Solder ball welding ball supply structure and solder ball welding device

Abstract

The present invention discloses a tin ball welding ball supply structure and a tin ball welding device, which belong to the field of welding equipment. In the tin ball welding device of the present invention, the ball dividing disc is clamped between the lower body and the upper body, and is rotatably connected to the upper body and the lower body respectively, and a plurality of transport holes for transporting tin balls are provided on the ball dividing disc along the first circumferential line; a receiving groove is provided on the top wall of the upper body, and a feeding groove is provided at the bottom of the receiving groove along the first circumferential line. The feeding groove runs through the upper body, and one end of the feeding groove is spaced a certain distance from one end of the receiving groove to form a support platform in the receiving groove; a feeding channel is formed on the upper body, and the feeding channel is directly opposite to the platform surface of the support platform. In the tin ball welding ball supply structure of the present invention, the support platform can withstand the pressure generated by the accumulation of tin balls, reduce the pressure on the ball dividing disc, thereby reducing the wear of the ball dividing disc, which is conducive to improving the smoothness of rotation and maintaining the dynamic balance of rotation, thereby improving work efficiency.

Description

Technical Field

[0001] The invention relates to the field of welding equipment, and in particular to a solder ball welding ball supply structure and a solder ball welding device. Background Art

[0002] In the field of solder ball welding equipment, the solder ball welding equipment in the prior art generally includes an upper flange, a lower flange, and a rotating disk sandwiched between the upper and lower flanges. A ball supply cavity is generally provided in the upper flange and above the rotating disk. The solder balls are introduced into the ball supply cavity through a feed channel. Since transport holes are provided at intervals along a certain circumferential line on the rotating disk, the solder balls in the ball supply cavity fall into the transport holes and are transported to the welding position entrance by the rotating disk. The solder balls are continuously fed into the ball supply cavity by an external feeding device. The internal space of the ball supply cavity is limited. When the solder balls fill the ball supply cavity, since there is no barrier device between the ball supply cavity and the rotating disk, the continuously input solder balls directly squeeze the rotating disk, causing greater friction between the rotating disk and the lower flange, resulting in faster wear of the rotating disk, and also affecting the dynamic balance and smoothness of the rotation. When the size of the solder balls is large, it may even cause jamming. Summary of the invention

[0003] The present invention aims to solve one of the technical problems existing in the prior art. To this end, the present invention proposes a solder ball welding ball supply structure, in which the ball distribution disc is subjected to less pressure from the solder ball, which is beneficial to reducing the wear of the ball distribution disc and improving the smoothness and dynamic balance of rotation. The present invention also proposes a solder ball welding device.

[0004] The solder ball welding ball supply structure according to the first aspect of the present invention includes:

[0005] Lower body;

[0006] A ball-dividing disc, the ball-dividing disc is arranged on the lower body and is rotatably connected to the lower body, and the ball-dividing disc is provided with a plurality of transport holes for transporting solder balls at intervals along a first circumferential line;

[0007] A driving device, the driving device is used to drive the ball-distributing disc to rotate;

[0008] The upper body is arranged above the ball dividing disc and is rotatably connected to the ball dividing disc, the ball dividing disc is clamped between the lower body and the upper body, and the gaps between the upper body and the ball dividing disc and between the lower body and the ball dividing disc are all smaller than the diameter of the solder ball; a receiving groove is provided on the top wall of the upper body, and a feeding groove is provided at the bottom of the receiving groove along the first circumferential line direction, the feeding groove passes through the upper body, and one end of the feeding groove is spaced a certain distance from one end of the receiving groove so as to form a supporting platform in the receiving groove; a feeding channel is formed on the upper body, and the discharge port of the feeding channel faces the supporting platform.

[0009] The solder ball welding ball supply structure according to the embodiment of the present invention has at least the following beneficial effects:

[0010] The ball-dividing disc is arranged between the upper body and the lower body, and the driving device drives the ball-dividing disc to rotate. The tin balls are transported to the receiving tank by the external feeding device through the feeding joint, and some of the tin balls fall into the feeding trough and then enter the transport hole of the ball-dividing disc, and are transported to the entrance of the welding area by the rotating ball-dividing disc to carry out the next work process. The external feeding device works continuously, so the tin balls are continuously fed into the receiving tank. Since the discharge port of the feeding channel faces the supporting platform, the tin balls are first blocked by the platform surface of the supporting platform after entering the receiving tank from the feeding channel, and then dispersed to the other end of the receiving tank under the push of the tin balls coming in from behind, fall into the feeding trough and then fall into the transport hole of the ball-dividing disc, and are transported to the entrance of the welding position by the ball-dividing disc. The designed support platform can withstand the pressure of the solder balls falling from the feed channel and reduce the pressure of direct collision between the solder balls and the ball dividing disc. In addition, when the feed channel is full of solder balls, the platform surface of the support platform can withstand the pressure generated by the accumulation of solder balls. The accumulated solder balls are blocked by the platform surface of the support platform and can only be dispersed to the other end of the receiving groove and fall into the discharge groove and then fall into the transport hole, thereby avoiding the solder balls directly squeezing the ball dividing disc, causing the ball dividing disc to deform and rub against the lower body, reducing the wear of the ball dividing disc, improving the dynamic balance and smoothness of the rotation of the ball dividing disc, and improving work efficiency.

