Transmitter cores with multiple outputs

Abstract

Provided is a transmitter core with multiple outputs. The invention adopts a digital temperature compensation double-layer circuit board with a double-layer structure, and integrates the circuit board inside a sensor, so that the sensor directly converts the measured analog signal into an output signal, omitting structural parts such as an existing core connection base and a chip buffer pad, thereby reducing the production cost and material cost to a certain extent and reducing the core volume; at the same time, the output circuit board can adopt a circuit board with a 4-20mA standard output, and can also be replaced by a 0-10V output circuit board, a 0-5V output circuit board and an I2C output circuit board, so that the core has multiple output modes, is sound in function, and has a wide range of application.

Description

Technical Field

[0001] The invention belongs to the technical field of transmitters and the technical field of sensors, and in particular relates to a transmitter core with multiple outputs. Background Art

[0002] The core with output function on the market has structural components such as connection base, chip buffer, sensor core body, locking ring, and single function output transmitter board. The core body is provided with a threaded core shell at the low temperature lower end so that it can be fixed on the connecting pipe. The core buffer inside the core body prevents damage to the core body due to excessive instantaneous pressure, and the locking ring can fix the pressure core body on the outer shell of the core body. The above structural disadvantages: 1. The product has many structural components, the assembly process is complicated and the cost is high; 2. The transmitter board is too large and it is inconvenient to install on site; 3. The output function is single.

[0003] Moreover, when the existing core is in use, the pressure of the measured medium causes displacement on the sensor surface, causing the internal resistance to change. The 4-20mA transmitter board collects the analog signal on the sensor and converts it into a 4-20mA standard current output through a digital processing chip and peripheral circuits. The output of this pressure sensor is an analog signal, and a transmitter is required to convert the output signal of the sensor into a signal that can be recognized by the controller or convert the non-electrical quantity input by the sensor into an electrical signal and amplify it at the same time to provide a signal source for remote measurement and control. The disadvantages of the above output are: 1. Its analog signal is unstable and has poor anti-interference ability; 2. The transmitter board can only output 4-20mADC, the function is not perfect, and the scope of application is small. Therefore, it is necessary to propose improvements. Summary of the invention

[0004] The technical problem solved by the present invention is as follows: a transmitter core with multiple outputs is provided. The present invention adopts a double-layer digital temperature compensation double-layer circuit board with a double-layer structure, and integrates the circuit board inside the sensor, so that the sensor directly converts the measured analog signal into an output signal, omitting the existing core connection base, chip buffer pad and other structural parts, reducing the production cost and material cost to a certain extent, and reducing the core volume; at the same time, the output circuit board can adopt a circuit board with a 4-20mA standard output, and can also be replaced by a 0-10V output circuit board, a 0-5V output circuit board and an I2C output circuit board, so that the core has multiple output modes, complete functions and a wide range of applications.

[0005] The technical solution adopted by the present invention is as follows: a transmitter core with multiple outputs includes a shell, a welding ring is provided on the lower edge of the shell, a pressure sensitive chip is provided at the lower part of the shell, a corrugated diaphragm is fixed on the shell below the pressure sensitive chip, the upper part of the shell is open and a digital temperature compensation double-layer circuit board is provided at the opening, the digital temperature compensation double-layer circuit board is supported on the shell as a whole through sensor pins, the digital temperature compensation double-layer circuit board includes a main circuit board and an output circuit board which are parallel to each other and maintain a certain distance from top to bottom, the main circuit board is placed at the lower part of the output circuit board, the sensor interface on the main circuit board is connected to the sensor pin on the pressure sensitive chip through the lead in the sensor pin, the output circuit board and the main circuit board are detachably connected through a connector, the detachable connection between the output circuit board and the main circuit board realizes the connection of the corresponding network interfaces of the two circuit boards and realizes the replacement of output circuit boards with different outputs; an air guide tube connected to the sensor air guide port in the shell is provided in the center of the digital temperature compensation double-layer circuit board.

[0006] To further limit the above technical solution, the output circuit board can be replaced with a 4-20mA output circuit board, a 0-10V output circuit board, a 0-5V output circuit board and an I2C output as needed.

