A heat dissipation component and electronic equipment equipped with the same

Abstract

This application discloses a heat dissipation assembly and an electronic device equipped with the same. The heat dissipation assembly comprises: a first cover plate having a first cavity, the bottom of which has a protrusion; and a second cover plate having a second cavity, the bottom of which is provided with a protruding fin array. The fin array includes a plurality of fins, at least some of which have microstructures on their surfaces. Adjacent protruding fins form a flow channel for storing working fluid. This heat dissipation assembly has a simple structure. The first and second cover plates, when combined, utilize the protrusion for support, forming a vapor chamber. The phase change of the working fluid within the flow channel transfers heat generated by heat sources such as electronic components received on the second cover plate side to the vapor chamber, achieving heat transfer within the vapor chamber, thus realizing efficient heat transfer and good temperature uniformity.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation technology, and in particular to a heat dissipation assembly for cooling electronic components and an electronic device equipped with the heat dissipation assembly. Background Art

[0002] With the rapid development and popularization of electronic information technology, the development of electronic components shows a trend of high speed, high frequency and high integration. Such high computing speed makes the power density of chips continuously increase to new heights, causing the temperature to rise sharply in a short time. Excessive temperature reduces the stability and accuracy of electronic components, and accelerates the aging of products and reduces the cycle life. Therefore, the heat dissipation technology of electronic products is gradually becoming a bottleneck for the replacement of electronic products, and the research and development of safe and efficient heat dissipation technology has become a top priority in the current electronic product field. Steam chamber heat pipes use liquid phase change, have good temperature uniformity and heat dissipation capabilities, and have become the mainstream technology for passive heat dissipation. However, the efficiency of such steam chamber heat pipes is not high. How to improve the phase change efficiency of phase change media and improve the heat dissipation efficiency in increasingly thin electronic products is becoming more and more urgent.

[0003] Therefore, the industry is in urgent need of a miniaturized, lightweight and thin steam chamber heat dissipation component. Summary of the invention

[0004] The purpose of the present invention is to provide a new heat dissipation assembly, which is used to provide efficient cooling for electronic components with small area and high heat flux density. The heat dissipation assembly has a simple internal structure.

[0005] In order to achieve the above purpose, this application adopts the following technical solutions:

[0006] A heat dissipation component, characterized by having:

[0007] The first cover plate has a first cavity, the bottom of which is provided with a protrusion, and the second cover plate has a second cavity, the bottom of which is provided with a protruding fin array, the fin array includes a plurality of fins, and two adjacent fins form a flow channel for storing working fluid.

[0008] Preferably, at least some of the fins are provided with microstructures on part or all of their surfaces. That is, some of the fins in the fin array are provided with microstructures, and the microstructures are provided on part or all of their surfaces. Or all of the fins in the fin array are provided with microstructures, and the microstructures are provided on part or all of their surfaces.

[0009] Preferably, the fin array includes a first fin array and a second fin array that are alternately arranged, the first fin array includes a plurality of first fins whose tops are connected to the ends of the protrusions, and the second fin array includes a plurality of second fins, and the height h1 of the first fins is greater than the height h2 of the second fins.

[0010] Preferably, the ratio of the height h2 of the second fin to the height h1 of the first fin is greater than or equal to 0.1, and a better ratio is between 0.1 and 0.95.

[0011] Preferably, at least a portion of the surface of the first fin is configured with a microstructure.

[0012] Preferably, the top protrusion of the first fin is in the shape of a continuous strip, and the end of the strip is connected to the first fin array to form a steam channel.

[0013] Preferably, the protrusions are in the shape of discrete cylinders, spheres, hemispheres, or diamonds, and are arranged in an array or randomly.

[0014] Preferably, the cross section of the flow channel is U-shaped, square or triangular.

[0015] Preferably, the microstructure comprises protrusions and / or depressions or the microstructure comprises a porous material layer.

[0016] Preferably, the working fluid includes at least one or more of water, deionized water, alcohol, methanol, acetone, and ethylene glycol.

[0017] The embodiment of the present application also provides an electronic device equipped with the above-mentioned heat dissipation component. Since the heat dissipation component can be designed to be very thin, it can be used in light and thin electronic devices, such as smart phones.

