Laser cleaning device and cleaning method

Abstract

The present invention relates to the field of laser processing technology, and discloses a laser cleaning device and a cleaning method, wherein the device comprises: a first laser source for emitting an ultrafast pulse laser beam and a second laser source for emitting a continuous laser beam, the first laser source and the second laser source are connected to a laser compound head, and a first output optical path of the first laser source and a second output optical path of the second laser source are integrated inside the laser compound head. The present invention provides a laser cleaning device and a cleaning method, which proposes to combine a continuous laser beam and an ultrafast pulse laser beam for cleaning, and adopts a laser power outputted by a dual beam that is several times the power of a single laser beam, which is conducive to ensuring that the laser meets the requirements of processing efficiency under the premise of stable operation; compared with a single ultrafast laser cleaning technology, the cleaning efficiency is improved, the texture caused by a small laser spot is solved, the processing quality is stable and reliable, and the structure is simple, the stability is good, the cost is low, and the practicability is strong.

Description

Technical Field

[0001] The present invention relates to the field of laser processing technology, and in particular to a laser cleaning device and a cleaning method. Background Art

[0002] There are various cleaning methods in the traditional cleaning industry, most of which are chemical reagents and mechanical methods. However, chemical reagent cleaning is easy to cause environmental pollution, and mechanical cleaning is easy to cause wear on the surface of objects.

[0003] Ultrafast laser micromachining technology has emerged in recent years. It uses ultra-high power density and ultra-short pulse width characteristics to achieve a completely different "cold" processing effect on metal materials, that is, there is almost no heat-affected zone, and the processing accuracy is very high, which is more suitable for cleaning composite coatings. However, ultrafast laser micromachining technology is inherently low in processing efficiency. It is difficult to increase the speed due to the small spot size; if the removal speed is increased, it is easy to cause the spot to overlap and there will be residual texture. At the same time, its "micromachining" characteristics are obviously not suitable for the removal of coating widths of general parts, and the cost performance is too low. Therefore, it is necessary to study a more practical processing technology to improve the cleaning efficiency without affecting the quality of coating removal. Summary of the invention

[0004] The invention provides a laser cleaning device and a cleaning method, which are used to solve or partially solve the problems of low processing efficiency and high cost in the existing ultrafast laser micro-processing technology.

[0005] The present invention provides a laser cleaning device, comprising: a first laser source for emitting an ultrafast pulse laser beam and a second laser source for emitting a continuous laser beam, wherein the first laser source and the second laser source are connected to a laser compound head, and a first output optical path of the first laser source and a second output optical path of the second laser source are integrated inside the laser compound head.

[0006] Based on the above solution, the first laser source is connected to the laser compound head through a light guide arm structure.

[0007] On the basis of the above solution, the second laser source is connected to the laser compound head via an optical fiber, and the laser compound head is provided with a corresponding connector.

[0008] Based on the above scheme, a beam combining mirror is further provided inside the laser compound head, and the beam combining mirror is located in the transmission direction of the first output optical path and the second output optical path at the same time. An output port is provided on the end face of the laser compound head corresponding to the beam combining mirror.

[0009] Based on the above solution, a focusing lens is provided at the output port.

[0010] On the basis of the above scheme, the first output light path includes a first reflector and a first galvanometer mirror which are rotatably arranged respectively; the second output light path includes a second reflector and a second galvanometer mirror which are rotatably arranged respectively.

[0011] The present invention also provides a laser cleaning method, based on the above-mentioned laser cleaning device, including: combining a continuous laser beam and an ultrafast pulse laser beam as a cleaning laser, and outputting the laser cleaning to the layer to be cleaned through a laser composite head; wherein the optical path system and process parameters of the continuous laser beam and the ultrafast pulse laser beam are independently controlled; adjusting the laser composite head to adjust the position and incident angle of the cleaning laser incident on the layer to be cleaned.

[0012] On the basis of the above scheme, it also includes: adjusting the transmission direction of the continuous laser beam and the ultrafast pulse laser beam, and adjusting the light emission mode of the cleaning laser; wherein the light emission mode of the cleaning laser includes: coaxial light emission and parallel light emission.

[0013] On the basis of the above scheme, it also includes: adjusting the scanning amplitude and speed of the cleaning laser according to the cleaning requirements of the layer to be cleaned.

