Method for manufacturing plate-shaped member and laminated body

Abstract

Provided is a method for manufacturing a plate-like member that can suppress shape defects of the plate-like member and improve yield. A method for manufacturing a plurality of plate-like components by cutting a base material (11) of the plate-like components, characterized in that it comprises: a step of preparing a base material (11) of the plate-like components having a first main surface (11a) and a second main surface (11b) opposite to each other; a step of forming dividing grooves (12a, 13a) on the first main surface (11a) of the base material (11) of the plate-like components; a step of pasting a supporting film (14) on the second main surface (11b) of the base material (11) of the plate-like components; a step of pasting an adhesive film (17) in a manner covering the first main surface (11a) of the base material (11) of the plate-like components; and a step of cutting the base material (11) of the plate-like components along the dividing grooves (12a, 13a) by pressing the area of ​​the base material (11) of the plate-like components where the dividing grooves (12a, 13a) are formed from the supporting film (14) side while the adhesive film (17) is pasted on the base material (11) of the plate-like components.

Description

Technical Field

[0001] The present invention relates to a method for producing a plate-like member such as a wavelength conversion member and a laminate used in the method for producing the plate-like member. Background Art

[0002] In recent years, as a next-generation light source to replace fluorescent lamps and incandescent lamps, light-emitting devices using LEDs or LDs have attracted attention. As an example of such a next-generation light source, a light-emitting device is disclosed that combines an LED that emits blue light with a wavelength conversion component that absorbs a portion of the light from the LED and converts it into yellow light. The light-emitting device emits white light that is a composite of blue light emitted from the LED and transmitted through the wavelength conversion component and yellow light emitted from the wavelength conversion component.

[0003] As a method for manufacturing a wavelength conversion component, a method of obtaining a plurality of wavelength conversion components at one time by singulating the base material of the wavelength conversion component is sometimes adopted. In the following patent document 1, as an example of such a method for manufacturing a wavelength conversion component, a method of obtaining a plurality of wavelength conversion components by forming dividing grooves of a grid-like pattern in the base material of the wavelength conversion component and singulating the divided grooves along the divided grooves is described. The singulation is performed by cutting the base material of the wavelength conversion component along the dividing grooves extending in one direction of the grid-like pattern and then cutting along the dividing grooves extending in the other direction.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent document 1: Japanese Patent Application Publication No. 2018-097060. Summary of the invention

[0007] Problems to be solved by the invention

[0008] When the base material of the plate-like component such as the wavelength conversion component is singulated, cracks are generated starting from the dividing groove and extending in the thickness direction of the base material of the plate-like component, thereby cutting the base material of the plate-like component. However, cracks may sometimes be generated starting from the dividing groove and extending in a direction deviating from the above-mentioned thickness direction. Therefore, there is a possibility that the plate-like component after singulation has a shape defect such as burrs.

[0009] An object of the present invention is to provide a method for manufacturing a plate-like member and a laminate used in the method for manufacturing a plate-like member, which can suppress shape defects of the plate-like member and improve the yield.

[0010] Technical solutions to the problem

[0011] The manufacturing method of a plate-like component of the present invention is a method for manufacturing a plurality of plate-like components by cutting a base material of the plate-like component, and is characterized in that it includes: a process of preparing a base material of the plate-like component having a first main surface and a second main surface relative to each other; a process of forming a dividing groove on the first main surface of the base material of the plate-like component; a process of pasting a supporting film on the second main surface of the base material of the plate-like component; a process of pasting an adhesive film in a manner covering the first main surface of the base material of the plate-like component; and a cutting process of cutting the base material of the plate-like component along the dividing groove by pressing the area of ​​the base material of the plate-like component where the dividing groove is formed from the supporting film side in a state where the adhesive film is pasted on the base material of the plate-like component.

[0012] Preferably, the dividing groove is a first dividing groove and a second dividing groove that intersect each other, and the cutting process includes: a first cutting process of cutting the base material of the plate-like component along the first dividing groove; and a second cutting process of cutting the base material of the plate-like component along the second dividing groove after the first cutting process. In this case, preferably, the first dividing groove is orthogonal to the second dividing groove.

[0013] Preferably, in the cutting step, the base material of the plate-like component is cut along the dividing groove by pressing the base material of the plate-like component from the supporting film side using a pressing member extending linearly and parallel to the first main surface of the base material of the plate-like component. In this case, preferably, in the cutting step, the base material of the plate-like component is supported from the adhesive film side using a supporting member having a slit, the base material of the plate-like component is pressed from the supporting film side using the pressing member, and the base material of the plate-like component is clamped by the supporting member and the pressing member, thereby cutting the base material of the plate-like component along the dividing groove.

