A patch type optical receiver, optical receiving module and electronic device

Abstract

The present invention provides a patch type optical receiver, an optical receiving module and an electronic device. Since the optical receiving chip and the processing chip are arranged on the supporting part along the first direction, the width of the supporting part in the second direction is approximately equal to the width of the optical receiving chip. The second direction is perpendicular to the first direction. Moreover, the shielding part is bent to the top of the chip, and the pin part is bent to the bottom of the chip, so that the width of the lead frame in the second direction is approximately equal to the width of the supporting part. Therefore, the width of the optical receiver in the second direction can be approximately equal to the width of the optical receiving chip. Moreover, since at least two optical receiving chips are used in the present invention, the width of each optical receiving chip in the second direction can be reduced compared with the optical receiver using one optical receiving chip. Therefore, the width of the patch type optical receiver in the second direction can be reduced, and then the total thickness of the assembled optical receiver and the PCB board and the effective width of the frame of the television can be reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of infrared light receivers, and more specifically, to a patch type light receiver, a light receiving module and an electronic device. Background Art

[0002] Infrared light receivers are widely used in the field of short-range wireless communications. Figure 1 As shown, an infrared light receiver is installed in the frame area A of the TV display to realize the communication between the TV and the remote control. However, as the TV display becomes frameless, the size of the infrared light receiver limits the effective width of the TV display frame, so that the frame of the TV display cannot be further narrowed.

[0003] like Figure 2 As shown, the infrared light receiver 10 needs to be assembled on a PCB (Printed Circuit Board) board 11 and then installed in the frame area A of the TV display. However, whether it is a plug-in infrared light receiver 10a or a patch infrared light receiver 10b, the total thickness d after assembly is equal to the sum of the width d1 of the infrared light receiver 10 and the thickness d2 of the PCB board 11. When the thickness d2 of the PCB board 11 is constant, the total thickness d after assembly is determined by the width d1 of the infrared light receiver 10. Therefore, how to reduce the width d1 of the infrared light receiver 10 is one of the problems that technicians in this field need to solve urgently. Summary of the invention

[0004] In view of this, the present invention provides a patch type optical receiver, an optical receiving module and an electronic device to reduce the width of the infrared light receiver and further reduce the width of the frame of the electronic device.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A patch type optical receiver, comprising:

[0007] At least two light-receiving chips;

[0008] A processing chip, wherein the processing chip is connected to the at least two light receiving chips through inner leads;

[0009] A lead frame, the lead frame comprising a support portion, a shielding portion and a pin portion, the shielding portion is connected to the support portion, and the pin portion is at least partially connected to the support portion;

[0010] The at least two light-receiving chips and the processing chip are sequentially arranged along a first direction and fixed on the supporting portion, so that a width of the supporting portion in a second direction is approximately equal to a width of the light-receiving chip in the second direction, the second direction is perpendicular to the first direction, and a plane formed by the first direction and the second direction is parallel to a light-receiving surface of the light-receiving chip;

[0011] The shielding portion is bent to the top of the light receiving chip and the processing chip, and the pin portion is bent to the bottom of the light receiving chip and the processing chip, so that the width of the lead frame in the second direction is approximately equal to the width of the supporting portion in the second direction;

[0012] Wherein, the light receiving surface of the light receiving chip faces the shielding portion, and the shielding portion has at least two hollow areas, and the hollow areas expose the light receiving surface of the light receiving chip;

[0013] The pin portion includes a plurality of pins, the plurality of pins are respectively connected to a plurality of output terminals of the processing chip through inner leads, and the pins extend along a third direction, which is perpendicular to both the first direction and the second direction.

[0014] Optionally, the optical receiver includes two light receiving chips;

[0015] The two light receiving chips are respectively arranged on two sides of the processing chip.

[0016] Optionally, at least two lenses are also included;

[0017] The at least two lenses are respectively arranged on top of the at least two light receiving chips.

