Microfluidic Core System

Abstract

The present invention provides a kind of microfluidic core system, belonging to the field of microfluidic technology; it includes a microfluidic chip, the microfluidic chip includes a chip body, a top cover, a bottom cover, a flexible flow channel layer and a rigid pressure cover layer; the bottom cover is provided with a receiving groove; the rigid pressure cover layer and the flexible flow channel layer are both located in the receiving groove, the flexible flow channel layer is installed on the rigid pressure cover layer, and the flexible flow channel layer is provided with a flow channel on the side away from the rigid pressure cover layer; the chip body is pressure-covered on the flexible flow channel layer, and is detachably connected to the bottom cover, and the chip body is provided with a filling port connected to the flow channel; the top cover is detachably connected to the filling port, and is used to block the filling port. The structure of the microfluidic chip of the present invention is quickly assembled by various components. The microfluidic chip of this structure not only has extremely strong expansibility, but also can be disassembled and cleaned after the chip is used, or some core consumables can be replaced, which greatly increases the number of reuses of the microfluidic chip and effectively reduces the cost of single use.

Description

Technical Field

[0001] The invention belongs to the field of microfluidic technology, and in particular relates to a microfluidic core system. Background Art

[0002] As the application of microfluidic technology in various industries becomes more mature, microfluidic core systems are increasingly used in laboratories and production activities. This not only puts higher requirements on the production and use costs of microfluidic core systems, but also on the convenience of using organ chips.

[0003] However, existing microfluidic core systems are all integrally formed, and this structure cannot clean the complex internal channels of the microfluidic core system, which causes the microfluidic core system to become a disposable consumable that needs to be discarded as a whole after use. Summary of the invention

[0004] The purpose of the present invention is to provide a microfluidic core system to solve the problem that the existing microfluidic core system cannot clean the internal channel and becomes a disposable consumable.

[0005] In order to solve the above technical problems, the present invention provides a microfluidic core system, and the specific technical solution is as follows:

[0006] A microfluidic core system comprises a microfluidic chip, wherein the microfluidic chip comprises a chip body, a top cover, a bottom cover, a flexible flow channel layer and a rigid pressure cover layer;

[0007] The bottom cover is provided with a receiving groove;

[0008] The rigid gland layer and the flexible flow channel layer are both located in the accommodating groove, the flexible flow channel layer is installed on the rigid gland layer, and a flow channel is provided on a side of the flexible flow channel layer away from the rigid gland layer;

[0009] The chip body is pressed onto the flexible flow channel layer and is detachably connected to the bottom cover, and the chip body is provided with a filling port communicating with the flow channel;

[0010] The top cover is detachably connected to the filling port and is used to block the filling port.

[0011] Furthermore, first positioning connection parts are provided at opposite ends of the chip body;

[0012] The bottom cover is provided with second positioning connection parts at opposite ends;

[0013] The first positioning connection portion and the second positioning connection portion are detachably connected.

[0014] Furthermore, a concave is provided on one side of the flexible flow channel layer close to the chip body, and after the flexible flow channel layer is attached to the chip body, the concave and the chip body form the flow channel;

[0015] Alternatively, a protrusion is provided on a side of the flexible flow channel layer close to the chip body, and after the flexible flow channel layer is attached to the chip body, the protrusion and the chip body form the flow channel.

[0016] Further, it also includes a base and a controller;

[0017] There are multiple bases, multiple microfluidic chips are mounted on the multiple bases in a one-to-one correspondence, and two adjacent bases are detachably connected;

[0018] The base is connected to the controller.

[0019] Furthermore, the bottom cover is provided with a plurality of third positioning connection parts; the base is provided with a plurality of fourth positioning connection parts; and the plurality of third positioning connection parts and the plurality of fourth positioning connection parts are connected one by one.

