Bands, encapsulation processes and optical devices

Abstract

This invention discloses a tape, an encapsulation process, and an optical device. The tape includes at least one tape unit. The tape unit includes a substrate structure having a first portion and a second portion. The first portion has a first surface and a second surface opposite to the first surface. The second portion protrudes from the second surface of the first portion and has a third surface and a side surface, the third surface opposite to the first surface of the first portion, and the side surface extending between the second surface and the third surface. Viewed from top, the area of ​​the first portion is larger than the area of ​​the second portion.

Description

Technical Field

[0001] This invention relates to a tape, an encapsulating process, and an optical device, and further relates to a tape, an encapsulating process using the tape, and an optical device formed by the encapsulating process. Background Technology

[0002] An optical device may include a substrate, an emitter, and a detector, the emitter and detector being disposed on a predetermined portion of the substrate. The emitter emits a light beam. The light beam is reflected by an object and then detected by the detector. To protect the substrate, emitter, and detector, it is necessary to form an irregularly shaped molding compound on the substrate. The molding compound must cover the substrate and define perforations to expose the predetermined portion of the substrate, such that the emitter and detector can be disposed within the perforations and on the predetermined portion of the substrate. Summary of the Invention

[0003] In some embodiments, a tape includes at least one tape unit. The tape unit includes a base structure having a first portion and a second portion. The first portion has a first surface and a second surface opposite to the first surface. The second portion protrudes from the second surface of the first portion and has a third surface and a side surface, the third surface opposite to the first surface of the first portion, and the side surface extending between the second surface and the third surface. Viewed from top, the area of ​​the first portion is larger than the area of ​​the second portion.

[0004] In some embodiments, an encapsulation process includes: (a) providing a substrate; (b) disposing at least one tape unit on the substrate, wherein the tape unit includes a substrate structure having a first portion and a second portion, the first portion having a first surface, a second surface and a first side surface, the second surface being opposite to the first surface, the first side surface extending between the first surface and the second surface, the second portion protruding from the second surface and having a third surface and a second side surface, the third surface being opposite to the first surface of the first portion, the second side surface extending between the second surface and the third surface, and, in a top view, the area of ​​the first portion being larger than the area of ​​the second portion; and (c) forming an encapsulant around the tape unit.

[0005] In some embodiments, an optical device includes a substrate, a passive component, and an encapsulating agent. The substrate has a surface. The passive component is disposed on the surface of the substrate. The encapsulating agent is disposed on the surface of the substrate and encapsulates the passive component. The encapsulating agent has a first side surface that defines a through-hole. The angle between the first side surface of the encapsulating agent and the surface of the substrate is approximately 90 degrees to approximately 110 degrees. Attached Figure Description

[0006] Some aspects of embodiments of this disclosure will be best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that, for clarity of discussion, various structures may not be drawn to scale, and the dimensions of various structures may be arbitrarily increased or decreased.

[0007] Figure 1 A cross-sectional view of an example of a band according to some embodiments of the present disclosure is shown.

[0008] Figure 2 A cross-sectional view of an example of a band according to some embodiments of the present disclosure is shown.

[0009] Figure 3 A cross-sectional view of an example with cells according to some embodiments of the present disclosure is shown.

[0010] Figure 4 A cross-sectional view of an example with cells according to some embodiments of the present disclosure is shown.

[0011] Figure 5 A cross-sectional view of an example with cells according to some embodiments of the present disclosure is shown.

[0012] Figure 6 A cross-sectional view of an example of an optical device according to some embodiments of the present disclosure is shown.

[0013] Figure 7 One or more stages of an example of a method for manufacturing an optical device according to some embodiments of the present disclosure are shown.

[0014] Figure 8 One or more stages of an example of a method for manufacturing an optical device according to some embodiments of the present disclosure are shown.

[0015] Figure 9 One or more stages of an example of a method for manufacturing an optical device according to some embodiments of the present disclosure are shown.

[0016] Figure 10 One or more stages of an example of a method for manufacturing an optical device according to some embodiments of the present disclosure are shown.

[0017] Figure 11 One or more stages of an example of a method for manufacturing an optical device according to some embodiments of the present disclosure are shown.

[0018] Figure 12 Examples of one or more stages of an encapsulation process according to some embodiments of the present disclosure are shown.

[0019] Figure 13 One or more stages of an example of a method for manufacturing an optical device according to some embodiments of the present disclosure are shown.

[0020] Figure 14 One or more stages of an example of a method for manufacturing an optical device according to some embodiments of the present disclosure are shown.

[0021] Figure 15 One or more stages of an example of a method for manufacturing an optical device according to some embodiments of the present disclosure are shown.

[0022] Figure 16 One or more stages of an example of a method for manufacturing an optical device according to some embodiments of the present disclosure are shown.

[0023] Figure 17 One or more stages of an example of a method for manufacturing an optical device according to some embodiments of the present disclosure are shown. Detailed Implementation

[0024] Throughout the accompanying drawings and detailed embodiments, the same reference numerals are used to indicate the same or similar components. The embodiments of this disclosure will be readily understood through the following detailed description in conjunction with the accompanying drawings.

