Cleaning methods and cleaning equipment

Abstract

This invention provides a cleaning method and apparatus that do not adversely affect the plating solution or the substrate holder used to hold the substrate, and can remove dirt adhering to electrical contacts that cannot be removed with pure water. The cleaning method of this invention is a cleaning method for a substrate holder having electrical contacts for contacting the substrate to supply power to the substrate for plating purposes. The cleaning method includes a cleaning step of cleaning the electrical contacts mounted on the substrate holder with a citric acid aqueous solution.

Description

Technical Field

[0001] This invention relates to cleaning methods and cleaning apparatus. Background Technology

[0002] A plating apparatus is used to form a metal thin film on the surface of a substrate. For example, Patent Document 1 discloses a substrate plating apparatus comprising: a substrate holding section that detachably holds a substrate with the plating surface facing upwards; a cathode section having a cathode electrode and a sealing material; a movable electrode head having an anode; and a fixed nozzle. The substrate holding section is configured to move freely between a lower substrate delivery position, an upper plating position, and a pretreatment / cleaning position in between. When the substrate holding section is in the plating position, the cathode electrode abuts against the periphery of the substrate, and the anode is positioned opposite the substrate. Furthermore, this substrate plating apparatus brings the upper surface of the substrate into contact with the plating solution to perform the plating process. Additionally, when the substrate holding section is in the pretreatment / cleaning position, the fixed nozzle supplies pure water to the cathode section to clean the cathode electrode.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2005-139558

[0004] When plating a substrate using a cathode electrode, contaminants may adhere to the contact surface between the cathode electrode and the substrate. If contaminants adhere to the cathode electrode, they become resistive, preventing the cathode electrode from applying the desired current to the substrate. As a result, there is a concern that the thickness of the plating formed on the substrate may become uneven. In contrast, the plating apparatus described in Patent Document 1 uses pure water to clean the cathode electrode as described above, thereby removing contaminants from the cathode electrode and suppressing such problems. However, the contaminants adhering to the cathode electrode can be of various types, and sometimes cleaning with pure water is insufficient to completely remove them. For example, oxides of the copper seed layer and resist residues may accumulate on the substrate in contact with the cathode electrode. Moreover, copper oxides and resist residues can adhere to the cathode electrode and become contaminants. There is a concern that cleaning with pure water may not be sufficient to remove the copper oxides and resist residues adhering to the cathode electrode.

[0005] Furthermore, in the plating apparatus described in Patent Document 1, if sulfuric acid, persulfate (a mixture of concentrated sulfuric acid and hydrogen peroxide), or an aqueous solution containing ozone microbubbles is used instead of pure water, these agents can remove contaminants such as copper, copper oxides, and resists that cannot be removed by pure water. However, these agents can sometimes adversely affect components used to hold the substrate, such as sealing materials located near the cathode electrode. These components are made of polyetherketone resin (PEEK material), fluororubber (FKM), stainless steel, etc. Moreover, sulfuric acid and persulfate have corrosive properties, and ozone microbubbles degrade resins and rubbers. Therefore, if the cathode electrode is not separated from the components used to hold the substrate and is cleaned with these agents, there is a concern that the aforementioned agents may be applied to the components used to hold the substrate, potentially causing damage to these components.

[0006] Furthermore, if persulfate remains in the components used to hold the substrate after cleaning the cathode electrode, it can contaminate the plating solution during subsequent plating processes. In this case, the persulfate can disrupt the electrolyte in the plating solution, negatively impacting its properties. Therefore, the selection of the cleaning solution for the cathode electrode is crucial. Summary of the Invention

[0007] Therefore, in view of the above-mentioned problems, the object of the present invention is to provide a cleaning method and cleaning apparatus that does not adversely affect the plating solution or the substrate holder used to hold the substrate, and is able to remove dirt adhering to the cathode electrode (electric contact) that cannot be removed by pure water.

[0008] One embodiment of the cleaning method is a substrate holder cleaning method, the substrate holder having electrical contacts for contacting the substrate to supply power to the substrate in order to plate the substrate, wherein the substrate holder cleaning method includes a cleaning step of cleaning the electrical contacts installed on the substrate holder with a citric acid aqueous solution.

[0009] One embodiment of the cleaning apparatus includes: a rotating member for holding an annular holding member, the holding member holding a substrate for plating and having electrical contacts in contact with the substrate; an actuator for rotating the holding member in a circumferential direction by rotating the rotating member; and a cleaning module for cleaning the holding member rotating by the rotating member using an aqueous citric acid solution.

[0010] One embodiment of the cleaning apparatus is a cleaning apparatus for a holding member having electrical contacts and being a component of at least a portion of a substrate holder. The cleaning apparatus includes a cleaning tank for holding a citric acid aqueous solution and immersing the holding member in the citric acid aqueous solution. Attached Figure Description

[0011] Figure 1 This is an exploded perspective view of the substrate holder.

[0012] Figure 2 yes Figure 1 A magnified cross-sectional view of the substrate holder shown.

[0013] Figure 3 yes Figure 1 Rear view of the second holding member of the substrate holder shown.

[0014] Figure 4 This is a diagram illustrating the cleaning apparatus of the present invention.

[0015] Figure 5 It means Figure 4 A schematic diagram of the housing of the cleaning device shown.

[0016] Figure 6 It means and Figure 3 The diagram shows a perspective view of a cleaning device of the present invention, which differs from the cleaning device shown.

[0017] Figure 7 Is Figure 6 A perspective view of the carrier housed inside the cleaning tank of the cleaning device shown.

[0018] Figure 8 yes Figure 6 A cross-sectional view of the cleaning device shown.

[0019] Figure 9 yes Figure 8 AA sectional view.

[0020] Figure 10 It means Figure 6 A cross-sectional view of a first modified example of the cleaning apparatus shown.

[0021] Figure 11 It means Figure 6 A cross-sectional view of a second modified example of the cleaning apparatus shown.

[0022] Explanation of reference numerals: 30…substrate holder; 31…first holding member; 32…second holding member; 50…electrical contact; 100…cleaning device; 102…rotating member; 118…pump; 140…drain pipe; 144…liquid nozzle; 154…air nozzle; 166…warm air device; 200…cleaning module; 202…housing; 204…nozzle; 220…citric acid tank; 400…cleaning device; 408…supply port; 410…outlet; 428…pump; 438…air intake. ; 440…exhaust port; 442…fan; 444…heater; 446…partition plate; 448…first opening; 450…second opening; 460…thermometer; 462…temperature regulator; 466…first rod-shaped component; 468…nozzle; 470…second rod-shaped component; 472…stirring component; 500…carrier; 504…grid plate; 520…washing tank; 540…citric acid tank; 900…waste liquid section; 902…liquid supply source; 904…gas supply source; Wf…substrate. Detailed Implementation

[0023] Overview

[0024] Hereinafter, two embodiments (first and second embodiments) of the present invention will be described by way of example. Furthermore, in the accompanying drawings described below, the same or equivalent constituent elements are labeled with the same reference numerals, and repeated descriptions are omitted.

[0025] [First Implementation Method]

[0026] The following is a reference to the appendix. Figure 1 The cleaning apparatus of the first embodiment will be described below. First, the structure of the substrate holder 30 cleaned by the cleaning apparatus 100 will be described. Next, the structure of the cleaning apparatus 100 of this embodiment will be described. Next, the cleaning method of the cleaning apparatus 100 will be described.

[0027] <Structure of the substrate holder>

[0028] Figure 1 This is an exploded perspective view of the substrate holder 30. (See attached image.) Figure 1 As shown, the substrate holder 30 includes, for example, a first holding member 31 in the shape of a rectangular plate made of vinyl chloride, and a second holding member 32 in the shape of an annulus that is detachably mounted to or detachably mounted relative to the first holding member 31 (corresponding to an example of a holding member). The substrate holder 30 holds the substrate Wf (see reference) by clamping the wafer or other substrate Wf with the first holding member 31 and the second holding member 32. Figure 2Furthermore, in this invention, the substrate holder refers to a device for holding the substrate Wf and a part of that device. That is, the first holding member 31 and the second holding member 32 can also be referred to as the substrate holder. A support surface 33 for supporting the substrate Wf is provided at approximately the center of the first holding member 31 of the substrate holder 30. In addition, on the outer side of the support surface 33 of the first holding member 31, a plurality of inverted L-shaped clamps 34 with inwardly protruding protrusions are provided at equal intervals around the support surface 33.

[0029] A pair of handles 35 are connected to the end of the first holding member 31 of the substrate holder 30. These handles 35 serve as supports for transporting or suspending the substrate holder 30. The substrate holder 30 is vertically suspended by hooking the handles 35 onto the upper surface of the peripheral wall of various processing tanks in a substrate processing apparatus (not shown), and the substrate Wf held by the substrate holder 30 is processed inside the processing tank. For example, if the substrate holder 30 is suspended on the upper surface of the peripheral wall of a plating tank holding plating solution, the substrate Wf is immersed in the plating solution. In this state, plating is performed on the surface of the substrate Wf. Furthermore, the transport device included in the substrate processing apparatus can hold the handles 35 to transport the substrate holder 30.

[0030] Additionally, an external contact 38 electrically connected to an external power source is provided on a handle 35. When the substrate holder is suspended on the upper surface of the peripheral wall of the plating tank, the external contact 38 contacts the external power source provided in the plating tank, thereby establishing an electrical connection with the external power source. This external contact 38 is connected via multiple wires to multiple relay contacts 60 (see reference 60) provided on the outer periphery of the support surface 33. Figure 2 Electrical connection.

[0031] The second retaining member 32 includes a ring-shaped sealing retainer 36 made of polyetherketone resin (PEEK material). A push ring 37 is rotatably mounted on the sealing retainer 36 of the second retaining member 32, and the push ring 37 is used to press and fix the sealing retainer 36 to the first retaining member 31. The push ring 37 has a plurality of outwardly protruding protrusions 37a on its outer periphery. The upper surface of the protrusions 37a and the lower surface of the inner protrusion of the clamp 34 have conical surfaces that are inclined in opposite directions along the rotation direction.