[0014] Preferably, the support film has an area larger than the second main surface of the plate-like member base material in a plan view, and when the adhesive film is affixed to cover the first main surface of the plate-like member base material, the adhesive film is affixed to reach the support film from the first main surface.

[0015] The adhesive film is preferably a self-adhesive film.

[0016] It is preferred that an adhesive layer is provided on the surface of the supporting film, and the adhesive layer of the supporting film is bonded to the second main surface of the base material of the plate-shaped member.

[0017] It is preferred that the adhesive force of the adhesive film be lower than the adhesive force of the supporting film.

[0018] The plate-shaped member is preferably a wavelength conversion member in which phosphor particles are dispersed in an inorganic matrix.

[0019] The laminate of the present invention is a laminate used when a plurality of plate-like parts are manufactured by cutting a base material of a plate-like part, and is characterized in that it includes: a base material of the plate-like part, which has a first main surface and a second main surface opposite to each other, and a dividing groove is provided on the first main surface; a supporting film, which is adhered to the second main surface of the base material of the plate-like part; and an adhesive film, which is adhered in a manner covering the first main surface of the base material of the plate-like part.

[0020] Effects of the Invention

[0021] According to the present invention, it is possible to provide a method for manufacturing a plate-like member that can suppress shape defects of the plate-like member and improve the yield, and a laminate used in the method for manufacturing the plate-like member. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic front cross-sectional view showing an example of a plate-like member manufactured by the method for manufacturing a plate-like member of the present invention.

[0023] Figure 2 This is a schematic plan view showing a base material of a plate-like member in which first dividing grooves and second dividing grooves are formed, which is used in a method for manufacturing a plate-like member according to an embodiment of the present invention.

[0024] Figure 3 (a) and Figure 3 (b) is a schematic front cross-sectional view for explaining a manufacturing step of a laminated body in a method for manufacturing a plate-like member according to an embodiment of the present invention.

[0025] Figure 4 This is a schematic enlarged front cross-sectional view of a support film used in a method for producing a plate-like member according to an embodiment of the present invention.

[0026] Figure 5 This is a schematic enlarged front cross-sectional view of an adhesive film used in a method for producing a plate-shaped member according to an embodiment of the present invention.

[0027] Figure 6 This is a schematic enlarged front cross-sectional view showing a modified example of an adhesive film used in the method for producing a plate-shaped member according to an embodiment of the present invention.

[0028] Figure 7 (a)~ Figure 7 (d) is a schematic front cross-sectional view for explaining a cutting step in the method for manufacturing a plate-like member according to one embodiment of the present invention.

[0029] Figure 8 It is a schematic plan view showing an example of a shape defect of a plate-shaped member.

[0030] Fig. 9(a) and Fig. 9 (b) is a schematic front cross-sectional view for explaining a method for manufacturing a plate-like member according to a comparative example. DETAILED DESCRIPTION

[0031] Hereinafter, preferred embodiments will be described. However, the following embodiments are merely illustrative, and the present invention is not limited to the following embodiments. In addition, in each figure, components having substantially the same function are sometimes referred to by the same reference numerals.

[0032] (Plate-shaped parts)

[0033] Figure 1 This is a schematic front cross-sectional view showing an example of a plate-like member manufactured by the method for manufacturing a plate-like member of the present invention. Figure 1 The plate-like member shown is a rectangular plate-like wavelength conversion member 1 having a first main surface 1a and a second main surface 1b facing each other. The shape of the wavelength conversion member 1 is not limited to a rectangular plate shape.

[0034] The wavelength conversion member 1 is composed of phosphor particles 2 dispersed in an inorganic matrix 3. The phosphor particles 2 emit fluorescence by the incidence of excitation light A. Therefore, when the excitation light A is incident on the wavelength conversion member 1, the wavelength conversion member 1 emits a composite light B of the excitation light and the fluorescence.

[0035] The phosphor particles 2 are not particularly limited as long as they emit fluorescence by the incidence of excitation light. Specific examples of the phosphor particles 2 include, for example, one or more selected from oxide phosphors, nitride phosphors, oxynitride phosphors, chloride phosphors, oxychloride phosphors, sulfide phosphors, oxysulfide phosphors, halide phosphors, chalcogenide phosphors, chlorate phosphors, halophosphate compound phosphors, and garnet compound phosphors. When blue light is used as the excitation light, for example, a phosphor that emits green light, yellow light, or red light as fluorescence can be used.

