Inspection device

Abstract

The present invention relates to an inspection device, which includes an indexing table for mounting devices via an exchangeable fixed stand, thereby realizing miniaturization and low cost of the inspection device. The inspection device (1) includes an indexing table (11, 12) and an arm (13). The indexing table (11, 12) has a device mounting area for mounting devices via an exchangeable fixed stand. The arm (13) has a device adsorption head (13a, 13b) for adsorbing devices and a fixed stand adsorption head (13c) for adsorbing the fixed stand.

Description

Technical Field

[0001] The present invention relates to an inspection device for inspecting a device such as a semiconductor device, and more particularly to an inspection device for inspecting a device in two or more environments having different conditions. Background Art

[0002] In the inspection of semiconductor devices, it is sometimes necessary to perform both static characteristic tests and dynamic characteristic tests. Patent document 1 discloses an inspection device for performing such tests. In addition, in the inspection of semiconductor devices, it is sometimes necessary to perform tests for both room temperature environments and high temperature environments. Patent documents 2 and 3 disclose inspection devices for performing such tests.

[0003] Prior art literature

[0004] Patent Literature

[0005] [Patent Document 1] Japanese Patent Publication No. 2016-206150

[0006] [Patent Document 2] Japanese Patent Publication No. 58-39021

[0007] [Patent Document 3] Japanese Patent Publication No. 4-23446 Summary of the invention

[0008] Problem that the invention aims to solve

[0009] In order to effectively inspect semiconductor devices, it is preferred to perform static characteristic tests and dynamic characteristic tests on an index table for transporting semiconductor devices. However, if semiconductor devices are directly placed on an index table and these tests are performed, the index table may be damaged if the semiconductor device is defective. Therefore, it is preferred to place semiconductor devices on an index table using an interchangeable fixed mount to perform these tests.

[0010] However, in this case, a mechanism for handling semiconductor devices and a mechanism for handling the fixed stage are required, so it is inevitable that the inspection device will be larger and more expensive.

[0011] In addition, here, the problems that occur when testing semiconductor devices are described, but the same problems also occur when testing devices other than semiconductor devices. That is, the above problems can be generalized as problems that may occur when testing any device.

[0012] One aspect of the present invention has been made in view of the above-mentioned problems, and aims to achieve miniaturization and cost reduction of an inspection device including an index stage on which a device is mounted via an exchangeable fixed stage.

[0013] Means used to solve problems

[0014] In order to solve the above-mentioned problems, an inspection device involved in one embodiment of the present invention includes an indexing table and an arm, wherein the indexing table has a device loading area for loading devices through an exchangeable fixed stage, and the arm has a device adsorption head for adsorbing the device and a fixed stage adsorption head for adsorbing the fixed stage.

[0015] Effects of the Invention

[0016] According to one embodiment of the present invention, with respect to an inspection device including an index stage on which a device is mounted via an exchangeable fixed stage, it is possible to achieve miniaturization and cost reduction of the inspection device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a perspective view showing a schematic structure of an inspection device according to an embodiment of the present invention.

[0018] Figure 2 It is shown Figure 1 An overhead view of a conveying path for semiconductor devices in an inspection apparatus.

[0019] Figure 3 It shows that the Figure 1 A flowchart of the process of a method for inspecting a semiconductor device by an inspection apparatus.

[0020] Figure 4 yes Figure 1 The inspection device has a top view of the first indexing table.

[0021] Figure 5 It is a partial cross-sectional view showing details of the periphery of the device placement region of the first index stage.

[0022] Figure 6 yes Figure 1 The inspection device has a top view of the second indexing table.

[0023] Figure 7 It is a partial cross-sectional view showing details of the device placement region and the periphery of the second index stage.

[0024] Figure 8 yes Figure 1 The inspection device has a top view of the arm.

[0025] Fig. 9 yes Figure 1 A side view of a device adsorption head provided on an arm of the inspection apparatus.

[0026] Fig.10 yes Figure 1 A side view of an inspection device having an arm having a fixed stage adsorption head.

[0027] Fig.11 It is shown installed on Figure 1 A schematic diagram of a process of a method for replacing a fixed stage of a first indexing table of an inspection device.

[0028] Fig.12 It is shown installed on Figure 1 A schematic diagram of the process of a method for replacing a fixed stage of a second indexing stage of an inspection device. DETAILED DESCRIPTION

[0029] [General structure of the inspection device]

[0030] Reference Figure 1 A schematic configuration of an inspection device 1 according to an embodiment of the present invention will be described. Figure 1 It is a perspective view showing a schematic configuration of the inspection device 1 .

[0031] The inspection device 1 is a device for performing static characteristic tests and dynamic characteristic tests in a room temperature environment (an example of a "first environment" in the patent claims) and a high temperature environment (an example of a "second environment" in the patent claims) of a semiconductor device (an example of a "device" in the patent claims). Here, the high temperature environment refers to an environment with a temperature higher than the room temperature environment.

[0032] like Figure 1 As shown, the inspection device 1 includes a first indexing table 11, a second indexing table 12, an arm 13, a fixed stage recovery / supply unit 14, a first test device 15, a second test device 16, a third test device 17 and a fourth test device 18.

[0033] The first indexing table 11 is a device for transporting the loaded semiconductor device along the circular intra-table transport path P1. The first indexing table 11 is provided with a device loading area for loading the device via an interchangeable fixed stand. Four positions P11 to P14 are set at equal intervals on the intra-table transport path P1. In particular, the third position P13 is set at a position closest to the second indexing table 12 in the intra-table transport path P1. The first indexing table 11 is rotated 90° clockwise when viewed from above to (1) transport the semiconductor device located at the first position P11 to the second position P12, (2) transport the semiconductor device located at the second position P12 to the third position P13, (3) transport the semiconductor device located at the third position P13 to the fourth position P14, and (4) transport the semiconductor device located at the fourth position P14 to the first position P11.

[0034] In the present embodiment, the first indexing table 11 functions as a room temperature test station for implementing static characteristic tests and dynamic characteristic tests in a room temperature environment. As an example of a room temperature environment, an environment in which the temperature of the semiconductor device can be made to be above 20°C and below 30°C can be cited. The inspection device 1 is arranged in a clean room in most cases. The room temperature in the clean room is set to 25°C, for example, and the actual room temperature is above 20°C and below 30°C in most cases. As a result, the temperature of the semiconductor device placed on the first indexing table 11 also becomes above 20°C and below 30°C. The details of the first indexing table 11 will be described below with reference to different drawings.

