A Hall chip aging test device and test method

Abstract

The present invention discloses a Hall chip aging test device, comprising a base, on which one or more aging test bodies are fixed; the aging test body comprises a first coil frame and a second coil frame which are coaxially arranged and detachable, a first coil is wound on the first coil frame, a second coil is wound in the second coil frame, the leads of the first coil and the second coil are welded to form a coil wound in one line, the winding directions of the first coil and the second coil are the same, a PCB pin amplifier board is placed between the first coil frame and the second coil frame; the coil of each aging test body is connected to an integrated bus, and the amplified end on the PCB pin amplifier board of each aging test body is led out through another integrated bus; the present invention also discloses a Hall chip aging test method. The present invention solves the problem that the aging test existing in the prior art is difficult to implement in batches.

Description

Technical Field

[0001] The invention belongs to the technical field of integrated circuit testing, and relates to a Hall chip aging testing device. The invention also relates to a testing method using the device. Background Art

[0002] The Hall chip is a magnetic sensor based on the Hall effect. Due to its magnetoelectric characteristics, high cost performance, stable performance and other characteristics, it is widely used to detect magnetic fields and their changes or various applications related to magnetic fields. There are currently a variety of packaging forms, the most common ones are TO92S, SOT23, TO94, SOT89, etc., and the aging test after packaging is often difficult to achieve in batches. It often takes dozens of hours to test the parameters of a Hall chip at full temperature, and the aging test takes thousands of hours. There are many steps, which makes the aging test of the Hall chip very difficult. Summary of the invention

[0003] The purpose of the present invention is to provide a Hall chip aging test device, which solves the problem in the prior art that aging tests are difficult to implement in batches.

[0004] The technical solution adopted by the Hall chip aging test device of the present invention is:

[0005] A Hall chip aging test device comprises a base, on which one or more aging test bodies are fixed; the aging test body comprises a first coil frame and a second coil frame which are coaxially arranged and detachable, a first coil is wound on the first coil frame, a second coil is wound in the second coil frame, leads of the first coil and the second coil are welded to form a coil wound in one line, the first coil and the second coil have the same winding direction, and a PCB pin amplifier board is placed between the first coil frame and the second coil frame;

[0006] The coil of each aging test body is connected to an integrated bus, and the amplifying end on the PCB pin amplifier board of each aging test body is led out through another integrated bus.

[0007] The present invention is also characterized in that:

[0008] The first coil frame is fixed on the base, a first fixing plate is fixed on the base, one end face of the first fixing plate is fixed on the base close to the first coil frame, the other end of the first fixing plate is rotatably connected to the other end of the second fixing plate, the second coil frame is fixed on the plate surface of the second fixing plate, and the second fixing plate can be coaxially placed with the first fixing plate by the second fixing plate rotating on the first fixing plate.

[0009] The first coil frame and the second coil frame are both made of aluminum, and the coils are high temperature resistant enameled copper wires.

[0010] A groove is formed on the end surface of the contact surface between the first coil frame and the second coil frame, and the PCB pin amplifier board is placed in the groove.

[0011] The PCB pin amplifier board is also provided with a fixing hole, and a boss matching the fixing hole is also arranged in the groove.

[0012] It also includes a chip aging test seat, and the pins of the chip aging test seat are welded to the pin ends of the PCB pin amplifier board.

[0013] Another object of the present invention is to provide a Hall chip aging test method.

[0014] Another technical solution of the present invention is:

[0015] A Hall chip aging test method, the specific steps are:

[0016] Step 1: Place the Gauss meter probe between the first coil frame and the second coil frame, pass current through the coil, and obtain the coefficient of magnetic field and current through the current change. ;

[0017] Step 2, take out the Gauss meter probe, connect the Hall chip to the PCB pin amplifier board through the pins of the chip aging test socket or directly connect it to the PCB pin amplifier board package and then put the PCB pin amplifier board into the groove; connect the test equipment between the two integrated buses;

[0018] Step 3, gradually increase or decrease the current value according to the coefficient The sensitivity of the Hall chip can be calculated based on the data obtained from the measuring equipment;

[0019] In step 4, a Hall chip aging test device can be placed in a high and low temperature humidity chamber, and different temperature points or humidity points can be set on the temperature and humidity chamber. When the temperature or humidity reaches the set value, the parameters of the Hall chip can be tested again. When the temperature or humidity reaches the set value, the test method is the same as step 3.