[0025] The following disclosure provides numerous different embodiments or instances for implementing various features of the provided subject matter. Specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to be limiting. For example, forming a first feature above or on top of a second feature described below may include embodiments where the first and second features are in direct contact, and may also include embodiments where additional features may be formed or placed between the first and second features, such that the first and second features do not need to be in direct contact. Furthermore, reference numerals and / or letters may be repeated in various instances of this disclosure. Such repetition is for simplicity and clarity and does not in itself specify a relationship between the various embodiments and / or configurations discussed.

[0026] In a comparative process for forming an optical device, a mold is placed on a substrate. The mold has a protruding portion close to the surface of the substrate. An encapsulating agent is then formed on the surface of the substrate and surrounds the protruding portion of the mold. After the mold is removed, perforations are formed corresponding to the protruding portion of the mold. The perforations extend through the encapsulating agent to expose a portion of the substrate surface. A light-emitting component and a light-receiving component are then placed in the perforations of the encapsulating agent and on the surface of the substrate. A glass plate or lens is then placed on the encapsulating agent to cover the perforations. That is, the glass plate or lens is placed above the light-emitting component and the light-receiving component.

[0027] In the aforementioned processes, the molds are typically made of hard metals such as steel. Therefore, when the mold is in close contact with the substrate surface, it may easily damage the substrate. Molds made of hard metal may not adhere properly to the substrate surface, and thus, during the molding process, the encapsulant may flow into the gap between the protrusion and the substrate surface. Furthermore, molds made of hard metal must have a large draft angle or a sharp draft taper to prevent damage to the encapsulant when removing the mold. However, due to the large draft angle or sharp draft taper, the sidewalls of the encapsulant perforations may not be substantially perpendicular to the substrate surface, which may adversely affect the function of the light-emitting and / or light-receiving components.

[0028] Therefore, at least some embodiments of this disclosure provide a tape capable of being suitably adhered to the surface of a substrate. At least some embodiments of this disclosure further provide an encapsulation process using said tape, and an optical device manufactured by said encapsulation process.

[0029] Figure 1 A cross-sectional view of a strip 1' according to some embodiments of the present disclosure is shown. Strip 1' includes at least one strip unit 1, such as two strip units 1. Each strip unit 1 includes a base structure 11. The base structure 11 includes a first portion 13 and a second portion 14. The first portion 13 and the second portion 14 can be integrally formed as a monolithic structure. That is, there is no boundary between the first portion 13 and the second portion 14. The first portions 13 of the base structures 11 of multiple strip units 1 are connected such that the base structures 11 together form an integral structure. That is, the entire strip 1' can be a monolithic structure. In some embodiments, strip 1' is adhesive tape.

[0030] The substrate structure 11 can be made of a flexible and compressible material. The material of the substrate structure 11 can be a polymer, such as polypropylene (PP), oriented polypropylene (OPP), biaxially oriented polypropylene (BOPP), polyethylene (PE), or polyvinyl chloride (PVC). The substrate structure 11 can be formed by injection molding or machining. In some embodiments, the tape 1' can be a thermal release tape that can be easily peeled off at a certain temperature. Furthermore, the tape 1' can be a double-sided adhesive tape. When in use, the tape 1' can be cut to form two separate tape units 1, such as... Figure 3 The image shows belt unit 1. Each belt unit 1 can be used as a mold to form the cavity of the product, such as... Figure 6 The cavity 30 of the encapsulant 3 is shown in the figure. In some embodiments, since the substrate structure 11 is made of a flexible and compressible material, a large draft angle or sharp draft taper is not required for the belt 1' or belt unit 1.

[0031] Figure 2 A cross-sectional view of band 1" is shown according to some embodiments of the present disclosure. Band 1" includes elements similar to... Figure 1 and 3 The diagram shows at least one belt unit 1 of belt unit 1. However, belt 1" further includes a carrier portion 16. The at least one belt unit 1 includes a plurality of belt units 1 disposed on and in contact with the carrier portion 16. For example, a first portion 13 of the base structure 11 may be disposed on and in contact with the carrier portion 16. In some embodiments, the belt units 1 and the carrier portion 16 may be integrally formed as a single structure. That is, the entire belt 1" may be a single structure. When in use, each belt unit 1 may be cut or separated from the carrier portion 16. However, these belt units 1 may be used directly as a mold to which the carrier portion 16 is attached. Each belt unit 1 may correspond to a cavity in the product, and the carrier portion 16 may correspond to the upper surface of the product. In other embodiments, the belt units 1 and the carrier portion 16 may be formed separately and then attached together to form belt 1". For example, the carrier portion 16 may be release paper, so that the belt units 1 can be easily removed from the carrier portion 16 when in use.

[0032] Figure 3 A cross-sectional view with element 1 is shown, as follows. Figure 1 The one shown in the image is marked with 1' or Figure 2 The strip unit 1 with the "1" shown in the figure.

[0033] like Figure 3 As shown, the strip unit 1 includes a base structure 11. The base structure 11 has a first portion 13 and a second portion 14. The first portion 13 has a first surface 101, a second surface 102 opposite to the first surface 101, and a first side surface 104 extending between the first surface 101 and the second surface 102. The second portion 14 protrudes from the second surface 102 of the first portion 13. The second portion 14 has a third surface 103 opposite to the first surface 101 of the first portion 13, and a second side surface 105 extending between the second surface 102 and the third surface 103. From a top view, the area of ​​the first portion 13 is larger than the area of ​​the second portion 14. In some embodiments, the first portion 13 and the second portion 14 can be integrally formed as a single structure. That is, there is no boundary between the first portion 13 and the second portion 14.

