Display device

Abstract

The present disclosure relates to a display device, which includes a substrate, wherein the substrate includes a flat area and a first bending area adjacent to the flat area, wherein the first bending area includes a first upper bending portion, a first extending portion, and a first lower bending portion in sequence in a direction away from the flat area, a transistor is arranged in the flat area, a light-emitting element electrically connected to the transistor is located in the flat area and the first upper bending portion, the light-emitting element includes a bent light-emitting layer, so that an image is displayed in the flat area and the first upper bending portion, and the thickness of the inorganic continuous film located in the first bending area is thinner than the thickness of the inorganic continuous film located in the flat area.

Description

Technical Field

[0001] The present disclosure relates to a display device, and more particularly to a flexible display device including a flat region and a bent region adjacent thereto. Background Art

[0002] Generally, a display device includes a display panel that displays an image using a pixel array formed on a substrate. In such a display device, by bending at least a portion, the area of ​​a peripheral region where the image is not displayed can be reduced.

[0003] However, in the process of manufacturing the flexible display device, stress acts on the bending region or the display region connected thereto when the flexible display device is bent, which may cause problems such as defects or shortened life of the display device. Summary of the invention

[0004] An object of the embodiment is to provide a flexible display device that reduces the thickness of an inorganic film in a bending region of the display device to reduce stress in the bending region, thereby preventing defects such as cracks and wiring damage and improving display quality.

[0005] According to one embodiment, a display device includes a substrate, the substrate includes a flat area and a first bending area adjacent to the flat area, the first bending area includes a first upper bending portion, a first extending portion and a first lower bending portion in sequence in a direction away from the flat area, a transistor is arranged in the flat area, a light-emitting element electrically connected to the transistor is located in the flat area and the first upper bending portion, the light-emitting element includes a bent light-emitting layer, so that an image is displayed in the flat area and the first upper bending portion, and the thickness of the inorganic continuous film located in the first bending area is thinner than the thickness of the inorganic continuous film located in the flat area.

[0006] The inorganic continuous film may include at least one of a barrier layer, a buffer layer, a first insulating layer, and a second insulating layer.

[0007] It may be that, in a portion corresponding to the flat area, the barrier layer and the buffer layer are sequentially located on the substrate.

[0008] It may be that the transistor includes a semiconductor layer, a gate electrode located on the semiconductor layer, and a source electrode and a drain electrode electrically connected to the gate electrode.

[0009] It may be that the semiconductor layer is located on the buffer layer, the first insulating layer is located on the semiconductor layer, the gate conductor including the gate electrode is located on the first insulating layer, the second insulating layer is located on the gate conductor, and the data conductor including the source electrode and the drain electrode is located on the second insulating layer.

[0010] It may be that a first opening is formed in the barrier layer and the buffer layer in a portion corresponding to the first bending region.

[0011] It may be that a second opening is further formed in the first insulating layer and the second insulating layer in a region corresponding to the first lower bent portion.

[0012] It may be that the first opening and the second opening are filled with a first protective layer, and the first protective layer contains an organic substance.

[0013] The bent light emitting layer may be located at a portion corresponding to a portion of the flat region and a portion of the first upper bent portion.

[0014] It can be that the sum of the thickness of the barrier layer and the buffer layer is to

[0015] The first bending region may be bent downward of the flat region with reference to a side of the adjacent flat region.

[0016] The first upper bent portion, the first extending portion, and the first lower bent portion may be bent based on mutually adjacent sides.

[0017] It may be that at least one of a second bending area, a third bending area, and a fourth bending area is further included along the edge of the flat area.

[0018] The second bending region, the third bending region, and the fourth bending region may be bent downward of the flat region with reference to the side of the adjacent flat region.

[0019] The bent light emitting layer may be located in the second bending region, the third bending region, and a portion of the fourth bending region to display an image.

[0020] It may be that the third insulating layer is located on the data conductor, the first electrode is located on the third insulating layer, the light-emitting layer is located on the first electrode, the second electrode is located on the light-emitting layer, the light-emitting element is composed of the first electrode, the light-emitting layer and the second electrode, and the light-emitting layer includes a first light-emitting layer and the bent light-emitting layer.

[0021] It may be that the fourth insulating layer is located on the first electrode, and the bent light-emitting layer is located above the fourth insulating layer and below the second electrode.

[0022] It may be that a connecting wiring made of the same material as the data conductor is located in the area corresponding to the first lower bending portion, and the connecting wiring electrically connects the first wiring and the second wiring located on both sides of the first lower bending portion, thereby transmitting an electrical signal to the first upper bending portion and the flat area.

[0023] The connection wiring may be bent together with the first lower bent portion when the first lower bent portion is bent.

[0024] It may be that a packaging layer is further provided on the light emitting element to cover the light emitting element, and the packaging layer includes one or more inorganic layers and one or more organic layers.

[0025] (Effect of Publicity)

[0026] According to the display device of the embodiment, a portion of the inorganic film is removed in the bending area of ​​the display device to reduce the thickness of the entire inorganic film, so that the stress on the bending area can be minimized, thereby improving defects such as cracks and wiring damage caused by stress, and improving display quality, stability, etc. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 FIG. 1 is a plan view schematically showing an unfolded state of a display device according to an embodiment.

[0028] Figure 2 It shows that according to Figure 1 A cross-sectional view of the cross section taken along line II-II' when the display device is in a bent state.

[0029] Figure 3 It shows that Figure 1 A cross-sectional view of the cross section taken along line III-III'.

[0030] Figure 4 It briefly shows the Figure 1 A cross-sectional view of the cross section taken along line III-III'.

[0031] Figure 5 It briefly shows the Figure 1 This is a cross-sectional view showing another example of the cross-section taken along line III-III'.

