Multilayer electronic components

Abstract

The present disclosure relates to a multilayer electronic component, comprising: a first non-conductive resin layer extending between a conductive resin layer of a first external electrode and an electrode layer; and a second non-conductive resin layer extending between a conductive resin layer of a second external electrode and the electrode layer. The first non-conductive resin layer and the second non-conductive resin layer may be spaced apart from each other to suppress arc discharge and improve bending strength.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2019-0169536 filed on December 18, 2019, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0002] The present disclosure relates to a multi-layer electronic assembly. Background Art

[0003] A multilayer ceramic capacitor (MLCC), a multilayer electronic component, may be a chip capacitor mounted on a printed circuit board of various electronic products (such as imaging devices including liquid crystal displays (LCDs), plasma display panels (PDPs), etc., as well as computers, smart phones, mobile phones, etc.) for charging or discharging therefrom.

[0004] Such multilayer ceramic capacitors are used as components of various electronic devices due to their relatively small size, relatively high capacitance, and relatively easy installation. As various electronic devices such as computers, mobile devices, etc. are miniaturized and increased in output, the demand for miniaturization and high capacitance of multilayer ceramic capacitors is increasing.

[0005] Furthermore, with the recent increase in interest in vehicle electrical / electronic components, multilayer ceramic capacitors also begin to require relatively high reliability and strength characteristics in order to be used in vehicles or infotainment systems.

[0006] In order to ensure high reliability and high strength characteristics, a method of changing a conventional external electrode including an electrode layer to have a double-layer structure including an electrode layer and a conductive resin layer has been proposed.

[0007] In a double-layer structure including an electrode layer and a conductive resin layer, a resin composition including a conductive material is applied to the electrode layer to absorb external impact and prevent plating solution penetration. As a result, reliability can be improved.

[0008] However, since the standards of high reliability and high strength characteristics required by the industry are increasing, a method of further improving the high reliability and high strength characteristics is required.

[0009] Furthermore, since the use of multilayer ceramic capacitors at high voltages is increasing, a method of preventing arc discharge from occurring between the ends of the band portions of the external electrodes is required. Summary of the invention

[0010] An aspect of the present disclosure is to provide a multilayer electronic component capable of suppressing arc discharge.

[0011] Another aspect of the present disclosure is to provide a multilayer electronic assembly having improved bending strength characteristics.

[0012] Another aspect of the present disclosure is to provide a multilayer electronic component having improved heat resistance.

[0013] Another aspect of the present disclosure is to provide a multilayer electronic component having improved moisture resistance reliability.

[0014] Another aspect of the present disclosure is to provide a multilayer electronic component having a low equivalent series resistance (ESR) achieved by improving electrical connectivity between an electrode layer and a conductive resin layer.

[0015] However, the purpose of the present disclosure is not limited to the above description and will be more easily understood in the process of describing specific embodiments of the present disclosure.

[0016] According to one aspect of the present disclosure, a multilayer electronic component includes: a body including a dielectric layer and a first inner electrode and a second inner electrode, the first inner electrode and the second inner electrode are alternately stacked with the corresponding dielectric layer interposed between the first inner electrode and the second inner electrode, and the body has a first surface and a second surface opposite to each other in a stacking direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other; a first external electrode including a first electrode layer connected to the first inner electrode and a first conductive resin layer disposed on the first electrode layer, and the first external electrode is divided into a first conductive resin layer disposed on the first inner electrode and a conductive resin layer disposed on the first electrode layer. a first connection portion on the third surface of the body and a first band portion extending from the first connection portion to a portion of each of the first surface, the second surface, the fifth surface, and the sixth surface; a second outer electrode including a second electrode layer connected to the second inner electrode and a second conductive resin layer provided on the second electrode layer, and the second outer electrode is divided into a second band portion having a second connection portion provided on the fourth surface of the body and a portion extending from the second connection portion to each of the first surface, the second surface, the fifth surface, and the sixth surface; and a first non-conductive resin layer and a second non-conductive resin layer provided on the first surface, the second surface, the fifth surface, and the sixth surface and spaced apart from each other. The first non-conductive resin layer extends between the first conductive resin layer and the first electrode layer of the first band portion, and the second non-conductive resin layer extends between the second conductive resin layer and the second electrode layer of the second band portion.

[0017] According to another aspect of the present disclosure, a multilayer electronic component includes: a body including a dielectric layer and a first inner electrode and a second inner electrode, the first inner electrode and the second inner electrode are alternately stacked with the corresponding dielectric layer interposed between the first inner electrode and the second inner electrode, and the body has a first surface and a second surface opposite to each other in a stacking direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other; a first outer electrode including a first electrode layer connected to the first inner electrode and a first conductive resin layer disposed on the first electrode layer; a second outer electrode including a second electrode layer connected to the second inner electrode and a second conductive resin layer disposed on the second electrode layer; and a first non-conductive resin layer and a second non-conductive resin layer disposed on the first surface, the second surface, the fifth surface and the sixth surface and spaced apart from each other. The first non-conductive resin layer extends between the first conductive resin layer and the first electrode layer, and the second non-conductive resin layer extends between the second conductive resin layer and the second electrode layer. The first non-conductive resin layer includes one or more first openings, and a portion of the first electrode layer is exposed to the first conductive resin layer through the one or more first openings, and the second non-conductive resin layer includes one or more second openings, and a portion of the second electrode layer is exposed to the second conductive resin layer through the one or more second openings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and other aspects, features and advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings.

[0019] Figure 1 is a schematic perspective view of a multilayer electronic assembly according to an exemplary embodiment of the present disclosure.

[0020] Figure 2 is along Figure 1 A cross-sectional view taken along line II' in FIG.

[0021] Figure 3 is a schematic exploded perspective view of a body in which a dielectric layer and an internal electrode are stacked according to an exemplary embodiment of the present disclosure.

[0022] Figure 4 yes Figure 2 Magnified view of area P in FIG.

[0023] Figure 5 The bending test method is shown.

[0024] Figure 6is a graph showing evaluation of bending strength of a multilayer electronic component depending on whether or not the non-conductive resin layer of the present disclosure is applied, which shows that Figure 5 Bending test results obtained by the test method.

[0025] Figure 7 : is a graph showing the evaluation of ESR after the cycle TC in which the temperature changes from -55°C to 150°C is repeated 200 times for twenty samples of test number 5 in Table 1.

[0026] Figure 8 The arc discharge occurrence voltage measured five times repeatedly for ten sample pieces (#1 to #10) of the comparative example in which the non-conductive resin layer was not provided is shown.

[0027] Fig. 9 The arc discharge occurrence voltage measured five times repeatedly for ten sample pieces (#1 to #10) of the inventive example in which the non-conductive resin layer according to the exemplary embodiment of the present disclosure is provided is shown.

[0028] Fig.10 is a schematic perspective view of a multilayer electronic assembly according to an exemplary embodiment of the present disclosure.