[0034] The second surface 102 of the first portion 13 may be substantially perpendicular to the first side surface 104 of the first portion 13. The angle θ1 between the second surface 102 and the first side surface 104 of the first portion 13 is approximately 90 degrees to approximately 110 degrees, such as approximately 90 degrees to approximately 100 degrees, approximately 90 degrees to approximately 95 degrees, approximately 90 degrees to approximately 93 degrees, or approximately 90 degrees to approximately 91 degrees. The third surface 103 of the second portion 14 may be substantially perpendicular to the second side surface 105 of the second portion 14. The angle θ2 between the third surface 103 and the second side surface 105 of the second portion 14 may be approximately 90 degrees to approximately 110 degrees, such as approximately 90 degrees to approximately 100 degrees, approximately 90 degrees to approximately 95 degrees, approximately 90 degrees to approximately 93 degrees, or approximately 90 degrees to approximately 91 degrees. In some embodiments, the length of the base structure 11 (e.g., the length of the first portion 13) is less than 10 mm, such as less than 8 mm, less than 6 mm, less than 5 mm, less than 4 mm, or less than 3 mm. In some embodiments, the third surface 103 of the substrate structure 11 may be adhesive. For example, the substrate structure 11 may be made of a non-reactive adhesive material, such as a pressure-sensitive adhesive.

[0035] Figure 4 A cross-sectional view of a strip unit 1a according to some embodiments of the present disclosure is shown. The strip unit 1a is similar to... Figure 3 The strip unit 1 shown in the figure further includes an adhesive layer 12.

[0036] The adhesive layer 12 can be disposed on the third surface 103 of the second portion 14 of the substrate structure 11. The adhesive layer 12 can be formed by applying or disposing an adhesive onto the third surface 103. In some embodiments, the adhesive layer 12 can be a thermal release adhesive. In some embodiments, a plurality of tape units 1a can be connected to form a structure similar to... Figure 1 The strip shown as 1' can be placed on the carrier portion to form a shape similar to Figure 2 The strip 1" is shown in the figure. In some embodiments, the adhesive layer 12 may be made of a non-reactive adhesive material, such as a pressure-sensitive adhesive.

[0037] Figure 5 A cross-sectional view of a strip unit 1b according to some embodiments of the present disclosure is shown. The strip unit 1b is similar to... Figure 4 The strip unit 1a shown in the figure, except for the following.

[0038] like Figure 5 As shown, a base structure 11b with unit 1b defines a cavity 10 recessed from a first surface 101 of its first portion 13. The cavity 10 extends through the first portion 13 of the base structure 11b into a second portion 14. The second portion 14 of the base structure 11b has a first thickness T1 between the cavity 10 and a second side surface 105, and a second thickness T2 between the cavity 10 and a third surface 103. The first thickness T1 is greater than the second thickness T2. In some embodiments, the cavity 10 is formed by machining such as milling. Furthermore, as Figure 5 As shown, the adhesive layer 12b is further disposed on the second side surface 105 of the second portion 14 of the substrate structure 11b and / or the second surface 102 of the first portion 13.

[0039] Figure 6 A cross-sectional view of an optical device 8 according to some embodiments of the present disclosure is shown. The optical device 8 includes a substrate 2, two passive components 83, an encapsulant 3, a light-emitting component 84, a light-receiving component 85, and an optical lens 86.

[0040] Substrate 2 has a first surface 201 and a second surface 202 opposite to the first surface 201. Substrate 2 may be an embedded trace substrate. For example, substrate 2 may include a first circuit layer 25 exposed from the first surface 201, a second circuit layer 26 exposed from the second surface 202, and conductive vias 27 electrically connecting the first circuit layer 25 and the second circuit layer 26. In some embodiments, substrate 2 may further include a semiconductor chip 24 disposed between the first surface 201 and the second surface 202 (i.e., the semiconductor chip 24 may be embedded in substrate 2), and the semiconductor chip 24 is electrically connected to the first circuit layer 25 and / or the second circuit layer 26.

[0041] Passive components 83 are disposed on the first surface 201 of the substrate 2 and are electrically connected to the substrate 2, such as the first circuit 25 and / or semiconductor chip 24 of the substrate 2. Each passive component 83 may be a resistor, capacitor, inductor, or transformer, etc. In some embodiments, the optical device 8 may include only one passive component 83, or it may include two or more passive components 83.