[0032] When holding the substrate Wf, firstly, with the second holding member 32 removed from the first holding member 31, the substrate Wf is placed on the support surface 33 of the first holding member 31, and the second holding member 32 is installed on the first holding member 31. Next, the push ring 37 is rotated clockwise, causing the protrusion 37a of the push ring 37 to slide into the interior (lower side) of the inner protrusion of the clamp 34. Thus, the first holding member 31 and the second holding member 32 are securely locked together via the conical surfaces respectively provided on the push ring 37 and the clamp 34, holding the substrate Wf. When releasing the substrate Wf, with the first holding member 31 and the second holding member 32 locked, the push ring 37 is rotated counterclockwise. Thus, the protrusion 37a of the push ring 37 is removed from the inverted L-shaped clamp 34, releasing the substrate Wf from being held.

[0033] Figure 2 This is a partially enlarged cross-sectional view of the substrate holder 30 in the thickness direction while holding the substrate Wf. As shown in the figure, an inner seal 39 and an outer seal 40 are provided on the surface of the sealing holder 36 of the second holding member 32 opposite to the first holding member 31. Both the inner seal 39 and the outer seal 40 are made of fluororubber. The inner seal 39 is configured to contact the outer periphery of the substrate Wf when the substrate Wf is held by the substrate holder 30, thereby sealing the surface of the substrate Wf with the sealing holder 36. The outer seal 40 is configured to be located radially outside the inner seal 39, contacting the support base 43 of the first holding member 31. Thus, the outer seal 40 can seal the sealing holder 36 with the support base 43. The inner seal 39 and the outer seal 40 are clamped between the sealing retainer 36 and the stainless steel retaining ring 41 and are installed in the sealing retainer 36. The retaining ring 41 is installed in the sealing retainer 36 by fastening devices such as bolts.

[0034] A stepped portion is provided on the outer periphery of the sealing retainer 36 of the second retaining member 32, and the push ring 37 is rotatably mounted on this stepped portion via the isolator 42. The push ring 37 is made of a metal (e.g., titanium) with excellent acid corrosion resistance and sufficient rigidity. The isolator 42 is made of a material with a low coefficient of friction, such as PTFE (polytetrafluoroethylene), to allow the push ring 37 to rotate smoothly.

[0035] Additionally, a flat relay contact 60 is provided on the support base 43 of the first retaining member 31. Figure 2 The symbol represents a relay contact 60. Multiple relay contacts 60 are arranged around the support base 43 along the periphery of the support surface 33. The relay contacts 60 are connected to the support base 43 via wires (not shown). Figure 2The external contact 38 shown is electrically connected. One end of the relay contact 60 is fixed to the support base 43 by any fixing unit such as screws. In addition, a stepped portion 48 is formed in the support base 43 so that the other end of the relay contact 60 becomes a free end.

[0036] A plurality of electrical contacts 50 are mounted on the inner circumferential surface of the retaining ring 41 of the second holding member 32. When the substrate Wf is held by the substrate holder 30, these electrical contacts 50 contact the outer periphery of the substrate Wf supported by the support surface 33 to supply power to the substrate Wf. Furthermore, when the substrate Wf is immersed in the plating solution, the electrical contacts 50 supply power to the substrate Wf, thereby performing the plating process on the substrate Wf. Figure 2 An electrical contact 50 is shown in the diagram. Here, refer to... Figure 3 . Figure 3 This is a rear view of the second retaining member 32 of the substrate holder 30. Multiple electrical contacts 50 are mounted approximately around the circumference of the retaining ring 41.

[0037] If referred again Figure 2 The electrical contact 50 has a plurality of first ends 51 that contact the substrate Wf and a plurality of second ends 52 that contact the relay contact 60. The electrical contact 50 is preferably formed of a spring material such as stainless steel and plated with gold. The first ends 51 are configured to be bent at an angle of approximately 90° and protrude forward (towards the center of the support surface 33) in a leaf spring shape. Figure 2 As shown, the first end 51 is configured to elastically contact the outer periphery of the substrate Wf when the substrate Wf is held by the substrate holder 30.

[0038] like Figure 2 As shown, the second end 52 of the electrical contact 50 has a generally C-shaped cross-section in the thickness direction of the substrate holder 30. Thus, the second end 52 of the electrical contact 50 is configured to elastically contact the relay contact 60 when the substrate Wf is held by the first holding member 31 and the second holding member 32.

[0039] <Structure of the cleaning device>

[0040] Figure 4 This is a diagram illustrating the cleaning apparatus 100 of the present invention. Figure 5 This is a schematic diagram showing the general outline of the housing 202 of the cleaning apparatus 100. The cleaning apparatus 100 is a device for cleaning the electrical contacts 50 of the substrate holder 30. (Refer to...) Figure 5 The cleaning apparatus 100 includes a rotating component 102, an actuator 104, a cleaning module 200, a rotating shaft 106, a frame 108, a bearing 110, a gasket 112, and a flexible coupling 113. The cleaning module 200 also includes a housing 202. The constituent elements of the cleaning apparatus 100 will be described below.

[0041] The housing 202 is configured to surround the rotating component 102 and has the function of retaining liquids such as citric acid aqueous solution and water inside. As an example, the rotating component 102 has a disk shape and is located inside the housing 202. The rotating component 102 has the function of retaining a second annular retaining member 32. Furthermore, the center of the rotating component 102 is fixed to a rotating shaft 106 extending outward from the housing 202. The rotating shaft 106 is supported by a bearing 110, which is mounted on a frame 108 located outside the housing 202, allowing it to rotate. An actuator 104 is fixed to the frame 108 and connected to the rotating shaft 106 via a flexible coupling 113. Thus, the actuator 104 can rotate the rotating component 102 and rotate the second retaining member 32 in the circumferential direction. Furthermore, as an example, the actuator 104 is a waterproof brushless motor. Additionally, a gasket 112 is provided between the rotating shaft 106 and the housing 202 to prevent liquid leakage from inside the housing 202 to the outside.

[0042] In addition, such as Figure 5 As shown, for example, the cleaning module 200 has a nozzle 204. Furthermore, as... Figure 4 As shown, as an example, the cleaning apparatus 100 includes a citric acid tank 220, piping 116, piping 117, and a pump 118. The citric acid tank 220 functions to hold an aqueous solution of citric acid. In this embodiment, the citric acid tank 220 holds an aqueous solution of citric acid, the mass percentage concentration of which is 2% to 30%. Furthermore, piping 116 connects the citric acid tank 220 to the suction port of the pump 118, and piping 117 connects the discharge port of the pump 118 to the nozzle 204. Thus, the pump 118 can pressurize the aqueous solution of citric acid held in the citric acid tank 220 to the nozzle 204. Moreover, the nozzle 204's spray outlet faces the electrical contact 50 of the second holding member 32 held by the rotating member 102 (see reference). Figure 5 Therefore, the nozzle 204 can spray a citric acid aqueous solution toward the electrical contact 50 of the second retaining member 32, and can clean the electrical contact 50 with the citric acid aqueous solution.

[0043] Additionally, as an example, the cleaning device 100 includes a regulator 122, a valve 124, and a flow meter 126 installed on the piping 117. The regulator 122 has the function of reducing the pressure of the citric acid aqueous solution flowing in the piping 117, and the flow meter 126 has the function of measuring the flow rate of the citric acid aqueous solution flowing in the piping 117. Moreover, the valve 124 has the function of adjusting the flow rate of the citric acid aqueous solution flowing in the piping 117.

[0044] Additionally, as an example, the cleaning device 100 includes a thermostat 128, piping 130, and valve 132. The thermostat 128 is installed on piping 116 and has the function of heating the citric acid aqueous solution flowing in piping 116. Piping 130 connects the outlet of pump 118 to the citric acid tank 220. Furthermore, valve 132 has the function of adjusting the flow rate of the citric acid aqueous solution flowing in piping 130. Thus, when valve 132 is opened while pump 118 is pumping citric acid, the citric acid aqueous solution heated by the thermostat 128 returns to the citric acid tank 220. That is, the thermostat 128 can heat the citric acid aqueous solution held in the citric acid tank 220 to a predetermined temperature. In particular, in the first embodiment, as an example, the thermostat 128 heats the citric acid aqueous solution to a temperature of 35 degrees Celsius or higher and 55 degrees Celsius or lower.

[0045] Additionally, as an example, the cleaning device 100 includes a piping 134, a valve 136, and a valve 138. The piping 134 connects the housing 202 and the citric acid tank 220 to the waste liquid section 900 of the plant. In other words, the piping 134 forms a flow path from the housing 202 to the waste liquid section 900 and from the citric acid tank 220 to the waste liquid section 900. Furthermore, the valve 136, installed on the piping 134, has the function of adjusting the flow rate of the liquid flowing from the housing 202 to the waste liquid section 900. Thus, by opening the valve 136, the cleaning device 100 can discard unwanted liquid inside the housing 202 into the waste liquid section 900. Conversely, the valve 138, installed on the piping 134, has the function of adjusting the amount of liquid flowing from the citric acid tank 220 to the waste liquid section 900. Thus, by opening valve 138, cleaning device 100 can discard unwanted liquid inside citric acid tank 220 to waste liquid section 900.

[0046] Additionally, as an example, the citric acid tank 220 is equipped with two level gauges 222 and 224, which are capable of detecting the presence or absence of liquid at their respective installation positions. Level gauge 222 is installed to detect the presence or absence of liquid at lower levels inside the citric acid tank 220. Therefore, when level gauge 222 does not detect a liquid level, the control device (not shown) stops pump 118 to prevent pump 118 from running dry. Conversely, level gauge 224 is installed to detect the presence or absence of liquid at higher levels inside the citric acid tank 220 than level gauge 222. Therefore, when level gauge 224 detects a liquid level, the control device (not shown) opens valve 138 to prevent the citric acid solution from overflowing from the citric acid tank 220.