[0018] Beneficial Effects

[0019] Compared with the solutions in the prior art, the heat dissipation assembly proposed in the embodiment of the present application has a simple structure, and the entire surface of the heat absorption structure is used for cooling, so it has extremely high thermal conductivity and good temperature uniformity, providing efficient cooling for small-area and high-heat flux density electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of this specification or the prior art, the drawings required for use in the embodiments or the prior art description are briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this specification. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor:

[0021] Figure 1 This is a schematic diagram of the structure of the heat dissipation assembly of an embodiment of the present application;

[0022] Figure 1a for Figure 1 A schematic diagram of the structure from one perspective;

[0023] Figure 1b for Figure 1a Schematic diagram of the cross section of the middle BB;

[0024] Figure 2 This is a schematic structural diagram of a first cover plate according to a first embodiment of the present application;

[0025] Figure 3 This is a schematic structural diagram of a first cover plate of a second embodiment of the present application;

[0026] Figure 4 This is a schematic structural diagram of a first cover plate of a third embodiment of the present application;

[0027] Figure 5 This is a schematic structural diagram of a second cover plate according to an embodiment of the present application;

[0028] Figure 6 for Figure 5 Schematic diagram of the cross section of AA;

[0029] Figure 7 for Figure 6 A partial enlarged schematic diagram of B in the middle;

[0030] Figure 8 for Figure 5 A cross-sectional schematic diagram of a modified embodiment of AA;

[0031] Fig. 9 for Figure 8 A partial enlarged schematic diagram of C in the middle. DETAILED DESCRIPTION

[0032] In order to enable those skilled in the art to better understand the technical solutions proposed in the present invention, the technical solutions in the embodiments of this specification will be clearly and completely described below in conjunction with the drawings in the embodiments of this specification. Obviously, the described embodiments are only part of the embodiments in this specification, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field without creative work based on one or more embodiments in this specification shall fall within the scope of protection of the present invention.

[0033] The present application provides a heat dissipation component, which is used to provide efficient cooling for electronic components with small areas and high heat flux density, so as to solve the problem of heat dissipation of high heat flux density in a small space, greatly improve the heat dissipation efficiency and temperature uniformity of the heat dissipation component, and because of its small overall thickness, it can be used for heat dissipation of portable intelligent processors. At least part of the surface of the fin is configured with a capillary structure to improve the capillary force. The heat dissipation component has: a first cover plate, which has a first cavity, the bottom of the first cavity is provided with a protrusion, a second cover plate, which has a second cavity, the bottom of the second cavity is configured with a protruding fin array, the fin array includes a plurality of fins, and two adjacent fins constitute a flow channel for storing working fluid. That is, the depression between two adjacent fins is used to store working fluid. Adjacent flow channels are connected. Microstructures are configured on part or all of the surface of the fin to improve the capillary force of the flow channel. In this way, the heat dissipation component has a simple structure. After the first cover plate and the second cover plate are combined, the protrusion plays a supporting role to form a steam chamber. The phase change of the working fluid in the flow channel is used to transfer the heat generated by the heat source such as the electronic components received on the second cover plate side to the steam chamber to achieve heat transfer in the steam chamber, thereby achieving efficient heat transfer and having good temperature uniformity. The flow channel (cross section) is U-shaped, inverted triangle or square. In this way, the heat dissipation component uses the phase change and flow process of the working fluid in the flow to evenly transfer and disperse the heat of the heat source received on the second cover plate side, thereby achieving efficient heat transfer. The heat dissipation component has good temperature uniformity.

[0034] The heat dissipation assembly proposed in this application is described in detail below with reference to the accompanying drawings.

[0035] like Figure 1 The figure is a schematic diagram of the structure of the heat dissipation assembly of the embodiment of the present application; the heat dissipation assembly 100 comprises: a first cover plate 101, and a second cover plate 102 matched and connected with the first cover plate 101. During manufacturing, after the first cover plate 101 and the second cover plate 102 are combined, the working fluid is injected through the injection port and then the injection port is vacuum-sealed. Figure 1a for Figure 1 A schematic diagram of the structure from one perspective; Figure 1b for Figure 1a A cross-sectional diagram of BB in the figure; a protrusion 101c is provided in the first cavity a in the first cover plate 101, which is connected to the first fin array 102b to form a steam cavity. Two fins in the second fin array 102c form a flow channel for storing working fluid. The material of the first cover plate / the second cover plate can be copper or aluminum, stainless steel, copper alloy, titanium, titanium alloy and other metals or polymers such as PI, PET and the like.