[0018] Optionally, it also includes a packaging body;

[0019] The light receiving chip, the processing chip, the supporting part and the shielding part are packaged inside the package body, the pin part extends to the outside of the package body, and the lens is packaged on the top of the package body.

[0020] Optionally, the package body further comprises two positioning steps;

[0021] The two positioning steps are respectively arranged on two opposite sides of the packaging body along the first direction.

[0022] Optionally, the package body is made by using a glue potting packaging process.

[0023] A light receiving module comprises a PCB board and a light receiver;

[0024] The optical receiver is a patch type optical receiver as described in any one of the above items;

[0025] The pins of the optical receiver are attached to the surface of the PCB board and are electrically connected to the circuit on the PCB board.

[0026] Optionally, the optical receiver is partially embedded in the PCB board along the second direction, and the positioning step of the optical receiver fixes the optical receiver part above the PCB board so that the pins of the optical receiver are attached to the surface of the PCB board;

[0027] Furthermore, the PCB board on the top of the lens of the optical receiver is hollowed out so that the lens of the optical receiver is exposed from the PCB board.

[0028] An electronic device comprises the light receiving module as described above.

[0029] Optionally, the electronic device includes a television, and the light receiving module is arranged in a frame area of ​​the television.

[0030] Compared with the prior art, the technical solution provided by the present invention has the following advantages:

[0031] The patch optical receiver, optical receiving module and electronic device provided by the present invention, because at least two light receiving chips and processing chips are arranged in sequence on the supporting part along the first direction, the width of the supporting part in the second direction is approximately equal to the width of the light receiving chip in the second direction, the second direction is perpendicular to the first direction, and the shielding part is bent to the top of the light receiving chip and the processing chip, and the pin part is bent to the bottom of the light receiving chip and the processing chip, so that the width of the lead frame in the second direction is approximately equal to the width of the supporting part in the second direction, therefore, the width of the patch optical receiver in the second direction can be made approximately equal to the width of the light receiving chip in the second direction. Moreover, because at least two light receiving chips are used in the present invention, compared with the optical receiver using one light receiving chip, the area of ​​each light receiving chip can be reduced, that is, the width of each light receiving chip in the second direction can be reduced, therefore, the width of the patch optical receiver in the second direction can be reduced, and then the total thickness of the assembled optical receiver and PCB board and the effective width of the frame of the television can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0033] Figure 1 It is a structural schematic diagram of an existing television display;

[0034] Figure 2 for Figure 1 A magnified image of the middle frame area A;

[0035] Figure 3 It is a structural schematic diagram of an existing plug-in infrared light receiver;

[0036] Figure 4 It is a structural schematic diagram of an existing patch-type infrared light receiver;

[0037] Figure 5 for Figure 4 The side view structural diagram of the patch type infrared light receiver shown;

[0038] Figure 6 A schematic side view of the structure of a light receiving chip and a bent lead frame provided in one embodiment of the present invention;

[0039] Figure 7 A schematic diagram of a top view of a light receiving chip, a processing chip and an unbent lead frame provided in one embodiment of the present invention;

[0040] Figure 8 It is a schematic diagram of a top view structure of an existing infrared light receiver;

[0041] Fig. 9 A schematic diagram of the side structure of a patch type optical receiver provided by one embodiment of the present invention;

[0042] Fig.10 A schematic cross-sectional structure diagram of a patch type optical receiver provided by one embodiment of the present invention;

[0043] Fig.11 A schematic diagram of the side structure of a patch type optical receiver provided by another embodiment of the present invention;

[0044] Fig.12 A schematic cross-sectional structure diagram of a patch type optical receiver provided in another embodiment of the present invention;

[0045] Fig.13 A schematic diagram of the three-dimensional structure of a light receiving module provided by an embodiment of the present invention;

[0046] Fig.14 A schematic front view of the structure of an optical receiving module provided by one embodiment of the present invention;

[0047] Fig.15 A partially enlarged structural schematic diagram of an electronic device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0048] As described in the background art, the width d1 of the infrared light receiver 10 is relatively large, which results in the border of the TV display being unable to be further narrowed. The inventors have found that the main reason for this problem is that the inherent structure of the infrared light receiver 10 limits the reduction of the width d1 of the infrared light receiver 10.