[0014] On the basis of the above scheme, according to the cleaning requirements of the layer to be cleaned, the scanning amplitude and speed of the cleaning laser are adjusted specifically including: adjusting the scanning amplitude and speed of the cleaning laser according to the thickness and format of the layer to be cleaned; the thicker the layer to be cleaned, the smaller the scanning amplitude of the cleaning laser and the slower the speed; the larger the format of the layer to be cleaned, the larger the scanning amplitude of the cleaning laser and the faster the speed.

[0015] The present invention provides a laser cleaning device and a cleaning method, which propose to combine a continuous laser beam and an ultrafast pulse laser beam for cleaning. The laser power output by the dual-beam is several times that of a single-beam laser power, which is beneficial to ensure that the laser meets the requirements of processing efficiency under the premise of stable operation. Compared with the single ultrafast laser cleaning technology, the cleaning efficiency is improved, the texture caused by a small laser spot is solved, the processing quality is stable and reliable, and the structure is simple, the stability is good, the cost is low, and the practicability is strong. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 It is an overall schematic diagram of the laser cleaning device provided by the present invention;

[0018] Figure 2 It is a schematic diagram of the interior of the laser compound head in the laser cleaning device provided by the present invention;

[0019] Figure 3 It is a schematic diagram of the optical path inside the laser compound head provided by the present invention.

[0020] Reference numerals:

[0021] 1. First laser source; 2. Second laser source; 3. Light guide arm structure; 4. Connector; 5. Laser compound head; 6. Focusing lens; 7. First reflector; 8. First galvanometer; 9. Second reflector; 10. Second galvanometer; 11. Beam combiner; 12. Output port. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] Combine the following Figure 1-Figure 3 The laser cleaning device and cleaning method of the present invention are described.

[0024] refer to Figure 1 This embodiment provides a laser cleaning device, which includes: a first laser source 1 for emitting an ultrafast pulse laser beam and a second laser source 2 for emitting a continuous laser beam, the first laser source 1 and the second laser source 2 are commonly connected to a laser compound head 5, and a first output optical path of the first laser source 1 and a second output optical path of the second laser source 2 are integrated inside the laser compound head 5.

[0025] The second laser source 2 may be a laser capable of emitting a continuous laser beam; the first laser source 1 may be a laser capable of emitting an ultrafast pulsed laser beam. The operation of the first laser source 1 and the second laser source 2 are independently controlled, and the emission of the two laser beams is controlled respectively. A laser compound head 5 is provided to integrate the output optical paths of the two laser beams. The first output optical path and the second output optical path may be independently provided, and respectively connected to the corresponding laser sources to realize the transmission of the corresponding laser beams. The two laser beams are output through a common laser compound head 5, so as to realize the combined application of the two laser beams.

[0026] Furthermore, the continuous laser beam can be a high-power continuous hot-melt laser beam. The high-power continuous hot-melt laser beam can be a fiber continuous laser commonly used in the industry, with a central wavelength of 1080nm, an average power adjustable from 500W to 2000W, and a modulation frequency of 1-5000Hz. Applications such as welding and cutting are achieved through heat output. Another ultrafast pulse laser beam can be an extremely short pulse laser beam output by an ultrafast laser represented by a picosecond or femtosecond laser. It has a short pulse duration and extremely high peak power. It has unique ultra-fine and heat-free excellent characteristics for material processing.

[0027] The two laser beams are combined. The thermal expansion of the high-power continuous hot-melt laser beam can reduce the bonding force between the layer to be cleaned, such as the coating layer, and the substrate. At the same time, the high-frequency vibration generated by the ultrafast pulse laser beam is used to cause the coating layer to fall off, thereby achieving the purpose of rapid cleaning.

[0028] A laser cleaning device provided in this embodiment proposes to combine a continuous laser beam and an ultrafast pulse laser beam for cleaning. The laser power output by the dual-beam laser is several times the power of a single-beam laser, which is beneficial to ensure that the laser meets the requirements of processing efficiency under the premise of stable operation; specifically, two laser beams with different characteristic parameters are used for dual light sources for cleaning or other laser processing, which is a non-contact processing. Compared with the traditional method of polishing, the laser processing has no direct impact on the workpiece and no mechanical deformation will occur; compared with the pickling method, it is pollution-free and reduces the process of chemical stain emission and collection; compared with the single ultrafast laser cleaning technology, it improves the cleaning efficiency, solves the problem of lines appearing when the laser spot is small, and the processing quality is stable and reliable, and it has a simple structure, good stability, low cost, and strong practicality.