[0020] The specific steps of step 1 are as follows:

[0021] Take out the PCB pin amplifier board and the chip aging test socket from between the first coil frame and the second coil frame, place the Gauss meter probe between the first coil frame and the second coil frame, pass current through the coil, adjust the current size, obtain the size of the magnetic field under different currents, and then obtain the linear relationship between current and magnetic field, and calculate the coefficient of magnetic field and current. :

[0022] (1)

[0023] in is the magnetic field, is the current, It is the coefficient of current and magnetic field, and its unit is Gs / A.

[0024] The specific steps of step 2 are as follows:

[0025] Take out the Gaussmeter, connect the Hall chip under test to the PCB pin amplifier board through the pins of the chip aging test socket or directly connect it to the PCB pin amplifier board package, then put the PCB pin amplifier board into the groove to ensure that the chip is placed in the center of the coil, and buckle the first coil frame and the second coil frame to place them coaxially; connect the current source device, source meter device, multimeter, and oscilloscope between the two integrated buses.

[0026] The specific steps of step 3 are as follows:

[0027] When testing the Hall switch chip, gradually increase or decrease the current value, observe the value change on the oscilloscope or ammeter, record the current threshold on the current source device at the switching point, and record the current value x at this time. Calculate the relationship between current and magnetic field according to step 1 The value can be used to calculate the magnitude of the magnetic field at this time:

[0028] y= * x(2)

[0029] Where y is the magnetic field threshold of the Hall switch chip, and x is the current value of the current source device when the Hall switch chip is working;

[0030] When testing the linear Hall chip, gradually increase or decrease the current value, observe the change in the voltage value on the multimeter, and record the relationship between the current on the current source and the voltage value on the multimeter. For example, when the current of the current source is I0, the corresponding voltage value on the multimeter is V0, and when the current of the current source is I1, the corresponding voltage value on the multimeter is V1. At this time, the sensitivity of the linear Hall chip can be calculated as:

[0031] (3)

[0032] Where Sens is the sensitivity of the linear Hall chip, I0 is the current of the first point current source device, I1 is the current of the second point current source device, V0 is the voltage value measured by the multimeter when the first point current source device current is 0, and V1 is the voltage value measured by the multimeter when the second point current source device current is 0.

[0033] The beneficial effects of the present invention are:

[0034] 1. The present invention adopts non-magnetic materials to make the frame, especially aviation aluminum, which has low cost, is non-magnetic, has high hardness, has good magnetic concentration of the wound coil, and can withstand high temperatures.

[0035] 2. Aluminum material is used as the coil frame in this device, which will not affect the lifespan with the length of use. Other structures, such as enameled copper wire, interface, integrated bus, etc., are easy to repair when failure occurs.

[0036] 3. Use the integrated bus method to connect multiple coils in parallel, set the test parameters, and realize automated batch testing.

[0037] 4. According to the magnetic effect of current. When the coil is energized, a magnetic field is generated. A Gaussmeter is used to measure the relationship between the current and the magnetic field. A PCB circuit board is used to amplify the pins. A chip aging test seat is used to position the pins. These auxiliary structures and equipment are used to improve the test accuracy. Specifically: 1. The present invention uses two upper and lower coils to generate a large magnetic field and a wide test range. 2. A Gaussmeter can be used to measure the precise relationship between the current and the magnetic field. 3. The present invention uses two upper and lower coils, fixes the PCB on the lower coil, fixes the chip aging test seat on the PCB, and sets the height so that the chip to be tested is located in the middle of the upper and lower coils to obtain an accurate and uniform magnetic field.

[0038] 5. The device of the present invention can be used in high and low temperature environments, and can measure the threshold values ​​of Hall switch chips and linear Hall chips under all temperatures. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 It is a structural diagram of a Hall chip aging test device of the present invention;

[0040] Figure 2 This is a connection relationship diagram between a PCB pin amplifier board and a chip aging test socket in a Hall chip aging test device of the present invention;

[0041] Figure 3 It is a structural diagram of a PCB pin amplifier board in a Hall chip aging test device of the present invention.

