A semiconductor intelligent sand blowing production line

Abstract

The present invention relates to the field of semiconductor wafer technology, and specifically to a semiconductor intelligent sand blowing production line, which can improve sand blowing efficiency and is easy to operate. The sand blowing production line comprises a workbench and a sand blowing machine, and is characterized in that a material box grabbing robot, an intermediate film picking robot, and a sand blowing film picking robot are arranged next to the workbench, and two positioning tables corresponding to the sand blowing film picking robots and two material box placement areas corresponding to the intermediate film picking robots are arranged on the workbench. The sand blowing machine comprises a turntable, and wafer placing plates are evenly arranged on the turntable. The wafer placing plates are arranged obliquely and wafer support columns are arranged on the upper end faces.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor wafers, and in particular to a semiconductor intelligent sand blowing production line. Background Art

[0002] Silicon is a gray, brittle, tetravalent non-metallic chemical element. Semiconductor wafers are mainly composed of silicon, which is a thin gray disc that is very easy to break. After processing, they need to be blown away by a sand blower. The traditional operation is done manually, taking it out from the material box and putting it into the sand blower. After the sand blowing is completed, it is taken out and put back into the material box. The operation is difficult and the efficiency is low. Summary of the invention

[0003] In order to solve the problems of low efficiency, difficult operation and easy fragmentation of existing semiconductor wafer sand blowing operations, the present invention provides a semiconductor intelligent sand blowing production line, which can improve the sand blowing efficiency and is easy to operate.

[0004] The technical solution is as follows: a semiconductor intelligent sand blowing production line, which includes a workbench and a sand blowing machine, characterized in that a material box grabbing robot, an intermediate film picking robot, and a sand blowing film picking robot are arranged next to the workbench, and two positioning tables corresponding to the sand blowing film picking robots and two material box placement areas corresponding to the intermediate film picking robots are arranged on the workbench. The sand blowing machine includes a turntable, and wafer placing plates are evenly arranged on the turntable. The wafer placing plates are arranged at an angle and wafer support columns are arranged on the upper end surface.

[0005] It is further characterized in that a material box manipulator is installed on the material box grasping robot, and the material box manipulator includes a symmetrically arranged left clamping plate and a right clamping plate, the left clamping plate and the right clamping plate are respectively installed on one end of the left clamping jaw and the right clamping jaw, and the other ends of the left clamping jaw and the right clamping jaw are respectively connected to a fixed seat through a connecting rod, and the connecting rod includes a front connecting rod and a rear connecting rod arranged in parallel, and the two ends of the front connecting rod are respectively hinged to the left clamping jaw / right clamping jaw and the fixed seat, and one end of the rear connecting rod is hinged to the left clamping jaw or the right clamping jaw, and a gear is installed on the other end, and the gears connected by the two rear connecting rods are meshed, and one of the gears is connected to a driving motor;

[0006] The inner side surfaces of the left clamping plate and the right clamping plate are both serrated surfaces, and the outer side surfaces of the left clamping plate and the right clamping plate are respectively fixedly connected to the left clamping jaw and the right clamping jaw through a connecting frame;

[0007] The intermediate slice picking robot is provided with an intermediate slice picking manipulator, and the intermediate slice picking manipulator comprises two slice picking forks, and a vacuum suction hole is provided on the upper surface of the end of the slice picking fork, and an air passage connected with the vacuum suction hole is provided in the slice picking fork;

[0008] The sand blowing and film taking robot is equipped with two flexible claws, the outer surface of the flexible claws is a silicone layer, an air cavity is arranged inside the flexible claws, and the air cavity is connected to the air source through a hose;

[0009] A cylindrical groove is provided in the middle of the positioning platform, a step surface for supporting the semiconductor wafer is provided in the cylindrical groove, two first clearance grooves cooperating with the wafer taking fork are provided on the side of the positioning platform, and a second clearance groove cooperating with the two flexible claws is also provided on the positioning platform;

[0010] The material box grabbing robot is provided with one, and the intermediate sheet picking robot, the sand blowing sheet picking robot and the sand blowing machine are provided with two and are arranged on both sides of the workbench respectively.