[0036] The average particle size of the phosphor particles 2 is preferably 1 μm to 50 μm, more preferably 5 μm to 30 μm. When the average particle size of the phosphor particles 2 is too small, the luminous intensity may decrease. On the other hand, when the average particle size of the phosphor particles 2 is too large, the luminous color may be uneven.

[0037] The content of the phosphor particles 2 in the wavelength conversion component 1 is preferably 1% by volume or more, 1.5% by volume or more, particularly preferably 2% by volume or more, and preferably 70% by volume or less, 50% by volume or less, particularly preferably 30% by volume or less. When the content of the phosphor particles 2 is too small, the wavelength conversion component 1 needs to be formed thick in order to obtain the desired luminescent color, as a result, there is a case where the light extraction efficiency decreases due to increased internal scattering of the obtained wavelength conversion component. On the other hand, when the content of the phosphor particles 2 is too large, the wavelength conversion component 1 needs to be formed thin in order to obtain the desired luminescent color, so there is a case where the mechanical strength of the wavelength conversion component 1 decreases.

[0038] The inorganic material used in the inorganic matrix 3 is not particularly limited as long as it can be used as a dispersion medium for the phosphor particles 2. For example, glass can be used. As the glass used in the inorganic matrix 3, for example, borosilicate glass, phosphate glass, tin phosphate glass, bismuth glass, etc. can be used. As borosilicate glass, there can be cited glasses containing 30% to 85% SiO2, 0% to 30% Al2O3, 0% to 50% B2O3, 0% to 10% Li2O+Na2O+K2O and 0% to 50% MgO+CaO+SrO+BaO by mass%. As tin phosphate glass, there can be cited glasses containing 30% to 90% SnO and 1% to 70% P2O5 by mole%.

[0039] Reference Figure 1 As an example of a plate-like component manufactured by the manufacturing method of the plate-like component of the present invention, a wavelength conversion component is shown, but the plate-like component is not limited to the wavelength conversion component. As the plate-like component manufactured by the manufacturing method of the present invention, in addition to the wavelength conversion component, for example, a brittle material substrate composed of an inorganic material such as a glass plate or a ceramic plate or a plate-like semiconductor element can be listed.

[0040] [Method for manufacturing plate-shaped member]

[0041] Hereinafter, an example of a method for manufacturing a plate-like member according to an embodiment of the present invention will be described. In addition, the plate-like member in this embodiment is the plate-like wavelength conversion member described above.

[0042] (Step of producing laminated body)

[0043] Figure 2 This is a schematic plan view showing a base material of a plate-like member in which first dividing grooves and second dividing grooves are formed, which is used in a method for manufacturing a plate-like member according to an embodiment of the present invention. Figure 3 (a) and Figure 3(b) is a schematic front cross-sectional view for explaining a manufacturing step of a laminated body in a method for manufacturing a plate-like member according to an embodiment of the present invention. Figure 4 This is a schematic enlarged front cross-sectional view of a support film used in a method for producing a plate-like member according to an embodiment of the present invention. Figure 5 This is a schematic enlarged front cross-sectional view of an adhesive film used in a method for producing a plate-shaped member according to an embodiment of the present invention.

[0044] First, prepare Figure 2 The base material 11 of the wavelength conversion member is a rectangular plate-shaped base material 11 as shown. The base material 11 of the wavelength conversion member has a first main surface 11a and a second main surface 11b facing each other (see Figure 3 (a) in the figure). The base material 11 of the wavelength conversion component is composed of phosphor particles dispersed in an inorganic matrix. The base material 11 of the wavelength conversion component can be composed of the same material as the wavelength conversion component 1 described above. In addition, in addition to the base material 11 of the wavelength conversion component, the base material of the plate-like component may also be a brittle material substrate composed of an inorganic material such as a glass plate or a ceramic plate, or a plate-like semiconductor element, etc.

[0045] Then, if Figure 2 As shown, dividing grooves are formed on the first main surface 11a of the base material 11 of the wavelength conversion member. Specifically, first dividing grooves 12a and second dividing grooves 13a intersecting each other are formed. In this embodiment, the first dividing grooves 12a and the second dividing grooves 13a are orthogonal to each other.

[0046] Here, let the directions extending parallel to the first principal surface 11a of the base material 11 of the wavelength conversion component and orthogonal to each other be the x direction and the y direction. Let the direction orthogonal to the x direction and the y direction be the z direction. In the present embodiment, a plurality of first dividing grooves 12a extend along the y direction and are arranged in the x direction. On the other hand, a plurality of second dividing grooves 13a extend along the x direction and are arranged in the y direction. In addition, the first dividing groove 12a and the second dividing groove 13a are not necessarily orthogonal. In addition, only one of the first dividing groove 12a and the second dividing groove 13a may be provided. Alternatively, other dividing grooves different from the first dividing groove 12a and the second dividing groove 13 may be further provided.