[0042] In the figure, 1. base, 2. first fixing plate, 3. first coil, 4. first coil frame, 5. second coil frame, 6. second coil, 7. second fixing plate, 8. groove, 9. PCB pin amplifier board, 9-1. fixing hole, 10. chip aging test socket, 11. integrated bus. DETAILED DESCRIPTION

[0043] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments.

[0044] A Hall chip aging test device, such as Figure 1 Figure 2 and Figure 3, comprising a base 1, on which one or more aging test bodies are fixed; the aging test body comprises a first coil frame 4 and a second coil frame 5 which are coaxially arranged and detachable, a first coil 3 is wound on the first coil frame 4, a second coil 6 is wound in the second coil frame 5, the leads of the first coil 3 and the second coil 6 are welded to form a coil wound in one line, the first coil 3 and the second coil 6 have the same winding direction, and a PCB pin amplifier board 9 is placed between the first coil frame 4 and the second coil frame 5;

[0045] The coil of each aging test body is connected to an integrated bus 11 , and the amplified end on the PCB pin amplifier board 9 of each aging test body is led out through another integrated bus 11 .

[0046] The first coil frame 4 is fixed on the base 1, and the first fixed plate 2 is also fixed on the base 1. One end face of the first fixed plate 2 is fixed on the base 1 close to the first coil frame 4. The other end of the first fixed plate 2 is rotatably connected to the other end of the second fixed plate 7. The second coil frame 5 is fixed on the plate surface of the second fixed plate 7. The second fixed plate 7 can be coaxially placed with the first fixed plate 2 by rotating the second fixed plate 7 on the first fixed plate 2.

[0047] The first coil frame 4 and the second coil frame 5 are both made of aluminum, and the coils are high temperature resistant enameled copper wires.

[0048] A groove 8 is formed on the end surface of the contact surface between the first coil frame 4 and the second coil frame 5 , and a PCB pin amplifier board 9 is placed in the groove 8 .

[0049] It also includes a chip aging test socket 10, and the pins of the chip aging test socket 10 are welded to the pin ends of the PCB pin amplifier board 9.

[0050] A fixing hole 9-1 is also provided on the PCB pin amplifier board 9, and a boss matching the fixing hole 9-1 is also provided in the groove.

[0051] Another technical solution of the present invention is a Hall chip aging test method, which specifically comprises the following steps:

[0052] Step 1: Place the Gauss meter probe between the first coil frame 4 and the second coil frame 5, pass current through the coil, and obtain the coefficient of magnetic field and current through the current change. ;

[0053] Step 2, take out the Gauss meter probe, connect the Hall chip to the PCB pin amplifier board 9 through the pins of the chip aging test socket 10 or directly connect the PCB pin amplifier board 9 to the PCB pin amplifier board 9 and then put the PCB pin amplifier board 9 into the groove 8; connect the test equipment between the two integrated buses 11;

[0054] Step 3, gradually increase or decrease the current value according to the coefficient The sensitivity of the Hall chip can be calculated based on the data obtained from the measuring equipment;

[0055] In step 4, a Hall chip aging test device can be placed in a high and low temperature humidity chamber, and different temperature points or humidity points can be set on the temperature and humidity chamber. When the temperature or humidity reaches the set value, the parameters of the Hall chip can be tested again. When the temperature or humidity reaches the set value, the test method is the same as step 3.

[0056] The specific steps of step 1 are as follows:

[0057] Step 1, take out the PCB pin amplifier board 9 and the chip aging test seat 10 from between the first coil frame 4 and the second coil frame 5, place the Gauss meter probe between the first coil frame 4 and the second coil frame 5, and pass current into the coil. At this time, the Gauss meter can measure the current size, adjust the current size, and obtain the size of the magnetic field under different currents, and then obtain the linear relationship between the current and the magnetic field, and calculate the coefficient of the magnetic field and the current. :

[0058] (1)

[0059] in is the magnetic field, is the current, It is the coefficient of current and magnetic field, and its unit is Gs / A.

