BGA socket device for semiconductor device testing and contact for BGA socket device

Abstract

The present invention relates to a dual pinch type BGA socket device for testing semiconductor devices, comprising: a contact (100), comprising a pair of terminals arranged opposite to each other, the pair of terminals being a fixed side terminal (110) and a movable side terminal (120), wherein the upper tip portions (111, 122) of the fixed side terminal (110) and the movable side terminal (120) are offset by a predetermined distance (d) relative to the center of a spherical terminal (2); a main body (210), wherein the contact (100) is vertically arranged and fixed to the main body (210); a cover (230), elastically supported on the upper portion of the main body (210), and capable of moving up and down within a predetermined height range relative to the main body (210); and a sliding member (240), which is arranged between the main body (210) and the cover (230). ), slides left and right in a manner linked to the up and down movement of the cover (230), thereby opening and closing the movable side terminal (120) in the horizontal direction, and the sliding member (240) is formed with a fixed side terminal accommodating hole (245) for the fixed side terminal (110) to be through-configured and a movable side terminal accommodating hole (246) for the movable side terminal (120) to be through-configured, wherein the fixed side terminal accommodating hole (245) and the movable side terminal accommodating hole (246) are offset from each other by a predetermined distance (d), and the predetermined distance (d) is equal to the predetermined distance (d) between the upper tip portions (111, 122) of the contacts, and the length of the fixed side terminal accommodating hole is greater than the length of the movable side terminal accommodating hole.

Description

Technical Field

[0001] The present invention relates to a dual pinch type BGA socket device for testing semiconductor devices. Background Art

[0002] Typically, a socket for a semiconductor device (IC, Integrated Circuit) (hereinafter referred to as "IC") is set on a test board (Test Board) or a burn-in board (Burn-in Board), and is connected to a burn-in chamber or its peripheral equipment that can input and output a power supply and electronic signals of a predetermined voltage required to drive the IC through I / O terminals (input / output terminals) formed on the board, and other test devices for testing IC characteristics, and is used in an IC testing system.

[0003] Among ICs that are generally widely used, a BGA (Ball Grid Array) type IC significantly reduces the size and thickness of the IC by arranging IC terminals over the entire bottom surface of the IC. Figure 1 (a) and (b) are a plan view and a side view of a BGA type IC, and a plurality of ball terminals 2 are provided on the bottom surface of the IC 1.

[0004] Figure 2 is a plan view of a conventional BGA socket device having pinch-type contacts of the prior art, Figure 3 is along Figure 2 The cross-sectional diagram of the AA line, Figure 4 yes Figure 3 A partial enlarged view of .

[0005] See also Figures 2 to 4 The BGA socket device of the prior art includes: a contact 16, including a fixed side terminal 20 and a movable side terminal 21 that contact the ball terminal 2 of the BGA type IC; a body 17, which accommodates the body of the contact 16; a stopper 18, which is arranged at the lower end of the body 17 to fix the contact 16; a lead guide 19, which guides the position of the lead of the contact 16; a cover 11, which is elastically supported on the upper part of the body 17 and is configured to be able to move up and down within a predetermined stroke range relative to the body 17; a sliding member 15, which is arranged on the upper part of the body 17 and moves left and right in a manner linked to the up and down movement of the cover 11 to open and close the movable side terminal 21; a plurality of IC holders 14, which are rotatably assembled on the sliding member 15 and pressurize and fix the upper part of the IC according to the up and down movement of the cover 11; and a holder spring 13, which is arranged on the sliding member 15 and elastically supports the IC holder 14.

[0006] The contact 16 is configured so that the fixed side terminal 20 and the movable side terminal 21, which are symmetrically arranged on the left and right sides of the IC 1, contact the ball terminal 2, and the lower ends of the fixed side terminal 20 and the movable side terminal 21 have a lead 25 fixed to the trunk 24 and extending from the trunk 24. The lead 25 is soldered and fixed to the PCB (not shown).

[0007] The cover 11 is elastically supported on the upper part of the body 17 by the spring 9, can move up and down within a predetermined distance range, and has a slide cam for operating the slider 15 left and right according to the up and down position.

[0008] The slider 15 is formed with a terminal hole 23 , and two terminals 20 , 21 of the contact 16 vertically fixed to the body 17 are arranged through the terminal hole 23 , wherein the terminal hole 23 is provided with a movable member 22 that divides the fixed side terminal 20 and the movable side terminal 21 .

