A semiconductor grinding machine large plate groove cleaning device with balanced gravity

Abstract

The invention provides a semiconductor grinding machine disc groove cleaning device with balanced gravity, including a disc and a cleaning device for cleaning the disc, the cleaning device including a mounting frame, a cleaning component mounted on the mounting frame, and a curved saw for controlling the cleaning component to clean; the cleaning component includes a tool, the tool is slidably mounted on the mounting frame through a connecting block, and the curved saw drives the connecting block to drive the tool to reciprocate to clean the disc. The cleaning device described in the invention can clean the residue on the disc groove of the grinding machine, adopts a semi-automatic cleaning method, saves labor and improves work efficiency, and effectively avoids blade damage to the disc, and is suitable for cleaning the disc groove of the semiconductor grinding machine.

Description

Technical Field

[0001] The invention belongs to the field of semi-automatic cleaning equipment for the grooves of a semiconductor grinding machine, and in particular relates to a semiconductor grinding machine groove cleaning device with balanced gravity. Background Art

[0002] In the field of semiconductor silicon single crystal manufacturing, when the grinding machine grinds silicon wafers, solid residues such as silicon materials, grinding fluid and cast iron are generated, and these residues solidify inside the grid-shaped grooves of the large plate. It takes 4h-8h to clean the residues in each groove manually by pushing and pulling the scraper back and forth many times (cleaning once a week), which is time-consuming and laborious. In order to meet the requirements of saving working hours and manpower, it is necessary to design a small groove cleaning tool. In the existing technology, the method of cleaning the grooves of the large plate generally includes the following steps: manually using a handheld scraper, manually driving the scraper to reciprocate, and cleaning the residues in the grooves. The disadvantage of the existing groove cleaning technology is that manual cleaning of the grooves is time-consuming and labor-intensive, and the cleaning is not clean, and even scratches the large plate. By designing this cleaning tool, manpower can be saved, work efficiency can be improved, and the large plate can be effectively prevented from being scratched. It can be seen that efficient cleaning of the groove residues of the large plate has very important application value in the semiconductor material industry. Summary of the invention

[0003] In view of this, the invention aims to provide a semiconductor grinding machine large disk groove cleaning device with balanced gravity to solve the problem of large disk groove cleaning.

[0004] To achieve the above object, the technical solution created by the present invention is implemented as follows:

[0005] A semiconductor grinding machine large disc groove cleaning device with balanced gravity, comprising a large disc and a cleaning device for cleaning the large disc, wherein the cleaning device comprises a mounting frame, a cleaning component mounted on the mounting frame, and a jigsaw for controlling the cleaning component to perform cleaning;

[0006] The cleaning assembly comprises a cutter, and the cutter is slidably mounted on a mounting frame through a connecting block. The jigsaw drives the connecting block to drive the cutter to perform reciprocating motion to clean the large plate.

[0007] Furthermore, the mounting frame includes a first support plate and a second support plate. The first support plate and the second support plate have the same shape, both are L-shaped. The first support plate and the second support plate are connected by a plurality of pillars. A mounting seat is provided on the side wall of the curved saw, and the mounting seat is fixed to the first support plate and the second support plate by bolts.

[0008] Furthermore, a connecting plate is installed between the first support plate and the second support plate, and two groups of linear bearings are installed on the connecting plate. The cleaning assembly also includes a driving frame, and the driving frame includes a first connecting block and two groups of first guide rods. One end of the two groups of first guide rods is vertically fixed on the side wall of the first connecting block, and the other ends of the two groups of first guide rods pass through the two groups of linear bearings respectively. One of the guide rods passes through one of the linear bearings and is connected to the jigsaw through a fisheye joint, and the other guide rod passes through the other linear bearing and is connected to the second connecting block.

[0009] Furthermore, a linear guide rail is provided on the side wall of the second support plate, a sliding block corresponding to the linear guide rail is provided on the side wall of the second connecting block, and one side of the second connecting block is slidably mounted on the linear guide rail.

[0010] Furthermore, two through holes are provided at the bottom of the second connecting block, and second guide rods are respectively installed in the two through holes, one end of the two groups of second guide rods is connected to the third connecting block, and the other ends of the two groups of second guide rods are connected to the mounting seat of the tool, and springs are respectively passed through the two groups of second guide rods, one end of the spring is fixed on the third connecting block, and the other end of the spring is fixed on the second connecting block.

[0011] Furthermore, a guide wheel group is installed between the first support plate and the second support plate. The guide wheel group includes two sets of guide wheel brackets and two guide wheels. The two guide wheels are rotatably installed on the two sets of guide wheel brackets respectively. The two sets of guide wheels are respectively located on the front and rear sides of the tool.

