Levitation transportation equipment and laser processing equipment

Abstract

The present invention relates to a levitation transport device and a laser processing device. According to one embodiment, the levitation transport device is used to transport a substrate while levitating it by spraying gas onto its lower surface. The levitation transport device includes: a plurality of injection ports configured to spray gas onto the substrate; a downstream flow path configured to supply gas to the plurality of injection ports; an upstream flow path configured to supply gas to the downstream flow path; and a gas supply port configured to supply gas to the downstream flow path. The cross-sectional area of the upstream flow path is configured to be larger than the cross-sectional area of the downstream flow path.

Description

Technical Field

[0001] The present invention relates to a levitation transport device and a laser processing device, and more particularly to a levitation transport device and a laser processing device for transporting a substrate while suspending the substrate. Background Art

[0002] In the manufacturing of liquid crystal display panels, organic EL panels, and the like, levitation transport equipment is widely used because of the large substrates used. This equipment is used to transport the substrates while levitating them. Japanese Unexamined Patent Application Publication No. 2019-192681 discloses a technology related to a levitation transport equipment that levitates and transports substrates by blowing air toward them. Summary of the Invention

[0003] A problem is that in levitation transport equipment that transports a substrate while levitating it, the amount of levitation of the substrate can vary. In particular, there is a need for a laser processing device that irradiates a substrate with a laser beam to improve the levitation accuracy of the substrate, as variations in the amount of levitation significantly affect the quality of thin films and other materials formed on the substrate after laser processing.

[0004] Other problems and novel features will become readily apparent from the description of this specification and the accompanying drawings.

[0005] One exemplary aspect is a levitation transport device for transporting a substrate while levitating it by spraying gas onto its lower surface. The levitation transport device includes: a plurality of injection ports configured to spray gas onto the substrate; a first flow path configured to supply gas to the plurality of injection ports; a second flow path configured to supply gas to the first flow path; and a gas supply port configured to supply gas to the second flow path. The cross-sectional area of the second flow path is configured to be larger than that of the first flow path.

[0006] A laser processing apparatus according to an example aspect includes the above-described levitation transportation apparatus and a laser generating unit configured to generate a laser beam to be applied to a substrate.

[0007] According to the above aspects, a levitation transport device capable of improving the levitation accuracy of a substrate can be provided.

[0008] The above and other objects, features and advantages of the present disclosure will become more fully understood from the detailed description given below and the accompanying drawings, which are given by way of illustration only and thus should not be construed as limiting the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a perspective exploded view of the suspended transportation device according to the first embodiment.

[0010] Figure 2 It is a plan view of the suspended transportation device according to the first embodiment.

[0011] Figure 3 This is a top view of the lower plate of the suspended transportation device according to the first embodiment.

[0012] Figure 4 It is a cross-sectional view of the suspension transportation device according to the first embodiment.

[0013] Figure 5 This is a schematic diagram of another structural example of the levitation transportation equipment of the first embodiment (a top view of the lower plate).

[0014] Figure 6 This is a cross-sectional view near the injection port of the levitation transportation equipment according to the second embodiment.

[0015] Figure 7 A perspective view of a columnar component.

[0016] Figure 8 A cross-sectional view illustrating an operation of inserting a columnar member into a hole.

[0017] Figure 9 A cross-sectional view illustrating an operation of inserting a columnar member into a hole.

[0018] Figure 10 4 is a cross-sectional view of a laser processing apparatus according to a third embodiment. DETAILED DESCRIPTION

[0019] First embodiment

[0020] Hereinafter, a first embodiment will be described with reference to the drawings. Figure 1 It is a perspective exploded view of the suspended transportation device according to the first embodiment. Figure 2 It is a plan view of the suspended transportation device according to the first embodiment. Figure 3 This is a top view of the lower plate of the suspended transportation device according to the first embodiment. Figure 4 FIG. 1 is a cross-sectional view of the first embodiment of the suspended transport device. Figure 4 As shown, the levitation transport device 1 of this embodiment is a device that transports the substrate 30 in a transport direction (positive direction of the x-axis) while levitating the substrate 30 by spraying gas onto the lower surface of the substrate 30 .

[0021] like Figure 1 As shown, the levitation transport device 1 according to this embodiment includes an upper plate 10 and a lower plate 20. The upper plate 10 is disposed on the upper side (positive side in the z-axis direction) of the levitation transport device 1. The lower plate 20 is disposed below the upper plate 10 (negative side in the z-axis direction). For example, the upper plate 10 and the lower plate 20 can be made of a metal material such as an aluminum alloy, which may be plated.

