and quality. Due to the difficult processing characteristics of the tool material itself, it is particularly difficult to use traditional processing methods such as diamond wheel grinding to manufacture superhard tools and complex-shaped tools, which has high manufacturing costs, low processing efficiency, and extremely complex processing technology.

[0003] Laser processing has the characteristics of non-contact, high energy, flexible processing, small heat-affected zone, and no material selectivity. It has become an important means to replace traditional difficult-to-process material processing methods at home and abroad. The level of laser processing equipment is the key to restricting the development of advanced laser processing technology. Foreign high-end laser processing machine tool manufacturers such as GF, DMG MORI, CBFerrari and EWAG mainly use nanosecond or picosecond single lasers for laser milling, while domestic Muji machine tools mainly use single lasers for turning. In addition, patent 201710958233.6 discloses a combined multifunctional laser processing machine tool that combines traditional mechanical processing and laser processing methods in one machine tool. It is mainly used for drilling, cutting, and milling of materials, and cannot meet the processing of complex surface tool laser turning and milling. At present, international laser machine tools are mainly suitable for laser cutting, drilling and surface texture processing. There is no laser machine tool with an overall dedicated system design that meets the requirements of application tools such as rough and fine processing of complex surface tools and turning and milling.

[0004] In view of the laser processing requirements of complex surface tools and the current status of laser processing machine tools, it is urgent to design and develop a combined laser processing machine tool that takes into account the processing efficiency and quality of lasers with different characteristics such as nanosecond, picosecond and femtosecond, and performs turning and milling composite processing through motion axis design to achieve one-time clamping processing and forming. Summary of the invention

[0005] In view of this, the present invention provides a multi-laser combined multi-axis turning and milling compound machine tool and a processing method thereof. The present invention combines nanosecond, picosecond and femtosecond lasers to respectively perform rough, semi-finishing and finishing of tool, and realizes turning and milling compound processing through multi-axis motion platform design, and realizes one-time clamping and processing of complex surface tools, effectively improving processing efficiency and processing quality, and solving the problem that general laser processing cannot realize complex surface tool processing.

[0006] The technical solution of the present invention is:

[0007] A multi-laser combination multi-axis turning and milling compound machine tool includes a frame, characterized in that a first laser processing area, a second laser processing area, and an X-axis motion component are respectively provided on the frame, the first laser processing area includes a first laser processing component and a first motion component, and the first laser processing component is cooperatively connected with the first motion component; the second laser processing area includes a second laser processing component and a second motion component, and the second laser processing component is cooperatively connected with the second motion component; the X-axis motion component is located below the first laser processing component and the second laser processing component.

[0008] Furthermore, the maximum linear movement range of the X-axis motion component is 1500 mm, and the maximum positioning accuracy is 0.1 μm.

[0009] Furthermore, the X-axis motion assembly is provided with a central turntable and a tool handle, the tool handle is clamped in the middle area of ​​the central turntable, and a motor is provided in the central turntable. The tool handle is used to clamp the tool, and the motor can drive the central turntable to rotate.

[0010] Furthermore, the motor drives the central turntable to rotate at high speed along the A-axis and the C-axis; the A-axis is an axis parallel to the X-axis motion component, and the C-axis is an axis perpendicular to the X-axis motion component.

[0011] Furthermore, the rotation range of the center turntable along the A axis is -140°-140°, the rotation range of the center turntable along the C axis is 0°-360°, and the maximum rotation positioning accuracy is 0.001°.

[0012] Further, the first motion component includes a Y1-axis motion component and a Z1-axis motion component;

[0013] The first laser processing component performs linear movement in the Y-axis and Z-axis directions through the Y1-axis motion component and the Z1-axis motion component respectively. The maximum linear movement range of the first laser processing component in the Y1 and Z1 axes is 500 and 600 mm respectively, and the maximum positioning accuracy is 0.1 μm.

[0014] Furthermore, the first laser processing component includes a nanosecond laser, a nanosecond laser fixing frame, a first processing area galvanometer scanning module, and a first processing area laser head. The nanosecond laser is arranged on the nanosecond laser fixing frame, and the nanosecond laser fixing frame is connected to the Y1-axis motion component. The first processing area galvanometer scanning module and the first processing area laser head are respectively connected to the Z1-axis motion component.