[0009] See also Figure 4 When the cover is pressed down, the slide 15 moves to the right through the slide cam of the cover, and the movable member 22 moves together to open the movable side terminal 21 outward, so that the ball terminal of the IC can be located between the fixed side terminal 20 and the movable side terminal 21. In addition, it is designed that when the slide 15 is in the initial position, the distance between the fixed side terminal 20 and the movable side terminal 21 between the movable member 22 is smaller than the size of the ball terminal. Figure 3 Reference numeral 12 is an IC guide for guiding the position when the IC 1 is loaded.

[0010] Figure 5 (a), (b), and (c) are diagrams showing schematic operation examples of a socket device of the related art.

[0011] Figure 5 (a) shows an initial state, the cover 11 is elastically supported on the body 17 and is located at a predetermined height, so that the fixed side terminal 20 and the movable side terminal 21 of the contact are closely attached to the movable member 22, and thus a predetermined distance L1 is maintained between the two terminals 20 and 21.

[0012] Next, if Figure 5 As shown in (b), when the cover 11 is pressed downward, the movable member 22 moves to the right side of the figure together with the sliding member, so that the movable side terminal 21 is stretched outward to load the IC 1. At this time, the distance L2 between the two terminals 20 and 21 is greater than the diameter of the ball terminal 2.

[0013] Finally, if Figure 5 As shown in (c), when the cover 11 returns to its original position, the movable member 22 returns to its initial position together with the sliding member, and the movable side terminal 21 also returns to its original position, and the fixed side terminal 20 and the movable side terminal 21 fix the ball terminal 2.

[0014] As mentioned above, the BGA socket device in the prior art has the following problems:

[0015] In the clamping type contact, the movable side terminal is operated horizontally to achieve contact or release with the ball terminal. At this time, the movable side terminal is repeatedly elastically deformed, so repeated use will lead to reduced durability, thereby reducing the contact force with the ball terminal. In particular, the BGA socket device of the prior art has a process in which the movable side terminal returns (refer to Figure 5 In (c)), the operating force for returning the slider to its initial position is generated by the elastic restoring force of the movable side terminal. Therefore, as the movable side terminal is used more and more times, the restoring elastic force gradually decreases due to fatigue (stress) of the movable side terminal, thereby weakening the contact force with the spherical terminal, which will lead to a decrease in IC test reliability.

[0016] Typically, a clamping type BGA socket device requires a service life of approximately 20,000 cover cycles, and therefore, improving the durability of the terminals when the clamping type contacts are repeatedly used to solve the problem of reduced elastic restoring force is extremely important for determining the test reliability of the BGA socket device.

[0017] Prior art literature

[0018] Patent Literature

[0019] Korean Utility Model Publication No. 20-0229127 (Announcement Date: 2001.07.19) Summary of the invention

[0020] Problems to be solved by the invention

[0021] The present invention aims to improve the existing BGA socket device for testing semiconductor devices, and to provide a BGA socket device capable of improving the degradation of the contact caused by the reduction of the elastic restoring force of the terminal in contact with the ball terminal in the clamping type contact.

[0022] Means used to solve problems

[0023] The BGA socket device for testing a semiconductor device of the present invention comprises: a contact, wherein the contact comprises a pair of terminals arranged opposite to each other, the pair of terminals being a fixed side terminal and a movable side terminal, wherein the upper tip of each of the fixed side terminal and the movable side terminal is offset by a predetermined distance (d) relative to the center of a spherical terminal; a main body, wherein the contact is vertically arranged and fixed to the main body; a cover, wherein the cover is elastically supported on the upper part of the main body and can move up and down within a predetermined height range relative to the main body; and a sliding member, wherein the sliding member is arranged between the main body and the cover. , sliding left and right in linkage with the up and down movement of the cover, thereby opening and closing the movable side terminal in the horizontal direction, the sliding member is formed with a fixed side terminal accommodating hole for the fixed side terminal to be inserted through and a movable side terminal accommodating hole for the movable side terminal to be inserted through, wherein the fixed side terminal accommodating hole and the movable side terminal accommodating hole are offset from each other by a predetermined distance (d), the predetermined distance (d) is equal to the predetermined distance (d) between the upper tip portions of the contacts, and the length of the fixed side terminal accommodating hole is greater than the length of the movable side terminal accommodating hole.

[0024] Furthermore, the contact for the BGA socket device of the present invention is characterized in that it includes: a pair of terminals, which are a fixed side terminal and a movable side terminal, and the fixed side terminal and the movable side terminal are arranged in a manner opposite to each other; a contact body, which fixes the lower end of the fixed side terminal and the lower end of the movable side terminal as a whole; and a lead, which extends downward from the contact body, wherein the upper tip portion of each of the fixed side terminal and the movable side terminal is offset by a predetermined distance relative to the center of the spherical terminal.