[0035] The second indexing table 12 is a device for transporting the loaded semiconductor device along the circular intra-table transport path P2. The second indexing table 12 is provided with a device loading area for loading devices via an interchangeable fixed stand and a fixed stand loading area for loading a spare fixed stand. Four positions P21 to P24 are set on the intra-table transport path P2. In particular, the first position P21 is set at the position closest to the first indexing table 11 in the intra-table transport path P2. The second indexing table 12 is rotated 90° clockwise when viewed from above to (1) transport the semiconductor device located at the first position P21 to the second position P22, (2) transport the semiconductor device located at the second position P22 to the third position P23, (3) transport the semiconductor device located at the third position P23 to the fourth position P24, and (4) transport the semiconductor device located at the fourth position P24 to the first position P21.

[0036] In the present embodiment, the second indexing table 12 functions as a room temperature test station for performing a static characteristic test and a dynamic characteristic test in a high temperature environment. As an example of a high temperature environment, an environment in which the temperature of the semiconductor device can be made to be 50° C. or higher and 300° C. or lower can be cited. The details of the second indexing table 12 will be described below with reference to different drawings.

[0037] The arm 13 is a T-shaped swing arm having two device suction heads 13a, 13b and a fixed stage suction head 13c. The arm 13 uses the device suction heads 13a and 13b to perform a device transfer action. Here, the device transfer action refers to an action of transferring a semiconductor device placed on the first indexing table 11 to the second indexing table 12 using one of the two device suction heads 13a to 13b, while transferring a semiconductor device placed on the second indexing table 12 to the first indexing table 11 using the other of the two device suction heads 13a to 13b. In addition, the arm 13 uses one of the two device suction heads 13a to 13b to perform a device recovery action. Here, the device recovery action refers to an action of recovering a device that has been determined to be a defective product in a test from the first indexing table 11 or the second indexing table 12. In addition, the arm 13 uses the fixed stage suction head 13c to perform a fixed stage recovery action. Here, the fixed stage recovery action refers to the action of recovering the fixed stage on which the device determined to be a defective product in the test is placed from the first indexing table 11 or the second indexing table 12. In addition, the arm 13 performs the fixed stage installation action using the fixed stage suction head 13c. Here, the fixed stage installation action refers to the action of installing the spare fixed stage obtained from the second indexing table 12 or the fixed stage recovery / supply unit 14 described later on the first indexing table 11 or the second indexing table 12. In addition, the details of the arm 13 will be described below with reference to different drawings.

[0038] The fixed stage collecting / supplying unit 14 is a unit for collecting a fixed stage on which a device determined to be a defective product in a test is placed, and supplying a spare fixed stage to be replaced with the fixed stage.

[0039] The first test device 15 is a device for performing a dynamic characteristic test on the semiconductor device placed on the first index stage 11 at room temperature. In this embodiment, the first test device 15 performs a dynamic characteristic test on the semiconductor device at the second position P12 of the first stage intra-transfer path P1.

[0040] The second test device 16 is a device for performing a dynamic characteristic test in a high temperature environment on the semiconductor device placed on the second index stage 12. In this embodiment, the second test device 16 performs a dynamic characteristic test on the semiconductor device at the second position P22 of the second stage intra-transfer path P2.

[0041] The third test device 17 is a device for performing a static characteristic test in a high temperature environment on the semiconductor device placed on the second index stage 12. In this embodiment, the third test device 17 performs a static characteristic test on the semiconductor device at the fourth position P24 of the second stage intra-transfer path P2.

[0042] The fourth test device 18 is a device for performing a static characteristic test on the semiconductor device placed on the first index stage 11 at room temperature. In this embodiment, the fourth test device 18 performs a static characteristic test on the semiconductor device at the fourth position P14 of the first stage intra-transfer path P1.

[0043] In addition, these test devices 15 to 18 can be realized by a known configuration (for example, the configuration disclosed in Patent Document 1). Therefore, in this specification, a detailed description of the test devices 15 to 18 is omitted.

[0044] [Transportation route of semiconductor devices]

[0045] Reference Figure 2 A transport path P of semiconductor devices in the inspection apparatus 1 will be described. Figure 2 It is a plan view showing the structure of the conveyance path P.

[0046] The transport path P is composed of a first intra-stage transport path P1, a second intra-stage transport path P2, and an inter-stage transport path P3. The first intra-stage transport path P1 is a transport path for transporting semiconductor devices through the first indexing stage 11. The second intra-stage transport path P2 is a transport path for transporting semiconductor devices through the second indexing stage 12. The inter-stage transport path P3 is a transport path for transporting (transferring) semiconductor devices through the arm 13.

[0047] In the inspection apparatus 1 , semiconductor devices are conveyed as follows.

[0048] First, through the device supply unit (in Figure 1 (not shown) supplies uninspected semiconductor devices to a first position P11 of the first intra-stage transport path P1.

[0049] Next, the semiconductor device supplied to the first position P11 of the first intra-stage transport path P1 is transported by the first index stage 11 along the first intra-stage transport path P1 (1) from the first position P11 to the second position P12 and (2) from the second position P12 to the third position P13.

[0050] Next, the semiconductor device conveyed to the third position P13 of the first intra-stage transport path P1 is conveyed (transferred) to the first position P21 of the second intra-stage transport path P2 along the inter-stage transport path P3 by the arm 13 .

[0051] Next, the semiconductor device that has been transported to the first position P21 of the second-stage transport path P2 is transported along the second-stage transport path P2 by the second transfer table 12: (1) from the first position P21 to the second position P22, (2) from the second position P22 to the third position P23, (3) from the third position P23 to the fourth position P24, and (4) from the fourth position P24 to the first position P21.

[0052] Next, the semiconductor device conveyed to the first position P21 of the second intra-stage transport path P2 is conveyed (transferred) to the third position P13 of the first intra-stage transport path P1 along the inter-stage transport path P3 by the arm 13 .

[0053] Next, the semiconductor device transported to the third position P13 of the first-stage intra-transfer path P1 is transported by the first indexing stage 11 along the first-stage intra-transfer path P1 (1) from the third position P13 to the fourth position P14, and (2) from the fourth position P14 to the first position P11.