[0015] Furthermore, the second motion component includes a Y2-axis motion component and a Z2-axis motion component; the second laser processing component performs linear movement in the Y-axis and Z-axis directions through the Y2-axis motion component and the Z2-axis motion component respectively, and the maximum linear movement range of the second laser processing component in the Y2 and Z2 axes is 500 and 600 mm respectively, and the maximum positioning accuracy is 0.1μm.

[0016] Furthermore, the second laser processing component includes a picosecond and femtosecond laser, a picosecond and femtosecond laser fixing frame, a second processing area galvanometer scanning module, a second processing area laser head, a CCD module, and an optical path transmission module. The picosecond and femtosecond laser is arranged on the picosecond and femtosecond laser fixing frame, and an optical path transmission module is provided on one side of the picosecond and femtosecond laser. The second processing area galvanometer scanning module and the second processing area laser head are respectively connected to the Z2-axis motion component, and the CCD module is arranged on one side of the picosecond and femtosecond laser fixing frame, and the picosecond and femtosecond laser fixing frame is connected to the Y2-axis motion component.

[0017] In particular, the picosecond and femtosecond lasers share a set of optical paths, and the laser light source is switched as required; in particular, the CCD module can perform online monitoring of tool processing accuracy.

[0018] Furthermore, the frame includes a mineral bed and a mineral column.

[0019] Furthermore, the laser machine tool is connected to a silent vacuum cleaner and a dust prevention device to remove waste chips and exhaust gas during processing.

[0020] A processing method for a multi-laser combined multi-axis turning and milling compound machine tool, specifically: the tool being processed can be linearly moved to a first processing area through an X-axis motion platform for nanosecond laser rough processing, and moved to a second processing area for picosecond laser semi-finishing or femtosecond laser finishing; laser turning can be achieved by deflecting the A axis 90° and fixing it parallel to the Y axis, and the C axis continuously rotating 360°; laser milling can be achieved through linkage control between A, C, X, Y1, Z1 or between A, C, X, Y2, Z2, and finally laser turning and milling compound processing is achieved.

[0021] The main innovative features of the present invention are:

[0022] 1. Laser machine tools combine nanosecond, picosecond and femtosecond lasers to perform rough, semi-finishing and finishing of tools respectively;

[0023] 2. Realize laser turning and milling composite processing through multi-axis motion platform design;

[0024] 3. Through the combination of the above two points, the complex surface tool can be clamped and laser processed in one step.

[0025] The beneficial effects of the present invention are:

[0026] The present invention provides a multi-laser combined multi-axis turning and milling compound machine tool, which combines nanosecond, picosecond and femtosecond lasers to respectively perform rough, semi-finishing and finishing of tool, realizes turning and milling compound processing through multi-axis motion platform design, realizes one-time clamping and processing of complex surface tools, effectively improves processing efficiency and processing quality, solves the problems that general laser processing cannot realize complex surface tool processing, and low processing efficiency and poor quality caused by multiple clamping, and is of great significance to improving the manufacturing level of high-end tools in my country. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a structural schematic diagram of the present invention;

[0028] In the accompanying drawings of the present invention, 1-frame, 2-Y1-axis motion assembly, 3-Z1-axis motion assembly, 4-nanosecond laser fixing frame, 5-nanosecond laser, 6-picosecond and femtosecond laser, 7-picosecond and femtosecond laser fixing frame, 8-optical path transmission module, 9-second processing area scanning galvanometer module, 10-CCD module, 11-X-axis motion assembly, 12-second processing area laser head, 13-Z2-axis motion assembly, 14-Y2-axis motion assembly, 15-first processing area scanning galvanometer module, 16-first processing area laser head, 17-center turntable, 18-tool handle, 100-first laser processing area, 200-second laser processing area, 101-first motion assembly, 102-first laser processing assembly, 201-second motion assembly, 202-second laser processing assembly. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the present invention more clear, the present invention is further described in detail below in conjunction with specific implementation methods. It should be understood that the specific implementation methods described here are only used to explain the present invention and do not limit the scope of protection of the present invention.

[0030] Example 1

[0031] A multi-laser combination multi-axis turning and milling compound machine tool includes a frame 1, characterized in that a first laser processing area 100, a second laser processing area 200, and an X-axis motion component 11 are respectively provided on the frame, the first laser processing area includes a first laser processing component 102 and a first motion component 101, and the first laser processing component is connected with the first motion component; the second laser processing area includes a second laser processing component 202 and a second motion component 201, and the second laser processing component is connected with the second motion component; the X-axis motion component is located below the first laser processing component and the second laser processing component.

