Substrate handling system printed circuit board assembly having one or more heater layers

Abstract

A substrate processing system includes: a substrate processing chamber; a pedestal arranged in the substrate processing chamber; and an electrostatic chuck (ESC) arranged on the pedestal. The ESC includes a printed circuit board assembly (PCBA) composed of multiple printed circuit board layers, and the printed circuit board layers are used to mount circuits that control the operation of the ESC. One or more of the printed circuit board layers include a heater layer, which has one or more metal traces, which can be copper used to cover part or all of the surface of the heating layer, which is sufficient to provide heat to the remaining one or more printed circuit board layers to maintain the circuit within a predetermined temperature range. The heat can be conducted directly between each other printed circuit board layer, or it can be conducted through through holes in each of the printed circuit board layers.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to U.S. Utility Patent Application No. 15 / 825,682, filed on November 29, 2017. The entire disclosure of the above-referenced application is incorporated herein by reference. Technical Field

[0003] The present disclosure relates to substrate processing systems, more particularly, to electrostatic chucks in substrate processing systems, still more particularly, to printed circuit board assemblies in substrate processing systems, and even more particularly, to apparatus and methods for reducing or alleviating solder joint fatigue in printed circuit board assemblies through temperature control. Background Art

[0004] The background description provided here is for the purpose of generally presenting the context of the present disclosure. Work by the presently designated inventors to the extent described in this background section and in aspects of the description that could not be determined as prior art at the time of filing the application is neither explicitly nor implicitly admitted to be prior art against the present disclosure.

[0005] The substrate processing system can be used to etch and / or otherwise process a substrate (e.g., a semiconductor wafer). The substrate can be arranged on a susceptor in a processing chamber of the substrate processing system. For example, during etching in a plasma etcher, a gas mixture containing one or more precursors is introduced into the processing chamber, and a plasma is excited to etch the substrate.

[0006] The pedestal in the processing chamber may include an electrostatic chuck (ESC) to hold the substrate in place during etching. The ESC may require heating equipment and other circuits installed in the pedestal to control the operation of the ESC. The circuit can be set in a printed circuit board assembly (PCBA). The PCBA may be relatively complex, with up to 250 to 300 components on a single printed circuit board in the PCBA. These components may include, for example, a field programmable gate array (FPGA), a central processing unit (CPU), and / or various measurement circuits, such as voltage divider circuits. The PCBA may also include multiple layers, with circuits mounted on each layer. Some of these layers may be primarily ground layers; other layers may be power layers; others may also be signal transmission layers, which provide various types of signal transmission to control the operation of the ESC.

[0007] Conditions within a substrate processing chamber can vary widely, depending on the processes being implemented and the conditions that may exist between processing operations. The conditions that vary include temperature, which may exceed the operating temperature range of the circuits in the PCBA. These temperature conditions may exist for long enough that the PCBA circuits may fail or stop working. In addition, the temperature can be continuously cycled over a wide range (e.g., from -40°C to +70°C) in a short period of time (e.g., within four minutes) for a long period of time (even days). Cycling is expected to occur throughout the life cycle of the PCBA. The cycling range may be wider as the temperature decreases (even to -60°C or -80°C or -140°C).

[0008] Additionally, large temperature changes can cause significant expansion or contraction of materials in a PCBA. Different materials in a PCBA will have different coefficients of thermal expansion, perhaps significantly different. As a result, these materials, which may be soldered or otherwise attached to each other, will expand or contract to varying degrees, placing strain on the solder or other attachments and causing fatigue. This fatigue can cause solder connections to break or otherwise loosen, leading to PCBA failure and, in turn, substrate processing chamber downtime.

[0009] To avoid effects such as solder joint fatigue, it is desirable to maintain the temperature of the PCBA relatively constant. However, heating the PCBA, for example, may also result in undesirable heating of surrounding portions of the substrate processing chamber.

[0010] A PCBA may contain measurement circuits, such as voltage or current measurement circuits, whose performance may fluctuate significantly with temperature. The measurement results themselves can vary significantly with temperature. If the temperature fluctuations of the measurement circuits on the PCBA are not constrained, it may not be clear whether the fluctuating measurement values ​​are the result of the fluctuating values ​​themselves, the performance changes of the measurement circuits, or a combination of both.