[0022] like Figure 1 and Figure 2 As shown, a plurality of injection ports 11 for injecting gas upward are provided in the surface of the upper plate 10. Each injection port 11 can be formed, for example, by forming a hole extending in the z-axis direction in the upper plate 10. As will be described later, each injection port 11 can be formed by inserting a columnar member (a columnar member whose side is cut away in the vertical direction) into a hole portion provided in the upper plate 10 (see the second embodiment).

[0023] like Figure 4 As shown, the levitation transport device 1 of this embodiment ejects gas from a plurality of ejection ports 11 toward the positive side in the z-axis direction, causing the ejected gas to collide with the lower surface of the substrate 30, thereby levitating the substrate 30. By using a transport device (not shown) to move the substrate 30 in the transport direction (positive direction of the x-axis), the substrate 30 can be transported along the transport direction while being levitated.

[0024] exist Figure 2 In the example shown, the plurality of ejection ports 11 are regularly arranged at predetermined intervals in the x-axis direction and the y-axis direction. However, in the present embodiment, the arrangement of the plurality of ejection ports 11 is not limited to Figure 2 The arrangement shown in the figure can be any arrangement. A plurality of through holes 12 are formed near the periphery of the upper plate 10, and leveling bolts 42 (see Figure 4 ) is inserted into the through hole 12.

[0025] like Figure 1 As shown, the lower plate 20 is arranged below the upper plate 10. Figure 1 and Figure 3 As shown, a surface of the lower plate 20 facing the upper plate 10 (ie, the positive side in the z-axis direction) is provided with a plurality of flow paths 21 and 22 for supplying gas to the plurality of injection ports 11 of the upper plate 10 .

[0026] Specifically, if Figure 3 As shown, upstream flow path 21 and downstream flow path 22 are provided on the surface of lower plate 20. In this specification, flow paths 21 and 22 on the gas supply port 27 side are defined as upstream flow paths, and flow paths 21 and 22 on the injection port 11 side are defined as downstream flow paths.

[0027] The upstream flow path 21 supplies the gas supplied from the gas supply port 27 to the positive side and the negative side of the y-axis direction of the lower plate 20. That is, the upstream flow path 21 includes a flow path 21_1 provided on the positive side of the y-axis direction of the lower plate 20, a flow path 21_2 provided on the negative side of the y-axis direction of the lower plate, and a flow path 21_3 for supplying the gas supplied from the gas supply port 27 to each of the flow paths 21_1 and 21_2. Figure 3In the illustrated example, the upstream flow path 21 (flow paths 21_1 to 21_3 ) is H-shaped, and the gas supply port 27 is provided in the upstream flow path 21 at a point-symmetrical position with respect to the gas supply port 27 .

[0028] The downstream flow path 22 supplies the gas supplied from the gas supply port 27 to the plurality of injection ports 11 provided on the upper plate 10 via the upstream flow path 21. The downstream flow path 22 is connected to the upstream flow path 21 at the upstream end. The downstream flow path 22 is branched on the downstream side, and the ends 23 of the branched flow path are respectively connected to the injection ports 11 (see Figure 2 Specifically, each downstream flow path 22 includes a flow path (trunk) extending in the y-axis direction from the connection point with the upstream flow path 21 and a plurality of flow paths (branches) extending in the x-direction from the flow path (trunk). The end portions 23 of the plurality of flow paths (branches) extending in the x-axis direction are respectively connected to the injection ports 11 (see Figure 2 ).

[0029] exist Figure 3 In the illustrated example, the upstream flow path 21 (flow paths 21_1 and 21_2) is provided to extend in the x-axis direction, and a plurality of downstream flow paths are connected to the upstream flow path 21 (flow paths 21_1, 21_2) at each end on the upstream side at substantially equal intervals therebetween.

[0030] Specifically, multiple downstream flow paths 22 are provided on the positive side of flow path 21_1 of upstream flow path 21 in the y-axis direction, and the upstream ends of the downstream flow paths 22 are connected to flow path 21_1 at substantially equal intervals. Similarly, multiple downstream flow paths 22 are provided on the negative side of flow path 21_1 of upstream flow path 21 in the y-axis direction, and the upstream ends of the downstream flow paths 22 are connected to flow path 21_1 at substantially equal intervals. Note that the multiple downstream flow paths 22 connected to flow path 21_2 of upstream flow path 21 have the same structure as described above. Here, "substantially equally spaced" includes not only equal spacing but also slight deviations from the equal spacing.

[0031] In this embodiment, the cross-sectional area of the upstream flow path 21 is configured to be larger than that of the downstream flow path 22. That is, since the upstream flow path 21 serves as the flow path for supplying gas from the gas supply port 27 to each downstream flow path 22, the amount of gas flowing through the upstream flow path 21 is greater than the amount of gas flowing through the downstream flow path 22. Therefore, by making the cross-sectional area of the upstream flow path 21 larger than that of the downstream flow path 22, the flow resistance from the gas supply port 27 to the injection port 11 can be reduced. This reduces the pressure loss of the gas in the upstream flow path 21 and the downstream flow path 22, allowing gas to be supplied to the injection port 11 at a pressure substantially the same as that of the gas supplied to the gas supply port 27.

