Upper cover assembly, chip testing mechanism and chip testing integrated machine

Abstract

The present invention provides an upper cover assembly, a chip testing mechanism and a chip testing all-in-one machine. The upper cover assembly includes an upper cover bracket, a lens fixing seat, a lens arranged in the lens fixing seat, an upper pressing plate fixing seat, an upper pressing plate, a first heating structure arranged in the upper cover bracket and an upper cover circuit board. A lens cavity is provided on one side of the upper cover bracket, and a pressing plate cavity is provided on the other side of the upper cover bracket. The lens fixing seat is fixed in the lens cavity, the upper pressing plate fixing seat is fixed in the pressing plate cavity, and the upper pressing plate is fixed to the upper pressing plate fixing seat and is used to press the chip. The upper cover assembly, chip testing mechanism and chip testing all-in-one machine provided by the present invention, by providing a lens fixing seat and an upper pressing plate fixing seat, can be applied to different chips by adjusting the position of the lens relative to the lens fixing seat or replacing the lens fixing seat, and by adjusting the position of the upper pressing plate relative to the upper pressing plate fixing seat or replacing the upper pressing plate fixing seat after replacing the chip.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip testing, and more specifically, relates to an upper cover component, a chip testing mechanism and a chip testing integrated machine. Background Art

[0002] As the chip testing field gradually develops towards automation, the chip testing process is completed by automated equipment. The chip is grabbed by the grasping mechanism and taken to the chip testing mechanism for testing. After the test is completed, it is determined whether the chip is a good product, and then the grasping mechanism transfers the tested chip to the corresponding position. The chip testing mechanism is usually provided with multiple testing positions, which can test multiple chips at a time. When testing the chip, the chip is placed on the test seat, and the test cover presses the chip against the test seat to test the chip. However, the specific structure of the chip detection mechanism is related to the model of the chip itself. Therefore, when testing different chips, different test covers and test seats are required, which causes the factory to not only redesign the test seat but also redesign the test cover when testing different chips, which increases the testing cost. Summary of the invention

[0003] The purpose of the embodiments of the present invention is to provide a cover assembly, a chip testing mechanism and a chip testing integrated machine to solve the technical problem in the prior art that different test covers need to be replaced when testing different chips, resulting in high testing costs.

[0004] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: to provide a chip testing mechanism, including an upper cover bracket, a lens fixing seat, a lens arranged in the lens fixing seat, an upper pressure plate fixing seat, an upper pressure plate, a first heating structure arranged in the upper cover bracket and an upper cover circuit board, a lens cavity is opened on one side of the upper cover bracket, a pressure plate cavity is opened on the other side of the upper cover bracket, the lens fixing seat is fixed in the lens cavity, the upper pressure plate fixing seat is fixed in the pressure plate cavity, the upper pressure plate is fixed to the upper pressure plate fixing seat and is used to press the chip.

[0005] In one embodiment, the upper cover bracket includes a lens fixing frame, a heat insulation plate and a heating fixing frame which are stacked in sequence, the lens cavity is opened in the lens fixing frame, the pressing cavity is opened in the heating fixing frame, and the first heating structure is arranged in the heating fixing frame.

[0006] In one embodiment, the first heating structure includes a heating rod and a first temperature-controlled switch for controlling the temperature of the heating rod, and the heating fixing frame is provided with a heating hole for inserting the heating rod.

[0007] In one embodiment, the axial direction of the heating hole is arranged perpendicular to the axial direction of the lens.

[0008] In one embodiment, an air flow channel is opened on the upper cover bracket, one end of the air flow channel extends to the upper pressing plate, and the other end of the air flow channel is connected to an air path connector.

[0009] The present invention also provides a chip testing mechanism, comprising the above-mentioned upper cover assembly, a lower cover assembly and a connector, wherein the connector is used to electrically connect the upper cover assembly and the lower cover assembly.

[0010] In one embodiment, the lower cover assembly includes a lower cover bracket, a second heating structure disposed in the lower cover bracket, a probe structure disposed in the lower cover bracket and used to be electrically connected to the chip, a floating sheet for placing the chip, an elastic member for buffering the floating sheet, and a lower cover circuit board electrically connected to the probe structure, and the connector is used to electrically connect the upper cover circuit board and the lower cover circuit board.

[0011] In one embodiment, the probe structure includes a probe seat, a probe body inserted in the probe seat, and a needle seat cover fixed on the probe seat. The needle seat cover is fixedly connected to the probe seat and the lower cover circuit board, and the needle seat cover is arranged between the probe seat and the lower cover circuit board.