[0011] In view of the above, it is desirable to provide a mechanism for locally heating a PCBA without affecting conditions elsewhere in a substrate processing chamber. It is also desirable to provide a mechanism to facilitate maintaining the temperature of the PCBA or certain components within a predetermined range. Summary of the invention

[0012] According to one feature, a substrate processing system includes: a substrate processing chamber; a pedestal arranged in the substrate processing chamber; and an electrostatic chuck (ESC) arranged on the pedestal. The ESC includes a PCBA composed of a plurality of printed circuit board layers, the printed circuit board layers being used to mount circuits that control the operation of the ESC. One or more of the printed circuit board layers includes a heater layer having one or more metal traces, which may be copper for covering a portion or all of the surface of the heating layer, sufficient to provide heat to the remaining one or more printed circuit board layers to maintain the circuit within a predetermined temperature range. The heat may be conducted directly between each of the other printed circuit board layers, or may be conducted through through holes in each of the printed circuit board layers.

[0013] According to one feature, a layer of the PCBA is provided with one or more metal traces (in one aspect, copper) that respond to the application of an electrical current to provide heat to a portion or all of the PCBA.

[0014] In one feature, a single metal trace is provided on the layer as a single heating element with a single controller. In another feature, multiple metal traces are provided on the layer as multiple heating elements connected in parallel with a single controller. In another feature, one or more metal traces connect circuits on the layer as multiple heating elements with multiple controllers.

[0015] In one feature, the temperature of each layer of the PCBA is controlled within a specified range. In another feature, the temperature within the frequency band will be maintained in one or more areas of the PCBA, but not necessarily for all PCBAs.

[0016] Further scope of applicability of the present disclosure will become apparent from the detailed description, claims and drawings.The detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present disclosure will be more fully understood from the detailed description and accompanying drawings, in which:

[0018] Figure 1 is a high-level diagram of a substrate processing chamber.

[0019] Figure 2 is a high-level exploded view of the pedestal in the substrate processing chamber, which contains the PCBA.

[0020] Figure 3 is a view of a PCBA showing the multiple layers in a slightly exploded view.

[0021] Figure 4It is a more decomposed diagram of PCBA based on one aspect;

[0022] Figure 5 is a view of a layer of a PCBA showing metal traces according to one aspect;

[0023] Figure 6 is a view of a layer of a PCBA showing metal traces according to one aspect;

[0024] Figure 7 It is a view of one layer of a PCBA according to one aspect;

[0025] Figure 8 is a view of another layer of a PCBA according to one aspect.

[0026] Among the drawings, reference numerals may be repeated to identify similar and / or identical elements. DETAILED DESCRIPTION

[0027] Figure 1 A substrate processing chamber 100 is shown, which includes a pedestal 110 on which an electrostatic chuck (ESC) 115 can be mounted. A wafer or substrate 120 is placed on the ESC 115. At the top of the chamber 100, a conduit 130 delivers the plasma to a showerhead 135, which distributes the plasma in the chamber 100. Figure 1 In the present invention, the conduit 130 and the showerhead 135 are provided as examples of plasma distribution equipment only. The precise distribution structure is not important.

[0028] Figure 2 A cross-sectional view of an ESC 115 is shown having halves 115A, 115B. Various structures, including a heater (e.g., a coil heater or a pixelated heater), are contained within the ESC 115. In one aspect, toward the bottom of the ESC 115, a PCBA 200 may be provided. For purposes of illustration, several layers of the PCBA 200 are shown. In one aspect, as will be discussed in more detail herein, the PCBA 200 has a complex structure having multiple layers. Different layers may have different circuits or other items on one or both sides. Some layers may be connected to each other through vias in the layers.