[0020] Further, the base includes a first side and a second side opposite to each other, and a third side located between the first side and the second side;

[0021] The first side is provided with a first sealing connection portion and a first electrical connection portion, the second side is provided with a second sealing connection portion and a second electrical connection portion, and the third side is provided with a third sealing connection portion;

[0022] The first sealing connection part, the second sealing connection part and the third sealing connection part are all in communication with the interior of the base;

[0023] The first sealed connection portion of one base is communicated with and sealedly engaged with the second sealed connection portion of another adjacent base;

[0024] The first electrical connection portion of one base is connected to the second electrical connection portion of another base adjacent thereto;

[0025] The third sealing connection portion is communicated with the interior of the microfluidic chip.

[0026] Furthermore, a first guide connection portion is provided on one side of two opposite sides of the base, and a second guide connection portion is provided on the other side;

[0027] The first guide connection portion of one base is detachably connected to the second guide connection portion of another adjacent base.

[0028] Furthermore, one side of the two opposite sides of the base is provided with a first locking connection portion, and the other side is provided with a second locking connection portion;

[0029] The first locking connection portion of one base is detachably connected to the second locking connection portion of another adjacent base.

[0030] Furthermore, there are multiple controllers, and two adjacent controllers are detachably connected;

[0031] The controller has a fourth sealed connection portion and a third electrical connection portion on one side of two opposite sides, and a fifth sealed connection portion and a fourth electrical connection portion on the other side;

[0032] The fourth sealed connection portion and the fifth sealed connection portion are both in communication with the interior of the controller;

[0033] The fourth sealed connection portion of one controller is connected to and sealed with the fifth sealed connection portion of another adjacent controller;

[0034] The third electrical connection portion of one controller is connected to the fourth electrical connection portion of another adjacent controller.

[0035] Further, the controller is provided with a gas circuit connection portion and a fifth electrical connection portion;

[0036] When the base is provided with a first sealing connection portion and a first electrical connection portion, the gas path connection portion is communicated with the first sealing connection portion, and the fifth electrical connection portion is connected with the first electrical connection portion.

[0037] According to the microfluidic core system provided by the present invention, the structure of the microfluidic chip is quickly assembled by various components. The microfluidic chip with this structure not only has extremely strong scalability, but also can be disassembled and cleaned after the chip is used, or some core consumables can be replaced, which greatly increases the number of times the microfluidic chip is reused and effectively reduces the cost of a single use. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0039] Figure 1 A schematic structural diagram of a microfluidic chip of a microfluidic core system provided in an embodiment of the present invention;

[0040] Figure 2 An exploded view of a microfluidic chip of a microfluidic core system provided in an embodiment of the present invention (I);

[0041] Figure 3 An exploded view of a microfluidic chip of a microfluidic core system provided in an embodiment of the present invention (II);

[0042] Figure 4 An exploded view of another microfluidic chip of the microfluidic core system provided by an embodiment of the present invention;

[0043] Figure 5 A schematic diagram of the structure of a base of a microfluidic core system provided in an embodiment of the present invention;

[0044] Figure 6 A schematic diagram of the matching relationship between two adjacent bases of the microfluidic core system provided in an embodiment of the present invention;

[0045] Figure 7 A schematic diagram of the matching relationship between the microfluidic chip and the base of the microfluidic core system provided in an embodiment of the present invention;

[0046] Figure 8 A schematic diagram of the structure of a controller of a microfluidic core system provided by an embodiment of the present invention (I);

[0047] Fig. 9 A schematic diagram of the structure of a controller of a microfluidic core system provided by an embodiment of the present invention (II);

[0048] Fig.10 A schematic diagram of the structure of a microfluidic core system provided in an embodiment of the present invention.

