A substrate leveling device for double-sided digital exposure

Abstract

The present invention discloses a substrate leveling device for double-sided digital exposure, which includes: a fixing mechanism and a suspension auxiliary support mechanism, wherein the fixing mechanism is used to perform preliminary positioning of the substrate; the suspension auxiliary support mechanism includes an eddy current component and a magnetic component, wherein the eddy current component interacts with the magnetic component to apply a supporting force perpendicular to the surface of the substrate. The present invention performs preliminary positioning of the substrate by a fixing mechanism to prevent the substrate from moving relative to the fixing mechanism, and then performs non-contact support on the substrate in the vertical direction by the suspension auxiliary support mechanism, thereby improving the flatness of the substrate surface, thereby effectively ensuring the consistency between the exposure surface of the substrate and the focal plane of the exposure lens, and greatly improving the core indicators such as the exposure pattern resolution and alignment accuracy; in addition, the substrate leveling device also has the advantages of simple structure, easy processing, and low cost.

Description

Technical Field

[0001] The invention relates to the field of digital photolithography, and in particular to a substrate leveling device for double-sided digital exposure. Background Art

[0002] Laser direct imaging technology refers to the use of data directly output by the CAM workstation to drive the laser imaging device to perform pattern exposure on a substrate coated with photoresist. The flatness of the substrate is crucial to the quality of the exposed pattern. Specifically, the decrease in the flatness of the substrate will cause the substrate to deviate from the focal plane of the exposure lens, thereby reducing the resolution, alignment accuracy and other indicators of the exposed pattern, resulting in poor exposure. Especially in double-sided exposure laser direct imaging equipment, both sides of the substrate need to be exposed at the same time. In order not to block the light path, the common practice is to tighten or support the substrate at both ends. However, the substrate is not an ideal rigid structure. For example, under the action of gravity, the middle of the printed circuit board will sink, and the extent of the sinking depends on its own weight, rigidity and the tension of the two ends. The longer and softer the substrate is, the tension required to ensure that the substrate is within the effective range of the focal plane often exceeds the limit of the equipment. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a substrate leveling device for double-sided digital exposure, which realizes non-contact support for the exposed substrate.

[0004] According to an embodiment of the present invention, a substrate leveling device for double-sided digital exposure includes: a fixing mechanism and a suspension auxiliary support mechanism, wherein the fixing mechanism is used to preliminarily position the substrate; the suspension auxiliary support mechanism includes an eddy current component and a magnetic component, wherein the eddy current component interacts with the magnetic component to apply a supporting force perpendicular to the surface of the substrate.

[0005] The substrate leveling device for double-sided digital exposure according to the above embodiment of the present invention has at least the following beneficial effects: first, the substrate is preliminarily positioned by a fixing mechanism to prevent the substrate from moving relative to the fixing mechanism, and then the substrate is non-contactly supported in the vertical direction by a suspended auxiliary support mechanism, thereby improving the flatness of the substrate surface, thereby effectively ensuring the consistency between the exposure surface of the substrate and the focal plane of the exposure lens, and greatly improving core indicators such as exposure graphic resolution and alignment accuracy; in addition, the substrate leveling device also has the advantages of simple structure, easy processing, and low cost.

[0006] According to some embodiments of the present invention, the fixing mechanism includes a tensioning mechanism and / or a supporting mechanism.

[0007] According to some embodiments of the present invention, the substrate flattening device for double-sided digital exposure further includes a detection feedback mechanism for detecting the flatness of the substrate surface and adjusting the magnitude of the supporting force according to the flatness.

[0008] According to some embodiments of the present invention, the eddy current component includes an eddy current coil arranged on the substrate and located at the periphery of the exposure area, and an input contact connected to the eddy current coil, the eddy current coil is symmetrically distributed along the center of the substrate, the input contact is electrically connected to the detection feedback mechanism, and the magnetic component is arranged directly above and / or directly below the center of the substrate.

[0009] According to some embodiments of the present invention, the eddy current coil is manufactured by using a spatial projection imaging maskless photolithography technique.

[0010] According to some embodiments of the present invention, the eddy current coil is manufactured by an FPC manufacturing process.

[0011] According to some embodiments of the present invention, the eddy current coil is assembled by hot embossing technology.

