A substrate with electrically and thermally conductive heat dissipation effect

Abstract

The present application relates to a substrate with electrically and thermally conductive heat dissipation effect, which comprises light source fixing parts and heat conductive heat dissipation parts, a plurality of the light source fixing parts and a plurality of the heat conductive heat dissipation parts are connected together to form the substrate, the light source fixing parts are provided with LED light sources, the substrate is arranged in a bulb of a lamp, the heat conductive heat dissipation parts are attached to the inner surface of the glass bulb wall, the LED light sources are electrified to emit light, the light transmits through the glass bulb wall to irradiate out, and the heat generated by the operation of the substrate is mainly dissipated through the heat conductive heat dissipation parts and the glass bulb wall to dissipate heat for the lamp.

Description

TECHNICAL FIELD

[0001] The present application relates to a substrate, in particular to a substrate provided with an LED light source and having electrically and thermally conductive and heat dissipation effects. BACKGROUND

[0002] It is known that, with the further withdrawal of incandescent lamps from the market, the demand for LED filament lamps is increasing at home and abroad. Since LED filament lamps have the large-angle light emission form of the traditional incandescent lamps that are familiar to the public, they are popular among the application groups with "retro" complex, and the LED filament lamps that look like incandescent lamps find their "valley" of application. Also, since the production and manufacturing process of LED filament lamps is similar to that of incandescent lamps, for lighting manufacturers who have been engaged in the production and manufacturing of incandescent lamps, it is undoubtedly an extremely simple thing to produce LED filament lamps and enter this application field. With the LED filament lamps from theory to reality lighting products, from decorative applications to functional lighting applications, the demand will continue to expand.

[0003] However, in terms of technical composition, since the filament of the filament lamp is in a closed environment, and the area of the substrate of the LED filament is too small, the heat dissipation in actual application is difficult to meet the ideal design requirements under the requirements of small light decay and long service life. The power cannot be improved, and the maximum power can only fluctuate between 6-8 watts. At present, another deficiency of LED filament lamps is that due to the need to increase the heat dissipation area and the length of the filament, it is difficult to achieve full circumferential light in structure. In addition, due to the large light-emitting area, the light intensity cannot reach the effect of traditional incandescent lamps, and LED filament lamps cannot replace incandescent lamps in many occasions.

[0004] The deficiencies of the current LED filament lamp are: 1. The length of the transparent substrate of sapphire, glass, etc. for double-sided light emission is relatively long, and the light mainly goes in the direction of the four directions, and the light below the lamp is relatively dark. 2. The soft aluminum substrate emits light on one side - the main light also goes in the direction of the four directions, and the light above and below is weak.

[0005] The current double-sided light emitting and single-sided light emitting LED filament lamp has a problem that the limited substrate itself cannot achieve the heat dissipation purpose. In addition, the substrate is made of sapphire, glass, aluminum and FPC, and the infrared radiation wavelength of these materials is above 8 μm, which belongs to medium and far infrared radiation. The glass bulb shell of the filament lamp is made of ordinary soda lime glass. The vibration frequency (intrinsic frequency) of a substance is determined by the size of the mechanical constant and the atomic weight. The atomic weight of the glass oxide such as Na2O·CaO·6SiO2 or Na2SiO3, CaSiO3, SiO2 is small, and the force constant is large, so the intrinsic frequency is large, and it cannot transmit medium and far infrared, but only near infrared, visible light and ultraviolet light with a wavelength below 2.5 μm. Therefore, the heat of the filament of the ordinary filament lamp cannot be directly transmitted through the glass shell, but only through the low thermal conductivity gas and glass, and the heat is transmitted to the limited outer surface of the glass through the layer-by-layer thermal resistance, and then taken away by the air, and the heat dissipation efficiency is not good, which is the main disadvantage of the traditional technology. SUMMARY

[0006] The technical scheme adopted by the present application is as follows: a substrate with electrically conductive, heat-conducting and heat-dissipating effects, comprising a light source fixing part and a heat-conducting and heat-dissipating part, a plurality of the light source fixing parts and a plurality of the heat-conducting and heat-dissipating parts are connected together to form the substrate, the light source fixing part is provided with an LED light source, the substrate is arranged in a bulb of a lamp, the heat-conducting and heat-dissipating part is attached to the inner surface of the glass bulb wall, the LED light source is powered to emit light, the light transmits through the glass bulb wall and irradiates out, and the heat generated by the operation of the substrate is mainly dissipated through the heat-conducting and heat-dissipating part and the glass bulb wall to dissipate heat for the lamp.