[0047] Additionally, as an example, the cleaning device 100 includes a drain pipe 140 and a valve 142. The drain pipe 140 connects the housing 202 and the citric acid tank 220, and has the function of draining the citric acid aqueous solution held in the housing 202 into the citric acid tank 220. Furthermore, the valve 142 has the function of adjusting the flow rate of the citric acid aqueous solution flowing in the drain pipe 140.

[0048] Additionally, as an example, the cleaning device 100 includes a piping 143. Like the drain pipe 140, the piping 143 connects the housing 202 and the citric acid tank 220, and functions to drain the citric acid aqueous solution held in the housing 202 into the citric acid tank 220. The opening of the piping 143, which connects to the citric acid tank 220, is located above the opening of the drain pipe 140, and below the through hole formed in the housing 202 through which the rotating shaft 106 passes. Furthermore, when the level of the citric acid aqueous solution inside the housing 202 rises to the height of the opening of the piping 143, the citric acid aqueous solution inside the housing 202 moves to the citric acid tank 220 through the piping 143. Therefore, the piping 143 prevents the citric acid aqueous solution from overflowing from the housing 202.

[0049] Additionally, as an example, the cleaning device 100 includes a liquid nozzle 144, piping 146, a regulator 148, a valve 150, and a flow meter 152. Piping 146 connects a liquid supply source 902 for supplying water to the liquid nozzle 144. Thus, water is supplied from the liquid supply source 902 to the liquid nozzle 144. Furthermore, although in Figure 5 The liquid nozzle 114 is not specified, but it is related to... Figure 5 Similarly, the nozzle 204 shown has its spray nozzle 144 positioned so that it faces the electrical contact 50 of the second holding member 32 held by the rotating member 102. Therefore, the liquid nozzle 144 can spray water towards the electrical contact 50 of the second holding member 32, allowing the electrical contact 50 to be cleaned with water. Furthermore, a regulator 148, a valve 150, and a flow meter 152 are installed in the piping 146. The regulator 148 has the function of reducing the pressure of the water flowing in the piping 146, and the flow meter 152 has the function of measuring the flow rate of the water flowing in the piping 146. Moreover, the valve 150 has the function of adjusting the flow rate of the water flowing in the piping 146.

[0050] Additionally, as an example, the cleaning device 100 includes an air nozzle 154, piping 156, a filter 158, a regulator 160, a valve 162, and a flow meter 164. Piping 156 connects a gas supply source 904 for supplying gas to the air nozzle 154. Thus, gas is supplied from the gas supply source 904 to the air nozzle 154. Furthermore, although in Figure 5 The text does not specify air nozzle 154, but it is related to... Figure 5Similarly, the nozzle 204 shown has its nozzle orifice positioned towards the electrical contact 50 of the second holding member 32, which is held by the rotating member 102. Therefore, the air nozzle 154 can spray gas towards the electrical contact 50 of the second holding member 32, thus drying the electrical contact 50. Additionally, a filter 158, a regulator 160, a valve 162, and a flow meter 164 are installed in the piping 156. The filter 158 functions to filter particles from the gas flowing in the piping 156. The regulator 160 functions to reduce the pressure of the water flowing in the piping 156. The flow meter 164 functions to measure the flow rate of the gas flowing in the piping 156. Furthermore, the valve 162 functions to adjust the flow rate of the gas flowing in the piping 156.

[0051] Additionally, as an example, the cleaning device 100 includes a heating device 166. The heating device 166 is mounted on the housing 202. The heating device 166 functions to blow warm air from the opening 203 of the housing 202 into the interior of the housing 202. Here, the heating device 166 and the housing 202 are configured such that the second holding member 32, held by the rotating member 102, is located at the destination of the warm air flow. Therefore, the heating device 166 can blow warm air toward the second holding member 32.

[0052] <Cleaning Method>

[0053] Then, while referring to Figure 1 and Figure 5 An example of the operation during cleaning in the cleaning device 100 will be described. In the initial state, valves 124, 132, 136, 138, 142, 150, and 162 are closed, and actuator 104 is stopped. Furthermore, the housing 202 does not hold liquids such as citric acid solution or water. Moreover, the second retaining member 32 is mounted on the first retaining member 31.

[0054] First, such as Figure 1 As shown, the first retaining member 31 and the second retaining member 32 are separated (an example of a separation process). Next, the second retaining member 32 is held in the rotating member 102 (see reference). Figure 5 In this embodiment, the first retaining member 31, which is detached from the second retaining member 32, is not installed in the cleaning device 100. That is, the second retaining member 32 is housed inside the cleaning device 100, which is isolated from the first retaining member 31.

[0055] Next, valve 132 is opened, and pump 118 and thermostat 128 are started. As a result, the citric acid aqueous solution inside the citric acid tank 220 is heated to above 35 degrees and below 55 degrees.

[0056] Next, actuator 104 is activated. As a result, the annular second holding member 32, which has electrical contacts 50, rotates in the circumferential direction (equivalent to an example of a rotation process). At this time, for example, the second holding member 32 rotates at 1 to 10 rpm.

[0057] Next, valve 150 is opened. As a result, liquid nozzle 144 sprays water toward electrical contact 50 at a flow rate of 2 L / min. Consequently, the second retaining member 32, including electrical contact 50, is cleaned with water (an example of the first water washing process). Furthermore, water spraying based on liquid nozzle 144 continues for more than 10 minutes. During this time, the water sprayed by liquid nozzle 144 accumulates in housing 202 (see reference). Figure 5 As a result, a portion of the electrical contact 50 is immersed in the water held in the housing 202, and the second holding member 32 containing the electrical contact 50 is also cleaned by the water held in the housing 202 (equivalent to an example of the first water washing process). Then, valve 150 is closed and valve 136 is opened. As a result, the spraying of liquid from the liquid nozzle 144 stops, and the water held in the housing 202 is discharged.

[0058] Next, valve 136 is closed and valve 124 is opened. As a result, nozzle 204 sprays a citric acid aqueous solution toward electrical contact 50 at a flow rate of 0.4 L / min. Electrical contact 50 is then cleaned by the citric acid aqueous solution (equivalent to an example of a cleaning process). Furthermore, the spraying of the citric acid aqueous solution based on nozzle 204 continues for more than 60 minutes. Meanwhile, the citric acid aqueous solution sprayed by liquid nozzle 144 accumulates in housing 202. Consequently, a portion of electrical contact 50 is immersed in the citric acid aqueous solution held in housing 202, and electrical contact 50 is also cleaned by the citric acid aqueous solution held in housing 202 (equivalent to an example of a cleaning process). At this time, electrical contact 50 rotates together with the second holding member 32. Therefore, the citric acid aqueous solution in contact with electrical contact 50 convects, removing more dirt adhering to electrical contact 50 compared to a case where the citric acid aqueous solution does not convect.

[0059] Next, valve 124 is closed and valve 142 is opened. Furthermore, the citric acid aqueous solution held in housing 202 is discharged into citric acid tank 220. Thus, the citric acid aqueous solution used for cleaning can move from housing 202 to citric acid tank 220, and the cleaning apparatus 100 can reuse the citric acid aqueous solution.

[0060] Next, valve 142 is closed and valve 150 is opened. As a result, liquid nozzle 144 sprays water toward electrical contact 50 at a flow rate of 2 L / min. Consequently, the second retaining member 32, containing electrical contact 50, is cleaned by water (equivalent to an example of a second water washing process). Furthermore, water spraying based on liquid nozzle 144 continues for more than 10 minutes. Additionally, water sprayed by liquid nozzle 144 accumulates in housing 202 during this time. As a result, a portion of the second retaining member 32, containing electrical contact 50, is immersed in the water held in housing 202, and the second retaining member 32 is also cleaned by the water held in housing 202 (equivalent to an example of a second water washing process). As a result, the citric acid aqueous solution adhering to the second retaining member 32 is rinsed off with water. Next, valve 150 is closed and valve 136 is opened. As a result, the water held in housing 202 is drained.

[0061] Next, valve 162 is opened. As a result, air nozzle 154 sprays gas toward the second retaining member 32 at a flow rate of 2 L / min. Furthermore, the gas spraying based on air nozzle 154 continues for more than 10 minutes. As a result, water adhering to the second retaining member 32, which includes the electrical contact 50, is blown away, and the second retaining member 32 dries (an example of a drying process).

[0062] Next, valve 162 is closed, and the heating device 166 blows warm air at an angle of 45 degrees or higher toward the second retaining member 32. Furthermore, the warm air supply based on the heating device 166 continues for at least 60 minutes. As a result, water adhering to the second retaining member 32 that cannot be dried by the injection of gas based on the air nozzle 154 evaporates and dries (an example of a drying process).

[0063] Furthermore, the drying process based on the air nozzle 154 and the drying process based on the warm air device 166 can be performed simultaneously, and the drying process based on the warm air device 166 can also be performed before the drying process based on the air nozzle 154.

[0064] Next, the actuator 104 is stopped, and the rotation of the second holding member 32 in the circumferential direction is stopped. Then, the operation of the cleaning device 100 ends.

[0065] Cleaning with a citric acid aqueous solution can remove contaminants such as copper, copper oxides, and corrosion inhibitors adhering to the electrical contacts 50 that cannot be effectively removed by water. Therefore, the cleaning apparatus 100 can remove contaminants from the electrical contacts 50 that cannot be removed by pure water using a citric acid aqueous solution. Furthermore, the citric acid aqueous solution will not corrode or degrade the materials constituting the substrate holder 30, such as polyetherketone resin, fluororubber, or stainless steel. Therefore, the cleaning apparatus 100 can clean the electrical contacts 50 without separating them from the second holding member 32 of the substrate holder 30, and will not adversely affect the second holding member 32. Moreover, the citric acid aqueous solution will not disrupt the electrolyte of the plating solution and will not adversely affect the plating solution. Therefore, even if residual citric acid remains on the electrical contacts 50 after citric acid cleaning and mixes into the plating solution, the electrical contacts 50 cleaned by the cleaning apparatus 100 will not adversely affect the citric acid.