[0025] Effects of the Invention

[0026] The BGA socket device for testing semiconductor devices of the present invention comprises: a double-clamping contact whose tip portions of two terminals are offset by a predetermined distance, and a sliding member that slides the contact forward and backward in a horizontal direction in a manner linked to the vertical movement of a cover to generate an opening and closing operating force. Therefore, unlike the previous return operation of the sliding member that only relies on the elastic force of the contact itself, the operating force required for the sliding member to slide forward and backward is directly generated according to the up and down position of the cover, thereby having the effect of improving the deterioration phenomenon of the contact, improving the test reliability, and extending the life of the socket device and the contact. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 (a) and (b) are the plan view and side view of the BGA type IC;

[0028] Figure 2 A plan view of a socket device of the prior art;

[0029] Figure 3 for Figure 2 The cross-sectional composition diagram of the AA line;

[0030] Figure 4 for Figure 3 A partial enlarged view of

[0031] Figure 5 (a), (b), (c) are schematic diagrams showing a brief working example of a socket device in the prior art;

[0032] Figure 6 A plan view of a BGA socket device according to an embodiment of the present invention;

[0033] Figure 7 for Figure 6 The cross-sectional diagram of the BB line;

[0034] Figure 8 for Figure 6 The cross-sectional diagram of the CC line;

[0035] Fig. 9 (a) and (b) are respectively a front view and a side view of a contact according to an embodiment of the present invention;

[0036] Fig.10 It is a plane composition diagram of the main body of an embodiment of the present invention;

[0037] Fig.11 for Fig.10 The cross-sectional diagram of the DD line;

[0038] Fig.12 for Fig.10 The cross-sectional diagram of the EE line;

[0039] Fig.13 A plan view of the stopper body portion of an embodiment of the present invention;

[0040] Fig.14 (a) and (b) are Fig.13 The cross-sectional diagram of the FF line and the GG line;

[0041] Fig.15 A plan view of a cover according to an embodiment of the present invention;

[0042] Fig.16 for Fig.15 The cross-sectional diagram of the HH line;

[0043] Fig.17 for Fig.15 The cross-sectional diagram of line II;

[0044] Fig.18 A plan view of a sliding member according to an embodiment of the present invention;

[0045] Fig.19 (a), (b), and (c) are Fig.18 The cross-sectional diagram of the JJ line, KK line and LL line;

[0046] Fig. 20 (a) and (b) are Fig.18 The cross-sectional diagram of the MM line and the right side diagram;

[0047] Fig.21 (a) and (b) are Fig.18 The cross-sectional diagram of the NN line and OO line;

[0048] Figure 22 to Figure 24 A schematic diagram briefly illustrating the contact process between the ball terminal of the IC and the contact in the BGA socket device according to the embodiment of the present invention;

[0049] Fig.25 A plan view of a BGA socket device according to another embodiment of the present invention;

[0050] Fig.26 for Fig.25 The cross-sectional structure diagram of the PP line;

[0051] Fig.26 for Fig.25 The cross-sectional diagram of the QQ line;

[0052] Fig.28 (a) and (b) are respectively a front view and a side view of a contact according to another embodiment of the present invention. DETAILED DESCRIPTION

[0053] First, the terms and words used in this specification and claims should not be interpreted limited to the conventional or dictionary meanings, but should be interpreted as meanings and concepts that conform to the technical ideas based on the principle that the inventor can appropriately define the concepts of the terms in order to explain his invention in the best way.

[0054] Therefore, the embodiments described in this specification and the structures shown in the drawings are merely the most preferred embodiments of the present invention and do not represent all technical ideas of the present invention. Therefore, it should be understood that there may be a variety of equivalents and modifications that can replace these at the time of this application.

[0055] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0056] Figure 6 FIG. 1 is a plan view of a BGA socket device according to an embodiment of the present invention. Figure 7 for Figure 6 The cross-sectional structure diagram of the BB line, Figure 8 yes Figure 6 The cross-sectional structure diagram of the CC line.

[0057] See also Figures 6 to 8 The BGA socket device 200 of this embodiment includes: a contact 100, which includes a pair of terminals, the pair of terminals being a fixed side terminal and a movable side terminal; a main body 210, on which a plurality of contacts 100 are vertically arranged; a stop body 220, which is arranged at the lower end of the main body 210 and fixes the contacts 110; a cover 230, which is arranged to be elastically supported on the upper part of the main body 210 and can move up and down within a predetermined height range relative to the main body 210; and a sliding member 240, which is arranged between the main body 210 and the cover 230, and slides left and right in a manner linked to the up and down movement of the cover 230, thereby opening and closing the movable side terminal 120.