[0032] Specifically, in this embodiment, because the cross-sectional area of upstream flow path 21 is larger than that of downstream flow path 22, the gas supplied from gas supply port 27 can be evenly distributed to upstream flow path 21. Therefore, after the gas is evenly diffused throughout upstream flow path 21, it can be directed to downstream flow path 22. This prevents a decrease in the pressure of the gas (compressed gas) in downstream flow path 22. This also effectively prevents variations in the flow rate of gas ejected from ejection port 11, thereby improving the levitation accuracy of substrate 30.

[0033] For example, in this embodiment, the cross-sectional area of the upstream flow path 21 and the cross-sectional area of the downstream flow path 22 can be adjusted by adjusting the width and depth of each flow path. For example, the width of the upstream flow path 21 can be made wider than the width of the downstream flow path 22. The depth of the upstream flow path 21 can be made deeper than the depth of the downstream flow path 22. The width of the upstream flow path 21 can be made wider than the width of the downstream flow path 22, and the depth of the upstream flow path 21 can be made deeper than the depth of the downstream flow path 22.

[0034] In this embodiment, the cross-sectional area of the upstream flow path 21 can be configured to be larger than the cross-sectional area of the gas supply port 27. With this configuration, the gas can be uniformly distributed to the upstream flow path 21. Note that the gas is supplied to the upstream flow path 21 by connecting a pipe to the gas supply port 27, and at this time, the cross-sectional area of each gas supply port 27 is, for example, the cross-sectional area of a water outlet hole to be connected to a joint connected to the gas supply port 27.

[0035] In this embodiment, the cross-sectional area of the downstream flow path 22 can be configured to be substantially the same as the cross-sectional area of the injection port 11. With this configuration, variations in the flow rate of the gas injected from the injection port 11 can be more effectively prevented. Here, "substantially the same" includes not only the case where the cross-sectional area of the downstream flow path 22 is the same as the cross-sectional area of the injection port 11, but also the case where the cross-sectional area of the downstream flow path 22 is slightly different from the cross-sectional area of the injection port 11.

[0036] Figure 3 The arrangement of the upstream flow path 21 and the downstream flow path 22 shown is an example, and in the present embodiment, the arrangement of the upstream flow path 21 and the downstream flow path 22 can be freely determined. That is, the arrangement of the upstream flow path 21 and the downstream flow path 22 can be arbitrarily arranged as long as the upstream flow path 21 and the downstream flow path 22 are configured to supply gas from the gas supply port 27 to the injection port 11 via the upstream flow path 21 and the downstream flow path 22.

[0037] A leveling bolt 42 (see FIG. Figure 4 ) is inserted into the through hole 25. The position of the through hole 25 in the lower plate 20 corresponds to the position of the through hole 12 in the upper plate 10.

[0038] In this embodiment, the upper plate 10 and the lower plate 20 are fastened to each other using fastening bolts. For example, a plurality of fastening bolts 41 (see FIG. 1 ) inserted from the lower plate 20 side may be used. Figure 4 ) Fasten the upper plate 10 and the lower plate 20 to each other.

[0039] As described above, the levitation transport device 1 according to this embodiment supplies gas from the gas supply port 27 to the injection port 11 via the upstream flow path 21 and the downstream flow path 22. Figure 4 As shown, gas may be injected from the plurality of injection ports 11 to the lower surface of the substrate 30, thereby levitating the substrate 30. Although the substrate 30 is typically a glass substrate, the substrate 30 transported by the levitation transport apparatus 1 is not limited to a glass substrate.

[0040] Furthermore, the levitation transport device 1 of this embodiment is composed of two plates, an upper plate 10 and a lower plate 20. This configuration effectively prevents the formation of a gap between the contact surfaces of the upper plate 10 and the lower plate 20, and effectively prevents gas leakage from the contact surfaces of the upper plate 10 and the lower plate 20. Consequently, variations in the flow rate of the gas ejected from the plurality of ejection ports 11 can be effectively prevented, effectively improving the levitation accuracy of the substrate 30.

[0041] Although the example in which the flow paths 21 and 22 are formed on the lower plate has been described above, in the levitation transport apparatus 1 according to this embodiment, the flow paths 21 and 22 may be formed on at least one of the upper plate 10 and the lower plate 20. Specifically, as described above, the flow paths 21 and 22 may be formed only on the lower plate 20. Alternatively, the flow paths 21 and 22 may be formed only on the upper plate 10. In addition, the flow paths 21, 22 may also be formed on both the upper plate 10 and the lower plate 20.