[0029] Fig.11 is along Fig.10 A cross-sectional view taken along line II-II'. DETAILED DESCRIPTION

[0030] Hereinafter, embodiments of the present disclosure will be described with reference to specific embodiments and the accompanying drawings. However, embodiments of the present disclosure may be modified to have various other forms, and the scope of the present disclosure is not limited to the embodiments described below. In addition, embodiments of the present disclosure may be provided to more completely describe the present disclosure to those of ordinary skill in the art. Therefore, for clarity of description, the shapes and sizes of the elements in the accompanying drawings may be exaggerated, and the elements represented by the same reference numerals in the accompanying drawings may be the same elements.

[0031] In the accompanying drawings, in order to clarify the present disclosure, parts not related to the description will be omitted, and the thickness may be magnified to clearly show the layers and regions. The same reference numerals will be used to represent the same components with the same reference numerals. In addition, throughout the specification, when an element is referred to as "comprising" or "including" an element, unless otherwise specifically stated, this means that the element may also include other elements without excluding other elements.

[0032] In the drawings, the X direction may be defined as the second direction, L direction or length direction, the Y direction may be defined as the third direction, W direction or width direction, and the Z direction may be defined as the first direction, stacking direction, T direction or thickness direction.

[0033] Multilayer electronic components

[0034] Figure 1 is a schematic perspective view of a multilayer electronic assembly according to an exemplary embodiment of the present disclosure.

[0035] Figure 2 is along Figure 1 A cross-sectional view taken along line II' in FIG.

[0036] Figure 3 is a schematic exploded perspective view of a body in which a dielectric layer and an internal electrode are stacked according to an exemplary embodiment.

[0037] Figure 4 yes Figure 2 Magnified view of area P in FIG.

[0038] In the following, reference will be made to Figures 1 to 4 A multilayer electronic assembly 100 according to an exemplary embodiment is described.

[0039] A multilayer electronic component 100 according to an exemplary embodiment may include: a body 110 including a dielectric layer 111 and first and second internal electrodes 121 and 122, the first and second internal electrodes 121 and 122 being alternately stacked with the corresponding dielectric layer interposed between the first and second internal electrodes 121 and 122, and the body 110 having a first surface 1 and a second surface 2 opposite to each other in a stacking direction (e.g., a Z direction), a third surface 3 and a fourth surface 4 connected to the first and second surfaces 1 and 2 and opposite to each other, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and opposite to each other; a first external electrode 131 including a first electrode layer 131a connected to the first internal electrode 121 and a first conductive resin layer 131b disposed on the first electrode layer 131a, and the first external electrode 131 is divided into a first connection portion A1 arranged on the third surface 3 of the main body 110 and a first band portion B1 extending from the first connection portion A1 to a portion of each of the first surface 1, the second surface 2, the fifth surface 5 and the sixth surface 6; the second external electrode 132 includes a second electrode layer 132a connected to the second internal electrode 122 and a second conductive resin layer 132b arranged on the second electrode layer 132a, and the second external electrode 132 is divided into a second connection portion A2 arranged on the fourth surface 4 of the main body 110 and a second band portion B2 extending from the second connection portion A2 to a portion of each of the first surface 1, the second surface 2, the fifth surface 5 and the sixth surface 6; the first non-conductive resin layer 141 and the second non-conductive resin layer 142 are arranged on the first surface 1, the second surface 2, the fifth surface 5 and the sixth surface 6 and are spaced apart from each other. The first non-conductive resin layer 141 is provided to extend between the first conductive resin layer 131b and the first electrode layer 131a of the first band portion B1, and the second non-conductive resin layer 142 is provided to extend between the second conductive resin layer 132b and the second electrode layer 132a of the second band portion B2.

[0040] In the body 110 , dielectric layers 111 and internal electrodes 121 and 122 are alternately stacked.

[0041] The shape of the body 110 is not limited but may have a hexahedral shape or a shape similar thereto. Since ceramic powder particles included in the body 110 shrink during sintering, the body 110 may have a substantially hexahedral shape instead of a hexahedral shape having completely straight lines.

[0042] The body 110 may have a first surface 1 and a second surface 2 opposite to each other in a thickness direction (e.g., Z direction), a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in a length direction (e.g., X direction), and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2 and the third surface 3 and the fourth surface 4 and opposite to each other in a width direction (e.g., Y direction).

[0043] The plurality of dielectric layers 111 constituting the body 110 are in a sintered state and may be integrated with each other, so that boundaries between the plurality of dielectric layers 111 may be inconspicuous without using a scanning electron microscope (SEM).

[0044] According to an exemplary embodiment, the raw material for forming the dielectric layer 111 is not limited as long as sufficient capacitance can be obtained. For example, the raw material for forming the dielectric layer 111 may be a barium titanate-based material, a lead composite perovskite-based material, a strontium titanate-based material, etc. The barium titanate-based material may include BaTiO3-based ceramic powder particles. The BaTiO3-based ceramic powder may be, for example, a BaTiO3-based ceramic powder prepared by partially applying calcium (Ca), zirconium (Zr), etc. to BaTiO3. 1-x Ca x )TiO3、Ba(Ti 1-y Ca y )O3、(Ba 1-x Ca x )(Ti 1- y Zr y )O3、Ba(Ti 1-y Zr y )O3, etc.

[0045] According to the purpose of the present disclosure, various ceramic additives, organic solvents, plasticizers, binders, dispersants, etc. may be added to powder particles of barium titanate (BaTiO3) or the like as a material for forming the dielectric layer 111. The ceramic additives may include transition metal oxides or carbides, rare earth elements, magnesium (Mg), aluminum (Al), etc.

[0046] The main body 110 may have a capacitor forming portion and an upper protective layer 112 and a lower protective layer 113. The capacitor forming portion is arranged in the main body 110 and includes a first internal electrode 121 and a second internal electrode 122. The first internal electrode 121 and the second internal electrode 122 are arranged to be opposite to each other and the dielectric layer 111 is interposed between the first internal electrode 121 and the second internal electrode 122 to form a capacitor. The upper protective layer 112 and the lower protective layer 113 are arranged above and below the capacitor forming portion.

[0047] The capacitance forming part may contribute to the capacitance formation of the capacitor, and may be formed by repeatedly stacking a plurality of first and second internal electrodes 121 and 122 with the dielectric layer 111 interposed therebetween.

[0048] The upper protective layer 112 and the lower protective layer 113 may be formed by stacking a single dielectric layer or two or more dielectric layers on the upper and lower surfaces of the capacitor forming part in a vertical direction, respectively, and may substantially play a role in preventing damage to the internal electrodes due to physical or chemical stress.

[0049] The upper protective layer 112 and the lower protective layer 113 may not include an internal electrode, and may include the same material as that of the dielectric layer 111 .

[0050] The internal electrodes 121 and 122 may be disposed to face each other with the dielectric layer 111 interposed therebetween.

[0051] The internal electrodes 121 and 122 may include first internal electrodes 121 and second internal electrodes 122 which are alternately disposed to face each other with respective dielectric layers interposed therebetween.