[0049] icon:

[0050] 100-microfluidic chip; 101-chip body; 102-bottom cover; 103-rigid pressure cover layer; 104-flexible flow channel layer; 105-top cover; 106-third positioning connection part; 107-filling port; 108-fitting surface; 109-first positioning connection part; 110-flow channel; 111-protrusion; 112-second positioning connection part;

[0051] 200-base; 201-base body; 202-first mating surface; 203-second mating surface; 204-third mating surface; 205-first sealing connection part; 206-second sealing connection part; 207-third sealing connection part; 208-first guide connection part; 209-second guide connection part; 210-first locking connection part; 211-second locking connection part; 212-first electrical connection part; 213-second electrical connection part; 214-third electrical connection part; 215-fourth positioning connection part;

[0052] 300-controller; 301-first connection surface; 302-second connection surface; 303-first connection socket; 304-second connection socket; 305-fourth electrical connection part; 306-fifth electrical connection part; 307-fourth sealed connection part; 308-fifth sealed connection part; 309-operation panel; 310-gas path connection part; 311-sixth electrical connection part. DETAILED DESCRIPTION

[0053] The technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0054] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0055] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0056] Combined with Figure 1 and 10 As shown, this embodiment provides a microfluidic core system, which includes a microfluidic chip 100, a base 200 and a controller 300. In order to solve the problems mentioned in the background technology, this embodiment first improves the microfluidic chip 100.

[0057] Combined with Figure 2 and 3 As shown, the microfluidic chip 100 of this embodiment includes a chip body 101, a bottom cover 102, a rigid pressure cover layer 103, a flexible flow channel layer 104 and a top cover 105.

[0058] The bottom cover 102 of this embodiment is provided with a receiving groove. The rigid pressure cover layer 103 and the flexible flow channel layer 104 of this embodiment are sequentially installed in the receiving groove, and the flexible flow channel layer 104 is installed on the rigid pressure cover layer 103 .

[0059] The rigid pressure cover layer 103 of the present embodiment may be made of any rigid material, such as transparent glass. The rigid pressure cover layer 103 of the present embodiment is bonded to the lower surface of the flexible flow channel layer 104 .

[0060] The flexible flow channel layer 104 of the present embodiment is made of flexible materials such as silicone, polyurethane, polydimethylsiloxane (PDMS), etc., and PDMS is preferably used in the present embodiment. A flow channel 110 is arranged on the side of the flexible flow channel layer 104 away from the rigid pressure cover layer 103. There are many ways to form the flow channel 110. For example, a protrusion is provided on the side of the flexible flow channel layer 104 close to the chip body 101. After the flexible flow channel layer 104 is attached to the chip body 101, the protrusion and the chip body 101 form a flow channel. In addition, the surface of the flexible flow channel layer 104 of the present embodiment close to the chip body 101 may be concave downward, and the chip body 101 is pressed on the surface of the flexible flow channel layer 104, and the chip body 101 and the concave form the flow channel of the present embodiment.

[0061] The chip body 101 of this embodiment is pressed onto the protrusion 111 on the flexible flow channel layer 104 and is detachably connected to the bottom cover 102. Specifically, the chip body 101 of this embodiment is provided with a bonding surface 108 on one side (the lower side in the figure) close to the rigid pressure covering layer 103, and the bonding surface is bonded with the protrusion 111 on the flexible flow channel layer 104.

[0062] The chip body 101 of this embodiment is provided with a filling port 107 which passes through the upper and lower surfaces of the chip body 101 . The filling port 107 is connected to the flow channel 110 . The filling port 107 is the location for adding reagents to the microfluidic chip 100 and is the channel for the microfluidic chip 100 to exchange substances with the outside world.

[0063] The top cover 105 of the present embodiment is detachably connected to the filling port 107 and is used to seal the filling port 107, serving as a sealing cover for the filling port 107. As a preferred implementation manner of the present embodiment, the top cover 105 of the present embodiment is threadedly connected to the filling port 107 or axially connected. For example, an external thread may be provided at the lower portion of the top cover 105, and an internal thread matching the external thread may be provided in the filling port 107 to facilitate the connection and disassembly of the top cover 105 and the filling port 107.