[0011] After adopting the present invention, the material box grasping robot sends the material box filled with semiconductor wafers to the material box placement area, the intermediate wafer picking robot takes out the wafers and places them on the positioning table, and the sand blowing wafer picking robot takes out the wafers and places them on the wafer placement plate of the sand blowing machine for sand blowing operation. The two positioning tables and the two material box placement areas can realize the loading of wafers that have not undergone sand blowing operation on one side and the unloading of wafers that have completed sand blowing operation on the other side, which effectively improves the sand blowing efficiency and is simple to operate; further, flexible claws are used to grasp the wafers to realize loading and unloading at the sand blowing machine, ensuring that the product will not be fragmented and improving product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the structure of the present invention;

[0013] Figure 2 This is a schematic diagram of the material box robot structure;

[0014] Figure 3 This is a schematic diagram of the sand blowing machine structure;

[0015] Figure 4 This is a schematic diagram of the intermediate sheet-picking robot and the material box;

[0016] Figure 5 This is the main view of the positioning platform structure;

[0017] Figure 6 It is a top view of the positioning platform structure;

[0018] Figure 7 Schematic diagram of the flexible claw structure. DETAILED DESCRIPTION

[0019] See Figures 1 to 7As shown, a semiconductor intelligent sand blowing production line includes a workbench 1 and two sand blowers 2. A material box grabbing robot 3, two intermediate sheet picking robots 4, and two sand blowing sheet picking robots 5 are arranged next to the workbench 1. Two positioning tables 6 corresponding to each sand blowing sheet picking robot 5 and two material box placement areas corresponding to each intermediate sheet picking robot 4 are arranged on the workbench 1. The material box placement area is used to vertically place the material box 7, that is, a total of four positioning tables 6 and four material box placement areas are included. The sand blowing machine 2 includes a turntable 8, and wafer placement plates 9 are evenly arranged on the turntable 8. The wafer placement plates 9 are arranged obliquely and four wafer support columns 10 are arranged on the upper end surface to support the semiconductor wafer.

[0020] A material box manipulator is installed on the material box grasping robot 3, and the material box manipulator includes a symmetrically arranged left clamping plate 11 and a right clamping plate 12, and the left clamping plate 11 and the right clamping plate 12 are respectively installed on one end of the left clamping jaw 13 and the right clamping jaw 14, and the other ends of the left clamping jaw 13 and the right clamping jaw 14 are respectively connected to the fixed seat 15 through a connecting rod, and the connecting rod includes a front connecting rod 16 and a rear connecting rod 17 arranged in parallel, and the two ends of the front connecting rod 16 are respectively hinged to the left clamping jaw 13 / right clamping jaw 14 and the fixed seat 15, and one end of the rear connecting rod 17 is hinged to the left clamping jaw 13 or the right clamping jaw 14, and the other end is installed with a gear 18, and the gears 18 connected by the two rear connecting rods 17 are meshed, and one of the gears 18 is connected to the driving motor, and the driving motor rotates one of the gears 18, and the other gear 18 rotates accordingly, and the two rear connecting rods 17 swing synchronously, and the two front connecting rods 16 also swing synchronously, and finally the left clamping plate 11 and the right clamping plate 12 are synchronously clamped or released.

[0021] The inner side surfaces of the left clamping plate 11 and the right clamping plate 12 are both serrated surfaces, which can better clamp the material box 7. The outer side surfaces of the left clamping plate 11 and the right clamping plate 12 are fixedly connected to the left clamping jaw 13 and the right clamping jaw 14 through the connecting frame 19 respectively.

[0022] An intermediate wafer picking robot 4 is installed with an intermediate wafer picking manipulator, which includes two wafer picking forks 20, which are similar to the forks on a forklift. A vacuum suction hole is provided on the upper surface of the end of the wafer picking fork 20, and an air passage connected to the vacuum suction hole is provided inside the wafer picking fork. When picking up materials, the wafer picking fork 20 moves to the bottom of the wafer and then rises to contact the bottom surface of the wafer. After the vacuum suction hole absorbs the wafer, the handling operation can be carried out.

[0023] A cylindrical groove 21 is provided in the middle of the positioning platform 6, and a step surface 22 for supporting the semiconductor wafer is provided in the cylindrical groove 21. Two first clearance grooves 23 cooperating with the wafer picking fork 20 are provided on the side of the positioning platform 6, allowing the wafer picking fork to enter to complete the wafer picking and placing operations.

[0024] Two flexible claws 24 are installed on the sand blowing wafer picking robot 5. The outer surface of the flexible claws 24 is a silicone layer, which will not cause damage to the wafer. An air cavity is arranged inside the flexible claws 24, and the air cavity is connected to the gas source through a hose 26. When gas is introduced into the air cavity, the pressure in the air cavity increases, and the flexible claws 24 bend inward under the action of the squeezing force to achieve grasping, imitating the operation of human hands. When the gas is discharged from the air cavity, the pressure decreases and no squeezing force is generated. The flexible claws reset and release the wafer. A second make way groove 25 cooperating with the two flexible claws 24 is also provided on the positioning platform 6, so that the flexible claws 24 can extend into and grasp the wafer.