[0058] A plurality of cover springs 251 are provided between the main body 210 and the cover 240 , and the cover 240 is assembled to be elastically supported by the cover springs 251 and to be able to move up and down within a predetermined height (S) on the upper portion of the main body 210 .

[0059] A plurality of sliding springs 252 are arranged horizontally between the sliding members 251 of the main body 210. The sliding springs 252 pressurize the sliding member 240 in the horizontal direction to provide the operating force required for the horizontal operation of the sliding member 240. For reference, Figure 6 The sliding spring 252 of the BGA socket device presses the sliding member 240 in the right direction.

[0060] Fig. 9 (a) and (b) are respectively a front view and a side view of the contact of an embodiment of the present invention.

[0061] See also Fig. 9 The contact 100 of the present embodiment is a dual pinch type contact including a pair of terminals arranged opposite to each other via a ball terminal 2 of an IC, the pair of terminals being a fixed side terminal 110 and a movable side terminal 120. The contact 100 includes a contact body 130 that fixes the lower end of the fixed side terminal 110 and the lower end of the movable side terminal 120 into one piece, and a lead 140 extending downward from the contact body 130. The lead 140 is assembled to a through hole of a PCB (not shown) and fixed by welding.

[0062] The fixed terminal 110 includes a pin 111 and an upper tip portion 112 provided at the upper end of the pin 111 to directly contact the ball terminal. Similarly, the movable terminal 120 includes a pin 121 and an upper tip portion 122 provided at the upper end of the pin 121.

[0063] A supporting protrusion 111 a protruding outward may be provided in the middle of the fixed-side pin 111 . The supporting protrusion 111 a is supported by the side wall when located in the receiving hole of the main body, thereby supporting the fixed-side terminal 110 in the horizontal direction.

[0064] Preferably, the fixed side upper tip portion 112 and the movable side upper tip portion 122 are offset by a predetermined distance d relative to the center of the ball terminal 2. Therefore, in the present invention, when the double clamping type contact contacts the ball terminal, the two upper tip portions 112 and 122 are offset by a predetermined distance d relative to the ball terminal 2 to make contact.

[0065] Fig.10 is a plan view of the main body of an embodiment of the present invention, Fig.11 for Fig.10 The cross-sectional structure diagram of the DD line, Fig.12 for Fig.10 The cross-sectional structure diagram of the EE line.

[0066] See also Figures 10 to 12 The main body 210 has a plurality of first receiving holes 211 vertically formed in a predetermined pattern, and the contacts are vertically received in each first receiving hole 211. A fixing member 212 is provided between the fixed side pin 111 and the movable side pin 121 at the upper opening end of each first receiving hole 211, and the fixed side pin 111 and the movable side pin 121 are fixed on the main body 210 in the horizontal direction.

[0067] A pair of stop protrusions 213 are symmetrically disposed on the side wall of the main body 210 . The stop protrusions 213 are formed to protrude from a predetermined height of the main body 210 to combine with the guide protrusions of the cover to limit the vertical movable range of the cover.

[0068] The lower portion of the main body 210 is provided with a guide pin 214 formed to be protruded, and the guide pin 214 guides the assembly position with the PCB during the assembly process with the PCB. There may be one or more such guide pins 214.

[0069] A first fixing protrusion 215 is partially formed on the inner side wall of the main body 210 and is used as an assembling component to be assembled with the stop body 220 .

[0070] Reference numeral 216 is a slide assembly hole that vertically passes through the main body 210 so that the slide 240 and the main body 210 can be assembled.

[0071] Fig.13 is a plan view of the stopper body portion of an embodiment of the present invention, Fig.14 (a) and (b) are Fig.13 The cross-sectional structure diagram of the FF line and the GG line.

[0072] See also Fig.13 and Fig.14 The stop body 220 has a plurality of second receiving holes 221 formed vertically through a predetermined pattern, and the contacts are vertically fixed to each second receiving hole 221. The second receiving holes 221 are arranged at substantially the same position as the first receiving holes of the body, so that the contacts 100 are arranged vertically.

[0073] Preferably, the second receiving hole 221 is a structure whose inner diameter narrows downward, and the inner side wall is formed with a supporting inclined surface 221a with a certain inclination angle, and the contact body 130 is supported by the inclined surface 221a, and the lead 140 is configured to protrude downward from the second receiving hole 221.