[0054] Finally, the device recovery unit (in Figure 1 (not shown) recovers the inspected semiconductor device that has been transported to the first position P11 of the first intra-stage transport path P1.

[0055] In the inspection device 1, for the semiconductor device transported as described above, each of the dynamic characteristic test and the static characteristic test is performed in each of the room temperature environment and the high temperature environment. First, the dynamic characteristic test in the room temperature environment is performed by the test device 15 at the second position P12 of the transport path P1 in the first station. Secondly, the dynamic characteristic test in the high temperature environment is performed by the second test device 16 at the second position P22 of the transport path P2 in the second station. Next, the static characteristic test in the high temperature environment is performed by the third test device 17 at the fourth position P24 of the transport path P2 in the second station. Finally, the static characteristic test in the room temperature environment is performed by the fourth test device 18 at the fourth position P14 of the transport path P1 in the first station.

[0056] Figure 2 The inter-stage transport path included in the transport path P shown in FIG. 1 is only the inter-stage transport path P3. In addition, the length of the inter-stage transport path P3 can be shortened compared to the length of the inter-stage transport path for transferring semiconductor devices between indexing stages. Therefore, the static characteristic test and the dynamic characteristic test can be performed in each of the room temperature environment and the high temperature environment without causing unnecessary enlargement of the inspection apparatus 1 and unnecessary reduction of the inspection speed.

[0057] Furthermore, the image inspection of the semiconductor device can also be performed at the first position P11 and the third position P13 of the first station internal transport path P1 and the first position P21 and the third position P23 of the second station internal transport path P2. For example, in the image inspection at the first position P11 of the first station internal transport path P1, a camera not shown in the figure takes an image of the semiconductor device placed on the first indexing table 11. Then, the controller not shown (1) calculates the difference between the position where the semiconductor device is actually placed and the predetermined reference position based on the captured image; and (2) adjusts the probe position of the first test device 15 based on the calculated difference. Thus, even if the semiconductor device deviates from the reference position and is placed on the first indexing table 11, the dynamic characteristics test performed by the first test device 15 can be appropriately implemented. The same image inspection can also be performed at the first position P21 of the second station internal transport path P2, the third position P23 of the second station internal transport path P2, and the third position P13 of the first station internal transport path P1. By performing these image inspections, the probe positions of the second test device 16, the third test device 17, and the fourth test device 18 can be adjusted respectively, so that the same effect as the above-mentioned image inspection can be obtained.

[0058] [Flow of inspection method]

[0059] Reference Figure 3 The flow of the inspection method S100 using the inspection apparatus 1 will be described. Figure 3 is a flow chart showing the process of the inspection method S100. Figure 3 In the figure, a plurality of steps sequentially applied to each semiconductor device DUTi (i=1, 2, 3, ...) are arranged horizontally, and a plurality of steps simultaneously applied to a plurality of semiconductor devices DUT1, DUT2, DUT3, ... are arranged vertically.

[0060] The inspection method S100 is an inspection method for testing the static characteristics and dynamic characteristics of a semiconductor device in a room temperature environment and a high temperature environment using the inspection apparatus 1 described above. Figure 3 As shown in, the inspection method S100 includes a supply / image inspection process S101, a conveying process S102, a room temperature AC test process S103, a conveying process S104, a transfer / image inspection process S105, a conveying process S106, a high temperature AC test process S107, a conveying process S108, an image inspection process S109, a conveying process S110, a high temperature DC test process S111, a conveying process S112, a transfer / image inspection process S113, a conveying process S114, a room temperature DC test process S115, a conveying process S116 and a recycling process S117.

[0061] The supply / image inspection step S101 is a step of supplying the semiconductor device DUT1 using the device supply unit at the first position P11 of the first intra-stage transport path P1. In this step, the semiconductor device DUT1 placed on the first indexing stage 11 is image inspected at the first position P11 of the first intra-stage transport path P1, and the probe position of the first test device 15 is adjusted based on the inspection result.

[0062] The transfer step S102 is a step of transferring the semiconductor device DUT1 placed on the first index table 11 from the first position P11 to the second position P12 along the first intra-stage transfer path P1 by rotating the first index table 11 by 90 degrees.

[0063] The room temperature AC (dynamic characteristics) test step S103 is a step of performing a dynamic characteristics test in a room temperature environment on the semiconductor device DUT1 conveyed to the second position P12 of the first intra-stage conveyance path P1 using the first test apparatus 15 .

[0064] The transfer step S104 is a step of transferring the semiconductor device DUT1 placed on the first index table 11 from the second position P12 to the third position P13 along the first intra-stage transfer path P1 by rotating the first index table 11 by 90 degrees.

[0065] The transfer / image inspection step S105 is a step of transferring the semiconductor device DUT1 transferred to the third position P13 of the first-stage intra-transfer path P1 to the second indexing stage 12 using the arm 13. In this step, an image inspection is performed on the semiconductor device DUT1 transferred to the second indexing stage 12 at the first position P21 of the second-stage intra-transfer path P2. The probe position of the second test device 16 is adjusted according to the result of the image inspection.

[0066] The transfer step S106 is a step of transferring the semiconductor device DUT1 placed on the second index table 12 from the first position P21 to the second position P22 along the second intra-stage transfer path P2 by rotating the second index table 12 by 90 degrees.

[0067] The high temperature AC test step S107 is a step of performing a dynamic characteristic test in a high temperature environment on the semiconductor device DUT1 conveyed to the second position P22 of the second intra-stage conveyance path P2 using the second test apparatus 16 .

[0068] The transfer step S108 is a step of transferring the semiconductor device DUT1 placed on the second index table 12 from the second position P22 to the third position P23 along the second intra-stage transfer path P2 by rotating the second index table 12 by 90 degrees.

[0069] The image inspection step S109 is a step of performing an image inspection on the semiconductor device DUT1 placed on the second index stage 12 at the third position P23 of the second intra-stage transport path P2. In the image inspection step S109, the probe position of the third test device 17 is adjusted based on the result of the image inspection.

[0070] The transfer step S110 is a step of rotating the second index table 12 by 90 degrees. By performing the transfer step S110, the semiconductor device DUT1 placed on the second index table 12 is transferred from the third position P23 to the fourth position P24 along the second intra-stage transfer path P2.