[0032] Figure 6 is an exploded perspective view schematically showing a display device according to an embodiment.

[0033] Figure 7 It shows that Figure 6A cross-sectional view of the cross section taken along line VII-VII'.

[0034] Description of Reference Numerals

[0035] 100, 1000: display device 110: substrate

[0036] FA: Flat area BA: Bending area

[0037] BA1: First bending area BA1-1: First upper bending portion

[0038] BA1-2: first extension portion BA1-3: first lower bending portion

[0039] 115: barrier layer 120: buffer layer

[0040] 154: semiconductor layer 124: gate layer

[0041] 140: first insulating layer 160: second insulating layer

[0042] 173: Source electrode 175: Drain electrode

[0043] 180: third insulating layer 360: fourth insulating layer

[0044] 400: Bending protection layer

[0045] TR: Transistor LD: Light Emitting Device

[0046] EL: light-emitting layer ELb: bent light-emitting layer

[0047] C1: First opening C2: Second opening DETAILED DESCRIPTION

[0048] Hereinafter, with reference to the attached drawings, multiple embodiments of the present disclosure are described in detail so that a person having ordinary knowledge in the technical field to which the present disclosure belongs can easily implement the present disclosure. The present disclosure can be implemented in many different forms and is not limited to the embodiments described herein.

[0049] In order to clearly illustrate the present disclosure, parts irrelevant to the description are omitted, and the same reference numerals are used for the same or similar components throughout the specification.

[0050] In addition, the size and thickness of each structure shown in the drawings are arbitrarily shown for the convenience of explanation, and therefore the present disclosure is not necessarily limited to the drawings. In the drawings, the thickness is enlarged to clearly express multiple layers and regions. In addition, in the drawings, the thickness of some layers and regions is exaggerated for the convenience of explanation.

[0051] Furthermore, when a layer, film, region, plate or the like is expressed as being "on" or "upper" another part, it includes not only the case where it is "directly" "on" another part, but also the case where there is another part in between. Conversely, when a certain part is expressed as being "directly" "on" another part, it means the case where there is no other part in between. Furthermore, when it is expressed as being "on" or "upper" a part that becomes a reference, it means the case where it is located above or below the part that becomes the reference, and it does not necessarily mean that it is located "on" or "upper" in the direction opposite to the gravity.

[0052] Furthermore, throughout the specification, when a certain part is expressed as “including” a certain constituent element, unless there is a particular description to the contrary, it means that other constituent elements are not excluded but may be included.

[0053] Furthermore, throughout the specification, when expressed as “on a plane”, it means a case where the subject portion is viewed from above, and when expressed as “on a cross section”, it means a case where a cross section vertically cutting the subject portion is viewed from the side.

[0054] Below, use Figure 1 and Figure 2 , a display device according to an embodiment is described. Figure 1 is a top view schematically showing an unfolded state of a display device according to an embodiment, Figure 2 It shows that according to Figure 1 A cross-sectional view of the cross section taken along line II-II' when the display device is in a bent state.

[0055] refer to Figure 1 According to an embodiment, the display device 100 includes a flat area FA (Fla1t Area) and at least one bending area BA (Bending Area). Figure 2 As shown, a portion of the flat area FA and the bent area BA may correspond to a display area DA (Display Area) for displaying an image, and another portion of the bent area may correspond to a peripheral area PA (Peripheral Area) for not displaying an image.

[0056] A plurality of pixels PX are formed in the flat area FA. Each pixel PX formed in the flat area FA can be connected to a gate driving unit, a data driving unit, a printed circuit board PCB (refer to FIG. 1 ) located in a part of the peripheral area PA through a signal line such as a scan line and a data line (not shown). Figure 7 ) terminals connected. Through this, each pixel PX can receive a scan signal, a data signal, a driving voltage, a common power supply, and the like to display an image. The flat area FA may have a flat surface shape. Figure 1One pixel PX is exemplarily shown in FIG. In the flat area FA, a plurality of pixels PX may be arranged in various patterns such as rows, columns, and grids.

[0057] The bending area BA may be located around the flat area FA, and may be located at each edge of the flat area FA. The bending area BA may include a first bending area BA1, a second bending area BA2, a third bending area BA3, and a fourth bending area BA4. Each corner of the flat area FA adjacent to each bending area (BA1, BA2, BA3, BA4) may be defined as a chamfered shape, which is called a chamfered portion CP (chamfered Portion).

[0058] The first bending area BA1 may be located at the lower side of the flat area FA, and the first bending area BA1 may include a first upper bending portion BA1-1, a first extending portion BA1-2, and a first lower bending portion BA1-3.

[0059] The first lower bending portion BA1-3 is formed with a connection interface such as a pad or a protrusion, and the connection interface is arranged to be able to attach a printed circuit board PCB (refer to Figure 7 The first bending area BA1 can be bent together with the connection interface, and the printed circuit board PCB (refer to Figure 7 ) is located at the back side of the display device 100 according to an embodiment.

[0060] The second bending area BA2 may be located at the upper side of the flat area FA. The second bending area BA2 may include a second upper bending portion BA2-1, a second extending portion BA2-2, and a second lower bending portion BA2-3.

[0061] The third bending area BA3 may be located at the left side of the flat area FA. The third bending area BA3 may include a third upper bending portion (not shown), a third extending portion (not shown), and a third lower bending portion (not shown).

[0062] The fourth bending area BA4 may be located at the right side of the flat area FA. The fourth bending area BA4 may include a fourth upper bending portion (not shown), a fourth extending portion (not shown), and a fourth lower bending portion (not shown).