[0064] As a preferred implementation mode of the present embodiment, first positioning connection parts 109 are provided at opposite ends of the chip body 101 of the present embodiment, and correspondingly, second positioning connection parts 112 are provided at both ends of the bottom cover 102 of the present embodiment, and the positions and numbers of the second positioning connection parts 112 correspond to the first positioning connection parts 109 on the chip body 101, and the first positioning connection parts 109 and the second positioning connection parts 112 are detachably connected to realize the connection and locking between the chip body 101 and the bottom cover 102. Specifically, the connection and locking method of the first positioning connection parts 109 and the second positioning connection parts 112 of the present embodiment can be screw and nut connection, magnetic attraction, lock contraction, etc.

[0065] In order to realize the connection and assembly of the microfluidic chip 100 and the base 200, the present embodiment is provided with a third positioning connection part 106 at the bottom of the bottom cover 102. The number and position of the third positioning connection part 106 correspond to the fourth positioning connection part 215 on the base 200. It is the quick connection point of the microfluidic chip 100 and the base 200. The state of the microfluidic chip 100 and the base 200 after connection in the present embodiment is as follows: Figure 7 Specifically, the third positioning connection part 106 and the fourth positioning connection part 215 of this embodiment can also be combined by magnetic steel attraction, screw nut locking, expansion pin locking, and magnetic steel attraction is preferred.

[0066] The assembly method of the microfluidic chip 100 of this embodiment is that the bottom cover 102 is locked with the second positioning connection part 112 and the first positioning connection part 109, so as to press the rigid pressure cover layer 103 and the flexible flow channel layer 104 onto the chip body 101, and the flexible flow channel layer 104 is bonded with the bonding surface 108 through the protrusion 111 to form a sealed microfluidic channel.

[0067] In addition, Figure 2 and 3 In addition to the single-layer microfluidic chip 100 shown in FIG. Figure 4 As shown, this embodiment further provides a multi-layer microfluidic chip 100 , that is, the microfluidic chip 100 may further include a multi-layer flexible channel layer 104 and a multi-layer rigid capping layer 103 .

[0068] This multi-layer microfluidic chip 100 first adheres the above-mentioned flexible flow channel layer 104 to the bonding surface 108 of the chip body 101, and adheres the side of the flexible flow channel layer 104 with the sealing protrusion 111 to the bonding surface 108, and adheres the above-mentioned rigid pressure covering layer 103 to the bottom surface of the flexible flow channel layer 104.

[0069] Then, another flexible flow channel layer 104 is attached to the bottom surface of the rigid pressure cover layer 103, and the protrusion 111 of the other flexible flow channel layer 104 is attached to the bottom surface of the rigid pressure cover layer 103, and then another rigid pressure cover layer 103 is attached to the bottom surface of another flexible flow channel layer 104. The rigid pressure cover layer 103 between the flexible flow channel layers 104 should have a channel connecting the upper and lower flexible flow channel layers 104.

[0070] Finally, the bottom cover 102 is spliced ​​on the bottom surface of the bottommost rigid pressure cover layer 103, and the bottom cover 102 is connected to the chip body 101 through the first positioning connection part 109 and the second positioning connection part 112, and the flexible flow channel layer 104 and the rigid pressure cover layer 103 therebetween are pressed tightly. In this way, the structure of the two-layer flow channel chip is formed. By analogy, any number of flexible flow channel layers 104 and rigid pressure cover layers 103 can be stacked in sequence between the chip body 101 and the bottom cover 102, and then each layer is connected to each other through the flow port, so as to form a microfluidic chip 100 with any number of layers.

[0071] The microfluidic chip 100 assembled in this way has extremely high scalability. Different types of microfluidic chips 100 can be quickly constructed by simply changing the type and number of the flexible channel layer 104 and the rigid pressure cover layer 103 between the chip body 101 and the bottom cover 102. On the other hand, this disassembly and assembly method can be used to disassemble and clean the chip after use. If it is damaged after multiple uses, only the flexible channel layer 104 at the core of the microfluidic chip 100 needs to be replaced, which greatly reduces the use cost of the microfluidic chip 100 and increases the number of times the microfluidic chip 100 can be reused.