[0042] Encapsulant 3 is disposed on a first surface 201 of substrate 2 and encapsulates passive component 83. Encapsulant 3 has a first portion 31 and a second portion 32 and defines a through-hole 30. The first portion 31 and the second portion 32 can be integrally formed as a single structure. That is, there is no boundary between the first portion 31 and the second portion 32. The first portion 31 has a first surface 301, a second surface 302 opposite to the first surface 301, and a first side surface 304 extending between the first surface 301 and the second surface 302. The first surface 301 is disposed on the first surface 201 of substrate 2. The first side surface 304 of the first portion 31 of encapsulant 3 can be substantially perpendicular to the first surface 201 of substrate 2. The angle θ3 between the first side surface 304 of the first portion 31 of encapsulant 3 and the first surface 201 of substrate 2 can be from about 90 degrees to about 110 degrees, such as from about 90 degrees to about 100 degrees, from about 90 degrees to about 95 degrees, from about 90 degrees to about 93 degrees, or from about 90 degrees to about 91 degrees. The second portion 32 protrudes from the second surface 302 of the first portion 31. The second portion 32 has a third surface 303 opposite to the first surface 301 of the first portion 31, and a second side surface 305 extending between the second surface 302 and the third surface 303 of the first portion 31. The second side surface 305 of the second portion 32 of the encapsulant 3 may be substantially perpendicular to the second surface 302 of the first portion 31 of the encapsulant 3. The angle θ4 between the second side surface 305 of the second portion 32 of the encapsulant 3 and the second surface 302 of the first portion 31 may be from about 90 degrees to about 110 degrees, such as from about 90 degrees to about 100 degrees, from about 90 degrees to about 95 degrees, from about 90 degrees to about 93 degrees, or from about 90 degrees to about 91 degrees.

[0043] The first side surface 304 and the second surface 302 of the first portion 31 of the encapsulant 3, and the second side surface 305 of the second portion 32 together define a perforation 30. The perforation 30 extends through the encapsulant 3. The perforation 30 includes an upper portion (e.g., defined by the second side surface 305 of the encapsulant 3) and a lower portion (e.g., defined by the first side surface 304 of the encapsulant 3), and the width of the upper portion is greater than the width of the lower portion.

[0044] The encapsulant 3 can be made of an opaque material and therefore can be opaque. In some embodiments, the encapsulant 3 can be made of an epoxy resin encapsulating compound (with or without filler) containing a black pigment such as carbon black.

[0045] A portion of the first surface 201 of substrate 2 is exposed in the perforations 30 of encapsulant 3. A light-emitting component 84 and a light-receiving component 85 are disposed side-by-side on the exposed portion of the first surface 201 of substrate 2 in the perforations 30 of encapsulant 3. The light-emitting component 84 and the light-receiving component 85 are electrically connected to substrate 2, such as a first circuit 25 and / or semiconductor chip 24 of substrate 2. The light-emitting component 84 can be a component capable of emitting light of a single wavelength or a range of wavelengths, such as a laser diode or a vertical cavity surface-emitting laser (VCSEL). A VCSEL is a laser diode with single-chip laser resonance, which emits light primarily in the vertical direction of its top surface. Compared to traditional edge-emitting lasers (EELs), VCSELs offer advantages such as compatibility with circuitry and inspection instruments, reliability, scalability, cost-effectiveness, and packaging capabilities. Since the introduction of VCSEL-supported facial recognition technology into smartphones, the industry's demand for VCSELs has been continuously increasing. Alternatively, the light receiving component 85 may be a component capable of receiving and / or detecting light arriving at its light receiving area, such as a photodiode.

[0046] An optical lens 86 is disposed on or attached to the second surface 302 of the encapsulant 3, and is positioned above the light-emitting component 84 and the light-receiving component 85. For example... Figure 6 As shown, the optical lens 86 is disposed in the upper portion of the perforation 30 and covers the lower portion of the perforation 30. Therefore, the optical lens 86 is disposed above the light-emitting component 84 and the light-receiving component 85. The optical lens 86 can be a plate made of glass or polymer and can be transparent or translucent. For example, the optical lens 86 allows light beams with a desired wavelength to pass through. That is, the optical lens 86 can be a filter such as an infrared (IR) filter.

[0047] In the optical device 8, since the angle θ3 between the first side surface 304 of the first portion 31 of the encapsulant 3 and the first surface 201 of the substrate 2 is about 90 degrees to about 110 degrees (for example, the first side surface 304 of the first portion 31 of the encapsulant 3 can be substantially perpendicular to the first surface 201 of the substrate 2), the influence of the first side surface 304 on the performance of the light-emitting component 84 and / or the light-receiving component 85 can be reduced.

[0048] Figures 7 to 11Encapsulation processes according to some embodiments of the present disclosure are illustrated. In some embodiments, the encapsulation process can be used to manufacture, for example... Figure 6 The optical device 8 shown is an optical device. The encapsulation process uses at least one tape unit, such as... Figure 3 The two strip units 1 are shown in the figure.

[0049] refer to Figure 7 A substrate 2 is provided. The substrate 2 has a first surface 201 and a second surface 202 opposite to the first surface 201. The substrate 2 may be an embedded trace substrate. For example, the substrate 2 may include a first circuit layer 25 exposed from the first surface 201, a second circuit layer 26 exposed from the second surface 202, and conductive vias 27 electrically connecting the first circuit layer 25 and the second circuit layer 26. In some embodiments, the substrate 2 may further include a semiconductor chip 24 disposed between the first surface 201 and the second surface 202 (i.e., the semiconductor chip may be embedded in the substrate 2), and the semiconductor chip 24 is electrically connected to the first circuit layer 25 and / or the second circuit layer 26. Figure 7 The substrate 2 shown can be used to fabricate two or more optical devices. Four passive components 83 are then mounted on the first surface 201 of the substrate 2. The passive components 83 are electrically connected to the substrate 2, such as the first circuit 25 and / or semiconductor chip 24 of the substrate 2.

