A method for preparing diamond beads

Abstract

The present invention provides a diamond bead, a diamond wire saw and a method for preparing the diamond bead. The diamond bead has only one diamond matrix, the diamond matrix has a through hole, and the inner wall of the through hole formed by the diamond matrix is ​​also recessed to form a screw groove. When the diamond bead is prepared into a wire saw, the beads are directly embedded with the coating layer through the screw groove, and the axial anti-movement and circumferential anti-rotation effects of the beads can be well achieved; at the same time, the existing spring structure is omitted, the thickness can be reduced to a smaller size, and the diameter of the wire saw can be made smaller; and the length is also reduced, the density of the beads on the wire saw is greatly increased, and the cutting efficiency of the wire saw is effectively improved. The wire saw also has better bending ability and can be well mounted on a small diameter wheel for operation. In addition, the present scheme provides a method for preparing the diamond bead, and the preparation steps are simple and ingenious, and will not damage the diamond matrix.

Description

Technical Field

[0001] The invention relates to the field of wire cutting, and in particular to a diamond bead, a diamond wire saw having the diamond bead and a method for preparing the diamond bead. Background Art

[0002] Diamond wire saw, also known as diamond wire, refers to a method of fixing diamond abrasive on a metal wire by electroplating or resin bonding to perform wire cutting. In the prior art, diamond wire saws generally include a wire rope, a plurality of beads strung on the wire rope, and a coating layer arranged on the outer surface of the wire rope to fix the beads. In order to prevent the beads from moving in the axial direction and rotating in the circumferential direction, a diamond wire saw with a spring inside the beads and a manufacturing method disclosed in CN103144202A is provided. The spring is arranged inside the beads to limit the reinforcement, so that the beads can be effectively prevented from moving in the axial direction and rotating in the circumferential direction. However, the addition of the spring structure makes the overall thickness of the beads thicker and the length longer. The increase in the thickness of the beads makes it difficult to reduce the diameter of the wire saw. The increase in the length of the beads reduces the density of the beads on the wire saw, and the degree of bending is limited, which is not suitable for operation on a small diameter wheel. Summary of the invention

[0003] Therefore, the present invention provides a diamond bead, a diamond wire saw having the diamond bead and a method for preparing the diamond bead to solve the above problems.

[0004] To achieve the above purpose, the technical solution provided by the present invention is as follows:

[0005] A diamond bead has only one diamond matrix, wherein the diamond matrix has only a diamond working layer; the diamond matrix has a through hole, and the inner wall of the through hole enclosed by the diamond matrix is ​​also concave to form a screw groove.

[0006] A diamond wire saw comprises a wire rope, a plurality of beads strung on the wire rope, and a coating layer arranged on the outer surface of the wire rope to fix the beads; the beads are the diamond beads described above.

[0007] A method for preparing diamond beads comprises the following steps:

[0008] A1, providing a spiral coil, and covering the outer surface of the spiral coil with an isolation layer;

[0009] A2, preparing a diamond matrix green body on the outer ring of the spiral coil, and allowing the inner side wall of the diamond matrix green body to penetrate into the gap of the spiral coil;

[0010] A3, subjecting the product obtained in step A2 to high temperature sintering;

[0011] A4, remove the isolation layer on the inner turn of the spiral coil;

[0012] A5, by removing the spiral coil, a diamond bead having only one diamond matrix and a concave inner wall of the diamond matrix forming a screw groove can be obtained.

[0013] Furthermore, the isolation layer is a glue layer that does not bond with metal when the diamond matrix green body is sintered.

[0014] Furthermore, the isolation layer is a ceramic adhesive layer or a graphite adhesive layer.

[0015] Furthermore, between step A1 and step A2, step A1-2 is also included, in which a limiting column is inserted into the center hole of the spiral coil, and the outer surface of the limiting column just abuts against the isolation layer; when operating step A2, the diamond matrix embryo is cold pressed, so that the inner side wall of the diamond matrix embryo penetrates into the gap of the spiral coil and abuts against the outer surface of the limiting column, that is, it is flush with the isolation layer; after the cold pressing is completed, the limiting column is removed.

[0016] A method for preparing diamond beads comprises the following steps:

[0017] A1, providing a screw having thread teeth on its outer circumferential surface, and covering the outer circumferential surface of the screw with an isolation layer;

[0018] A2, preparing the diamond matrix directly on the outer peripheral surface of the screw;

[0019] A3, removing the isolation layer on the outer peripheral surface of the screw;

[0020] A4, rotating the screw to unscrew the diamond matrix, and obtaining a diamond bead having only one diamond matrix and an inner wall of the diamond matrix being concave to form a screw groove.