[0029] On the basis of the above embodiment, further, the first laser source 1 is connected to the laser compound head 5 through the light guide arm structure 3. Specifically, the light guide arm structure 3 may include multiple sections of light guide arms that are rotatably connected in sequence, and the ends of the light guide arm structure 3 may be connected to the first laser source 1 and the laser compound head 5 through bolts. The light guide arm structure 3 can realize the transmission of laser and the movement of multiple degrees of freedom, which can facilitate the flexible movement of the laser compound head 5.

[0030] On the basis of the above embodiment, further, the second laser source 2 is connected to the laser compound head 5 through an optical fiber, and the laser compound head 5 is provided with a corresponding connector 4. Specifically, it can be a QBH connector to achieve plug-in connection and facilitate operation.

[0031] On the basis of the above embodiments, further, referring to Figure 2, a beam combiner 11 is also provided inside the laser compound head 5, and the beam combiner 11 is located in the transmission direction of the first output optical path and the second output optical path at the same time, and an output port 12 is provided on the end face of the laser compound head 5 at a position corresponding to the beam combiner 11. The continuous laser beam emitted by the first laser source 1 is transmitted to the beam combiner 11 through the first output optical path; the ultrafast pulse laser beam emitted by the second laser source 2 is transmitted to the beam combiner 11 through the second output optical path. The continuous laser beam emitted by the first laser source 1 and the ultrafast pulse laser beam emitted by the second laser source 2 are combined by the beam combiner 11 and then output.

[0032] On the basis of the above embodiment, further, a focusing lens 6 is provided at the output port 12 to achieve focusing of the two laser beams.

[0033] On the basis of the above embodiments, further, referring to Figure 3 The first output optical path includes a first reflector 7 and a first galvanometer 8 which are rotatably arranged respectively; the first reflector 7 and the first galvanometer 8 can be fixed inside the laser compound head 5 by a rotating shaft respectively, and the rotating shaft can drive the first reflector 7 and the first galvanometer 8 to rotate under the drive of the motor. The output direction of the ultrafast pulse laser beam can be adjusted by rotating the first reflector 7 and the first galvanometer 8; the scanning amplitude and scanning speed of the ultrafast pulse laser beam can be controlled by controlling the rotation of the first galvanometer 8.

[0034] The second output optical path includes a second reflector 9 and a second galvanometer 10 which are rotatably arranged. The second reflector 9 and the second galvanometer 10 can be fixed inside the laser compound head 5 through a rotating shaft, respectively, and the rotating shaft can drive the second reflector 9 and the second galvanometer 10 to rotate under the drive of the motor. The output direction of the continuous laser beam can be adjusted by rotating the second reflector 9 and the second galvanometer 10; the scanning amplitude and scanning speed of the continuous laser beam can be controlled by controlling the rotation of the second galvanometer 10.

[0035] On the basis of the above embodiments, further, this embodiment provides a laser cleaning method, which is based on the laser cleaning device described in any of the above embodiments, and the laser cleaning method includes: combining a continuous laser beam and an ultrafast pulse laser beam as a cleaning laser, and outputting the laser cleaning to the layer to be cleaned through a laser compound head 5; wherein the optical path system and process parameters of the continuous laser beam and the ultrafast pulse laser beam are independently controlled; adjusting the laser compound head 5 to adjust the position and incident angle of the cleaning laser incident on the layer to be cleaned. The cleaning laser is a combination of a continuous laser and an ultrafast pulse laser, and has the characteristics of the two laser beams.

[0036] The laser cleaning method provided in this embodiment uses two laser beams with different characteristic parameters to remove the surface of the workpiece surface of the coating material containing a dense coating layer, for example, by processing the surface of the workpiece. It is a non-contact processing. Compared with the traditional grinding method, laser processing has no direct impact on the workpiece and will not cause mechanical deformation; compared with the pickling method, it is pollution-free and reduces the process of chemical stain discharge and collection; compared with the single ultrafast laser coating cleaning technology, it improves the coating cleaning efficiency, solves the problem of lines appearing when the laser spot is small, and the processing quality is stable and reliable, and the appearance is beautiful. The laser power output by the dual-beam laser is several times that of the single-beam laser, ensuring that the laser meets the processing efficiency requirements under the premise of stable operation.