[0007] The light source fixing part has a fixed top surface, the LED light source is arranged on the fixed top surface, the fixed top surface is a reflective surface, part of the light emitted by the LED light source directly transmits through the glass bulb wall and irradiates out, and part of the light is reflected by the inner surface of the glass bulb wall and finally reflected by the reflective surface and then transmits through the glass bulb wall and irradiates out. The heat-conducting and heat-dissipating part has a contact top surface, a plurality of contact ribs are protruded on the contact top surface, and the plurality of contact ribs are in contact with the inner surface of the glass bulb wall. The bottom surface of the substrate is provided with a radiation reflection layer, part of the heat radiation generated by the substrate directly transmits through the glass bulb wall and radiates out, and another part of the heat radiation is reflected by the radiation reflection layer and then transmits through the glass bulb wall and radiates out.

[0008] A plurality of the substrates are connected into a whole substrate through an insulating connecting body, the whole substrate is arranged in a bulb of a lamp, and the heat-conducting and heat-dissipating part of each of the substrates constituting the whole substrate is attached to the inner surface of the glass bulb wall.

[0009] The insulation connecting body comprises a front fixed film and a back fixed film, the front fixed film is attached to the front of the whole base plate, the back fixed film is attached to the back of the whole base plate, the front fixed film is provided with a light source window and an infrared radiation window, the back fixed film is provided with a reflection window, the fixed top surface of the light source fixed part and the LED light source are in the light source window, the contact top surface of the heat conduction and heat dissipation part is in the infrared radiation window, and the radiation reflection layer on the bottom surface of the base plate is in the reflection window.

[0010] The elastic pressing part is arranged on the base plate, and when the base plate is bent, the elastic pressing part can exert an elastic force on the base plate, so that the heat conduction and heat dissipation part of the base plate is tightly attached to the inner surface of the glass bulb wall.

[0011] A base plate with electrically conductive and heat-conducting heat dissipation function comprises a light source fixed part and a heat conduction and heat dissipation part, a plurality of the light source fixed parts and a plurality of the heat conduction and heat dissipation parts are connected together to form the base plate, the light source fixed part is provided with an LED light source, the base plate is arranged in a bulb of a lamp, the heat conduction and heat dissipation part is attached to the inner surface of the glass bulb wall, the LED light source is powered to emit light, the light transmits through the glass bulb wall and is emitted, the heat generated by the operation of the base plate is mainly dissipated through the heat conduction and heat dissipation part and the glass bulb wall, the light source fixed part has a fixed top surface, the LED light source is arranged on the fixed top surface, the fixed top surface is a reflecting surface, and the bottom surface of the base plate is provided with a radiation reflection layer.

[0012] A plurality of the base plates are connected by an insulation connecting body to form a whole base plate, the whole base plate is arranged in a bulb of a lamp, and the heat conduction and heat dissipation part of each of the base plates constituting the whole base plate is attached to the inner surface of the glass bulb wall.

[0013] The beneficial effects of the present application are that the light source fixing parts and the heat-conducting and heat-dissipating parts are connected together to form the substrate. The light source fixing parts are provided with LED light sources. The LED light sources can be LED lamp beads, LED light-emitting chips or other light sources. The substrate is arranged in a lamp bulb of a lamp, and the heat-conducting and heat-dissipating parts are attached to the inner surface of the glass lamp bulb wall. When the LED light sources are powered on and emit light, the light transmits through the glass lamp bulb wall and is emitted out, at this moment, the heat generated by the operation of the substrate is mainly in the form of heat radiation and is dissipated through the heat-conducting and heat-dissipating parts and the glass lamp bulb wall to achieve the effect of dissipating heat for the lamp. In practice, the intensity of heat radiation is inversely proportional to the square of the distance, and in the present application, the heat-conducting and heat-dissipating parts are directly attached to the inner surface of the glass lamp bulb wall, which can minimize the distance between the substrate and the glass lamp bulb wall, thereby improving the radiation and heat dissipation efficiency and improving the overall heat dissipation efficiency of the lamp. When the present application works, most of the heat generated by the operation of the LED light sources is directly conducted to the heat-conducting and heat-dissipating parts, and then the heat is mainly in the form of heat radiation and is dissipated through the glass lamp bulb wall. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is a front view of the substrate of the present application.

[0015] Figure 2 It is a structural schematic view of the substrate of the present application.

[0016] Figure 3 It is a schematic view of the substrate of the present application arranged in a lamp bulb.

[0017] Figure 4 It is a schematic view of the lamp bulb of the present application.

[0018] Figure 5 It is a schematic view of the overall substrate of the present application.