[0071] The high temperature DC (static characteristics) test step S111 is a step of performing a static characteristics test in a high temperature environment on the semiconductor device DUT1 conveyed to the fourth position P24 of the second intra-stage conveyance path P2 using the third test apparatus 17 .

[0072] The transfer step S112 is a step of transferring the semiconductor device DUT1 placed on the second index table 12 from the fourth position P24 to the first position P21 along the second intra-stage transfer path P2 by rotating the second index table 12 by 90 degrees.

[0073] The transfer / image inspection step S113 is a step of transferring the semiconductor device DUT1 transferred to the first position P21 of the second-stage intra-transfer path P2 to the first indexing stage 11 using the arm 13. In this step, an image inspection is performed on the semiconductor device DUT1 transferred to the first indexing stage 11 at the third position P13 of the first-stage intra-transfer path P1. In this step, the probe position of the fourth test device 18 is adjusted based on the result of the image inspection.

[0074] The transfer step S114 is a step of rotating the first index table 11 by 90 degrees. By performing the transfer step S114, the semiconductor device DUT1 placed on the first index table 11 is transferred from the third position P13 to the fourth position P14 along the first intra-stage transfer path P1.

[0075] The room temperature DC test step S115 is a step of performing a static characteristic test in a room temperature environment on the semiconductor device DUT1 conveyed to the fourth position P14 of the first intra-stage conveyance path P1 using the fourth test apparatus 18 .

[0076] The transfer step S116 is a step of rotating the first index table 11 by 90 degrees. By performing the transfer step S116, the semiconductor device DUT1 placed on the first index table 11 is transferred from the fourth position P14 to the first position P11 along the first intra-stage transfer path P1.

[0077] The collecting step S117 is a step of collecting the semiconductor device DUT1 at the first position P11 of the first intra-stage transport path P1 using a device collecting unit.

[0078] In addition, the above-mentioned steps S101 to S117 are simultaneously and parallelly performed for a plurality of semiconductor devices DUT1, DUT2, DUT3, ... For example, while performing the transfer / image inspection step S105 for the first semiconductor device DUT1, the room temperature AC test step S103 for the second semiconductor device DUT2 is performed, and the supply / image inspection step S101 for the third semiconductor device DUT3 is performed. In addition, while performing the transfer step S106 for the first semiconductor device DUT1, the transfer step S104 for the second semiconductor device DUT2 is performed, and the transfer step S102 for the third semiconductor device DUT3 is performed.

[0079] [Structure of the indexing table]

[0080] Reference Figures 4 to 7 The configuration of the first index table 11 and the second index table 12 included in the inspection device 1 will be described. Figure 4 is a top view of the first indexing table 11, Figure 5 is a partial cross-sectional view of the first indexing table 11, Figure 6 is a top view of the second indexing table 12, Figure 7 It is a partial cross-sectional view of the second indexing table 12 .

[0081] like Figure 5 As shown in FIG. 1 , the first indexing stage 11 is constructed by sequentially stacking a heat-resistant insulating resin plate 111, a ceramic plate 112, and a stage block 113. Figure 4 and Figure 5 As shown in FIG. 1 , a recess 113a functioning as a device placement area AD is provided on the upper surface of the block 113. A fixed stand M is mounted on the recess 113a, and a semiconductor device DUT is placed on the fixed stand M. The fixed stand M is a plate-shaped member made of a material having thermal conductivity and electrical conductivity (e.g., metal). In addition, an air supply and exhaust passage 113b is provided inside the block 113, and one end of the air supply and exhaust passage 113b is released in the recess 113a and communicated with a through hole provided in the fixed stand M. The air supply and exhaust passage 113b is used as a flow path for air for adsorbing the semiconductor device DUT to the fixed stand M and for air for floating the semiconductor device DUT from the fixed stand M.

[0082] like Figure 7 As shown in FIG. 1 , the second indexing table 12 is formed by sequentially stacking a heat-resistant insulating resin plate 121, a heater block 124, a ceramic plate 122, and a stage block 123. Figure 6 and Figure 7 As shown in , a recess 123a that functions as a device placement area AD is provided on the upper surface of the block 123. A fixed stand M is mounted on the recess 123a, and a semiconductor device DUT is placed on the fixed stand M. The fixed stand M is a plate-shaped member made of a material having thermal conductivity and electrical conductivity (e.g., metal). In addition, an air supply and exhaust passage 123b is provided inside the block 123, and one end of the air supply and exhaust passage 123b is released in the recess 123a and communicated with a through hole provided in the fixed stand M. The air supply and exhaust passage 123b is used as a flow path for air to adsorb the semiconductor device DUT to the fixed stand M and for air to float the semiconductor device DUT from the fixed stand M.

[0083] A recessed portion that functions as a fixed stand mounting area AM is also provided on the upper surface of the block 123. A spare fixed stand M' is mounted in the recessed portion. The spare fixed stand M' has the same size and material as the fixed stand M, and the fixed stand M and spare fixed stand M' are interchangeable.

[0084] The heater block 124 built into the second indexing table 12 is used to heat the semiconductor device DUT placed in the device placement area AD. Thus, the test of the semiconductor device DUT in a high temperature environment can be carried out without using an external heat source. In addition, the heater block 124 built into the second indexing table 12 is also used to heat the spare fixed stand M' placed in the fixed stand placement area AM. Thus, the spare fixed stand M' can be kept at a high temperature without using an external heat source. That is, when the fixed stand M needs to be replaced, it can be replaced with the spare fixed stand M' without waiting for the spare fixed stand M' to reach a high temperature.

[0085] [Arm structure]

[0086] Reference Figure 8 to Figure 10 The structure of the arm 13 included in the inspection device 1 will be described. Figure 8 to Figure 10 middle, Figure 8 is a top view of the arm 13, Fig. 9 1 is a side view of the device adsorption heads 13a and 13b of the arm 13. Fig.10 It is a side view of the fixed stage adsorption head 13c possessed by the arm 13.

[0087] like Figure 8As shown in , the arm 13 has a T-shaped planar shape formed by combining three straight portions 13A to 13C. The first device adsorption head 13a is installed on the front back side of the first straight portion 13A extending from the rotation center of the arm 13 in the first direction. The second device adsorption head 13b is installed on the front back side of the second straight portion 13B extending from the rotation center of the arm 13 in the direction opposite to the first direction. The fixed stage adsorption head 13c is installed on the front back side of the third straight portion 13C extending from the rotation center of the arm 13 in a third direction, which is perpendicular to both the first direction and the second direction opposite to the first direction.