[0036] Next, combine Figure 2-Figure 9 The heat dissipation assembly of the application embodiment is described in detail.

[0037] like Figure 2The figure shows a schematic diagram of the structure of the first cover plate of the first embodiment; a side wall 101b is disposed on one side of the first cover plate 101, and an injection port 101a is disposed on the side wall 101b on one side, through which a cooling liquid working medium is injected into the heat dissipation component, and after a preset amount of working medium is injected, a vacuum is drawn and the injection port 101a is sealed. The first cover plate 101 is sealedly connected to the second cover plate 102 (not shown) through the end of the side wall 101b. The phase change working medium includes at least one of water, deionized water, alcohol, methanol, acetone, ethylene glycol, etc., or a combination thereof. In this embodiment, the protrusion 101c is configured in a continuous long strip shape. The end of the protrusion 101c is in the same plane as the end of the side wall 101b, or the protrusion 101c does not exceed the plane of the end of the side wall 101b (see Figure 1b ).

[0038] In one embodiment, the protrusion is in a discontinuous segmented configuration such as Figure 3 As shown, the first cover plate 201 has a first cavity therein, and a side wall 201b is disposed on one side of the first cover plate, and an injection port 201a is disposed on the side wall 201b on one side of the first cover plate. The bottom of the first cavity is provided with a plurality of protrusions 201c arranged in sections, and there are grooves 201d between adjacent protrusions. The length of each section or each protrusion is the same or different. The width of the protrusion (L1-L2 direction) is between 10μm and 3mm, and the width of the interval between adjacent protrusions is between 100μm and 10mm. In one embodiment, the cross section of the protrusion is square, and at least one side includes a sharp corner; or the cross section is round or circular (semicircular), in which case the protrusions are randomly arranged or arranged in an array, and their diameters can be the same or different, and the width of the protrusion is the diameter or the maximum diameter.

[0039] In one embodiment, the protrusions are arranged in an array such as Figure 4 As shown, the first cover plate 301 has a first cavity therein, a side wall 301b is disposed on one side of the first cover plate, an injection port 301a is disposed on the side wall 301b on one side of the first cover plate, and a plurality of protrusions 301c are disposed at the bottom of the first cavity. The protrusions 301c are rhombus-shaped. In other embodiments, the protrusions 301c may be cylindrical, spherical, hemispherical, etc., and may be arranged in an array or randomly arranged.

[0040] Next, combine Figure 5-Figure 9 The structure of the second cover plate of one embodiment of the present application is described. The second cover plate 102 includes a side wall 102a, which is used to connect with the side wall of the first cover plate (not shown), and has a second cavity therein. The bottom of the second cavity is configured with protruding fins.

[0041] Please refer to Figure 6 and Figure 7 For one embodiment Figure 5Schematic cross-sectional view along A-A; the bottom of the second cavity is provided with protruding first fin array 102b and second fin array 102c.

[0042] The first fin array 102b includes a plurality of first fins 102b1, and the top 102b2 thereof is used to connect to the end of a protrusion (not shown in the figure). Preferably, at least part of the surface of the first fin is provided with microstructures 102d (micro-nano structures). Adjacent first fins form a flow channel for storing the working fluid (or the first fin and its adjacent side wall form a flow channel for storing the working fluid), and the two adjacent flow channels are connected. Configuring microstructures on the surface of the fins increases the capillary force, so that the liquid working fluid is stored in the flow channel. Preferably, the tops 102b2 of the first fins 102b1 are in the same plane. In one embodiment, the plane where the tops 102b2 of the first fins 102b1 are located is in the same plane as the end of the side wall 102b.

[0043] The second fin array 102c includes a plurality of second fins 102c1. At least part of the surface of the second fin is provided with microstructures 102d (micro-nano structures). Adjacent second fins form a flow channel for storing the working fluid (or the second fin and its adjacent side wall form a flow channel for storing the working fluid), and the two adjacent flow channels are connected. Configuring microstructures on the surface of the fins increases the capillary force, so that the liquid working fluid is stored in the flow channel.