[0050] refer to Figure 8 At least one strip unit (e.g., two strip units 1) is disposed on a substrate 2. Each strip unit 1 includes a substrate structure 11. The substrate structure 11 includes a first portion 13 and a second portion 14. The first portion 13 has a first surface 101, a second surface 102 opposite to the first surface 101, and a first side surface 104 extending between the first surface 101 and the second surface 102. The second portion 14 protrudes from the second surface 102 of the first portion 13. The second portion 14 has a third surface 103 opposite to the first surface 101 of the first portion 13, and a second side surface 105 extending between the second surface 102 and the third surface 103. Viewed from top, the area of ​​the first portion 13 is larger than the area of ​​the second portion 14.

[0051] The second surface 102 of the first portion 13 is substantially perpendicular to the first side surface 104 of the first portion 13. The angle θ1 between the second surface 102 and the first side surface 104 of the first portion 13 is approximately 90 degrees to approximately 110 degrees. The third surface 103 of the second portion 14 is substantially perpendicular to the second side surface 105 of the second portion 14. The angle θ2 between the third surface 103 and the second side surface 105 of the second portion 14 is approximately 90 degrees to approximately 110 degrees. The third surface 103 of the substrate structure 11 contacts and adheres to the first surface 201 of the substrate 2. Therefore, during the encapsulation process, the position of the tape unit 1 relative to the substrate 2 can be firmly fixed.

[0052] refer to Figure 9 An encapsulant 3 is formed on the substrate 2 to cover the passive component 83 and surround the tape unit 1. For example, a mold or mold chase can be applied to the substrate 2 so that the passive component 83 and the tape unit 1 are received together in the cavity of the mold or mold chase. The mold or mold chase can press the tape unit 1 toward the first surface 201 of the substrate 2. In some embodiments, the tape unit 1 can be made of a flexible and compressible material to adhere tightly to the substrate 2 and prevent damage to the substrate 2. The encapsulant material can then flow into the cavity of the mold or mold chase. Because the third surface 103 of the base structure 11 of the tape unit 1 adheres tightly to the substrate 2, the encapsulant material is prevented from flowing into the space between the tape unit 1 and the surface 201 of the substrate 2. The encapsulant material is then cured at a curing temperature to form the encapsulant 3.

[0053] The encapsulant 3 contacts the first side surface 104 and second surface 102 of the first portion 13 and the second side surface 105 of the second portion 14 of the substrate structure 11 of each tape unit 1. For example, the second side surface 305 of the second portion 32 of the encapsulant 3, and the second surfaces 302 and 304 of the first portion 31 are conformally aligned with the first side surface 104 and second surface 102 of the first portion 13 and the second side surface 105 of the second portion 14 of the substrate structure 11 of the tape unit 1, respectively. Therefore, the first side surface 304 of the first portion 31 of the encapsulant 3 can be substantially perpendicular to the first surface 201 of the substrate 2. The angle θ3 between the first side surface 304 of the first portion 31 of the encapsulant 3 and the first surface 201 of the substrate 2 can be approximately 90 degrees to approximately 110 degrees. The second side surface 305 of the second portion 32 of the encapsulant 3 can be substantially perpendicular to the second surface 302 of the first portion 31 of the encapsulant 3. The angle θ4 between the second side surface 305 of the second portion 32 of the encapsulant 3 and the second surface 302 of the first portion 31 can be from about 90 degrees to about 110 degrees.

[0054] refer to Figure 10Each tape unit 1 is picked up and removed by a vacuum nozzle 93. In some embodiments, the tape unit 1 is a heat-release tape. Therefore, the tape unit 1 is heated to a release temperature, and the tape unit 1 is removed by the vacuum nozzle 93 at the release temperature. The release temperature of the tape unit 1 is greater than the curing temperature of the encapsulant 3. In some embodiments, since the tape unit 1 is made of a flexible and compressible flexible material, a large draft angle or sharp draft taper is not required. The tape unit 1 can be easily removed without damaging the encapsulant 3. In addition, there may be no or very little residue of the tape unit 1 on the first surface 21 of the substrate 2.

[0055] refer to Figure 11 Each tape unit 1 is removed to form a perforation 30 extending through the encapsulant 3. A first side surface 304 and a second surface 302 of a first portion 31 of the encapsulant 3, and a second side surface 305 of a second portion 32, collectively define the perforation 30. The perforation 30 includes an upper portion (e.g., defined by the second side surface 305 of the encapsulant 3) and a lower portion (e.g., defined by the first side surface 304 of the encapsulant 3), and the width of the upper portion is greater than the width of the lower portion. Multiple portions of the first surface 21 of the substrate 2 are exposed in each perforation 30 of the encapsulant 3.

[0056] refer to Figure 12 A light-emitting component 84 and a light-receiving component 85 are arranged side-by-side on the exposed portion of the first surface 201 of the substrate 2 and in each through-hole 30. Furthermore, the light-emitting component 84 and the light-receiving component 85 are electrically connected to the substrate 2. For example, the light-emitting component 84 and the light-receiving component 85 are electrically connected to the first circuit layer 25 and / or the semiconductor chip 24 of the substrate 2. Then, an optical lens 86 is placed on or attached to the second surface 302 of the second portion 32 of the encapsulant 3 to cover the light-emitting component 84 and the light-receiving component 85. Then, a singulation process is performed along the dicing line 9 on the substrate 2 and the encapsulant 3 to form multiple optical devices, such as... Figure 6 The optical device 8 shown in the figure.