[0052] The first and second internal electrodes 121 and 122 may be exposed to the third and fourth surfaces 3 and 4 of the body 110 , respectively.

[0053] Reference Figure 2 , the first internal electrode 121 may be spaced apart from the fourth surface 4 and may be exposed through the third surface 3, and the second internal electrode 122 may be spaced apart from the third surface 3 and may be exposed through the fourth surface 4. The first external electrode 131 may be disposed on the third surface 3 of the body 110 to be connected to the first internal electrode 121, and the second external electrode 132 may be disposed on the fourth surface 4 of the body 110 to be connected to the second internal electrode 122.

[0054] For example, the first internal electrode 121 is not connected to the second external electrode 132 but is connected to the first external electrode 131, and the second internal electrode 122 is not connected to the first external electrode 131 but is connected to the second external electrode 132. Therefore, the first internal electrode 121 is spaced apart from the fourth surface 4 by a predetermined distance, and the second internal electrode 122 is spaced apart from the third surface 3 by a predetermined distance.

[0055] The first and second internal electrodes 121 and 122 may be electrically isolated from each other by the dielectric layer 111 disposed therebetween.

[0056] Reference Figure 3The body 110 may be formed by alternately stacking dielectric layers 111 on which the first internal electrodes 121 are printed and dielectric layers 111 on which the second internal electrodes 122 are printed in a thickness direction (eg, Z direction) and sintering the stacked dielectric layers 111 .

[0057] The material of the internal electrodes 121 and 122 is not necessarily limited and may be a material having improved conductivity. For example, the internal electrodes 121 and 122 may be formed by printing an internal electrode conductive paste including at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof on a ceramic green sheet.

[0058] The method of printing the inner electrode conductive paste may be a screen printing method or a gravure printing method, but is not limited thereto.

[0059] The external electrodes 131 and 132 are disposed on the body 110 and include electrode layers 131 a and 132 a and conductive resin layers 131 b and 132 b .

[0060] The external electrodes 131 and 132 may include a first external electrode 131 and a second external electrode 132 connected to the first internal electrode 121 and the second internal electrode 122 , respectively.

[0061] The first external electrode 131 may include a first electrode layer 131 a and a first conductive resin layer 131 b , and the second external electrode 132 may include a second electrode layer 132 a and a second conductive resin layer 132 b .

[0062] Reference Figure 2 , the area of ​​the first external electrode 131 may be divided according to the position of the area of ​​the first external electrode 131. The first external electrode 131 may have a first connection portion A1 disposed on the third surface 3 of the body 110 and a first band portion B1 extending from the first connection portion A1 to a portion of each of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6.

[0063] In addition, the area between the first connection portion A1 and the first band portion B1 may be defined as a first corner portion C1. For example, a portion of the first external electrode 131 disposed on the third surface 3 of the body 110 may be referred to as the first connection portion A1, portions of the first external electrode 131 disposed on the first surface, the second surface, the fifth surface, and the sixth surface of the body 110 may be referred to as the first band portion B1, and an area of ​​the first external electrode 131 disposed between the first connection portion A1 and the first band portion B1 may be referred to as the first corner portion C1.

[0064] The area of ​​the second external electrode 132 may be divided according to the position of the area of ​​the second external electrode 132. The second external electrode 132 has a second connection portion A2 disposed on the fourth surface 4 of the body 110 and a second band portion B2 extending from the second connection portion A2 to a portion of each of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6.

[0065] In addition, the area between the second connection portion A2 and the second band portion B2 may be defined as a second corner portion C2. For example, the portion of the second external electrode 132 disposed on the fourth surface 4 of the body 110 may be referred to as the second connection portion A1, the portions of the second external electrode 132 disposed on the first surface, the second surface, the fifth surface, and the sixth surface of the body 110 may be referred to as the second band portion B2, and the area of ​​the second external electrode 132 disposed between the second connection portion A2 and the second band portion B2 may be referred to as the second corner portion C2.

[0066] According to an exemplary embodiment of the present disclosure, in an area of ​​the first connection portion A1 corresponding to the third surface 3 of the body 110 and in an area of ​​the second connection portion A2 corresponding to the fourth surface 4 of the body 110, a portion of the first electrode layer 131a may contact the first conductive resin layer 131b through an opening of the first non-conductive resin layer 141, and a portion of the second electrode layer 132a may contact the second conductive resin layer 132b through an opening of the second non-conductive resin layer 142.

[0067] The external electrodes 131 and 132 may be formed using any material, such as metal, as long as it has conductivity. Specific materials of the external electrodes 131 and 132 may be selected in consideration of electrical characteristics, structural stability, and the like.

[0068] For example, each of the first electrode layer 131 a and the second electrode layer 132 a may include a conductive metal and glass.

[0069] The conductive metal used for the electrode layers 131a and 132a is not necessarily limited as long as it can be electrically connected to the internal electrodes to form a capacitor. The conductive material can be, for example, at least one selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0070] The electrode layers 131 a and 132 a may be formed by coating a conductive paste prepared by adding glass frit to conductive metal powder particles and then sintering the conductive paste.

[0071] When the first electrode layer 131a and the second electrode layer 132a include conductive metal and glass, each of the corners C1 and C2 (areas between the connection parts A1 and A2 and the band parts B1 and B2) may be formed to have a low thickness, or separation may occur between the ends of the band parts B1 and B2 and the body 110 to deteriorate moisture-proof reliability. Therefore, when the first electrode layer 131a and the second electrode layer 132a include conductive metal and glass, moisture-proof reliability may be problematic, and the present invention may be more effective in improving moisture-proof reliability.

[0072] The first electrode layer 131 a and the second electrode layer 132 a may be formed by atomic layer deposition (ALD), molecular layer deposition (MLD), chemical vapor deposition (CVD), sputtering, or the like.

[0073] The first electrode layer 131 a and the second electrode layer 132 a may be formed by transferring a sheet including a conductive metal to the body 110 .

[0074] Each of the conductive resin layers 131 b and 132 b may include a conductive metal and a matrix resin.

[0075] The conductive metal included in each of the conductive resin layers 131 b and 132 b serves to electrically connect the conductive resin layers 131 b and 132 b to the electrode layers 131 a and 132 a .

[0076] The conductive metal included in each of the conductive resin layers 131b and 132b is not necessarily limited as long as it can be electrically connected to the electrode layers 131a and 132a. The conductive material may be, for example, at least one selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0077] The conductive metal included in the conductive resin layers 131b and 132b may include at least one of spherical powder particles and flake powder particles. For example, the conductive metal may include only flake powder particles or spherical powder particles, or a mixture of flake powder particles and spherical powder particles.

[0078] The spherical powder particles may have an incomplete spherical shape, and may have, for example, a shape in which the ratio of the length of the major axis to the length of the minor axis (major axis / minor axis) is 1.45 or less.