[0032] Furthermore, the maximum linear movement range of the X-axis motion component is 1500 mm, and the maximum positioning accuracy is 0.1 μm.

[0033] Furthermore, the X-axis motion assembly is provided with a central turntable and a tool handle, the tool handle is clamped in the middle area of ​​the central turntable, and a motor is provided in the central turntable. The tool handle is used to clamp the tool, and the motor can drive the central turntable to rotate.

[0034] Furthermore, the motor drives the central turntable to rotate at high speed along the A-axis and the C-axis; the A-axis is an axis parallel to the X-axis motion component, and the C-axis is an axis perpendicular to the X-axis motion component.

[0035] Furthermore, the rotation range of the center turntable along the A axis is -140°-140°, the rotation range of the center turntable along the C axis is 0°-360°, and the maximum rotation positioning accuracy is 0.001°.

[0036] Further, the first motion component includes a Y1-axis motion component 2 and a Z1-axis motion component 3;

[0037] The first laser processing component performs linear movement in the Y-axis and Z-axis directions through the Y1-axis motion component and the Z1-axis motion component respectively. The maximum linear movement range of the first laser processing component in the Y1 and Z1 axes is 500 and 600 mm respectively, and the maximum positioning accuracy is 0.1 μm.

[0038] Furthermore, the first laser processing component includes a nanosecond laser 5, a nanosecond laser fixing frame 4, a first processing area galvanometer scanning module 15, and a first processing area laser head 16, the nanosecond laser is arranged on the nanosecond laser fixing frame, the nanosecond laser fixing frame is connected to the Y1-axis motion component, and the first processing area galvanometer scanning module and the first processing area laser are connected to the Z1-axis motion component.

[0039] Further, the second motion component includes a Y2-axis motion component 13 and a Z2-axis motion component 14;

[0040] The second laser processing component performs linear movement in the Y-axis and Z-axis directions through the Y2-axis motion component and the Z2-axis motion component respectively. The maximum linear movement range of the second laser processing component in the Y2 and Z2 axes is 500 and 600 mm respectively, and the maximum positioning accuracy is 0.1 μm.

[0041] Furthermore, the second laser processing component includes a picosecond and femtosecond laser 6, a picosecond and femtosecond laser fixing frame 7, a second processing area galvanometer scanning module 9, a second processing area laser head 12, a CCD module 10, and an optical path transmission module 8. The picosecond and femtosecond laser is arranged on the picosecond and femtosecond laser fixing frame, and an optical path transmission module is provided on one side of the picosecond and femtosecond laser. The second processing area galvanometer scanning module and the second processing area laser head 12 are connected to the Z2 axis motion component, and the CCD module is arranged on one side of the picosecond and femtosecond laser fixing frame, and the picosecond and femtosecond laser fixing frame is connected to the Y2 axis motion component.

[0042] In particular, the picosecond and femtosecond lasers share a set of optical paths, and the laser light source is switched as required; in particular, the CCD module can perform online monitoring of tool processing accuracy.

[0043] Furthermore, the frame includes a mineral bed (not marked) and a mineral column (not marked).

[0044] Furthermore, the laser machine tool is connected to a silent vacuum cleaner (not marked) and a dust prevention device (not marked) to remove waste chips and exhaust gas during processing.

[0045] A processing method for a multi-laser combined multi-axis turning and milling compound machine tool, specifically: the tool being processed can be linearly moved to a first processing area through an X-axis motion platform for nanosecond laser rough processing, and moved to a second processing area for picosecond laser semi-finishing or femtosecond laser finishing; laser turning can be achieved by deflecting the A axis 90° and fixing it parallel to the Y axis, and the C axis continuously rotating 360°; laser milling can be achieved through linkage control between A, C, X, Y1, Z1 or A, C, X, Y2, Z2, and finally laser turning and milling compound processing is achieved.

[0046] The present invention provides a multi-laser combined multi-axis turning and milling compound machine tool, which combines nanosecond, picosecond and femtosecond lasers to respectively perform rough, semi-finishing and finishing of tool, realizes turning and milling compound processing through multi-axis motion platform design, realizes one-time clamping and processing of complex surface tools, effectively improves processing efficiency and processing quality, solves the problems that general laser processing cannot realize complex surface tool processing, and low processing efficiency and poor quality caused by multiple clamping, and is of great significance to improving the manufacturing level of high-end tools in my country.