[0088] like Fig. 9 As shown in FIG, the device adsorption heads 13a and 13b have a structure suitable for adsorbing semiconductor devices. Fig.10 As shown in FIG. 1 , the fixed stage adsorption head 13c has a structure suitable for adsorbing the fixed stage. Since known adsorption pads can be used as the device adsorption heads 13a, 13b and the fixed stage adsorption head 13c, detailed description of their structures is omitted here.

[0089] In addition, the arm 13 may also be configured in a cross shape. In this case, another head may be installed on the back of the front end of the fourth straight line portion of the arm 13.

[0090] As another head, for example, a third device suction head can be cited. In this case, it is considered that the first device suction head 13a and the second device suction head 13b are used for the device transfer operation, and the third device suction head is used for the device recovery operation. Thus, it is not necessary to use the third device suction head that may be damaged in the device recovery operation for the device transfer operation.

[0091] In addition, as another head, for example, an air supply head can be cited. In this case, for example, foreign matter attached to the fixed stand can be removed using the air blown from the air supply head.

[0092] [Fixed stage exchange method in the first indexing stage]

[0093] In the test conducted in the room temperature environment, it is assumed that the semiconductor device DUT placed in the device placement area AD of the first indexing table 11 via a fixed stage M is judged to be defective. In this case, the inspection device 1 has a function of exchanging the fixed stage M with a spare fixed stage M' supplied by the fixed stage recovery / supply unit 14. Fig.11 The flow of the fixed rack replacement method S200 will be described. Fig.11 is a schematic diagram showing the flow of the fixed stage replacement method S200.

[0094] like Fig.11As shown in the figure, the fixed stage exchange method S200 includes a rotation step S201, a device adsorption step S202, a rotation step S203, a fixed stage adsorption / device adsorption release step S204, a rotation step S205, a fixed stage adsorption release step S206, a spare fixed stage adsorption step S207, a rotation step S208, and a spare fixed stage adsorption release step S209. These steps S201 to S209 are performed in a state where the device placement area AD is arranged at the third position P13 of the first stage intra-transfer path P1.

[0095] The rotating step S201 is a step of rotating the arm 13 so that the device adsorption head 13a is arranged at the third position P13 of the first station inner transport path P1. In the fixed stage exchange method in the first indexing stage, the third position P13 of the first station inner transport path P1 is an example of the "first position" described in the patent claims.

[0096] The device suction step S202 is a step of suctioning the semiconductor device DUT by the device suction head 13 a at the third position P13 of the first intra-stage transport path P1 .

[0097] The rotation step S203 is a step of rotating the arm 13 so that the device suction head 13a is arranged at the specified position P0 and the fixed stage suction head 13c is arranged at the third position P13 of the conveying path P1 in the first stage. In the fixed stage exchange method in the first indexing stage, the specified position P0 is an example of the "second position" described in the patent claims.

[0098] The fixed stage adsorption / device adsorption release step S204 is a step of adsorbing the fixed stage M by the fixed stage adsorption head 13c at the third position P13 of the first stage internal transport path P1, and releasing the adsorption of the semiconductor device DUT by the device adsorption head 13a at the predetermined position P0. In addition, a device recovery tray is arranged at the predetermined position P0, and the semiconductor device DUT is stored in the device recovery tray.

[0099] The rotation step S205 is a step of rotating the arm 13 so that the fixed stage adsorption head 13c is arranged at the above-mentioned predetermined position P0.

[0100] The fixed stage adsorption release step S206 is a step of releasing the adsorption of the fixed stage M by the fixed stage adsorption head 13 c at the predetermined position P0. In addition, the fixed stage recovery / supply unit 14 is disposed at the predetermined position P0, and the fixed stage M is recovered by the fixed stage recovery / supply unit 14.

[0101] Through the above steps S201 to S206 , the device collecting operation of collecting the semiconductor device DUT from the first index stage 11 and the fixed stage collecting operation of collecting the fixed stage M from the first index stage 11 are realized.

[0102] The standby fixed stage adsorption step S207 is a step in which the fixed stage adsorption head 13c adsorbs the standby fixed stage M' at a predetermined position P0. In addition, a fixed stage recovery / supply unit 14 is disposed at the predetermined position P0, and the standby fixed stage M' is supplied by the fixed stage recovery / supply unit 14.

[0103] The rotating step S208 is a step of rotating the arm 13 so that the fixed stage adsorption head 13 c is arranged at the third position P13 of the first stage intra-transfer path P1.

[0104] The standby fixed stage suction release step S209 is a step in which the fixed stage suction head 13 c releases the suction of the standby fixed stage M′ at the third position P13 of the first intra-stage transport path P1.

[0105] Through the above steps S207 to S209 , the standby fixed stage installation operation of installing the standby fixed stage M′ on the first index stage 11 is realized.

[0106] [Fixed stage exchange method in the second indexing table]

[0107] In a test conducted in a high temperature environment, it is assumed that a semiconductor device DUT placed in the device placement area AD of the second indexing table 12 via a fixed stage M is judged to be defective. In this case, the inspection device 1 has a function of exchanging the fixed stage M with a spare fixed stage M' placed in the fixed stage placement area AM of the second indexing table 12. Fig.12 The flow of the fixed rack replacement method S300 will be described. Fig.12 is a schematic diagram showing the flow of the fixed stage replacement method S300 .

[0108] like Fig.12 As shown in FIG. 1 , the fixed stage exchange method S300 includes a rotation step S301, a device adsorption step S302, a rotation step S303, a fixed stage adsorption / device adsorption release step S304, a rotation step S305, a fixed stage adsorption release step S306, a rotation step S307, a spare fixed stage adsorption step S308, and a spare fixed stage adsorption release step S309. In addition, steps S301 to S306 are performed in a state where the device placement area AD is arranged at the first position P21 of the second stage inner transport path P2.

[0109] The rotating step S301 is a step of rotating the arm 13 so that the device adsorption head 13b is arranged at the first position P21 of the second stage inner conveying path P2. In the fixed stage exchange method in the second indexing stage, the first position P21 of the second stage inner conveying path P2 is an example of the "first position" described in the patent claims.