[0019] Figure 6 It is a schematic view of the front fixed film of the present application.

[0020] Figure 7 It is a schematic view of the back fixed film of the present application.

[0021] Figure 8 It is a schematic view of the lamp of the present application.

[0022] Figure 9 It is a schematic view of the heat-conducting column of the present application.

[0023] Figure 10 It is a schematic view of the spiral current forming lamp strip magnetic field of the present application.

[0024] Figure 11 It is a schematic view of the fan arranged in the lamp bulb of the present application.

[0025] Figure 12 A schematic diagram of a lamp made according to the present application in the form of a bulb.

[0026] Figure 13 A front view of another embodiment of a substrate according to the present application.

[0027] Figure 14 A cross-sectional view of another embodiment of a substrate according to the present application.

[0028] Figure 15 A front view of yet another embodiment of a substrate according to the present application.

[0029] Figure 16 A cross-sectional view of yet another embodiment of a substrate according to the present application.

[0030] Figure 17 A cross-sectional view of an embodiment of a lamp according to the present application as a street lamp. DETAILED DESCRIPTION

[0031] As shown in the drawings, a substrate 500 with electrically and thermally conductive heat dissipation function comprises a light source fixing portion 510 and a thermally conductive heat dissipation portion 520. Figures 1-7

[0032] A plurality of the light source fixing portions 510 and a plurality of the thermally conductive heat dissipation portions 520 are connected together to form the substrate 500.

[0033] In a specific implementation, the light source fixing portions 510 and the thermally conductive heat dissipation portions 520 are arranged in an interval, that is, one of the thermally conductive heat dissipation portions 520 is connected between two of the light source fixing portions 510, and one of the light source fixing portions 510 is connected between two of the thermally conductive heat dissipation portions 520.

[0034] The light source fixing portion 510 is provided with an LED light source 530.

[0035] The LED light source 530 can be an LED lamp bead, an LED light emitting chip or other light source.

[0036] The substrate 500 is arranged in a bulb of a lamp, and the thermally conductive heat dissipation portion 520 is attached to an inner surface 610 of a glass bulb wall 600.

[0037] The LED light source 530 is powered to emit light, and the light is transmitted through the glass bulb wall 600 to be emitted out, at this moment, heat generated by the operation of the substrate 500 is mainly transmitted through the thermally conductive heat dissipation portion 520 and the glass bulb wall 600 to be dissipated out in the form of heat radiation to achieve the heat dissipation effect for the lamp.

[0038] ​In practice, the intensity of heat radiation is inversely proportional to the square of the distance, and in the present application, the heat-conducting and heat-dissipating part 520 is directly attached to the inner surface 610 of the glass bulb wall 600, so that the distance between the substrate 500 and the glass bulb wall 600 is minimized, thereby improving the radiation and heat-dissipating efficiency and improving the overall heat-dissipating efficiency of the lamp.

[0039] In operation, the LED light source 530 generates most of the heat generated during operation directly into the heat-conducting and heat-dissipating part 520, which then dissipates heat mainly in the form of heat radiation through the glass bulb wall 600.

[0040] In specific implementation, the LED flip chip directly on the substrate 500 can also meet the above-mentioned heat-dissipating requirements.

[0041] The light source fixing part 510 has a fixing top surface 511 on which the LED light source 530 is arranged, and the fixing top surface 511 is a reflective surface, part of the light emitted by the LED light source 530 directly transmits through the glass bulb wall 600, and part of the light is reflected by the inner surface 610 of the glass bulb wall 600 and finally reflected by the reflective surface and transmitted through the glass bulb wall 600.

[0042] The heat-conducting and heat-dissipating part 520 has a contact top surface 521 on which a plurality of contact ribs 522 are provided, and the plurality of contact ribs 522 are in contact with the inner surface 610 of the glass bulb wall 600 to realize the effect of the heat-conducting and heat-dissipating part 520 being attached to the inner surface 610 and dissipating heat.

[0043] At the same time, when the substrate 500 is bent and placed in the bulb, the plurality of contact ribs 522 also have the effect of ensuring the bending effect.

[0044] As shown in Figure 4 In specific implementation, the glass bulb wall 600 is straight pipe-shaped, the inner surface 610 is pipe-shaped, and a plurality of heat-conducting and heat-dissipating parts 520 are simultaneously attached to the inner surface 610 of the pipe.

[0045] As shown in Figure 2 In specific implementation, a near-infrared radiation layer 13 is provided on the contact top surface 521 of the heat-conducting and heat-dissipating part 520.