[0007] Further limitation of the above technical solution, the circuit diagram of the main circuit board: The circuit diagram of the main circuit board: includes a core interface and an NSA2860X digital conditioning chip, the core interface is provided with four pins I+, I-, S+, and S- connected to the pressure sensitive chip, the I+ pin of the core interface is connected to the IEXC1 and TEMP pins of the NSA2860X digital conditioning chip, the S+ pin of the core interface is connected to the VIP pin of the NSA2860X digital conditioning chip through resistors R20, C20 and C22, the S- pin of the core interface is connected to the VIP pin of the NSA2860X digital conditioning chip through resistors R21, C22 The core interface is connected to the VIN pin of the NSA2860X digital conditioning chip, and C21 is connected to the VIN pin of the NSA2860X digital conditioning chip, the I- pin of the core interface is connected to the resistor R22, the resistor R20 is connected to the VIP pin at one end and grounded through the capacitor C20, the resistor R20, the VIP pin and the capacitor C20 are connected to one end of the capacitor C22, the resistor R21 and the VIN pin are connected to the other end of the capacitor C22 and one end of the capacitor C21, and the other end of the capacitor C21 is connected to the resistor R22 and grounded; one end of the capacitor C12 is connected to the AVDD pin of the NSA2860X digital conditioning chip, and one end of the capacitor C13 is connected to the NSA2860X digital conditioning chip. The other ends of the capacitors C12 and C13 are connected to the positive electrode of the voltage zener diode D2 and the capacitor C14 and are grounded. The negative electrode of the voltage zener diode D2 and the capacitor C14 are connected to the emitter E of the transistor Q2 and the VDDHV pin of the digital conditioning chip. The collector C and the base B of the transistor Q2 are connected through a resistor R10. The base B of the transistor Q2 and one end of the resistor R10 are connected to the VCATE pin of the NSA2860X digital conditioning chip. The collector C of the transistor Q2 and the other end of the resistor R10 form a VCC interface of the main circuit board. The OWI pin of the NSA2860X digital conditioning chip is directly led out to form the OWI interface of the main circuit board; the VOUT pin of the NSA2860X digital conditioning chip is directly led out to form the Vout interface of the main circuit board; the FBN pin of the NSA2860X digital conditioning chip is directly led out to form the FBN interface of the main circuit board; the FIJTER pin of the NSA2860X digital conditioning chip is led out through capacitor C18 to form the GND interface of the main circuit board; the LOOPN pin of the NSA2860X digital conditioning chip is directly led out to form the LOOPN interface of the main circuit board.

[0008] Further limiting the above technical solution, the circuit diagram of the 4-20mA output circuit board includes: one end of the resistor R13 forms a power supply VCC interface corresponding to the main circuit board, the other end of the resistor R13 is commonly connected to the collector of the inductor L3 and the transistor T1, one end of the inductor L3 is connected to the cathode of the diode D5, one end of the resistor R14 forms an OWI communication interface corresponding to the main circuit board, the other end of the resistor R14 is connected in series with a capacitor C16, the capacitor C16 and the anode of the diode D5 are commonly connected to the cathode of the diode D6 and connected to the 24V+ power supply connection terminal J3 of the 4-20mA output circuit board; one end of the resistor R15 forms a power supply VCC interface corresponding to the main circuit board, and the other end of the resistor R14 is connected in series with a capacitor C16, and the capacitor C16 and the anode of the diode D5 are commonly connected to the cathode of the diode D6 and connected to the 24V+ power supply connection terminal J3 of the 4-20mA output circuit board; one end of the resistor R15 forms a power supply VCC interface corresponding to the main circuit board. The circuit board is connected to the Vout interface corresponding to the circuit board, the other end of the resistor R15 and the base of the transistor T1 are connected to one end of the capacitor C17, the other end of the capacitor C17 is connected to the emitter of the transistor and one end of the resistor R17, the other end of the resistor R17 is connected to the resistor R18 to form the FBN interface and GND interface corresponding to the main circuit board; the other end of the resistor R18 is connected to the inductor L4 to form the LOOPN interface corresponding to the main circuit board and the capacitor C19, the other end of C19 is connected to the ground, the inductor L4 is connected to the positive electrode of the diode D6 to form the 4-20mA standard circuit signal output terminal J4 of the 4-20mA output circuit board.