[0029] Figure 3A PCBA 200 having layers 200A, 200B, 200C, ..., 200N, 200O, 200P according to one aspect is shown. For purposes of illustration herein, PCBA 200 is shown as including 16 layers. There may be more layers, or fewer layers. In one aspect, as will be discussed, in addition to the ground layer, power layer, and signal transmission layer, one or more heater layers are included. As will be discussed, the through holes 250 in each layer 200A, 200B, and 200C can facilitate connections between appropriate layers.

[0030] In one aspect, there may be symmetry between the layers, where, for example, the outer layers in the upper and lower halves of the overall PCBA may constitute ground planes, while the inner layers may include various power circuits or signal transmission circuits. These layers may also be connected to each other using various vias.

[0031] In one aspect, Figure 4 , looking more closely at the configuration and / or function of the different layers, the top layer 200A and the bottom layer 200P may constitute signal layers, which include pads or footprints to which various components are soldered. Layers 200B and 200O may be ground layers. Layers 200C, 200D and layers 200M, 200N may be signal layers. Layers 200E and 200L may be additional ground layers. Layers 200F and 200K may be heater layers. Layer 200G may be another ground layer. Layers 200H-200J may be power transmission layers.

[0032] In one aspect, there is a laminate 210A above the heater layer 200F and a laminate 210B below the heater layer 200K. The thickness of these laminates can be thinner than the laminates between the remaining layers in the PCBA and not shown (e.g., the laminates between layers 200P and 200O, and between layers 200O and 200N).

[0033] In one aspect, layers 200B and 200E are ground planes. These ground planes can be connected to each other through various vias such as via 250, which are shown in layers 200H and 200I for illustration purposes only. There can be any number of vias 250 in any layer of the PCBA to appropriately connect the various layers in the PCBA, and this will be understood by a person of ordinary skill.

[0034] In one aspect, similar to layers 200B and 200E, layers 200L and 200O are ground planes, which may also be connected to each other through various vias (eg, via 250 ).

[0035] In one aspect, laminate 210A facilitates heat transfer from heater layer 200F to ground layer 200E. Laminate 210B facilitates heat transfer from heater layer 200K to ground layer 200L. The two thinner laminates provide easier heat transfer to the ground layers 200E, 200L. Heat from these layers 200E, 200L can be drawn through vias to other ground layers 200E and 200L to ground layers 200B, 200O, so that heat from these ground layers 200B, 200O can be used to heat the top and bottom layers 200A, 200P.

[0036] The heater layer 200F includes a metal trace layer, as will be described below with respect to Figure 5 In one aspect, these metal trace layers are copper. In another aspect, the heater layer 200F comprises these metal trace layers separate from, for example, the ground layers 200B and 200O, because the ground layers 200B, 200O must provide a ground reference for the signals on the top and bottom layers 200A, 200P.

[0037] In one aspect, heater layer 200F may be merged into heater layer 200B, and / or heater layer 200K may be merged into heater layer 200O. As a result, there may be fewer layers, and the overall structure may be more efficient. However, the merged layers will be more complex.

[0038] In one aspect, heater layers 200F and 200K have identical traces. Each layer can be a single trace, with the end of the trace of layer 200F connected to the end of the trace of layer 200K. When a DC current is injected into the beginning of the trace of layer 200F, the current flows out of the end of the trace of layer 200F, then flows into the end of the trace of layer 200K, and finally returns from the beginning of the trace of layer 200K until both layers are heated. The current flows in the two heater layers in completely opposite directions. In this way, electromagnetic interference (EMI) to other printed circuit board layers, especially to signals generated in these layers, can be reduced. Another way to describe this is to improve the electromagnetic capability (EMC) of these other printed circuit board layers.

[0039] Figure 5 A heater layer 200F is shown having metal traces 300 (which may be copper). Figure 5 In FIG. 1 , there are multiple arrows pointing to the trace 300, but in one aspect, as Figure 5 As shown, there is a single trace 300 . Figure 5Traces 300 are shown extending through various locations on the heater layer 200F where circuits may be provided. In one aspect, the traces 300 move in, out, and over pins such as pins 320, on which a daughter board (not shown) may be mounted, or an integrated circuit device (IC) may be soldered to. The traces 300 cover a large amount of area on the printed circuit board layer 200F so that the heat generated by applying current through the traces 300 is distributed across the surface of the heater layer 200F. This type of distribution would be one way to distribute heat throughout the other layers of the layers 200A-200P, with or without the previously discussed vias 250.