[0046] It is worth noting that at this time, the top of the contact rib 522 is not provided with the near-infrared radiation layer 13, because the radiation material layer itself has a certain thermal resistance, which will affect the contact between the contact rib 522 and the inner surface 610 and affect the heat conduction.

[0047] AsFigure 2 As shown, in a specific implementation, a radiation reflective layer 540 is provided on the bottom surface of the substrate 500.

[0048] The radiation reflective layer 540 can be a silver-plated layer or other reflective layers. Silver is a low-emissivity layer and will not lower the effective front radiation temperature.

[0049] The thermal radiation generated by the substrate 500 is partially radiated directly through the glass bulb wall 600, and the other part is reflected by the radiation reflection layer 540 and then radiated through the glass bulb wall 600.

[0050] In practice, the intensity of thermal radiation is proportional to the fourth power of temperature: (273° + X). 4 , where X is temperature.

[0051] The radiation reflective layer 540 enables most of the thermal radiation generated by the substrate 500 to radiate outward from its top. At this time, the temperature of the top of the substrate 500 is much higher than the temperature of its bottom surface. Therefore, the outward emissivity of the top surface of the substrate 500 is stronger. This cycle allows the thermal radiation generated by the substrate 500 to be efficiently and directly radiated through the glass bulb wall 600.

[0052] In practice, the radiation reflection layer 540 is disposed on the bottom surface of the heat-conducting and heat-dissipating part 520 and the light source fixing part 510.

[0053] like Figure 5 The diagram shows another structural form of the substrate 500 of the present invention. The arrow indicates the overall bending direction, and after bending, the entire substrate is placed in the glass bulb wall 600.

[0054] In practice, several substrates 500 are connected into a single substrate by an insulating connector 700.

[0055] like Figure 3 As shown, the integral substrate is disposed in the bulb of the lamp, and the heat-conducting and heat-dissipating portion 520 of each of the substrate 500 that makes up the integral substrate is attached to the inner surface 610 of the glass bulb wall 600.

[0056] like Figure 3 As shown, each of the substrates 500 is provided with a spring-loaded portion 550. When the substrate 500 is bent, the spring-loaded portion 550 can apply an elastic force to the substrate 500, so that the heat-conducting and heat-dissipating portion 520 of the substrate 500 is tightly attached to the inner surface 610 of the glass bulb wall 600.

[0057] When the glass bulb wall 600 is a straight tube and the inner surface 610 is tubular, the spring-loaded portion 550 is disposed at the rear end of the substrate 500.

[0058] When the substrate 500 is bent into a ring shape, the elastic pressing portion 550 presses the front end of the substrate 500, so that the heat-conducting heat-dissipating portion 520 of the substrate 500 is tightly attached to the inner surface 610 of the tube.

[0059] In a specific implementation, the insulating connecting body 700 includes a front fixed film 710 and a back fixed film 720.

[0060] The front fixed film 710 is attached to the front surface of the whole substrate, and the back fixed film 720 is attached to the back surface of the whole substrate.

[0061] As shown in Figure 6 The front fixed film 710 is provided with a light source window 711 and an infrared radiation window 712.

[0062] As shown in Figure 7 The back fixed film 720 is provided with a reflection window 721 and a lamp bead back radiation window 722.

[0063] The fixed top surface 511 of the light source fixed portion 510 and the LED light source 530 are in the light source window 711.

[0064] The contact top surface 521 of the heat-conducting heat-dissipating portion 520 and the near-infrared radiation layer 13 thereon are in the infrared radiation window 712.

[0065] The radiation reflection layer 540 on the bottom surface of the substrate 500 is in the reflection window 721.

[0066] The bottom surface of the light source fixed portion 510 is in the lamp bead back radiation window 722.

[0067] In a specific implementation, the front fixed film 710 is a white fixed film, so as to improve the light reflection effect of the LED light source 530.

[0068] In a specific implementation, the lamp bulb is filled with a heat-dissipating gas, such as helium, argon, etc.

[0069] The heat of the whole substrate is mainly radiated through the light-emitting front surface, and the heat generated by the back surface is conducted through the heat-dissipating gas.

[0070] As shown in Figures 1-12 Another embodiment of the technical scheme of the present application is as follows.

[0071] As shown in Figure 8As shown, a lamp with a conductive and thermally conductive heat dissipation substrate includes an integral substrate and a lamp bulb. The lamp bulb has a sealed cavity 100, and the integral substrate is disposed in the sealed cavity 100. Several substrates 500 are connected to form the integral substrate by an insulating connector 700.