[0060] The specific steps of step 2 are as follows:

[0061] Take the Gauss meter out from between the first coil frame 4 and the second coil frame 5.

[0062] The Hall chip to be tested is connected to the PCB pin amplifier board 9 through the pins of the chip aging test socket 10 or directly connected to the PCB pin amplifier board 9 through encapsulation, and then the PCB pin amplifier board 9 is placed in the groove 8 to ensure that the chip is placed in the center of the coil, and the first coil frame 4 and the second coil frame 5 are buckled so that they are coaxially placed; the fixing hole 9-1 can be placed in conjunction with the boss to ensure that the chip is placed in the center of the coil;

[0063] The coil is connected to the current source device, source meter device, multimeter, oscilloscope and other testing equipment through the integrated bus 11, that is, the positive and negative poles of the current source device are connected to the integrated bus of the coil; the source meter device, multimeter, oscilloscope and other testing equipment are connected to the amplifying end of the PCB pin amplifier board 9 through the integrated bus 11.

[0064] The specific steps of step 3 are as follows:

[0065] When testing the Hall switch chip, gradually increase or decrease the current value, observe the value change on the oscilloscope or ammeter, record the current threshold on the current source device at the switching point, and record the current value x at this time. Calculate the relationship between current and magnetic field according to step 1 The value can be used to calculate the magnitude of the magnetic field at this time:

[0066] y= * x(2)

[0067] Where y is the magnetic field threshold of the Hall switch chip, and x is the current value of the current source device when the Hall switch chip is working;

[0068] When testing the linear Hall chip, gradually increase or decrease the current value, observe the change in the voltage value on the multimeter, and record the relationship between the current on the current source and the voltage value on the multimeter. For example, when the current of the current source is I0, the corresponding voltage value on the multimeter is V0, and when the current of the current source is I1, the corresponding voltage value on the multimeter is V1. At this time, the sensitivity of the linear Hall chip can be calculated as:

[0069] (3)

[0070] Where Sens is the sensitivity of the linear Hall chip, I0 is the current of the first point current source device, I1 is the current of the second point current source device, V0 is the voltage value measured by the multimeter when the first point current source device is in current, and V1 is the voltage value measured by the multimeter when the second point current source device is in current.

[0071] In the present invention, one or more aging test bodies are fixed on the base 1, the coil of each aging test body is connected to an integrated bus 11, and the PCB pin amplifier board 9 of each aging test body is connected to another integrated bus 11. By connecting the test equipment between the two integrated buses 11, the aging test of multiple Hall chips can be realized. The present invention is simple to operate, greatly improves the efficiency of the aging test, and saves time cost.

Claims

1. A Hall chip aging test device, characterized in that: The invention comprises a base (1), on which one or more aging test bodies are fixed; the aging test bodies comprise a first coil frame (4) and a second coil frame (5) which are coaxially arranged and detachable; a first coil (3) is wound on the first coil frame (4), a second coil (6) is wound in the second coil frame (5), the leads of the first coil (3) and the second coil (6) are welded to form a coil wound in one line, the first coil (3) and the second coil (6) have the same winding direction, and a PCB pin amplifier board (9) is placed between the first coil frame (4) and the second coil frame (5); each coil of the aging test body is connected to an integrated bus (11). The first coil frame (4) is fixed on the base (1), and a first fixing plate (2) is also fixed on the base (1). One end face of the first fixing plate (2) is fixed on the base (1) near the first coil frame (4). The other end of the first fixing plate (2) is rotatably connected to the other end of the second fixing plate (7). The second coil frame (5) is fixed on the plate surface of the second fixing plate (7). The second fixing plate (7) can be coaxially placed with the first fixing plate (2) by rotating the second fixing plate (7) on the first fixing plate (2).

2. A Hall chip aging test device as claimed in claim 1, characterized in that: The first coil frame (4) and the second coil frame (5) are both made of aluminum, and the coils are high-temperature resistant enameled copper wires.

