A new type of high power density power supply
By integrating the module power supply on the printed board and optimizing the structural layout and heat dissipation method, the problems of complex device connections and large thermal resistance in traditional module power supply are solved, and a new high-power density power supply with higher power density and efficiency are achieved.
Patent Information
- Application Number
- CN202110373565.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-04-07
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2041-04-07
AI Technical Summary
Traditional module power supplies have problems such as complex device connections, large space occupancy, and large thermal resistance for heating, which cannot meet the needs of high power density.
It adopts an integrated design and is integrated on the printed board. By optimizing the structural layout and heat dissipation methods, including the use of conductive heat dissipation blocks, copper foil coils and dense via connections, it reduces trace length and thermal resistance and improves heat dissipation capabilities.
Achieve higher power density and efficiency, reduce losses, and achieve higher power output within the same volume.
Smart Images
Figure CN112994415B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the field of power supply design, and in particular to a novel high power density power supply. Background Art
[0002] At present, module power supplies are constantly developing towards higher power and higher density. Due to the problems of low efficiency, complex wiring between devices, large space occupied, large heat concentration and thermal resistance, the traditional aluminum substrate module power supply can no longer meet the requirements of running wider lines in a limited space to meet the requirements of large currents, and it is even more unable to solve the problem of having enough heat dissipation devices in a limited space to dissipate the great damage caused to the power supply by high power. Therefore, it is necessary to seek new wiring methods and new structural layouts to solve existing problems. To increase power density, the first thing to do is to improve efficiency and reduce thermal resistance to solve heat dissipation.
[0003] In the invention patent application document with application number CN201110080828.9, a high power density power supply is proposed, and it is mentioned that: with the development of switching power supply technology, high frequency, high efficiency and high power density have become the development trend of switching power supplies. High frequency can effectively reduce the size of the switching power supply, but too high frequency will increase the switching loss, which is not conducive to improving the efficiency of the power supply. Summary of the invention
[0004] The main purpose of the present invention is to provide a new type of high power density power supply, aiming to solve the technical problems of complex wiring between components, large occupied space and large heat concentration thermal resistance in the prior art module power supply.
[0005] To achieve the above-mentioned purpose, the present invention proposes a novel high power density power supply, which adopts an integrated design and is integrated on a printed board. The printed board is divided into a BOT surface and a TOP surface. The novel high power density power supply comprises: a primary power tube, a transformer, an inductor, an output filter capacitor and a secondary power tube; the primary power tube is welded on the BOT surface of the printed board in a vertical parallel manner in four pieces, the right side of the primary power tube is close to the left side of the transformer, the right side of the transformer is close to the secondary power tube, each bridge of the secondary power tube is welded on the TOP surface of the printed board in a parallel manner in four pieces, the upper and lower pairs of tubes of the two bridge arms of the secondary power tube are placed back to back, an output filter capacitor is arranged on the right side of the secondary power tube, an inductor is placed above the secondary power tube, the output end of the primary power tube is connected to the input end of the transformer, the output end of the transformer is connected to the input end of the secondary power tube, the output end of the secondary power tube is connected to the input end of the inductor, and the output end of the inductor is connected to the output filter capacitor.
[0006] Preferably, a conductive heat sink is welded on the back of the primary power tube, one side of the conductive heat sink covers the power tube for electrical connection, and the other side is close to the shell surface for heat dissipation of the primary power tube.
[0007] Preferably, the transformer and the inductor use the copper foil of the printed circuit board as the coil, and the appropriate leakage inductance value is obtained by adjusting the direction and distance of the transformer coil.
[0008] Preferably, the secondary power tube is connected in DSSD, the two S-stages of the secondary power tube are connected together as the negative electrode output to one end of the capacitor, and the two D-stages are connected through the fifth heat sink and output to the inductor as the positive electrode.
[0009] Preferably, the fifth heat sink is made of pure copper plated with silver.
[0010] Preferably, the secondary power tube is connected to the TOP surface and the BOT surface through a large number of dense printed circuit board vias to transfer heat to the BOT surface, and the first heat sink, the second heat sink, the third heat sink and the fourth heat sink are welded at the corresponding positions of the BOT surface, the first heat sink electrically connects the D-levels of the two pairs of secondary power tubes together, and the first heat sink, the second heat sink, the third heat sink and the fourth heat sink transfer heat to the casing.
[0011] Preferably, the printed circuit board vias are made of pure copper.
[0012] Preferably, the BOT surface is close to the outer shell surface, and the TOP surface is far away from the outer shell surface.
[0013] Beneficial effects of the present invention:
[0014] (1) Optimize the structural layout, reduce the wiring length, and reduce copper loss;
[0015] (2) Reducing losses in many aspects while increasing heat dissipation capacity can achieve higher power density;
[0016] (3) The same volume can achieve higher power and higher efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 This is a schematic diagram of the new high power density power supply BOT surface;
[0018] Figure 2 This is a schematic diagram of the TOP surface of the new high power density power supply;
[0019] In the figure: 1-transformer, 2-primary power tube, 3-first heat sink, 4-second heat sink, 5-third heat sink, 6-fourth heat sink, 7-inductor, 8-fifth heat sink, 9-secondary power tube, 10-output filter capacitor;
[0020] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0021] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.