[0012] In one embodiment, the second heating assembly includes a heating ring and a second temperature-controlled switch for controlling the temperature of the heating ring, the probe seat includes a seat body and a boss protruding from the seat body toward the floating sheet, the heating ring is sleeved on the outer periphery of the boss, the floating sheet is arranged on the heating ring, and the two ends of the elastic member are respectively abutted against the heating ring and the seat body.

[0013] In one embodiment, the lower cover bracket is provided with a temperature control cavity having a placement opening, the second temperature control switch is arranged in the temperature control cavity, and a temperature control cover for shielding the second temperature control switch is provided at the placement opening.

[0014] In one embodiment, a positioning ring is extended from the circumference of the floating sheet, and the positioning ring is sandwiched between the lower cover bracket and the heating ring.

[0015] In one embodiment, the connector includes a first connecting socket fixed to the upper cover circuit board, a second connecting socket fixed to the lower cover circuit board, and a connector probe, one end of the connector probe is used to pass through the first connecting socket to electrically connect to the upper cover circuit board, and the other end of the connector probe is used to pass through the second connecting socket to electrically connect to the lower cover circuit board.

[0016] In one embodiment, the connector probe is fixed and electrically connected to the upper cover circuit board or the lower cover circuit board.

[0017] The present invention also provides a chip testing integrated machine, comprising the above-mentioned chip testing mechanism.

[0018] The beneficial effects of the upper cover assembly, chip testing mechanism and chip testing all-in-one machine provided by the present invention are: compared with the prior art, the upper cover assembly of the present invention includes an upper cover bracket, a lens fixing seat, a lens, an upper pressure plate fixing seat, an upper pressure plate, a first heating structure and an upper cover circuit board. By arranging the lens fixing seat and the upper pressure plate fixing seat, after replacing the chip, it can be adapted to different chips by adjusting the position of the lens relative to the lens fixing seat or replacing the lens fixing seat, and by adjusting the position of the upper pressure plate relative to the upper pressure plate fixing seat or replacing the upper pressure plate fixing seat. There is no need to replace the entire upper cover assembly, which can save costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0020] Figure 1 A three-dimensional structural diagram of an upper cover assembly provided in an embodiment of the present invention;

[0021] Figure 2 An exploded structural diagram of an upper cover assembly provided in an embodiment of the present invention;

[0022] Figure 3 A three-dimensional structural diagram of a chip testing mechanism provided by an embodiment of the present invention;

[0023] Figure 4 A three-dimensional structural diagram of a lower cover assembly provided in an embodiment of the present invention;

[0024] Figure 5 An exploded structural diagram of a lower cover assembly provided in an embodiment of the present invention;

[0025] Figure 6 A cross-sectional view of a lower cover assembly provided by an embodiment of the present invention;

[0026] Figure 7 This is an exploded structural diagram of a connector provided in an embodiment of the present invention.

[0027] Among them, the reference numerals in the figure are:

[0028] 1-upper cover assembly; 11-upper cover bracket; 111-lens fixing frame; 1111-lens cavity; 1112-gas circuit joint; 112-heat insulation board; 113-heating fixing frame; 1131-pressing cavity; 1132-heating hole; 12-lens fixing seat; 121-first annular flange; 13-lens; 14-upper pressing plate fixing seat; 141-second annular flange; 15-upper pressing plate; 151-lower pressing protrusion; 16-first heating structure; 161-heating rod; 162-first temperature control switch; 17-upper cover circuit board; 2-lower cover assembly; 21-lower cover bracket; 22-probe structure; 221-probe seat; 2211-seat body; 2212-boss; 222-probe body; 223-needle seat cover; 23-second heating structure; 231-heating ring; 232-second temperature control switch; 233-temperature control cover; 24-floating sheet; 241-positioning ring; 242-chip slot; 243-chamfer; 25-elastic part; 26-lower cover circuit board; 3-connector; 31-first connecting seat; 32-second connecting seat; 33-connector probe. DETAILED DESCRIPTION

[0029] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0030] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0031] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0032] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0033] The upper cover assembly 1 of the chip testing mechanism provided by the embodiment of the present invention is now described. When testing a chip, the chip is placed in the lower cover assembly 2, and the upper cover assembly 1 is controlled by a lifting mechanism. After the upper cover assembly 1 descends to contact and conduct with the chip, the chip can be tested.