[0021] Furthermore, in step A2, the diamond matrix is ​​formed on the outer peripheral surface of the screw by direct hot pressing and sintering.

[0022] Furthermore, the isolation layer is a glue layer that does not bond to metal under sintering conditions.

[0023] Furthermore, the isolation layer is a ceramic adhesive layer or a graphite adhesive layer.

[0024] The technical solution provided by the present invention has the following beneficial effects:

[0025] The diamond beads provided in the present invention have only one diamond matrix, and a screw groove is formed on the inner wall thereof. When the diamond beads are prepared into a wire saw, the beads are directly embedded in the coating layer through the screw groove, and the axial anti-movement and circumferential anti-rotation effects of the beads can be well achieved. At the same time, the existing spring structure is omitted, the thickness can be reduced to a smaller size, and the diameter of the wire saw can be made smaller. The length is also reduced, and the density of the beads on the wire saw is greatly increased, which effectively improves the cutting efficiency of the wire saw. The wire saw also has better bending ability and can be well mounted on a small-diameter rotating wheel for operation.

[0026] This solution also provides a method for preparing the diamond beads, which has simple and ingenious preparation steps and will not damage the diamond matrix. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 Shown is a cross-sectional view of the structure of the diamond beads in Example 1;

[0028] Figure 2 The figure shows a partial structural cross-sectional view of the diamond wire saw in the first embodiment, showing only one diamond bead;

[0029] Figure 3 The figure shows a flowchart of the preparation process of diamond beads in Example 2;

[0030] Figure 4 The product picture shown is the product picture of the preparation step A1 of the diamond beads in Example 2;

[0031] Figure 5 The product diagram of the step A3 of preparing diamond beads in Example 2 is shown;

[0032] Figure 6 Shown Figure 5 a cross-sectional view of the structure shown;

[0033] Figure 7 The figure shows a flowchart of the preparation process of diamond beads in Example 3;

[0034] Figure 8 The figure shows a schematic diagram of the screw shown in step A1 of preparing diamond beads in Example 3;

[0035] Fig. 9 The product picture shown is the product picture of the preparation step A2 of the diamond beads in Example 3;

[0036] Fig.10 Shown Fig. 9 A cross-sectional view of the structure shown. DETAILED DESCRIPTION

[0037] To further illustrate the various embodiments, the present invention provides drawings. These drawings are part of the disclosure of the present invention, which are mainly used to illustrate the embodiments and can be used in conjunction with the relevant descriptions in the specification to explain the operating principles of the embodiments. With reference to these contents, a person of ordinary skill in the art should be able to understand other possible implementations and advantages of the present invention. The components in the figures are not drawn to scale, and similar component symbols are generally used to represent similar components.

[0038] The present invention will now be further described with reference to the accompanying drawings and specific implementation methods.

[0039] Embodiment 1

[0040] Reference Figure 1 As shown, a diamond bead provided in this embodiment has only one diamond matrix 10, and the diamond matrix is ​​a matrix with only a diamond working layer; that is, in the prior art, the diamond working layer is generally prepared on a steel pipe, and the steel pipe is used as a support seat. In this embodiment, the steel pipe is removed, and only the matrix with the diamond working layer is provided, that is, there is only one diamond matrix 10. The diamond matrix 10 has a through hole 11, and the inner wall of the diamond matrix 10 enclosing the through hole 11 is also concave to form a screw groove 12.

[0041] More specifically, the cross section of the screw groove 12 is square, which is convenient for subsequent preparation of the diamond wire saw. Figure 2 As shown, the coating layer 30 can penetrate into the screw groove 12 more easily, and the opening of the square screw groove 12 is large enough, so that the connection between the portion of the coating layer 30 that penetrates into the screw groove 12 and the portion in the through hole 11 of the diamond substrate 10 is more secure, and the limiting effect is better.

[0042] Continue to refer to Figure 2 As shown, this embodiment also provides a diamond wire saw, including a wire rope 20, a plurality of beads strung on the wire rope, and a coating layer 30 disposed on the outer surface of the wire rope 20 to fix the beads; the beads are the diamond beads described above.

[0043] The diamond beads provided in the present solution have only one diamond matrix 10, and a screw groove 12 is formed on the inner wall thereof. When prepared into a wire saw, the beads are directly engaged with the coating layer 30 through the screw groove 12, and the axial anti-movement and circumferential anti-rotation effects of the beads can also be well achieved. At the same time, the existing spring structure is omitted, the thickness can be reduced to a smaller size, and the diameter of the wire saw can be made smaller. The length is also reduced, and the density of the beads on the wire saw is greatly increased, which effectively improves the cutting efficiency of the wire saw, and the wire saw has better bending ability, and can be well mounted on a small-diameter rotating wheel for operation.