[0012] Compared with the prior art, the semiconductor grinding machine large plate groove cleaning device created by the present invention has the following advantages:

[0013] The large disk groove cleaning device created by the present invention adopts a semi-automatic cleaning method, which saves labor and improves work efficiency, effectively avoids blade damage to the large disk, and is suitable for cleaning the large disk grooves of semiconductor grinding machines. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The drawings constituting part of the present invention are used to provide a further understanding of the present invention. The exemplary embodiments and descriptions of the present invention are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0015] Figure 1 A diagram showing the connection structure between the large tray and the cleaning device according to an embodiment of the present invention;

[0016] Figure 2 The overall structure diagram of the cleaning device described in the embodiment of the present invention;

[0017] Figure 3 This is a partial structural diagram of the cleaning equipment described in the embodiment of the present invention.

[0018] Description of reference numerals:

[0019] 1. Large plate; 2. Cleaning equipment; 3. Mounting frame; 31. First support plate; 32. Second support plate; 4. Curve saw; 41. Mounting table; 5. Cleaning assembly; 51. First connecting block; 52. First guide rod; 53. Fisheye joint; 54. Second connecting block; 55. Buffer assembly; 551. Third connecting block; 552. Second guide rod; 56. Tool; 321. Linear guide rail; 6. Linear bearing; 7. Guide wheel assembly; 71. Guide wheel bracket; 72. Guide wheel; 8. Connecting plate. DETAILED DESCRIPTION

[0020] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0021] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0022] In the description of the invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the invention can be understood according to specific circumstances.

[0023] The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0024] like Figure 1 to Figure 2As shown, a semiconductor grinding machine large disc 1 groove cleaning device 2 with balanced gravity includes a large disc 1 and a cleaning device 2 for cleaning the large disc 1, wherein the cleaning device 2 includes a mounting frame 3, a cleaning component 5 mounted on the mounting frame 3, and a jigsaw 4 for controlling the cleaning component 5 to perform cleaning;

[0025] The cleaning assembly 5 includes a cutter 56 , which is slidably mounted on the mounting frame 3 via a connecting block. The jigsaw 4 drives the connecting block to drive the cutter 56 to perform a reciprocating motion to clean the large plate 1 .

[0026] like Figure 2 As shown, the mounting frame 3 includes a first support plate 31 and a second support plate 32. The first support plate 31 and the second support plate 32 are of the same shape, both of which are L-shaped. The first support plate 31 and the second support plate 32 are connected by a plurality of pillars. A mounting seat is provided on the side wall of the jigsaw 4, and the mounting seat is fixed to the first support plate 31 and the second support plate 32 by bolts.

[0027] like Figure 3 As shown, a connecting plate 8 is installed between the first support plate 31 and the second support plate 32, and two groups of linear bearings 6 are installed on the connecting plate 8. The cleaning assembly 5 also includes a driving frame, and the driving frame includes a first connecting block 51 and two groups of first guide rods 52. One end of the two groups of first guide rods 52 is vertically fixed on the side wall of the first connecting block 51, and the other ends of the two groups of first guide rods 52 pass through the two groups of linear bearings 6 respectively. One of the guide rods passes through one of the linear bearings 6 and is connected to the jigsaw 4 through a fisheye joint 53; the other guide rod passes through the other linear bearing 6 and is connected to the second connecting block 54.

[0028] A linear guide rail 321 is disposed on the side wall of the second support plate 32 , a sliding block corresponding to the linear guide rail 321 is disposed on the side wall of the second connection block 54 , and one side of the second connection block 54 is slidably mounted on the linear guide rail 321 .

[0029] like Figure 1 , Figure 2 As shown, the jigsaw 4 adopts the existing jigsaw 4, and utilizes the reciprocating principle of the existing jigsaw 4 to drive the first guide rod 52 to perform linear motion, and the first guide rod 52 drives the second connecting block 54 to perform linear motion on the linear guide rail 321, thereby realizing the tool 56 to clean the large plate 1, and the stability of the tool 56 movement during cleaning.

[0030] like Figure 3As shown, two through holes are provided at the bottom of the second connecting block 54, and second guide rods 552 are respectively installed in the two through holes, one end of the two groups of second guide rods 552 is connected to the third connecting block 551, and the other ends of the two groups of second guide rods 552 are connected to the mounting seat of the tool 56, and springs are respectively passed through the two groups of second guide rods 552, one end of the spring is fixed on the third connecting block 551, and the other end of the spring is fixed to the second connecting block 54.

[0031] The tool 56 is rotatably mounted on the tool 56 mounting seat, and the mounting structure adopts the existing rotating structure, which will not be described in detail here. When the tool 56 cleans the large plate 1, due to the different groove depths of the large plate 1, the buffer assembly 55 is used for buffering to prevent the tool 56 from damaging the large plate 1. When the tool 56 encounters a shallow groove, the tool 56 is pushed upward, the second guide rod 552 moves upward, and the third connecting block 551 pulls the spring. When encountering a deeper groove, the second guide rod 552 moves downward, and the third connecting block 551 compresses the spring, so that the tool 56 can adapt to grooves of different depths.

[0032] like Figure 3 As shown, a guide wheel group 7 is also installed between the first support plate 31 and the second support plate 32. The guide wheel group 7 includes two groups of guide wheel brackets 71 and two guide wheels 72. The two guide wheels 72 are rotatably installed on the two groups of guide wheel brackets 71 respectively. The two groups of guide wheels 72 are respectively located on the front and rear sides of the tool 56.