3. A Hall chip aging test device as claimed in claim 1, characterized in that: A groove (8) is provided on the end surface of the contact surface between the first coil frame (4) and the second coil frame (5), and the PCB pin amplifier board (9) is placed in the groove (8).

4. A Hall chip aging test device as claimed in claim 3, characterized in that: The PCB pin amplifier plate (9) is also provided with a fixing hole (9-1), and the groove (8) is also provided with a boss that matches the fixing hole (9-1).

5. A Hall chip aging test device as claimed in claim 4, characterized in that: It also comprises a chip aging test socket (10), wherein the pins of the chip aging test socket (10) are welded to the pin ends of the PCB pin amplifier board (9).

6. A Hall chip aging test method, characterized in that: Using the Hall chip aging test device described in claim 5, the specific steps are: Step 1: Place the Gauss meter probe between the first coil frame (4) and the second coil frame (5), pass current through the coil, and obtain the coefficient of magnetic field and current through the change of current. ; Step 2, taking out the Gauss meter probe, connecting the Hall chip to the PCB pin amplifier board (9) through the pins of the chip aging test socket (10) or directly connecting the Hall chip to the PCB pin amplifier board (9) through the package, and then placing the PCB pin amplifier board (9) into the groove (8); connecting the test equipment between the two integrated buses (11); Step 3, gradually increase or decrease the current value according to the coefficient The sensitivity of the Hall chip can be calculated based on the data obtained from the measuring equipment; Step 4, place a Hall chip aging test device into a high and low temperature humidity chamber, set different temperature points or humidity points on the temperature and humidity chamber, and wait until the temperature or humidity reaches the set value, then test the parameters of the Hall chip again. When the temperature or humidity reaches the set value, the test method is the same as step 3.

7. A Hall chip aging test method as claimed in claim 6, characterized in that: The step 1 is specifically as follows: The PCB pin amplifier board (9) and the chip aging test seat (10) are taken out from between the first coil frame (4) and the second coil frame (5), and the Gauss meter probe is placed between the first coil frame (4) and the second coil frame (5). Current is passed through the coil, and the current is adjusted to obtain the magnitude of the magnetic field under different currents, thereby obtaining the linear relationship between the current and the magnetic field, and calculating the coefficient of the magnetic field and the current. : （1） in is the magnetic field, is the current, It is the coefficient of current and magnetic field, and its unit is Gs / A.

8. A Hall chip aging test method as claimed in claim 6, characterized in that: The step 2 is specifically as follows: Take out the Gauss meter, connect the Hall chip to be tested to the PCB pin amplifier board (9) through the pins of the chip aging test socket (10) or directly connect it to the PCB pin amplifier board (9) through encapsulation, then put the PCB pin amplifier board (9) into the groove (8) to ensure that the chip is placed at the center of the coil, and fasten the first coil frame (4) and the second coil frame (5) so that they are coaxially placed; connect the current source device, the source meter device, the multimeter, and the oscilloscope between the two integrated buses.

9. A Hall chip aging test method as claimed in claim 7, characterized in that: The step 3 is specifically as follows: When testing the Hall switch chip, gradually increase or decrease the current value, observe the value change on the oscilloscope or ammeter, record the current threshold on the current source device at the switching point, and record the current value x at this time. Calculate the relationship between current and magnetic field according to step 1 The value can be used to calculate the magnitude of the magnetic field at this time: y= *x(2) Where y is the magnetic field threshold of the Hall switch chip, and x is the current value of the current source device when the Hall switch chip is working; When testing the linear Hall chip, gradually increase or decrease the current value, observe the change in the voltage value on the multimeter, and record the relationship between the current on the current source and the voltage value on the multimeter. For example, when the current of the current source is I0, the corresponding voltage value on the multimeter is V0, and when the current of the current source is I1, the corresponding voltage value on the multimeter is V1. At this time, the sensitivity of the linear Hall chip can be calculated as: （3） Where Sens is the sensitivity of the linear Hall chip, I0 is the current of the first point current source device, I1 is the current of the second point current source device, V0 is the voltage value measured by the multimeter when the first point current source device current is 0, and V1 is the voltage value measured by the multimeter when the second point current source device current is 0.

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