[0063] At this time, the flat area FA may correspond to the flat display area DA0. In addition, the first upper bend portion BA1-1 and the second upper bend portion BA2-1 may correspond to the first display area DA1 and the second display area DA2 described later, respectively. Although not shown in the figure, the third upper bend portion and the fourth upper bend portion may also correspond to the third display area and the fourth display area described later, respectively. In this way, the display area DA may include the flat area FA, the first upper bend portion BA1-1 of the first bend area BA1, the second upper bend portion BA2-1 of the second bend area BA2, the third upper bend portion of the third bend area BA3, and the fourth upper bend portion of the fourth bend area BA4.

[0064] The first bending area BA1, the second bending area BA2, the third bending area BA3, and the fourth bending area BA4 can be bent toward the bottom of the display device 100 based on the edge of the adjacent flat area FA. That is, a flexible display device can be realized in which all edges of the substrate 110 are bent. Thus, when the user looks at the flat area FA of the display device 100, it can be recognized that the area of ​​the peripheral area where the image is not displayed is narrowed.

[0065] The flexible display device refers to a display device that is given flexibility, and can be used as the same meaning as a bendable display device, a rollable display device, an unbreakable display device, a foldable display device, and the like.

[0066] The first extension portion BA1-2 and the first downward bending portion BA1-3 may correspond to the first peripheral area PA1. The second extension portion BA2-2 and the second downward bending portion BA2-3 may correspond to the second peripheral area PA2. Although not shown, the third extension portion and the third downward bending portion of the third bending area BA3 may correspond to the third peripheral area, and the fourth extension portion and the fourth downward bending portion of the fourth bending area BA4 may correspond to the fourth peripheral area.

[0067] That is, there are various driving circuits or wirings in the first extension part BA1-2, the second extension part BA2-2, the third extension part (not shown), the fourth extension part (not shown) and the first lower bending part BA1-3, the second lower bending part BA2-3, the third lower bending part (not shown), and the fourth lower bending part (not shown), so that the image may not be displayed. Figure 3 ) can be located in the first extension portion BA1-2, the second extension portion BA2-2, the third extension portion (not shown), and the fourth extension portion (not shown).

[0068] exist Figure 1In the figure, the flat area FA is shown as a quadrilateral shape, and the bending area BA is shown as being located at the four sides of the flat area FA, but the form of the display area DA and the form or arrangement of the bending area BA are not limited to Figure 1 As an example, the display device 100 may include a first bending area BA1 formed on the lower side of the flat area FA, or may include only at least one of the second bending area BA2, the third bending area BA3 and the fourth bending area BA4.

[0069] Below, use Figure 3 , a display device according to an embodiment is described in more detail. Figure 3 It shows that Figure 1 A cross-sectional view of the cross section taken along line III-III'.

[0070] exist Figure 3 The cross-sectional view of FIG. 1 shows a portion of the flat area FA and the first bending area BA1 adjacent thereto, and the first bending area BA1 may include a first upper bending portion BA1-1, a first extension portion BA1-2, and a first lower bending portion BA1-3. The flat area FA includes a pixel driving portion formed with a transistor TR and a light emitting element LD connected thereto, and at least a portion of the light emitting element LD connected to the transistor TR is located at the first upper bending portion BA1-1. Here, the light emitting element LD may be an organic light emitting element.

[0071] refer to Figure 3 The display device 100 includes a substrate 110 and a plurality of layers, wirings, and elements formed thereon. A plurality of pixels PX are arranged in the display area DA of the display device 100, but for the convenience of description, only two pixels PX are briefly described. In addition, each pixel PX includes a transistor TR, a capacitor, and a light-emitting element LD, but each pixel PX is centered on a transistor TR and a light-emitting element LD connected thereto, and the stacked structure of the display device 100 is described.

[0072] The substrate 110 may be a flexible substrate and may be made of a polymer such as polyimide, polyamide, polycarbonate, or polyethylene terephthalate.

[0073] The barrier layer 115 for preventing moisture from penetrating from the outside is located on the substrate 110. The barrier layer 115 may include silicon oxide (SiO x ), Silicon Nitride (SiN x ) and other inorganic insulating materials.

[0074] The buffer layer 120 is located on the barrier layer 115. The buffer layer 120 can block impurities that may diffuse from the substrate 110 to the semiconductor layer 154 during the formation of the semiconductor layer 154 and reduce the stress on the substrate 110. The buffer layer 120 can include inorganic insulating materials such as silicon oxide and silicon nitride.

[0075] Here, the sum of the thicknesses of the barrier layer 115 and the buffer layer 120 may be approximately to about As an example, it could be about According to an embodiment, when the barrier layer 115 and the buffer layer 120 include an organic insulating substance, the sum of the thicknesses of the barrier layer 115 and the buffer layer 120 may be about 6 μm to about 10 μm, and as an example, may be about 7.8 μm.

[0076] The following description will be mainly based on the flat area FA and the first upper bent portion BA1 - 1 in the first bent area BA1 .

[0077] A first opening C1 may be formed in the barrier layer 115 and the buffer layer 120 so that the substrate 110 is exposed in a portion corresponding to the first bending area BA1. That is, the barrier layer 115 and the buffer layer 120 do not exist in the first bending area BA1. In this way, by removing a portion of the inorganic film in the first bending area BA1, the thickness of the bending area BA is reduced, thereby reducing the stress on the first bending area BA1. Through this, not only the first bending area BA1, but also cracks and other defects transmitted through it to the flat area FA or other peripheral parts are prevented from occurring, thereby improving the quality of the display device 100.

[0078] The semiconductor layer 154 of the transistor TR is located on the buffer layer 120. The semiconductor layer 154 includes a channel region overlapping the gate electrode 124 and a source region and a drain region doped on both sides thereof. The semiconductor layer 154 may include polysilicon, amorphous silicon, or an oxide semiconductor.

[0079] The first insulating layer 140 including an inorganic insulating material such as silicon oxide or silicon nitride is located on the semiconductor layer 154. The first insulating layer 140 may be referred to as a gate insulating layer.