[0079] The flaky powder particles refer to powder particles each having a flat and elongated shape, and are not limited to a specific shape, for example, the ratio of the length of the major axis to the length of the minor axis (major axis / minor axis) may be 1.95 or more.

[0080] The lengths of the major and minor axes of spherical powder particles and flaky powder particles can be measured from an image obtained by scanning a cross section (LT cross section) taken along the X and Z directions from the central portion in the width (Y) direction of a multilayer electronic component using a scanning electron microscope (SEM).

[0081] The matrix resin included in the conductive resin layers 131 b and 132 b serves to ensure adhesion and to absorb impact.

[0082] The base resin included in the conductive resin layers 131 b and 132 b is not necessarily limited as long as it has adhesiveness and impact absorption and is mixed with conductive metal powder particles to prepare a paste, and may include, for example, an epoxy-based resin.

[0083] In addition, the conductive resin layer may include a plurality of metal particles, an intermetallic compound, and a matrix resin.

[0084] According to the present disclosure, the non-conductive resin layer 140 including the first non-conductive resin layer 141 and the second non-conductive resin layer 142 may be provided to extend between the electrode layers 131a and 132a and the conductive resin layers 131b and 132b, or a plurality of island-shaped adhesive portions 151 and 152 may be provided on the first electrode layer 131a of the first connection portion A1 and the second electrode layer 132a of the second connection portion A2, respectively. Therefore, the contact area between the electrode layers 131a and 132a and the conductive resin layers 131b and 132b may be reduced. As a result, the electrical connectivity between the electrode layers 131a and 132a and the conductive resin layers 131b and 132b may be deteriorated.

[0085] However, according to an exemplary embodiment, when each of the conductive resin layers 131 b and 132 b includes a plurality of metal particles, an intermetallic compound, and a matrix resin, stable electrical connectivity may be ensured.

[0086] The intermetallic compound may be used to connect a plurality of metal particles to improve electrical connectivity, and may be used to surround a plurality of metal particles and connect the plurality of metal particles to each other.

[0087] In this case, the intermetallic compound may include a metal having a melting point lower than a solidification temperature of the base resin.

[0088] For example, since the intermetallic compound includes a metal having a melting point lower than the solidification temperature of the matrix resin, the metal having a melting point lower than the solidification temperature of the matrix resin melts during the drying and solidification process and forms the intermetallic compound with a portion of the metal particles to surround the metal particles. In this case, specifically, the intermetallic compound may include a metal having a low melting point of 300° C. or less.

[0089] For example, the intermetallic compound may include tin (Sn) having a melting point of 213° C. to 220° C. Tin (Sn) melts during drying and solidification, and the molten Sn wets high melting point metal particles (such as Ag, Ni, or Cu) having a high melting point due to capillary action, and reacts with a portion of the Ag, Ni, or Cu metal particles to form an intermetallic compound (such as Ag3Sn, Ni3Sn4, Cu6Sn5, Cu3Sn, etc.). Ag, Ni, or Cu that does not participate in the reaction remains in the form of metal particles.

[0090] Thus, the plurality of metal particles may include at least one of Ag, Ni, and Cu, and the intermetallic compound may include at least one of Ag3Sn, Ni3Sn4, Cu6Sn5, and Cu3Sn.

[0091] The external electrodes 131 and 132 may further include a plating layer (not shown) disposed on the conductive resin layers 131 b and 132 b to improve mounting characteristics.

[0092] For example, the plating layer may be a Ni plating layer or a Sn plating layer, may have a form in which the Ni plating layer and the Sn plating layer are sequentially formed on the conductive resin layers 131 b and 132 b , or may include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0093] The non-conductive resin layer 140 includes a first non-conductive resin layer 141 and a second non-conductive resin layer 142 .

[0094] The first and second non-conductive resin layers 141 and 142 are disposed on the first, second, fifth, and sixth surfaces 1, 2, 5, and 6 of the body 110 and are spaced apart from each other.

[0095] The first non-conductive resin layer 141 is provided to extend between the first conductive resin layer 131b and the first electrode layer 131a of the first band portion B1, and the second non-conductive resin layer 142 is provided to extend between the second conductive resin layer 132b and the second electrode layer 132a of the second band portion B2.

[0096] The non-conductive resin layer 140 serves to prevent stress generated when the substrate is deformed by heat and physical shock when the multilayer electronic component 100 is mounted on the substrate from being propagated to the body 110 and to prevent cracking.

[0097] Furthermore, the non-conductive resin layer 140 blocks a moisture permeation path to improve moisture-proof reliability.

[0098] The matrix resin included in the conductive resin layers 131b and 132b also plays a role in absorbing impact, but the role of the matrix resin is limited because the first and second conductive resin layers 131b and 132b should be set to be conductive.

[0099] In addition, when the length of the first conductive resin layer 131b and the second conductive resin layer 132b is increased to enhance the bending strength, arc discharge may occur between the ends of the band portions of the first conductive resin layer 131b and the second conductive resin layer 132b under high voltage, and thus a short circuit may occur between the first conductive resin layer 131b and the second conductive resin layer 132b.

[0100] However, since the non-conductive resin layer 140 is non-conductive, a short circuit does not occur even when the gap G between the first non-conductive resin layer 141 and the second non-conductive resin layer 142 is small. Therefore, the gap G can be sufficiently reduced to effectively absorb the impact and suppress the propagation of stress. In addition, the gap G can be sufficiently reduced to suppress the occurrence of arc discharge.

[0101] The non-conductive resin layer 140 disposed in contact with the surface of the body 110 may seal pores or cracks of the body 110 to prevent moisture from penetrating into the body 110 through the outer surface of the body 110 .

[0102] The first non-conductive resin layer 141 extends between the first conductive resin layer 131 b and the first electrode layer 131 a of the first band portion B1 to prevent stress from propagating to the body 110 and prevent cracking.

[0103] Furthermore, the first non-conductive resin layer 141 suppresses detachment between the end portion of the first electrode layer 131 a provided in the first band portion B1 and the main body 110 to improve moisture-proof reliability.

[0104] The second non-conductive resin layer 142 extends between the second conductive resin layer 132b and the second electrode layer 132a of the second band portion B2 to prevent stress from propagating to the body 110 and prevent cracking.

[0105] Furthermore, the second non-conductive resin layer 142 suppresses detachment between the end portion of the second electrode layer 132a provided in the second band portion B2 and the main body 110 to improve moisture-proof reliability.

[0106] When the direction in which the third surface 3 and the fourth surface 4 of the body 110 are opposite to each other is defined as the length direction (X direction) of the body 110, the first non-conductive resin layer 141 and the second non-conductive resin layer 142 may be spaced apart from each other with the central portion of the body 110 in the length direction (X direction) interposed therebetween. Such arrangement of the first non-conductive resin layer 141 and the second non-conductive resin layer 142 may significantly improve the arc discharge suppression effect.

[0107] The gap G between the first non-conductive resin layer 141 and the second non-conductive resin layer 142 may be 30% or less of the length of the body 110. When the gap G is greater than 30% of the length of the body 110, the arc discharge suppression effect or the bending strength improvement effect may be insufficient. The length of the body 110 may be a distance between the third surface and the fourth surface of the body 110 in the length direction.