[0066] Furthermore, the mass percentage concentration of the citric acid aqueous solution is preferably 2% to 30%, and the temperature of the citric acid solution is preferably 20°C to 45°C.

[0067] Furthermore, before cleaning the electrical contacts 50 with a citric acid aqueous solution, the cleaning device 100 cleans the second retaining member 32 with water. That is, the electrical contacts 50 installed on the second retaining member 32, where dirt has been roughly removed by water cleaning, are cleaned with a citric acid aqueous solution. Therefore, the citric acid aqueous solution used for cleaning is less likely to cause contamination.

[0068] Furthermore, if the citric acid aqueous solution enters the gap between the components constituting the second holding member 32 and then dries, citric acid powder may remain in the gap. In contrast, the cleaning apparatus 100 cleans the substrate holder 30 with water before cleaning with the citric acid aqueous solution, thus forming a water film in the gap. Moreover, the water film inhibits the intrusion of the citric acid aqueous solution into the gap. As a result, the residue of citric acid powder is suppressed.

[0069] [Second Implementation]

[0070] Next, the cleaning apparatus 400 of the second embodiment will be described with reference to the accompanying drawings. First, the structure of the cleaning apparatus 400 of the second embodiment will be described. Next, the cleaning method of the cleaning apparatus 400 will be described. Next, variations of the cleaning apparatus 400 will be described.

[0071] <Structure of the cleaning device>

[0072] Figure 6 This is a perspective view showing the cleaning apparatus 400 of the present invention, which is different from the cleaning apparatus 100. Figure 7This is a perspective view of the carrier 500 housed inside the cleaning tank 520 of the cleaning device 400. The cleaning device 400, like the cleaning device 100 described above, is a device for cleaning the electrical contacts 50. (Referring to...) Figure 6 The cleaning device 400 includes a cleaning tank 520, a cover 404, and a carrier 500 (see reference). Figure 8 The following describes the components of the cleaning apparatus 400.

[0073] The cleaning tank 520 has a roughly rectangular shape and is configured to accommodate the carrier 500 (see reference). Figure 8 Additionally, the cleaning tank 520 has the function of holding liquids such as citric acid solution and water inside. A cover 404 is installed in the cleaning tank 520 and can be opened and closed freely. With the cover 404 open, the carrier 500 is placed into and removed from the cleaning tank 520.

[0074] If reference Figure 7 The carrier 500 has a generally rectangular shape and includes four columns 502, eight beams 503, and multiple grid plates 504. The four columns 502, extending vertically, are arranged in a quadrilateral configuration. The upper ends of each column 502 are connected by the quadrilateral beams 503, and the lower ends of each column 502 are also connected by quadrilateral beams 503. The multiple grid plates 504 are quadrilaterals and arranged at equal intervals vertically. Each grid plate 504 is fixed to one of the four columns 502. In other words, the carrier 500 has the shape of a platform formed by the grid plates 504. Thus, the multiple grid plates 504 can each support the second retaining member 32.

[0075] Figure 8 This is a cross-sectional view of the cleaning device 400. Figure 9 yes Figure 8 AA section view. (Refer to...) Figure 8 As an example, the cleaning device 400 also includes a citric acid tank 540, a supply port 408, a discharge port 410, four pipes 412, 414, 416, 418, four valves 420, 422, 424, 426, and a pump 428.

[0076] Citric acid tank 540 functions to hold an aqueous citric acid solution. In this embodiment, citric acid tank 540 holds an aqueous citric acid solution with a mass percentage concentration of 2% to 30% citric acid. A supply port 408 and a discharge port 410 are both formed at the bottom of the cleaning tank 520. Pipe 412 connects the supply port 408 and the citric acid tank 540, with valves 422 and 426 sequentially installed from the valve closest to the supply port 408. Conversely, pipe 414 connects the discharge port 410 and the citric acid tank 540, with valves 420 and 424 sequentially installed from the valve closest to the discharge port 410. Additionally, pipe 416 connects the portion of pipe 414 between valves 420 and 424 to the suction port of pump 428. Furthermore, pipe 418 connects the portion of pipe 412 between valves 422 and 426 to the discharge port of pump 428.

[0077] Therefore, if valves 424 and 422 are opened with valves 420 and 426 closed, pump 428 can supply the citric acid aqueous solution held in the citric acid tank 540 from the supply port 408 into the cleaning tank 520. Conversely, if valves 420 and 426 are opened with valves 422 and 424 closed, pump 428 can draw the citric acid aqueous solution held in the cleaning tank 520 from the discharge port 410 and supply it to the citric acid tank 540. Furthermore, if valves 424 and 426 are closed and valves 420 and 422 are opened while the cleaning tank 520 is filled with liquid, pump 428 can draw liquid from inside the cleaning tank 520 from the discharge port 410. Pump 428 can then supply this drawn liquid from the supply port 408 into the cleaning tank 520. Thus, pump 428 can circulate and convection the liquid inside the cleaning tank 520.

[0078] Additionally, as an example, the cleaning device 400 includes a buffer tank 560, a piping 432, and a valve 434. The buffer tank 560 functions to hold liquids such as water and citric acid aqueous solution. Furthermore, the piping 432 connects the cleaning tank 520 and the buffer tank 560, and functions to discharge the liquid held in the cleaning tank 520 into the buffer tank 560. The opening of the piping 432 on the cleaning tank 520 side is located higher than the level gauge 524 (described later) and lower than the level gauge 526. Moreover, when the liquid level inside the cleaning tank 520 rises to the height of the opening of the piping 432, the liquid inside the cleaning tank 520 moves towards the buffer tank 560 through the piping 432. Thus, the piping 432 prevents liquid from overflowing from the cleaning tank 520. Furthermore, in this embodiment, the opening of the piping 432 is positioned such that liquid can be discharged when the liquid level inside the cleaning tank 520 is 72L or more. Additionally, valve 434 is installed on pipe 432 and has the function of adjusting the flow rate of fluid passing through pipe 432. Normally, valve 434 is open, but it is closed when the second retaining member 32 (described later) is dry.

[0079] Additionally, as an example, the cleaning tank 520 is equipped with three water level gauges 522, 524, and 526, which are capable of detecting the presence or absence of liquid at their respective installation locations. Water level gauge 522 is installed to detect the presence or absence of liquid inside the cleaning tank 520 at a position lower than the second retaining member 32 housed inside the cleaning tank 520. More specifically, it is positioned to detect whether the liquid level inside the cleaning tank 520 is 1L or more. Furthermore, water level gauge 524 is installed to detect the presence or absence of liquid inside the cleaning tank 520 at a position higher than the second retaining member 32 housed inside the cleaning tank 520.

[0080] Furthermore, the water level gauge 526 is installed to detect the presence or absence of liquid inside the cleaning tank 520 at a position higher than the water level gauge 524. More specifically, the water level gauge 526 is positioned to detect whether the liquid level inside the cleaning tank 520 is 80L or more. The water level gauge 526 is located higher than the opening of the aforementioned piping 432, and therefore does not normally detect liquid. Therefore, if the water level gauge 526 detects liquid, the possibility of malfunctions such as liquid blockage in the piping 432 of the cleaning device 400 is higher. Therefore, the water level gauge 526 is configured to stop the cleaning device 400 when liquid is detected. Thus, the cleaning device 400 suppresses accidents caused by malfunctions.

[0081] Additionally, as an example, the cleaning device 400 includes a piping 436. The piping 436 connects the citric acid tank 540 and the buffer tank 560, and functions to discharge the liquid held in the citric acid tank 540 into the buffer tank 560. The opening of the piping 436, which connects to the citric acid tank 540, is positioned higher than the level gauge 544 described later. Furthermore, when the liquid level inside the citric acid tank 540 rises to the height of the opening of the piping 436, the liquid inside the citric acid tank 540 moves towards the buffer tank 560 through the piping 436. In other words, the piping 436 prevents the citric acid aqueous solution from overflowing from the citric acid tank 540. Moreover, in this embodiment, the opening of the piping 436 is positioned such that liquid can be discharged when the liquid level inside the citric acid tank 540 is 85L or more.

[0082] Additionally, as an example, the citric acid tank 540 is equipped with two level gauges 542 and 544, which are capable of detecting the presence or absence of liquid at their respective installation locations. Level gauge 542 is positioned to detect whether the liquid level inside the citric acid tank 540 is 10L or more. Furthermore, level gauge 544 is positioned to detect whether the liquid level inside the citric acid tank 540 is 82L or more.

[0083] Additionally, as an example, the buffer tank 560 is equipped with two level gauges 562 and 564, which are capable of detecting the presence or absence of liquid at the installation location. Level gauge 562 is positioned to detect whether the liquid level inside the buffer tank 560 is above 1L. When level gauge 562 detects liquid, the cleaning device 400 uses a known method to drain the liquid inside the buffer tank 560 to the waste liquid section of the factory (not shown).

[0084] Furthermore, the water level gauge 564 is positioned to detect whether the liquid level inside the buffer tank 560 is 10L or more. Moreover, the water level gauge 564 is configured such that the cleaning device 400 stops when liquid is detected. The water level gauge 564 is located higher than the water level gauge 562, and therefore, like the water level gauge 526 described above, it typically does not detect liquid. Therefore, if the water level gauge 564 detects liquid, the cleaning device 400 is more likely to malfunction. Thus, by stopping the cleaning device 400 when the water level gauge 564 detects liquid, the cleaning device 400 can prevent accidents caused by malfunctions.