[0047] In this embodiment, the pattern of the first dividing grooves 12a and the second dividing grooves 13a is formed in a grid shape. However, the pattern of the dividing grooves is not particularly limited, and a pattern corresponding to the shape of the plate-like member to be finally manufactured can be appropriately selected.

[0048] The depth of the first dividing groove 12a and the second dividing groove 13a is not particularly limited, and is preferably in the range of 0.1% to 10% of the thickness of the base material 11 of the wavelength conversion component, and more preferably in the range of 0.5% to 5%. When the depth of the dividing groove is too shallow, sometimes cutting using the dividing groove is difficult to perform. When the depth of the dividing groove is too deep, sometimes the load when forming the dividing groove is too large, so that the crack extends in an undesirable direction, and cutting cannot be performed in a direction perpendicular to the first main surface 11a.

[0049] The width of the first dividing groove 12a and the second dividing groove 13a is preferably 0.001 mm or more, more preferably 0.002 mm or more, and preferably 0.010 mm or less, more preferably 0.005 mm or less. When the width is too large, it may become a defective part when being cut. When the width is too small, cutting using the dividing groove may be difficult.

[0050] The first dividing groove 12a and the second dividing groove 13a are preferably formed by scribing. As a specific method for forming the first dividing groove 12a and the second dividing groove 13a, it can be appropriately selected according to the material of the inorganic matrix. When the inorganic matrix is ​​glass, it is preferably formed by a scribing needle using diamond particles or the like. In addition, the first dividing groove 12a and the second dividing groove 13a can also be formed by laser irradiation according to the material of the inorganic matrix.

[0051] Then, if Figure 3 As shown in (a) of FIG. 1 , a support film 14 is attached to the second main surface 11b side of the base material 11 of the wavelength conversion member. Figure 4 As shown, the supporting film 14 includes a supporting layer 14a and an adhesive layer 14b disposed on the supporting layer 14a.

[0052] In the present embodiment, the supporting layer 14a is made of a polyethylene film. However, the supporting layer 14a is not particularly limited, and can be made of an appropriate resin film. In addition, in the present embodiment, the adhesive layer 14b is made of an ultraviolet curing resin. As the ultraviolet curing resin, acrylic resin, epoxy resin, polyurethane resin, etc. can be used. However, the adhesive layer 14b can also be made of other resins, etc., without particular limitation. In the present embodiment, by pasting the adhesive layer 14b of the supporting film 14 on the second main surface 11b of the base material 11 of the wavelength conversion component, the supporting film 14 can be pasted to the base material 11 of the wavelength conversion component.

[0053] Then, if Figure 3As shown in (b) in FIG. 1 , an adhesive film 17 is pasted so as to cover the first main surface 11a of the base material 11 of the wavelength conversion component. In the present embodiment, the adhesive film 17 is pasted on the entire surface of the first main surface 11a. In the present invention, the adhesive film 17 only needs to be pasted on a portion of the first main surface 11a, and it is not necessarily pasted on the entire surface of the first main surface 11a. However, as described later, from the viewpoint of further suppressing the shape defects of the wavelength conversion component 1, it is preferred to paste the adhesive film 17 on the entire surface of the first main surface 11a.

[0054] In addition, in the present embodiment, the area of ​​the supporting film 14 is larger than the area of ​​the second main surface 11b of the plate-like member base material 11 when viewed from above. Furthermore, the adhesive film 17 is attached so as to extend from the first main surface 11a of the wavelength conversion member base material 11 to the supporting film 14. Therefore, the adhesive film 17 can be more reliably attached to the first main surface 11a.

[0055] like Figure 5 As shown, the adhesive film 17 is a film that has adhesiveness itself. Preferably, the adhesive force of the adhesive film 17 to the adherend such as a plate-like component is 1 g / 25 mm or more. In addition, the value of the adhesive force can be measured based on JIS-Z-0237. In this embodiment, the adhesive film 17 is made of polyvinyl chloride. However, the adhesive film 17 can also be made of other resins.

[0056] In addition, the adhesive film 17 may also be Figure 6 As shown in the modified example, the adhesive layer 17b includes a base layer 17a and an adhesive layer 17b laminated on the base layer 17a. As the base layer 17a, for example, polyethylene terephthalate or polyvinyl chloride can be used. In addition, as the adhesive layer 17b, there is no particular limitation, and an appropriate adhesive such as an acrylic adhesive or a rubber adhesive can be used, and the adhesive layer 17b can also be composed of an ultraviolet curing resin.