[0072] like Figures 1-7 As shown, each of the substrates 500 includes a light source fixing portion 510 and a heat conduction and heat dissipation portion 520.

[0073] Several light source fixing parts 510 and several heat conduction and heat dissipation parts 520 are connected together to form the substrate 500.

[0074] In practice, the light source fixing part 510 and the heat conduction and heat dissipation part 520 are spaced apart. That is, one heat conduction and heat dissipation part 520 is connected between two light source fixing parts 510, and one light source fixing part 510 is connected between two heat conduction and heat dissipation parts 520.

[0075] An LED light source 530 is provided on the fixed part 510 of the light source.

[0076] The LED light source 530 can be an LED bead, an LED chip, or other light source.

[0077] The heat-conducting and heat-dissipating part 520 is attached to the inner surface 610 of the glass bulb wall 600.

[0078] like Figure 8 As shown, the lamp bulb includes a glass bulb wall 600 and a glass bulb inner wall 800, and the sealed cavity 100 is formed by the inner surface 610 of the glass bulb wall 600 and the outer surface of the glass bulb inner wall 800 surrounding each other.

[0079] When the LED light source 530 is powered on, it emits light, which shines out through the glass bulb wall 600. At this moment, the heat generated by the substrate 500 during operation is mainly dissipated through the heat-conducting and heat-dissipating part 520 and through the glass bulb wall 600 in the form of thermal radiation, so as to achieve the function of heat dissipation for the lamp.

[0080] In practice, the intensity of thermal radiation is inversely proportional to the square of the distance. In this invention, by directly attaching the heat-conducting and heat-dissipating part 520 to the inner surface 610 of the glass bulb wall 600, the distance between the substrate 500 and the glass bulb wall 600 can be minimized, thereby improving the efficiency of radiative heat dissipation and thus improving the overall heat dissipation efficiency of the lamp. When the LED light source 530 is powered on and emits light, most of the heat generated is directly conducted to the heat-conducting and heat-dissipating part 520, and then the heat-conducting and heat-dissipating part 520 dissipates the heat mainly through the glass bulb wall 600 in the form of thermal radiation.

[0081] The light source fixing part 510 has a fixing top surface 511, the LED light source 530 is arranged on the fixing top surface 511, the fixing top surface 511 is a reflecting surface, part of the light emitted by the LED light source 530 directly transmits through the glass bulb wall 600 to irradiate, and part of the light is reflected by the inner surface 610 of the glass bulb wall 600 and finally transmits through the glass bulb wall 600 after being reflected by the reflecting surface.

[0082] The heat-conducting and heat-dissipating part 520 has a contact top surface 521, a plurality of contact ribs 522 are protruded on the contact top surface 521, the plurality of contact ribs 522 are in contact with the inner surface 610 of the glass bulb wall 600, so that the heat-conducting and heat-dissipating part 520 is tightly attached to the inner surface 610 and dissipates heat.

[0083] Meanwhile, the plurality of contact ribs 522 also have the effect of ensuring the bending effect when the substrate 500 is bent and placed in the bulb.

[0084] In the specific implementation, the near-infrared radiation layer 13 is arranged on the contact top surface 521 of the heat-conducting and heat-dissipating part 520.

[0085] The near-infrared radiation layer 13 is also arranged on the bottom surface of the substrate 500.

[0086] It is worth noting that at this time, the top of the contact rib 522 is not provided with the near-infrared radiation layer 13, because the radiation material layer itself has a certain thermal resistance, which will affect the contact between the contact rib 522 and the inner surface 610 and affect the heat conduction.

[0087] In the specific implementation, the elastic pressing part 550 is arranged on each of the substrates 500, and when the substrate 500 is bent, the elastic pressing part 550 can exert an elastic force on the substrate 500, so that the heat-conducting and heat-dissipating part 520 of the substrate 500 is tightly attached to the inner surface 610 of the glass bulb wall 600.

[0088] When the glass bulb wall 600 is a straight pipe, and the inner surface 610 is a pipe, the elastic pressing part 550 is arranged at the rear end of the substrate 500, and when the substrate 500 is bent into a ring shape, the elastic pressing part 550 presses the front end of the substrate 500, so that the heat-conducting and heat-dissipating part 520 of the substrate 500 is tightly attached to the inner surface 610 of the pipe.

[0089] In the specific implementation, the insulating connecting body 700 includes a front fixed film 710 and a back fixed film 720, wherein the front fixed film 710 is attached to the front of the whole substrate, and the back fixed film 720 is attached to the back of the whole substrate.