[0049] like Figures 3 to 5 As shown, the infrared light receiver 10 includes a light receiving chip 101 and a processing chip 102, and the light receiving chip 101 and the processing chip 102 are fixed on a metal lead frame 103 to be electrically connected to the PCB board 11 through the metal lead frame 103. In addition, in order to maintain a high sensitivity, a focusing convex lens 104 is also required to be installed on the top of the light receiving chip 101. In addition, in order to improve and enhance the anti-electromagnetic interference capability of the chip, an electromagnetic shielding cover 105 is also required. These structures make it difficult to make the volume of the infrared light receiver 10 very small, and further make it difficult to make the total thickness d of the infrared light receiver 10 and the PCB board 11 very small.

[0050] Based on this, the present invention provides a patch type optical receiver, an optical receiving module and an electronic device to overcome the above problems existing in the prior art, wherein the optical receiver comprises:

[0051] At least two light-receiving chips;

[0052] A processing chip, wherein the processing chip is connected to the at least two light receiving chips through inner leads;

[0053] A lead frame, the lead frame comprising a support portion, a shielding portion and a pin portion, the shielding portion is connected to the support portion, and the pin portion is at least partially connected to the support portion;

[0054] The at least two light-receiving chips and the processing chip are sequentially arranged along a first direction and fixed on the supporting portion, so that a width of the supporting portion in a second direction is approximately equal to a width of the light-receiving chip in the second direction, the second direction is perpendicular to the first direction, and a plane formed by the first direction and the second direction is parallel to a light-receiving surface of the light-receiving chip;

[0055] The shielding portion is bent to the top of the light receiving chip and the processing chip, and the lead portion is bent to the bottom of the light receiving chip and the processing chip, so that the width of the lead frame in the second direction is approximately equal to the width of the light receiving chip;

[0056] Wherein, the light receiving surface of the light receiving chip faces the shielding portion, and the shielding portion has at least two hollow areas, and the hollow areas expose the light receiving surface of the light receiving chip;

[0057] The pin portion includes a plurality of pins, the plurality of pins are respectively connected to a plurality of output terminals of the processing chip through inner leads, and the pins extend along a third direction, which is perpendicular to both the first direction and the second direction.

[0058] The patch optical receiver, optical receiving module and electronic device provided by the present invention, since the width of the supporting part in the second direction is approximately equal to the width of the light receiving chip in the second direction, and the width of the lead frame in the second direction is approximately equal to the width of the supporting part in the second direction, therefore, the width of the patch optical receiver in the second direction can be made approximately equal to the width of the light receiving chip in the second direction. In addition, since at least two light receiving chips are used in the present invention, compared with an optical receiver using one light receiving chip, the area of ​​each light receiving chip can be reduced, that is, the width of each light receiving chip in the second direction can be reduced, therefore, the width of the patch optical receiver in the second direction can be reduced, and further the total thickness of the assembled optical receiver and PCB board and the effective width of the frame of the television can be reduced.

[0059] The above is the core idea of ​​the present invention. In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in combination with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0060] The embodiment of the present invention provides a patch type optical receiver, such as Figure 6 and Figure 7 As shown, the patch type optical receiver includes at least two light receiving chips 20 , a processing chip 21 and a lead frame 22 .

[0061] The light receiving chip 20 includes a photodiode for sensing light signals, performing photoelectric conversion, and outputting electrical signals. Optionally, the light receiving chip 20 is an infrared light receiving chip, that is, the light signal sensed by the light receiving chip is infrared light.