[0110] The device suction step S302 is a step of suctioning the semiconductor device DUT by the device suction head 13 b at the first position P21 of the second intra-stage transport path P2.

[0111] The rotation step S303 is a step of rotating the arm 13 so that the device suction head 13b is arranged at the specified position P0 and the fixed stage suction head 13c is arranged at the first position P21 of the conveying path P2 in the second stage. In the fixed stage exchange method in the second indexing stage, the specified position P0 is an example of the "second position" described in the patent claims.

[0112] The fixed stage adsorption / device adsorption release step S304 is a step of adsorbing the fixed stage M at the first position P21 of the second stage internal transport path P2 by the fixed stage adsorption head 13c, and releasing the adsorption of the semiconductor device DUT by the device adsorption head 13b at the specified position P0. In addition, a device recovery tray is arranged at the specified position P0, and the semiconductor device DUT is accommodated in the device recovery tray.

[0113] The rotation step S305 is a step of rotating the arm 13 so that the fixed stage adsorption head 13c is arranged at the above-mentioned predetermined position P0.

[0114] The fixed stage adsorption release step S306 is a step of releasing the adsorption of the fixed stage M by the fixed stage adsorption head 13 c at the predetermined position P0. In addition, the fixed stage recovery / supply unit 14 is disposed at the predetermined position P0, and the fixed stage M is recovered by the fixed stage recovery / supply unit 14.

[0115] Through the above steps S301 to S306 , the device recovery operation of recovering the semiconductor device DUT from the second index stage 12 and the fixed stage recovery operation of recovering the fixed stage M from the second index stage 12 are realized.

[0116] The rotating step S307 is a step of rotating the arm 13 so that the fixed stage adsorption head 13 c is arranged at the first position P21 of the second stage internal transport path P2.

[0117] The standby fixed stage adsorption step S308 is a step in which the fixed stage adsorption head 13c adsorbs the standby fixed stage M' at the first position P21 of the second stage inner conveying path P2. The standby fixed stage adsorption step S308 is implemented after the fixed stage loading area AM carrying the standby fixed stage M' is arranged at the first position P21 of the second stage inner conveying path P2 by the rotation of the second indexing table 12.

[0118] The preliminary fixed stage adsorption release step S309 is a step in which the fixed stage adsorption head 13c releases the adsorption of the standby fixed stage M' at the first position P21 of the second stage internal transport path P2. The standby fixed stage adsorption release step S309 is implemented after the device loading area AD carrying the fixed stage M is arranged at the first position P21 of the second stage internal transport path P2 by the rotation of the second indexing table 12.

[0119] Through the above steps S307 to S309, the spare fixed stage installation operation of installing the spare fixed stage M' on the second index stage 12 is implemented.

[0120] [Modifications of the inspection device]

[0121] In addition, although in this embodiment, a dynamic characteristic test is performed at the second position P12 on the first-station internal transport path P1, and a static characteristic test is performed at the fourth position P14 on the first-station internal transport path P1, the present invention is not limited thereto. For example, a static characteristic test may be performed at the second position P12 on the first-station internal transport path P1, and a dynamic characteristic test may be performed at the fourth position P14 on the first-station internal transport path P1. However, according to the configuration involved in this embodiment, the dynamic characteristic test will not be the last test. Therefore, the configuration involved in this embodiment has the advantage that a failure of a semiconductor device caused by a dynamic characteristic test can be detected by a subsequent test.

[0122] In addition, although in this embodiment, a dynamic characteristic test is performed at the second position P22 on the second station internal transport path P2, and a static characteristic test is performed at the fourth position P24 on the second station internal transport path P2, the present invention is not limited thereto. For example, a static characteristic test may be performed at the second position P22 on the second station internal transport path P2, and a dynamic characteristic test may be performed at the fourth position P24 on the second station internal transport path P2.

[0123] In addition, although the present embodiment adopts a configuration in which a test in a room temperature environment is performed in the first station transport path P1, and a test in a high temperature environment is performed in the second station transport path P2, the present invention is not limited thereto. For example, a configuration in which a test in a high temperature environment is performed in the first station transport path P1, and a test in a room temperature environment is performed in the second station transport path P2 may also be adopted. However, according to the configuration adopted in the present embodiment, the test in a high temperature environment will not be the last test. Therefore, the configuration involved in the present embodiment has the advantage of being able to detect a failure of a semiconductor device caused by a high temperature test through a subsequent test.

[0124] In addition, although the present embodiment adopts a configuration in which the test is performed at two positions P12 and P14 on the first in-carriage transport path P1, the present invention is not limited thereto. For example, a configuration in which the test is performed at one position on the first in-carriage transport path P1 may be adopted, or a configuration in which the test is performed at three or more positions on the first in-carriage transport path P1 may be adopted. In this case, the test performed at each position may be a static characteristic test, a dynamic characteristic test, or other tests.

[0125] In addition, although the configuration of performing the test at two positions P22 and P24 on the second station internal transport path P2 is adopted in this embodiment, the present invention is not limited thereto. For example, the configuration of performing the test at one position on the second station internal transport path P2 may be adopted, or the configuration of performing the test at three or more positions on the second station internal transport path P2 may be adopted. In this case, the test performed at each position may be a static characteristic test, a dynamic characteristic test, or other tests.

[0126] In addition, although a structure including two transfer tables 11, 12 and one arm 13 is adopted in this embodiment, the present invention is not limited to this. That is, a structure including N transfer tables and N-1 arms can also be adopted in which N is an arbitrary natural number greater than 2. In this case, the i-th arm is used to transfer the semiconductor device from the i-th transfer table to the i+1-th transfer table. In addition, in this case, tests in different environments are implemented in transfer tables adjacent to each other. For example, in a structure with three transfer tables, a test in a low temperature environment is implemented in the first transfer table, a test in a room temperature environment is implemented in the second transfer table, and a test in a high temperature environment is implemented in the third transfer table. Alternatively, a test in a room temperature environment is implemented in the first transfer table, a test in a high temperature environment is implemented in the second transfer table, and a test in a room temperature environment is implemented in the third transfer table. Transferring the semiconductor device from a transfer table where the test is performed in a room temperature environment to a transfer table where the test is performed in a high temperature environment can be performed manually instead of using an arm.