[0085] Additionally, as an example, the cleaning device 400 has two air intakes 438 (see reference). Figure 6 ), exhaust port 440, two fans 442 (refer to) Figure 9 ), two heaters 444, exhaust flow path 454, partition plate 446 (refer to) Figure 8), first opening 448, second opening 450, and opening 452. (Refer to...) Figure 8 The partition plate 446 is an L-shaped thin plate component that divides the cleaning tank 520 into a first chamber 528 and a second chamber 530. The partition plate 446 has an upper surface 456 and a side surface 458. The upper surface 456 is located directly below the air intake 438, which is formed on the upper surface 532 of the cleaning tank 520, spaced apart from the air intake 438. The first chamber 528 communicates with the air intake 438 without passing through the second chamber 530. The side surface 458 extends from the upper surface 456 to the lower surface 459 of the cleaning tank 520. Therefore, the second chamber 530 has a generally cuboid shape, and the first chamber 528 is an L-shape formed by cutting out the second chamber 530 from the generally cuboid shape. Furthermore, a first opening 448 is formed on the upper surface 456 of the partition plate 446, and a second opening 450 is formed on the side surface 458 of the partition plate 446. Furthermore, a carrier 500 is disposed inside the first chamber 528 adjacent to the second opening 450. Additionally, an opening 452 is formed on the side 529 of the first chamber 528 at a position higher than the water level gauge 524. Moreover, the opening 452 communicates with the exhaust port 440 via an exhaust flow path 454 (see reference). Figure 9 In other words, the first chamber 528 communicates with the exhaust port 440, but not through the second chamber 530. Furthermore, the fan 442 is positioned inside the first chamber 528 and directly above the first opening 448 formed on the upper surface 456 (see reference). Figure 8 Therefore, the fan 442 can blow gas from inside the first chamber 528 and gas drawn from outside the cleaning tank 520 via the suction port 438 into the first opening 448. Furthermore, the gas blown into the first opening 448 is supplied from the second opening 450 to the second holding member 32 held by the carrier 500 through the second chamber 530. That is, the second chamber 530 forms a flow path from the first opening 448 to the second opening 450. Additionally, as described above, the second holding member 32 is supported by the mesh plate 504 of the carrier 500. The gas supplied from the second opening 450 to the second holding member 32 is dispersed inside the cleaning tank 520 through the mesh provided on the mesh plate 504. As a result, the temperature inside the cleaning tank 520 can be homogenized. Furthermore, two heaters 444 are disposed in the second chamber 530. Therefore, the two heaters 444 can heat the gas blown onto the second holding member 32.

[0086] Additionally, as an example, the cleaning device 400 includes a thermometer 460 and a temperature regulator 462 (see reference). Figure 8 and Figure 9The temperature measuring section of thermometer 460 is located inside the second chamber 530 of the cleaning tank 520. Therefore, thermometer 460 has the function of measuring the temperature of the gas inside the second chamber 530. Furthermore, temperature regulator 462 is disposed outside the cleaning tank 520 and is electrically connected to thermometer 460 and two heaters 444. Moreover, temperature regulator 462 has the function of controlling heaters 444 based on the temperature measured by thermometer 460. Thus, the interior of the cleaning tank 520 is maintained at a predetermined temperature. In this embodiment, temperature regulator 462 controls heaters 444 so that the temperature inside the cleaning tank 520 is 40 degrees Celsius or higher and 50 degrees Celsius or lower during the drying of the second holding member 32 (described later).

[0087] Additionally, as an example, the cleaning device 400 also includes a thermocouple 464 (see reference). Figure 9 Thermocouple 464 is disposed inside the second chamber 530. Furthermore, thermocouple 464 has the function of stopping both heaters 444 when the temperature inside the second chamber 530 exceeds 60 degrees Celsius.

[0088] <Cleaning Method>

[0089] Then, while referring to Figure 1 and Figure 8 The operation of the cleaning device 400 will be explained below. In the initial state, as an example, the second retaining member 32 is installed on the first retaining member 31, and valves 420, 422, 424, and 426 are closed. Furthermore, the cleaning tank 520 does not hold liquids such as citric acid solution or water.

[0090] First, such as Figure 1 As shown, the first retaining member 31 and the second retaining member 32 are separated (corresponding to an example of a separation process). Next, one or more second retaining members 32 are held in the carrier 500, and the carrier 500 is disposed inside the cleaning tank 520 (see reference). Figure 8 In this embodiment, the first retaining member 31, which is separated from the second retaining member 32, is not housed in the cleaning tank 520. That is, the second retaining member 32 is housed inside the cleaning device 400, which is isolated from the first retaining member 31.

[0091] First, water is supplied to the interior of the washing tank 520 via a known liquid supply device (not shown). This causes the water level inside the washing tank 520 to rise. Furthermore, the water supply is stopped when the water level gauge 524 detects water. As a result, the entire second holding member 32 is immersed in water (corresponding to an example of the first water washing process).

[0092] Next, valves 420 and 422 are opened. As a result, water inside the cleaning tank 520 is discharged from outlet 410, and water discharged from outlet 410 is supplied to the cleaning tank 520 through supply port 408. Consequently, the water inside the cleaning tank 520 circulates and convects. Furthermore, the circulation of water inside the cleaning tank 520 by pump 428 lasts for more than 10 minutes.

[0093] Next, valves 420 and 422 are closed. Then, water is drained into the interior of the cleaning tank 520 through a known liquid discharge device (not shown).

[0094] Next, the water level gauge 544 of the citric acid tank 540 checks the presence or absence of the citric acid aqueous solution. This confirms that a sufficient amount of citric acid aqueous solution is maintained in the citric acid tank 540. Furthermore, if the water level gauge 544 detects citric acid aqueous solution, valves 424 and 422 are opened to supply citric acid aqueous solution into the cleaning tank 520. This causes the liquid level inside the cleaning tank 520 to rise. Moreover, if the water level gauge 524 detects citric acid aqueous solution, the supply of citric acid aqueous solution is stopped. As a result, the second holding member 32 is completely immersed in the citric acid aqueous solution (equivalent to an example of an immersion process). Furthermore, if the water level gauge 544 does not detect citric acid aqueous solution, the cleaning device 400 notifies the operator of insufficient citric acid aqueous solution using known methods.

[0095] Next, valves 420 and 422 are opened. This causes the citric acid solution inside the cleaning tank 520 to drain from outlet 410, and the citric acid solution drained from outlet 410 is supplied to the cleaning tank 520 through supply port 408. As a result, the citric acid solution inside the cleaning tank 520 circulates and convects. This removes more dirt from the electrical contacts 50. Furthermore, the circulation of the citric acid solution inside the cleaning tank 520 by pump 428 is performed for more than 60 minutes.

[0096] Next, the water level gauge 542 of the citric acid tank 540 checks the presence or absence of the citric acid aqueous solution. This confirms that the citric acid tank 540 has sufficient empty capacity to maintain the citric acid aqueous solution. If the water level gauge 544 detects the citric acid aqueous solution, the cleaning device 400 notifies the operator of insufficient empty capacity in the citric acid tank 540 using a known method. On the other hand, if the water level gauge 544 does not detect the citric acid aqueous solution, valve 422 is closed and valve 426 is opened. As a result, pump 428 pressurizes the citric acid aqueous solution inside the cleaning tank 520 into the citric acid tank 540, emptying the cleaning tank 520. Then, valves 420 and 426 are closed. Thus, the citric acid aqueous solution is recovered into the citric acid tank 540. At this time, as described above, prior to the citric acid aqueous solution-based cleaning, there was water-based cleaning; therefore, the recovered citric acid tank 540 contains the water used for the aforementioned water-based cleaning. Therefore, the amount of citric acid aqueous solution recovered is increased compared to the citric acid aqueous solution supplied from the citric acid tank 540 to the cleaning tank 520. Here, as described above, the cleaning device 400 includes a pipe 436 for draining liquid into a buffer tank 560 when the liquid level inside the citric acid tank 540 exceeds a certain amount. Therefore, the increased citric acid aqueous solution can move to the buffer tank 560 through the pipe 436 without overflowing from the citric acid tank 540.

[0097] Next, the second retaining member 32 is cleaned again. Specifically, water is supplied to the interior of the cleaning tank 520 via a known liquid supply device (not shown). As a result, the water level inside the cleaning tank 520 rises. Moreover, the water supply is stopped when the water level gauge 524 detects water. As a result, the entire second retaining member 32 is immersed in water (equivalent to an example of a second water washing process).

[0098] Next, valves 420 and 422 are opened. As a result, water inside the cleaning tank 520 is discharged from outlet 410, and water discharged from outlet 410 is supplied to the cleaning tank 520 through supply port 408. Consequently, the water inside the cleaning tank 520 circulates and convects. Furthermore, the circulation of water inside the cleaning tank 520 by pump 428 lasts for more than 10 minutes.

[0099] Next, valves 420 and 422 are closed. Then, the water inside the cleaning tank 520 is drained through a known liquid discharge device (not shown).

[0100] Next, the water level gauge 522 of the cleaning tank 520 checks for the presence or absence of water. This confirms that no water remains inside the cleaning tank 520. Furthermore, after the water level gauge 522 no longer detects water, the cleaning device 100 begins the drying process to dry the second holding member 32. Specifically, the fan 442 blows gas onto the second holding member 32 (an example of an air supply process). At this time, the heater 44 heats the gas blown onto the second holding member 32 in the second chamber 530 (an example of a heating process). Thus, the second holding member 32 dries. In addition to the gas drawn from the outside of the cleaning tank 520 via the suction port 438, the fan 442 also blows gas located in the first chamber 528 into the first opening 448. The gas located in the first chamber 528 contains gas heated by the heater 444. Therefore, a portion of the gas heated by the heater 444 in the second chamber 530 becomes already heated gas. As a result, the cleaning device 400 is able to supply high-temperature gas to the second holding member 32 while conserving energy used for heating the gas. In addition, warm air is supplied to the second holding member 32 by the fan 442 and the heater 444 for more than 60 minutes. Furthermore, during the drying of the second holding member 32, the thermometer 460 measures the temperature of the gas heated by the heater 444. Moreover, the temperature regulator 462 can control the heater 444 based on the temperature measured by the thermometer 460, thereby adjusting the temperature of the gas blown onto the second holding member 32. The operation of the cleaning device 400 is now complete.