[0034] In one embodiment of the present invention, see Figure 1 and Figure 3 The upper cover assembly 1 includes an upper cover bracket 11, a lens fixing seat 12, a lens 13, an upper pressing plate fixing seat 14, an upper pressing plate 15, a first heating structure 16 and an upper cover circuit board 17. A lens cavity 1111 is provided on one side of the upper cover bracket 11, and a pressing plate cavity 113 is provided on the other side of the upper cover bracket 11. The side of the upper cover bracket 11 with the pressing plate cavity 113 is used to face the chip, and the chip is pressed by the upper pressing plate 15. The lens fixing seat 12 is arranged in the lens cavity 1111, and the lens fixing seat 12 can be fixed to the inner wall of the lens cavity 1111 by fasteners and the like, and the specific fixing method is not limited here. The lens 13 is arranged in the lens fixing seat 12, and the lens 13 can be fixed to the lens fixing seat 12 by threaded connection and the like. The lens 13 is used to focus the chip during chip testing, improve the imaging quality of the chip, and facilitate the appearance inspection of the chip at the same time. When the size of the chip to be tested changes, or when the test position of a single chip changes, the position of the lens 13 relative to the lens holder 12 can be changed, such as making the lens 13 eccentrically set relative to the lens holder 12 to adapt to different chips, or directly replacing the lens holder 12, the outer dimensions of the lens holder 12 remain unchanged, and the position of the lens holder 12 used to install the lens 13 changes to adapt to different chips. The upper pressing plate holder 14 is arranged in the pressing plate cavity 113, and the upper pressing plate holder 14 can be fixed to the inner wall of the pressing plate cavity 113 by means of fasteners, etc., and its specific fixing method is not limited here. The upper pressing plate 15 is fixed on the upper pressing plate holder 14, and can be fixed by means of screws, etc. The upper pressing plate 15 is used to press the chip to prevent the chip from poor contact during detection, and also has the function of blocking light. The first heating structure 16 is arranged in the upper cover bracket 11, and is used to heat the chip to simulate the high temperature environment when testing the chip, so that the error of the test result is smaller.

[0035] The upper cover assembly 1 in the above embodiment, by providing a lens fixing seat 12 and an upper pressing plate fixing seat 14, can be adapted to different chips by adjusting the position of the lens 13 relative to the lens fixing seat 12 or replacing the lens fixing seat 12, and by adjusting the position of the upper pressing plate 15 relative to the upper pressing plate fixing seat 14 or replacing the upper pressing plate fixing seat 14 after replacing the chip, without having to completely replace the upper cover assembly 1.

[0036] Optionally, the upper cover assembly 1 can compress and test multiple chips at the same time. Accordingly, the number of lens cavities 1111, lens fixing seats 12 and lenses 13 is also multiple, and the number of pressing cavities 113, upper pressing seat 14 and upper pressing plates 15 is also multiple, and is the same as the number of chips tested simultaneously.

[0037] In one embodiment of the present invention, see Figure 2 The upper cover bracket 11 includes a lens fixing frame 111, a heat insulation board 112 and a heating fixing frame 113. The lens fixing frame 111, the heat insulation board 112 and the heating fixing frame 113 are stacked in sequence and can be fixed to each other by screws. The upper cover circuit board 17 can be fixed on the heating fixing frame 113. The lens cavity 1111 is opened in the lens fixing frame 111, and the lens fixing seat 12 is correspondingly arranged in the lens fixing frame 111. The end of the lens fixing seat 12 away from the heat insulation board 112 has a first annular flange 121, and the lens fixing frame 111 is correspondingly opened with a first annular groove, which is convenient for the screw to pass through the first annular flange 121 and connect to the inner wall of the first annular groove. The first annular flange 121 also has the function of positioning the lens fixing seat 12. The heating fixing frame 113 is provided with a pressing chamber 113, and the upper pressing plate fixing seat 14 is correspondingly fixed in the heating fixing frame 113. The upper pressing plate fixing seat 14 has a second annular flange 141 at one end away from the heat insulation plate 112. The heating fixing frame 113 is correspondingly provided with a second annular groove, which is convenient for the screw member to pass through the second annular flange 141 and connect to the inner wall of the second annular groove. The second annular flange 141 also has the function of positioning the upper pressing plate fixing seat 14. The first heating structure 16 is arranged in the heating fixing frame 113, closer to the upper pressing plate 15, so as to facilitate heating the chip. The heat insulation plate 112 is sandwiched between the lens fixing frame 111 and the heating fixing frame 113, which can reduce the heat transferred to the lens fixing frame 111. Compared with the integrally formed upper cover bracket, the setting of the heat insulation plate 112 can reduce heat loss and speed up the heating speed of the chip.