[0057] Figures 13 to 15 Encapsulation processes according to some embodiments of the present disclosure are illustrated. In some embodiments, the encapsulation process can be used to manufacture, for example... Figure 6 Optical devices such as optical device 8 are shown in the diagram. The encapsulation process uses at least one tape unit, such as... Figure 5 The two belt units 1b shown in the diagram represent the initial stage of the process. Figure 7 The stages shown are the same or similar. Figure 13 Depicting the continuation Figure 7 The stage following the stage described.

[0058] refer to Figure 13At least one strip unit (e.g., two strip units 1b) is disposed on the substrate 2. The strip unit 1b and... Figure 1 The strip unit 1 shown is similar, except that the base structure 11b defines the cavity 10 and the strip unit 1b further includes an adhesive layer 12b.

[0059] Cavity 10 is recessed from the first surface 101 of its first portion 13. Cavity 10 extends through the first portion 13 of substrate structure 11b into the second portion 14. The second portion 14 of substrate structure 11b has a first thickness T1 between cavity 10 and second side surface 105, and a second thickness T2 between cavity 10 and third surface 103. The first thickness T1 is greater than the second thickness T2. Adhesive layer 12b is disposed on the third surface 103 and second side surface 105 of the second portion 14 of substrate structure 11b and on the second surface 102 of the first portion 13. Tape unit 1b is adhered to substrate 2 via adhesive layer 12b.

[0060] refer to Figure 14 An encapsulant 3 is formed on the substrate 2 to cover the passive component 83 and surround the tape unit 1b. The encapsulant 3 contacts the first side surface 104 of the first portion 13 of the substrate structure 11b and a portion of the adhesive layer 12b of each tape unit 1b. Since the first thickness T1 is greater than the second thickness T2, the substrate structure 11b provides sufficient resistance along the direction of the first thickness T1. That is, the substrate structure 11b is not easily deformed during the formation of the encapsulant 3.

[0061] refer to Figure 15 Each tape unit 1b is picked up and removed by the vacuum nozzle 93. In some embodiments, the tape unit 1b is a heat-release tape. Therefore, the tape unit 1b is heated to a release temperature, and the tape unit 1b is removed by the vacuum nozzle 93 at the release temperature. When the tape unit 1b is heated, heat can be sufficiently transferred to the adhesive layer 12b due to the arrangement of the cavity 10. Therefore, the tape unit 1b can be easily peeled off from the encapsulant 3. In addition, during the vacuum suction of the vacuum nozzle 93, the cavity 10 can promote the shrinkage of the tape unit 1b toward the center of the tape unit 1b, and multiple gaps or voids may easily appear between the tape unit 1b and the encapsulant 3. This reduces the adhesive area or bonding area between the tape unit 1b and the encapsulant 3. Therefore, when the vacuum nozzle 93 pulls the tape unit 1b upward, the tape unit 1b can be more easily peeled off from the encapsulant 3. Therefore, residues of adhesive layer 12b on the second surface 302 and the first side surface 304 of the encapsulant 3 and / or the exposed portion of the first surface 21 of the substrate 2 can be avoided.

[0062] The process shown is in Figure 15 The stages following the stages shown in the diagram and Figures 11 to 12The stages shown in the diagram are similar, thus forming Figure 6 The optical device 8 shown in the figure.

[0063] Figures 16 to 17 Encapsulation processes according to some embodiments of the present disclosure are illustrated. In some embodiments, the encapsulation process can be used to manufacture, for example... Figure 6 Optical devices such as optical device 8 are shown in the diagram. The encapsulation process uses at least one tape unit, such as... Figure 2 The diagram shows belt 1" containing two belt units from belt unit 1. The initial stage of the process shown is related to... Figure 7 The stages shown are the same or similar. Figure 16 Depicting the continuation Figure 7 The stage following the stage described.

[0064] refer to Figure 16 A strip 1" comprising two strip units 1 and a carrier portion 16 is placed on a substrate 2. The strip unit 1 is similar to... Figure 8 The belt unit 1 shown is mounted on and in contact with the carrier portion 16. (As shown) Figure 16 As shown, the first surface 101 of the first portion 13 of the substrate structure 11 with unit 1 is disposed on and in contact with the surface 161 of the carrier portion 16. That is, the first surface 101 is an imaginary plane. The third surface 103 of the second portion 14 of the substrate structure 11 with unit 1 is disposed on and in contact with the first surface 201 of the substrate 2.

[0065] refer to Figure 17 An encapsulant 3 is formed on the substrate 2 to cover the passive component 83 and surround the tape unit 1. The encapsulant 3 contacts the first side surface 104 and the second surface 102 of the first portion 13 and the second side surface 105 of the second portion 14 of the substrate structure 11 of each tape unit 1, and further contacts the carrier portion 16 of the tape 1". For example, the second side surface 305 of the second portion 32 of the encapsulant 3 and the second surface 302 and the first side surface 304 of the first portion 31 are conformally fitted to the first side surface 104 and the second surface 102 of the first portion 13 and the second side surface 105 of the second portion 14 of the substrate structure 11 of the tape unit 1, respectively. In addition, the third surface 303 of the second portion 32 of the encapsulant 3 is conformally fitted to the surface 161 of the portion 16 of the tape 1".