[0009] To further define the above technical solution, the circuit diagram of the 0-10V output circuit board includes a resistor R1, a resistor R2, a resistor R3, a resistor R4, and a resistor R5. The resistor R3 and the resistor R4 are connected in series, a transistor Q2 is connected between the resistor R3 and the resistor R1, and the collector of the resistor R3 and the transistor Q2 are commonly connected to the cathode of the diode D2 to form a voltage output line Vout of the 0-10V output circuit board; the emitter of the transistor Q2 is connected to the resistor R1, the resistor R2 and the resistor R5 are connected through the transistor Q3, the collector of the transistor Q3 and the resistor R2 are commonly connected to the base of the transistor Q2, the emitter of the transistor Q3 and the resistor R5 are commonly connected to one end of the capacitor C1, and the other end of the capacitor C1 and the base of the transistor Q3 are commonly connected The resistor R7 is connected, one end of the resistor R7 is connected to the capacitor C3 and forms a Vout interface corresponding to the main circuit board, the resistor R3 and the resistor R4 are connected to the other end of the capacitor C3 and form an FBN interface corresponding to the main circuit board; the resistor R1, the resistor R2 and the cathode of the diode D1 are connected to form a VCC interface corresponding to the main circuit board, the anode of the diode D1 is connected to the capacitor C2 to form a 24V power supply interface of the 0-10V output circuit board, the capacitor C2 is connected in series with the resistor R6, and the other end of the resistor R6 forms an OWI interface corresponding to the main circuit board; the resistor R4, the resistor R5 and the anode of the diode D2 are connected together to form a GND interface corresponding to the main circuit board and form the ground wire GND of the 0-10V output circuit board.

[0010] A further limitation of the above technical solution is characterized in that: the circuit diagram of the 0-5V output circuit board includes a diode D1, a voltage stabilizing diode D2, a voltage stabilizing diode D3, a capacitor C2 and a capacitor C4, the cathode of the diode D1 and the cathode of the diode D2 are connected to form a VCC interface corresponding to the main circuit board (41), the anode of the diode D1 forms a 5V power supply of the 0-5V output circuit board, and the anode of the voltage stabilizing diode D2 is grounded; the cathode of the voltage stabilizing diode D3 and one end of the capacitor C2 are connected to form an OWI interface, an out interface and an FBN interface corresponding to the main circuit board (41) and form a voltage output line Vout of the 0-5V output circuit board, the anode of the voltage stabilizing diode D3 and one end of the capacitor C2 and the capacitor C4 are connected to form a GND interface corresponding to the main circuit board (41) and form a ground line GND of the 0-5V output circuit board, and the other end of C4 is connected to the ground.

[0011] To further limit the above technical solution, the I2C output is to directly lead out four female headers VCC, GND, SDA, and SCL with sockets on the main circuit board.

[0012] The advantages of the present invention compared with the prior art are:

[0013] 1. When this solution is used, the pressure of the measured medium directly acts on the corrugated diaphragm of the sensor, causing the corrugated diaphragm to produce a micro-displacement proportional to the medium pressure and transmit it to the pressure sensitive chip through silicone oil, causing the resistance value of the sensor to change, thereby outputting an electrical signal that changes linearly proportional to the pressure; the double-layer structure of the digital temperature compensation double-layer circuit board in this solution realizes temperature compensation for the sensor in the full temperature range of -20 to 80°C, and the circuit board is integrated inside the sensor, so that the sensor directly converts the measured analog signal into a standard 4-20mA standard current signal output, omitting the existing core connection base, chip buffer pad and other structural parts, reducing the production cost and material cost to a certain extent. At the same time, the size of the digital temperature compensation double-layer circuit board is only 14.9mm, which improves the application problem in an environment with a small effective installation space due to the large product size to a certain extent;

[0014] 2. The output circuit board in this solution can be a 4-20mA standard output circuit board, or it can be replaced by a 0-10V output circuit board, a 0-5V output circuit board, and an I2C output circuit board. When it is necessary to change to 0-5V output or 0-10V output, it is only necessary to replace the corresponding output circuit board on the upper layer. When I2C output is required, only 4 wires are led out on the main circuit board, so that the core has multiple output modes, complete functions, and a wide range of applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of the present invention;

