Temperature sensor, temperature sensing system, temperature measurement method and device

Abstract

The present invention discloses a temperature sensor, a temperature sensing system, a temperature measurement method and a device, and relates to the field of Internet of Things technology. The temperature sensor includes: a shell; a metal plate, which is placed in the shell; a temperature sensing element, which is fixed to the inner wall of the bottom of the shell and one end of which is against the metal plate, deforms in response to temperature changes and drives the metal plate to move; an electronic tag, which is fixed in the shell and is located above the metal plate. By using a temperature sensing element that can deform when the temperature changes to press against the metal plate, when the temperature changes, the distance between the metal plate and the electronic tag changes, causing the signal strength emitted by the electronic tag to change. By measuring the signal strength, the temperature can be indirectly derived. Therefore, through the above embodiment, there is no need to develop a dedicated temperature sensing tag, nor is there a need to power the tag, and a low-cost, small-volume temperature sensor can be achieved.

Description

Technical Field

[0001] The present invention relates to Internet of Things technology, and in particular to a temperature sensor, a temperature sensing system, a temperature measurement method and a device. Background Art

[0002] According to relevant data, about 400 million tons of fresh agricultural products enter the circulation field in my country every year. However, according to rough estimates, due to the lack of cold chain, the loss rate of fruits and vegetables in my country during picking, transportation, storage and other links is as high as 25% to 30%. According to this calculation, more than 100 million tons of fruit and vegetable agricultural products rot every year, and the economic loss is more than 100 billion yuan.

[0003] Fruit and vegetable agricultural products have high water content and short shelf life, so they are very easy to rot and deteriorate. There are strict requirements for the ambient temperature of the items when they are stored in warehouses, transported by trucks, and sold in stores. Therefore, among the various elements of the cold chain logistics system, one of the most important nodes is the temperature control in the process and real-time temperature monitoring. Establishing and improving the cold chain logistics temperature control management system is one of the top priorities to improve the level of cold chain logistics and ensure food safety.

[0004] In related technologies, temperature management of cold chain logistics mainly focuses on data tracking and recording.

[0005] Temperature indicators are used in the traditional fruit and vegetable supply chain for fresh-keeping transportation. When the ambient temperature exceeds a certain value, the indicator changes color. Although the indicator is low in cost, it requires manual observation with the naked eye, which is a lot of work.

[0006] With the rise of the Internet of Things technology, "smart temperature sensors" that combine radio frequency identification (RFID) and modern sensor technology have emerged. Using RFID tags to monitor and record the temperature of products can avoid the errors and efficiency problems that exist in manual monitoring and recording. In addition, this type of sensor can accurately record data information, time and location, and can be reused.

[0007] In the related art, a dedicated RFID passive chip is generally developed, and a temperature sensor module is loaded on the chip. The temperature sensor integrated in the passive RFID tag chip adopts an analog-to-digital conversion (ADC) structure. Alternatively, an active or semi-active RFID tag is used and a temperature sensing unit is loaded. Summary of the invention

[0008] After analysis, the inventor found that the advantage of developing a dedicated chip is that the temperature detection accuracy is high and it has a wide measurement range. The disadvantage is that the development cost is high and the reliability of the chip needs to be considered. In addition, the power consumption is very large, often reaching several mW or even higher, and the reading distance of the tag is less than 1 meter. Therefore, the structure of the analog-to-digital sensor (ADC) is obviously not suitable for passive RFID tag chips. As for the method of using active / semi-active RFID tags, the cost of the sensor is increased due to the addition of batteries. At the same time, the size is large and the installation is limited.

[0009] A technical problem to be solved by the embodiments of the present invention is: how to provide a low-cost and easy-to-detect temperature sensor.

[0010] According to a first aspect of some embodiments of the present invention, there is provided a temperature sensor, comprising: a shell; a metal plate disposed in the shell; a temperature sensing element fixed to an inner wall at the bottom of the shell and having one end pressed against the metal plate, deforming in response to temperature changes and driving the metal plate to move; and an electronic tag fixed in the shell and located above the metal plate.

[0011] In some embodiments, within a preset temperature range, the temperature sensing element undergoes irreversible expansion as the temperature increases.

[0012] In some embodiments, the temperature sensing element is a thermal shape memory polymer TSMP material.

[0013] In some embodiments, the top of the housing is made of wave-transparent material.

[0014] In some embodiments, the wave-transmitting material is epoxy resin.

[0015] In some embodiments, the electronic tag is attached to the top inner wall of the housing.