[0038] Optionally, the first heating structure 16 includes a heating rod 161 and a first temperature control switch 162. The number of heating rods 161 is not limited here. The heating rod 161 can be electrically heated. The first temperature control switch 162 is used to control the temperature of the heating rod 161. When the temperature of the heating rod 161 is too high, the heating of the heating rod 161 can be stopped to prevent damage to the chip. The heating fixing frame 113 is provided with a heating hole 1132, and one end of the heating rod 161 extends into the heating hole 1132 to heat the heating fixing frame 113. The other end of the heating rod 161 can be connected to a power supply to realize the power supply of the heating rod 161. The axial direction of the heating hole 1132 can be set perpendicular to the moving direction of the upper cover assembly 1 to avoid affecting the structural distribution of the upper cover assembly 1 in its moving direction.

[0039] In one embodiment of the present invention, see Figure 2 , an air flow channel is provided on the upper cover bracket 11, so that the gas can circulate in the upper cover bracket 11, one end of the air flow channel extends to the upper pressing plate 15, and the other end of the air flow channel is connected to an air path connector 1112, and the air path connector 1112 can be connected to an air pump for conveying air into the air flow channel, or sucking air from the air flow channel. In this way, after the chip inspection is completed, the chip can be blown through the air flow channel to prevent the chip from sticking to the upper pressing plate 15 when the upper cover assembly 1 moves up. More specifically, the air flow channel can be set on the lens 13 fixing frame 111 or the heating fixing frame 113, and its setting position is not limited here, as long as it can extend to the upper pressing plate 15.

[0040] In one embodiment of the present invention, please refer to Figure 3 , a chip testing mechanism is also provided, the chip testing mechanism includes the upper cover assembly 1 in any of the above embodiments, and also includes a lower cover assembly 2 and a connector 3. The connector 3 is used to electrically connect the upper cover assembly 1 and the lower cover assembly 2. The lower cover assembly 2 is used to place the chip. When the upper cover assembly 1 is driven by the lifting mechanism and moves down to press the chip, the connector 3 electrically connects the upper cover assembly 1 and the lower cover assembly 2, and is connected to the chip to test the chip.

[0041] Optionally, see Figure 4 and Figure 5 The lower cover assembly 2 includes a lower cover bracket 21, a second heating structure 23, a probe structure 22, a floating sheet 24, an elastic member 25 and a lower cover circuit board 26. The second heating structure 23 is arranged in the lower cover bracket 21 and is used to heat the chip. The first heating structure 16 and the second heating structure 23 work together to simulate the temperature during chip testing. The chip is placed on the floating sheet 24, and the elastic member 25 is used to buffer the floating sheet 24 to prevent the chip from being damaged due to pressure without buffering. The probe structure 22 is electrically connected to the lower cover circuit board 26, and the connector 3 is used to electrically connect the lower cover circuit board 26 and the upper cover circuit board 17. When the upper cover assembly 1 is pressed against the chip, the upper cover circuit board 17 and the lower cover circuit board 26 are electrically connected through the connector 3, the lower cover circuit board 26 is electrically connected to the probe structure 22, and the probe structure 22 is electrically connected to the chip. In this way, a chip test circuit is formed to test the chip.

[0042] In one embodiment of the present invention, see Figure 5 and Figure 6The probe structure 22 includes a probe seat 221, a probe body 222 and a needle seat cover 223. The probe body 222 is inserted into the probe seat 221. The needle seat cover 223 can be fixed to the side of the probe seat 221 away from the floating sheet 24. One end of the probe body 222 is inserted into the needle seat cover 223 to guide and position the probe body 222. The needle seat cover 223 is fixed on the lower cover circuit board 26, and the needle seat cover 223 is clamped between the probe seat 221 and the lower cover circuit board 26, so that the probe body 222 can pass through the needle seat cover 223 and be electrically connected to the lower cover circuit board 26. Among them, the probe seat 221 and the needle seat cover 223 are both arranged in the lower cover bracket 21, so that the lower cover bracket 21 can protect the probe seat 221 and the needle seat cover 223.

