A power device connection structure
By using heat dissipation connecting members and control connecting members of thermally conductive metal and elastic metal copper sheets in the power device connection structure, the problem of insufficient heat dissipation and stress absorption capabilities of power devices in the prior art is solved, and more efficient heat dissipation and stress management are achieved , extends the service life of the device.
Patent Information
- Application Number
- CN201910656137.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2019-07-19
- Publication Date
- 2024-12-06
- Estimated Expiration
- 2039-07-19
AI Technical Summary
The existing power device assembly methods cannot effectively dissipate heat and absorb mechanical stress caused by temperature changes, resulting in material fatigue and device failure.
The first heat dissipation connection member including a metal material with good thermal conductivity and conductivity and the second heat dissipation connection member with good elastic metal copper material is adopted. The electrical connection is carried out through the PCB board and raised. Power devices enhance heat dissipation and connect control pins through a well-elastic metal copper sheet and metal connector to absorb mechanical stress and temperature shocks.
Improves the heat dissipation performance of power devices, reduces stress caused by temperature changes, extends the service life of the device and ensures the stability of the control pins.
Smart Images
Figure CN112242372B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the field of circuit component connection, and in particular to a power device connection structure. Background Art
[0002] With the continuous advancement of technology, the power of power devices is getting higher and higher, and the heat dissipation is also getting larger and larger. How to efficiently dissipate heat for power devices has become the primary problem of practical high-power power devices. In the ordinary power device assembly method, each pin of the device is connected to the pad of the PCB board, and the pin only dissipates heat through the pad and PCB. Due to the large thermal resistance of the PCB material itself and the limited heat dissipation capacity of the pad copper foil, the ordinary power device assembly method cannot ensure that the power device is well cooled to the greatest extent and exerts the best performance.
[0003] At the same time, in the traditional power device assembly method, the connections between various parts are fixed, the deformation capacity is limited, and the stress caused by the deformation of various parts due to temperature changes cannot be effectively absorbed. After long-term exposure to mechanical stress and temperature shock, it may cause material fatigue and then lead to device failure. Summary of the invention
[0004] In view of the deficiencies of the prior art, the present invention provides a power device connecting component, which can improve the heat dissipation capacity of the power device on the one hand, and reduce the influence of the stress caused by deformation due to temperature change on the power device and the PCB circuit board on the other hand.
[0005] The present invention provides a power device connection structure, comprising a PCB board, a power device, a heat dissipation connection component and a control connection component, wherein the power device comprises a current input pin, a current output pin and a control pin, the heat dissipation connection component comprises a first heat dissipation connection component and a second heat dissipation connection component, and the power device is fixed on the PCB board through the heat dissipation connection component and the control connection component.
[0006] As a further improvement of the present invention, one end of the first heat dissipation connection member is electrically connected to the current input pin, and the other end passes through the PCB board and is electrically connected to the external current input port.
[0007] As a further improvement of the present invention, one end of the first heat dissipation connection member electrically connected to the current input pin slightly raises the power device.
[0008] As a further improvement of the present invention, one end of the second heat dissipation connection member is electrically connected to the current output pin, and the other end is electrically connected to the PCB board.
[0009] As a further improvement of the present invention, the second heat dissipation connection member has a certain height, which is the same as the height of the first heat dissipation connection member raising the power device.
[0010] As a further improvement of the present invention, one end of the control connection member is electrically connected to the control pin of the power device, and the other end is electrically connected to the PCB board.
[0011] As a further improvement of the present invention, the control connection component may be an FPC or a metal connector. If the control connection component is a metal connector, the height of the metal connector needs to be the same as the height of the power device raised by the first heat dissipation connection component.
[0012] As a further improvement of the present invention, the first heat dissipation connection component is made of a material with good thermal and electrical conductivity, such as a metal material.
[0013] As a further improvement of the present invention, the second heat dissipation connection member is made of a conductive material with good elasticity, such as metal copper.
[0014] A power device connection structure provided by the present invention connects the current input pin and the external current input terminal of the power device through a first heat dissipation connection component, and penetrates the PCB board, so as to directly conduct the heat generated by the power device to the outside of the PCB board (such as: a heat sink, a liquid cooling plate), thereby reducing the temperature rise of the power device when current passes through the power device, thereby improving the actual power of the power device; the current output pin is electrically connected to the PCB board through a second heat dissipation connection component, and because the working connection component has good elasticity and conductivity, it can further absorb mechanical stress and temperature shock while ensuring that the working pin is connected to the system circuit, thereby further reducing the failure risk of the power device; the control connection component can effectively compensate for the height difference between the control pin of the power device and the PCB circuit board, thereby ensuring effective control of the power device. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 The figure is a schematic diagram of a power device connection structure.
[0016] Figure 2 The figure is a side view of a power device connection structure.
[0017] Among them, 1 is a PCB circuit board, 2 is a power device, 3 is a first heat dissipation connection component, 4 is a second heat dissipation connection component, 41 is a first connection port, 42 is a second connection port, and 5 is a control connection component. DETAILED DESCRIPTION
[0018] The present invention will be described in further detail below with reference to the accompanying drawings.