[0057] In this embodiment, a self-adhesive film is particularly used as the adhesive film 17. Self-adhesive means a property that the film can be attached to an adherend by its own weight without using any other adhesive and without pressing.

[0058] The adhesive force of the adhesive film 17 is more preferably 3 g / 25 mm or more, 5 g / 25 mm or more, 7 g / 25 mm or more, 9 g / 25 mm or more, 11 g / 25 mm or more, and particularly 13 g / 25 mm or more. In this case, the adhesive film 17 can be more reliably attached to the first main surface 11 a.

[0059] The thickness of the adhesive film 17 is preferably 0.01 to 1 mm, 0.05 to 0.5 mm, and particularly 0.1 to 0.2 mm. When the thickness of the adhesive film 17 is too small, the mechanical strength of the adhesive film 17 is reduced, and there is a possibility of damage during the cutting process, or insufficient fixation of the base material 11 of the wavelength conversion component. On the other hand, when the thickness of the adhesive film 17 is too large, the cutting accuracy is reduced, and the shape of the plate-like component is likely to be defective.

[0060] However, it is preferable that the adhesive force of the adhesive film 17 is lower than the adhesive force of the support film 14. In this case, the adhesive film 17 can be more easily peeled off from the first main surface 11a of the base material 11 of the wavelength conversion member.

[0061] From the viewpoint of more easily peeling the adhesive film 17 from the first main surface 11a of the base material 11 of the wavelength conversion component, the adhesive force of the adhesive film 17 is preferably 100 g / 25 mm or less, 50 g / 25 mm or less, and particularly preferably 30 g / 25 mm or less. In addition, when peeling the adhesive film 17 from the base material 11 of the wavelength conversion component, it is preferred that no smear is generated on the first main surface 11a of the base material 11 of the wavelength conversion component.

[0062] As described above, by attaching the adhesive film 17 so as to cover the first main surface 11 a of the base material 11 of the wavelength conversion member, it is possible to obtain the laminated body 10 which is an intermediate product when manufacturing the wavelength conversion member 1 .

[0063] (Cutting process)

[0064] Figure 7 (a)~ Figure 7 (d) is a schematic front cross-sectional view for explaining a cutting step in the method for manufacturing a plate-like member according to one embodiment of the present invention.

[0065] The cutting process has Figure 7 (a) and Figure 7 The first cutting step shown in (b) and Figure 7 (c) and Figure 7 The second cutting step shown in (d) in the embodiment. In the cutting step of this embodiment, a pressing member 18 and a support 19 are used. The pressing member 18 has a blade 18a extending linearly parallel to the first main surface 11a of the base material 11 of the wavelength conversion member. On the other hand, the support 19 has a slit 19a.

[0066] First, the first cutting process is performed. Figure 7As shown in (a) of FIG. 1 , the support body 19 is arranged in contact with the adhesive film 17. At this time, the support body 19 is arranged so that the slit 19a overlaps with the first dividing groove 12a to be cut when viewed from the adhesive film 17 side. On the other hand, the pressing member 18 is arranged at a position opposite to the first dividing groove 12a to be cut. At this time, the blade 18a of the pressing member 18 and the slit 19a of the support body 19 extend linearly in the y direction, respectively.

[0067] Next, in the state where the support body 19 is arranged as described above, the base material 11 of the wavelength conversion member is pressed from the support film 14 side by the blade 18a of the pressing member 18. In this way, the base material 11 of the wavelength conversion member is clamped and pressed by the support body 19 and the pressing member 18. Figure 7 As shown in (b) in FIG. 1 , a crack is extended in the thickness direction of the base material 11 of the wavelength conversion component from the first dividing groove 12a as a starting point. Thus, the base material 11 of the wavelength conversion component is cut along the first dividing groove 12a. In addition, a cut surface 12b is formed at this time.

[0068] Next, the pressing member 18 and the support body 19 are moved in the x direction to cut the base material 11 of the wavelength conversion member along the adjacent first dividing grooves 12a. By repeating this operation, the base material 11 of the wavelength conversion member is cut along all the first dividing grooves 12a arranged in the x direction.