[0040] Figure 5 A single metal (copper) trace 300 is shown according to various aspects, and multiple such traces 300 may be provided in different regions of the heater layer 200F. The different traces 300 may be individually controlled in a manner that will be understood by one of ordinary skill in the art. Controlling different traces 300 at different times or to different degrees may allow for more efficient temperature control within the PCBA 200 by selectively heating different regions by different amounts or by selectively heating different regions at different times.

[0041] Figure 6 A heater layer 200K is shown with metal traces 300 (which may be copper). Figure 6 In FIG. 1 , there are multiple arrows pointing to the trace 300, but in one aspect, as Figure 6 As shown, there is a single trace 300 . Figure 6 Traces 300 are shown extending through various locations on the heater layer 200K where circuits may be provided. In one aspect, the traces 300 move in, out, and between pins such as pins 320, to which a daughter board (not shown) may be mounted, or to which an integrated circuit device (IC) may be soldered. The traces 300 cover a large amount of area on the printed circuit board layer 200K so that the heat generated by applying current through the traces 300 is distributed across the surface of the heater layer 200K. This type of distribution would be one way to distribute heat throughout the other layers of the layers 200A-200P, with or without the previously discussed vias 250.

[0042] Figure 6 A single metal (copper) trace 300 is shown according to various aspects, and multiple such traces 300 may be provided in different regions of the heater layer 200F. The different traces 300 may be individually controlled in a manner that will be understood by one of ordinary skill in the art. Controlling different traces 300 at different times or to different degrees may allow for more efficient temperature control within the PCBA 200 by selectively heating different regions by different amounts or by selectively heating different regions at different times. Figure 5 and Figure 6 A similar trace 300 is shown. Figure 6 In, there is an additional trace 310.

[0043] Figure 7 and 8 Other printed circuit board layers in PCBA 200 are depicted, illustrating different types of circuits and structures that may be provided on these printed circuit board layers. Figure 7 and 8 These printed circuit board layers in may be unnumbered anywhere in PCBA 200 .

[0044] Based on the disclosure provided herein, various examples of temperature control will be familiar to a person of ordinary skill. By way of example only and not limitation, when a temperature sensor on the PCBA 200 indicates that the temperature is below a predetermined temperature or outside a predetermined temperature range, the heater layer 200F, 200K may be turned on. For example, it may be desirable to control the temperature of part or all of the PCBA 200 within a small range, such as 1°C to 5°C, to reduce fluctuations in readings of a measuring device on the PCBA 200.

[0045] Providing heater layers 200F, 200K in multiple printed circuit board layers 200A-200P has the following advantages, among others. First, the heat provided is localized to the printed circuit board layers themselves. Other methods of applying heat from the outside can heat areas outside the printed circuit board layers when the heat may not be desirable and may actually offset the desired temperature within the chamber. As previously mentioned, the temperature within the substrate processing chamber 100 may fluctuate widely. When the temperature is very low (e.g., -40°C), it will be necessary to locally heat the printed circuit board layers 200A-200P, thereby avoiding heating other parts of the chamber 100. The attendant effect of local heating is higher power efficiency compared to heating using a heat source external to the PCBA 200. In addition, local heating can enable the temperature to cycle at other locations in the substrate processing chamber 100 where such cycling may be desirable. The effect is to substantially decouple the heating of components in the PCBA 200 from the heating of other components in the chamber 100 (e.g., an enclosure that may be expected to be very cold (e.g., minus 40 degrees Celsius or more)).

[0046] Second, the functions performed in some of the printed circuit board layers 200A-200P include various current and / or voltage measurements. Such measurements can fluctuate under different temperature conditions. For example, when one or more resistors in a voltage divider circuit fluctuate up and down in temperature, the amount of current per degree Celsius that the voltage divider will measure will change. By applying heat internally to the PCBA 200 to keep it at a temperature within a predetermined range, the measurement circuit (e.g., the voltage divider) can operate stably, meaning that fluctuations in current can be attributed to other circuits rather than to the measurement circuit. The effect of this thermal stability is greater accuracy and consistency in measurements.