[0074] The stopper body 220 is provided with a plurality of vertically extending fixing arms 222, and the upper front end of the fixing arm 222 is provided with a second fixing protrusion 222a, and the second fixing protrusion 222a is assembled to the first fixing protrusion 215 of the main body 210 (see Fig.12 ), the stop body portion 220 is assembled at the lower end of the main body portion 210.

[0075] The stopper body 220 is used to fix the contact together with the main body 210, and is assembled to the main body 210 after the contact 100 is temporarily assembled in the second receiving hole 221 of the stopper body 220. In addition, as another modification, the contact is directly pressed into the receiving hole of the main body, so that even without other stopper body parts, the contact can be fixed only by the main body.

[0076] Fig.15 FIG. 1 is a plan view of a cover according to an embodiment of the present invention. Fig.16 for Fig.15 The cross-sectional structure diagram of the HH line, Fig.17 for Fig.15 The cross-sectional structure diagram of line II.

[0077] See also Figures 15 to 17 The cover 230 is formed with openings 230a on approximately four sides so that the sliding part is exposed when assembled to the main body, and each corner forms a cover spring receiving groove 230a, and each cover spring receiving groove 230a is inserted into the cover spring to be elastically assembled to the main body.

[0078] The cover 230 is provided with a pair of guide arms 231 extending downwardly, and a guide protrusion 231a protrudes from the front end of the lower side of each guide arm 231, and the guide protrusion 231a is aligned with the stop protrusion 213 of the main body 210 (see Fig.11 ) assembly, so that the cover 230 can move up and down within a predetermined height range on the upper part of the main body 210.

[0079] The cover 230 has an opening cam 232 and a closing cam 233 extending in a vertical direction to slide-operate a slider in a horizontal direction.

[0080] Preferably, any one of the four sides of the cover 230 has an opening cam 232, and any one of the two sides at right angles to the opening cam 232 has a closing cam 233. In this embodiment, both sides at right angles to the opening cam 232 have a closing cam 233, so that a uniform horizontal operating force can be transmitted to the sliding direction of the sliding member. More preferably, the opening cam 232 is arranged on one of the four sides of the cover 230, which is located in the movable direction ( Figure 6 The side (side) in the left and right directions.

[0081] The opening cam 232 and the closing cam 233 have inclined surfaces at a certain angle within the predetermined horizontal length t1 and t2 respectively. During the vertical movement of the cover 230, the inclined surfaces contact the sliding member and play the role of horizontally driving the sliding member, which will be described in detail later in conjunction with relevant drawings.

[0082] Fig.18 FIG. 1 is a plan view of a sliding member according to an embodiment of the present invention. Fig.19 (a), (b), and (c) are Fig.18 The cross-sectional diagram of the JJ line, KK line and LL line, Fig. 20 (a) and (b) are Fig.18 The cross-sectional diagram of the MM line and the right side diagram, Fig.21 (a) and (b) are Fig.18 The cross-sectional structure diagram of the NN line and the OO line.

[0083] See also Figures 18 to 21 The sliding member 240 has an opening cam contact portion 241 and a closing cam contact portion 242 corresponding to the opening cam and the closing cam of the cover described above. Each contact portion 241, 242 protrudes integrally from each side of the sliding member 240 and has a certain curved surface, and contacts with the inclined surfaces of the opening cam and the closing cam. The horizontal operation of the sliding member 240 is achieved by the up and down movement of the cover.

[0084] Reference numeral 243 denotes a main body assembly hook, which is assembled in the slider assembly hole 216 (see Fig.10 ) plays a role in guiding the horizontal movement along the sliding direction of the sliding member 240. Reference numeral 244 is a member to which a sliding spring 252 (see Figure 6 ) of the sliding spring assembly guide.

[0085] The sliding member 240 is formed with a fixed side terminal accommodating hole 245 and a movable side terminal accommodating hole 246, which are respectively used for the fixed side pin and the movable side pin of the contact to pass through. Preferably, the fixed side terminal accommodating hole 245 and the movable side terminal accommodating hole 246 are offset by a predetermined distance d, and the length L1 of the fixed side terminal accommodating hole 245 is greater than the length L2 of the movable side terminal accommodating hole 246 (L1>L2).

[0086] The upper surface of the slider 240 is provided with a ball terminal guide 247 for guiding the installation position of the ball terminal 2 during IC loading. In this embodiment, the ball terminal guide 247 is provided by a plurality of blocks at equal distances from the installation center of the ball terminal 2, but is not limited thereto.