[0037] On the basis of the above embodiment, a laser cleaning method further includes: adjusting the transmission direction of the continuous laser beam and the ultrafast pulse laser beam, and adjusting the light emission mode of the cleaning laser; wherein the light emission mode of the cleaning laser includes: coaxial light emission and parallel light emission. The transmission direction of the corresponding laser beam is adjusted by rotating the corresponding reflector and the galvanometer.

[0038] Furthermore, according to the difficulty of cleaning the layer to be cleaned, the light emission mode of the cleaning laser is selected. Specifically, when the thickness of the layer to be cleaned is greater than the preset thickness, the light emission mode of the cleaning laser is selected to be coaxial. In the coaxial light emission mode, the continuous laser beam and the ultrafast pulse laser beam are coaxially emitted, and the ultrafast pulse laser beam is located in the middle of the cleaning laser beam; the two laser beams are combined, the inner part is an ultrafast pulse laser beam for fine processing and a small focused spot, and the outer part is a high-power continuous hot melt laser beam with a large heat input and a large focused spot. At the same time, the light is emitted for processing, and the thermal expansion of the high-power continuous hot melt laser beam is used to reduce the bonding force between the coating layer and the substrate. At the same time, the high-frequency vibration generated by the ultrafast pulse laser beam is used to make the coating layer fall off, so as to achieve the purpose of rapid cleaning.

[0039] In the coaxial light emitting mode, the energy of the cleaning laser beam is concentrated, which can be applied to cleaning processes with greater cleaning difficulty, such as when the thickness of the layer to be cleaned is thick. In the parallel light emitting mode, the output directions of the continuous laser beam and the ultrafast pulse laser beam are parallel to each other and do not intersect. The continuous laser beam can be arranged in front of the ultrafast pulse laser beam along the moving direction of the laser compound head 5, so that the layer to be cleaned is first melted by the continuous laser beam, and then cleaned by the ultrafast pulse laser beam, which is beneficial to improving the cleaning efficiency. In the parallel light emitting mode, the total length of the spot formed by the continuous laser beam and the ultrafast pulse laser beam is longer, which is beneficial to improving the cleaning speed and is suitable for cleaning processes that are easier to clean and have a larger cleaning format.

[0040] The light emission mode of the cleaning laser can be flexibly adjusted according to the actual cleaning needs. During the cleaning process, the light emission mode of the cleaning laser can also be flexibly adjusted in real time.

[0041] On the basis of the above embodiment, further, a laser cleaning method further includes: adjusting the scanning amplitude and speed of the cleaning laser according to the cleaning requirements of the layer to be cleaned. The scanning amplitude and speed of the cleaning laser are determined by the scanning amplitude and speed of the continuous laser beam and the ultrafast pulse laser beam. The scanning amplitude and speed of the corresponding laser beam can be adjusted by rotating the corresponding galvanometer.

[0042] On the basis of the above embodiment, further, according to the cleaning requirement of the layer to be cleaned, adjusting the scanning amplitude and speed of the cleaning laser specifically includes: adjusting the scanning amplitude and speed of the cleaning laser according to the thickness and format of the layer to be cleaned.

[0043] Specifically, the thicker the layer to be cleaned, the smaller the scanning amplitude of the cleaning laser and the slower the speed; the smaller the scanning amplitude of the cleaning laser, the more concentrated the energy, the slower the scanning speed, and the longer the energy residence time, which is suitable for cleaning thicker layers to be cleaned.

[0044] The larger the size of the layer to be cleaned, the larger the scanning amplitude of the cleaning laser and the faster the speed. The larger the scanning amplitude of the cleaning laser and the faster the speed, the faster the cleaning speed, which is suitable for cleaning layers with larger sizes.