[0080] The scanning line and the gate conductor including the gate electrode 124 of the transistor TR are located on the first insulating layer 140. The gate conductor may include metals such as molybdenum (Mo), copper (Cu), aluminum (Al), silver (Ag), chromium (Cr), tantalum (Ta), titanium (Ti), or metal alloys.

[0081] The second insulating layer 160 is located on the first insulating layer 140 and the gate conductor. The second insulating layer 160 may include inorganic insulating materials such as silicon oxide and silicon nitride. The second insulating layer 160 may be called an interlayer insulating layer.

[0082] Hereinafter, the barrier layer 115 , the buffer layer 120 , the first insulating layer 140 , and the second insulating layer 160 may be collectively referred to as an inorganic continuous film.

[0083] In the first insulating layer 140 and the second insulating layer 160, a second opening C2 is formed in the first bending area BA1 corresponding to the first lower bending portion BA1-3. That is, the second opening C2 is formed in the first lower bending portion BA1-3, and the first insulating layer 140 and the second insulating layer 160 are removed at the same time, so that any one of the blocking layer 115, the buffer layer 120, the first insulating layer 140 and the second insulating layer 160 may not exist. In this way, there is no inorganic continuous film in the first lower bending portion BA1-3, so that when the first bending area BA1 is toward the bottom of the display device 100 ( Figure 2 When bent (reference), it can bend more flexibly.

[0084] Referring to the first opening C1, in the display device 100 according to an embodiment, the first opening C1 having a wider area than the second opening C2 is formed before the second opening C2, so that the thickness of the entire inorganic continuous film can be reduced across the entire first bending area BA1. This process sequence is applicable to all of the 11-mask and 13-mask processes for manufacturing the display device 100 as an example.

[0085] The data line, the driving voltage line, the voltage transmission line, and the data conductor including the source electrode 173 and the drain electrode 175 of the transistor TR are located on the second insulating layer 160. The source electrode 173 and the drain electrode 175 can be connected to the source region and the drain region of the semiconductor layer 154 respectively through the contact holes formed in the second insulating layer 160 and the first insulating layer 140. The voltage transmission line 177 can transmit the common voltage (ELVSS). The data conductor can include a metal or a metal alloy such as aluminum (Al), copper (Cu), silver (Ag), gold (Au), platinum (Pt), palladium (Pd), nickel (Ni), molybdenum (Mo), tungsten (W), titanium (Ti), chromium (Cr), tantalum (Ta). The data conductor can be a multi-layer such as titanium / aluminum / titanium (Ti / Al / Ti), titanium / copper / titanium (Ti / Cu / Ti), molybdenum / aluminum / molybdenum (Mo / Al / Mo).

[0086] The gate electrode 124, the source electrode 173, and the drain electrode 175 constitute a transistor TR together with the semiconductor layer 154. In the transistor TR shown in the figure, the gate electrode 124 is located above the semiconductor layer 154, but the structure of the transistor TR is not limited to this and can be variously changed.

[0087] The third insulating layer 180 is located on the second insulating layer 160 and the data conductors. The third insulating layer 180 may include an organic insulating material, such as polyimide, acrylic polymer, siloxane polymer, etc.

[0088] The first electrode E1 of the light emitting element LD is located on the third insulating layer 180. The first electrode E1 can be connected to the drain electrode 175 through a contact hole formed in the third insulating layer 180. The connecting part 195 connected to the voltage transmission line 177 is located on the third insulating layer 180. In order to connect the connecting part 195 and the voltage transmission line 177, the part of the third insulating layer 180 overlapping the voltage transmission line 177 is removed. The connecting part 195 as a conductive layer can be formed with the same material in the same process as the first electrode E1. The first electrode E1 and the connecting part 195 can include metals or metal alloys such as silver (Ag), nickel (Ni), gold (Au), platinum (Pt), aluminum (Al), copper (Cu), aluminum neodymium (AlNd), aluminum nickel lanthanum (AlNiLa). The first electrode E1 and the connecting part 195 can also include transparent conductive materials such as indium tin oxide (ITO) and indium zinc oxide (IZO). The first electrode E1 and the connection member 195 may be a multi-layer of ITO / silver (Ag) / ITO, ITO / aluminum (Al), or the like.

[0089] The fourth insulating layer 360 having an opening overlapping the first electrode E1 is located on the third insulating layer 180. The opening of the fourth insulating layer 360 can define each pixel region, which can also be called a partition. The fourth insulating layer 360 can also be included in at least one dam part DM located in the first extension portion BA1-2 of the first bending area BA1. The fourth insulating layer 360 can include an organic insulating material.

[0090] The light emitting layer EL is located on the first electrode E1, and the second electrode E2 is located on the light emitting layer EL. The second electrode E2 is connected to the connection member 195. Since the connection member 195 is connected to the voltage transmission line 177, the second electrode E2 is electrically connected to the voltage transmission line 177 through the connection member 195, and the common voltage (ELVSS) can be applied to the second electrode E2.

[0091] The light emitting layer EL may include a first light emitting layer ELa located in the opening of the fourth insulating layer 360. The light emitting layer EL may further include a bent light emitting layer ELb located in the first upper bent portion BA1-1 and on the fourth insulating layer 360.

[0092] The second electrode E2 is formed of a thin layer of a metal with a low work function such as calcium (Ca), barium (Ba), magnesium (Mg), aluminum (Al), silver (Ag), etc., so that it can have light transmittance. The second electrode E2 can also be formed of a transparent conductive material such as ITO and IZO. The first electrode E1, the light-emitting layer EL, and the second electrode E2 of each pixel PX constitute a light-emitting element LD such as an organic light-emitting diode. One of the first electrode E1 and the second electrode E2 becomes a cathode, and the other becomes an anode.