[0087] The sliding member 240 is formed with a fixed side terminal accommodating hole 245 and a movable side terminal accommodating hole 246 through which the fixed side pins and the movable side pins of each contact are respectively penetrated. Preferably, the fixed side terminal accommodating hole 245 and the movable side terminal accommodating hole 246 are offset by a predetermined distance d, and the length L1 of the fixed side terminal accommodating hole 245 is longer than the length L2 of the movable side terminal accommodating hole 246 (L1>L2).

[0088] Preferably, a movable opening and closing part 249 protruding into an inverted triangle is provided between the movable side terminal accommodating holes 246 adjacent to each other. The movable opening and closing part 249 has an inverted triangle shape, and the left end and the right end respectively serve as an opening pressurizing end 249a and a closing pressurizing end 249b through two movable side pins 121 adjacent to each other.

[0089] In addition, a distance-maintaining movable member 248 protruding into an inverted triangle is provided between adjacent fixed-side terminal accommodating holes 245 . The distance-maintaining movable member 248 supports the inner side surface of the fixed-side pin 111 and plays a role in maintaining the minimum distance between the upper tip portion 112 of the fixed side and the upper tip portion 122 of the movable side.

[0090] Figure 22 to Figure 24 The figure briefly shows the contact process between the ball terminal of the IC and the contact in the BGA socket device according to the embodiment of the present invention.

[0091] Fig. 22 FIG. 2 shows the initial state of the BGA socket device. The cover 230 is elastically supported by the cover spring 251 and is located at a predetermined height on the upper end of the main body 210. The sliding member 240 is elastically supported by the sliding spring 252 and becomes Fig. 22 The state where the right side direction is pressurized.

[0092] In addition, when the contact body is fixed to the main body 210, the fixed side pin 111 of the contact is supported by contacting the distance maintaining movable member 248, and the movable side pin 121 is supported by contacting the closing pressure end 249b of the opening and closing movable member 249. The initial distance w1 between the fixed side upper side tip portion 112 and the movable side upper side tip portion 122 is smaller than the diameter of the ball terminal.

[0093] Afterwards, if Fig.23 As shown, when the cover 230 is pressed to move a predetermined distance S, the slider 240 is horizontally moved by a predetermined displacement in the left direction by the opening cam 232 of the cover 230 .

[0094] As the sliding member 240 moves horizontally, the opening and closing movable member 249 also moves horizontally while pushing the movable side pin 121. At this time, the opening pressurizing end 249a of the opening and closing movable member 249 pushes the movable side pin 121, and the distance w2 between the two upper tip portions 112 and 122 is stretched to be larger than the diameter of the ball terminal 2. After that, the IC is loaded into the socket device, and the ball terminal 2 is located between the two upper tip portions 112 and 122.

[0095] See also Fig.24 When the external force originally pressing the cover 230 is released, the cover 230 returns to its original position by the elastic restoring force of the cover spring 251, and the sliding member 240 also returns to its original position together with the closing cam 233 by the elastic restoring force of the sliding spring 252.

[0096] In addition, during the return process of the slider 240, the movable side pin 121 contacts the ball terminal 2 while being pressed by the closing pressurizing end 249b of the opening and closing movable member 249, and the initial distance w1 between the two upper tip portions 112 and 122 is designed to be smaller than the diameter of the ball terminal 2 (see Fig. 22 ), therefore, the fixed side upper side tip portion 112 contacts the ball terminal 2 with a contact force generated by a displacement equal to the distance difference b in the initial state.

[0097] Figure 25 to Figure 27 Schematic diagram of a BGA socket device according to another embodiment of the present invention. Fig.25 For a plane composition diagram, Fig.26 for Fig.25 The cross-sectional structure diagram of the PP line, Fig.26 for Fig.25 The cross-sectional structure diagram of the QQ line of FIG. In this embodiment, the contact between the contact and the ball terminal is achieved by the sliding action of the sliding member in a manner linked with the cover, and the description repeated with the above embodiment is omitted, and the difference is mainly described.

[0098] The BGA socket device of the present embodiment includes an IC holder 310 which is rotatably assembled to the slider 2400 and presses and fixes the upper portion of the IC 1 according to the up-and-down movement of the cover 2300 .

[0099] The IC holder 310 includes a hinge shaft 311 rotatably assembled on the sliding member 2400, a pressure rod 312 for pressurizing the upper part of the IC 1 with the hinge shaft 311 as the rotation axis, a bracket 313 eccentrically arranged within the upper and lower travel range of the cover 2300 relative to the hinge shaft 311, and a retainer spring 314 arranged on the sliding member 2400 to elastically support the bracket 313.