[0047] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be considered exemplary and non-restrictive in all respects, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention.

[0048] In addition, it should be understood that although this specification is described in accordance with the implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should take the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation modes that can be understood by those skilled in the art. It should be noted that the technical features not described in detail in the present invention can be realized by any prior art in the art.

Claims

1. A multi-laser combined multi-axis turning and milling compound machine tool, comprising a frame, characterized in that: The frame is respectively provided with a first laser processing area, a second laser processing area, and an X-axis motion assembly, wherein the first laser processing area includes a first laser processing assembly and a first motion assembly, and the first laser processing assembly is connected in cooperation with the first motion assembly; the second laser processing area includes a second laser processing assembly and a second motion assembly, and the second laser processing assembly is connected in cooperation with the second motion assembly; the X-axis motion assembly is located below the first laser processing assembly and the second laser processing assembly; The maximum linear movement range of the X-axis motion component is 1500mm, and the maximum positioning accuracy is 0.1μm; The X-axis motion assembly is provided with a central turntable and a tool handle, and the tool handle is clamped in the middle area of ​​the central turntable; a motor is provided in the central turntable; The motor drives the central turntable to rotate at high speed along the A-axis and the C-axis; the A-axis is an axis parallel to the X-axis motion component, and the C-axis is an axis perpendicular to the X-axis motion component; The rotation range of the center turntable along the A axis is -140°-140°, and the rotation range of the center turntable along the C axis is 0°-360°, and the maximum rotation positioning accuracy is 0.001°; The first motion component includes a Y1-axis motion component and a Z1-axis motion component; The first laser processing component performs linear movement in the Y-axis and Z-axis directions through the Y1-axis motion component and the Z1-axis motion component, respectively. The maximum linear movement range of the first laser processing component in the Y1 and Z1 axes is 500 and 600 mm respectively, and the maximum positioning accuracy is 0.1 μm; The first laser processing assembly includes a nanosecond laser, a nanosecond laser fixing frame, a first processing area galvanometer scanning module, and a first processing area laser head, wherein the nanosecond laser is arranged on the nanosecond laser fixing frame, the nanosecond laser fixing frame is connected to the Y1-axis motion assembly, and the first processing area galvanometer scanning module and the first processing area laser head are respectively connected to the Z1-axis motion assembly; The second motion assembly includes a Y2-axis motion assembly and a Z2-axis motion assembly; The second laser processing assembly performs linear movement in the Y-axis and Z-axis directions through the Y2-axis motion assembly and the Z2-axis motion assembly, respectively. The maximum linear movement range of the second laser processing assembly in the Y2 and Z2 axes is 500 and 600 mm, respectively, and the maximum positioning accuracy is 0.1 μm. The second laser processing component includes a picosecond and femtosecond laser, a picosecond and femtosecond laser fixing frame, a second processing area galvanometer scanning module, a second processing area laser head, a CCD module, and an optical path transmission module. The picosecond and femtosecond laser is arranged on the picosecond and femtosecond laser fixing frame, and an optical path transmission module is arranged on one side of the picosecond and femtosecond laser. The second processing area galvanometer scanning module and the second processing area laser head are respectively connected to the Z2 axis motion component, and the CCD module is arranged on one side of the picosecond and femtosecond laser fixing frame, and the picosecond and femtosecond laser fixing frame is connected to the Y2 axis motion component.

2. The multi-laser combined multi-axis turning and milling compound machine tool according to claim 1, characterized in that: The machine tool is connected with a silent vacuum cleaner and dust protection device.

3. The processing method of the multi-laser combined multi-axis turning and milling compound machine tool according to claim 1 or 2, characterized in that: Specifically, the tool being processed is moved linearly to the first processing area through the X-axis motion platform for nanosecond laser rough processing, and then moved to the second processing area for picosecond laser semi-finishing or femtosecond laser finishing. The A-axis is deflected 90° and fixed parallel to the Y-axis, and the C-axis continuously rotates 360° for laser turning. Laser milling is performed through linkage control between A, C, X, Y1, Z1 or A, C, X, Y2, Z2, ultimately realizing laser turning and milling composite processing.

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