[0090] The front fixed film 710 is provided with a light source window 711 and an infrared radiation window 712, and the back fixed film 720 is provided with a lamp bead back radiation window 722.

[0091] The fixed top surface 511 of the light source fixed part 510 and the LED light source 530 are located in the light source window 711.

[0092] The near-infrared radiation layer 13 on the contact top surface 521 of the heat-conducting heat-dissipating part 520 is located in the infrared radiation window 712.

[0093] The near-infrared radiation layer 13 on the bottom surface of the substrate 500 is located in the lamp bead back radiation window 722.

[0094] In specific implementation, the front fixed film 710 is a white fixed film to improve the light reflection effect of the LED light source 530.

[0095] In specific implementation, the sealed cavity 100 is filled with heat-dissipating gas, such as helium, argon, etc.

[0096] In specific implementation, the near-infrared radiation layer 13 can be made of various materials, such as a mixed material with 60% of nickel oxide, 30% of cobalt oxide, and 10% of iron oxide.

[0097] In operation, the LED light source 530 is powered to emit light, and the heat generated by the operation is conducted to the near-infrared radiation layer 13, which radiates the heat in the form of near-infrared short waves to achieve the effect of dissipating heat and reducing the working temperature of the substrate 500.

[0098] The lamp further includes a heat-conducting column 20 corresponding to the near-infrared radiation layer 13 on the bottom surface of the substrate 500.

[0099] The heat-conducting column 20 is used to absorb the near-infrared short waves emitted by the near-infrared radiation layer 13.

[0100] In operation, the near-infrared radiation layer 13 radiates heat in the form of near-infrared short waves, and at this moment, the heat-conducting column 20 absorbs the near-infrared short waves, and at the same time, the heat-conducting column 20 dissipates heat outward to achieve the effect of dissipating heat for the lamp.

[0101] The heat-conducting column 20 is provided with an infrared absorption layer 21 corresponding to the near-infrared radiation layer 13 on the bottom surface of the substrate 500, and the infrared absorption layer 21 is used to absorb the near-infrared short waves emitted by the near-infrared radiation layer 13.

[0102] In the embodiment, the infrared absorption layer 21 has an absorption rate greater than 90% and an emissivity less than 20%. The infrared absorption layer 21 can be made of a mixture of various materials, for example, a mixture of 60% nickel oxide, 30% cobalt oxide and 10% iron oxide by weight.

[0103] The heat-conducting column 20 further has an aerogel layer 22 arranged on the outer surface of the heat-conducting column 20 between the outer surface of the heat-conducting column 20 and the infrared absorption layer 21.

[0104] In operation, the infrared absorption layer 21 absorbs the near-infrared short waves emitted by the near-infrared radiation layer 13. At this time, the heat is radiated outward through the inner surface of the other side of the heat-conducting column 20 by means of the aerogel layer 22.

[0105] The aerogel (SiO_2 aerogel has extremely low thermal conductivity due to its fine nano-porous structure, and pure aerogel is almost transparent to near-infrared wavelengths below 8 μm) used to make the aerogel layer 22. When the near-infrared passes through, the heat generated is absorbed by a black body material with a characteristic wavelength greater than 8 μm. After being heated, the wavelength of the radiation is greater than 8 μm, which is blocked by the aerogel. In addition, the aerogel has extremely poor thermal conductivity of 0.013 W / m.k. Therefore, the heat can only be radiated from the inner surface of the heat-conducting column 20.

[0106] In the embodiment, the air flows around the heat-conducting column 20 to improve the heat dissipation efficiency of the heat-conducting column 20 and the heat dissipation effect of the lamp.

[0107] In the embodiment, the glass bulb wall 600 and the glass bulb inner wall 800 are made of quartz or infrared glass.

[0108] The quartz or infrared glass allows the near-infrared, mid-infrared and infrared reflected by the glass to pass through, and the transmitted near-infrared is absorbed by the heat-conducting column 20.

[0109] In the embodiment, the glass bulb inner wall 800 is a glass inner sleeve, and the glass bulb wall 600 is a glass outer sleeve.

[0110] The outer surface of the glass inner sleeve and the inner surface of the glass outer sleeve surround the sealed cavity 100.

[0111] The inner surface of the glass inner sleeve surrounds a ventilation and heat dissipation cavity 150, and the heat-conducting column 20 is arranged in the ventilation and heat dissipation cavity 150.

[0112] The ventilation and heat dissipation cavity 150 includes an air inlet 151 and an air outlet 152.

[0113] The air inlet 151 and the air outlet 152 are respectively located at the two ends of the lamp.