[0100] The lower end of the cover 2300 is provided with a pressurizing protrusion 2310 for pressurizing the bracket 313. When the cover 2300 is lowered, the pressurizing protrusion 2310 presses the bracket 313 so that the pressurizing rod 312 opens to load or unload the IC 1. In this embodiment, a pair of IC holders 310 are symmetrically provided at right angles to the sliding direction of the sliding member 2400, and the IC holders 310 are configured to pressurize the IC 1.

[0101] The BGA socket device of this embodiment further includes an IC guide 320 located on the upper portion of the sliding member 2400 and having an inclined surface 321 for guiding the IC 1. The lower edge of the IC guide 320 is supported by the main body 2100 and is disposed on the upper portion of the sliding member 2400, and the IC 1 is loaded into the socket device along the inclined surface 321 so that the IC 1 is installed in the correct position.

[0102] The BGA socket device of the present embodiment further includes a lead wire guide 330 which is located at the lower portion of the stopper body 2200 and through which the leads 140 of the contacts are inserted.

[0103] The lead wire guide 330 has hooks 331 at both ends and is assembled to the main body 2100 so as to be movable up and down. When the socket device is assembled to the PCB, the lead wire guide 330 guides the lead wire 140 so that the lead wire 140 of the contact is accurately inserted into the through hole of the PCB.

[0104] Fig.28 (a) and (b) are respectively a front view and a side view of a contact according to another embodiment of the present invention.

[0105] See also Fig.28 The contact 400 of this embodiment is a double-clamping contact including a pair of terminals, the pair of terminals being a fixed side terminal 410 and a movable side terminal 420. The contact 400 includes a contact body 430 that fixes the lower end of the fixed side terminal 410 and the lower end of the movable side terminal 420 as a whole, and a lead 440 extending downward from the contact body 430.

[0106] The fixed side terminal 410 includes a fixed side pin 411 and a fixed side upper tip portion 412 which is arranged at the upper end of the fixed side pin 411 and is in direct contact with the spherical terminal 2. Correspondingly, the movable side terminal 420 also includes a movable side pin 421 and a movable side upper tip portion 422 which is arranged at the upper end of the movable side pin 421.

[0107] The fixed-side upper tip portion 412 and the movable-side upper tip portion 422 are offset by a predetermined distance d with respect to the center of the ball terminal 2 .

[0108] In particular, in this embodiment, the lead 440 has a partial curved portion. The lead 440 having the curved portion has a predetermined elastic force in the up and down directions and can be compressed to generate contact when contacting the contact sheet of the PCB, thereby increasing the contact force.

[0109] As described above, the present invention has been described through limited embodiments and drawings, but the present invention is not limited thereto. It is obvious that a person skilled in the art can make various modifications and variations within the scope of the technical concept of the present invention and the equivalent scope of the appended claims.

[0110] Description of Reference Numerals

[0111] 100, 400: Contact 110: Fixed side terminal

[0112] 111: Fixed side pin 112: Fixed side upper side tip

[0113] 120: Movable side terminal 121: Movable side pin

[0114] 122: Movable upper tip 130: Contact body

[0115] 140: Lead 200: BGA socket device

[0116] 210, 2100: main body 211: first receiving hole

[0117] 212: Fixing piece 213: Stopping protrusion

[0118] 214: guide pin 215: first fixing protrusion

[0119] 216: Sliding assembly hole

[0120] 220, 2200: stopper body 221: second receiving hole

[0121] 222: fixed arm 222a: second fixed protrusion

[0122] 230, 2300: Cover 231: Guide rod

[0123] 231a: guide protrusion 232: opening cam

[0124] 233: Closing cam 240, 2400: Sliding member

[0125] 241: Open cam contact part 242: Close cam contact part

[0126] 243: Main body assembly hook

[0127] 244: Sliding spring assembly guide 245: Fixed side terminal receiving hole

[0128] 246: Movable terminal accommodating hole 247: Ball terminal guide

[0129] 248: Distance-maintaining movable part 249: Opening and closing movable part