[0093] At this time, although the transistor TR including the semiconductor layer 154 is located in the flat area FA, the light emitting element LD electrically connected to the transistor TR is also located in the flat area FA and the first upper bent portion BA1-1 extending therefrom. According to the above, the light emitting layer EL located in a part of the first upper bent portion BA1-1 is called a bent light emitting layer ELb.

[0094] The bent light emitting layer ELb may be bent together with the first upper bent portion BA1-1 when it is bent toward the lower side of the display device 100. Figure 2 The first upper bending portion BA1-1 can also realize the first display area DA1 for displaying images.

[0095] Likewise, re-referencing Figure 1 , the bent light emitting layer ELb electrically connected to the transistor TR located in the flat area FA may also be located in the second bending area BA2, the third bending area BA3, and the fourth bending area BA4 which may extend from the upper side, the left side, and the right side of the flat area FA of the display device 100, respectively. Thus, the display device 100 according to an embodiment can display images not only in the flat area FA, but also in the bending areas bent on its respective sides. When the first bending area BA1, the second bending area BA2, the third bending area BA3, and the fourth bending area BA4 are all present, the display device 100 according to an embodiment may be a four-sided light emitting display device.

[0096] The encapsulation layer EN is located on the second electrode E2. The encapsulation layer EN seals the light emitting element LD and can prevent moisture or oxygen from penetrating from the outside. The encapsulation layer EN is stacked with one or more inorganic layers and one or more organic layers. In the illustrated embodiment, the encapsulation layer EN is a thin film encapsulation layer including a first inorganic layer 391, a second inorganic layer 393, and an organic layer 392 located therebetween. The first inorganic layer 391 and the second inorganic layer 393 covering the side of the organic layer 392 are formed to be wider than the organic layer 392, and the first inorganic layer 391 and the second inorganic layer 393 may be in contact at the edge region of the encapsulation layer EN. The organic layer 392 may include acrylic resin, methacrylic resin, polyisoprene resin, vinyl resin, epoxy resin, polyurethane resin, cellulose resin, dinaphthylene resin, etc.

[0097] A polarizing layer for reducing external light reflection may be located on the encapsulation layer EN, and a touch sensor layer including touch electrodes for detecting a touch may be located between the encapsulation layer EN and the polarizing layer.

[0098] In order to explain the first extension portion BA1-2, the dam part DM is located on the second insulating layer 160. The dam part DM may exist to surround the edge of the substrate 110, and may include a first dam DM1 and a second dam DM2. The first dam DM1 and the second dam DM2 may be located in the first bending area BA1 located below the display device 100. The lower layer of the first dam DM1 may be the third protective layer 365a, and the upper layer of the first dam DM1 may be the bending protective layer 400a. The second dam DM2 may be composed of the second protective layer 185b, the third protective layer 365b, and the bending protective layer 400b in sequence from the bottom. The bending protective layers 400a and 400b constituting the dam part DM are also called spacers.

[0099] The dam part DM can prevent organic substances such as monomers from flowing out when the organic layer 392 of the encapsulation layer EN is formed, so that the edge of the organic layer 392 of the encapsulation layer EN can be roughly located inside the dam part DM, that is, between the dam part DM and the display area DA.

[0100] The first and second inorganic layers 391 and 393 constituting the encapsulation layer EN may be formed to extend onto the first and second dams DM1 and DM2. In this case, since the contact area of ​​the first and second inorganic layers 391 and 393 increases, adhesion between the first and second inorganic layers 391 and 393 can be increased.

[0101] In the first lower bending portion BA1-3, the connection wiring 179 that electrically connects the first wiring 127 and the second wiring 129 located on both sides of the first lower bending portion BA1-3 is located in the first lower bending portion BA1-3. Figure 7 ) output (for example, data signals, control signals, voltage signals), signals input to the pads of the pad portion (not shown) (for example, driving voltage ELVDD, common voltage ELVSS), etc. can be transmitted to the display area DA, the driving device, etc. through the second wiring 129, the connecting wiring 179 and the first wiring 127.

[0102] The connection wiring 179 bends when the first lower bending portion BA1-3 is bent, and thus can be formed of a metal having good flexibility and a small Young's modulus. The connection wiring 179 can be formed of the same material in the same process as the source electrode 173 and the drain electrode 175. If the flexibility of the connection wiring 179 increases, the stress for deformation (strain) becomes smaller, thereby reducing the risk of cracks, degradation, or disconnection when bending.

[0103] In the first lower bend portion BA1-3, a first protection layer 165 is located between the substrate 110 and the connection wiring 179. The first protection layer 165 may include organic insulating materials such as polyimide, acrylic polymer, and siloxane polymer. The first protection layer 165 may exist in the area corresponding to the first lower bend portion BA1-3 to fill the first opening C1 formed in the barrier layer 115 and the buffer layer 120 and the second opening C2 formed in the first insulating layer 140 and the second insulating layer 160. In other words, the substrate 110 exposed by the first opening C1 and the second opening C2 may be covered by the first protection layer 165. By forming the first opening C1 and the second opening C2 to be covered by the organic film of the first protection layer 165, the first lower bend portion BA1-3 can be flexibly bent toward the bottom of the display device 100, and stress can be prevented from being generated.

[0104] The second protective layer 185 and the third protective layer 365 are located on the connection wiring 179. The second protective layer 185 may be formed of the same material in the same process as the third insulating layer 180. The third protective layer 365 may be formed of the same material in the same process as the fourth insulating layer 360.

[0105] A bending protection layer 400 for relieving tensile stress and protecting the connection wiring 179 is located on the third protection layer 365. The bending protection layer 400 may be called a stress neutralization layer. The bending protection layer 400 may include an organic insulating material such as acrylic resin.