[0069] Then, the second cutting process is performed. Figure 7 As shown in (c) of FIG. 1 , in the second cutting step, the blade 18a of the pressing member 18 and the slit 19a of the support body 19 are arranged so as to extend linearly in the x direction. By clamping the base material of the plate-like member using the support body 19 and the pressing member 18 in the same manner as in the first cutting step, Figure 7 As shown in (d) in FIG. 1 , cracks are extended in the thickness direction of the base material 11 of the wavelength conversion member starting from the second dividing groove 13a. Thus, the base material 11 of the wavelength conversion member is cut along the second dividing groove 13a.

[0070] Next, the pressing member 18 and the support body 19 are moved in the y direction to cut the base material 11 of the wavelength conversion member along the adjacent second dividing grooves 13a. By repeating this action, the base material 11 of the wavelength conversion member is cut along all the second dividing grooves 13a arranged in the y direction. Thus, the base material 11 of the wavelength conversion member is singulated into a plurality of wavelength conversion members 1.

[0071] Next, the adhesive film 17 is peeled off from the base material 11 of the wavelength conversion component and the support film 14. Then, UV light is irradiated to the support film 14, thereby ultraviolet curing the adhesive layer 14b of the support film 14. Then, the individualized wavelength conversion components 1 are peeled off from the support film 14. Through the above process, a plurality of wavelength conversion components 1 are obtained.

[0072] The present embodiment is characterized in that it includes a cutting step of cutting the base material 11 of the wavelength conversion component along the dividing groove in a state where the base material 11 of the wavelength conversion component is attached with an adhesive film 17. As a result, it is possible to suppress the shape defects of the wavelength conversion component 1 as a plate-like component, and it is possible to improve the yield. This is explained below by comparing the present embodiment with the comparative example. In addition, the manufacturing method of the comparative example is different from the present embodiment in that the adhesive film 17 is not used.

[0073] As the base material of the wavelength conversion component, a phosphor glass mother plate (50 mm × 50 mm × 0.2 mm, phosphor concentration 8.3 vol%) in which YAG phosphor powder is dispersed in a borosilicate glass matrix (softening point 850°C) is prepared. Using the base material of the wavelength conversion component, 2304 roughly square wavelength conversion components with a side of about 1 mm are produced using the manufacturing method of the present embodiment and the manufacturing method of the comparative example. In the present embodiment and the comparative example, the incidence of shape defects is compared. Here, the following is used. Figure 8 This shows an example of a bad shape.

[0074] Figure 8 1 is a schematic plan view showing an example of a shape defect of a wavelength conversion component. Figure 8 1 shows a state before the plurality of wavelength conversion components 1 are peeled off from the support film 14. Figure 8 As shown in the figure, when the wavelength conversion member 1 is viewed from the first principal surface 1a side, the portion where the outer peripheral edge of the second principal surface 1b protrudes outward from the outer peripheral edge of the first principal surface 1a is a burr C. The longest distance between the outer peripheral edge of the first principal surface 1a and the outer peripheral edge of the second principal surface 1b in the portion of the burr C is defined as the burr size D. When the burr size D is 20 μm or more, it is defined as a shape defect.

[0075] When the wavelength conversion component 1 is manufactured by the manufacturing method of the comparative example, the generation rate of shape defects is 30%. In contrast, when the wavelength conversion component is manufactured by the manufacturing method of the present embodiment (a polyvinyl chloride film with a thickness of about 0.12 mm and an adhesive force of 13 g / 25 mm is used as an adhesive film), the generation rate of shape defects is 0%. As can be seen, in the present embodiment, shape defects of the wavelength conversion component 1 as a plate-like component can be suppressed, and the yield rate can be improved. This is believed to be based on the following reasons.

[0076] like Fig. 9 As shown in (a) of FIG. 1 , in the comparative example, the base material 11 of the wavelength conversion component is cut along the first dividing groove 12a in the same manner as in the present embodiment except that the adhesive film 17 is not used. In the case of the comparative example, in the first cutting step, the monolithic bodies (short grid-shaped monolithic bodies) of the base material 11 of the wavelength conversion component are pressed against each other on the support body 19, thereby becoming easy to move, and there is a Fig. 9 As shown in (b) in FIG. 1 , the monolithic body of the base material 11 of the wavelength conversion component is displaced after cutting. In this case, after the first cutting step, the first main surface 11a is in a state of unevenness. When the second cutting step is performed in this state, the extension direction of the crack starting from the second dividing groove 13a is likely to deviate from the thickness direction of the base material 11 of the wavelength conversion component. As a result, in the comparative example, shape defects caused by burrs are likely to occur.