[0127] In addition, although the semiconductor device is used as the inspection object of the inspection apparatus 1 in this embodiment, the present invention is not limited thereto and any device that needs to be tested in an environment with different conditions (an environment with different temperatures in this embodiment) can be used as the inspection object of the inspection apparatus 1 .

[0128] [Summarize]

[0129] The inspection device involved in mode 1 of the present invention includes an indexing table and an arm, wherein the indexing table has a device loading area for loading devices via an exchangeable fixed stage, and the arm has a device suction head for sucking the device and a fixed stage suction head for sucking the fixed stage.

[0130] According to the above method, the processing operation of the device and the processing operation of the fixed stage can be performed by one arm. Therefore, for an inspection device including an indexing table that mounts the device via an exchangeable fixed stage, the mechanism for performing the processing operation of the device and the processing operation of the fixed stage can be simplified. As a result, the inspection device can be miniaturized and cost-effective.

[0131] In the inspection device according to the second aspect of the present invention, in addition to the configuration of the inspection device according to the first aspect, the following configuration is further adopted. That is, the following configuration is adopted: the arm performs (1) a device recovery operation of recovering the device from the device placement area using the device suction head; (2) a fixed stage recovery operation of recovering the fixed stage from the device placement area using the fixed stage suction head; and (3) a fixed stage installation operation of installing a spare fixed stage on the device placement area using the fixed stage suction head.

[0132] When a device is found to be defective through testing, the mounting bracket on which the device is mounted may be damaged. According to the above method, in such a case, the recovery of the device found to be defective, the recovery of the old mounting bracket on which the device is mounted, and the installation of a new mounting bracket can all be performed by one arm.

[0133] In the inspection device involved in mode 3 of the present invention, in addition to the structure of the inspection device involved in mode 2, the following structure is also adopted. That is, the device recovery action and the fixed stage recovery action include: the step of rotating the arm so that the device adsorption head is configured in the first position; the step of adsorbing the device by the device adsorption head at the first position when the device loading area is configured in the first position; the step of rotating the arm so that the device adsorption head is configured in the second position, and configuring the fixed stage adsorption head at the first position; the step of adsorbing the fixed stage by the fixed stage adsorption head at the first position when the device loading area is configured in the first position, and releasing the adsorption of the device by the device adsorption head at the second position; the step of rotating the arm so that the fixed stage adsorption head is configured in the second position; and the step of releasing the adsorption of the fixed stage by the fixed stage adsorption head at the second position.

[0134] According to the above aspect, the recovery of the device determined to be defective and the recovery of the fixed stage on which the device is placed can be efficiently performed by one arm.

[0135] In the inspection device according to the fourth aspect of the present invention, in addition to the configuration of the inspection device according to the third aspect, the following configuration is further adopted. That is, a fixed stage supply device for supplying the backup fixed stage at the second position is further included, and the fixed stage installation operation includes: a step of the fixed stage adsorption head adsorbing the backup fixed stage at the second position; a step of rotating the arm so that the fixed stage adsorption head is arranged at the first position; and a step of the fixed stage adsorption head releasing the adsorption of the backup fixed stage at the first position when the device placement area is arranged at the first position.

[0136] According to the above aspect, the spare fixing stand can be efficiently installed using one arm.

[0137] In the inspection device according to the fifth aspect of the present invention, in addition to the configuration of the inspection device according to any one of the first to fourth aspects, the following configuration is further adopted. That is, the inspection device includes at least two indexing tables including the indexing table, the arm includes at least two device suction heads including the device suction head, the arm uses the first device suction head and the second device suction head to transfer the device placed on the first indexing table to the second indexing table, and simultaneously performs a device transfer operation of transferring the device placed on the second indexing table to the first indexing table, and uses the first device suction head and the second device suction head to perform the device recovery operation.

[0138] According to the above aspect, in an inspection device including at least two indexing tables, the device can be transferred between the indexing tables using an arm that transfers the device and the fixed stage. Therefore, the configuration of the inspection device including at least two indexing tables can be simplified.

[0139] In the inspection device according to the sixth aspect of the present invention, in addition to the configuration of the inspection device according to any one of the first to fourth aspects, the following configuration is further adopted. That is, the inspection device includes at least two indexing tables including the indexing table, the arm includes at least three device suction heads including the device suction head, the arm uses the first device suction head and the second device suction head to transfer the device placed on the first indexing table to the second indexing table, and simultaneously performs a device transfer operation of transferring the device placed on the second indexing table to the first indexing table, and uses the third device suction head to perform the device recovery operation.

[0140] According to the above aspect, in an inspection device including at least two indexing tables, the device can be transferred between the indexing tables using an arm that transfers the device and the fixed stage. Therefore, the configuration of the inspection device including at least two indexing tables can be simplified.

[0141] Furthermore, according to the above method, different adsorption heads can be used for recovering components that are determined to be defective and for transferring components between transfer tables. Therefore, it is possible to avoid the transfer of damage to normal components caused by using an adsorption head that is damaged by recovering components that are determined to be defective for transferring components between transfer tables.

[0142] In the inspection device according to aspect 7 of the present invention, in addition to the configuration of the inspection device according to any one of aspects 1 to 6, the following configuration is further adopted: That is, the arm further includes an air blowing head for removing foreign matter attached to the fixed stand by blowing air.

[0143] According to the above aspect, it is possible to realize an inspection device having a function of removing foreign matter attached to the fixed stage with a simple configuration.

[0144] [Additional Notes]

[0145] The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope of the claims. Embodiments obtained by appropriately combining the technical means disclosed in the above-described embodiments are also included in the technical scope of the present invention.