[0072] Based on the above structure, the inventors found that the base 200 of the existing microfluidic core system is generally also an integral structure, and it is impossible to realize the free splicing and combination between the bases 200, and it is impossible to achieve any number of expansions under the same control logic. Therefore, this embodiment also makes improvements to the structure of the base 200.

[0073] Combined with Figure 5 , 6 As shown in Figure 10, the microfluidic core system of this embodiment includes a plurality of bases 200. The base 200 of this embodiment includes a base body 201, a first mating surface 202, a second mating surface 203, a third mating surface 204, a first sealing connection portion 205, a second sealing connection portion 206, a third sealing connection portion 207, a first guide connection portion 208, a second guide connection portion 209, a first locking connection portion 210, a second locking connection portion 211, a first electrical connection portion 212, a second electrical connection portion 213, a third electrical connection portion 214, and a fourth positioning connection portion 215.

[0074] The first mating surface 202 and the second mating surface 203 of this embodiment are respectively located on the left and right sides of the base body 201. The first mating surface 202 and the second mating surface 203 are the joint surfaces for assembly between the bases 200. The second mating surface 203 of the first base 200 and the first mating surface 202 of the second base 200 are fixedly assembled with each other. By analogy, any number of bases 200 can form a large base 200 as a whole. The third mating surface 204 is located at the upper part of the base body 201 and is the joint surface between the base 200 and the microfluidic chip 100.

[0075] The first sealing connection part 205 of this embodiment is located on the first mating surface 202, the second sealing connection part 206 is located on the second mating surface 203, and the third sealing connection part 207 is located on the third mating surface 204. The first sealing connection part 205, the second sealing connection part 206 and the third sealing connection part 207 of this embodiment can be the interface structure shown in the figure.

[0076] The first sealing connection part 205 of this embodiment can be sealed and joined with the second sealing connection part 206. The third sealing connection part 207 is used to connect the base 200 and the gas path of the microfluidic chip 100. The first sealing connection part 205, the second sealing connection part 206, and the third sealing connection part 207 are interconnected inside the base 200.

[0077] The first guide connection part 208 of this embodiment is located on the first mating surface 202, and the second guide connection part 209 is located on the second mating surface 203, which plays a role of positioning and guiding when the two bases 200 are spliced. Specifically, the first guide connection part 208 of this embodiment can be a pin shaft, and the second guide connection part 209 of this embodiment can be a pin hole, or vice versa.

[0078] The first locking connection part 210 and the second locking connection part 211 of this embodiment are respectively located on the first mating surface 202 and the second mating surface 203. The first locking connection part 210 and the second locking connection part 211 cooperate with each other to play a locking role when the two bases 200 are spliced. The first locking connection part 210 and the second locking connection part 211 can also cooperate in a magnetic steel attraction, a screw and nut locking, an expansion pin locking, etc. In this embodiment, the screw and nut locking that is easy to implement is preferably used.

[0079] The first electrical connection portion 212 and the second electrical connection portion 213 of the present embodiment are respectively located on the first mating surface 202 and the second mating surface 203 , and are used for conducting electrical signals when the two bases 200 are combined.

[0080] The third electrical connection part 214 of this embodiment is located on the third mating surface 204 mentioned above, and is used as an interface for electrical signal conduction between the base 200 and the microfluidic chip 100. The first electrical connection part 212, the second electrical connection part 213, and the third electrical connection part 214 are interconnected inside the base 200. The fourth positioning connection part 215 is located on the third mating surface 204, and its number and position correspond to the third positioning connection part 106 on the microfluidic chip 100, which is the site for the microfluidic chip 100 to be quickly combined with the base 200. The combination method can be magnetic steel attraction, screw nut locking, and expansion pin locking, and magnetic steel attraction is preferred here.