[0016] In some embodiments, the distance between the outer edge of the electronic tag and the inner edge of the top of the housing is not less than 0.2 wavelengths, where the wavelength is the wavelength of the transmission signal of the electronic tag reader.

[0017] In some embodiments, the maximum distance between the electronic tag and the metal plate does not exceed 1 / 4 wavelength, where the wavelength is the wavelength of the transmission signal of the electronic tag reader.

[0018] In some embodiments, the electronic tag has one or more characteristics of a narrowband characteristic, a linear polarization characteristic, and a characteristic that the operating frequency band drifts linearly in one direction as the metal plate approaches.

[0019] In some embodiments, the temperature sensor further includes: a limiting device having a locked state and an unlocked state, wherein in the locked state, the limiting device limits the metal plate from moving toward the electronic tag.

[0020] In some embodiments, a side wall of the shell is provided with an insertion hole; and the limiting device is a latch, and in a locked state, the latch passes through the insertion hole and extends into the shell.

[0021] According to a second aspect of some embodiments of the present invention, there is provided a temperature sensing system, comprising: any one of the aforementioned temperature sensors; and a temperature measuring device configured to determine the temperature of an environment in which the temperature sensor is located based on a preset relationship between the signal strength of an electronic tag in the temperature sensor and the temperature.

[0022] In some embodiments, the temperature sensing system further includes: an electronic tag reader / writer configured to obtain the signal strength of a signal returned by the electronic tag by reading the electronic tag in the temperature sensor.

[0023] According to a third aspect of some embodiments of the present invention, there is provided a temperature measurement method, comprising: obtaining the signal strength of a signal of an electronic tag obtained by an electronic tag reader / writer, wherein the electronic tag is an electronic tag in any one of the aforementioned temperature sensors; and determining the temperature of an environment in which the temperature sensor is located based on a preset relationship between the signal strength and the temperature.

[0024] In some embodiments, the temperature of the environment where the temperature sensor is located is negatively correlated with the signal strength.

[0025] According to a fourth aspect of some embodiments of the present invention, there is provided a temperature measurement device, comprising: a memory; and a processor coupled to the memory, wherein the processor is configured to execute any one of the aforementioned temperature measurement methods based on instructions stored in the memory.

[0026] According to a fifth aspect of some embodiments of the present invention, there is provided a computer-readable storage medium having a computer program stored thereon, wherein the program implements any one of the aforementioned temperature measurement methods when executed by a processor.

[0027] Some embodiments of the above invention have the following advantages or beneficial effects: by using a temperature sensing element that can be deformed when the temperature changes to press against the metal plate, when the temperature changes, the distance between the metal plate and the electronic tag changes, causing the signal strength emitted by the electronic tag to change. By measuring the signal strength, the temperature can be indirectly derived. Therefore, through the above embodiments, there is no need to develop a dedicated temperature sensing tag or to power the tag, and a low-cost, small-volume temperature sensor can be realized.

[0028] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0030] Figure 1 A schematic diagram of the working environment of an RFID tag is shown.

[0031] Figure 2 A schematic structural diagram of a temperature sensor according to some embodiments of the present invention is shown.

[0032] Figure 3 The schematic diagrams of the structures of temperature sensors according to other embodiments of the present invention are shown.

[0033] Figure 4 The schematic diagrams of the structures of temperature sensors according to some further embodiments of the present invention are shown.

[0034] Figure 5 A schematic structural diagram of a temperature sensing system according to some embodiments of the present invention is shown.

[0035] Figure 6 A schematic flow chart of a temperature measurement method according to some embodiments of the present invention is shown.

[0036] Figure 7 A schematic structural diagram of a temperature measuring device according to some embodiments of the present invention is shown.

[0037] Figure 8 The schematic diagrams of the structures of temperature measuring devices according to other embodiments of the present invention are shown. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] The relative arrangement of components and steps, the numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0040] At the same time, it should be understood that for the convenience of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship.

[0041] Technologies, methods, and apparatus known to ordinary technicians in the relevant field may not be discussed in detail, but where appropriate, such technologies, methods, and apparatus should be considered part of the authorization specification.

[0042] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0043] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0044] After analysis, the inventors found that metal objects have an impact on the antenna parameters and performance of the electronic tag, including an impact on the antenna field and an impact on the antenna parameters.