[0077] In contrast, in this embodiment, if Figure 3 As shown in (b) in FIG. 1 , a laminate 10 including a support film 14, a base material 11 of a wavelength conversion component, and an adhesive film 17 attached to the support film 14 and the base material 11 of the wavelength conversion component is formed. Then, a first cutting step is performed. Figure 7 As shown in (a) in the figure, the first cutting process is performed with the adhesive film 17 attached to the first main surface 11a of the base material 11 of the wavelength conversion component, so that the periphery of the first dividing groove 12a and the periphery of the cut surface 12b can be effectively fixed during cutting. Therefore, when the base material 11 of the wavelength conversion component is cut along the first dividing groove 12a to form the cut surface 12b, it is not easy to cause displacement of the single piece of the base material 11 of the wavelength conversion component around the cut surface 12b. Therefore, it is possible to suppress the occurrence of unevenness on the first main surface 11a of the base material 11 of the wavelength conversion component after the first cutting process.

[0078] In this embodiment, the wavelength conversion member is subjected to the treatment in a state where the first main surface 11a of the base material 11 has almost no irregularities. Figure 7 (c) and Figure 7 The second cutting step shown in (d) in FIG. Thus, when the base material 11 of the wavelength conversion component is cut along the second dividing groove 13a, the crack starting from the second dividing groove 13a can be more reliably extended in the thickness direction of the base material 11 of the wavelength conversion component. Therefore, the occurrence of shape defects can be effectively suppressed and the yield rate can be effectively improved.

[0079] Furthermore, in the present embodiment, in the first cutting step and the second cutting step, the first main surface 11a of the base material 11 of the wavelength conversion component is covered with the adhesive film 17. Thus, the base material 11 of the wavelength conversion component can be clamped and pressed by the support body 19 and the pressing member 18 without the support body 19 contacting the base material 11 of the wavelength conversion component. Therefore, it is difficult to cause damage to the first main surface 1a of the wavelength conversion component 1 after singulation.

[0080] Therefore, it is preferred that the entire surface of the base material 11 of the wavelength conversion component is covered with an adhesive film 17 in the first cutting step and the second cutting step as in the present embodiment. Thus, the first principal surface 11a can be more reliably protected when the base material 11 of the wavelength conversion component is clamped and pressed. Thus, the first principal surface 1a of the wavelength conversion component 1 after being singulated is less likely to be damaged. Furthermore, in the first cutting step, the periphery of the first dividing groove 12a and the periphery of the cut surface 12b can be further fixed. Thus, in the second cutting step of the base material 11 of the wavelength conversion component, displacement of the periphery of the cut surface 12b is less likely to occur. Therefore, the occurrence of shape defects of the wavelength conversion component 1 as a plate-like component can be further suppressed.

[0081] In addition, when the adhesive film 17 having self-adhesive properties is used, the portion bonded to the base material 11 of the wavelength conversion component has a tendency to be difficult to move in the shearing direction (a direction parallel to the first main surface 11a of the base material 11 of the wavelength conversion component). As a result, the periphery of the first dividing groove 12a and the periphery of the cutting surface 12b can be more reliably fixed in the first cutting step. Therefore, the occurrence of shape defects of the wavelength conversion component 1 as a plate-like component can be more reliably suppressed.

[0082] [Laminated body]

[0083] like Figure 3 As shown in (b) in the figure, the laminate 10 includes a base material 11 of a wavelength conversion component, a supporting film 14 and an adhesive film 17. The laminate 10 is an intermediate when manufacturing the above-mentioned wavelength conversion component 1. However, the base material 11 of the wavelength conversion component may also be a base material of other plate-like components. That is, it may also be an intermediate when manufacturing other plate-like components other than the wavelength conversion component 1. As other plate-like components, for example, a brittle material substrate made of an inorganic material such as a glass plate or a ceramic plate, or a plate-like semiconductor element, etc. can be listed. In this case, the base material of the above-mentioned plate-like component can be used instead of the base material 11 of the wavelength conversion component.

[0084] The base material 11 of the wavelength conversion component has a rectangular plate shape having a first main surface 11a and a second main surface 11b facing each other. The first dividing groove 12a and the second dividing groove 13a are provided on the first main surface 11a. The supporting film 14 is pasted on the second main surface 11b. In addition, the adhesive film 17 is pasted in a manner covering the first main surface 11a. In the present embodiment, the adhesive film 17 is pasted in a manner reaching the supporting film 14 from the first main surface 11a. However, in the present invention, it is sufficient that the adhesive film 17 is pasted on a part of the first main surface 11a, and it is not necessarily pasted in a manner reaching the supporting film 14. In addition, the same supporting film 14, the base material 11 of the wavelength conversion component, and the adhesive film 17 as used in the above-mentioned manufacturing method can be used.