[0042] In this embodiment, if Figure 4 As shown, the thickness of the lower plate 20 can be configured to be thinner than that of the upper plate 10. When the thickness of the lower plate 20 is made thinner than that of the upper plate 10, if the upper plate 10 and the lower plate 20 are fastened by a plurality of fastening bolts 41 (see FIG. Figure 4 ) are fastened to each other, the lower plate 20, which is thinner than the upper plate 10, bends along the surface of the upper plate 10 (contact surface) at the contact surface between the upper plate 10 and the lower plate 20, thereby closing the gap in the contact surface between the upper plate 10 and the lower plate 20. Therefore, it is possible to more reliably prevent gas leakage from the contact surface between the upper plate 10 and the lower plate 20.

[0043] In the levitation transport system 1 of this embodiment, since it is necessary to improve the surface accuracy of the surface of the levitation transport system 1 that faces the base plate 30 (i.e., the upper surface of the upper plate 10), it is necessary to increase the thickness of the upper plate 10. Therefore, in this embodiment, it is preferable to increase the thickness of the upper plate 10 and reduce the thickness of the lower plate 20.

[0044] like Figure 4 As shown, in the suspension transport equipment 1 of this embodiment, a plurality of leveling bolts 42 are provided which protrude downward from the lower surface of the suspension transport equipment 1. Figure 4 As shown, in this embodiment, the levitation transportation device 1 is installed on the installation surface 35 by bringing a plurality of leveling bolts 42 into contact with the installation surface 35 .

[0045] The leveling bolts 42 are disposed in through-holes 12 and 25 formed in the upper plate 10 and lower plate 20 of the levitation transport system 1 and are displaced in the vertical direction (z-axis direction) within the through-holes 12 and 25. For example, the leveling bolts 42 are configured to be threadedly engaged with at least one of the upper plate 10 and lower plate 20. By rotating the leveling bolts 42, the amount by which the leveling bolts 42 protrude from the lower surface of the levitation transport system 1 can be varied.

[0046] A gas supply port 27 (see FIG. 2 ) is provided on the lower surface of the lower plate 20 for supplying gas to the flow paths 21 and 22 provided on the lower plate 20. Figure 3 ).like Figure 4 As shown, when the leveling bolts 42 are brought into contact with the mounting surface 35 to mount the levitation transport apparatus 1, a space is formed between the lower surface (lower plate 20) of the levitation transport apparatus 1 and the mounting surface 35. Pipes (not shown) may be arranged in this space, and gas may be supplied to the gas supply port 27 through these pipes.

[0047] For example, the surface accuracy of the surface (contact surface) of the leveling bolt 42 that contacts the mounting surface 35 can be made higher than the surface accuracy of the lower surface of the lower plate 20. In other words, when the levitation transport system 1 is installed, if the contact position with the mounting surface 35 is limited to the contact surface (lower surface) of the leveling bolt 42, the installation accuracy of the levitation transport system 1 will depend on the surface accuracy of the contact surface (lower surface) of the leveling bolt 42. Therefore, by improving the surface accuracy of the contact surface (lower surface) of the leveling bolt 42, the installation accuracy of the levitation transport system 1 can be improved.

[0048] Next, another example of the configuration of the levitation transportation equipment according to the present embodiment will be described. Figure 5 This is a schematic diagram of another structural example of the levitation transportation equipment of this embodiment (a top view of the lower plate). Figure 5 Flow paths 51 and 52 formed on the lower plate 50 are shown, and the positions of the injection ports 11 formed in the upper plate (not shown) are also shown.

[0049] like Figure 5As shown, an upstream flow path 51 and a downstream flow path 52 are formed on the surface of the lower plate 50. The upstream flow path 51 is formed to extend in the x-axis direction and supplies the gas supplied from the gas supply port 27 in the x-axis direction of the lower plate 50. Figure 5 In the illustrated example, the upstream flow path 51 is I-shaped, and the gas supply port 27 is provided at a position in the upstream flow path 51 that is point-symmetrical with respect to the gas supply port 27 .

[0050] The downstream flow path 52 supplies the gas supplied from the gas supply port 27 to the multiple injection ports 11 via the upstream flow path 51. The downstream flow path 52 is connected to the upstream flow path 51 at the end on the upstream side. The downstream flow path 52 forms a branch on the downstream side, and the ends of the branched flow paths are respectively connected to the injection ports 11. Specifically, each downstream flow path 52 includes a flow path (trunk) extending from the connection point with the upstream flow path 51 in the y-axis direction and a plurality of flow paths (branches) extending from the flow path (trunk) in the x-axis direction. Figure 5 In the illustrated example, a portion of the downstream end portion (branched end portion) of each downstream flow path 52 is connected to the injection port 11 . A portion of the injection port 11 is connected to the upstream flow path 51 .