[0016] Figure 2 A circuit diagram of the main circuit board in the present invention;

[0017] Figure 3 The circuit diagram of the 4-20mA output circuit board of the present invention;

[0018] Figure 4 The circuit diagram of the 0-10V output circuit board of the present invention;

[0019] Figure 5 It is a circuit diagram of the 0-5V output circuit board in the present invention. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions. The elements defined by the sentence "includes a..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0022] See also Figure 1-5 , describing in detail the embodiments of the present invention,

[0023] Embodiment 1:

[0024] Transmitter cores with various outputs, such as Figure 1As shown, it includes a shell 1, a welding ring 7 is provided on the lower edge of the shell 1, a pressure sensitive chip 2 is provided at the lower part of the shell 1, a corrugated diaphragm 3 is fixed on the shell below the pressure sensitive chip 2, the upper part of the shell 1 is opened and a digital temperature compensation double-layer circuit board 4 is provided at the opening, the digital temperature compensation double-layer circuit board 4 is supported on the shell 1 as a whole through the sensor pin 5, the digital temperature compensation double-layer circuit board 4 includes a main circuit board 41 and an output circuit board 42 which are parallel to each other and maintain a certain distance from top to bottom, the main circuit board 41 is placed at the lower part of the output circuit board 42, the sensor interface on the main circuit board 41 is connected to the sensor pin on the pressure sensitive chip 2 through the lead in the sensor pin 5, the pressure sensitive chip 2 is encapsulated in the lower part of the shell 1 and filled with silicone oil medium, four I+, I-, S+, S- sensor pins are led out to be connected to the sensor interface corresponding to the main circuit board 41, and the analog signal is processed through the peripheral components of the circuit board and the NSA2860X digital conditioning chip. The output circuit board 42 is detachably connected to the main circuit board 41 via a connector 43. The detachable connection between the output circuit board 42 and the main circuit board 41 enables connection of corresponding network interfaces of the two circuit boards and replacement of output circuit boards 42 with different outputs. An air duct 6 connected to the air duct port of the sensor in the housing 1 is provided at the center of the digital temperature compensation double-layer circuit board 4.

[0025] The output circuit board 42 can be replaced with a 4-20mA output circuit board, a 0-10V output circuit board, a 0-5V output circuit board and an I2C output as needed.

[0026] Embodiment 2:

[0027] The circuit diagram of the main circuit board 41 is as follows: Figure 2As shown: the circuit diagram of the main circuit board 41: including a core interface and an NSA2860X digital conditioning chip, the core interface is provided with four pins I+, I-, S+, and S- connected to the pressure sensitive chip 2, the I+ pin of the core interface is connected to the IEXC1 and TEMP pins of the NSA2860X digital conditioning chip, the S+ pin of the core interface is connected to the VIP pin of the NSA2860X digital conditioning chip through resistors R20, C20 and C22, the S- pin of the core interface is connected to the NSA2860X digital conditioning chip through resistors R21, C22 and C21. The VIN pin of the chip is connected, the I- pin of the core interface is connected to resistor R22, one end of the resistor R20 and the VIP pin is connected to ground through capacitor C20, the resistor R20, the VIP pin and the capacitor C20 are connected to one end of the capacitor C22, the resistor R21 and the VIN pin are connected to the other end of the capacitor C22 and one end of the capacitor C21, and the other end of the capacitor C21 is connected to resistor R22 and grounded; one end of the capacitor C12 is connected to the AVDD pin of the NSA2860X digital conditioning chip, one end of the capacitor C13 is connected to the VREFP pin of the NSA2860X digital conditioning chip, and the The other ends of capacitors C12 and C13 are connected to the positive electrode of the voltage zener diode D2, capacitor C14 and grounded. The negative electrode of the voltage zener diode D2 and capacitor C14 are connected to the emitter E of the transistor Q2 and the VDDHV pin of the digital conditioning chip. The collector C and base B of the transistor Q2 are connected through a resistor R10. The base B of the transistor Q2 and one end of the resistor R10 are connected to the VCATE pin of the NSA2860X digital conditioning chip. The collector C of the transistor Q2 and the other end of the resistor R10 jointly form the VCC interface of the main circuit board 41. The NSA2860X digital The OWI pin of the conditioning chip is directly led out to form the OWI interface of the main circuit board 41; the VOUT pin of the NSA2860X digital conditioning chip is directly led out to form the Vout interface of the main circuit board 41; the FBN pin of the NSA2860X digital conditioning chip is directly led out to form the FBN interface of the main circuit board 41; the FIJTER pin of the NSA2860X digital conditioning chip is led out through capacitor C18 to form the GND interface of the main circuit board 41; the LOOPN pin of the NSA2860X digital conditioning chip is directly led out to form the LOOPN interface of the main circuit board 41.