[0045] Figure 1 Figure 1 shows a schematic diagram of the working environment of an RFID tag. Figure 1 As shown, the field in which the antenna in the RFID tag 12 works includes an incident wave 110 emitted by the reader 11, an antenna reflected wave 120, and a reflected wave 130 reflected by the metal plate 13. There is a certain phase difference between the incident wave 110 and the reflected wave 130, which causes the two to cancel each other out to a certain extent, thereby weakening the field strength. Within a certain wavelength range, as the distance between the metal plate 13 and the RFID tag 12 decreases, the current induced by the antenna of the RFID tag 12 working in this environment gradually decays monotonically. Since this current is used to provide energy for the chip of the RFID tag 12, when the distance is 0, the chip of the RFID tag 12 cannot be activated, resulting in the RFID tag 12 being unable to work.

[0046] For the reader / writer 11, as the distance between the metal plate 13 and the RFID tag 12 is shortened within a certain range, the RSSI (Received Signal Strength Indication) of the tag return energy value received by the reader / writer at the same reading and writing distance decreases monotonically.

[0047] Therefore, the inventors realized that the RSSI value received from the reader can indirectly detect the temperature of the crop storage and transportation environment. The inventors proposed a temperature sensor that reflects the ambient temperature based on the distance between the metal plate and the electronic tag. Figure 2 Embodiments of the temperature sensor of the present invention are described.

[0048] Figure 2 FIG. 2 shows a schematic diagram of the structure of a temperature sensor according to some embodiments of the present invention. Figure 2 As shown, the temperature sensor 20 of this embodiment includes a housing 210 , a metal plate 220 , a temperature sensing element 230 and an electronic tag 240 .

[0049] In some embodiments, the bottom of the housing 210 is made of metal, which has better thermal conductivity, so that the internal temperature sensing element 230 can sense temperature changes more accurately.

[0050] In some embodiments, the housing 210 is made of a material with rigid properties, so it is not easily deformed, and the destructiveness of the external environment to the interior of the sensor can be avoided as much as possible.

[0051] The metal plate 220 is placed in the housing. In some embodiments, the metal plate 220 is a copper plate or an aluminum plate.

[0052] In some embodiments, the size difference between the metal plate 220 and the bottom surface of the housing 210 is within a preset range, and a gap is formed between the edge of the metal plate 220 and the inside of the side wall of the housing 210 so that the metal plate 220 can move smoothly.

[0053] The temperature sensing element 230 is fixed to the inner wall of the bottom of the housing, and one end of the temperature sensing element 230 is against the metal plate 220 . The temperature sensing element 230 is deformed in response to temperature changes, and drives the metal plate to move.

[0054] In some embodiments, the lower surface of the metal plate 220 is fixed to the upper surface of the temperature sensing member 230 .

[0055] In some embodiments, within a preset temperature range, the temperature sensing element undergoes irreversible expansion as the temperature rises. In this case, the temperature sensor 10 can reflect the maximum value of the measured ambient temperature during the test period. Thus, during the transportation of temperature-sensitive products such as agricultural products, cold chain foods, blood, and vaccines, the temperature sensor of this embodiment can be used to determine whether the measured environment has ever exceeded the allowable temperature, thereby being able to more accurately grasp the temperature conditions of these products during transportation.

[0056] In some embodiments, the temperature sensing element is a TSMP (Temperature Shape Memory Polymer) material, such as polynorbornene, trans-polyisoprene and polyurethane. Shape memory refers to the phenomenon that a product with an initial shape can be restored to its initial shape after being deformed and fixed by external conditions such as heating. Due to the properties of TSMP materials, TSMP materials expand monotonically with the increase of temperature, and drive the top metal plate to rise monotonically, pulling the distance with the electronic tag closer.

[0057] TSMP materials can restore their original shape within a preset temperature range, so the temperature sensor can be used multiple times.

[0058] In some embodiments, the TSMP material properties are designed according to the temperature requirement Tg and the maximum allowable temperature limit Th of the product storage and transportation environment. Then, the increase in the height of the TSMP material during the temperature change from Tg to Th is obtained, and the cavity height of the housing 210 is designed according to the increase.

[0059] The electronic tag 240 is fixed in the housing 210 and is located above the metal plate 220 .

[0060] In some embodiments, the electronic tag 240 is a passive electronic tag.

[0061] In some embodiments, the maximum distance between the electronic tag 240 and the metal plate 220 does not exceed 1 / 4 wavelength, which is the wavelength of the emission signal of the electronic tag reader. For example, the initial distance between the electronic tag 240 and the metal plate 220 can be less than 1 / 4 wavelength. After testing, the inventor found that within the distance range of 0 to 1 / 4 wavelength, the signal strength of the signal returned by the electronic tag decreases monotonically as the distance between the electronic tag and the metal plate is shortened, that is, there is a one-to-one correspondence between the signal strength and the temperature. Therefore, within the distance range of 1 / 4 wavelength, a more accurate temperature detection result can be obtained.