[0019] It should be understood that if there are terms such as "upper", "lower", "left", "right", etc. that describe directions or positional relationships, they are for the convenience of describing the drawings and do not mean that certain components or structures must be installed or arranged in a specific direction or position. In the following description, unless otherwise clearly defined, the terms "installation" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection, and it can be a direct connection or an indirect connection.
[0020] As a specific embodiment of the present invention, Figure 1 , Figure 2 As shown, it includes a PCB board 1, a power device 2, a first heat dissipation connection member 3, a second heat dissipation connection member 4 and a control connection member 5. One end of the first heat dissipation connection member 3 is electrically connected to the current input end of the power device 2, and the other end is connected to the external current input port, and runs through the PCB board 1. The entire first heat dissipation connection member 3 is made of metal copper. Copper has high thermal conductivity and good heat dissipation effect. The first heat dissipation connection member 3 runs through the PCB board 1, thereby enhancing the heat dissipation effect of the first heat dissipation connection member 3 on the power device 2. At the same time, the first heat dissipation connection member 3 slightly raises the power device 2, so that the bottom part of the power device 2 that is not in contact with the first heat dissipation connection member 3 is in direct contact with the air, further improving the heat dissipation performance of the entire power device.
[0021] In this embodiment, if Figure 1 As shown, the first heat dissipation connection component penetrates the PCB board 1 and the part protruding from the PCB board 1 is in the form of a rectangular thin sheet. This structure can further increase the contact area between the first heat dissipation connection component 3 and the external heat dissipation system, such as a liquid cooling plate, a heat sink, etc., and improve the heat dissipation efficiency of the first heat dissipation connection component 3.
[0022] One end of the working connecting component is connected to the working pin of the power device 2, and the other end is electrically connected to the PCB board 1, ensuring that the power device 2 and the PCB board 1 form a closed loop. Since the first heat dissipation connecting component 3 raises the power device 2, there is a certain height difference between the working pin and the PCB board 1, so the working connecting component needs to make up for this height difference and electrically connect the working pin and the PCB board 1. At the same time, since a large amount of heat will be generated during the operation of the power device 2, the heat dissipation connecting component will be deformed, thereby changing the height difference between the working pin and the PCB board 1, so the working connecting component needs to be able to adapt to this deformation and the stress caused by this deformation.
[0023] In this embodiment, if Figure 2As shown, the entire working connection component is made of metal copper into a stepped copper sheet, and the copper sheet includes a first connection port 41 and a second connection port 42. The first connection port 41 is connected to the current output pin of the power device, and the second connection port 42 is electrically connected to the PCB board. Copper has good electrical conductivity and can ensure the electrical connection between the current output pin and the PCB board 1. The stepped copper sheet makes up for the height difference between the power device 2 and the PCB board 1. At the same time, the copper sheet itself has a small thickness and good elasticity, and can adapt to the deformation of the first heat dissipation connection component 3 caused by temperature changes.
[0024] One end of the control connection member 5 is connected to the control pin of the power device 2, and the other end is connected to the circuit on the PCB board 1. The control pin of the power device 2 can be connected to the PCB board by means of an FPC or a metal connector. While ensuring the stability and reliability of the control, it can also avoid mechanical stress and temperature shock from causing a circuit breaker on the control pin or the PCB copper foil wiring.
[0025] In this embodiment, if Figure 2 As shown, the control connection component 5 is a "C"-shaped metal connector, one end of the metal connector is electrically connected to the control pin of the power device 2, and the other end is electrically connected to the PCB board 1. The height of the metal connector is the same as the height of the power device 2 raised by the first heat dissipation connection component.
[0026] It should be understood that the above embodiments are only for the convenience of those skilled in the art to understand the technical solutions provided by the present invention, and do not mean that the present invention has only the above embodiments. All technical solutions with the same principle as the present invention are within the protection scope of the present invention.
Claims
1. A power device connection structure, characterized in that: It includes a PCB board, a power device, a heat dissipation connection component and a control connection component, wherein the power device includes a current input pin, a current output pin and a control pin, and the heat dissipation connection component includes a first heat dissipation connection component and a second heat dissipation connection component, and the power device is fixed on the PCB board through the heat dissipation connection component and the control connection component; One end of the first heat dissipation connection component is electrically connected to the current input pin, and the other end passes through the PCB board and is electrically connected to the external current input port; the end of the first heat dissipation connection component electrically connected to the current input pin raises the power device; the second heat dissipation connection component is made of elastic conductive material in a stepped shape, one end of the second heat dissipation connection component is electrically connected to the current output pin, and the other end is electrically connected to the PCB board, and the control connection component is electrically connected to the control pin.
2. A power device connection structure according to claim 1, characterized in that: The second heat dissipation connection member has a certain height, which is the same as the height of the first heat dissipation connection member raising the power device.
3. A power device connection structure according to claim 1, characterized in that: One end of the control connection component is electrically connected to the control pin of the power device, and the other end is electrically connected to the PCB board.
4. A power device connection structure according to claim 3, characterized in that: The control connection component is an FPC or a metal connector. If the control connection component is a metal connector, the height of the metal connector needs to be the same as the height of the power device raised by the first heat dissipation connection component.
5. A power device connection structure according to claim 1, characterized in that: The first heat dissipation connection component is made of a thermally conductive and electrically conductive material.
6. A power device connection structure according to claim 1, characterized in that: The second heat dissipation connection member is made of elastic conductive material.