[0051] exist Figure 5 In the illustrated example, the upstream flow path 51 is provided so as to extend in the x-axis direction, and a plurality of downstream flow paths 52 are connected to the upstream flow path 51 at their upstream end portions at substantially equal intervals. Specifically, the plurality of downstream flow paths 52 are provided on the positive side of the upstream flow path 51 in the y-axis direction, and are connected to the upstream flow path 51 at their upstream end portions at substantially equal intervals. Similarly, the plurality of downstream flow paths 52 are provided on the negative side of the upstream flow path 51 in the y-axis direction, and are connected to the upstream flow path 51 at their upstream end portions at substantially equal intervals.

[0052] exist Figure 5 In the illustrated example, the cross-sectional area of the upstream flow path 51 is configured to be larger than the cross-sectional area of the downstream flow path 52. Since the resistance of the flow path from the gas supply port 27 to the ejection port 11 can be reduced, the pressure loss of the gas in the upstream flow path 51 and the downstream flow path 52 can be reduced, and the gas can be supplied to the ejection port 11 at a pressure substantially the same as that supplied to the gas supply port 27. Therefore, the flow rate of the gas ejected from each ejection port 11 can be effectively prevented from varying, thereby improving the levitation accuracy of the substrate 30.

[0053] According to the above-described embodiment, a levitation transport device capable of improving the levitation accuracy of a substrate can be provided.

[0054] Second embodiment

[0055] Hereinafter, a second embodiment will be described.

[0056] In the second embodiment, another example of the configuration of the levitation transport system 1 near the injection port described in the first embodiment will be described. Note that the configuration of the levitation transport system 1 according to the second embodiment, excluding the vicinity of the injection port, is the same as that of the levitation transport system 1 described in the first embodiment. Therefore, repeated descriptions will be omitted.

[0057] Figure 6 This is a cross-sectional view of the vicinity of the injection port of the suspension transport device of this embodiment. Figure 6 As shown, a hole portion 70 is formed in the upper surface of the suspension transport device (ie, the upper plate 10 of the suspension transport device). The hole portion 70 is provided with a columnar member 60. Figure 7 As shown, the cylindrical member 60 has a cutout portion 61 whose side surface is cut out in the vertical direction (z-axis direction). In this way, the ejection port 11 can be formed by arranging the cylindrical member 60 having the cutout portion 61 in the hole portion 70.

[0058] Specifically, if Figure 6 As shown, a first hole portion 71 and a second hole portion 72 are formed in the upper plate 10 of the levitation transport device as the hole portion 70. The first hole portion 71 is formed on the upper surface side (upper plate 10) of the levitation transport device (positive side in the z-axis direction). The second hole portion 72 is formed closer to the inner side (negative side in the z-axis direction) of the levitation transport device (upper plate 10) than the first hole portion 71. Figure 6 In the illustrated configuration example, the diameter of the first hole portion 71 is smaller than the diameter of the second hole portion 72, and the columnar member 60 is disposed in the second hole portion 72. The columnar member 60 is disposed in the second hole portion 72 by insertion or press-fitting.

[0059] With this configuration, a gap 75 is formed between the side surface of the second hole portion 72 and the notch 61 of the columnar member 60. Gas supplied from the downstream flow path 22 passes through the gap 75, flows to the first hole portion 71, and is ejected from the upper surface (upper plate 10) of the levitation transport device. The ejected gas collides with the lower surface of the substrate 30, causing the substrate 30 to levitate. In this embodiment, as described above, since the ejection port 11 is formed by providing the columnar member 60 in the second hole portion 72, the ejection port 11 can be easily formed.

[0060] exist Figure 6In the illustrated configuration example, the diameter of the first hole portion 71 is configured to be smaller than the diameter of the second hole portion 72. With this configuration, the columnar member 60 can be effectively prevented from coming out (on the positive side in the z-axis direction). Note that in this embodiment, when the columnar member 60 is press-fitted into the second hole portion 72 with a force sufficient to prevent the columnar member 60 from coming out, the diameter of the first hole portion 71 can be the same as the diameter of the second hole portion 72 (that is, the first hole portion 71 and the second hole portion 72 can be formed as a single hole portion).

[0061] In this embodiment, the cross-sectional area of the gap 75 between the side surface of the second hole portion 72 and the notch portion 61 of the columnar member 60 is smaller than the cross-sectional area of the downstream flow path 22. With this structure, a pressure difference can be generated between the gas before and after passing through the columnar member 60.