[0062] In some embodiments, the electronic tag has one or more characteristics of a narrowband characteristic, a linear polarization characteristic, and a characteristic that the operating frequency band drifts linearly in one direction as the metal plate approaches.

[0063] The narrowband characteristic means that the closer the distance between the metal plate and the electronic tag is, the greater the frequency deviation will be. For example, a -10dB bandwidth can be used, and the national standard range is [920,925]MH. As the temperature rises, the distance between the metal plate and the tag is shortened, and the operating frequency of the tag changes monotonically. Once the frequency band is narrow, it can more sensitively reflect temperature changes.

[0064] Compared with circularly polarized electronic tags, linearly polarized electronic tags are more sensitive to changes in the distance between the metal plate and the electronic tag, and can thus more accurately reflect temperature changes.

[0065] The operating frequency band drifts linearly in one direction as the metal plate approaches, so that there is a one-to-one correspondence between signal strength and temperature. Therefore, more accurate temperature detection results can be obtained.

[0066] In some embodiments, the maximum size of the tag shape is controlled within the size of a single tag, for example, within 5 cm*5 cm. Generally, a single tag is more sensitive to temperature changes, and mutual coupling between tags can be ignored.

[0067] When in use, the temperature sensor can be placed in the measured environment. For products such as agricultural products that have a high surface temperature, the bottom surface of the temperature sensor can also be attached to the surface of the product to more accurately measure the product temperature.

[0068] By using a temperature sensing element that can deform when the temperature changes to press against the metal plate, when the temperature changes, the distance between the metal plate and the electronic tag changes, causing the signal strength emitted by the electronic tag to change. By measuring the signal strength, the temperature can be indirectly derived. Therefore, through the above embodiment, there is no need to develop a dedicated temperature sensing tag or power the tag, and a low-cost, small-volume temperature sensor can be realized.

[0069] Furthermore, when the temperature sensing element is made of TSMP material, the temperature sensor can record the maximum temperature monitored within a period of time, which is beneficial for monitoring products with higher storage temperature requirements.

[0070] Figure 3 FIG. 2 shows a schematic diagram of the structure of a temperature sensor according to some other embodiments of the present invention. Figure 3 As shown, the temperature sensor 30 of this embodiment includes a housing 310, a metal plate 320, a temperature sensing element 330 and an electronic tag 340. The specific implementations of these components can refer to the aforementioned embodiments and will not be repeated here.

[0071] In some embodiments, the top 3100 of the housing 310 is made of a wave-transmitting material, so that when a tag reader is used to read a tag, the tag can be read from the top of the housing 310 , which reduces the reflectivity and improves the transmission rate.

[0072] In some embodiments, the dielectric constant ε of the wave-transmitting material used in the top 3100 is as low as possible, for example, it can be set to be lower than a preset dielectric constant threshold. The dielectric constant of a vacuum is 1. In order to reduce the interference of the external environment on the return signal of the electronic tag, the ideal situation should be a vacuum environment. Therefore, the closer the dielectric constant is to 1, the more accurate the measurement result.

[0073] In some embodiments, the loss tangent tanδ of the wave-transmitting material used in the top 3100 is as low as close to zero, for example, it can be set to be lower than a preset loss tangent threshold to achieve the purpose of minimum reflection and maximum transmission. Tanδ refers to the energy consumed by the dielectric to convert electrical energy into thermal energy (in the form of heat) per unit volume per unit time. The larger the tanδ, the better the wave-absorbing performance of the material. When preparing a composite wave-absorbing material, the equivalent electromagnetic loss angle factor of the material can be improved by adjusting the electromagnetic parameters of the composite system.

[0074] In some embodiments, the ε and tanδ of the wave-transmitting material used in the top 3100 do not change significantly with temperature and frequency, for example, under the condition of a temperature rise of 100° C., the ε changes by less than 1%. Thus, under the condition of aerodynamic heating, electromagnetic waves can be transmitted as undistorted as possible.

[0075] In some embodiments, the wave-transmitting material is epoxy resin. An exemplary parameter of the epoxy resin is as follows:

[0076] Density: 1.30g / cm 3 , flexural strength: 97Mpa, flexural modulus: 3.8, dielectric constant: 3.0 (at a test frequency of 10GHz), tangent loss: 0.020 (at a test frequency of 10GHz).