[0022] The present invention proposes an embodiment, such as Figure 1 and Figure 2 As shown, Figure 1 This is a schematic diagram of the new high power density power supply BOT surface. Figure 2 1 is a schematic diagram of the TOP surface of the novel high power density power supply. In this embodiment, a novel high power density power supply is proposed. The power supply adopts an integrated design and is integrated on a printed board. The printed board is divided into a BOT surface and a TOP surface. The novel high power density power supply includes: a primary power tube 2, a transformer 1, an inductor 7, an output filter capacitor 10 and a secondary power tube 9; the primary power tube 2 is welded on the BOT surface of the printed board in a vertical parallel manner. The right side of the primary power tube 2 is adjacent to the left side of the transformer 1, and the right side of the transformer 1 is adjacent to the secondary Power tube 9, each bridge of the secondary power tube 9 is welded on the TOP surface of the printed circuit board in a parallel manner with four tubes, the upper and lower pairs of tubes of the two bridge arms of the secondary power tube 9 are placed back to back, an output filter capacitor 10 is arranged on the right side of the secondary power tube 9, an inductor 7 is placed above the secondary power tube 9, the output end of the primary power tube 2 is connected to the input end of the transformer 1, the output end of the transformer 1 is connected to the input end of the secondary power tube 9, the output end of the secondary power tube 9 is connected to the input end of the inductor 7, and the output end of the inductor 7 is connected to the output filter capacitor 10.
[0023] Specifically, an integrated design is adopted, and a printed circuit board is used to integrate transformer 1, inductor 7, power tube, capacitor, resistor and other components, and current is input and output through pins welded on the printed circuit board, without the need for additional wiring. All heat-generating components are placed as close to the shell as possible through the heat sink, and the heat is conducted away through the shell.
[0024] In this embodiment, a conductive heat sink is welded on the back of the primary power tube 2 . One side of the conductive heat sink covers the power tube for electrical connection, and the other side is close to the shell surface for heat dissipation of the primary power tube 2 .
[0025] Specifically, the primary power tube 2 uses 4 vertical parallel connections, and the power is taken from the middle to enter the input end of the transformer 1, so that the power AC circuit encloses the smallest area, and the EMI radiation and interference are reduced. The power tube is welded on the BOT surface of the printed circuit board (that is, close to the shell surface), and the conductive heat sink is directly welded on the back to cover the power tube, which serves as an electrical connection. At the same time, the heat sink is directly next to the shell surface for heat dissipation. Different from the traditional method of power tube-PCB-potting glue-shell, this method makes the heat capacity of the power tube larger and the thermal resistance to the shell is minimized.
[0026] In this embodiment, the transformer 1 and the inductor 7 use the copper foil of the printed circuit board as the coil. At the same time, by changing the direction and distance of the coil of the transformer 1, a suitable leakage inductance value can be obtained to achieve soft switching of the primary power tube 2, reduce losses and improve efficiency.
[0027] In this embodiment, the secondary power tube 9 is connected in DSSD, the two S stages of the secondary power tube 9 are connected together as the negative electrode output to one end of the capacitor, and the two D stages are connected through a heat sink and output to the inductor 7 as the positive electrode.
[0028] Specifically, the magnetic core of transformer 1 is adjacent to primary power tube 2 on the left and to secondary power tube 9 on the right. The magnetic core of inductor 7 is placed above secondary power tube 9, and output filter capacitor 10 is placed on the right of secondary power tube 9. The layout of primary power tube 2-transformer 1--inductor 7-secondary power tube 9-capacitor can effectively reduce the wiring length of the power loop. The output line of primary power conversion directly enters transformer 1, and the output line of transformer 1 is directly connected to secondary power tube 9 for rectification. The output of secondary rectifier tube is directly connected to inductor 7, and the output line of inductor 7 is directly connected to output capacitor filtering output. In this way, the overall power path is minimized and the copper loss is minimized.
[0029] In this embodiment, the secondary power tube 9 is connected in DSSD, the two S stages of the secondary power tube 9 are connected together as the negative electrode output to one end of the capacitor, and the two D stages are connected through the fifth heat sink 8 and output to the inductor as the positive electrode.
[0030] Specifically, each bridge of the secondary power tube 9 (rectifier tube) uses 4 tubes in parallel to reduce the on-resistance and increase the heat dissipation area. The upper and lower pairs of tubes of the two bridge arms are placed back to back. That is, DSSD, such a connection method. The two S-classes are connected together as the negative electrode after rectification to output to one end of the capacitor, and the two Ds are connected through the fifth heat sink 8. The fifth heat sink 8 is a pure copper silver-plated material, which serves as a current conduction path to connect the D poles of the two rectifier tubes as the output positive pole to the inductor 7. It also greatly increases the heat dissipation area of the power tube.