[0101] Thus, the cleaning apparatus 400, like the cleaning apparatus 100 described above, can use a citric acid aqueous solution to clean the electrical contacts 50. Alternatively, the cleaning apparatus 400 can also clean the electrical contacts 50 by immersing the substrate holder 30 itself in a citric acid aqueous solution.

[0102] In addition, the cleaning device 400 uses the carrier 500 to clean the second holding member 32, so multiple second holding members 32 can be cleaned simultaneously in one cleaning action.

[0103] <Variation Example>

[0104] (First variation)

[0105] Figure 10 This is a cross-sectional view showing a first modified example of the cleaning device 400. It can also be as follows: Figure 10As shown, the cleaning device 400 includes a first rod-shaped member 466 configured to rotate and a nozzle 468. In this case, the nozzle 468 is mounted on the first rod-shaped member 466 and configured to rotate integrally with the first rod-shaped member 466. Furthermore, the nozzle 468 has the function of spraying an aqueous solution of citric acid, water, or gas toward the electrical contact 50. In addition, through holes 506 for the first rod-shaped member 466 to pass through are formed in the plurality of mesh plates 504 of the carrier 500.

[0106] By configuring the cleaning device 400 in this way, the nozzle 468 can rotate integrally with the first rod-shaped member 466 while spraying an aqueous solution of citric acid, water, or gas toward the electrical contact 50. Therefore, when spraying an aqueous solution of citric acid toward the electrical contact 50, the cleaning device 400 can clean the electrical contact 50 with the aqueous solution. Alternatively, when spraying water toward the electrical contact 50, the cleaning device 400 can clean the electrical contact 50 with water. Furthermore, when spraying gas toward the electrical contact 50, the cleaning device 400 can dry the electrical contact 50.

[0107] (Second variation)

[0108] Figure 11 This is a cross-sectional view showing a second modified example of the cleaning device 400. It can also be as follows: Figure 11 As shown, the cleaning device 400 includes a second rod-shaped member 470 configured to rotate and a stirring member 472. In this case, the stirring member 472 is a thin plate-shaped member configured to be mounted on the second rod-shaped member 470 and rotate integrally with the second rod-shaped member 470. In addition, through holes 506 for the second rod-shaped member 470 to pass through are formed in the plurality of mesh plates 504 of the carrier 500.

[0109] By configuring the cleaning device 400 in this way, the stirring member 472 can agitate the liquid inside the cleaning tank 520. Therefore, while the cleaning tank 520 contains a citric acid aqueous solution, the cleaning device 400 can remove more dirt adhering to the electrical contacts 50.

[0110] In the first and second embodiments described above, only the second holding member 32 is cleaned by the cleaning apparatus 100 and 400. That is, when the second holding member 32 is cleaned by the cleaning apparatus 100 and 400, the first holding member 31 is not cleaned. Compared to the case where both the first holding member 31 and the second holding member 32 are housed in the cleaning apparatus 100 and 400, the cleaning apparatus 100 and 400 can be miniaturized. If the cleaning solution (citric acid aqueous solution, water) adheres to the first holding member 31, which has a complex structure, such as the mechanism for holding the substrate Wf or the electrical system for supplying power to the substrate Wf, a longer time is required to dry the cleaning solution. In the embodiments described above, the first holding member 31 is isolated from the interior of the cleaning apparatus 100 and 400, and the cleaning apparatus 100 and 400 only clean the second holding member 32, which has a relatively simple structure, thus the drying time can also be shortened.

[0111] [Postscript]

[0112] Some or all of the above-described embodiments may also be described as follows, but are not limited to the following:

[0113] (Postscript 1)

[0114] The cleaning method described in Appendix 1 is a cleaning method for a substrate holder having electrical contacts for contacting the substrate to supply power to the substrate in order to plate the substrate. The cleaning method includes a cleaning step of cleaning the electrical contacts of the substrate holder with a citric acid aqueous solution.

[0115] Cleaning with a citric acid aqueous solution can remove contaminants such as copper, copper oxides, and corrosion inhibitors adhering to electrical contacts that cannot be effectively removed by water. Therefore, the cleaning method described in Appendix 1 can remove contaminants from electrical contacts that cannot be removed by pure water. Furthermore, the citric acid aqueous solution does not corrode or degrade materials constituting the substrate holder, such as polyetherketone resin, fluororubber, or stainless steel. Therefore, this cleaning method allows for cleaning of electrical contacts without separating them from the substrate holder, and does not adversely affect the substrate holder. Moreover, the citric acid aqueous solution does not disrupt the electrolyte of the plating solution and does not adversely affect the plating solution. Therefore, even if residual citric acid from the electrical contacts after cleaning is mixed into the plating solution, the electrical contacts cleaned by this method will not adversely affect the plating solution.

[0116] (Postscript 2)

[0117] In the cleaning method described in Appendix 2, according to the cleaning method described in Appendix 1, the substrate holder has a first holding member and a second holding member. The first holding member has a relay contact configured to be electrically connected to an external power source, and the second holding member has the aforementioned electrical contact. Before the cleaning process, there is a separation process to separate the first holding member and the second holding member. In the cleaning process, the first holding member is not cleaned, but the second holding member is cleaned.

[0118] (Note 3)

[0119] In the cleaning method described in Appendix 3, according to the cleaning method described in Appendix 1 or Appendix 2, the mass percentage concentration of citric acid in the above-mentioned citric acid aqueous solution is 2% to 30%.

[0120] (Note 4)

[0121] In the cleaning method described in Appendix 4, according to any of the cleaning methods described in Appendix 1 to 3, before the above-mentioned cleaning step, there is a step of heating the above-mentioned citric acid aqueous solution to a temperature of 35 degrees or higher and 55 degrees or lower.

[0122] (Note 5)

[0123] In the cleaning method described in Appendix 5, according to any one of Appendix 1 to 4, the cleaning method further includes a rotation step in which an annular holding member having the aforementioned electrical contacts is rotated in the circumferential direction, and the cleaning step includes a step of spraying the aforementioned citric acid aqueous solution toward the aforementioned electrical contacts during the rotation step.

[0124] According to the cleaning method in Appendix 5, the retaining component rotating in the circumferential direction can be cleaned by a jet of citric acid aqueous solution.

[0125] (Note 6)

[0126] In the cleaning method described in Appendix 6, according to the cleaning method described in Appendix 5, the cleaning process includes a step of immersing a portion of the electrical contacts in the citric acid aqueous solution during the rotation process.

[0127] When electrical contacts are merely immersed in a citric acid solution, the citric acid solution in contact with the contacts does not easily convect, resulting in poor cleaning. In contrast, according to the cleaning method in Appendix 6, the electrical contacts, which rotate together with the retaining component, are immersed in a citric acid solution for cleaning. Therefore, the citric acid solution in contact with the contacts convects, removing more dirt adhering to the contacts.

[0128] (Note 7)

[0129] In the cleaning method described in Appendix 7, according to any of the cleaning methods described in Appendix 1 to 6, a first water washing step is performed before the above-mentioned cleaning step to clean the substrate holder with water.

[0130] According to the cleaning method in Appendix 7, the substrate holder is cleaned with water before cleaning the electrical contacts with a citric acid aqueous solution. That is, the electrical contacts mounted on the substrate holder, whose dirt has been roughly removed by water-based cleaning, are cleaned with a citric acid aqueous solution. Therefore, the citric acid aqueous solution used for cleaning is less likely to become contaminated. Furthermore, if the citric acid aqueous solution enters the gaps between the components constituting the substrate holder and then dries, citric acid powder may remain in the gaps. In contrast, in the cleaning method in Appendix 7, the substrate holder is cleaned with water before cleaning with a citric acid aqueous solution, thus forming a water film in the gaps. Moreover, the water film inhibits the penetration of the citric acid aqueous solution into the gaps. As a result, the residue of citric acid powder is suppressed.

[0131] (Note 8)

[0132] In the cleaning method described in Appendix 8, according to any one of Appendix 5 to 7, a second water washing step is performed during the rotation process and after the cleaning process to clean the substrate holder with water.

[0133] In the cleaning method described in Appendix 8, water can be used to rinse the citric acid aqueous solution adhering to the substrate holder.

[0134] (Note 9)

[0135] In the cleaning method described in Appendix 9, according to any one of the cleaning methods described in Appendix 1 to 4, the cleaning process includes an immersion process in which the entire component that is at least part of the substrate holder and the holding component having the electrical contacts is immersed in the citric acid aqueous solution held in the cleaning tank.

[0136] According to the cleaning method in Appendix 9, electrical contacts can be cleaned using a citric acid aqueous solution maintained in the cleaning tank.

[0137] (Postscript 10)

[0138] In the cleaning method described in Appendix 10, according to the cleaning method described in Appendix 9, the following steps are also included: during the above-mentioned immersion step, the above-mentioned citric acid aqueous solution inside the cleaning tank is discharged from the outlet, and the citric acid aqueous solution discharged from the outlet is supplied to the inside of the cleaning tank from the supply port.

[0139] In the cleaning method described in Appendix 10, the citric acid aqueous solution circulates between the inside of the cleaning tank, the outlet, and the supply port, thereby causing convection of the citric acid aqueous solution inside the cleaning tank. Therefore, this cleaning method can remove more dirt from the electrical contacts.