[0081] Combined with Fig.10 As shown, the base 200 of the above structure can be connected to any number of combined bases 200 by the cooperation of the first mating surface 202 and the second mating surface 203, and then the gas path of the base 200 is connected through the first sealing connection part 205, the second sealing connection part 206, and the third sealing connection part 207, and the electrical connection is connected through the first electrical connection part 212, the second electrical connection part 213, and the third electrical connection part 214. At the same time, as many bases 200 as combined, as many microfluidic chips 100 can be placed. The microfluidic chip 100 and the base 200 can be quickly combined or separated by the third positioning connection part 106 and the fourth positioning connection part 215. This approach not only greatly reduces the difficulty of operation, but also provides a hardware foundation for the high-throughput operation of the microfluidic chip 100.

[0082] Based on the structures of the above-mentioned microfluidic chip 100 and the base 200 , in order to realize that the controllers 300 can be freely combined in any number and each controller 300 can be independently controlled, this embodiment further improves the structure of the controller 300 .

[0083] Combined with Figure 8 , 9 As shown in Figure 10, the controller 300 of this embodiment includes a first connection surface 301, a second connection surface 302, a first connection bayonet 303, a second connection bayonet 304, a fourth electrical connection part 305, a fifth electrical connection part 306, a fourth sealed connection part 307, a fifth sealed connection part 308, an operation screen 309, an air path connection part 310, and a sixth electrical connection part 311.

[0084] The controller 300 of this embodiment has the first connection surface 301 and the second connection surface 302 on the left and right sides respectively. The first connection surface 301 and the second connection surface 302 of two adjacent controllers 300 can be combined with each other, and the combined controllers 300 can operate independently, so that a controller 300 with multiple control modes can be combined through multiple controllers 300.

[0085] The first connection bayonet 303 and the second connection bayonet 304 of this embodiment are respectively located on the first connection surface 301 and the second connection surface 302. The first connection bayonet 303 and the second connection bayonet 304 are interfaces for the controller 300 to engage with each other.

[0086] The fourth sealing connection portion 307 and the fifth sealing connection portion 308 of the present embodiment are respectively located on the first connection surface 301 and the second connection surface 302 , and the fourth sealing connection portion 307 and the fifth sealing connection portion 308 can cooperate with each other to seal.

[0087] The fourth electrical connection portion 305 and the fifth electrical connection portion 306 of the present embodiment are respectively located on the first connection surface 301 and the second connection surface 302 . The fourth electrical connection portion 305 and the fifth electrical connection portion 306 cooperate with each other to connect the electrical signal of the controller 300 .

[0088] The operation screen 309 of this embodiment is located on the front of the controller 300 and is the human-machine interaction interface of the controller 300. In addition, it should be noted that the controller 300 can also be connected to a PC and controlled by the PC.

[0089] The gas circuit connection part 310 and the sixth electrical connection part 311 of this embodiment are interfaces for the controller 300 to interact with the corresponding base 200. The gas circuit connection part 310 is connected to the first sealing connection part 205 of the base 200 through a pipeline or direct contact to connect the gas circuit. The sixth electrical connection part 311 is connected to the first electrical connection part 212 of the base 200 through a cable or direct contact to connect the electrical signal.

[0090] In this embodiment, multiple controllers 300 are spliced ​​into a group of controllers 300, each of which can operate independently. Each controller 300 is connected to a group of bases 200 through a gas connection part and an electrical connection part, so that multiple bases 200 are independent of each other and operate according to their own control logic. Each group of bases 200 is spliced ​​by multiple bases 200, and each base 200 can hold a microfluidic chip 100. Each group of bases 200 operates according to the same control logic under the control of the same controller 300, realizing high-throughput operation under the same control logic.

[0091] In addition, each microfluidic chip 100 can be diversified by adjusting the type and quantity of the flexible channel layer 104 and the rigid capping layer 103. Compared with the traditional system, the microfluidic core system of this embodiment has the advantages of high throughput, strong diversity, easy use and simple maintenance.