[0062] That is, because the cross-sectional area of the gap 75 of the columnar member 60 is smaller than that of the downstream flow path 22, the gas pressure in the downstream flow path 22 is higher than the gas pressure in the gap 75 of the columnar member 60 on the outlet side. Therefore, the pressure can be made uniform throughout all the upstream flow paths 21 and downstream flow paths 22. In other words, because the cross-sectional area of the gap 75 of the columnar member 60 is smaller than that of the downstream flow path 22, the gas is throttled when passing through the gap 75 of the columnar member 60. Therefore, after the gas is evenly diffused throughout the upstream flow path 21 and downstream flow path 22, it can be allowed to pass through the gap 75. Therefore, it is possible to effectively prevent the pressure in the upstream flow path 21 and downstream flow path 22 from becoming uneven. Consequently, it is possible to effectively prevent the flow rate of the gas ejected from each ejection port 11 from varying.

[0063] In this embodiment, the shape of the cutout portion 61 formed in the side surface of the columnar member 60 is simple. Specifically, in this embodiment, the cutout portion 61 is formed by cutting away the side surface of the columnar member 60 in the vertical direction (z-axis direction). This stabilizes the gas ejected from the gap 75 of the columnar member 60, thereby stably levitating the substrate 30.

[0064] More specifically, the gases 78 and 79 flowing in the minute space between the substrate 30 and the levitation transport device 1 are explained by a phenomenon based on the gas bearing theory (see Figure 6 The gases 78 and 79 flowing through the microscopic space flow in a laminar state. For example, if the cutout formed in the columnar member 60 has a complex shape such as a spiral, the gas ejected from the ejection port 11 forms a vortex-shaped turbulent flow. When this turbulent flow contacts the substrate 30, the levitation behavior of the substrate 30 may be disturbed, and the amount of levitation of the substrate 30 may be changed.

[0065] On the other hand, in this embodiment, the cutout portion 61 is formed by cutting away the side surface of the columnar member 60 in the vertical direction (z-axis direction). As described above, in this embodiment, the simple shape of the cutout portion 61 formed in the side surface of the columnar member 60 prevents the gas ejected from the gap 75 of the columnar member 60 from becoming a turbulent flow. Therefore, the substrate 30 can be stably levitated. In this case, the gases 78 and 79 flowing through the small space between the substrate 30 and the levitation transport device 1 can be in a laminar flow state.

[0066] In addition, in this embodiment, since a complicated shape does not need to be formed on the columnar member 60, the columnar member 60 can be easily processed. In other words, sufficient flow resistance can be provided to the gas flowing through the gap 75 by simply processing the columnar member 60.

[0067] Furthermore, for example, when the injection port 11 is formed without providing the columnar member 60 in the second hole portion 72, the injection port 11 needs to be machined to minimize its diameter. However, this process makes it difficult to deeply machine the injection port. On the other hand, when the injection port 11 is formed by providing the columnar member 60 in the hole portion 70 (second hole portion 72), as in the present embodiment, there is no need to drill a very small hole, so the injection port 11 can easily form a narrow flow path.

[0068] Figure 6 and Figure 7 An example is shown in which the cross-sectional shape of the second hole portion 72 in the xy plane is circular and the columnar component 60 is cylindrical (i.e., the cross-sectional shape in the xy plane is circular). However, in this embodiment, the cross-sectional shape of the second hole portion 72 in the xy plane may also be a shape other than circular. The cross-sectional shape of the columnar component 60 in the xy plane may also be a shape other than circular. For example, the cross-sectional shape of the second hole portion 72 in the xy plane may be a polygonal shape, and in this case, the cross-sectional shape of the columnar component 60 in the xy plane may also be a polygonal shape. For example, the cross-sectional shape of the second hole portion 72 in the xy plane may be a square, and in this case, the columnar component 60 may be a square column (the cross-sectional shape in the xy plane is square). Even when the shape of the columnar component 60 is not cylindrical, a cutout portion cut in the vertical direction (z-axis direction) is formed in the side surface of the columnar component 60.

[0069] In this embodiment, Figure 7 Similarly, the cylindrical component 60 shown may also be provided with a release structure 65 for cutting off the peripheral edge of the distal end of the cylindrical component. Figure 7The columnar member 60 shown in FIG is cylindrical and includes a first region 62 located at the center in the z-axis direction and a second region 63 located on the end side. The relief structure 65 can be formed by making the diameter of the circle of the cross section (in the xy plane) of the second region 63 smaller than the diameter of the circle of the cross section (in the xy plane) of the first region 62 (by cutting away the columnar member 60).

[0070] When the release structure 65 is formed as described above, if the columnar member 60 is inserted (or press-fitted) into the second hole portion 72 (in the following description, the term "insertion" may be replaced by "press-fit"), it is possible to effectively prevent the columnar member 60 from tilting relative to the second hole portion 72. Therefore, the columnar member 60 can be inserted into an appropriate position in the second hole portion 72.