[0077] In some embodiments, the electronic tag 340 is attached to the inner wall of the top 3100 of the housing.

[0078] In some embodiments, the distance between the outer edge of the electronic tag 340 and the inner edge of the top 3100 of the housing is not less than 0.2 wavelengths, where the wavelength is the wavelength of the signal transmitted by the electronic tag reader. When the distance is not less than 0.2 wavelengths, the interference of the surrounding environment on the electromagnetic signal can be reduced to a greater extent.

[0079] In some embodiments, the temperature sensor further includes a limiting device having a locked state and an unlocked state, wherein in the locked state, the limiting device limits the metal plate from moving toward the electronic tag, and in the unlocked state, the metal plate can move with the deformation of the temperature sensing element. Figure 4 An implementation of the limiting device is shown by way of example.

[0080] Figure 4 FIG. 2 shows a schematic diagram of the structure of a temperature sensor according to some other embodiments of the present invention. Figure 4 As shown, the temperature sensor 40 of this embodiment includes a housing 410, a metal plate 420, a temperature sensing element 430 and an electronic tag 440. The specific implementations of these components can refer to the aforementioned embodiments and will not be repeated here.

[0081] In some embodiments, the limiting device is a latch 450. A plug hole is provided on the side wall of the housing 410. In the locked state, the latch 450 passes through the plug hole and extends into the housing 410. In addition, the portion of the latch 450 extending into the housing intersects with the moving path of the metal plate 420 to block the movement of the metal plate 420.

[0082] In some embodiments, the latch 450 is placed in an unlocked state by moving the latch 450 so that the portion of the latch 450 extending into the housing does not intersect with the moving path of the metal plate 420 .

[0083] Those skilled in the art may also implement the limiting device in other ways, which will not be described in detail here.

[0084] Reference below Figure 5 An embodiment of the temperature sensing system of the present invention is described.

[0085] Figure 5 FIG. 2 shows a schematic diagram of a temperature sensing system according to some embodiments of the present invention. Figure 5 As shown, the temperature sensing system 5 of this embodiment includes a temperature sensor 51 and a temperature measuring device 52. The specific implementation of the temperature sensor 51 refers to the above-mentioned embodiment and is not repeated here. The temperature measuring device 52 is configured to determine the temperature of the environment where the temperature sensor is located according to the preset relationship between the signal strength of the electronic tag in the temperature sensor and the temperature.

[0086] In some embodiments, the temperature of the environment where the temperature sensor is located is negatively correlated with the signal strength, that is, as the temperature increases, the signal strength decreases monotonically.

[0087] In some embodiments, the preset relationship can be determined by a pre-test. For example, the ambient temperature is preset, a temperature sensor is placed therein, and the signal strength of the signal emitted by the electronic tag at the temperature is tested. By recording these data, the data can be fitted to generate a functional relationship between the signal strength and the temperature.

[0088] In some embodiments, the temperature sensing system 5 further includes an electronic tag reader / writer 53 configured to obtain the signal strength of a signal returned by the electronic tag by reading the electronic tag in the temperature sensor 51 .

[0089] Reference below Figure 6 An embodiment of the temperature measuring method of the present invention is described.

[0090] Figure 6 FIG. 2 is a flow chart showing a temperature measurement method according to some embodiments of the present invention. Figure 6 As shown, the temperature measurement method of this embodiment includes steps S602 to S604.

[0091] In step S602, the signal strength of the signal of the electronic tag obtained by the electronic tag reader is obtained, wherein the electronic tag is the electronic tag in the temperature sensor in the above-mentioned embodiments.

[0092] In some embodiments, the signal strength is a RSSI value.

[0093] In step S604, the temperature of the environment where the temperature sensor is located is determined according to a preset relationship between signal strength and temperature.

[0094] In some embodiments, the temperature of the environment where the temperature sensor is located is negatively correlated with the signal strength.

[0095] The method of this embodiment can indirectly deduce the temperature by measuring the signal strength, thereby making it possible to perform temperature measurement efficiently and conveniently.

[0096] Figure 7 FIG. 2 shows a schematic diagram of a temperature measurement device according to some embodiments of the present invention. Figure 7 As shown, the temperature measurement device 70 of this embodiment includes: a memory 710 and a processor 720 coupled to the memory 710 , and the processor 720 is configured to execute the temperature measurement method in any one of the aforementioned embodiments based on instructions stored in the memory 710 .