[0044] Embodiment 2

[0045] Reference Figure 3As shown, this embodiment provides a method for preparing diamond beads, comprising the following steps:

[0046] A1, a spiral coil 31 is provided, and an isolation layer 32 is covered on the outer surface of the spiral coil 31, such as Figure 4 shown.

[0047] More specifically, in this embodiment, the cross-sectional shape of the isolation layer 32 is a square structure. During preparation, a mold may be prepared, the mold having a spiral channel with a square cross-section, the spiral coil 31 is placed in the spiral channel, and then an isolation glue is injected. After the isolation glue is cured, the isolation layer 32 covering the outer surface of the spiral coil 31 is obtained. By using an isolation layer 32 with a square cross-section, the cross-section of the screw groove 12 of the subsequent diamond substrate 10 is also square; it is convenient for the coating layer 30 to penetrate into the screw groove more easily during the subsequent preparation of the diamond wire saw, and the opening of the square screw groove 12 is large enough, and the connection between the portion of the coating layer 30 that penetrates into the screw groove 12 and the portion in the through hole 11 of the diamond substrate 10 is more firmly, and the limiting effect is better.

[0048] Of course, in other embodiments, the cross-sectional shape of the isolation layer 32 may also be other structures, such as being the same as the cross-sectional shape of the spiral coil 31. In this way, during preparation, the spiral coil 31 can be immersed in the isolation glue as a whole, and after being taken out and dried, a layer of isolation layer 32 can be obtained covering the outer surface of the spiral coil 31. The preparation is simple and quick.

[0049] A2, preparing a diamond matrix embryo on the outer ring of the spiral coil 31, and allowing the inner side wall of the diamond matrix embryo to penetrate into the gap of the spiral coil 31;

[0050] As a preferred solution, between step A1 and step A2, step A1-2 is also included, a limiting column (not shown) is inserted into the central hole of the spiral coil 31, and the outer surface of the limiting column just abuts against the isolation layer 32; when operating step A2, the diamond matrix embryo is cold pressed, so that the inner side wall of the diamond matrix embryo penetrates into the gap of the spiral coil 31 and abuts against the outer surface of the limiting column, that is, it is flush with the inner side wall of the isolation layer 32; after the cold pressing is completed, the limiting column is removed. In this way, through the cooperation of the limiting column, it is possible to well achieve that the inner side wall of the diamond matrix embryo penetrates into the gap of the spiral coil 31 and is flush with the isolation layer 32, and the operation is simpler, and there is no need to deliberately control the parameters such as the pressure and time of the cold pressing, and the diamond matrix embryo is more compact. Of course, in other embodiments, the limiting method of the limiting column may not be adopted. The inner side wall of the diamond matrix embryo may also not need to be flush with the inner side wall of the isolation layer 32.

[0051] A3, the product obtained in step A2 is subjected to high temperature sintering to obtain a diamond matrix embryo, that is, a formed diamond matrix 10, such as Figure 5 , Figure 6 shown.

[0052] A4, removing the isolation layer on the inner circle of the spiral coil 31, so that the fixed connection between the spiral coil 31 and the diamond substrate 10 is released.

[0053] A5, removing the spiral coil 31, a diamond bead having only one diamond matrix 10 and an inner wall of the diamond matrix 10 having a concave groove 12 (ie, the diamond bead provided in the first embodiment) can be obtained.

[0054] Specifically, the method of removing the spiral coil 31 is preferably to rotate the spiral coil 31 to rotate it out of the diamond matrix 10; in this way, the spiral coil 31 will not be damaged and can be reused. Of course, in other embodiments, removing the spiral coil 31 is not limited to this, and can also be achieved by destroying the spiral coil 31.

[0055] Specifically, in order to better remove the isolation layer 32, the isolation layer 32 is a glue layer that does not bond with metal when the diamond matrix green body is sintered. That is, the isolation layer will not bond with the spiral coil 31 and the diamond matrix 10 in step A3, and is easy to remove.

[0056] More specifically, the isolation layer 32 is a ceramic glue layer or a graphite glue layer, that is, it is prepared by using ceramic glue or graphite glue in the prior art. More specifically, the isolation layer 32 can be removed by wet etching or the like, and the specific method of removing the glue component is the prior art and will not be described in detail here. Of course, in other embodiments, the material of the isolation layer 32 is not limited thereto.

[0057] This solution provides a method for preparing the diamond beads, and the preparation steps are simple and ingenious without damaging the diamond matrix.