[0028] Embodiment 3:

[0029] The circuit diagram of the 4-20mA output circuit board is as follows Figure 3As shown: the circuit diagram of the 4-20mA output circuit board: including a resistor R13 at one end forming a power supply VCC interface corresponding to the main circuit board, the other end of the resistor R13 is commonly connected to the collector of the inductor L3 and the transistor T1, the inductor L3 at one end is connected to the cathode of the diode D5, the resistor R14 at one end forms an OWI communication interface corresponding to the main circuit board, the other end of the resistor R14 is connected in series with a capacitor C16, the capacitor C16 and the anode of the diode D5 are commonly connected to the cathode of the diode D6 and connected to the 24V+ power supply connection terminal J3 of the 4-20mA output circuit board; the resistor R15 at one end forms a corresponding connection to the main circuit board The other end of the resistor R15 and the base of the transistor T1 are connected to one end of the capacitor C17, the other end of the capacitor C17 is connected to the emitter of the transistor and one end of the resistor R17, the other end of the resistor R17 is connected to the resistor R18 and forms an FBN interface and a GND interface corresponding to the main circuit board; the other end of the resistor R18 is connected to the inductor L4 and forms a LOOPN interface corresponding to the main circuit board and connected to the capacitor C19, the other end of C19 is connected to the ground, the inductor L4 is connected to the positive electrode of the diode D6 and forms a 4-20mA standard circuit signal output terminal J4 of the 4-20mA output circuit board.

[0030] Principle description: The pressure of the measured medium causes the sensor to generate a changing analog electrical signal, which is input into the NSA2860X digital conditioning chip through the P1 interface and the peripheral resistors R20, R21, R22, C20, C21, and C22 through the VIP and VIN pins. The 24VDC external power supply is converted into 5VDC through the peripheral circuit diode D5, inductor L3, resistor R13, transistor Q2, resistor R10, and diode D2 to power the NSA2860X. The NSA2860X communicates with the debugger through pin 18 and the peripheral resistor R14 and capacitor C16 using OWI communication. The peripheral devices transistor T1, capacitor C17, resistor R17, and resistor R18 provide 4-20mADC output current.

[0031] Embodiment 4:

[0032] The circuit diagram of the 0-10V output circuit board is as follows Figure 4As shown: it includes a resistor R1, a resistor R2, a resistor R3, a resistor R4, and a resistor R5, wherein the resistor R3 and the resistor R4 are connected in series, a transistor Q2 is connected between the resistor R3 and the resistor R1, the collector of the resistor R3 and the transistor Q2 are connected to the cathode of the diode D2 and form a voltage output line Vout of the 0-10V output circuit board; the emitter of the transistor Q2 is connected to the resistor R1, the resistor R2 and the resistor R5 are connected through the transistor Q3, the collector of the transistor Q3 and the resistor R2 are connected to the base of the transistor Q2, the emitter of the transistor Q3 and the resistor R5 are connected to one end of the capacitor C1, the other end of the capacitor C1 and the base of the transistor Q3 are connected to the resistor R7, one end of the resistor R7 and the capacitor C3 The resistors R3 and R4 are connected to form a Vout interface corresponding to the main circuit board 41, and the resistors R3 and R4 are connected to the other end of the capacitor C3 to form a FBN interface corresponding to the main circuit board 41; the resistors R1 and R2 are connected to the negative electrode of the diode D1 to form a VCC interface corresponding to the main circuit board 41, and the positive electrode of the diode D1 is connected to the capacitor C2 to form a 24V power supply interface of the 0-10V output circuit board. The capacitor C2 is connected in series with the resistor R6, and the other end of the resistor R6 forms an OWI interface corresponding to the main circuit board 41; the resistors R4, R5 and the positive electrode of the diode D2 are connected together to form a GND interface corresponding to the main circuit board 41 and form the grounding wire GND of the 0-10V output circuit board. In summary, the output of the 0-10V output circuit board is three silicone wires, namely, the 24V power supply interface of the 0-10V output circuit board, the voltage output line Vout of the 0-10V output circuit board, and the grounding wire GND of the 0-10V output circuit board.