[0108] The gap G between the first non-conductive resin layer 141 and the second non-conductive resin layer 142 may be smaller than the gap between the first conductive resin layer 131b and the second conductive resin layer 132b. For example, the sum of the length B1b of the first conductive resin layer 131b of the first band portion B1, the length of the second conductive resin layer 132b of the second band portion B2, and the gap G between the first non-conductive resin layer 141 and the second non-conductive resin layer 142 may be smaller than the length of the body 110. When the gap G between the first non-conductive resin layer 141 and the second non-conductive resin layer 142 is greater than or equal to the gap between the first conductive resin layer 131b and the second conductive resin layer 132b, the arc discharge suppression effect or the bending strength improvement effect may be insufficient.

[0109] The lower limit of the gap G is not necessarily limited. However, when the gap G between the first non-conductive resin layer 141 and the second non-conductive resin layer 142 disposed in contact with each other is zero, stress is not dispersed, and thus the bending strength improvement effect may be insufficient. For example, as the first non-conductive resin layer 141 and the second non-conductive resin layer 142 are spaced apart from each other, stress may be dispersed to increase the bending strength improvement effect.

[0110] Figure 5 The bending test method is shown.

[0111] Figure 6 is a graph showing evaluation of bending strength of a multilayer electronic component depending on whether the non-conductive resin layer 140 of the present disclosure is applied, which shows that Figure 5 Bending test results obtained by the test method.

[0112] exist Figure 6 In the examples, the comparative example is a multilayer electronic component to which the non-conductive resin layer 140 is not applied, and the inventive example is a multilayer electronic component to which the non-conductive resin layer 140 is applied. Thirty samples were prepared for each of the comparative example and the inventive example.

[0113] Reference Figure 5 , when the sample piece (MLCC) is mounted on a substrate (PCB) and the surface of the substrate (PCB) opposite to the mounting surface of the sample piece (MLCC) is pressed to 6 mm, the peeling point (where the outer electrode is peeled from the body) and the cracking occurrence point (where the body is cracked) are Figure 6 The piezoelectric peak position is shown in .

[0114] In the comparative example, peeling (external electrode peeling from the main body) or cracking (main body cracking) occurred in all thirty samples. However, in the inventive example, it was confirmed that no defects were found in all thirty samples, and therefore, the bending strength was guaranteed during the 6 mm bending strength test.

[0115] The non-conductive resin layer 140 may be formed in the following manner: forming a first electrode layer 131a and a second electrode layer 132a in a main body 110 including a dielectric layer and an internal electrode, forming a non-conductive resin layer on an exposed outer surface of the main body 110 and the first electrode layer 131a and the second electrode layer 132a, and removing the non-conductive resin layer formed on the first electrode layer 131a and the second electrode layer 132a at the connection parts A1 and A2 and the non-conductive resin layer formed in the central portion of the main body 110 in the length direction.

[0116] The method of removing the non-conductive resin layer 140 may be, for example, laser processing, mechanical polishing, dry etching, wet etching, masking deposition using a protective layer, or the like.

[0117] The non-conductive resin layer 140 may include a base resin.

[0118] The base resin included in the non-conductive resin layer 140 is not necessarily limited as long as it has adhesiveness and impact absorption properties, and may be, for example, an epoxy-based resin.

[0119] The non-conductive resin layer 140 may include a base resin, and may include one or more fillers of silica, alumina, glass, and zirconium dioxide (ZrO 2 ).

[0120] Silica, alumina, glass, and zirconium dioxide (ZrO2) used as fillers are used to improve the coating shape of the non-conductive resin layer 140. In addition, silica, alumina, glass, and zirconium dioxide (ZrO2) may also be used to improve heat resistance.

[0121] In this case, the content of the filler included in the non-conductive resin layer 140 is not necessarily limited and may be specifically determined in consideration of the type of the filler, the type of resin of the non-conductive resin layer, and effects desired to be obtained therefrom.

[0122] As a detailed example, when the filler of the non-conductive resin layer 140 is silicon dioxide and the resin of the non-conductive resin layer 140 is epoxy resin, the content of the filler included in the non-conductive resin layer 140 may be 10 volume % or more, preferably, 20 volume % or more, more preferably, 40 volume % or more. Therefore, the first non-conductive resin layer 141 may include 10 volume % or more of the filler, and the second non-conductive resin layer 142 may include 10 volume % or more of the filler.

[0123] Table 1 shows the evaluation of heat resistance of the sample sheet including the non-conductive resin layer 140 according to the example when the content of the filler included in the non-conductive resin layer 140 is changed. In the non-conductive resin layer, silicon dioxide is added to the epoxy resin as a filler. The content of the filler relative to the entire non-conductive resin layer is expressed by volume percentage (vol%).

[0124] Heat resistance was evaluated by exposing the sample piece at a temperature of 260° C. for 20 seconds and then examining the degree of deformation of the non-conductive resin layer after the sample piece was exposed, compared with the non-conductive resin layer before the sample piece was exposed. In Table 1, × indicates a case where the degree of deformation is greater than or equal to 30%, △ indicates a case where the degree of deformation is greater than or equal to 10% and less than 30%, ○ indicates a case where the degree of deformation is less than 10%, and ◎ indicates a case where no deformation occurs.

[0125] Table 1

[0126]

[0127]

[0128] As can be seen from Table 1, in the case of test numbers 1 and 2, the content of the filler is less than 10 volume percent, and the heat resistance is poor.

[0129] Comparative Test Nos. 3 to 9. When the filler included in the non-conductive resin layer is silica and the resin included in the non-conductive resin layer is an epoxy resin, the content of the filler may preferably be 10% by volume, more preferably may be 20% by volume or more, and further more preferably may be 40% by volume or more in terms of heat resistance.

[0130] Figure 7 : is a graph showing the evaluation of ESR after repeating 200 times of TC (Temperature Cycle) of temperature change from -55°C to 150°C for twenty sample pieces (sample pieces No. 1 to 20) of test No. 5 in Table 1. Figure 7 It can be seen that the ESR before and after TC are almost similar to each other, and the heat resistance is improved.

[0131] Figure 8 The arc discharge occurrence voltage measured five times repeatedly for ten sample pieces (#1 to #10) of the comparative example in which the non-conductive resin layer 140 is not provided is shown.

[0132] Fig. 9 The arc discharge occurrence voltage measured five times repeatedly for ten sample pieces (#1 to #10) of the inventive example in which the non-conductive resin layer 140 according to the exemplary embodiment of the present disclosure is provided is shown.

[0133] As from Figure 8 It can be seen that since there are four cases where arc discharge occurs at 2 kV or less, the average value of the arc discharge occurrence voltage is about 2.5 kV.