[0058] Embodiment 3

[0059] Reference Figure 7 As shown, this embodiment provides a method for preparing diamond beads, comprising the following steps:

[0060] A1, provide a screw 40 having a thread 41 on the outer peripheral surface, such as Figure 8 and an isolation layer (not shown) is covered on the outer peripheral surface of the screw 40.

[0061] A2, directly prepare the diamond matrix 10 on the outer peripheral surface of the screw 40, such as Fig. 9 , Fig.10 shown.

[0062] Specifically, in this step, since the screw 40 is a solid structure with sufficient support, when preparing the diamond matrix 10, it is formed on the outer peripheral surface of the screw 40 by direct hot pressing and sintering. This preparation method is simpler and faster. Of course, in other embodiments, the diamond matrix green embryo can also be cold pressed onto the screw 40 by cold pressing, and then formed by high temperature sintering.

[0063] A3, removing the isolation layer on the outer peripheral surface of the screw 40; disconnecting the screw 40 from the diamond substrate 10.

[0064] A4, rotate the screw 40 to unscrew the diamond matrix 10, and obtain a diamond bead having only one diamond matrix 10 and the inner wall of the diamond matrix 10 is also concave to form a screw groove 12 (i.e., the diamond bead provided in Example 1).

[0065] This method has simple and ingenious preparation steps and will not damage the diamond substrate 10. Compared with the method in the second embodiment, it is simpler and more efficient.

[0066] Specifically, in order to better remove the isolation layer, the isolation layer is a glue layer that does not bond with metal under sintering (ie, hot pressing) conditions. That is, the isolation layer will not bond with the screw 40 and the diamond matrix 10 in step A2, and is easy to remove.

[0067] More specifically, the isolation layer is a ceramic glue layer or a graphite glue layer, that is, it is prepared by using ceramic glue or graphite glue in the prior art. More specifically, the isolation layer can be removed by wet etching or the like, and the specific method of removing the glue component is the prior art and will not be described in detail here. Of course, in other embodiments, the material of the isolation layer is not limited thereto.

[0068] Although the present invention has been specifically shown and described in conjunction with the preferred embodiments, it should be understood by those skilled in the art that various changes may be made to the present invention in form and details without departing from the spirit and scope of the present invention as defined by the appended claims, all of which are within the scope of protection of the present invention.

Claims

1. A method for preparing diamond beads, characterized in that: The steps include: A1, providing a spiral coil, and covering the outer surface of the spiral coil with an isolation layer; A2, preparing a diamond matrix green body on the outer ring of the spiral coil, and allowing the inner side wall of the diamond matrix green body to penetrate into the gap of the spiral coil; A3, subjecting the product obtained in step A2 to high temperature sintering; A4, remove the isolation layer on the inner turn of the spiral coil; A5, by removing the spiral coil, a diamond bead having only one diamond matrix and a concave inner wall of the diamond matrix forming a screw groove can be obtained.

2. The method for preparing diamond beads according to claim 1, characterized in that: The isolation layer is a glue layer that does not bond with metal under the condition of sintering the diamond matrix green embryo.

3. The method for preparing diamond beads according to claim 2, characterized in that: The isolation layer is a ceramic adhesive layer or a graphite adhesive layer.

4. The method for preparing diamond beads according to claim 1, characterized in that: Between step A1 and step A2, step A1-2 is also included, in which a limiting column is inserted into the center hole of the spiral coil, and the outer surface of the limiting column just abuts against the isolation layer; when operating step A2, the diamond matrix embryo is cold pressed, so that the inner side wall of the diamond matrix embryo penetrates into the gap of the spiral coil and abuts against the outer surface of the limiting column, that is, it is flush with the isolation layer; after the cold pressing is completed, the limiting column is removed.

5. A method for preparing diamond beads, characterized in that: The steps include: A1, providing a screw having thread teeth on its outer circumferential surface, and covering the outer circumferential surface of the screw with an isolation layer; A2, preparing the diamond matrix directly on the outer peripheral surface of the screw; A3, removing the isolation layer on the outer peripheral surface of the screw; A4, rotating the screw to unscrew the diamond matrix, and obtaining a diamond bead having only one diamond matrix and an inner wall of the diamond matrix being concave to form a screw groove.

6. The method for preparing diamond beads according to claim 5, characterized in that: In step A2, the diamond matrix is ​​formed on the outer peripheral surface of the screw by direct hot pressing and sintering.

7. The method for preparing diamond beads according to claim 5, characterized in that: The isolation layer is a glue layer that does not bond to metal under sintering conditions.

8. The method for preparing diamond beads according to claim 7, characterized in that: The isolation layer is a ceramic adhesive layer or a graphite adhesive layer.

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