[0011] According to some embodiments of the present invention, a blocking device is provided in the receiving groove, the blocking device divides the receiving groove into a first cavity and a second cavity, the blocking device spans the discharge groove and is provided with a first opening near the discharge groove for solder balls to pass through.

[0012] According to some embodiments of the present invention, the blocking device is disposed adjacent to the supporting platform, and a distance between the blocking device and one end of the material discharge chute close to the supporting platform is smaller than a length of a platform surface of the supporting platform.

[0013] According to some embodiments of the present invention, the blocking device is disposed close to the supporting platform, and the upper body is integrally provided with the blocking device.

[0014] According to some embodiments of the present invention, the width and depth of the receiving groove are greater than the width and depth of the discharge groove.

[0015] According to some embodiments of the present invention, a feed connector is further included, wherein the feed connector is arranged on the upper body, the feed channel is arranged on the feed connector, a discharge port is opened on the bottom wall of the feed connector, a feed port is opened on one side wall of the feed connector, and the feed port, the feed channel and the discharge port are interconnected.

[0016] According to some embodiments of the present invention, a cover plate is provided on the upper body at the opening of the receiving groove.

[0017] According to some embodiments of the present invention, a chamfer is provided at an edge of the feed chute away from the ball dividing disc.

[0018] The solder ball welding device according to the second embodiment of the present invention includes the above-mentioned solder ball welding ball supply structure.

[0019] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0021] Figure 1 This is an exploded view of a solder ball welding ball supply structure according to an embodiment of the present invention.

[0022] Figure 2 A top view of a ball supply structure for solder ball welding in an embodiment of the present invention.

[0023] Figure 3 It is a three-dimensional diagram of a ball supply structure for solder ball welding in an embodiment of the present invention.

[0024] Figure 4 for Figure 2 Cross-section along the AA direction.

[0025] Figure 5 A three-dimensional diagram of a ball supply structure for solder ball welding from another perspective in an embodiment of the present invention.

[0026] Figure 6 It is a stereoscopic view of a feed connector in one embodiment of the present invention.

[0027] Figure Number:

[0028] Lower body 100;

[0029] Ball dividing disc 200; transport hole 201;

[0030] Upper body 300; containing tank 310; material discharge tank 320; supporting platform 330;

[0031] Blocking device 340; first opening 341;

[0032] Feed connector 400; feed port 410; discharge port 420;

[0033] Cover plate 500. DETAILED DESCRIPTION

[0034] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0035] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, left, right, front, back, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0036] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0037] According to the following Figures 1 to 6 The solder ball supply structure of the first embodiment of the present invention is described.

[0038] The solder ball welding ball supply structure of the present invention comprises:

[0039] Lower body 100;

[0040] The ball-distributing disc 200 is disposed on the lower body 100 and is rotatably connected to the lower body 100. The ball-distributing disc 200 is provided with a plurality of transport holes 201 for transporting solder balls at intervals along a first circumferential line;

[0041] A driving device, used for driving the ball-distributing disc 200 to rotate;

[0042] The upper body 300 is arranged above the ball dividing disc 200 and is rotatably connected to the ball dividing disc 200. The ball dividing disc 200 is clamped between the lower body 100 and the upper body 300. The gaps between the upper body 300 and the ball dividing disc 200 and between the lower body 100 and the ball dividing disc 200 are all smaller than the diameter of the solder ball. A receiving groove 310 is provided on the top wall of the upper body 300. A discharge groove 320 is provided at the bottom of the receiving groove 310 along the first circumferential line direction. The discharge groove 320 runs through the upper body 300, and one end of the discharge groove 320 is spaced a certain distance from one end of the receiving groove 310 to form a support platform 330 in the receiving groove 310. A feed channel is formed on the upper body 300, and the discharge port of the feed channel faces the support platform.