[0134] However, as from Fig. 9 It can be seen that, in the case of the present invention example, arc discharge did not occur at 2.2 kV or less in a total of 50 tests. In addition, the average value of the arc discharge occurrence voltage was higher than that in the comparative example, improving the arc discharge suppression effect.

[0135] The first non-conductive resin layer 141 is provided as the first electrode layer 131 a covering the first corner portion C1 , and the second non-conductive resin layer 142 is provided as the second electrode layer 132 a covering the second corner portion C2 .

[0136] When the electrode layers 131a and 132a include conductive metal and glass, the electrode layers 131a and 132a of the corners C1 and C2 (regions between the connecting parts A1 and A2 and the band parts B1 and B2) are respectively formed to have a low thickness. The corners C1 and C2 serve as a main moisture penetration path to deteriorate the moisture-proof reliability.

[0137] Therefore, the non-conductive resin layer 140 may be provided to cover the electrode layers 131a and 132a of the corner portions C1 and C2. As a result, the moisture penetration path may be blocked to improve moisture-proof reliability.

[0138] In addition, the first non-conductive resin layer 141 is provided to extend to the portion between the first conductive resin layer 131b and the first electrode layer 131a of the first connection portion A1, and the second non-conductive resin layer 142 extends to the portion between the second conductive resin layer 132b and the second electrode layer 132a of the second connection portion A2. As a result, the moisture penetration path can be more strictly blocked to further improve the moisture-proof reliability.

[0139] The length of each of the first conductive resin layer 131 b of the first band portion B1 and the second conductive resin layer 132 b of the second band portion B2 may be 10% to 20% of the length of the body 110 .

[0140] Reference Figure 2 and Figure 4 , the length of the body may refer to the distance between the third surface and the fourth surface of the body, the length of the first conductive resin layer 131b of the first band portion B1 may be the distance B1b from the third surface of the body 110 to the end of the first conductive resin layer 131b, and the length of the second conductive resin layer 132b of the second band portion B2 may be the distance from the fourth surface of the body 110 to the end of the second conductive resin layer 132b.

[0141] When the non-conductive resin layer 140 is not provided, the length of each of the first conductive resin layer 131b of the first band portion B1 and the second conductive resin layer 132b of the second band portion B2 should be maintained in the range of 20% to 30% of the length of the body 110 to ensure bending strength.

[0142] However, when the non-conductive resin layer 140 is provided according to the exemplary embodiment, sufficient bending strength can be ensured even in the case where the length of each of the first conductive resin layer 131b of the first band portion B1 and the second conductive resin layer 132b of the second band portion B2 is 10% to 20% of the length of the body 110. Therefore, the arc discharge suppression effect can be further improved.

[0143] In order to further improve the bending strength, the distance B1b from the third surface of the body to the end of the first conductive resin layer 131b may be greater than the distance B1a from the third surface of the body to the end of the first electrode layer 131a. Similarly, the distance from the fourth surface of the body to the end of the second conductive resin layer 132b may be greater than the distance from the fourth surface of the body to the end of the second electrode layer 132a.

[0144] Fig.10 is a schematic perspective view of a multilayer electronic assembly according to an exemplary embodiment of the present disclosure.

[0145] Fig.11 It is along Fig.10 A cross-sectional view taken along line II-II'.

[0146] In the following, reference will be made to Fig.10 and Fig.11 A multilayer electronic component 100 ′ according to another exemplary embodiment is described. However, description of the multilayer electronic component 100 ′ that is the same as that of the multilayer electronic component 100 according to the exemplary embodiment will be omitted to avoid duplication of description.

[0147] A multilayer electronic component 100 ′ according to another exemplary embodiment may have an adhesive part 150 , specifically, may have a plurality of first island-shaped adhesive parts 151 on the first electrode layer 131 a of the first connection part A1 and a plurality of second island-shaped adhesive parts 152 on the second electrode layer 132 a of the second connection part A2 .

[0148] Reference Fig.11 , a plurality of first island-shaped adhesive portions 151 may be arranged between the first conductive resin layer 131b and the first electrode layer 131a of the first connection portion A1, and a plurality of second island-shaped adhesive portions 152 may be arranged between the second conductive resin layer 132b and the second electrode layer 132a of the second connection portion A2.

[0149] That is, the first non-conductive resin layer 141 may include one or more first openings, a portion of the first electrode layer 131a is exposed to the first conductive resin layer 131b through the one or more first openings, and the second non-conductive resin layer 142 may include one or more second openings, a portion of the second electrode layer 132a is exposed to the second conductive resin layer 132b through the one or more second openings. The one or more first openings and the one or more second openings may each include a plurality of discrete openings spaced apart from each other.

[0150] The plurality of first island-shaped adhesive portions 151 and the plurality of second island-shaped adhesive portions 152 are used to improve the adhesion between the electrode layers 131a and 132a and the conductive resin layers 131b and 132b. Since the adhesion between the electrode layers 131a and 132a and the conductive resin layers 131b and 132b is improved, defects such as electrode detachment can be prevented.

[0151] Each of the plurality of first island-shaped adhesive parts 151 and the plurality of second island-shaped adhesive parts 152 may include a matrix resin.

[0152] The matrix resin included in the plurality of first island-shaped adhesive portions 151 and the plurality of second island-shaped adhesive portions 152 is not necessarily limited as long as it has adhesiveness and impact absorption, and may be, for example, epoxy resin.

[0153] In addition, the plurality of first island-shaped adhesive portions 151 and the plurality of second island-shaped adhesive portions 152 may include a matrix resin and may include at least one of silicon dioxide, aluminum oxide, glass, and zirconium dioxide (ZrO 2 ) for improving a coating shape and for improving heat resistance.

[0154] A plurality of first island-shaped adhesive portions 151 and a plurality of second island-shaped adhesive portions 152 may be formed in the following manner: a first electrode layer 131a and a second electrode layer 132a are formed on a main body 110 including a dielectric layer and an internal electrode, a non-conductive resin layer is formed on an exposed outer surface of the main body 110 and the first electrode layer 131a and the second electrode layer 132a, and only a portion of the non-conductive resin layer 140 formed on the first electrode layer 131a and the second electrode layer 132a of the connecting portions A1 and A2 is removed.

[0155] Therefore, the plurality of first island-shaped adhesive portions 151 and the plurality of second island-shaped adhesive portions 152 may be formed using the same material as that of the first non-conductive resin layer 141 and the second non-conductive resin layer 142 .

[0156] The total area of ​​the first island-shaped adhesive portions 151 may be 20% to 40% of the area of ​​the first electrode layer 131a of the first connection portion A1, and the total area of ​​the second island-shaped adhesive portions 152 may be 20% to 40% of the area of ​​the second electrode layer 132a of the second connection portion A2.

[0157] Table 2 shows the evaluation results of ESR and adhesion depending on the ratio (S2 / S1) of the area S2 of the adhesive portion to the area S1 of the electrode layer of the connection portion.