[0146] [Explanation of Reference Numerals]

[0147] 1 Inspection device

[0148] 11. First indexing station

[0149] 12. Second indexing station

[0150] 13 Arm

[0151] 14 Fixed stand recovery / supply unit

[0152] 15 The first test device (for dynamic characteristics test in room temperature environment)

[0153] 16 The second test device (for dynamic characteristics test in high temperature environment)

[0154] 17 The third test device (for static characteristics test in high temperature environment)

[0155] 18 The fourth test device (for static characteristic test in room temperature environment)

Claims

1. An inspection device, characterized in that: The inspection device comprises a first indexing table, an arm and a fixed stage supply device, The first indexing table (1) has a device placement area located on a circular first transport path centered on a first rotation center, and (2) transports devices and a fixed stage along the first transport path by rotating about the first rotation center. The device placement area is an area where devices are placed via an exchangeable fixed stage; The arm (3) comprises: a first straight portion and a third straight portion extending from a third rotation center in first and second directions different from each other and rotating around the third rotation center; a device adsorption head mounted on the first straight portion, the device adsorption head being used to adsorb the device; and a fixed stage adsorption head mounted on the third straight portion; and the fixed stage adsorption head being used to adsorb the fixed stage, and (4) by rotating the first straight portion and the third straight portion around the third rotation center, the device and the fixed stage are transported along a circular second transport path, The first transport path overlaps with the second transport path at a first position, The second transport path overlaps with the fixed stage supply device at a second position, The fixed stage supply device supplies a spare fixed stage to the arm at the second position, The arm performs the following actions: a device recovery action of recovering the device from the device loading area using the device suction head; a fixed stage recovery action of recovering the fixed stage from the device loading area using the fixed stage suction head; and a fixed stage installation action of installing a spare fixed stage in the device loading area using the fixed stage suction head. In the device recovery action and the fixed stand recovery action: The arm rotates so that the device adsorption head is configured in a first position; When the device placement area is configured at the first position, the device adsorption head adsorbs the device at the first position; The arm rotates so that the device adsorption head is arranged in the second position and the fixed stage adsorption head is arranged in the first position; When the device placement area is configured at the first position, the fixed stage adsorption head adsorbs the fixed stage at the first position, and the device adsorption head releases adsorption of the device at the second position; The arm rotates so that the fixed stage adsorption head is configured in the second position; and The fixed stage adsorption head releases the adsorption of the fixed stage at the second position, In the fixed stand installation action: The fixed stage adsorption head adsorbs the spare fixed stage supplied by the fixed stage supply device at the second position; The arm rotates so that the fixed stage adsorption head is configured in the first position; and When the device placement area is configured at the first position, the fixed stage adsorption head releases adsorption of the standby fixed stage at the first position.

2. The inspection device according to claim 1, characterized in that: In addition to the first indexing table, the inspection device also includes a second indexing table having a second rotation center and transporting the components and the fixed stand along a circular third transport path, The second transport path overlaps with the third transport path at a third position, In the arm, the direction in which the first straight portion extends and the direction in which the third straight portion extends are perpendicular to each other, The arm further includes a second straight portion extending from the third rotation center in a third direction, the third direction being a direction opposite to the first direction, Using the device adsorption head as the first device adsorption head, Installing the second device adsorption head to the second straight line portion, The arm transfers the device between the first indexing table and the second indexing table via the first position and the third position, The arm includes at least two device adsorption heads including the device adsorption head; The arm uses the first device suction head and the second device suction head to transfer the device placed on the first transfer table to the second transfer table, and simultaneously performs a device transfer action of transferring the device placed on the second transfer table to the first transfer table, and uses the first device suction head to perform the device recovery action.

3. An inspection device, characterized in that: The inspection device includes a first indexing table, a second indexing table, an arm and a fixed stage supply device, The first indexing table (1) is a first device loading area located on a circular first conveying path centered on a first rotation center, having a first device loading area for loading devices via an exchangeable fixed stage, and (2) conveying devices along the first conveying path by rotating around the first rotation center. The second indexing table (3) is a second device placement area located on a circular second transport path centered on a second rotation center, having a second device placement area for placing devices via an exchangeable fixed stand, and (4) transports the devices along the second transport path by rotating around the second rotation center. The arm (5) includes: (i) a first straight portion, a second straight portion, a third straight portion and a fourth straight portion extending in four directions from a third rotation center and forming a cross; (ii) a first device adsorption head, a second device adsorption head and a third device adsorption head installed to each of the first straight portion, the second straight portion and the third straight portion; (iii) a fixed stage adsorption head installed to the fourth straight portion; and (6) by rotating around the third rotation center of the first straight portion, the second straight portion, the third straight portion and the fourth straight portion, the device and the fixed stage are transported along a circular third transport path, The first transport path overlaps with the third transport path at a first position, The second transport path overlaps with the third transport path at a second position, The third transport path overlaps with the fixed stage supply device at a third position, The fixed stage supply device supplies a spare fixed stage to the arm at the third position, The arm performs the following actions: a device transfer action of transferring the device loaded in the first device loading area to the second device loading area while using the first device suction head and the second device suction head; a device recovery action of recovering the device from the first device loading area using the third device suction head; a fixed stage recovery action of recovering the fixed stage from the first device loading area using the fixed stage suction head; and a fixed stage installation action of installing a spare fixed stage to the first device loading area using the fixed stage suction head. In the device transfer operation: The arm rotates so that the first device adsorption head is configured at the first position and the second device adsorption head is configured at the second position; When the first device placement area is configured at the first position and the second device placement area is configured at the second position, the first device adsorption head adsorbs the device at the first position, and the second device adsorption head adsorbs the device at the second position; The arm rotates so that the first device adsorption head is configured at the second position and the second device adsorption head is configured at the first position; When the first device placement area is configured at the first position and the second device placement area is configured at the second position, the first device adsorption head and the second device adsorption head release the adsorption of the device at the second position, and the second device adsorption head releases the adsorption of the device at the first position, In the device recovery action and the fixed stand recovery action: The arm rotates so that the third device adsorption head is configured at the first position; When the first device placement area is configured at the first position, the third device adsorption head adsorbs the device at the first position; The arm rotates so that the third device adsorption head is configured at the third position; The third device adsorption head releases the adsorption of the device at the third position; The arm rotates so that the fixed stage adsorption head is arranged at the first position; When the first device placement area is configured at the first position, the fixed stage adsorption head adsorbs the fixed stage at the first position; The arm rotates so that the fixed stage adsorption head is arranged at the third position; When the fixed stage adsorption head is arranged at the third position, the fixed stage adsorption head releases the adsorption of the fixed stage at the third position, In the fixed stand installation action: The fixed stage adsorption head adsorbs the spare fixed stage supplied by the fixed stage supply device at a third position; The arm rotates so that the fixed stage adsorption head is configured in the first position; When the first device placement area is configured at the first position, the fixed stage adsorption head releases adsorption of the standby fixed stage at the first position.

4. The inspection device according to any one of claims 1 to 3, characterized in that: The arm further includes an air supply head configured to remove foreign matter attached to the fixed stand by supplying air.

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