[0043] Optionally, the second heating structure 23 includes a heating ring 231 and a second temperature control switch 232, the heating ring 231 is used to heat the chip, and the second temperature control switch 232 is used to control the temperature of the heating ring 231. When the temperature of the heating ring 231 is too high, the heating of the heating ring 231 can be stopped to prevent damage to the chip. The number of heating rings 231 can be selected to be the same as or different from the number of floating sheets 24. In one embodiment, the probe seat 221 includes a seat body 2211 and a boss 2212, the boss 2212 is formed by a side of the seat body 2211 protruding toward the floating sheet 24, the probe body 222 can be arranged through the boss 2212, and a connection hole can be opened on the edge of the seat body 2211 for the threaded member to pass through and connect to the needle seat cover 223, so as to facilitate the fixation of the probe seat 221 and the needle seat cover 223. The heating ring 231 can be sleeved around the circumference of the boss 2212, so that the heating ring 231 is clamped between the floating sheet 24 and the seat body 2211, and the heating ring 231 abuts against the floating sheet 24, so that the chip can be quickly heated. Among them, the elastic member 25 can be selected as a spring, and the two ends of the elastic member 25 abut against the heating ring 231 and the seat body 2211 respectively. The setting of the elastic member 25 can firstly make the heating ring 231 and the floating sheet 24 close to each other and quickly conduct heat, and secondly, when the floating sheet 24 is subjected to the pressure of the upper cover assembly 1, it can shrink downward under the action of the elastic member 25 to prevent the chip from being damaged by pressure.

[0044] Optionally, a positioning ring 241 is formed by extending the circumference of the floating sheet 24, and a screw member can pass through the positioning ring 241 and be connected to the heating ring 231, so that the floating sheet 24 is fixed on the heating ring 231. In addition, the positioning ring 241 is sandwiched between the inner wall of the lower cover bracket 21 and the heating ring 231, so that under the action of the elastic member 25, when the floating sheet 24 floats up, the lower cover bracket 21 can limit the floating sheet 24 to prevent the floating sheet 24 from exceeding a predetermined position.

[0045] Optionally, a chip slot 242 is provided on the floating sheet 24, and a corresponding protrusion of the upper pressing sheet 15 is provided with a downward pressing protrusion 151 that can extend into the chip slot 242. The side wall of the chip slot 242 is provided with a chamfer 243, which makes it easier to put the chip into the chip slot 242, and also ensures the flatness of the chip when it is placed, thereby reducing the downtime rate and chip damage rate.

[0046] In one embodiment of the present invention, see Figure 5 The lower cover bracket 21 is provided with a temperature control cavity, and the temperature control cavity has a placement opening, which can be set on the side of the lower cover bracket 21 facing the lower cover circuit board 26, so that the temperature control cavity can be hidden. The second temperature control switch 232 is set in the temperature control cavity, and a temperature control cover 233 is set at the placement opening, and the temperature control cover 233 can cover the second temperature control switch 232. In addition, the temperature control cavity can be set at both ends of the lower cover bracket 21, making full use of the space not used by the probe structure 22, hiding the second temperature control switch 232 inside the lower cover bracket 21, and will not increase the volume of the lower cover assembly 2.

[0047] In one embodiment of the present invention, see Figure 7 , the connector 3 includes a first connection seat 31, a second connection seat 32 and a connector probe 33. The first connection seat 31 is fixed to the upper cover circuit board 17, the second connection seat 32 is fixed to the lower cover circuit board 26, and the connector probe 33 can be fixed to the upper cover circuit board 17 or the lower cover circuit board 26. When the connector probe 33 is fixed to the upper cover circuit board 17, one end of the connector probe 33 passes through the first connection seat 31 and is fixed to the upper cover circuit board 17. When the upper cover assembly 1 gradually approaches the lower cover assembly 2, the other end of the connector probe 33 passes through the second connection seat 32 and is electrically connected to the lower cover circuit board 26, forming a test loop. When the connector probe 33 is fixed to the lower cover circuit board 26, one end of the connector probe 33 passes through the second connection seat 32 and is fixed to the lower cover circuit board 26. When the upper cover assembly 1 gradually approaches the lower cover assembly 2, the other end of the connector probe 33 passes through the first connection seat 31 and is electrically connected to the upper cover circuit board 17, forming a test loop.

[0048] The present invention also provides a chip testing machine, which includes the chip testing mechanism in any of the above embodiments. The chip testing machine may also include a lifting mechanism for lifting the upper cover assembly 1. The specific structure of the chip testing machine is not limited here.