[0062] The processing chip 21, namely the IC (Integrated Circuit Chip), is connected to at least two light receiving chips 20 through inner leads. In some embodiments of the present invention, the patch type optical receiver includes two light receiving chips 20, such as Figure 7As shown, two light receiving chips 20 are respectively arranged on both sides of a processing chip 21. The processing chip 21 is used to receive the electrical signal output by the light receiving chip 20, filter and demodulate the electrical signal to obtain the information carried by the optical signal, and execute corresponding programs according to the obtained information.

[0063] The lead frame 22 includes a support portion 220 , a shielding portion 221 , and a lead portion 222 . The shielding portion 221 is connected to the support portion 220 , and the lead portion 222 is at least partially connected to the support portion 220 .

[0064] in, Figure 6 is a schematic side view of the light receiving chip 20 and the bent lead frame 22, Figure 7 is a schematic diagram of a top view of the light receiving chip 20, the processing chip 21 and the unbent lead frame 22, that is, Figure 7 The shielding part 221 in the lead frame 22 is bent 90 degrees to the outside of the paper along the six V-shaped grooves 2211 reserved on the lead frame 22 to form Figure 6 The shape shown in Figure 7 The pin portion 222 in the paper is bent into the paper to form Figure 6 In some embodiments of the present invention, Figure 6 As shown, the shape of the bent lead frame 22 is similar to a bow, but the present invention is not limited thereto.

[0065] like Figure 7 As shown, at least two light receiving chips 20 and the processing chip 21 are arranged in sequence along the first direction X and fixed on the supporting part 220, so that the width L1 of the supporting part 220 in the second direction Y is approximately equal to the width L2 of the light receiving chip 20 in the second direction, the second direction Y is perpendicular to the first direction X, and the plane formed by the first direction X and the second direction Y is parallel to the light receiving surface of the light receiving chip 20 and also parallel to the plane where the supporting part 220 is located.

[0066] The shielding part 221 is bent to the top of the light receiving chip 20 and the processing chip 21, and the pin part 222 is bent to the bottom of the light receiving chip 20 and the processing chip 21, so that the width L3 of the lead frame 22 in the second direction Y is approximately equal to the width L1 of the supporting part 220 in the second direction Y.

[0067] The light receiving surface of the light receiving chip 20 faces the shielding portion 221 , and the shielding portion 221 has at least two hollow regions 2210 , and the hollow regions 2210 expose the light receiving surface of the light receiving chip 20 .

[0068] It should be noted that in some embodiments of the present invention, the material of the lead frame 22 is metal, such as copper, iron, aluminum, etc. The metal shielding portion 221 can shield external electromagnetic signals to prevent the electromagnetic signals from interfering with the light receiving chip 20 and the processing chip 21 .

[0069] In the embodiment of the present invention, the pin portion 222 includes a plurality of pins 2220, and the plurality of pins 2220 are respectively connected to a plurality of output terminals of the processing chip 21 through inner leads, wherein Figure 7 As shown, at least one pin 2220 is connected to the support portion 220, and other pins 2220 are not connected to the support portion 220 to avoid short circuits between the pins 2220. In addition, each pin 2220 is connected to the output end of the processing chip 21 through a lead. Figure 6 As shown, the bent pin 2220 extends along the third direction Z, and the third direction Z is perpendicular to both the first direction X and the second direction Y.

[0070] Since the width L1 of the support portion 220 in the second direction Y is approximately equal to the width L2 of the light receiving chip 20 in the second direction Y, and the width L3 of the lead frame 22 in the second direction Y is approximately equal to the width L1 of the support portion 220 in the second direction Y, the width of the patch optical receiver in the second direction Y can be approximately equal to the width L2 of the light receiving chip 20 in the second direction Y. In addition, since at least two small light receiving chips 20 are used in the present invention, Figure 8 Compared with the optical receiver using a large light receiving chip as shown, L3 is smaller than L4, that is, the width of each light receiving chip 20 in the second direction Y can be reduced. Therefore, the width of the patch type optical receiver in the second direction Y can be reduced, and then the total thickness of the assembled optical receiver and PCB board and the effective width of the TV frame can be reduced.