[0066] After the encapsulant 3 is formed, the tape 1" can be removed. That is, multiple tape units 1 and carrier portions 16 are removed together to form multiple perforations 30 extending through the encapsulant 3, such as Figure 11 As shown in the image.

[0067] A portion of the substrate 2, such as the first surface 201 of the substrate 2, is exposed through the perforations 30 of the encapsulant 3. In some embodiments, the strip 1" is an integral structure, so the strip unit 1 and the carrier portion 16 can be easily removed by simply pulling the carrier portion 16.

[0068] The process shown is in Figure 17 The stages following the stages shown in the diagram and Figures 11 to 12 The stages shown in the diagram are similar, thus forming Figure 6 The optical device 8 shown in the figure.

[0069] Unless otherwise stated, spatial descriptions such as “above,” “below,” “upward,” “left,” “right,” “downward,” “top,” “bottom,” “vertical,” “horizontal,” “side,” “higher,” “lower,” “upper,” “above,” or “below,” etc., refer to the directional indications shown in the figures. It should be understood that the spatial descriptions used herein are for illustrative purposes only, and actual implementations of the structures described herein can be arranged in space in any orientation or manner, provided that the advantages of the embodiments of this disclosure do not depart from this arrangement.

[0070] As used herein, the terms “approximately,” “substantially,” “basically,” and “about” are used to describe and explain small variations. When used with an event or situation, these terms can refer to instances where the event or situation occurred precisely, or instances where the event or situation was close to occurring. For example, when used with a numerical value, these terms can refer to a range of variation less than or equal to ±10% of that value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if the difference between numerical values ​​is less than or equal to ±10% of the average, the two numerical values ​​can be considered “substantially” the same or equal, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%.

[0071] If the displacement between two surfaces is no greater than 5 μm, no greater than 2 μm, no greater than 1 μm, or no greater than 0.5 μm, then the two surfaces can be considered coplanar or substantially coplanar.

[0072] As used herein, unless the context clearly indicates otherwise, the singular forms “a / an” and “the” may contain plural referents.

[0073] As used herein, the terms “conductive,” “electrically conductive,” and “electrical conductivity” refer to the ability to conduct electric current. Conductive materials generally refer to those materials that offer little or no resistance to the flow of electric current. One measure of conductivity is Siemens per meter (S / m). Typically, conductive materials are those with a conductivity greater than about 10. 4 S / m, such as at least 10 5 S / m or at least 10 6 Conductive materials with conductivity of S / m. The conductivity of the material may sometimes vary with temperature. Unless otherwise stated, the conductivity of the material is measured at room temperature.

[0074] In addition, quantities, ratios, and other numerical values ​​are sometimes presented in range format in this document. It should be understood that this range format is used for convenience and brevity and should be flexibly interpreted to include not only the numerical values ​​that are explicitly specified as the limits of the range, but also all individual numerical values ​​or subranges covered within the range, as if each numerical value and subrange were explicitly specified.

[0075] While this disclosure has been described and illustrated with reference to specific embodiments thereof, such descriptions and illustrations are not limiting. Those skilled in the art will understand that various changes may be made and equivalents may be substituted without departing from the spirit and scope of this disclosure as defined by the appended claims. Illustrations may not necessarily be drawn to scale. Due to manufacturing processes and tolerances, there may be differences between the process reproduction in this disclosure and actual apparatus. Other embodiments of this disclosure may exist that are not specifically shown. The specification and drawings should be considered illustrative rather than limiting. Modifications may be made to adapt particular circumstances, materials, composition, methods, or processes to the objectives, spirit, and scope of this disclosure. All such modifications are intended to be within the scope of the appended claims. Although the methods disclosed herein have been described with reference to specific operations performed in a particular order, it should be understood that these operations may be combined, subdivided, or rearranged to form equivalent methods without departing from the teachings of this disclosure. Therefore, unless expressly indicated herein, the order and grouping of operations are not limitations of this disclosure.

Claims

1. A tape comprising: at least one tape unit, the at least one tape unit comprising: a base structure having a first portion and a second portion, wherein the first portion has a first surface and a second surface opposite the first surface, the second portion protrudes from the second surface of the first portion and has a third surface and a side surface, the third surface is opposite the first surface of the first portion, the side surface extends between the second surface and the third surface, and the first portion has an area greater than an area of the second portion in plan view, wherein the first portion and the second portion are integrally formed as a unitary structure without a boundary between the first portion and the second portion, the base structure is made of a flexible and compressible material, the tape unit further comprises an adhesive layer disposed on the third surface of the second portion of the base structure, the base structure defines a cavity recessed from the first surface of the first portion, upon heating the at least one tape unit, heat can be substantially transferred to the adhesive layer due to the arrangement of the cavity, the cavity extends through the first portion of the base structure into the second portion, the cavity can facilitate the at least one tape unit to contract toward a center of the at least one tape unit during vacuum suction of a vacuum suction nozzle.

2. The tape of claim 1, wherein the second portion of the base structure has a first thickness between the cavity and the side surface and a second thickness between the cavity and the third surface, and the first thickness is greater than the second thickness.

3. The tape of claim 2, wherein the first thickness and the second thickness are both less than a thickness of the first portion of the base structure.