[0045] Furthermore, the scanning amplitude and speed of the cleaning laser, the scanning amplitude and speed of the continuous laser beam, and the scanning amplitude and speed of the ultrafast pulse laser beam have the same change trend. Specifically, the scanning amplitude of the continuous laser beam is -22°-22°, and the scanning speed range is 0-6m / s. The scanning amplitude of the ultrafast pulse laser beam is -22°-22°, and the scanning speed range is 0-10m / s.

[0046] On the basis of the above embodiments, further, this embodiment provides a dual-beam laser composite coating high-efficiency cleaning device and method, which is used to solve or partially solve the problems of slow processing efficiency and residual texture of existing coating cleaning methods.

[0047] On the first aspect, this embodiment provides a dual-beam laser composite coating high-efficiency cleaning device, including parallel laser sources, a laser source and laser composite head 5 adapter and a laser composite head 5, wherein one of the parallel laser sources is a high-power continuous hot-melt laser beam, and the other is an ultrafast pulse laser beam. The optical path systems and process parameters of the two laser beams are independent of each other, and light can be emitted one by one or both by the same time without affecting each other.

[0048] On the basis of the above scheme, the laser source and the laser compound head 5 adapter are also divided into two parts and fixed on the laser compound head 5. One part is the QBH connector that is connected to the high-power continuous hot-melt laser beam, which realizes plug-in connection and is easy to operate; the other part is the light guide arm support frame that is connected to the ultrafast pulse laser beam. Bolt connection makes the incident light beam and the light guide arm coaxial. The laser source and the laser compound head 5 adapter can realize the placement of the laser compound head 5 at any angle, and can be used with various actuators for processing, without being restricted by the linear output of the high-power continuous hot-melt laser beam and the ultrafast pulse laser beam. At the same time, the optical path system and process parameters of the two laser beams are independent of each other, and the process parameters include laser power, focus spot diameter, repetition frequency, auxiliary air blowing, etc.

[0049] On the basis of the above scheme, the laser compound head 5 includes two different optical path output components, a first scanning galvanometer and a second scanning galvanometer, a first reflector 7 and a second reflector 9. Each optical path enters the laser compound head 5 and first reaches the respective reflector to adjust the optical path position, and then reaches the respective scanning galvanometer for linear scanning, and finally is combined under the same two-sided different coating lens, i.e., the beam combining mirror 11, and is focused on the workpiece surface for processing through the focusing lens 6, thereby realizing dual-beam laser compound high-efficiency processing.

[0050] In a second aspect, this embodiment provides a dual-beam laser composite coating efficient cleaning method, comprising:

[0051] Fixing the coated workpiece to be processed on the platform, with the surface to be processed of the coated workpiece facing the light outlet position of the laser compound head 5;

[0052] The parallel laser source is composed of two laser beams with different characteristic parameters, one is a high-power continuous hot-melt laser beam, and the other is an ultrafast pulse laser beam. The optical path systems and process parameters of the two laser beams are independent of each other, and light can be emitted one by one or both at the same time without affecting each other;

[0053] Adjust the relative position between the laser compound head 5 and the workpiece so that the two laser beams output by the laser compound head 5 are incident on the workpiece surface at a certain angle and focused on the workpiece surface, and the optical axes of the two laser beams after focusing are coaxial or parallel, which is adjusted according to the processing requirements;

[0054] At the same time, the high-power continuous hot-melt laser beam and the ultrafast pulse laser beam are turned on, and the output light is kept entering the laser compound head 5 along the QBH connector and the light guide arm respectively. The swing amplitude and speed of the scanning galvanometer are adjusted, and the workpiece is processed at the specified coating position to achieve complete removal of the surface coating without residue.

[0055] Based on the above solution, the length of the cleaning laser line spot is 10-80 mm.

[0056] In the above embodiment, the deflection angle of the second scanning galvanometer on the high-power continuous hot-melt laser beam is -22°-22°, and the scanning speed range is 0-6m / s. The deflection angle of the first scanning galvanometer on the ultrafast pulse laser beam is -22°-22°, and the scanning speed range is 0-10m / s. The deflection angle and the scanning speed value are adjusted according to different coating thicknesses and format cleaning requirements.