[0140] (Postscript 11)

[0141] In the cleaning method described in Appendix 11, according to the cleaning method described in Appendix 9 or Appendix 10, a first water washing step is performed before the above-mentioned cleaning step, in which the entire holding component is immersed in water held in the above-mentioned cleaning tank.

[0142] According to the cleaning method in Appendix 11, the substrate holder is cleaned with water before cleaning the electrical contacts with a citric acid aqueous solution. Therefore, similar to the cleaning method described in Appendix 7, the citric acid aqueous solution used for cleaning is less likely to cause contamination, and the residue of citric acid powder in the gaps of the substrate holder is suppressed.

[0143] (Postscript 12)

[0144] In the cleaning method described in Appendix 12, according to any one of the cleaning methods described in Appendix 9 to 11, a second water washing step is further provided, after the above-mentioned cleaning step, in which the entire holding component is immersed in water held in the above-mentioned cleaning tank.

[0145] According to the cleaning method in Appendix 12, a substrate holder with citric acid aqueous solution adhering to it can be cleaned with water.

[0146] (Postscript 13)

[0147] In the cleaning method described in Appendix 13, according to the cleaning method described in Appendix 8 or Appendix 12, there is also a drying step after the second water washing step, in which the substrate holder is dried.

[0148] According to the cleaning method in Appendix 13, the substrate holder with water adhering to it can be dried.

[0149] (Postscript 14)

[0150] In the cleaning method described in Appendix 14, according to the cleaning method described in Appendix 13, the drying process includes: an air supply process in which a fan blows gas to the holding member; and a heating process in which a heater heats the gas blown to the holding member.

[0151] In the cleaning method described in Appendix 14, the fan can supply the retaining component with gas heated by the heater.

[0152] (Postscript 15)

[0153] In the cleaning method described in Appendix 15, according to the cleaning method described in Appendix 14, the drying process further includes: a step of measuring the temperature of the gas heated by the heater; and a step of controlling the heater based on the measured temperature and adjusting the temperature of the gas blown onto the holding member.

[0154] In the cleaning method described in Appendix 15, the temperature of the gas supplied by the fan to the holding component is made to a specified temperature.

[0155] (Postscript 16)

[0156] In the cleaning method described in Appendix 16, according to the cleaning method described in Appendix 14 or Appendix 15 which are subordinate to Appendix 12, the air supply process includes: the fan blowing gas drawn from outside the cleaning tank via the air intake into the first opening; the gas blown into the first opening flowing in a second chamber forming a flow path from the first opening to the second opening, and blowing from the second opening toward the holding member disposed in the first chamber; and the fan drawing in the gas that has been blown toward the holding member and is located in the first chamber, and blowing it back into the first opening; the heating process includes heating the gas flowing in the second chamber.

[0157] According to the cleaning method in Appendix 16, the gas flowing in the second chamber is heated and blown toward the holding member disposed in the first chamber. Furthermore, the gas blown toward the holding member is then blown back into the second chamber. Therefore, a portion of the gas supplied to the second chamber is heated gas. Thus, in this method, it is possible to supply high-temperature gas to the holding member while conserving energy used for heating the gas.

[0158] (Postscript 17)

[0159] In the cleaning method described in Appendix 17, according to the cleaning method described in Appendix 9 or any of Appendix 10 to 16 which are subordinate to Appendix 9, the immersion process includes the step of immersing at least one of the holding members of the grid plate supported on the carrier in the citric acid aqueous solution held in the cleaning tank, the carrier having a plurality of the grid plates arranged in the vertical direction.

[0160] In the cleaning method described in Appendix 17, a carrier capable of holding multiple retaining components can be used to immerse the retaining components in an aqueous citric acid solution.

[0161] (Postscript 18)

[0162] In the cleaning method described in Appendix 18, according to the cleaning method described in Appendix 17, there is a first rotation step in which a first rod-shaped member is rotated and the first rod-shaped member is located inside the retaining member which is supported by the plurality of mesh plates and is in an annular shape; and during the first rotation step, a nozzle mounted on the first rod-shaped member rotates integrally with the first rod-shaped member while spraying the citric acid aqueous solution, water or gas toward the electrical contact.

[0163] According to the cleaning method in Appendix 18, the nozzle can rotate integrally with the first rod-shaped component while spraying an aqueous solution of citric acid, water, or gas toward the electrical contacts. Therefore, when an aqueous solution of citric acid is sprayed onto the electrical contacts, the electrical contacts can be cleaned using the aqueous solution. Similarly, when water is sprayed onto the electrical contacts, the electrical contacts can be cleaned using water. Furthermore, when gas is sprayed onto the electrical contacts, the electrical contacts can be dried using this cleaning method.

[0164] (Postscript 19)

[0165] In the cleaning method described in Appendix 19, the cleaning apparatus according to Appendix 17 or Appendix 18 further includes: a second rotation step, in which a second rod-shaped member is rotated, the second rod-shaped member being located inside the holding member which is supported by the plurality of grid plates and is in an annular shape; and during the second rotation step, a stirring member installed on the second rod-shaped member rotates integrally with the second rod-shaped member, thereby stirring the liquid inside the cleaning tank.

[0166] In the cleaning method described in Appendix 19, the liquid inside the cleaning tank can be stirred.

[0167] (Postscript 20)

[0168] The cleaning apparatus of Appendix 20 includes: a rotating member for holding an annular holding member, which holds a substrate for plating and has electrical contacts in contact with the substrate; an actuator for rotating the holding member in a circumferential direction by rotating the rotating member; and a cleaning module for cleaning the holding member rotating by the rotating member using an aqueous citric acid solution.

[0169] According to the cleaning apparatus in Appendix 20, a retaining component that rotates in the circumferential direction can be cleaned using a citric acid aqueous solution. Furthermore, similar to the cleaning method in Appendix 1, this cleaning apparatus does not adversely affect the plating solution or the component used to hold the substrate, i.e., the substrate holder, and can remove dirt adhering to the electrical contacts that cannot be removed with pure water.

[0170] (Postscript 21)

[0171] In the cleaning apparatus described in Appendix 21, according to the cleaning apparatus described in Appendix 20, the holding member is a second holding member having the aforementioned electrical contact, and the substrate holding structure comprises a first holding member and the aforementioned second holding member, wherein the first holding member has a relay contact configured to be electrically connected to an external power source.

[0172] (Postscript 22)

[0173] In the cleaning apparatus described in Appendix 22, according to the cleaning apparatus described in Appendix 20 or Appendix 21, the cleaning module has a nozzle for spraying the citric acid aqueous solution toward the holding member.

[0174] According to the cleaning device in Appendix 22, a retaining component that rotates in the circumferential direction can be cleaned by a jet of citric acid aqueous solution.

[0175] (Postscript 23)

[0176] In the cleaning apparatus described in Appendix 23, according to any one of Appendices 20 to 22, the cleaning module has a housing for holding the citric acid aqueous solution, and a portion of the holding member is immersed in the citric acid aqueous solution held in the housing.

[0177] When using the cleaning apparatus described in Appendix 23 to clean the retaining component with electrical contacts, the electrical contacts, which rotate together with the retaining component, are immersed in a citric acid aqueous solution for cleaning. Therefore, the citric acid aqueous solution in contact with the electrical contacts convects, and the cleaning apparatus is able to remove a significant amount of dirt adhering to the electrical contacts.

[0178] (Postscript 24)

[0179] According to the cleaning apparatus described in any one of Appendices 20 to 23, the cleaning apparatus in Appendix 24 further comprises: a citric acid tank for holding the aforementioned citric acid aqueous solution; a thermostat for heating the aforementioned citric acid aqueous solution held in the citric acid tank to a temperature of 35 degrees Celsius or higher and 55 degrees Celsius or lower; and a pump for pressurizing the aforementioned citric acid aqueous solution held in the citric acid tank to the aforementioned cleaning module.

[0180] (Postscript 25)

[0181] According to the cleaning apparatus described in Appendix 24, which is subordinate to Appendix 23, the cleaning apparatus in Appendix 25 also includes a drain pipe for discharging the citric acid aqueous solution held by the housing into the citric acid tank.

[0182] The cleaning apparatus in Appendix 25 allows the citric acid aqueous solution used for cleaning to be moved from the housing to the citric acid tank. Therefore, the cleaning apparatus can reuse the citric acid aqueous solution.

[0183] (Postscript 26)

[0184] According to any of the cleaning devices described in Appendix 20 to 25, the cleaning device in Appendix 26 further includes a liquid nozzle for spraying water toward the aforementioned holding member.

[0185] The cleaning device in Appendix 26 can clean the retaining component by spraying water toward it from a liquid nozzle.

[0186] (Postscript 27)

[0187] According to any of the cleaning devices described in Appendix 20 to 26, the cleaning device in Appendix 27 further includes an air nozzle for spraying gas toward the aforementioned holding member.

[0188] The cleaning device in Appendix 27 is able to dry the retaining component by spraying gas toward the retaining component through an air nozzle.

[0189] (Postscript 28)

[0190] According to any of the cleaning devices described in Appendix 20 to 27, the cleaning device in Appendix 28 also includes a warm air device for blowing warm air toward the aforementioned holding member.

[0191] The cleaning device in Appendix 28 can dry the retaining component by blowing warm air towards it from the warm air device.

[0192] (Postscript 29)

[0193] The cleaning apparatus of Appendix 29 is a cleaning apparatus for a holding member having an electrical contact and serving as at least part of a substrate holder. The cleaning apparatus includes a cleaning tank for holding a citric acid aqueous solution and immersing the holding member in the citric acid aqueous solution.

[0194] The cleaning apparatus described in Appendix 29 can clean electrical contacts using a citric acid aqueous solution held in a cleaning tank. Furthermore, similar to the cleaning method in Appendix 1, this cleaning apparatus does not adversely affect the plating solution or the substrate holder used to hold the substrate, and can remove dirt adhering to the electrical contacts that cannot be removed with pure water.