[0043] refer to Figure 1 , Figure 2 and Figure 5 The ball-distributing disc 200 is arranged between the upper body 300 and the lower body 100, and the driving device drives the ball-distributing disc 200 to rotate. The solder balls are transported to the receiving groove 310 by the external feeding device through the feeding joint 400, and some of the solder balls fall into the feeding trough 320 and then enter the transport hole 201 of the ball-distributing disc 200, and are transported to the welding zone entrance by the ball-distributing disc 200 to carry out the next step of the work process. The external feeding device works continuously, so the solder balls are continuously fed into the receiving groove 310. Since the discharge port of the feeding channel faces the supporting platform 330, the solder balls are first blocked by the platform surface of the supporting platform 330 after entering the receiving groove 310 from the feeding channel, and then dispersed to the other end of the receiving groove 310 under the push of the solder balls coming in from behind, fall into the feeding trough 320 and then fall into the transport hole 201 of the ball-distributing disc 200, and are transported to the welding position entrance by the ball-distributing disc 200. The support platform 330 is designed to withstand the pressure of the solder balls falling from the feed channel, and reduce the pressure of the direct collision between the solder balls and the ball dividing disc 200. In addition, when the feed channel is full of solder balls, the platform surface of the support platform 330 can withstand the pressure generated by the accumulation of solder balls. After the accumulated solder balls are blocked by the platform surface of the support platform 330, they can only disperse to the other end of the accommodating groove 310 and fall into the discharge groove 320 and then fall into the transport hole 201, thereby preventing the solder balls from directly squeezing the ball dividing disc 200, causing the ball dividing disc 200 to deform and come into frictional contact with the lower body 100, reducing the wear of the ball dividing disc 200, improving the dynamic balance and smoothness of the rotation of the ball dividing disc 200, and improving work efficiency.

[0044] In some embodiments of the present invention, a blocking device 340 is provided in the receiving groove 310, and the blocking device 340 divides the receiving groove 310 into a first cavity and a second cavity. The blocking device 340 spans the discharge groove 320 and is provided with a first opening 341 for solder balls to pass through near the discharge groove 320.

[0045] refer to Figure 3The blocking device 340 is provided to divide the accommodating groove 310 into a first cavity and a second cavity. The blocking device 340 spans the discharge groove 320 and has a first opening 341 for the solder balls to pass through near the discharge groove 320. When a large number of solder balls are accumulated in the feed connector 400, the solder balls are pressed against each other, and some of the solder balls can enter the second cavity through the first opening 341, and then enter the transport hole 201 of the ball dividing disc 200 through the discharge groove 320. In the prior art, there is also a ball supply cavity above the feed trough 320, but no baffle mechanism is provided. Since the cavity structure of the ball supply cavity is single, when the solder balls fill the ball supply cavity, the solder balls will be squeezed against each other and unable to move. When the ball dividing disc 200 rotates at high speed through the feed trough 320, the solder balls cannot fall into the transport hole 201 in time, resulting in a decrease in the supply and demand rate. In this embodiment, the baffle device 340 plays a separation role. Such a setting allows some solder balls to enter the second cavity through the first opening 341, reducing the occurrence of solder balls squeezing against each other, thereby reducing the density of solder balls in the second cavity, allowing the solder balls to fall smoothly into the transport hole 201, and improving the ball supply rate. In addition, such a setting can also prevent the solder balls from squeezing against each other too tightly, causing the solder balls at the bottom layer to be deformed or stuck in the gap between the ball dividing disc 200 and the upper body 300, and when the ball dividing disc 200 rotates at high speed, the solder balls at the bottom layer are cut.

[0046] In some embodiments of the present invention, the blocking device 340 is disposed adjacent to the support platform 330 , and the distance between the blocking device 340 and one end of the material discharge chute 320 close to the support platform 330 is smaller than the length of the platform surface of the support platform 330 .

[0047] refer to Figures 2 to 4 Such an arrangement allows the solder balls passing through the feed connector 400 to fall onto the platform surface of the support platform 330. In addition, such an arrangement can also make the length of the feed chute 320 on the side of the baffle device 340 close to the support platform 330 shorter, so that the number of solder balls accumulated on the ball dividing disc 200 in the first cavity is limited, reducing the pressure of the solder balls in the first cavity on the ball dividing disc 200, and at the same time allowing more solder balls to be dispersed into the second cavity through the opening, reducing the solder ball density in the first cavity, thereby reducing the wear of the ball dividing disc 200, and allowing the solder balls to fall into the transport hole 201 more easily.

[0048] In some embodiments of the present invention, the upper body 300 and the baffle 340 are integrally provided. Figure 1 , Figure 3 and Figure 4 The blocking device 340 is integrally formed with the upper body 300. Specifically, the upper body 300 can be directly cut and formed. Such a configuration can facilitate the processing and assembly of the blocking device 340.

[0049] In some embodiments of the present invention, the width and depth of the receiving groove 310 are greater than the width and depth of the feeding groove 320. Figure 4 The width and depth of the receiving groove 310 are greater than the width and depth of the feeding groove 320. This arrangement allows the pressure generated by the mutual squeezing of the solder balls to act more on the bottom of the receiving groove 310 when there are more solder balls in the receiving groove 310, thereby reducing the pressure on the ball dividing disc 200 caused by the accumulation of solder balls in the feeding groove, thereby reducing the wear of the ball dividing disc 200.