[0057] The present embodiment provides a dual-beam laser composite coating high-efficiency cleaning device with simple structure, good stability, and low cost. The laser power of the dual-beam output is several times that of the single-beam laser power, ensuring that the laser meets the requirements of processing efficiency under the premise of stable operation. The dual-beam laser composite coating high-efficiency cleaning method provided by the present embodiment uses two laser beams with different characteristic parameters to remove the surface of the workpiece surface of the coating material containing a dense coating layer. It is a non-contact processing. Compared with the traditional method of grinding, the laser processing has no direct impact on the workpiece and will not cause mechanical deformation; compared with the pickling method, it is pollution-free and reduces the process of chemical stain discharge and collection; compared with the single ultrafast laser coating cleaning technology, it improves the coating cleaning efficiency, solves the problem of lines caused by small laser spots, and has stable and reliable processing quality and beautiful appearance.

[0058] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A laser cleaning device, characterized in that: include: A first laser source for emitting an ultrafast pulsed laser beam and a second laser source for emitting a continuous laser beam, wherein the first laser source and the second laser source are connected to a laser compound head, and a first output optical path of the first laser source and a second output optical path of the second laser source are integrated inside the laser compound head; Adjust the transmission directions of the continuous laser beam and the ultrafast pulse laser beam to adjust the light emission mode of the cleaning laser; wherein the light emission mode of the cleaning laser includes: coaxial light emission and parallel light emission; When the thickness of the layer to be cleaned is greater than the preset thickness, the light emission mode of the cleaning laser is selected to be coaxial light emission; in the coaxial light emission mode, the continuous laser beam and the ultrafast pulse laser beam are coaxially emitted, and the ultrafast pulse laser beam is located in the middle of the cleaning laser beam; the two laser beams are combined, the inner part is the ultrafast pulse laser beam for fine processing and a small focused spot, and the outer part is the high-power continuous laser beam with a large heat input and a large focused spot; In the parallel light output mode, the output directions of the continuous laser beam and the ultrafast pulse laser beam are parallel to each other and do not intersect; the continuous laser beam is arranged in front of the ultrafast pulse laser beam along the moving direction of the laser compound head, so that the layer to be cleaned is first melted by the continuous laser beam and then cleaned by the ultrafast pulse laser beam; A beam combiner is also provided inside the laser compound head, and the beam combiner is located in the transmission direction of the first output optical path and the second output optical path at the same time, and an output port is provided on the end surface of the laser compound head at a position corresponding to the beam combiner; The first output light path comprises a first reflector and a first galvanometer mirror which are rotatably disposed respectively; the second output light path comprises a second reflector and a second galvanometer mirror which are rotatably disposed respectively.

2. The laser cleaning device according to claim 1, characterized in that: The first laser source is connected to the laser compound head via a light guide arm structure.

3. The laser cleaning device according to claim 1, characterized in that: The second laser source is connected to the laser compound head via an optical fiber, and the laser compound head is provided with a corresponding connector.

4. The laser cleaning device according to claim 1, characterized in that: A focusing lens is provided at the output port.

5. A laser cleaning method, characterized in that: The laser cleaning device according to any one of claims 1 to 4 above comprises: A continuous laser beam and an ultrafast pulse laser beam are combined as a cleaning laser, and the laser cleaning is output to the layer to be cleaned through a laser compound head; wherein the optical path system and process parameters of the continuous laser beam and the ultrafast pulse laser beam are independently controlled; Adjust the laser compound head to adjust the position and incident angle of the cleaning laser on the layer to be cleaned.

6. The laser cleaning method according to claim 5, characterized in that: Also includes: Adjust the transmission direction of the continuous laser beam and the ultrafast pulse laser beam, and adjust the light output mode of the cleaning laser; Among them, the light emission modes of the cleaning laser include: coaxial light emission and parallel light emission.

7. The laser cleaning method according to claim 5, characterized in that: Also includes: According to the cleaning requirements of the layer to be cleaned, the scanning amplitude and speed of the cleaning laser are adjusted.

8. The laser cleaning method according to claim 7, characterized in that: According to the cleaning requirements of the layer to be cleaned, the scanning amplitude and speed of the cleaning laser are adjusted, including: According to the thickness and width of the layer to be cleaned, adjust the scanning amplitude and speed of the cleaning laser; The thicker the layer to be cleaned, the smaller the scanning amplitude of the cleaning laser and the slower the speed; The larger the size of the layer to be cleaned, the larger the scanning amplitude of the cleaning laser and the faster the speed.

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