[0158] When the conductive resin layer is separated from the electrode layer, the adhesion is evaluated by measuring the energy using an adhesion tester. Compared with the case where the area S2 of the adhesive portion is 0, △ indicates a case where the adhesion improvement effect is less than 5%, ○ indicates a case where the adhesion improvement effect is greater than or equal to 5% and less than 20%, and ◎ indicates a case where the adhesion improvement effect is greater than or equal to 20%.

[0159] The ESR evaluation was performed by measuring the ESR of 100 samples at the self-resonant frequency using an LCR meter. In Table 2, △ indicates a case where the coefficient of variation (CV) is greater than or equal to 10%, ○ indicates a case where the CV is greater than or equal to 3% and less than 10%, and ◎ indicates a case where the CV is less than 3%.

[0160] Table 2

[0161] Test No. S2 / S1 ESR Adhesion 10 0.1 ◎ △ 11 0.2 ○ ○ 12 0.3 ○ ○ 13 0.4 ○ ○ 14 0.5 △ ◎

[0162] As can be seen from Table 2, in the case of Test No. 10 in which the ratio (S2 / S1) of the area S2 of the adhesive portion to the area S1 of the electrode layer of the connection portion was 0.1, the ESR characteristics improved, but the adhesion deteriorated.

[0163] In the case of Test No. 14 in which the ratio (S2 / S1) of the area S2 of the adhesive portion to the area S1 of the electrode layer of the connection portion was 0.5, the adhesiveness was improved, but the ESR characteristics were deteriorated.

[0164] Therefore, the area of ​​each of the plurality of first island-shaped adhesive portions 151 and the plurality of second island-shaped adhesive portions 152 is set to, for example, 20% to 40% of the area of ​​the first electrode layer 131a of the first connection portion A1 or the area of ​​the second electrode layer 132a of the second connection portion A2. As a result, both improved adhesion and improved ESR characteristics can be ensured.

[0165] As described above, the first non-conductive resin layer extending between the conductive resin layer and the electrode layer of the first external electrode and the second non-conductive resin layer extending between the conductive resin layer and the electrode layer of the second external electrode may be spaced apart from each other to suppress arc discharge and improve bending strength.

[0166] Furthermore, fillers may be added to the first non-conductive resin layer and the second non-conductive resin layer to improve heat resistance.

[0167] While embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the present disclosure as defined by the appended claims.

Claims

1. A multilayer electronic component comprising: a body including a dielectric layer and first and second internal electrodes, the first and second internal electrodes being alternately stacked with the respective dielectric layers interposed therebetween, and having a first surface and a second surface opposite to each other in a stacking direction, a third surface and a fourth surface connected to the first and second surfaces and opposite to each other, and a fifth surface and a sixth surface connected to the first, second, third and fourth surfaces and opposite to each other; a first external electrode including a first electrode layer connected to the first internal electrode and a first conductive resin layer provided on the first electrode layer, and the first external electrode is divided into a first band portion having a first connection portion provided on the third surface of the body and a portion extending from the first connection portion to each of the first surface, the second surface, the fifth surface, and the sixth surface; a second external electrode including a second electrode layer connected to the second internal electrode and a second conductive resin layer provided on the second electrode layer, and the second external electrode is divided into a second band portion having a second connection portion provided on the fourth surface of the body and a portion extending from the second connection portion to each of the first surface, the second surface, the fifth surface, and the sixth surface; as well as a first non-conductive resin layer and a second non-conductive resin layer disposed on the first surface, the second surface, the fifth surface, and the sixth surface and spaced apart from each other, wherein the first non-conductive resin layer extends between the first conductive resin layer and the first electrode layer of the first belt portion, and the second non-conductive resin layer extends between the second conductive resin layer and the second electrode layer of the second belt portion, wherein, when the direction in which the third surface and the fourth surface of the body are opposite to each other is defined as the length direction of the body, in the length direction, a gap between the first non-conductive resin layer and the second non-conductive resin layer is greater than 0 and less than or equal to 30% of the length of the body, and Wherein, in the length direction, the length of the first conductive resin layer of the first belt portion and the length of the second conductive resin layer of the second belt portion are respectively greater than the length of the first electrode layer of the first belt portion and the length of the second electrode layer of the second belt portion.

2. The multilayer electronic component according to claim 1, wherein Each of the first non-conductive resin layer and the second non-conductive resin layer includes a base resin and includes one or more fillers selected from the group consisting of silica, alumina, glass, and zirconium dioxide.

3. The multilayer electronic component according to claim 1, wherein: Each of the first non-conductive resin layer and the second non-conductive resin layer includes epoxy resin and silicon dioxide, and a content of the silicon dioxide is 10 volume % or more.

4. The multilayer electronic component according to claim 1, wherein: A central portion of the body in the length direction is interposed between the first non-conductive resin layer and the second non-conductive resin layer.

5. The multilayer electronic component according to claim 1, wherein In the length direction, the length of the first conductive resin layer of the first belt portion and the length of the second conductive resin layer of the second belt portion are respectively smaller than the length of the first non-conductive resin layer and the length of the second non-conductive resin layer.

6. The multilayer electronic component according to claim 1, wherein: Each of the first conductive resin layer and the second conductive resin layer includes a conductive metal and a matrix resin.

7. The multilayer electronic component according to claim 1, wherein: Each of the first conductive resin layer and the second conductive resin layer includes a plurality of metal particles, an intermetallic compound, and a matrix resin.

8. The multilayer electronic component according to claim 7, wherein: The plurality of metal particles include at least one of Ag, Ni and Cu, and The intermetallic compound includes at least one of Ag3Sn, Ni3Sn4, Cu6Sn5 and Cu3Sn.

9. The multilayer electronic component according to any one of claims 1 to 8, wherein: When a portion between the first connecting portion and the first band portion is defined as a first corner and a portion between the second connecting portion and the second band portion is defined as a second corner, the first non-conductive resin layer is configured to cover the first electrode layer of the first corner, and the second non-conductive resin layer is configured to cover the second electrode layer of the second corner.

10. The multilayer electronic component according to any one of claims 1 to 8, wherein: The first non-conductive resin layer extends to a portion between the first conductive resin layer and the first electrode layer of the first connecting portion, and The second non-conductive resin layer extends to a portion between the second conductive resin layer and the second electrode layer of the second connection portion.

11. The multilayer electronic component according to any one of claims 1 to 8, wherein: In the length direction, the length of the first conductive resin layer of the first tape portion and the length of the second conductive resin layer of the second tape portion are respectively 10% to 20% of the length of the main body.

12. The multilayer electronic component according to any one of claims 1 to 8, wherein: A plurality of first island-shaped adhesive portions are disposed on the first electrode layer of the first connecting portion, a plurality of second island-shaped adhesive portions are disposed on the second electrode layer of the second connecting portion, and Each of the plurality of first island-shaped adhesive portions and the plurality of second island-shaped adhesive portions includes a matrix resin.

13. The multilayer electronic component according to claim 12, wherein: Each of the plurality of first island-shaped bonding portions and the plurality of second island-shaped bonding portions further includes at least one of silicon dioxide, aluminum oxide, glass, and zirconium dioxide.