[0033] The two sets of guide wheels 72 are used to guide and support the cutter 56 to prevent the cutter 56 from scratching the large plate 1.

[0034] The details are as follows:

[0035] The lower end of the guide rail guide mechanism is equipped with a fisheye joint, a linear bearing and a linear guide rail, which are used to drive the tool to reciprocate and clean the residue in the groove.

[0036] The tooling roller guide mechanism has two guide wheels fixed on both sides of the tool, one of which is to achieve guidance during the tool movement process, and the other is to support the entire tooling to move smoothly on the tool disc, thereby saving effort.

[0037] In the tool lifting device, the guide rod 3 is connected to the linear bearing, on which a spring is installed, and the groove residues are cleared by elastic force and impact force to achieve the purpose of labor saving. In addition, the spring is installed to clean the groove residues of different depths.

[0038] The large disc groove cleaning tool is used for cleaning groove residues, and its characteristics are as follows: 1. The center of gravity is located at the center of the structure, so that manual operation will be more labor-saving; 2. It is light in weight, compact in structure, occupies little space, and is more convenient for manual operation.

[0039] The technical solutions adopted are as follows:

[0040] A device for cleaning grooves of a semiconductor grinding machine disk with balanced gravity is provided, comprising the following steps

[0041] 1. Manually place the tool into the groove.

[0042] 2. Press the start button manually, the jigsaw moves, drives the guide rod to move, drives the tool to move, and starts to clean the residue in the large plate groove.

[0043] 3. After the entire groove is cleaned, manually press the stop button, remove the tool from the groove, and then put it into another groove, and repeat the above operations in sequence.

[0044] The beneficial effect of the invention is that the semiconductor grinding machine large plate groove cleaning device with balanced gravity created by the invention can realize semi-automatic cleaning of large plate groove residues, effectively avoid the disadvantage of scratching the large plate, save manpower and improve work efficiency.

[0045] Finally, it should be noted that the above examples are only specific embodiments of the present invention. Obviously, the present invention is not limited to the above examples, and there are many variations. All variations that can be directly derived or associated by a person skilled in the art from the contents disclosed in the present invention should be considered as the protection scope of the present invention.

[0046] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor grinding machine disc groove cleaning device with balanced gravity, comprising a disc (1), and a cleaning device (2) for cleaning the disc (1), characterized in that: The cleaning device (2) comprises a mounting frame (3), a cleaning component (5) mounted on the mounting frame (3), and a jigsaw (4) for controlling the cleaning component (5) to perform cleaning; The cleaning assembly (5) comprises a cutter (56), and the cutter (56) is slidably mounted on the mounting frame (3) via a connecting block, and the jigsaw (4) drives the connecting block to drive the cutter (56) to perform a reciprocating motion to clean the large plate (1); The mounting frame (3) comprises a first supporting plate (31) and a second supporting plate (32); the first supporting plate (31) and the second supporting plate (32) are of the same shape, both of which are L-shaped; the first supporting plate (31) and the second supporting plate (32) are connected via a plurality of pillars; a mounting seat is provided on the side wall of the jigsaw (4); the mounting seat is fixed to the first supporting plate (31) and the second supporting plate (32) via bolts; A connecting plate (8) is installed between the first supporting plate (31) and the second supporting plate (32), and two groups of linear bearings (6) are installed on the connecting plate (8). The cleaning assembly (5) also includes a driving frame, and the driving frame includes a first connecting block (51) and two groups of first guide rods (52). One end of the two groups of first guide rods (52) are respectively vertically fixed on the side wall of the first connecting block (51), and the other ends of the two groups of first guide rods (52) respectively penetrate the two groups of linear bearings (6). One of the guide rods penetrates one of the linear bearings (6) and is connected to the jigsaw (4) through a fisheye joint (53), and the other guide rod penetrates the other linear bearing (6) and is connected to the second connecting block (54); A linear guide rail (321) is provided on the side wall of the second support plate (32), a sliding block corresponding to the linear guide rail (321) is provided on the side wall of the second connection block (54), and one side of the second connection block (54) is slidably mounted on the linear guide rail (321); The second connecting block (54) is provided with two through holes at the bottom, and second guide rods (552) are respectively installed in the two through holes, one end of the two groups of second guide rods (552) is connected to the third connecting block (551), and the other end of the two groups of second guide rods (552) is connected to the mounting seat of the tool (56), and springs are respectively passed through the two groups of second guide rods (552), one end of the spring is fixed to the third connecting block (551), and the other end of the spring is fixed to the second connecting block (54).

2. A semiconductor grinding machine large plate groove cleaning device with balanced gravity according to claim 1, characterized in that: A guide wheel group (7) is also installed between the first support plate (31) and the second support plate (32). The guide wheel group (7) comprises two groups of guide wheel brackets (71) and two guide wheels (72). The two guide wheels (72) are rotatably installed on the two groups of guide wheel brackets (71). The two groups of guide wheels (72) are respectively located at the front and rear sides of the tool (56).

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