[0130] 249a: Pressurizing end for opening 249b: Pressurizing end for closing

[0131] 251: Cover spring 252: Sliding spring

[0132] 310: IC holder 311: hinge axis

[0133] 312: Pressure rod 313: Bracket

[0134] 314: Retainer spring 320: IC guide

[0135] 330: Wire guide

Claims

1. A BGA socket device for testing a semiconductor device, characterized in that: include: A contact, the contact comprising a pair of terminals arranged opposite to each other, the pair of terminals being a fixed side terminal and a movable side terminal, wherein the upper tip of each of the fixed side terminal and the movable side terminal is offset by a predetermined distance (d) relative to the center of the spherical terminal; A main body, wherein the contact is vertically arranged and fixed to the main body; a cover, the cover being elastically supported on the upper portion of the main body and being able to move up and down within a predetermined height range relative to the main body; as well as A sliding member is provided between the main body and the cover, and slides left and right in linkage with the up and down movement of the cover, so as to open and close the movable side terminal in the horizontal direction, and the sliding member is formed with a fixed side terminal accommodating hole for the fixed side terminal to be inserted through and a movable side terminal accommodating hole for the movable side terminal to be inserted through. Wherein, the fixed side terminal accommodating hole and the movable side terminal accommodating hole are offset from each other by a predetermined distance (d), the predetermined distance (d) is equal to the predetermined distance (d) between the upper tip portions of the contacts, and the length of the fixed side terminal accommodating hole is greater than the length of the movable side terminal accommodating hole.

2. The BGA socket device for semiconductor device testing according to claim 1, wherein: Also includes: A sliding spring elastically supports the sliding member along a sliding direction.

3. The BGA socket device for semiconductor device testing according to claim 1 or 2, characterized in that: The cover comprises: An opening cam and a closing cam extend in a vertical direction and respectively contact an opening cam contact portion and a closing cam contact portion provided on the sliding member according to the up and down movement of the cover to operate the sliding member in a manner of advancing and retreating in a horizontal direction.

4. The BGA socket device for semiconductor device testing according to claim 3, characterized in that: The opening cam is located on any one of four sides of the quadrilateral of the cover, and the closing cam is located on any one of two sides in a right-angle direction with respect to the opening cam.

5. The BGA socket device for semiconductor device testing according to claim 4, characterized in that: The opening cam is located in the sliding direction of the sliding member.

6. The BGA socket device for semiconductor device testing according to claim 1, wherein: Also includes: A ball terminal guide is provided on an upper surface of the slide member and guides a mounting position of the ball terminal of the IC.

7. The BGA socket device for semiconductor device testing according to claim 6, characterized in that: The ball terminal guide is a plurality of blocks that are protrudingly arranged at positions equidistant from a mounting center of the ball terminal.

8. The BGA socket device for semiconductor device testing according to claim 1, wherein: The plurality of movable-side terminal accommodating holes on the sliding member correspond to the plurality of contacts, The sliding member comprises: The movable member for opening and closing is arranged between the movable side terminal accommodating holes adjacent to each other, and has an opening pressurizing end for pressurizing the movable side terminal in an opening direction and a closing pressurizing end for pressurizing the movable side terminal in a closing direction.

9. The BGA socket device for semiconductor device testing according to claim 8, characterized in that: The sliding member further comprises: A distance-maintaining movable member is disposed between the adjacent fixed-side terminal accommodating holes and supports the inner side surface of the fixed-side terminal to maintain a minimum distance between the upper tip portion of the fixed side and the upper tip portion of the movable side.

10. The BGA socket device for semiconductor device testing according to claim 9, characterized in that: A minimum distance ( w1 ) between the fixed-side upper tip portion and the movable-side upper tip portion is smaller than a diameter of the ball terminal.

11. The BGA socket device for semiconductor device testing according to claim 1, wherein: Also includes: A stop body portion is arranged at the lower end of the main body portion and fixes the contact.

12. The BGA socket device for semiconductor device testing according to claim 1, wherein: Also includes: The IC holder is rotatably provided on the slide member and pressurizes and fixes the upper part of the IC according to the up-and-down movement of the cover.

13. The BGA socket device for semiconductor device testing according to claim 1, wherein: Also includes: The IC guide is disposed on the upper portion of the slide member and has an inclined surface for loading and guiding the IC so as to install the IC at a mounting position.

14. The BGA socket device for semiconductor device testing according to claim 1, wherein: Also includes: A lead wire guide is disposed at a lower portion of the main body in a manner that allows the lead wires of the contacts to pass through and be inserted therein.

15. A contact for a BGA socket device, characterized in that: include: a pair of terminals, the pair of terminals being a fixed side terminal and a movable side terminal, the fixed side terminal and the movable side terminal being arranged in a manner opposite to each other; a contact body, wherein the contact body fixes the lower end of the fixed-side terminal and the lower end of the movable-side terminal as a whole; and A lead wire extends downward from the contact body, wherein the upper tip portions of the fixed-side terminal and the movable-side terminal are offset by a predetermined distance relative to the center of the spherical terminal; An initial distance between an upper tip portion of the fixed-side terminal and an upper tip portion of the movable-side terminal is smaller than a diameter of the spherical terminal.

16. The contact for a BGA socket device according to claim 15, characterized in that: The lead wire has a curved portion arranged along a length direction.

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