[0033] Principle description: The 24V power supply is connected to the VCC of the main circuit board 41 through the diode D1 to provide power to the main circuit board 41; the debugger transmits signals through the capacitor C2 and the resistor R6 using OWI communication, and the IC voltage output signal passes through the resistor R7, the transistor Q3, the transistor Q2, and is output from the Vout port. The resistors R2 and R1 are current limiting resistors, the capacitors C3 and C1 act as filters to eliminate clutter, the resistors R3 and R4 are voltage dividers, and the FBN pin collects voltage through R4 and feeds it back to the IC for analog data processing. D2 is a voltage stabilizing diode that stabilizes the output voltage.

[0034] Embodiment 5:

[0035] The circuit diagram of the 0-5V output circuit board includes a diode D1, a voltage stabilizing diode D2, a voltage stabilizing diode D3, a capacitor C2 and a capacitor C4. The cathode of the diode D1 is connected to the cathode of the diode D2 to form a VCC interface corresponding to the main circuit board (41). The anode of the diode D1 forms a 5V power supply of the 0-5V output circuit board. The anode of the voltage stabilizing diode D2 is grounded. The cathode of the voltage stabilizing diode D3 is connected to one end of the capacitor C2 to form an OWI interface, an out interface and an FBN interface corresponding to the main circuit board (41) and to form a voltage output line Vout of the 0-5V output circuit board. The anode of the voltage stabilizing diode D3 is connected to one end of the capacitor C2 and one end of the capacitor C4 to form a GND interface corresponding to the main circuit board (41) and to form a ground line GND of the 0-5V output circuit board. The other end of C4 is connected to the ground.

[0036] Principle description: 5V power supply provides voltage to the main circuit board 41 through diode D1, and diode D2 is a voltage regulator to stabilize the power supply voltage and reduce ripple. OWI, OUT, and FBN are short-circuited, and then the voltage is stabilized by capacitor C2 and diode D3, and then a 0-5V signal is output through J2. GND is connected to the ground through capacitor C4 to prevent interference.

[0037] Embodiment 6:

[0038] The I2C output is directly connected to the main circuit board 41 by leading out four female headers VCC, GND, SDA, and SCL with sockets.

[0039] When the present invention is in use, the pressure of the measured medium directly acts on the corrugated diaphragm 3 of the sensor, causing the corrugated diaphragm 3 to produce a micro-displacement proportional to the medium pressure and transmit it to the pressure sensitive chip 2 through silicone oil, causing the resistance value of the sensor to change, thereby outputting an electrical signal that changes linearly proportional to the pressure.

[0040] The double-layer structure of the digital temperature compensation double-layer circuit board in the present invention realizes temperature compensation for the sensor in the full temperature range of -20 to 80°C, and the circuit board is integrated inside the sensor, so that the sensor directly converts the measured analog signal into a standard 4-20mA standard current signal output, omitting existing core connection bases, chip buffer pads and other structural parts, reducing production costs and material costs to a certain extent. At the same time, the size of the digital temperature compensation double-layer circuit board is only 14.9mm, which improves the application problem in an environment with a small effective installation space due to the large size of the product to a certain extent.

[0041] The output circuit board 42 in the present invention can be a circuit board with a 4-20mA standard output, or can be replaced by a 0-10V output circuit board, a 0-5V output circuit board, and an I2C output circuit board. When it is necessary to change to 0-5V output or 0-10V output, it is only necessary to replace the corresponding output circuit board on the upper layer. When I2C output is required, only 4 wires need to be led out on the main circuit board, so that the core has multiple output modes, complete functions, and a wide range of applications.