[0071] Figure 8 This is a cross-sectional view for describing the operation of inserting the columnar component into the hole. Figure 8 As shown in the left side view of FIG, when the columnar component 60 is inserted into the second hole portion 72, the columnar component 60 is inserted from the negative side of the second hole portion 72 in the z-axis direction. Figure 8 In, with Figure 6 In contrast, the upper plate 10 has the opposite vertical direction. Then, by pushing the columnar member 60 toward the positive side in the z-axis direction, as shown in FIG. Figure 8 As shown in the right side view of FIG, the columnar component 60 is inserted (press-fitted) into the second hole portion 72. At this time, by providing a release structure 65 on the distal end side of the columnar component 60, the columnar component 60 can be effectively prevented from tilting relative to the second hole portion 72 when the columnar component 60 is inserted into the second hole portion 72. Therefore, as shown in FIG. Figure 8 As shown, the columnar component 60 can be inserted into a proper position of the second hole portion 72 .

[0072] For example, Figure 9 As shown, when the release structure 65 is not provided in the columnar member 60, the columnar member 60 can be tilted relative to the second hole portion 72. Figure 9 As shown in the left side view of FIG, when the columnar member 60 is pushed into the second hole portion 72 in a state where the columnar member 60 is tilted relative to the second hole portion 72, the columnar member 60 is inserted (press-fitted) into the second hole portion 72 while the columnar member 60 is kept tilted. As described above, when the columnar member 60 is inserted into the second hole portion 72 while tilting, the second hole portion 72 may be damaged or the flow path (see FIG. Figure 6 The gap 75) in may be blocked.

[0073] On the other hand, when the release structure 65 is provided on the distal end side of the columnar member 60, if the columnar member 60 is inserted into the second hole portion 72, the columnar member 60 can be effectively prevented from tilting relative to the second hole portion 72 (see FIG. Figure 8). Therefore, the columnar member 60 can be inserted into an appropriate position in the second hole portion 72.

[0074] like Figure 7 As shown, the relief structure 65 may be provided in both second regions 63 (upper and lower end sides) of the columnar member 60 (specifically, the second region 63 corresponds to the relief structure 65), or may be formed in only one of the two second regions 63. When the relief structure 65 is formed in only one of the two second regions 63 of the columnar member 60, the relief structure 65 is formed in one of the two second regions 63 that becomes the distal end side (positive side in the z-axis direction) when the columnar member 60 is inserted into the second hole portion 72.

[0075] Third embodiment

[0076] Hereinafter, a third embodiment will be described. In the third embodiment, a case where the levitation transport apparatus 1 described in the first and second embodiments is used in a laser processing apparatus will be described. Figure 10 FIG. 2 is a cross-sectional view of a laser processing apparatus 2 according to a third embodiment. Figure 10 As shown, the laser processing device 2 includes a levitation transport device 1 and a laser generating unit 90 .

[0077] The levitation transporter 1 transports the substrate 30 in the transport direction (positive side in the x-axis direction) while levitating the substrate 30 by spraying gas onto the lower surface of the substrate 30. The levitation transporter 1 is the same as the above-mentioned levitation transporter, and therefore, repeated description is omitted.

[0078] The laser generating unit 90 generates a laser beam 91 to be applied to the substrate 30. For example, the laser processing device 2 is a laser annealing device, and in this case, an excimer laser or the like can be used for the laser generating unit 90. The laser beam provided from the laser generating unit 90 is formed into a linear shape (a linear shape extending in the y-axis direction) in an optical system (not shown). Therefore, the linear laser beam 91, more specifically, the laser beam 91 whose focus extends in the y-axis direction, is applied to the upper surface of the substrate 30. For example, an amorphous film is formed on the substrate 30, and the amorphous film can be crystallized by irradiating the amorphous film with the laser beam 91 and annealing it.

[0079] As described above, in the levitation transport device 1, it is possible to effectively prevent the flow rate of the gas ejected from the plurality of ejection ports 11 from deviating. Consequently, the substrate 30 can be precisely levitated. Therefore, by using the levitation transport device 1 in the laser processing apparatus 2, it is possible to improve the accuracy of laser irradiation. Specifically, it is possible to prevent the laser beam from deviating from the depth of focus (DOF) of the laser beam applied to the substrate 30 during laser irradiation.

[0080] From the disclosure thus described, it will be apparent that the embodiments of the present disclosure may be modified in many ways. Such variations are not to be regarded as a departure from the spirit and scope of the present disclosure, and all such modifications obvious to one skilled in the art are intended to be included within the scope of the appended claims.