[0050] In some embodiments of the present invention, a feed connector 400 is further included. The feed connector 400 is arranged on the upper body 300, and a feed channel is arranged on the feed connector 400. A discharge port 420 is opened on the bottom wall of the feed connector 400, and a feed port 410 is opened on a side wall of the feed connector 400. The feed port 410, the feed channel and the discharge port 420 are interconnected.

[0051] refer to Figure 1 and Figure 6 The feed connector 400 is provided to realize temporary storage of solder balls, ensuring that the supply of solder balls is slightly greater than the transport capacity of solder balls transported by the ball-distributing disc 200, so as to ensure the normal supply of solder balls at the entrance of the welding area, and avoid the occurrence of false solder joints and fake solder joints. The solder balls are transported to the feed channel through the feed port 410 by the external conveying equipment, and the solder balls fall from the discharge port 420 onto the platform surface of the support platform 330 of the receiving tank 310, and then dispersed into the second cavity through the opening, and then slide into the feed tank and enter the transport hole 201 of the ball-distributing disc 200.

[0052] In some embodiments of the present invention, a cover plate 500 is disposed on the upper body 300 at the opening of the receiving groove 310 .

[0053] refer to Figure 1 By such a configuration, the external environment and the receiving groove 310 can be isolated, preventing dust and impurities in the external environment from falling into the receiving cavity and covering the solder ball, which is beneficial to keeping the solder ball clean and improving the soldering yield.

[0054] In some embodiments of the present invention, a chamfer is provided at the edge of the material discharge chute 320 away from the ball dividing disc 200 .

[0055] refer to Figure 4 The chamfer can play a guiding role, making it easier for the solder balls in the receiving groove 310 to slide into the feeding groove 320, which is beneficial to improving the ball supply rate and improving work efficiency.

[0056] The solder ball welding device according to the second embodiment of the present invention comprises the solder ball welding ball supply structure of the first embodiment of the present invention. In the solder ball welding device of the present invention, the ball dividing disc 200 is subjected to less impact force from the solder ball, which can reduce the friction force when the ball dividing disc 200 rotates, which is beneficial to improving the rotation balance and smoothness of the ball dividing disc 200 and improving the solder ball scoring efficiency.

[0057] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A solder ball welding ball supply structure, characterized in that: include: Lower body; A ball-dividing disc, the ball-dividing disc is arranged on the lower body and is rotatably connected to the lower body, and the ball-dividing disc is provided with a plurality of transport holes for transporting solder balls at intervals along a first circumferential line; A driving device, the driving device is used to drive the ball-distributing disc to rotate; The upper body is arranged above the ball dividing disc and is rotatably connected to the ball dividing disc, the ball dividing disc is clamped between the lower body and the upper body, and the gaps between the upper body and the ball dividing disc and between the lower body and the ball dividing disc are all smaller than the diameter of the solder ball; a receiving groove is provided on the top wall of the upper body, and a feeding groove is provided at the bottom of the receiving groove along the first circumferential line direction, the feeding groove passes through the upper body, and one end of the feeding groove is spaced a certain distance from one end of the receiving groove so as to form a supporting platform in the receiving groove; a feeding channel is formed on the upper body, and the discharge port of the feeding channel faces the supporting platform.

2. The solder ball welding ball supply structure according to claim 1, characterized in that: A baffle device is provided in the receiving groove, the baffle device divides the receiving groove into a first cavity and a second cavity, the baffle device spans the feed trough and is provided with a first opening for solder balls to pass through near the feed trough.

3. The solder ball welding ball supply structure according to claim 2, characterized in that: The blocking device is arranged adjacent to the supporting platform, and the distance between the blocking device and one end of the material discharge chute close to the supporting platform is less than the length of the platform surface of the supporting platform.

4. The solder ball welding ball supply structure according to claim 3, characterized in that: The upper body is integrally arranged with the baffle device.

5. The solder ball welding ball supply structure according to claim 1, characterized in that: The width and depth of the containing groove are greater than the width and depth of the feeding groove.

6. The solder ball welding ball supply structure according to claim 1, characterized in that: It also includes a feed connector, which is arranged on the upper body, the feed channel is arranged in the feed connector, a discharge port is opened on the bottom wall of the feed connector, a feed port is opened on one side wall of the feed connector, and the feed port, the feed channel and the discharge port are interconnected.

7. The solder ball welding ball supply structure according to claim 1, characterized in that: A cover plate is arranged on the upper body at the opening of the accommodating groove.

8. The solder ball welding ball supply structure according to claim 1, characterized in that: The edge of the material discharge trough away from the ball dividing disc is provided with a chamfer.

9. A solder ball welding device, characterized in that: The invention comprises the solder ball welding ball supply structure as described in any one of claims 1 to 8.

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