[0042] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0043] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A transmitter core with multiple outputs, comprising a housing (1), wherein a welding ring (7) is provided at a lower edge of the housing (1), characterized in that: A pressure sensitive chip (2) is provided at the lower part of the shell (1); a corrugated diaphragm (3) is fixed on the shell below the pressure sensitive chip (2); the upper part of the shell (1) is open and a digital temperature compensation double-layer circuit board (4) is provided at the opening; the digital temperature compensation double-layer circuit board (4) is supported on the shell (1) as a whole through sensor pins (5); the digital temperature compensation double-layer circuit board (4) comprises a main circuit board (41) and an output circuit board (42) which are parallel to each other and maintain a certain distance from each other; the main circuit board (41) is placed at the lower part of the output circuit board (42); The sensor interface on the circuit board (41) is connected to the sensor pin on the pressure sensitive chip (2) via the lead wire in the sensor pin (5); the output circuit board (42) and the main circuit board (41) are detachably connected via the connector (43); the detachable connection between the output circuit board (42) and the main circuit board (41) realizes the connection of the corresponding network interfaces of the two circuit boards and the replacement of the output circuit board (42) with different outputs; an air guide tube (6) connected to the sensor air guide port in the housing (1) is provided at the center of the digital temperature compensation double-layer circuit board (4); The output circuit board (42) can be replaced with a 4-20mA output circuit board, a 0-10V output circuit board, a 0-5V output circuit board and an I2C output as required.

2. The transmitter core with multiple outputs according to claim 1, characterized in that: The circuit diagram of the main circuit board (41) includes a core interface and an NSA2860X digital conditioning chip. The core interface is provided with four pins I+, I-, S+, and S- connected to the pressure sensitive chip (2). The I+ pin of the core interface is connected to the NSA2860X digital conditioning chip. The IEXC1 and TEMP pins of the digital conditioning chip are connected, the S+ pin of the core interface is connected to the VIP pin of the NSA2860X digital conditioning chip through resistors R20, C20 and C22, the S- pin of the core interface is connected to the VIN pin of the NSA2860X digital conditioning chip through resistors R21, C22 and C21, the I- pin of the core interface is connected to resistor R22, one end of the resistor R20 and the VIP pin is connected to ground through capacitor C20, the resistor R20, the VIP pin and the capacitor C20 are connected to one end of the capacitor C22, the resistor R21 and the VIN pin are connected to the other end of the capacitor C22 and one end of the capacitor C21, the other end of the capacitor C21 is connected to resistor R22 and grounded; one end of the capacitor C12 is connected to the AVDD pin of the NSA2860X digital conditioning chip, and one end of the capacitor C13 is connected to the NSA2860X The VREFP pin of the digital conditioning chip, the other ends of the capacitors C12 and C13 are connected to the positive electrode of the voltage stabilizing diode D2, the capacitor C14 and grounded, the negative electrode of the voltage stabilizing diode D2 and the capacitor C14 are connected to the emitter E of the transistor Q2 and the VDDHV pin of the digital conditioning chip, the collector C and the base B of the transistor Q2 are connected through a resistor R10, the base B of the transistor Q2 and one end of the resistor R10 are connected to the VCATE pin of the NSA2860X digital conditioning chip, the collector C of the transistor Q2 and the other end of the resistor R10 form a VCC interface of the main circuit board (41); the OWI pin of the NSA2860X digital conditioning chip is led out to directly form the OWI interface of the main circuit board (41); the VOUT pin of the NSA2860X digital conditioning chip is led out to directly form the Vout interface of the main circuit board (41); the NSA2860X The FBN pin of the digital conditioning chip is led out to directly form the FBN interface of the main circuit board (41); the FIJTER pin of the NSA2860X digital conditioning chip is led out through a capacitor C18 to form the GND interface of the main circuit board (41); and the LOOPN pin of the NSA2860X digital conditioning chip is led out to directly form the LOOPN interface of the main circuit board (41).