[0106] In a flexible display device, the inorganic insulating layer is vulnerable to cracks when bent, and the cracks may cause damage to the wiring. To this end, according to one embodiment of the present disclosure, the inorganic continuous film containing an inorganic insulating substance, namely the barrier layer 115, the buffer layer 120, the first insulating layer 140 and the second insulating layer 160, can be removed from the first lower bending portion BA1-3. Furthermore, a portion of the inorganic continuous film, namely the barrier layer 115 and the buffer layer 120, is removed not only in the first lower bending portion BA1-3, but also in the first extension portion BA1-2 and the first upper bending portion BA1-1 adjacent thereto. Therefore, when the first bending area BA1 is bent, the stress across the entire first bending area BA1 is reduced, which enables a more flexible bending. In addition, defects such as cracks, degradation and broken wires generated in the display device 100 can be improved, thereby improving display quality and stability.

[0107] On the other hand, the bent light emitting layer ELb is located in a part of the first bent area BA1 (for example, the first upper bent portion BA1-1), so that images can also be displayed on the side bent portions of each side of the flat area FA of the display device 100. In particular, images are displayed not only on the left and right sides of the flat area FA, but also on the first bent area BA1 located at the lower side, so there is an advantage that the area of ​​the peripheral area where no image is displayed can be further reduced.

[0108] Below, use Figure 4 , briefly describing the characteristics of a display device according to an embodiment. Figure 4 It briefly shows the Figure 1 The following is a cross-sectional view of the cross section of the III-III' line. Figure 3 The description of the same or similar parts as those described in the drawings may be omitted, and the description will be mainly based on the characteristic parts.

[0109] refer to Figure 4 According to an embodiment, the display device 100 may include a substrate 110, a plurality of layers formed on the substrate 110, a plurality of wirings, etc. The display device 100 includes a flat area FA, a first bending area BA1 adjacent thereto, and the first bending area BA1 may include a first upper bending portion BA1-1 and a first lower bending portion BA1-3. For ease of description, the aforementioned first extension portion BA1-2 is omitted.

[0110] The barrier layer 115 and the buffer layer 120 are sequentially disposed on the substrate 110, which may be a flexible substrate. At this time, a first opening C1 is formed in the barrier layer 115 and the buffer layer 120 at a portion corresponding to the first bending area BA1, so that the substrate 110 is exposed. That is, the barrier layer 115 and the buffer layer 120 do not exist at the portion corresponding to the first bending area BA1. The sum of the thickness of the barrier layer 115 and the buffer layer 120 may be about to about As an example, it could be about

[0111] The semiconductor layer 154 is located on the buffer layer 120. The semiconductor layer 154 may include a channel region overlapping the gate electrode 124 and a source region and a drain region doped at both sides thereof.

[0112] The first insulating layer 140 including an inorganic insulating material is located on the semiconductor layer 154. The scanning line, including the transistor TR (reference Figure 3 ) of the gate electrode 124 (reference Figure 3 ) is located on the first insulating layer 140. In this embodiment, the gate conductor may further include a data signal transmission layer 121 at a portion corresponding to the first upper bending portion BA1-1. The data signal transmission layer 121 can be used to transmit the data signal from the printed circuit board PCB (reference Figure 7 ) output data signals to the display area DA.

[0113] The 1-1 insulating layer 145 may be further disposed on the gate conductor. The 1-1 insulating layer 145 may be a thin inorganic insulating film for protecting the gate conductor.

[0114] The second insulating layer 160 is located on the 1-1 insulating layer 145. The second insulating layer 160 may include an inorganic insulating material and may also be referred to as an interlayer insulating layer.

[0115] In the region corresponding to the first lower bending portion BA1-3, a second opening C2 is formed in the first insulating layer 140, the 1-1 insulating layer 145, and the second insulating layer 160. When the second opening C2 is formed in the first lower bending portion BA1-3, the first insulating layer 140, the 1-1 insulating layer 145, and the second insulating layer 160 can be removed. A first protective layer 165 may be provided to fill the first opening C1 and the second opening C2 formed in the first lower bending portion BA1-3.

[0116] Data lines, driving voltage lines, voltage transmission lines, including transistors TR (reference Figure 3 ) of the source electrode 173 (reference Figure 3 ) and drain electrode 175 (reference Figure 3 ) is located on the second insulating layer 160. The data conductor 170 may be electrically connected to the gate conductor located thereunder in the region corresponding to the flat region FA and the first upper bent portion BA1-1 to form a transistor TR (refer to Figure 3 ) part.

[0117] The third insulating layer 180 is located on the second insulating layer 160 and the data conductor 170. The third insulating layer 180 may include an organic insulating substance.

[0118] The upper connection wiring 175a may be located on the third insulating layer 180. An opening may be formed in the third insulating layer 180 so that the upper connection wiring 175a is electrically connected to the data conductor 170 located therebelow. Here, the upper connection wiring 175a located in the flat area FA and the first upper bent portion BA1-1 may correspond to the upper connection wiring 175a constituting the light emitting element LD (refer to Figure 3 ) of the first electrode E1 (reference Figure 3 That is, although not shown in the figure for convenience of explanation, it also includes a light-emitting layer EL (refer to Figure 3 ) and the second electrode E2 (reference Figure 3 ) can be located on the upper connection wiring 175a. Thus, when the first bending area BA1 is bent toward the lower side of the display device 100, the light emitting element LD can also be located on the lower side of the bend, and an image can also be displayed on the lower side of the bend.