[0012] According to some embodiments of the present invention, the magnetic component includes a permanent magnet and / or an electromagnet arranged on the substrate and located at the periphery of the exposure area, the magnetic field generated by the permanent magnet and / or the electromagnet is symmetrically distributed along the center of the substrate, the eddy current component is arranged directly above and / or directly below the center of the substrate, and the eddy current component is electrically connected to the detection feedback mechanism.

[0013] According to some embodiments of the present invention, the magnetic component includes at least one group of permanent magnets arranged in the center of the substrate, the magnetic field generated by the permanent magnets is symmetrically distributed along the center of the substrate, the eddy current component is arranged directly above and / or directly below the center of the substrate, the eddy current component is connected to the detection feedback mechanism, and the permanent magnet is a transparent structure.

[0014] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0016] Figure 1 A top view of an embodiment of the present invention;

[0017] Figure 2 It is a front view of an embodiment of the present invention.

[0018] Reference numerals:

[0019] The substrate 100 , the fixing mechanism 200 , the suspension auxiliary support mechanism 300 , the eddy current component 310 , the magnetic component 320 , the eddy current coil 311 , and the input contact 312 . DETAILED DESCRIPTION

[0020] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0021] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0022] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0023] refer to Figure 1 and Figure 2 , is a substrate leveling device for double-sided digital exposure according to an embodiment of the present invention, which includes: a fixing mechanism 200 and a suspension auxiliary support mechanism 300.

[0024] During exposure, the fixing mechanism 200 performs preliminary positioning on the substrate 100 to prevent the substrate 100 from moving relative to the fixing mechanism 200 .

[0025] The suspension auxiliary support mechanism 300 includes an eddy current component 310 and a magnetic component 320. When the eddy current component 310 is powered on during operation, a magnetic field is generated around it and interacts with the magnetic field generated by the magnetic component 320, thereby generating an upward supporting force applied perpendicular to the surface of the substrate 100, so that the flatness of the surface of the substrate 100 meets the exposure requirements.

[0026] In some embodiments of the present invention, the fixing mechanism 200 includes a tensioning mechanism and / or a supporting mechanism. When the rigidity of the substrate 100 is sufficient, the sagging degree of the middle part thereof is within the range allowed by exposure, and it is no longer appropriate to apply a tensioning force. In this case, it is only necessary to set a supporting mechanism to fix the edge of the substrate 100. When the rigidity of the substrate 100 is insufficient, the sagging degree of the middle part thereof exceeds the range allowed by exposure. In this case, it is necessary to set a tensioning mechanism to apply a tensioning force parallel to the surface of the substrate 100 to the edge of the substrate 100 to control the sagging degree of the middle part of the substrate 100. Of course, in some cases, a tensioning mechanism and a supporting mechanism can also be set at the same time to support and tension at different positions of the substrate 100.

[0027] In some embodiments of the present invention, the substrate flattening device for double-sided digital exposure further includes a detection feedback mechanism for detecting the flatness of the surface of the substrate 100 and adjusting the magnitude of the supporting force according to the flatness, so that the flatness of the substrate 100 is within the range allowed by the exposure process. Specifically, the detection feedback mechanism can be composed of a flatness detector and a controller, and the controller adjusts the working current of the eddy current component 310 according to the data fed back by the flatness detector, thereby achieving the purpose of changing the magnitude of the supporting force.

[0028] In some embodiments of the present invention, Figure 1 As shown, the eddy current assembly 310 includes an eddy current coil 311 disposed on the substrate 100 and located at the periphery of the exposure area, and an input contact 312 connected to the eddy current coil 311. The eddy current coil 311 is located at the periphery of the exposure area so that it does not block the exposure light path. The eddy current coils 311 are symmetrically distributed along the center of the substrate 100 so that the magnetic field generated by them is evenly distributed. The input contact 312 is electrically connected to a detection feedback mechanism, which detects the flatness of the surface of the substrate 100. When the flatness of the substrate 100 is not within the allowable range of the exposure process, the detection feedback mechanism adjusts the input current of the input contact 312, thereby achieving the purpose of adjusting the size of the supporting force. Figure 2 As shown, the magnetic assembly 320 is disposed just above and / or just below the center of the substrate 100 , so that the magnetic force acting on the substrate 100 is more uniform.