[0047] Third, refer again Figure 4 , limiting the temperature range within PCBA 200 can reduce fatigue of solder joints, such as solder joint 240, that secure integrated circuit (IC) 220 to the appropriate one of printed circuit board layers 200A-200P in PCBA 200. Reduction in solder joint fatigue means that IC 220 will be less likely to separate from the printed circuit board layer to which it is attached.

[0048] Another aspect of this just described advantage is that thermal fatigue is not only reduced in solder joints, but also in other components in PCBA 200, which may have significantly different coefficients of thermal expansion (TCE).

[0049] Fourth, look again Figure 5 As well as the example of a daughterboard mounted to a printed circuit board layer such as a 200F layer, such a daughterboard may have multiple pins, such as spring loaded pogo pins, through which a large amount of current will flow. Atmospheric conditions such as condensation and freezing may lock the circuit in place and prevent contact. When separation and high currents are present, arcing may occur, which can break contacts, as well as otherwise damage the printed circuit board. Maintaining such a printed circuit board within a predetermined temperature range can prevent such atmospheric conditions and corresponding catastrophic damage.

[0050] Fifth, one or more heater layers 200F, 200K in the PCBA 200 (with traces 300 extending throughout) may serve as a shielding layer for other printed circuit board layers in the PCBA 200 .

[0051] Sixth, as previously described, by providing multiple traces 300 in different portions of one or more heater layers 200F, 200K, it will be possible to independently control the heating of different areas of the PCBA 200, resulting in higher operating efficiency. Relatedly, by having the traces 300 cover a majority of the surface of the heater layer 200F, 200K, the heating effect will be more uniform, both within the area of ​​the heater layer 200F, 200K and throughout the heater layer. In particular, for relatively large PCBAs (e.g., 10 inches in diameter), using discrete resistors instead of metal traces can result in heating of isolated areas of the PCBA (rather than continuous areas).

[0052] Seventh, the heater layers 200F, 200K may be powered using the same voltage as other layers in the PCBA 200. Alternatively, the heater layers 200F, 200K may be powered using a voltage derived from the same voltage as other layers in the PCBA 200.

[0053] Eighth, the heater layer 200F, 200K can keep the entire PCBA (including all components on the PCBA) above the freezing point or above the detection metal plate to protect the circuit from the risk of condensation or ice.

[0054] The foregoing description is merely illustrative in nature and is in no way intended to limit the present disclosure, its application or use. The broad teachings of the present disclosure can be implemented in various forms. Therefore, although the present disclosure includes specific examples, the true scope of the present disclosure should not be so limited, because other modifications will become apparent when studying the drawings, specifications and appended claims. As used herein, the phrase "at least one of A, B and C" should be interpreted as meaning the logic (A or B or C) using a non-exclusive logical or (OR), and should not be interpreted as meaning "at least one of A, at least one of B and at least one of C". It should be understood that without changing the principles of the present disclosure, one or more steps in the method can be performed in different orders (or simultaneously).

[0055] In some implementations, the controller is part of a system, which can be part of the above examples. Such a system can include a semiconductor processing device, which includes one or more processing tools, one or more chambers, one or more platforms for processing, and / or specific processing components (wafer pedestals, gas flow systems, etc.). These systems can be integrated with electronic devices for controlling their operations before, during, and after the processing of semiconductor wafers or substrates. The electronic device can be referred to as a "controller", which can control various components or subcomponents of one or more systems. Depending on the processing requirements and / or system type, the controller can be programmed to control any process disclosed herein, including the delivery of process gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, position and operation settings, wafer transfer of load locks in and out of tools and other transfer tools and / or connected to a specific system or connected via an interface.