[0044] In this embodiment, the height h1 of the first fin 102b1 is higher than the height h2 of the second fin 102c1. After the second cover plate and the first cover plate are combined, the top 102b2 of the first fin 102b1 contacts the end of the protrusion of the first cover plate. In this way, two adjacent protrusions and the first fin array matched therewith, and the inner side walls of the first / second cover plates and the adjacent protrusions and the matched first fin arrays form an air duct for steam flow. The ratio of the height h2 of the second fin to the height h1 of the first fin is greater than or equal to 0.1. Preferably, the ratio of the height h2 of the second fin to the height h1 of the first fin is between 0.1 and 0.95 (in this way, the air duct flow efficiency is improved by means of the steam pressure). The width w1 of the first fin array is equivalent to or w1 < w2 of the width of the second fin array between the two first fin arrays. The width w3 of the second fin array between the first fin array and the adjacent side wall.

[0045] The first fin array and the second fin array are arranged alternately. After the first / second cover plate is combined, the protrusion is used to contact the top of the first fin to form a support component. The air channel for steam flow is formed between two adjacent support components or between the support component and the inner side of the first / second cover plate side wall adjacent to it. The two adjacent second fins included in the second fin array form a flow channel for storing the working fluid. Preferably, the flow channel for storing the working fluid is also formed between the two adjacent first fins included in the first fin array. The adjacent flow channels are connected, which is equivalent to cooling the entire surface. By configuring a microstructure on at least part of the surface of the second fin or configuring a microstructure on at least part of the surface of the first fin and the second fin, the capillary force of the flow channel is improved, and the heat dissipation efficiency of the heat dissipation component is further improved.

[0046] As Figure 6 Variations of the embodiments, such as Figure 8 , Fig. 9 The figure shows a cross-sectional schematic diagram of the second cover plate of another embodiment. The second cover plate includes a side wall 202a, which is used to connect to the side wall of the first cover plate (not shown), and has a second cavity therein, and the bottom of the second cavity is provided with a fin array, and the fin array includes a plurality of protruding fins 202b, and at least part of the surface of the fin 202b is provided with a microstructure, and the microstructure includes a plurality of protrusions 202c. In other embodiments, the microstructure includes a plurality of depressions. In one embodiment, the microstructure is a porous material layer or a secondary microstructure of a porous material. The height of the fin 202b is substantially the same, and the depth of the depression between the two fins 202b is the same. Or the height of the fin 202b is substantially the same, and the depth of the depression between the two fins 202b is different. The end 202b1 of some fins 202b contacts the protrusion of the first cover plate (not shown), so that after the first / second cover plate is assembled, the protrusion of the first cover plate constitutes a supporting component, and two adjacent fins 202b will constitute a flow channel for storing the working medium. At least part of the surface of the fin 202b is configured with a microstructure, which improves the capillary force and the ability to accommodate the liquid working medium, thereby improving the heat dissipation efficiency of the heat dissipation component. The protrusions that contact the end 202b1 of the fin 202b can be continuous, or they can be discrete protrusions configured in an array or randomly configured. It is used to separate the steam cavity through the protrusion after the first / second cover plate is assembled, and the liquid working medium is stored in the flow channel.

[0047] In one embodiment, the protrusion of the first cover plate includes at least one pointed angle, and the cross-section of the protrusion is rounded and semicircular, so that after contacting the top of the fin, there is a space between the bottom of the first cavity and the fin, which is used as a steam cavity to transfer heat.

[0048] In the design of the heat dissipation component, its structure is simple, with a first cover plate and a second cover plate connected in a matching manner. The bottom of the second cavity of the second cover plate is provided with a protruding fin array, the fin array includes a plurality of fins, and the surface of at least some of the fins is provided with a microstructure, and two adjacent fins constitute a flow channel for storing the working fluid (sometimes, the depression between the fin and its adjacent side wall constitutes the flow channel for storing the working fluid). Adjacent flow channels are connected. After the first cover plate is combined with the second cover plate, the protrusion is used to play a supporting role to form a steam chamber, and the phase change of the working fluid in the flow channel is used to transfer the heat generated by the heat source such as the electronic components received by the second cover plate side to the steam chamber, and the heat transfer is realized in the steam chamber, thereby realizing efficient heat transfer, and the microstructure is configured on at least part of the surface of the fin to improve the capillary force, thereby further improving the heat dissipation efficiency of the heat dissipation component.