[0085] When a plurality of plate-like members are manufactured by cutting such a laminate 10 , as described in the above-mentioned manufacturing method section, shape defects in the obtained plate-like member, namely, the wavelength conversion member 1 can be effectively suppressed, and the yield can be effectively improved.

[0086] Description of Reference Numerals

[0087] 1…Wavelength conversion component

[0088] 1a…First main surface

[0089] 1b…Second main surface

[0090] 2…Phosphor particles

[0091] 3…Inorganic matrix

[0092] 10…Laminated body

[0093] 11…Base material of wavelength conversion component

[0094] 11a…first main surface

[0095] 11b…Second main surface

[0096] 12a…first dividing groove

[0097] 12b…cutting surface

[0098] 13a...Second dividing groove

[0099] 14…Support film

[0100] 14a…Supporting layer

[0101] 14b…Adhesion layer

[0102] 17…Adhesive film

[0103] 17a…base material layer

[0104] 17b…Adhesion layer

[0105] 18…Pressing parts

[0106] 18a…Blade

[0107] 19…Support

[0108] 19a…Slit

Claims

1. A method for manufacturing a plurality of plate-like components by cutting a base material of the plate-like components, characterized in that: include: A step of preparing a base material of a plate-like member having a first main surface and a second main surface facing each other; a step of forming dividing grooves on the first main surface of the base material of the plate-like member by scribing; a step of attaching a supporting film to the second main surface of the base material of the plate-like member; a step of attaching an adhesive film so as to cover the first main surface of the base material of the plate-like member; and a cutting step of cutting the base material of the plate-like component along the dividing groove by pressing the area of ​​the base material of the plate-like component where the dividing groove is formed from the supporting film side in a state where the adhesive film is attached to the base material of the plate-like component, The plate-shaped component is a wavelength conversion component in which phosphor particles are dispersed in an inorganic matrix. The inorganic matrix is ​​glass, The adhesive film is a self-adhesive film. The adhesive force of the adhesive film is lower than the adhesive force of the supporting film.

2. The method for manufacturing a plate-like component according to claim 1, wherein: The dividing grooves are first dividing grooves and second dividing grooves that intersect each other, The cutting step includes: a first cutting step of cutting the base material of the plate-shaped member along the first dividing groove; and a second cutting step of cutting the base material of the plate-shaped member along the second dividing groove after the first cutting step.

3. The method for manufacturing a plate-like component according to claim 2, wherein: The first dividing grooves are orthogonal to the second dividing grooves.

4. The method for manufacturing a plate-like member according to any one of claims 1 to 3, characterized in that: In the cutting step, the base material of the plate-like member is cut along the dividing groove by pressing the base material of the plate-like member from the supporting film side using a pressing member extending linearly and parallel to the first main surface of the base material of the plate-like member.

5. The method for manufacturing a plate-like component according to claim 4, wherein: In the cutting process, while the base material of the plate-like component is supported from the adhesive film side using a supporting component having a slit, the base material of the plate-like component is pressed from the supporting film side using the pressing component, and the base material of the plate-like component is clamped between the supporting component and the pressing component, thereby cutting the base material of the plate-like component along the dividing groove.

6. The method for manufacturing a plate-like member according to any one of claims 1 to 3, characterized in that: In a plan view, the area of ​​the supporting film is larger than the area of ​​the second main surface of the base material of the plate-like member. When the adhesive film is attached so as to cover the first main surface of the base material of the plate-shaped member, the adhesive film is attached so as to reach the supporting film from the first main surface.

7. The method for manufacturing a plate-like member according to any one of claims 1 to 3, characterized in that: An adhesive layer is provided on the surface of the supporting film, The adhesive layer of the supporting film is bonded to the second main surface of the base material of the plate-shaped member.

8. A laminated body used when manufacturing a plurality of plate-like components by cutting a base material of the plate-like component, characterized in that: include: A base material of a plate-like component, which has a first main surface and a second main surface facing each other, and a dividing groove is provided on the first main surface; a supporting film adhered to the second main surface of the base material of the plate-like member; and an adhesive film attached so as to cover the first main surface of the base material of the plate-like member, The plate-shaped component is a wavelength conversion component in which phosphor particles are dispersed in an inorganic matrix. The inorganic matrix is ​​glass, The width of the dividing groove on the first main surface is 0.01 mm or less, The second main surface to which the supporting film is attached is a surface on the side to be pressed in order to cut the base material of the plate-like member. The adhesive film is a self-adhesive film. The adhesive force of the adhesive film is lower than the adhesive force of the supporting film.

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