[0056] In general, a controller can be defined as an electronic device having various integrated circuits, logic, memory, and / or software that receive instructions, issue instructions, control operations, enable cleaning operations, enable endpoint measurements, etc. The integrated circuit can include a chip in the form of firmware that stores program instructions, a digital signal processor (DSP), a chip defined as an application specific integrated circuit (ASIC), and / or one or more microprocessors, or a microcontroller that executes program instructions (e.g., software). The program instructions can be instructions sent to the controller in the form of various individual settings (or program files) that define operating parameters for performing a specific process on or for a semiconductor wafer or system. In some embodiments, the operating parameters can be part of a recipe defined by a process engineer to complete one or more processing steps during the manufacture of one or more (kinds of) layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or dies of a wafer.

[0057] In some implementations, the controller may be part of or coupled to a computer that is integrated with the system, coupled to the system, otherwise networked to the system, or a combination thereof. For example, the controller may be in the "cloud" or all or part of a wafer fab host system that may allow remote access to wafer processing. The computer may enable remote access to the system to monitor the current progress of a manufacturing operation, check the history of past manufacturing operations, check trends or performance criteria for multiple manufacturing operations, change parameters of a current process, set processing steps to follow the current process, or start a new process. In some examples, a remote computer (e.g., a server) may provide a process recipe to the system via a network (which may include a local network or the Internet). The remote computer may include a user interface that enables input or programming of parameters and / or settings, which are then sent from the remote computer to the system. In some examples, the controller receives instructions in the form of data that specify parameters for each processing step to be performed during one or more operations. It should be understood that the parameters may be specific to the type of process to be performed and the type of tool that the controller is configured to interface with or control. Thus, as described above, the controller may be distributed, for example, by including one or more discrete controllers networked together and working toward a common purpose (e.g., process and control as described herein). An example of a distributed controller for such a purpose is one or more integrated circuits on a chamber communicating with one or more integrated circuits remotely (e.g., at a platform level or as part of a remote computer), which combine to control the process on the chamber.

[0058] Example systems may include, but are not limited to, plasma etch chambers or modules, deposition chambers or modules, spin rinse chambers or modules, metal plating chambers or modules, cleaning chambers or modules, chamfer edge etch chambers or modules, physical vapor deposition (PVD) chambers or modules, chemical vapor deposition (CVD) chambers or modules, atomic layer deposition (ALD) chambers or modules, atomic layer etch (ALE) chambers or modules, ion implantation chambers or modules, track chambers or modules, and any other semiconductor processing system that may be associated with or used in the manufacture and / or preparation of semiconductor wafers.

[0059] As described above, depending on one or more processing steps to be performed by the tool, the controller can communicate with one or more other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, neighboring tools, tools located throughout the factory, a host computer, another controller, or tools used in the transport of materials for transporting wafer containers to and from tool locations and / or load ports in a semiconductor manufacturing facility.

Claims

1. A printed circuit board assembly, wherein in a substrate processing system, the substrate processing system comprises a substrate processing chamber and an electrostatic chuck for holding a substrate in the substrate processing chamber, The printed circuit board assembly includes a plurality of printed circuit board layers, wherein one or more of the plurality of printed circuit board layers are configured to mount circuitry that controls operation of the electrostatic chuck, The multiple printed circuit board layers include a first printed circuit board layer, which includes a first metal trace covering a first area of ​​the first printed circuit board layer, and the first metal trace is used to provide heat to one or more other printed circuit board layers in the multiple printed circuit board layers to keep the circuit within a predetermined temperature range.

2. The printed circuit board assembly of claim 1 , wherein the plurality of printed circuit board layers further comprises a second printed circuit board layer, the second printed circuit board layer comprising a second metal trace, the second metal trace being used to cover a second area of ​​the second printed circuit board layer, the first metal trace and the second metal trace being used to provide heat to one or more of the plurality of printed circuit board layers to keep the circuit within the predetermined temperature range.

3. The printed circuit board assembly according to claim 1, wherein: The first region covers substantially all of the first printed circuit board layer.

4. The printed circuit board assembly according to claim 1, wherein: The circuitry that controls operation of the electrostatic chuck includes a first circuit mounted on the first printed circuit board layer.

5. The printed circuit board assembly according to claim 2, wherein: The second region covers substantially all of the second printed circuit board layer.