[0071] In the embodiment of the present invention, Fig. 9 and Fig.10 As shown, the optical receiver further includes at least two lenses 23, wherein the at least two lenses 23 are respectively arranged on the top of at least two light receiving chips 20. Optionally, the lens 23 is a convex lens, which is used to converge light and converge the optical signal to the light receiving surface of the light receiving chip 20.

[0072] In the embodiment of the present invention, Fig. 9 and Fig.10 As shown, it also includes a package body 24 . The light receiving chip 20 , the processing chip 21 , the support part 220 and the shielding part 221 are packaged inside the package body 24 , the pin part 222 extends to the outside of the package body 24 , and the lens 23 is packaged on the top of the package body 24 .

[0073] In some embodiments of the present invention, Fig.11 and Fig.12 As shown, the package body 24 further includes two positioning steps 240. The two positioning steps 240 are respectively arranged on two opposite sides of the package body 24 along the first direction X.

[0074] In some embodiments of the present invention, the package body 24 is made by a glue potting packaging process. In the embodiments of the present invention, the epoxy resin glue potting packaging process is used to form the package body 24. Since the glue potting process has low packaging cost and high production efficiency, it can improve the production efficiency of the optical receiver provided by the embodiment of the present invention and reduce its production cost.

[0075] The embodiment of the present invention also provides a light receiving module, such as Fig.13 As shown, it includes a PCB board 1 and a light receiver 2. The light receiver 2 is a patch type light receiver as provided in any of the above embodiments. Optionally, the light receiver 2 is an infrared light receiver. The PCB board 1 has an electronic circuit for driving the light receiver 2. Fig.13 As shown, the pin 2220 of the optical receiver 2 is attached to the surface of the PCB board 1 and is electrically connected to the circuit on the PCB board 1 .

[0076] like Fig.13 and Fig.14 As shown, the optical receiver 2 is partially embedded in the PCB board 1 along the second direction Y, and the positioning step 240 of the optical receiver 2 fixes the optical receiver 2 part above the PCB board 1, so that the pin 2220 of the optical receiver 2 is attached to the surface of the PCB board 1. In addition, the PCB board 1 at the top of the lens 23 of the optical receiver 2 is hollowed out, so that the lens 23 of the optical receiver 2 is exposed on the PCB board 1.

[0077] An embodiment of the present invention further provides an electronic device, which includes the light receiving module 10c provided in the above embodiment.

[0078] In the embodiment of the present invention, the electronic device includes a television, and the light receiving module 10c is arranged in the frame area of ​​the television. Figure 1 The light receiving module 10c is arranged in the longitudinal frame area A of the television. Fig.15 As shown, the extension direction of the long side of the frame of the television is the same as the arrangement direction of the light receiving chip and the processing chip in the light receiver 2 in the light receiving module 10c, that is, the arrangement direction X of the lens 23. Of course, the present invention is not limited to this. In another embodiment, if the light receiving module 10c is set in the horizontal frame area of ​​the television, the extension direction of the long side of the frame of the television is perpendicular to the arrangement direction of the light receiving chip and the processing chip in the light receiver 2 in the light receiving module 10c, that is, the arrangement direction X of the lens 23.

[0079] Since the optical receiver 2 is partially embedded in the PCB board 1 along the second direction Y, the total thickness of the PCB board 1 and the optical receiver 2 is less than the sum of the thickness of the PCB board 1 and the width L of the optical receiver 2. Optionally, the total thickness of the PCB board 1 and the optical receiver 2 is equal to the width L of the optical receiver 2. Based on this, in the embodiment of the present invention, not only can the total thickness of the PCB board 1 and the optical receiver 2 be reduced by reducing the width L of the optical receiver 2, but also the total thickness of the PCB board 1 and the optical receiver 2 can be reduced by partially embedding the optical receiver 2 in the PCB board 1.