4. The tape of claim 1, wherein the first portion further has a side surface extending between the first surface and the second surface, and an angle between the second surface and the side surface of the first portion is about 90 degrees to about 110 degrees.

5. The tape of claim 1, wherein an angle between the third surface and the side surface of the second portion is about 90 degrees to about 110 degrees.

6. The tape of claim 1, further comprising a carrier portion, wherein the at least one tape unit comprises a plurality of tape units disposed on a carrier portion, the plurality of tape units and the carrier portion are integrally formed as a unitary structure.

7. The tape of claim 1, further comprising a carrier portion, wherein the at least one tape unit comprises a plurality of tape units disposed on a carrier portion, the carrier portion is a release paper.

8. The tape of claim 1, wherein the third surface of the second portion is adhesive, the base structure is made of a non-reactive adhesive material.

9. The tape of claim 1, wherein the tape is a tape, wherein the at least one tape unit can be used as a mold to form a cavity of a product.

10. The tape of claim 1, wherein the entire base structure is made of the flexible and compressible material.

11. The tape of claim 1, wherein the base structure is formed by injection molding or machining.

12. The tape of claim 1, wherein the tape is a thermal release tape that is easily peelable from an encapsulant at a temperature.

13. The tape of claim 1, wherein the tape is a double sided tape.

14. The tape of claim 1, wherein the second surface of the first portion horizontally overlaps the cavity.

15. The tape of claim 1, further comprising a carrier portion, wherein the at least one tape unit comprises a plurality of tape units disposed on the carrier portion, a gap between the first portions of the plurality of tape units is less than a gap between the second portions of the plurality of tape units.

16. An encapsulation process, comprising: (a) providing a substrate; (b) disposing at least one tape unit on the substrate, wherein the tape unit comprises a base structure having a first portion and a second portion, the first portion having a first surface, a second surface opposite the first surface, and a first side surface extending between the first surface and the second surface, the second portion protruding from the second surface and having a third surface opposite the first surface of the first portion and a second side surface extending between the second surface and the third surface, and wherein the first portion has an area greater than an area of the second portion as viewed from above, wherein the first portion and the second portion are integrally formed as a unitary structure without a boundary between the first portion and the second portion, the base structure is made of a flexible and compressible material, the base structure defines a cavity recessed from the first surface of the first portion, the cavity extending through the first portion of the base structure into the second portion; (c) forming an encapsulant around the tape unit; and (d) sucking and removing the tape unit with a vacuum nozzle to form a through hole extending through the encapsulant, wherein a vacuum channel of the vacuum nozzle communicates with the cavity of the base structure, and wherein the cavity facilitates a contraction of the at least one tape unit toward a center of the at least one tape unit during vacuum suction of the vacuum nozzle.

17. The process of claim 16, wherein after step (a), the process further comprises: (a1) electrically connecting at least one passive component to the substrate; wherein in (c), the encapsulant covers the passive component.

18. The process of claim 16, wherein in step (b), the third surface of the base structure contacts and adheres to a first surface of the substrate.

19. The process of claim 16, wherein the tape unit further comprises an adhesive layer disposed on the third surface of the second portion of the base structure, and in step (b), the tape unit adheres to the substrate through the adhesive layer.

20. The process of claim 16, wherein step (b) further comprises: ​ applying a mold to press the at least one tape element toward the first surface of the substrate such that the third surface of the base structure of the at least one tape element contacts the first surface of the substrate.

21. The process of claim 16, wherein in step (c) the encapsulant contacts the first side surface and the second surface of the first portion of the base structure of the tape element and contacts the second side surface of the second portion of the base structure of the tape element.

22. The process of claim 16, wherein in step (c) a top surface of the encapsulant is coplanar with the first surface of the first portion of the base structure.

23. The process of claim 22, wherein the encapsulant exposes the first surface of the first portion of the base structure.

24. The process of claim 23, wherein a maximum thickness of the encapsulant is equal to a maximum thickness of the base structure.

25. The process of claim 16, wherein in step (c) a first portion of the encapsulant surrounds the second side surface of the second portion of the base structure and a second portion of the encapsulant surrounds the first side surface of the first portion of the base structure.

26. The process of claim 25, wherein the first portion of the encapsulant contacts the second side surface of the second portion of the base structure and the second portion of the encapsulant contacts the first side surface of the first portion of the base structure.

27. The process of claim 25, wherein a thickness of the first portion of the encapsulant is equal to a thickness of the second portion of the base structure and a thickness of the second portion of the encapsulant is equal to a thickness of the first portion of the base structure.

28. The process of claim 16, wherein the perforations include an upper portion and a lower portion and a width of the upper portion is greater than a width of the lower portion.

29. The process of claim 16, wherein the tape element is a heat release tape and step (d) includes heating the tape element to a release temperature of the tape element and removing the tape element from the encapsulant at the release temperature, the arrangement of the cavities sufficient to transfer heat to the adhesive layer.

30. The process of claim 29, wherein the release temperature of the tape element is greater than a cure temperature of the encapsulant.

31. The process of claim 16, wherein the at least one tape element includes a plurality of tape elements disposed on a carrier portion, the process further comprising: (d) removing the plurality of tape elements and the carrier portion together to form a plurality of perforations extending through the encapsulant, wherein portions of the substrate are exposed from the perforations.

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