14. The multilayer electronic component according to claim 12, wherein: Each of the plurality of first island-shaped adhesive portions and the plurality of second island-shaped adhesive portions includes the same material as that of the first non-conductive resin layer and the second non-conductive resin layer.

15. The multilayer electronic component according to claim 12, wherein: The total area of ​​the multiple first island-shaped adhesive portions is 20% to 40% of the area of ​​the first electrode layer of the first connecting portion, and the total area of ​​the multiple second island-shaped adhesive portions is 20% to 40% of the area of ​​the second electrode layer of the second connecting portion.

16. The multilayer electronic component according to claim 1, wherein In a region of the first connection portion corresponding to the third surface of the main body and a region of the second connection portion corresponding to the fourth surface of the main body, A portion of the first electrode layer contacts the first conductive resin layer through the opening of the first non-conductive resin layer, and a portion of the second electrode layer contacts the second conductive resin layer through the opening of the second non-conductive resin layer.

17. A multilayer electronic component comprising: a body including a dielectric layer and first and second internal electrodes, the first and second internal electrodes being alternately stacked with the respective dielectric layers interposed therebetween, and having a first surface and a second surface opposite to each other in a stacking direction, a third surface and a fourth surface connected to the first and second surfaces and opposite to each other, and a fifth surface and a sixth surface connected to the first, second, third and fourth surfaces and opposite to each other; a first external electrode including a first electrode layer connected to the first internal electrode and a first conductive resin layer disposed on the first electrode layer; a second external electrode including a second electrode layer connected to the second internal electrode and a second conductive resin layer disposed on the second electrode layer; as well as a first non-conductive resin layer and a second non-conductive resin layer disposed on the first surface, the second surface, the fifth surface, and the sixth surface and spaced apart from each other, wherein the first non-conductive resin layer extends between the first conductive resin layer and the first electrode layer, and the second non-conductive resin layer extends between the second conductive resin layer and the second electrode layer, wherein the first non-conductive resin layer includes one or more first openings, a portion of the first electrode layer is exposed to the first conductive resin layer through the one or more first openings, and the second non-conductive resin layer includes one or more second openings, a portion of the second electrode layer is exposed to the second conductive resin layer through the one or more second openings, wherein, when the direction in which the third surface and the fourth surface of the body are opposite to each other is defined as the length direction of the body, in the length direction, a gap between the first non-conductive resin layer and the second non-conductive resin layer is greater than 0 and less than or equal to 30% of the length of the body, and Wherein, in the length direction, the length of the portion of the first conductive resin layer arranged on the first surface and the length of the portion of the second conductive resin layer arranged on the first surface are respectively greater than the length of the portion of the first electrode layer arranged on the first surface and the length of the portion of the second electrode layer arranged on the first surface.

18. The multilayer electronic component according to claim 17, wherein: The one or more first openings and the one or more second openings each include a plurality of discrete openings spaced apart from one another.

19. The multilayer electronic component according to claim 17, wherein: The one or more first openings are arranged only in a region corresponding to the third surface of the body, and the one or more second openings are arranged only in a region corresponding to the fourth surface of the body.

20. The multilayer electronic component according to any one of claims 17 to 19, wherein: Each of the first non-conductive resin layer and the second non-conductive resin layer includes a base resin and includes one or more fillers selected from the group consisting of silica, alumina, glass, and zirconium dioxide.

21. A multilayer electronic component comprising: a body including a dielectric layer and first and second internal electrodes, the first and second internal electrodes being alternately stacked with the respective dielectric layers interposed therebetween, and having a first surface and a second surface opposite to each other in a stacking direction, a third surface and a fourth surface connected to the first and second surfaces and opposite to each other, and a fifth surface and a sixth surface connected to the first, second, third and fourth surfaces and opposite to each other; a first external electrode including a first electrode layer connected to the first internal electrode and a first conductive resin layer provided on the first electrode layer, and the first external electrode is divided into a first band portion having a first connection portion provided on the third surface of the body and a portion extending from the first connection portion to each of the first surface, the second surface, the fifth surface, and the sixth surface; a second external electrode including a second electrode layer connected to the second internal electrode and a second conductive resin layer provided on the second electrode layer, and the second external electrode is divided into a second band portion having a second connection portion provided on the fourth surface of the body and a portion extending from the second connection portion to each of the first surface, the second surface, the fifth surface, and the sixth surface; as well as a first non-conductive resin layer and a second non-conductive resin layer disposed on the first surface, the second surface, the fifth surface, and the sixth surface and spaced apart from each other, wherein the first non-conductive resin layer extends between the first conductive resin layer and the first electrode layer of the first belt portion, and the second non-conductive resin layer extends between the second conductive resin layer and the second electrode layer of the second belt portion, wherein a plurality of first island-shaped adhesive portions are arranged on the first electrode layer of the first connecting portion, a plurality of second island-shaped adhesive portions are arranged on the second electrode layer of the second connecting portion, and Here, each of the plurality of first island-shaped adhesive portions and the plurality of second island-shaped adhesive portions includes the same material as that of the first non-conductive resin layer and the second non-conductive resin layer.

22. A multilayer electronic component comprising: a body including a dielectric layer and first and second internal electrodes, the first and second internal electrodes being alternately stacked with the respective dielectric layers interposed therebetween, and having a first surface and a second surface opposite to each other in a stacking direction, a third surface and a fourth surface connected to the first and second surfaces and opposite to each other, and a fifth surface and a sixth surface connected to the first, second, third and fourth surfaces and opposite to each other; a first external electrode including a first electrode layer connected to the first internal electrode and a first conductive resin layer provided on the first electrode layer, and the first external electrode is divided into a first band portion having a first connection portion provided on the third surface of the body and a portion extending from the first connection portion to each of the first surface, the second surface, the fifth surface, and the sixth surface; a second external electrode including a second electrode layer connected to the second internal electrode and a second conductive resin layer provided on the second electrode layer, and the second external electrode is divided into a second band portion having a second connection portion provided on the fourth surface of the body and a portion extending from the second connection portion to each of the first surface, the second surface, the fifth surface, and the sixth surface; as well as a first non-conductive resin layer and a second non-conductive resin layer disposed on the first surface, the second surface, the fifth surface, and the sixth surface and spaced apart from each other, wherein the first non-conductive resin layer extends between the first conductive resin layer and the first electrode layer of the first belt portion, and the second non-conductive resin layer extends between the second conductive resin layer and the second electrode layer of the second belt portion, wherein a plurality of first island-shaped adhesive portions are arranged on the first electrode layer of the first connecting portion, a plurality of second island-shaped adhesive portions are arranged on the second electrode layer of the second connecting portion, and The total area of ​​the first plurality of island-shaped adhesive portions is 20% to 40% of the area of ​​the first electrode layer of the first connecting portion, and the total area of ​​the second plurality of island-shaped adhesive portions is 20% to 40% of the area of ​​the second electrode layer of the second connecting portion.

Images