[0195] (Postscript 30)

[0196] In the cleaning apparatus of Appendix 30, according to the cleaning apparatus described in Appendix 29, the substrate holder has a first holding member and a second holding member. The first holding member has a relay contact configured to be electrically connected to an external power source, and the second holding member has the aforementioned electrical contact. The holding member is the aforementioned second holding member.

[0197] (Postscript 31)

[0198] According to the cleaning apparatus described in Appendix 29 or Appendix 30, the cleaning apparatus in Appendix 31 further comprises: a supply port for supplying liquid to the interior of the cleaning tank; a discharge port for discharging liquid from the interior of the cleaning tank; and a pump configured to draw liquid from the interior of the cleaning tank from the discharge port and supply the drawn liquid from the supply port to the interior of the cleaning tank.

[0199] The cleaning device in Appendix 31 allows the citric acid aqueous solution to circulate between the inside of the cleaning tank, the outlet, the pump, and the supply port, and allows the citric acid aqueous solution inside the cleaning tank to convect.

[0200] (Postscript 32)

[0201] According to any of the cleaning devices described in Appendix 29 to 31, the cleaning device of Appendix 32 includes a carrier housed inside the cleaning tank, the carrier having a plurality of mesh plates arranged in the vertical direction and used to support the holding member.

[0202] According to the cleaning apparatus in Appendix 32, the carrier is capable of holding multiple retaining components. Therefore, the cleaning apparatus can use the carrier to immerse multiple retaining components in a citric acid aqueous solution at one time.

[0203] (Postscript 33)

[0204] According to the cleaning apparatus described in Appendix 32, the cleaning apparatus in Appendix 33 further comprises: a first rod-shaped member configured to rotate; and a nozzle for spraying the citric acid aqueous solution, water, or gas toward the electrical contacts, mounted on the first rod-shaped member and capable of rotating integrally with the first rod-shaped member, and through holes for the first rod-shaped member to pass through are formed in the plurality of mesh plates respectively.

[0205] According to the cleaning apparatus in Appendix 33, the nozzle can rotate integrally with the first rod-shaped component while spraying an aqueous solution of citric acid, water, or gas toward the electrical contacts. Therefore, when an aqueous solution of citric acid is sprayed onto the electrical contacts, the cleaning apparatus can clean the electrical contacts using the aqueous solution. Additionally, when water is sprayed onto the electrical contacts, the cleaning apparatus can clean the electrical contacts using water. Furthermore, when gas is sprayed onto the electrical contacts, the cleaning apparatus can dry the electrical contacts.

[0206] (Postscript 34)

[0207] According to the cleaning apparatus described in Appendix 32 or Appendix 33, the cleaning apparatus in Appendix 34 further comprises: a second rod-shaped member configured to rotate; and a stirring member installed on the second rod-shaped member for stirring the liquid inside the cleaning tank by rotating integrally with the second rod-shaped member, wherein through holes for the second rod-shaped member to pass through are formed in the plurality of grid plates respectively.

[0208] The cleaning device in Note 34 is capable of agitating the liquid inside the cleaning tank.

[0209] (Postscript 35)

[0210] According to any of the cleaning devices described in Appendix 29 to 34, the cleaning device in Appendix 35 further comprises: a fan for blowing gas to the aforementioned holding member; and a heater for heating the gas blown to the aforementioned holding member.

[0211] In the cleaning device of Appendix 35, the fan is able to supply gas heated by the heater to the holding component.

[0212] (Postscript 36)

[0213] According to the cleaning apparatus described in Appendix 35, the cleaning apparatus in Appendix 36 further includes: a thermometer for measuring the temperature of the gas inside the cleaning tank; and a temperature regulator for controlling the heater based on the temperature measured by the thermometer.

[0214] In the cleaning device described in Appendix 36, the temperature of the gas supplied by the fan to the holding component is made to a specified temperature.

[0215] (Postscript 37)

[0216] According to the cleaning apparatus described in Appendix 36, which is subordinate to Appendix 32, the cleaning apparatus in Appendix 37 includes: an air intake for supplying gas to the interior of the cleaning tank; an exhaust port for discharging gas from the interior of the cleaning tank; a partition plate for dividing the cleaning tank into a first chamber and a second chamber for arranging the carrier; and a first opening and a second opening formed in the partition plate, the second chamber forming a flow path from the first opening to the second opening, the heater being arranged in the flow path, the first chamber communicating with the air intake and the exhaust port without passing through the second chamber, the second opening being adjacent to the carrier, and the fan being configured to blow gas from the first chamber and gas drawn from the outside of the cleaning tank via the air intake into the first opening, and to blow gas from the first chamber and gas drawn from the outside of the cleaning tank via the air intake toward the holding member from the second opening.

[0217] According to the cleaning method in Appendix 37, the gas flowing in the second chamber is heated and blown toward the holding member disposed in the first chamber. Furthermore, the gas blown toward the holding member is then blown back into the second chamber. Therefore, a portion of the gas supplied to the second chamber is heated gas. Thus, in this method, it is possible to supply high-temperature gas to the holding member while conserving energy used for heating the gas.

[0218] The above description only illustrates a few embodiments of the present invention. However, those skilled in the art can readily understand that various modifications or improvements can be made to the illustrated embodiments without departing from the novel teachings and advantages of the present invention. Therefore, it is implied that such modifications or improvements are also included within the technical scope of the present invention. Furthermore, the above embodiments can be combined arbitrarily.

Claims

1. A cleaning method for a substrate holder, the substrate holder having electrical contacts for supplying power to the substrate by contacting the substrate for plating purposes, wherein... The cleaning method includes a cleaning step of cleaning the electrical contacts of the substrate holder using a citric acid aqueous solution. The substrate holder has a first holding member and a second holding member. The first holding member has a relay contact configured to be electrically connected to an external power source, and the second holding member has the electrical contact. The cleaning method includes a separation step prior to the cleaning step, in which the first holding component and the second holding component are separated. In the cleaning process, the first retaining component is not cleaned, but the second retaining component is cleaned. The cleaning process includes an immersion process in which the entire component, which is at least part of the substrate holder and has the electrical contacts, is immersed in the citric acid aqueous solution held in the cleaning tank.

2. The cleaning method according to claim 1, wherein, The citric acid aqueous solution contains 2% to 30% citric acid by mass percentage.

3. The cleaning method according to claim 1, wherein, The cleaning method further includes a rotation step, in which the annular retaining member having the electrical contacts is rotated in the circumferential direction. The cleaning process includes the step of spraying the citric acid aqueous solution toward the electrical contacts during the rotation process.

4. The cleaning method according to claim 1, wherein, It also includes a first water washing process, prior to the cleaning process, in which the substrate holder is cleaned with water.

5. The cleaning method according to claim 1, wherein, It also includes a first water washing process prior to the cleaning process, in which the entire holding component is immersed in water held in the cleaning tank.

6. The cleaning method according to claim 1, wherein, The cleaning method also has the following characteristics: The second water washing process involves rinsing the substrate holder with water after the cleaning process; and The drying process, following the second water washing process, dries the substrate holder.

7. The cleaning method according to claim 6, wherein, The drying process has the following characteristics: In the air supply process, a fan blows gas onto the substrate holder; and In the heating process, the heater heats the gas blown onto the substrate holder.

8. A cleaning apparatus, comprising: A rotating component for holding an annular holding component, the holding component holding a substrate for plating and having electrical contacts in contact with the substrate; An actuator for rotating the holding member in a circumferential direction by rotating the rotating member; and A cleaning module for cleaning the retaining component that is rotating via the rotating component using an aqueous citric acid solution. The retaining component is a second retaining component having the electrical contacts. The substrate holding structure includes a first holding member and a second holding member, wherein the first holding member has a relay contact configured to be electrically connected to an external power source. The cleaning module has a housing for holding the citric acid aqueous solution. The cleaning device is configured such that a portion of the retaining component is immersed in the citric acid aqueous solution held by the housing. The cleaning device cleans the second retaining component after it has been separated from the first retaining component.

9. The cleaning apparatus according to claim 8, wherein, The cleaning module has a nozzle for spraying the citric acid aqueous solution toward the retaining component.

10. The cleaning apparatus according to claim 8, wherein, The cleaning device also includes a warm air device for blowing warm air toward the retaining component.

11. A cleaning apparatus for a holding member, said holding member having electrical contacts and being at least a part of a substrate holder, wherein, The cleaning device includes a cleaning tank for holding an aqueous solution of citric acid and immersing the holding component in the aqueous solution of citric acid. The substrate holder has a first holding member and a second holding member. The first holding member has a relay contact configured to be electrically connected to an external power source, and the second holding member has the electrical contact. The retaining component is the second retaining component. The cleaning device cleans the second retaining component after it has been separated from the first retaining component.

12. The cleaning apparatus according to claim 11, wherein, The cleaning device includes a carrier housed inside the cleaning tank. The carrier has multiple grid plates arranged vertically and used to support the retaining member.

13. The cleaning apparatus according to claim 12, wherein, The cleaning device also includes: The first rod-shaped component is configured to rotate; and A nozzle, used to spray the citric acid aqueous solution, water, or gas toward the electrical contacts, is mounted on the first rod-shaped component and is capable of rotating integrally with the first rod-shaped component. The plurality of grid plates are each formed with through holes for the first rod-shaped component to pass through.

14. The cleaning apparatus according to claim 12, wherein, The cleaning device also includes: The second rod-shaped component is configured to rotate; and A stirring component, mounted on the second rod-shaped component, is used to stir the liquid inside the cleaning tank by rotating integrally with the second rod-shaped component. The plurality of grid plates are each formed with through holes for the second rod-shaped component to pass through.

15. The cleaning apparatus according to claim 11, wherein, The cleaning device also includes: A fan, used to blow gas onto the retaining member; and A heater for heating the gas blown onto the holding member.

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