[0025] The working principle is as follows: the material box grabbing robot 3 grabs two material boxes 7 to the two material box placement areas on one side of the workbench and places them vertically, with the opening of the material box 7 on the side. One of the material boxes 7 contains wafers without sand blowing, and the other is an empty material box. The wafer picking fork 20 on the intermediate wafer picking robot 4 takes out a wafer from the material box 7 containing the wafer and places it on one of the positioning tables 6. The sand blowing wafer picking robot 5 drives the flexible claw 24 to take the wafer out of the positioning table 6 and place it on the wafer placement plate 9 of the sand blowing machine 2. The turntable rotates to start sand blowing, and the intermediate wafer picking robot 4 places the next wafer on a positioning table. 6, the sand blowing and wafer taking robot 5 works again to put it into the sand blowing machine 2, repeating the above operation until the first wafer is sanded. When the intermediate wafer taking robot 4 places the wafer on a positioning table 6, the sand blowing and wafer taking robot 5 places the wafer that has been sanded on another positioning table 6, and the sand blowing and wafer taking robot 5 puts the wafer that has not been sanded into the sand blowing machine 2. At the same time, the intermediate wafer taking robot 4 puts the wafer that has been sanded into an empty material box, and then takes out the next wafer from the material box with the wafer, realizing the simultaneous loading of the wafer that has been sanded and the unloading of the wafer that has been sanded, greatly improving the efficiency. A material box grabbing robot 3 is responsible for the material box picking and placing operations on both sides of the workbench, and is used to unload the material box that has been sanded and load the material box that has been sanded.

Claims

1. A semiconductor intelligent sand blowing production line, comprising a workbench and a sand blowing machine, characterized in that: A material box grabbing robot, an intermediate film picking robot and a sand blowing film picking robot are arranged next to the workbench. Two positioning platforms corresponding to the sand blowing film picking robot and two material box placement areas corresponding to the intermediate film picking robot are arranged on the workbench. The sand blowing machine includes a turntable, on which wafer placing plates are evenly arranged. The wafer placing plates are arranged obliquely and wafer supporting columns are arranged on the upper end faces; a material box manipulator is installed on the material box grabbing robot, and the material box manipulator includes a symmetrically arranged left clamp and a right clamp, the left clamp and the right clamp are respectively installed on one end of the left clamp and the right clamp, and the other ends of the left clamp and the right clamp are respectively connected to a fixed seat through a connecting rod, and the connecting rod includes two front connecting rods and two rear connecting rods arranged in parallel, one of the front connecting rods is hinged to the left clamp and the fixed seat at both ends, and the other front connecting rod is hinged to the right clamp and the fixed seat at both ends, and one of the rear connecting rods is hinged to the left clamp at one end and the other end is It is equipped with gears, one end of a rear connecting rod is hinged with the right clamping claw, and the other end is equipped with a gear, the gears connected by the two rear connecting rods are meshed, one of the gears is connected to a driving motor, the driving motor makes one of the gears rotate, and the other gear rotates accordingly, the two rear connecting rods swing synchronously, and the two front connecting rods also swing synchronously; the inner sides of the left clamping plate and the right clamping plate are both serrated surfaces, and the outer sides of the left clamping plate and the right clamping claw are respectively fixedly connected to the left clamping claw and the right clamping claw through a connecting frame; an intermediate film picking robot is installed with an intermediate film picking manipulator, and the intermediate film picking manipulator includes two film picking forks, and a vacuum suction hole is provided on the upper surface of the end of the film picking fork, and an air channel connected to the vacuum suction hole is provided in the film picking fork; two flexible claws are installed on the sand blowing film picking robot, the outer surface of the flexible claws is a silicone layer, and an air cavity is provided in the flexible claws, and the air cavity is connected to the air source through a hose.

2. A semiconductor intelligent sand blowing production line according to claim 1, characterized in that: A cylindrical groove is provided in the middle of the positioning platform, and a step surface for supporting the semiconductor wafer is arranged in the cylindrical groove. Two first clearance grooves cooperating with the wafer taking fork are provided on the side of the positioning platform, and a second clearance groove cooperating with the two flexible claws is also provided on the positioning platform.

3. The semiconductor intelligent sand blowing production line according to claim 1 is characterized in that: The material box grabbing robot is provided with one, and the intermediate sheet picking robot, the sand blowing sheet picking robot and the sand blowing machine are provided with two and are arranged on both sides of the workbench respectively.

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