[0080] In some embodiments of the present invention, the total thickness of the existing plug-in infrared light receiver 10a is approximately 8.5 mm, the total thickness of the existing patch-type infrared light receiver 10b is approximately 4.6 mm, and the total thickness of the light receiving module 10c in the embodiment of the present invention is approximately 2.7 mm. Compared with the existing plug-in infrared light receiver 10a and the patch-type infrared light receiver 10b, the total thickness of the light receiving module 10c in the embodiment of the present invention is greatly reduced, thereby greatly reducing the width of the TV frame.

[0081] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments, and the same and similar parts between the embodiments can be referred to each other. The above description of the disclosed embodiments enables professionals and technicians in this field to implement or use the present invention. Various modifications to these embodiments will be obvious to professionals and technicians in this field, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to these embodiments shown in this article, but will comply with the widest range consistent with the principles and novel features disclosed herein.

Claims

1. A patch type optical receiver, characterized in that: include: At least two light-receiving chips; A processing chip, wherein the processing chip is connected to the at least two light receiving chips through inner leads; A lead frame, the lead frame comprising a support portion, a shielding portion and a pin portion, the shielding portion is connected to the support portion, and the pin portion is at least partially connected to the support portion; The at least two light-receiving chips and the processing chip are sequentially arranged along a first direction and fixed on the supporting portion, so that a width of the supporting portion in a second direction is approximately equal to a width of the light-receiving chip in the second direction, the second direction is perpendicular to the first direction, and a plane formed by the first direction and the second direction is parallel to a light-receiving surface of the light-receiving chip; The shielding portion is bent to the top of the light receiving chip and the processing chip, and the pin portion is bent to the bottom of the light receiving chip and the processing chip, so that the width of the lead frame in the second direction is approximately equal to the width of the supporting portion in the second direction; Wherein, the light receiving surface of the light receiving chip faces the shielding portion, and the shielding portion has at least two hollow areas, and the hollow areas expose the light receiving surface of the light receiving chip; The pin part includes a plurality of pins, and the plurality of pins are respectively connected to the plurality of output terminals of the processing chip through inner leads, and the pins extend along a third direction, and the third direction is perpendicular to both the first direction and the second direction. The pins of the optical receiver are attached to the surface of the PCB board, and the second direction is perpendicular to the surface of the PCB board.

2. The patch type optical receiver according to claim 1, characterized in that: The optical receiver includes two light receiving chips; The two light receiving chips are respectively arranged on two sides of the processing chip.

3. The patch type optical receiver according to claim 1, characterized in that: Also comprising at least two lenses; The at least two lenses are respectively arranged on top of the at least two light receiving chips.

4. The patch type optical receiver according to claim 3, characterized in that: Also includes a package body; The light receiving chip, the processing chip, the supporting part and the shielding part are packaged inside the package body, the pin part extends to the outside of the package body, and the lens is packaged on the top of the package body.

5. The patch type optical receiver according to claim 4, characterized in that: The package body also includes two positioning steps; The two positioning steps are respectively arranged on two opposite sides of the packaging body along the first direction.

6. The patch type optical receiver according to claim 4, characterized in that: The packaging body is made by adopting a glue-filling packaging process.

7. A light receiving module, characterized in that: Including PCB board and optical receiver; The optical receiver is a patch type optical receiver according to any one of claims 1 to 6; The pins of the optical receiver are attached to the surface of the PCB board and are electrically connected to the circuit on the PCB board.

8. The optical receiving module according to claim 7, characterized in that: The optical receiver is partially embedded in the PCB board along the second direction, and the positioning step of the optical receiver fixes the optical receiver part above the PCB board so that the pins of the optical receiver are attached to the surface of the PCB board; Furthermore, the PCB board on the top of the lens of the optical receiver is hollowed out so that the lens of the optical receiver is exposed from the PCB board.

9. An electronic device, characterized in that: Includes the light receiving module described in claim 7 or 8.

10. The electronic device according to claim 9, characterized in that: The electronic device includes a television, and the light receiving module is arranged in a frame area of ​​the television.

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