[0029] In some embodiments of the present invention, the eddy current coil 311 is further formed by spatial projection imaging maskless photolithography technology, so that it becomes a part of the substrate 100, and when used, only the corresponding input contact 312 needs to be led out. This method can greatly improve the consistency of its electrical performance parameters, increase its electromagnetic coupling degree, and reduce its distributed capacitance.

[0030] In some embodiments of the present invention, further, the eddy current coil 311 is manufactured by an FPC manufacturing process, and has the characteristics of light weight, thin thickness, and good bendability, and can be directly attached to the surface of the substrate 100 by pasting.

[0031] In some embodiments of the present invention, further, the eddy current coil 311 is assembled by hot stamping technology. According to the actual process and the stress conditions of the substrate 100, coils of various standard specifications are produced, and then formed on the substrate 100 by hot stamping technology, and finally the input contact 312 is led out thereon, which can greatly reduce the production cost.

[0032] In some embodiments of the present invention, the magnetic component 320 includes a permanent magnet and / or an electromagnet disposed on the substrate 100 and located at the periphery of the exposure area. The magnetic field generated by the permanent magnet and / or the electromagnet is symmetrically distributed along the center of the substrate 100. The eddy current component 310 is disposed directly above and / or below the center of the substrate 100, and the eddy current component 310 is electrically connected to the detection feedback mechanism.

[0033] In some embodiments of the present invention, the magnetic component 320 includes at least one group of permanent magnets arranged at the center of the substrate 100, and the magnetic field generated by the permanent magnets is symmetrically distributed along the center of the substrate 100. The eddy current component 310 is arranged directly above and / or directly below the center of the substrate 100. The eddy current component 310 is connected to the detection feedback mechanism, and the permanent magnet is made of transparent magnetic material to form a transparent structure so that it does not block the exposure light path.

[0034] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0035] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A substrate leveling device for double-sided digital exposure, characterized in that: include: A fixing mechanism (200) for performing preliminary positioning of the substrate (100); A suspension auxiliary support mechanism (300) comprising an eddy current component (310) and a magnetic component (320), wherein the eddy current component (310) and the magnetic component (320) interact with each other to exert a support force perpendicular to the surface of the substrate (100); A detection feedback mechanism for detecting the flatness of the surface of the substrate (100) and adjusting the magnitude of the supporting force according to the flatness; The eddy current component (310) comprises an eddy current coil (311) arranged on the substrate (100) and located at the periphery of the exposure area, and an input contact (312) connected to the eddy current coil (311), the eddy current coil (311) being symmetrically distributed along the center of the substrate (100), the input contact (312) being electrically connected to the detection feedback mechanism, and the magnetic component (320) being arranged directly above and / or directly below the center of the substrate (100); The magnetic component (320) comprises a permanent magnet and / or an electromagnet arranged on the substrate (100) and located at the periphery of the exposure area, the magnetic field generated by the permanent magnet and / or the electromagnet is symmetrically distributed along the center of the substrate (100), the eddy current component (310) is arranged directly above and / or directly below the center of the substrate (100), and the eddy current component (310) is electrically connected to the detection feedback mechanism.

2. The substrate leveling device for double-sided digital exposure according to claim 1, characterized in that: The fixing mechanism (200) comprises a tensioning mechanism and / or a supporting mechanism.

3. The substrate leveling device for double-sided digital exposure according to claim 1, characterized in that: The eddy current coil (311) is manufactured and formed by using a spatial projection imaging maskless photolithography technology.

4. The substrate leveling device for double-sided digital exposure according to claim 1, characterized in that: The eddy current coil (311) is manufactured and formed by an FPC manufacturing process.

5. The substrate leveling device for double-sided digital exposure according to claim 1, characterized in that: The eddy current coil (311) is assembled by means of hot stamping technology.

6. The substrate leveling device for double-sided digital exposure according to claim 1, characterized in that: The magnetic component (320) comprises at least one group of permanent magnets arranged at the center of the substrate (100), the magnetic field generated by the permanent magnets being symmetrically distributed along the center of the substrate (100), the eddy current component (310) being arranged directly above and / or directly below the center of the substrate (100), the eddy current component (310) being connected to the detection feedback mechanism, and the permanent magnet being a transparent structure.

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