6. The printed circuit board assembly according to claim 2, wherein: The circuitry that controls operation of the electrostatic chuck includes a second circuit on the second printed circuit board layer.

7. The printed circuit board assembly according to claim 4, wherein: The first metal trace connects the first circuit mounted on the first printed circuit board layer.

8. The printed circuit board assembly of claim 6, wherein the second metal trace connects the second circuit mounted on the second printed circuit board layer.

9. The printed circuit board assembly according to claim 2, wherein: The plurality of printed circuit board layers include a ground layer, a power layer, and a signal transmission layer, and the first printed circuit board layer and the second printed circuit board layer are interspersed between the ground layer, the power layer, and the signal transmission layer.

10. The printed circuit board assembly according to claim 1, wherein: The plurality of printed circuit board layers are arranged in a stack, and the first printed circuit board layer is arranged towards the middle of the stack.

11. The printed circuit board assembly according to claim 10, wherein: Two or more of the plurality of printed circuit board layers include vias, and wherein the vias conduct heat from the first metal trace in the first printed circuit board layer to other printed circuit board layers in the stack.

12. The printed circuit board assembly according to claim 2, wherein: The plurality of printed circuit board layers are arranged in a stack, and the first printed circuit board layer and the second printed circuit board layer are arranged towards a middle of the stack.

13. The printed circuit board assembly according to claim 12, wherein: Two or more of the plurality of printed circuit board layers include vias, and wherein the vias conduct the heat from the first and second metal traces in the corresponding first and second printed circuit board layers to other printed circuit board layers in the stack.

14. The printed circuit board assembly according to claim 1, wherein: The first printed circuit board layer has a plurality of metal traces, each of the plurality of metal traces covering a corresponding area in the first printed circuit board layer.

15. The printed circuit board assembly according to claim 14, wherein: The heat provided by each of the plurality of metal traces is independently controlled.

16. The printed circuit board assembly according to claim 2, wherein: Each of the first and second printed circuit board layers has a plurality of metal traces, each of the plurality of metal traces covering a corresponding area in a respective one of the first and second printed circuit board layers.

17. The printed circuit board assembly according to claim 16, wherein: The heat provided by each of the plurality of metal traces is independently controlled.

18. A printed circuit board assembly (PCBA) in a substrate processing system, the substrate processing system comprising a substrate processing chamber and an electrostatic chuck (electrostatic chuck) for holding a substrate inside the substrate processing chamber, The printed circuit board assembly includes a plurality of printed circuit board layers, wherein one or more of the plurality of printed circuit board layers are configured to mount one or more integrated circuits that control the operation of the electrostatic chuck, The plurality of printed circuit board layers comprises: a first printed circuit board layer, the first printed circuit board layer comprising a first metal trace for covering a first area of ​​the first printed circuit board layer; as well as a second printed circuit board layer, the second printed circuit board layer comprising a second metal trace for covering a second area of ​​the second printed circuit board layer, wherein the first metal trace and the second metal trace are arranged so that current flows through the first metal trace in a first direction and current flows through the second metal trace in a second direction opposite to the first direction, The first metal trace and the second metal trace are used to provide heat to one or more other printed circuit board layers of the plurality of printed circuit board layers to maintain the one or more integrated circuits within a predetermined temperature range.

19. A printed circuit board assembly (PCBA) in a substrate processing system, the substrate processing system comprising a substrate processing chamber and an electrostatic chuck (electrostatic chuck) for holding a substrate inside the substrate processing chamber, The printed circuit board assembly includes a plurality of printed circuit board layers, wherein one or more of the plurality of printed circuit board layers are configured to mount a controller, the controller controlling the operation of the electrostatic chuck and controlling at least one of the following: process gas, pressure settings, vacuum settings, power settings, RF generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, position and operation settings, and wafer transfer, The multiple printed circuit board layers include a first printed circuit board layer, which includes a first metal trace for covering a first area of ​​the first printed circuit board layer, and the first metal trace is used to provide heat to one or more other printed circuit board layers in the multiple printed circuit board layers to maintain the controller within a predetermined temperature range.

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