[0092] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A microfluidic core system, comprising a microfluidic chip, a base and a controller, characterized in that: The microfluidic chip comprises a chip body, a top cover, a bottom cover, a flexible flow channel layer and a rigid pressure capping layer; The bottom cover is provided with a receiving groove; The rigid gland layer and the flexible flow channel layer are both located in the accommodating groove, the flexible flow channel layer is installed on the rigid gland layer, and a flow channel is provided on a side of the flexible flow channel layer away from the rigid gland layer; The flexible flow channel layer and the rigid gland layer are provided in plurality; The chip body is pressed onto the flexible flow channel layer and is detachably connected to the bottom cover, and the chip body is provided with a filling port communicating with the flow channel; The top cover is detachably connected to the filling port and is used to block the filling port; There are multiple bases, multiple microfluidic chips are mounted on the multiple bases in a one-to-one correspondence, and two adjacent bases are detachably connected; The base is connected to the controller.

2. The microfluidic core system according to claim 1, characterized in that: The chip body is provided with first positioning connection parts at opposite ends thereof; The bottom cover is provided with second positioning connection parts at opposite ends; The first positioning connection portion and the second positioning connection portion are detachably connected.

3. The microfluidic core system according to claim 1, characterized in that: A concave is provided on one side of the flexible flow channel layer close to the chip body, and after the flexible flow channel layer is attached to the chip body, the concave and the chip body form the flow channel; Alternatively, a protrusion is provided on a side of the flexible flow channel layer close to the chip body, and after the flexible flow channel layer is attached to the chip body, the protrusion and the chip body form the flow channel.

4. The microfluidic core system according to claim 1, characterized in that: The bottom cover is provided with a plurality of third positioning connection parts; the base is provided with a plurality of fourth positioning connection parts; the plurality of third positioning connection parts and the plurality of fourth positioning connection parts are connected in a one-to-one correspondence.

5. The microfluidic core system according to claim 1, characterized in that: The base includes opposing first and second sides, and a third side located between the first and second sides; The first side is provided with a first sealing connection portion and a first electrical connection portion, the second side is provided with a second sealing connection portion and a second electrical connection portion, and the third side is provided with a third sealing connection portion and a third electrical connection portion; The first sealing connection part, the second sealing connection part and the third sealing connection part are all in communication with the interior of the base; The first sealed connection portion of one base is communicated with and sealedly engaged with the second sealed connection portion of another adjacent base; The first electrical connection portion of one base is connected to the second electrical connection portion of another base adjacent thereto; The third sealing connection portion is communicated with the inside of the microfluidic chip, and the third electrical connection portion is electrically connected to the microfluidic chip.

6. The microfluidic core system according to claim 1, characterized in that: The base is provided with a first guide connection portion on one side of two opposite sides, and a second guide connection portion on the other side; The first guide connection portion of one base is detachably connected to the second guide connection portion of another adjacent base.

7. The microfluidic core system according to claim 1, characterized in that: A first locking connection portion is provided on one side of two opposite sides of the base, and a second locking connection portion is provided on the other side; The first locking connection portion of one base is detachably connected to the second locking connection portion of another adjacent base.

8. The microfluidic core system according to any one of claims 1 to 7, characterized in that: There are multiple controllers, and two adjacent controllers are detachably connected; A fourth sealing connection portion and a fourth electrical connection portion are provided on one side of the controller at two opposite sides, and a fifth sealing connection portion and a fifth electrical connection portion are provided on the other side; The fourth sealed connection portion and the fifth sealed connection portion are both in communication with the interior of the controller; The fourth sealed connection portion of one controller is connected to and sealed with the fifth sealed connection portion of another adjacent controller; The fourth electrical connection portion of one of the controllers is connected to the fifth electrical connection portion of another adjacent controller.

9. The microfluidic core system according to claim 8, characterized in that: The controller is provided with a gas circuit connection part and a sixth electrical connection part; When the base is provided with a first sealing connection portion and a first electrical connection portion, the gas path connection portion is communicated with the first sealing connection portion, and the sixth electrical connection portion is connected with the first electrical connection portion.

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