[0097] The memory 710 may include, for example, a system memory, a fixed non-volatile storage medium, etc. The system memory may store, for example, an operating system, an application program, a boot loader, and other programs.

[0098] Figure 8 FIG. 2 shows a schematic diagram of a temperature measurement device according to some other embodiments of the present invention. Figure 8 As shown, the temperature measuring device 80 of this embodiment includes: a memory 810 and a processor 820, and may also include an input / output interface 830, a network interface 840, a storage interface 850, etc. These interfaces 830, 840, 850 and the memory 810 and the processor 820 may be connected, for example, via a bus 860. Among them, the input / output interface 830 provides a connection interface for input / output devices such as a display, a mouse, a keyboard, and a touch screen. The network interface 840 provides a connection interface for various networked devices. The storage interface 850 provides a connection interface for external storage devices such as SD cards and USB flash drives.

[0099] An embodiment of the present invention further provides a computer-readable storage medium having a computer program stored thereon, wherein the program implements any one of the aforementioned temperature measurement methods when executed by a processor.

[0100] Those skilled in the art will appreciate that embodiments of the present invention may be provided as methods, systems, or computer program products. Therefore, the present invention may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, the present invention may take the form of a computer program product implemented on one or more computer-usable non-transient storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0101] The present invention is described with reference to flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0102] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0103] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0104] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A temperature sensor, comprising: case; A metal plate, disposed in the housing; A temperature sensing element, fixed to the inner wall of the bottom of the shell, with one end against the metal plate, deformed in response to temperature changes, and driving the metal plate to move; The electronic tag is fixed in the housing and is located above the metal plate.

2. The temperature sensor according to claim 1, wherein: Within a preset temperature range, the temperature sensing element undergoes irreversible expansion as the temperature rises.

3. The temperature sensor according to claim 2, wherein: The temperature sensing element is made of a thermal shape memory polymer TSMP material.

4. The temperature sensor according to claim 1, wherein: The top of the shell is made of wave-transmitting material.

5. The temperature sensor according to claim 4, wherein: The wave-transmitting material is epoxy resin.

6. The temperature sensor according to claim 4, wherein: The electronic tag is attached to the top inner wall of the shell.

7. The temperature sensor according to claim 5, wherein: The distance between the outer edge of the electronic tag and the inner edge of the top of the shell is not less than 0.2 wavelengths, and the wavelength is the wavelength of the transmission signal of the electronic tag reader.

8. The temperature sensor according to claim 1, wherein: The maximum distance between the electronic tag and the metal plate does not exceed 1 / 4 wavelength, where the wavelength is the wavelength of the transmission signal of the electronic tag reader.

9. The temperature sensor according to claim 1, wherein: The electronic tag has one or more characteristics of a narrowband characteristic, a linear polarization characteristic, and a characteristic that the working frequency band drifts linearly in one direction as the metal plate approaches.

10. The temperature sensor according to claim 1, further comprising: The limiting device has a locked state and an unlocked state, wherein in the locked state, the limiting device limits the movement of the metal plate toward the electronic tag.

11. The temperature sensor according to claim 10, wherein: The side wall of the housing is provided with an insertion hole; and, The limiting device is a latch pin, and in a locked state, the latch pin passes through the insertion hole and extends into the housing.

12. A temperature sensing system comprising: The temperature sensor according to any one of claims 1 to 11; The temperature measuring device is configured to determine the temperature of the environment where the temperature sensor is located according to a preset relationship between the signal strength of the electronic tag in the temperature sensor and the temperature.

13. The temperature sensing system according to claim 12, further comprising: The electronic tag reader is configured to obtain the signal strength of the signal returned by the electronic tag by reading the electronic tag in the temperature sensor.

14. A temperature measurement method, comprising: Acquiring a signal strength of a signal of an electronic tag obtained by an electronic tag reader / writer, wherein the electronic tag is an electronic tag in a temperature sensor according to any one of claims 1 to 11; The temperature of the environment where the temperature sensor is located is determined according to a preset relationship between the signal strength and the temperature.

15. The temperature measurement method according to claim 14, wherein: The temperature of the environment where the temperature sensor is located is negatively correlated with the signal strength.

16. A temperature measuring device, comprising: Memory; as well as A processor coupled to the memory, wherein the processor is configured to execute the temperature measurement method according to claim 14 or 15 based on instructions stored in the memory.

17. A computer-readable storage medium having a computer program stored thereon, wherein when the program is executed by a processor, the temperature measurement method according to claim 14 or 15 is implemented.

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