[0119] According to the foregoing, the display device 100 according to one embodiment removes the inorganic continuous film in the first bending area BA1, and in particular, removes a portion of the inorganic continuous film, namely the barrier layer 115 and the buffer layer 120, in the first upper bending portion BA1-1 adjacent to the flat area FA of the display device 100, thereby significantly reducing the thickness of the inorganic continuous film in the first bending area BA1. Therefore, in the flexible display device 100, by alleviating the stress and impact received by the bending area when being bent, defects such as cracks, wiring damage, disconnection, and degradation in the display device 100 can be prevented.

[0120] Below, use Figure 5 , briefly describing the characteristics of a display device according to an embodiment. Figure 5 It briefly shows the Figure 1 Another example of a cross-sectional view of the III-III' line. Figure 4 The different parts of the embodiments are mainly described.

[0121] refer to Figure 5 According to an embodiment, the display device 100 may include a substrate 110, a blocking layer 115, a buffer layer 120, a semiconductor layer 154, a first insulating layer 140, a gate conductor, a second insulating layer 160, a data conductor 170, a third insulating layer 180, and an upper connection wiring 175a.

[0122] At this time, there is no 1-1 insulating layer 145 on the gate conductor (refer to Figure 4) and the second insulating layer 160 is directly located on the gate conductor. The first opening C1 and the second opening C2 formed in the region corresponding to the first lower bending portion BA1-3 may be filled with the third protective layer 180 instead of the first protective layer 165 (refer to Figure 4 ). Based on this, Figure 4 Compared with the display device 100, it has the advantages of reducing the number of masks and reducing the process and cost.

[0123] Below, use Figure 6 and Figure 7 , a display device according to an embodiment is described. Figure 6 is an exploded perspective view schematically showing a display device according to an embodiment, Figure 7 It shows that Figure 6 A cross-sectional view of the cross section taken along line VII-VII'.

[0124] and Figure 6 Reference together Figure 7 According to an embodiment, the display device 1000 further includes a window member W, a support member SM, and a rear housing 500 .

[0125] The window member W is arranged above the display device 100' and may have a partially bent shape to correspond to the shape of the display device 100'. The top of the window member W may correspond to the flat area FA of the display device 100'. The window member W may be made of transparent materials such as glass, sapphire, and plastic.

[0126] The window component W may include a window top WF, a first window bending portion W1, a second window bending portion W2, a third window bending portion W3, and a fourth window bending portion W4. The window top WF, the first window bending portion W1, the second window bending portion W2, the third window bending portion W3, and the fourth window bending portion W4 may not be physically separated, but are distinguished and explained from a convenient perspective in this embodiment.

[0127] The top surface WF of the window may be parallel to the plane defined by the first direction and the second direction and have a flat shape. In this embodiment, when viewed from the third direction, the top surface WF of the window may be defined as a quadrilateral shape with chamfered edges and corners to form a curve, but is not limited thereto.

[0128] The first window bending portion W1, the second window bending portion W2, the third window bending portion W3, and the fourth window bending portion W4 can extend from the four sides of the upper surface WF of the window, respectively, and have a shape bent based on each of the four sides of the upper surface WF of the window. The first window bending portion W1, the second window bending portion W2, the third window bending portion W3, and the fourth window bending portion W4 can be bent in the upper direction of the window component W to the lower direction.

[0129] The first window bending portion W1 may include a first window upper bending portion W1-1 and a first window extension portion W1-2. The second window bending portion W2 may include a second window upper bending portion W2-1 and a second window extension portion W2-2. Similarly, although not shown in the figure, the third window bending portion W3 may include a third window upper bending portion and a third window extension portion, and the fourth window bending portion W4 may include a fourth window upper bending portion W4-1 and a fourth window extension portion W4-2.

[0130] The first window bending portion W1, the second window bending portion W2, the third window bending portion W3, and the fourth window bending portion W4 may correspond to the shapes of the first bending area BA1, the second bending area BA2, the third bending area BA3, and the fourth bending area BA4 of the display device 100', respectively.

[0131] The display device 100 ′ and Figure 1 and Figure 2 The structure of the display device 100 described in FIG. 1 is the same as that of the display device 100 described in FIG. 1 , and therefore, detailed description thereof is omitted. Figure 7 The display device 1000 includes a flexible printed circuit board (FPCB) and a printed circuit board (PCB).

[0132] The flexible printed circuit board FPCB has a flexible characteristic and can electrically connect the display device 100' and the printed circuit board PCB. The flexible printed circuit board FPCB and the printed circuit board PCB can be arranged at one end of the first lower bending portion BA1-3 of the first bending area BA1. The printed circuit board PCB can output an electrical signal to the display device 100' or receive an electrical signal from the display device 100' through the flexible printed circuit board FPCB.

[0133] The display device 100' may be located under the window member W. As described above, the pixels PX are formed in the display device 100', so that an image can be displayed. The display device 100' may be an organic light emitting display device (Organic Light Emitting Display) including a light emitting element LD.

[0134] The display device 100' may include a flat area FA, a first bending area BA1, a second bending area BA2, a third bending area BA3, and a fourth bending area BA4. The flat area FA may be parallel to a plane defined by the first direction and the second direction and have a flat shape. The flat area FA may overlap with the upper surface WF of the window.

[0135] Chamfered portions CP may exist between the bending areas BA1, BA2, BA3, and BA4 to facilitate bending of the first bending area BA1, the second bending area BA2, the third bending area BA3, and the fourth bending area BA4 along the four sides of the flat area FA.

[0136] The first upper bending portion BA1-1, the second upper bending portion BA2-1, the third upper bending portion (not shown), the fourth upper bending portion (not shown) (refer to Figure 2 ) extend from the four sides of the flat area FA respectively, and may have a shape that is bent toward the lower side of the display device 100' based on each of the four sides of the flat area FA.