3. The transmitter core with multiple outputs according to claim 2, characterized in that: The circuit diagram of the 4-20mA output circuit board includes: one end of a resistor R13 forms a power supply VCC interface corresponding to the main circuit board (41); the other end of the resistor R13 is commonly connected to the collector of the inductor L3 and the transistor T1; one end of the inductor L3 is connected to the cathode of the diode D5; one end of the resistor R14 forms an OWI communication interface corresponding to the main circuit board (41); the other end of the resistor R14 is connected in series with a capacitor C16; the capacitor C16 and the anode of the diode D5 are commonly connected to the cathode of the diode D6 and connected to the 24V+ power supply connection terminal J3 of the 4-20mA output circuit board; one end of the resistor R15 forms a power supply VCC interface corresponding to the main circuit board (41); The other end of the resistor R15 and the base of the transistor T1 are connected to one end of the capacitor C17, the other end of the capacitor C17 is connected to the emitter of the transistor and one end of the resistor R17, the other end of the resistor R17 is connected to the resistor R18 and forms an FBN interface and a GND interface corresponding to the main circuit board (41); the other end of the resistor R18 is connected to the inductor L4 and forms a LOOPN interface corresponding to the main circuit board (41) and connected to the capacitor C19, the other end of the C19 is connected to the ground, the inductor L4 is connected to the positive electrode of the diode D6 and forms a 4-20mA standard circuit signal output terminal J4 of the 4-20mA output circuit board.

4. The transmitter core with multiple outputs according to claim 2, characterized in that: The circuit diagram of the 0-10V output circuit board includes: a transistor Q2 is connected between the resistor R3 and the resistor R1, the collector of the resistor R3 and the transistor Q2 are connected to the cathode of the diode D2 and form a voltage output line Vout of the 0-10V output circuit board; the emitter of the transistor Q2 is connected to the resistor R1, the resistor R2 and the resistor R5 are connected through the transistor Q3, the collector of the transistor Q3 and the resistor R2 are connected to the base of the transistor Q2, the emitter of the transistor Q3 and the resistor R5 are connected to one end of the capacitor C1, the other end of the capacitor C1 and the base of the transistor Q3 are connected to the resistor R7, one end of the resistor R7 is connected to the capacitor C3 and forms a corresponding connection with the main circuit board (41) The resistor R3 and the resistor R4 are connected to the other end of the capacitor C3 to form an FBN interface connected to the main circuit board (41); the resistor R1 and the resistor R2 are connected to the cathode of the diode D1 to form a VCC interface connected to the main circuit board (41); the anode of the diode D1 is connected to the capacitor C2 to form a 24V power supply interface of the 0-10V output circuit board; the capacitor C2 is connected in series with the resistor R6; the other end of the resistor R6 forms an OWI interface connected to the main circuit board (41); the resistor R4, the resistor R5 and the anode of the diode D2 are connected together to form a GND interface connected to the main circuit board (41) and form a ground line GND of the 0-10V output circuit board.

5. The transmitter core with multiple outputs according to claim 2, characterized in that: The circuit diagram of the 0-5V output circuit board comprises a diode D1, a voltage stabilizing diode D2, a voltage stabilizing diode D3, a capacitor C2 and a capacitor C4; the cathode of the diode D1 and the cathode of the diode D2 are connected to form a VCC interface corresponding to the main circuit board (41); the anode of the diode D1 forms a 5V power supply of the 0-5V output circuit board; the anode of the voltage stabilizing diode D2 is grounded; the cathode of the voltage stabilizing diode D3 and one end of the capacitor C2 are connected to form an OWI interface, an out interface and an FBN interface corresponding to the main circuit board (41) and form a voltage output line Vout of the 0-5V output circuit board; the anode of the voltage stabilizing diode D3 and one end of the capacitor C2 and the capacitor C4 are connected to form a GND interface corresponding to the main circuit board (41) and form a ground line GND of the 0-5V output circuit board; the other end of C4 is connected to the ground.

6. The transmitter core with multiple outputs according to claim 2, characterized in that: The I2C output is directly connected to the main circuit board (41) by leading out four female headers with sockets, namely VCC, GND, SDA and SCL.

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