Claims

1. A levitation transport device for transporting a substrate while floating the substrate by spraying gas onto the lower surface of the substrate, characterized in that: The suspension transport equipment comprises: a plurality of injection ports configured to inject the gas onto the substrate; a first flow path configured to supply the gas to the plurality of injection ports; a second flow path configured to supply the gas to the first flow path; and a gas supply port configured to supply the gas to the second flow path; The cross-sectional area of the second flow path is larger than that of the first flow path, and a hole is formed on the upper surface of the suspension transport device. The ejection port is formed by providing a columnar member including a cutout portion whose side surface is cut out in the vertical direction in the hole portion, and The cylindrical member includes a relief structure, and a peripheral edge of the cylindrical member on a distal end side is cut away.

2. The suspension transport equipment according to claim 1, characterized in that: A cross-sectional area of the second flow path is larger than a cross-sectional area of the gas supply port.

3. The suspension transport equipment according to claim 1, characterized in that: The cross-sectional area of the first flow path is the same as the cross-sectional area of the injection port.

4. The suspension transport equipment according to claim 1, characterized in that: The first flow path is connected to the second flow path at a first end portion on the upstream side. The first flow path is branched on the downstream side, and second ends serving as ends of the branched flow paths are connected to the injection ports, respectively.

5. The suspension transport device according to claim 4, characterized in that: The second flow path is configured to extend in a predetermined direction, the predetermined direction being parallel to the upper surface of the suspension transport device; The first ends of the plurality of first flow paths are connected to the second flow path at equal intervals therebetween.

6. The suspension transport device according to claim 5, characterized in that: The gas supply port is provided at a position in the second flow path that is point-symmetrical with respect to the gas supply port.

7. The suspension transport device according to claim 1, characterized in that: A gap is formed by providing the columnar member in the hole, and a cross-sectional area of the gap between a side surface of the hole and the cutout portion of the columnar member is smaller than a cross-sectional area of the first flow path.

8. The suspension transport device according to claim 1, characterized in that: The hole portion includes a first hole portion and a second hole portion, the first hole portion is located on the side where the upper surface of the suspension transportation device is located, and the second hole portion is closer to the inner side of the suspension transportation device than the first hole portion; The diameter of the first hole portion is smaller than the diameter of the second hole portion; The columnar member is disposed in the second hole portion.

9. The suspension transport device according to claim 1, characterized in that: The suspension transport equipment further comprises: an upper plate provided on a side where the substrate is located and including an injection port for injecting the gas; and a lower plate on which the first flow path, the second flow path, and the gas supply port are formed.

10. The suspension transport device according to claim 9, characterized in that: The thickness of the lower plate is configured to be thinner than that of the upper plate.

11. A laser processing device, characterized in that: include: a levitation transport device configured to transport the substrate while levitating the substrate by spraying a gas toward a lower surface of the substrate; and a laser generating unit configured to generate a laser beam to be applied to the substrate; Wherein, the suspension transport equipment includes: a plurality of injection ports configured to inject the gas onto the substrate; a first flow path configured to supply the gas to the plurality of injection ports; a second flow path configured to supply the gas to the first flow path; and a gas supply port configured to supply the gas to the second flow path; The cross-sectional area of the second flow path is larger than that of the first flow path, and a hole is formed on the upper surface of the suspension transport device. The ejection port is formed by providing a columnar member including a cutout portion whose side surface is cut out in the vertical direction in the hole portion, and The cylindrical member includes a relief structure, and a peripheral edge of the cylindrical member on a distal end side is cut away.

12. The laser processing equipment according to claim 11, characterized in that A cross-sectional area of the second flow path is larger than a cross-sectional area of the gas supply port.

13. The laser processing equipment according to claim 11, characterized in that The cross-sectional area of the first flow path is the same as the cross-sectional area of the injection port.

14. The laser processing equipment according to claim 11, characterized in that The first flow path is connected to the second flow path at a first end portion on the upstream side. The first flow path is branched on the downstream side, and second ends serving as ends of the branched flow paths are connected to the injection ports, respectively.

15. The laser processing equipment according to claim 14, characterized in that: The second flow path is configured to extend in a predetermined direction, the predetermined direction being parallel to the upper surface of the suspension transport device; The first ends of the plurality of first flow paths are connected to the second flow path at equal intervals therebetween.

16. The laser processing equipment according to claim 15, characterized in that The gas supply port is provided at a position in the second flow path that is point-symmetrical with respect to the gas supply port.

17. The laser processing equipment according to claim 11, characterized in that A gap is formed by providing the columnar member in the hole, and a cross-sectional area of the gap between a side surface of the hole and the cutout portion of the columnar member is smaller than a cross-sectional area of the first flow path.

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