[0114] The air inlet 151 is located at the lamp holder, and the air outlet 152 is located at the front end of the lamp.

[0115] In practice, the integral substrate is arranged around the heat-generating column 20.

[0116] Both the overall substrate and the heat-generating column 20 are tubular.

[0117] The integral substrate emits light when energized. The current flowing in the integral substrate forms a spiral current 15 along the spiral direction of the integral substrate. The spiral current 15 forms a lamp bar magnetic field 16. The lamp bar magnetic field 16 is located in the ventilation and heat dissipation cavity 150. The heat-drawing column 20 is located in the lamp bar magnetic field 16. The heat dissipation efficiency of the heat-drawing column 20 is improved by means of the lamp bar magnetic field 16.

[0118] Specifically, these are various optical phenomena caused by the interaction of light (infrared) with magnetized matter, including Faraday's magneto-optical rotation effect, the Cotton-Mouton effect, and the Kerr magneto-optical effect. These effects all originate from the magnetization of matter.

[0119] This reflects the connection between light and the magnetism of matter. When light propagates in a medium, if a strong magnetic field is applied parallel to the direction of light propagation, the direction of light vibration will be deflected. The direction of deflection depends on the properties of the medium and the direction of the magnetic field. This phenomenon is called magneto-optical rotation. The external magnetic field force can lower the energy level of electromagnetic waves, reducing the heat supplied by the substrate required for infrared radiation, thus increasing the radiation intensity at the same temperature.

[0120] like Figure 11 As shown, in specific implementation, a fan 155 is provided in the ventilation and heat dissipation cavity 150 to improve heat dissipation efficiency.

[0121] In practical implementation, the heat-generating column 20 can be tubular, conical, etc. For example... Figure 12 As shown, the lamp of the present invention can also be made in the shape of a bulb.

[0122] like Figures 13-16 The image shows another embodiment of the present invention.

[0123] A substrate with thermal conductivity and heat dissipation function includes a light source region 910 and a thermal conductivity and heat dissipation region 920.

[0124] Several light source regions 910 are disposed on the substrate.

[0125] In a specific implementation, the heat-conducting and heat-dissipating area 920 is located between two adjacent light source areas 910. The light source area 910 can be disposed on the surface of the substrate or in the substrate.

[0126] The light source region 910 is provided with an LED light body 930.

[0127] The substrate is arranged in the bulb of the lamp, and the heat-conducting heat dissipation region 920 is attached to the inner surface of the glass bulb wall.

[0128] The LED light body 930 is powered to emit light, and the light transmits through the glass bulb wall to be emitted out. At this moment, the heat generated by the operation of the substrate is mainly dissipated in the form of heat radiation through the heat-conducting heat dissipation region 920 and the glass bulb wall to achieve the effect of dissipating heat for the lamp.

[0129] As shown in Figures 13-14 The LED light body 930 is a positive LED light chip. In practice, a plurality of positive LED light chips can be arranged in the light source region 910 at the same time.

[0130] In specific implementation, a reinforcing platform 911 can be arranged below the light source region 910.

[0131] As shown in Figures 15-16 The LED light body 930 is an LED light bar, and the light source region 910 is a through slot.

[0132] The LED light bar is connected to the substrate, and the LED light source on the LED light bar is in the through slot.

[0133] At this moment, the substrate as a whole can be designed as a uniform temperature plate, such as a thick copper plate, or a plate body provided with a uniform temperature material layer.

[0134] Figures 13-16 The other structures of the substrate in the embodiment shown are the same as those in Figures 1-12 and will not be repeated here.

[0135] In addition, it is worth emphasizing that the direct replacement of the traditional high-pressure sodium lamp, gold halide lamp light source with an LED standard light source has always been the goal pursued by LED researchers. Due to the large power and heat, the volume is limited, and the heat dissipation surface is not enough, it has always been unable to achieve. Especially for street lamps, since the lamp shell of the traditional high-pressure sodium lamp, ceramic gold halide lamp light source has been integrated into the city's road landscape, and the entire lamp head must be replaced to replace the traditional LED street lamp. First, the replacement cost is high, and second, due to the influence of heat dissipation design, the appearance cannot be designed at will.