[0049] The chip testing all-in-one machine provided by the present invention adopts the chip testing mechanism of any of the above-mentioned embodiments, and by setting a lens fixing seat 12 and an upper pressure plate fixing seat 14, after replacing the chip, it can be adapted to different chips by adjusting the position of the lens 13 relative to the lens fixing seat 12 or replacing the lens fixing seat 12, and by adjusting the position of the upper pressure plate 15 relative to the upper pressure plate fixing seat 14 or replacing the upper pressure plate fixing seat 14, without having to completely replace the upper cover assembly 1.

[0050] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A cover assembly, characterized in that: It includes an upper cover bracket, a lens fixing seat, a lens arranged in the lens fixing seat, an upper pressing plate fixing seat, an upper pressing plate, a first heating structure arranged in the upper cover bracket and an upper cover circuit board, wherein a lens cavity is opened on one side of the upper cover bracket, a pressing plate cavity is opened on the other side of the upper cover bracket, the lens fixing seat is fixed in the lens cavity, the upper pressing plate fixing seat is fixed in the pressing plate cavity, and the upper pressing plate is fixed to the upper pressing plate fixing seat and is used for pressing the chip.

2. The upper cover assembly according to claim 1, characterized in that: The upper cover bracket includes a lens fixing frame, a heat insulation plate and a heating fixing frame which are stacked in sequence, the lens cavity is opened in the lens fixing frame, the pressing cavity is opened in the heating fixing frame, and the first heating structure is arranged in the heating fixing frame.

3. The upper cover assembly according to claim 2, characterized in that: The first heating structure includes a heating rod and a first temperature control switch for controlling the temperature of the heating rod, and the heating fixing frame is provided with a heating hole for the heating rod to be inserted.

4. The upper cover assembly according to claim 3, characterized in that: The axial direction of the heating hole is arranged perpendicular to the axial direction of the lens.

5. The upper cover assembly according to claim 1, characterized in that: An air flow channel is provided on the upper cover bracket, one end of the air flow channel extends to the upper pressing plate, and the other end of the air flow channel is connected to an air path connector.

6. A chip testing mechanism, characterized in that: The invention comprises the upper cover assembly as described in any one of claims 1 to 5, and further comprises a lower cover assembly and a connector, wherein the connector is used to electrically connect the upper cover assembly and the lower cover assembly.

7. The chip testing mechanism according to claim 6, characterized in that: The lower cover assembly includes a lower cover bracket, a second heating structure arranged in the lower cover bracket, a probe structure arranged in the lower cover bracket and used for electrically connecting to the chip, a floating sheet for placing the chip, an elastic member for buffering the floating sheet, and a lower cover circuit board electrically connected to the probe structure, and the connector is used to electrically connect the upper cover circuit board and the lower cover circuit board.

8. The chip testing mechanism according to claim 7, characterized in that: The probe structure includes a probe seat, a probe body inserted in the probe seat, and a needle seat cover fixed on the probe seat. The needle seat cover is fixedly connected to the probe seat and the lower cover circuit board, and the needle seat cover is arranged between the probe seat and the lower cover circuit board.

9. The chip testing mechanism according to claim 8, characterized in that: The second heating structure includes a heating ring and a second temperature-controlled switch for controlling the temperature of the heating ring. The probe seat includes a seat body and a boss protruding from the seat body toward the floating sheet. The heating ring is sleeved on the outer periphery of the boss. The floating sheet is arranged on the heating ring. Both ends of the elastic member are respectively abutted against the heating ring and the seat body.

10. The chip testing mechanism according to claim 9, characterized in that: The lower cover bracket is provided with a temperature control cavity having a placement opening, the second temperature control switch is arranged in the temperature control cavity, and a temperature control cover for shielding the second temperature control switch is provided at the placement opening.

11. The chip testing mechanism according to claim 9, characterized in that: A positioning ring is extended from the circumference of the floating sheet, and the positioning ring is sandwiched between the lower cover bracket and the heating ring.

12. The chip testing mechanism according to claim 7, characterized in that: The connector includes a first connection socket fixed to the upper cover circuit board, a second connection socket fixed to the lower cover circuit board, and a connector probe, one end of the connector probe is used to pass through the first connection socket to electrically connect to the upper cover circuit board, and the other end of the connector probe is used to pass through the second connection socket to electrically connect to the lower cover circuit board.

13. The chip testing mechanism according to claim 12, characterized in that: The connector probe is fixed and electrically connected to the upper cover circuit board or the lower cover circuit board.

14. A chip testing integrated machine, characterized in that: A chip testing mechanism comprising any one of claims 6-13.

Images