[0049] In the design of the fin, at least part of the surface of the fin is configured with a microstructure, which includes a protruding and / or recessed design, or the microstructure includes a porous material. Such a design improves the capillary force of the working medium therein and improves the heat dissipation effect.

[0050] In the design of the fin, it includes a plurality of first fins, whose ends are in contact (connected) with the protrusions. Preferably, the protrusions are in a continuous strip shape, so that after the ends of the first fins are in contact with the protrusions, a steam channel is formed between two adjacent protrusions. And it includes a plurality of second fins, the height of the second fins is lower than the height of the first fins. The second fins are used to form a flow channel for storing working fluids. In order to improve its ability to store working fluids, preferably, a microstructure is partially or fully configured on the surface of the second fin, so that the ability to store working fluids is improved while improving the heat dissipation efficiency. Preferably, a microstructure is partially or fully configured on the surface of the first fin. The microstructure can be a porous layer composed of porous materials.

[0051] In the design of the first cover plate, a first cavity is disposed therein, and a plurality of protrusions are disposed at the bottom of the cavity. Preferably, the top of the protrusion (also called the end) is in the same plane as the end of the side wall. Or the protrusion does not protrude from the plane where the end of the side wall is located. The protrusion is in the shape of a continuous elongated cuboid or a discontinuous elongated cuboid, and the length of each section or each may be the same or different. The interval between adjacent protrusions is between 100μm and 10mm. Preferably, the cross-section of the protrusion is square or at least one side contains a pointed corner or round package or the cross-section is circular (semicircular). Preferably, when the protrusion is discontinuous and discrete, it is randomly configured or array configured.

[0052] In the design of the second cover plate, a second cavity is provided therein, and a protruding fin array is arranged at the bottom of the second cavity. The fin array includes a plurality of fins protruding from the bottom of the second cavity. The heights of the fins are the same or different, and at least part of the surface of the fins is arranged with a microstructure; or the heights of the fins are the same, and the depths of the recesses between the two fins are the same or different.

[0053] The heat dissipation assembly in the above embodiment can be used to dissipate heat from electronic components (such as processors, batteries, etc.) of electronic equipment. Preferably, the thickness of the heat dissipation assembly is less than 3 mm, which can well solve the heat dissipation problem in a narrow space.

[0054] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with the technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the protection scope of the present invention. Any equivalent transformation or modification made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A heat dissipation component, characterized in that: The heat dissipation component has a thickness of less than 3 mm and has: The first cover plate has a first cavity, and a protrusion is provided at the bottom of the first cavity. The protrusion plays a supporting role to form a steam cavity. A second cover plate has a second cavity, wherein a protruding fin array is disposed at the bottom of the second cavity, wherein the fin array comprises a plurality of fins, wherein two adjacent fins constitute a flow channel for storing a working medium, wherein at least a portion of the surfaces of the fins or the entire surface thereof are disposed with a microstructure, and wherein the fin array comprises a first fin array and a second fin array that are alternately disposed. The first fin array includes a plurality of first fins, the tops of which are connected to the ends of the protrusions. The second fin array includes a plurality of second fins. The height h1 of the first fin is greater than the height h2 of the second fin, and the ratio of the height h2 of the second fin to the height h1 of the first fin is between 0.1 and 0.

95.

2. The heat dissipation assembly according to claim 1, wherein: The protrusion is in the shape of a continuous strip, and the end portion thereof is connected to the first fin array to form a steam channel.

3. The heat dissipation assembly according to claim 1, wherein: The protrusions are in the shape of discrete cylinders, spheres, hemispheres, or diamonds, and are arranged in an array or randomly.

4. The heat dissipation assembly according to claim 1, characterized in that The cross section of the flow channel is U-shaped, square or triangular.

5. The heat dissipation assembly according to claim 1, wherein: The microstructure comprises protrusions and / or depressions or the microstructure comprises a porous material layer.

6. The heat dissipation assembly according to claim 1, wherein: The working fluid includes at least one or more of water, deionized water, alcohol, methanol, acetone, and ethylene glycol.

7. An electronic device, characterized in that: Equipped with a heat dissipation component as described in any one of claims 1-6.

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