Semiconductor processing apparatus and semiconductor processing method
By using a heater lifting assembly spring damper in a semiconductor processing unit, the impact of heater movement is buffered, solving the problems of damage and contamination caused by heater breakage, and improving the reliability and production efficiency of the unit.
CN113206027BActive Publication Date: 2026-05-26TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
- Filing Date
- 2021-04-29
- Publication Date
- 2026-05-26
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Figure CN113206027B_ABST
Abstract
A semiconductor processing apparatus and a semiconductor processing method are disclosed. The semiconductor processing apparatus includes a heater and a heater lifting assembly. The heater is configured to heat a wafer located on a wafer carrier region of the heater. The heater includes a heater shaft extending below the wafer carrier region. The heater lifting assembly includes a lifting shaft, a clamp, and a damper. The lifting shaft is configured to move the heater shaft in a vertical direction. The clamp connects the heater shaft to the lifting shaft. The damper is disposed on the top of the clamp.
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