[0137] Although not shown, the touch screen panel may also be located between the window member W and the display device 100'. The touch screen panel may include an area capable of sensing a touch from the outside, namely a touch area, and a touch frame area located around the touch area. A plurality of touch units may be formed in the touch area. The touch unit is a unit capable of sensing an external touch, including at least one touch electrode, capable of sensing a touch from the outside in a variety of ways such as a mutual capacitive type or a self-capacitive type, and outputting a touch output signal.

[0138] The support member SM may be located at the back of the display device 100'. The support member SM may include a first bending area BA1, a second bending area BA2, a third bending area BA3, and a fourth bending area BA4. The first support member SM1, the second support member SM2, the third support member SM3, and the fourth support member SM4 may be located at positions corresponding to the first support member SM1, the second support member SM2, the third support member SM3, and the fourth support member SM4 located at the four sides of the display device 100'.

[0139] The support member SM is arranged corresponding to the bending area BA of the display device 100', thereby supporting the bending area BA of the display device 100', and improving the structural strength of the display device 100'. In addition, by arranging the peripheral area PA of the display device 100' at a position that does not overlap with the window member W through the support member SM, and arranging the bending area BA of the display device 100' that displays an image at a position that overlaps with the window member W, the area where the image is not displayed, that is, the peripheral area PA, can be reduced in the display device 100'.

[0140] The rear case 500 may be combined with the window member W to accommodate the display device 100 ′ and the support member SM. The rear case 500 may include plastic or metal.

[0141] The display device 1000 according to an embodiment may further include an electronic component 600. The electronic component 600 may be disposed in a space between the lower portion of the display device 100' and the support member SM. The electronic component 600 may be a component for operating the display device 1000, such as a battery or various sensors.

[0142] The embodiments of the present disclosure are described in detail above, but the scope of rights of the present disclosure is not limited thereto. Various modifications and improvements made by those skilled in the art using the basic concepts of the present disclosure defined in the claims also fall within the scope of rights of the present disclosure.

Claims

1. A display device, wherein: The display device includes a substrate, wherein the substrate includes a flat region and a first bending region adjacent to the flat region. The first bending region includes a first upper bending portion, a first extending portion, and a first lower bending portion in sequence in a direction away from the flat region. A transistor is arranged in the flat area, The light emitting element electrically connected to the transistor is located in the flat area and the first upper bent portion, The light emitting element includes a bent light emitting layer, so that an image is displayed in the flat area and the first upper bent portion. The thickness of the inorganic continuous film located in the first bending region is thinner than the thickness of the inorganic continuous film located in the flat region. The inorganic continuous film includes a barrier layer, a buffer layer, a first insulating layer and a second insulating layer. The barrier layer and the buffer layer do not exist in the first bending region. The first insulating layer and the second insulating layer do not exist in a portion of the first bending region, and the first insulating layer and the second insulating layer exist in the remaining portion of the first bending region, and the substrate and the first insulating layer are in contact with each other.

2. The display device according to claim 1, wherein: In a portion corresponding to the flat area, the barrier layer and the buffer layer are sequentially located on the substrate.

3. The display device according to claim 1, wherein: The transistor includes a semiconductor layer, a gate electrode on the semiconductor layer, and a source electrode and a drain electrode electrically connected to the gate electrode.

4. The display device according to claim 3, wherein: The semiconductor layer is located on the buffer layer, The first insulating layer is located on the semiconductor layer. A gate conductor including the gate electrode is located on the first insulating layer, The second insulating layer is located on the gate conductor, A data conductor including the source electrode and the drain electrode is located on the second insulating layer.

5. The display device according to claim 1, wherein: A first opening is formed in the barrier layer and the buffer layer at a portion corresponding to the first bending region. In a region corresponding to the first lower bent portion, a second opening is further formed in the first insulating layer and the second insulating layer, and the second opening overlaps with the first opening. The first opening and the second opening are filled with a first protective layer, The first protective layer includes an organic substance.

6. The display device according to claim 1, wherein: The bent light emitting layer is located at a portion corresponding to a portion of the flat area and a portion of the first upper bent portion.

7. The display device according to claim 1, wherein: The sum of the thickness of the barrier layer and the buffer layer is to 8. The display device according to claim 1, wherein: The first bending region is bent downward of the flat region based on a side of the adjacent flat region.

9. The display device according to claim 1, wherein: The first upper bent portion, the first extending portion, and the first lower bent portion are bent based on mutually adjacent sides.

10. The display device according to claim 1, wherein: At least one of a second bending area, a third bending area, and a fourth bending area is also included along the edge of the flat area.

11. The display device according to claim 10, wherein: The second bending region, the third bending region, and the fourth bending region are bent downward of the flat region based on the sides of the adjacent flat region.

12. The display device according to claim 10, wherein: The bent light emitting layer is located in the second bent region, the third bent region, and a portion of the fourth bent region to display images.

13. The display device according to claim 4, wherein: A third insulating layer is located on the data conductor, The first electrode is located on the third insulating layer, The light-emitting layer is located on the first electrode, The second electrode is located on the light-emitting layer, The light emitting element is composed of the first electrode, the light emitting layer, and the second electrode. The light-emitting layer includes a first light-emitting layer and the bent light-emitting layer.

14. The display device according to claim 13, wherein: The fourth insulating layer is located on the first electrode, The bent light emitting layer is located on the fourth insulating layer and below the second electrode.

15. The display device according to claim 4, wherein: A connection wiring made of the same material as the data conductor is located in a region corresponding to the first lower bent portion. The connection wiring electrically connects the first wiring and the second wiring located on both sides of the first lower bending portion, thereby transmitting an electrical signal to the first upper bending portion and the flat area.

16. The display device according to claim 15, wherein: The connection wiring is bent together with the first lower bent portion when it is bent.

17. The display device according to claim 13, wherein: A packaging layer is also included on the light emitting element to cover the light emitting element. The encapsulation layer includes one or more inorganic layers and one or more organic layers.

Images