[0136] Now the general practice is to set the filament lamp bar in the center of the glass and then transmit to the glass by helium, because the conduction coefficient of helium is extremely low (0.2W / c.m), so that the temperature difference between the chip and the glass is large (about 40 degrees), when the temperature of the glass is 60 degrees, the temperature of the chip has reached or exceeded 100 degrees, in order to reduce the temperature difference, the design idea of the application can make the substrate of the light source as close as possible to the glass wall, preferably filled with high thermal conductivity medium, and directly transmit heat to the glass. Glass is a high radiation material with a radiation coefficient of 0.94. According to the radiation law of Boltzmann, the radiation intensity is proportional to the 4th power of the blackbody temperature. In the case of closely contacting the glass, the temperature of the glass is also close to 100 degrees, and the heat radiation is increased by nearly 1 times, that is, the power can be increased by nearly 1 times under the condition of the same chip temperature. The specific design idea is as follows.

[0137] As shown in Figure 17 , the substrate in Figures 13-16 is made into Figure 17 the street lamp bulb as shown, and the whole bulb can be circular, oval, flat plate and other shapes.

[0138] The outer surface of the glass bulb wall 600 can be roughened, and the heat conduction and heat dissipation area 920 is attached to the inner surface 610 of the glass bulb wall 600.

[0139] The surface of the light source area 910 can be provided with a light reflecting layer to reflect the light of the LED light emitting body 930.

[0140] In addition, the back of the light source area 910 can be provided with a near-infrared radiation layer 13.

[0141] The back of the heat conduction and heat dissipation area 920 can be provided with an infrared absorption layer 21.

[0142] The near-infrared radiation layer 13 can be cooled in the manner described above.

[0143] In practice, part of the heat radiated by the radiation layer 13 is reflected, part is absorbed by the absorption coating on the top and dissipated, and another part of the heat is conducted to the glass bulb wall through the filled helium and dissipated.

Claims

1. A substrate having electrically and thermally conductive heat dissipation effect, characterized by: The application relates to a light-emitting diode (LED) lamp, which comprises light source fixing parts and heat-conducting and heat-dissipating parts, the light source fixing parts and the heat-conducting and heat-dissipating parts are connected together to form a substrate, the light source fixing parts are provided with LED light sources, the substrate is arranged in a bulb of a lamp, the heat-conducting and heat-dissipating parts are attached to the inner surface of the glass bulb wall, the LED light sources are electrified to emit light, the light is radiated out through the glass bulb wall, the heat generated by the operation of the substrate is mainly dissipated through the heat-conducting and heat-dissipating parts and the glass bulb wall, the light source fixing parts have fixed top surfaces, the LED light sources are arranged on the fixed top surfaces, the fixed top surfaces are light-reflecting surfaces, part of the light emitted by the LED light sources is directly radiated out through the glass bulb wall, and part of the light is reflected by the inner surface of the glass bulb wall and then reflected by the light-reflecting surfaces and radiated out through the glass bulb wall, the heat-conducting and heat-dissipating parts have contact top surfaces, a plurality of contact ribs are arranged on the contact top surfaces, and the plurality of contact ribs are in contact with the inner surface of the glass bulb wall, a near-infrared radiation layer is arranged on the contact top surfaces, and the top portions of the contact ribs are not provided with the near-infrared radiation layer, a radiation reflection layer is arranged on the bottom surface of the substrate, part of the heat radiation generated by the substrate is directly radiated out through the glass bulb wall, and another part of the heat radiation is reflected by the radiation reflection layer and then radiated out through the glass bulb wall, a plurality of the substrates are connected into an integral substrate through insulating connecting bodies, the integral substrate is arranged in the bulb of the lamp, and the heat-conducting and heat-dissipating parts of each of the substrates constituting the integral substrate are attached to the inner surface of the glass bulb wall, the insulating connecting bodies comprise front fixed films and back fixed films, wherein the front fixed films are attached to the front surface of the integral substrate, and the back fixed films are attached to the back surface of the integral substrate, light source windows and infrared radiation windows are formed in the front fixed films, and reflection windows are formed in the back fixed films, the fixed top surfaces of the light source fixing parts and the LED light sources are located in the light source windows, the contact top surfaces of the heat-conducting and heat-dissipating parts are located in the infrared radiation windows, and the radiation reflection layer on the bottom surface of the substrate is located in the reflection windows.

2. The substrate with electrically and thermally conductive and heat dissipating effect according to claim 1, characterized in that: The front fixed films are white fixed films.

3. The substrate with electrically and thermally conductive and heat dissipating effect according to claim 1, characterized in that: The bulb of the lamp is filled with heat-dissipating gas.

4. The substrate with electrically and thermally conductive and heat dissipating effect according to claim 1, characterized in that: The substrates are all provided with elastic pressing parts, when the substrates are bent, the elastic pressing parts can exert elastic forces on the substrates, so that the heat-conducting and heat-dissipating parts of the substrates are tightly attached to the inner surface of the glass bulb wall.

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