[0031] In this embodiment, the secondary power tube 9 is connected to the TOP surface and the BOT surface through a large number of dense printed circuit board vias, and the heat is transferred to the BOT surface. The first heat sink 3, the second heat sink 4, the third heat sink 5 and the fourth heat sink 6 are welded at the corresponding positions of the BOT surface. The first heat sink 3 electrically connects the D-levels of the two pairs of secondary power tubes 9 together, and the first heat sink 3, the second heat sink 4, the third heat sink 5 and the fourth heat sink 6 transfer the heat to the casing.
[0032] Specifically, the secondary power tube 9 is welded on the TOP surface of the printed circuit board (i.e., away from the shell surface), and the TOP surface and the BOT surface (close to the shell surface) are connected through a large number of dense vias to transfer heat to the BOT surface, and heat sinks 1.2.3.4 are welded on the BOT surface. The heat is transferred to the shell through the heat sink. Since the printed circuit board vias are pure copper for heat dissipation, this method minimizes the thermal resistance from the secondary rectifier tube to the shell and maximizes the heat dissipation area. At the same time, the first heat sink 3 electrically connects the D poles of the two pairs of rectifier tubes together, increasing the overcurrent capacity of the power circuit.
[0033] The above is only a preferred embodiment of the present invention. It should be understood that the present invention is not limited to the form disclosed herein, and should not be regarded as excluding other embodiments, but can be used in various other combinations, modifications and environments, and can be modified within the scope of the concept described herein through the above teachings or the technology or knowledge of the relevant field. The changes and modifications made by those skilled in the art shall not deviate from the spirit and scope of the present invention, and shall be within the scope of protection of the claims attached to the present invention.
Claims
1. A new type of high power density power supply, the power supply adopts an integrated design and is integrated on a printed board, the printed board is divided into a BOT surface and a TOP surface, characterized in that: include: A primary power tube (2), a transformer (1), an inductor (7), an output filter capacitor (10) and a secondary power tube (9); the primary power tube (2) is welded to the BOT surface of a printed circuit board in a manner of four in vertical parallel connection; the right side of the primary power tube (2) is adjacent to the left side of the transformer (1); the right side of the transformer (1) is adjacent to the secondary power tube (9); each bridge of the secondary power tube (9) is welded to the TOP surface of the printed circuit board in a manner of four in parallel connection; the upper and lower pairs of tubes of the two bridge arms of the secondary power tube (9) are placed back to back; an output filter capacitor (10) is arranged on the right side of the secondary power tube (9); an inductor (7) is placed above the secondary power tube (9); the output end of the primary power tube (2) is connected to the input end of the transformer (1); the output end of the transformer (1) is connected to the input end of the secondary power tube (9); the output end of the secondary power tube (9) is connected to the input end of the inductor (7); the output end of the inductor (7) is connected to the output filter capacitor (10).
2. A novel high power density power supply as claimed in claim 1, characterized in that: A conductive heat sink is welded on the back of the primary power tube (2); one side of the conductive heat sink covers the power tube and serves as an electrical connection, while the other side is adjacent to the outer shell surface and is used for heat dissipation of the primary power tube (2).
3. A novel high power density power supply as claimed in claim 1, characterized in that: The transformer (1) and the inductor (7) use the copper foil of the printed circuit board as the coil, and the appropriate leakage inductance value is obtained by adjusting the direction and distance of the transformer coil.
4. A novel high power density power supply as claimed in claim 1, characterized in that: The secondary power tube (9) is connected in a DSSD manner, the two S-stages of the secondary power tube (9) are connected together as a negative electrode and output to one end of the capacitor, and the two D-stages are connected through a fifth heat sink (8) and output to the inductor as a positive electrode.
5. A novel high power density power supply as claimed in claim 4, characterized in that: The fifth heat sink (8) is made of pure copper plated with silver.
6. A novel high power density power supply as claimed in claim 1, characterized in that: The secondary power tube (9) is connected to the TOP surface and the BOT surface through a large number of dense printed circuit board vias, and heat is transferred to the BOT surface. A first heat sink (3), a second heat sink (4), a third heat sink (5) and a fourth heat sink (6) are welded at corresponding positions on the BOT surface. The first heat sink (3) electrically connects the D-levels of the two pairs of secondary power tubes (9) together. The first heat sink (3), the second heat sink (4), the third heat sink (5) and the fourth heat sink (6) transfer heat to the housing.
7. A novel high power density power supply as claimed in claim 6, characterized in that: The printed circuit board vias are made of pure copper.
8. A novel high power density power supply as claimed in claim 1, characterized in that: The BOT surface is close to the outer shell surface, and the TOP surface is far away from the outer shell surface.