Substrate processing equipment

Abstract

The present invention relates to a substrate processing device, and more specifically, to a substrate processing device, comprising: a chamber portion; a base portion, which is built into the chamber portion; a shaft portion, which is rotatably mounted on the base portion and rotates a substrate placed on the shaft portion; a plurality of processing portions, which are rotatably mounted on the base portion, move between the substrate and the base portion, and spray processing materials onto the substrate; and a damper portion, which is mounted on the chamber portion and keeps the internal pressure of the chamber portion constant. The substrate processing device can optimize the size of the chamber portion and suppress substrate defects.

Description

Technical Field

[0001] The present invention relates to a substrate processing device, and more particularly to a substrate processing device capable of optimizing nozzle configuration, reducing equipment size through substrate detection, and suppressing substrate defects. Background Art

[0002] Generally speaking, in the semiconductor manufacturing process, the wafer processing process includes a photoresist coating process (Photoresist Coating), a developing process (Develop & Bake), an etching process (Etching), a chemical vapor deposition process (Chemical Vapor Deposition), an ash removal process (Ashing), etc.

[0003] The process for removing various contaminants attached to the substrate during the process of performing the above-mentioned various steps includes a wet cleaning process using chemical liquid or deionized water (DI water).

[0004] In addition, after the cleaning process is completed, there is a drying process for drying the residual chemical solution or deionized water on the surface of the semiconductor substrate. The substrate drying devices used for the drying process include a spin dryer that dries the semiconductor substrate using mechanical rotation force and an IPA dryer that dries the semiconductor substrate using the chemical reaction of IPA (isopropyl alcohol).

[0005] In the prior art, there is a problem that the size of the equipment is increased in order to prevent mutual interference in the arrangement of multiple nozzles. Therefore, it is necessary to improve this.

[0006] The background technology of the present invention is recorded in Korean Patent Gazette No. 10-2031304 (authorization date: October 4, 2019, invention name: substrate processing chamber capable of etching and degumming, substrate processing device using the same, and substrate processing method using the same). Summary of the invention

[0007] Technical issues to be solved

[0008] The present invention is proposed to improve the above-mentioned problems, and its object is to provide a substrate processing apparatus that can optimize nozzle configuration, reduce the size of the equipment through substrate detection, and suppress substrate defects.

[0009] Solutions to technical problems

[0010] The substrate processing device according to the present invention is characterized in that it includes: a chamber portion; a base portion, which is built into the chamber portion; a shaft portion, which is rotatably mounted on the base portion and rotates the substrate placed on the shaft portion; a plurality of processing portions, which are rotatably mounted on the base portion, move between the substrate and the base portion, and spray processing materials onto the substrate; and a damper portion, which is mounted on the chamber portion and keeps the internal pressure of the chamber portion fixed.

[0011] The processing unit is characterized in that it includes: a first processing unit, which is rotatably mounted on the base unit and sprays a first processing substance onto the substrate; a second processing unit, which is rotatably mounted on the base unit and sprays a second processing substance onto the substrate; a third processing unit, which is arranged opposite to the second processing unit and is rotatably mounted on the base unit, the third processing unit moves upward without interfering with the second processing unit and sprays a third processing substance onto the substrate; and a fourth processing unit, which is rotatably mounted on the base unit and sprays a fourth processing substance onto the substrate.

[0012] The processing unit is characterized in that it further includes: a fifth processing unit installed on the base unit, which cleans the substrate when a process error occurs so that the substrate can be reused.

[0013] The substrate processing apparatus according to the present invention is characterized by further comprising: a detection unit installed in the chamber portion and detecting an internal state of the chamber portion and a state of the substrate.

[0014] The detection unit is characterized by including a vibration detection unit that detects the vibration of the chamber unit.

[0015] The detection unit is characterized by comprising: a temperature and humidity detection unit for detecting the temperature and humidity of the chamber unit.

[0016] The detection unit is characterized in that it includes: a thermal imaging detection unit for detecting the temperature of the substrate.

[0017] The detection unit is characterized by including a gas detection unit that detects the gas in the chamber.

[0018] The damper part is characterized in that it includes: the damper part includes: a damper tube part, which is connected to the chamber part and discharges the internal gas of the chamber part to the outside; a damper opening and closing part, which opens and closes the damper tube part; a damper motor part, which makes the damper opening and closing part work; a damper measuring part, which is installed in the chamber part and measures the internal pressure of the chamber part; and a damper control part, which receives the measurement signal of the damper measuring part to control the damper motor part.

[0019] The substrate processing apparatus according to the present invention is characterized by further comprising: an inspection unit installed on the base unit, and determining whether the processing material at a set flow rate is discharged from the processing unit.

[0020] The substrate processing apparatus according to the present invention is characterized by further comprising: a lower processing portion installed on the rotation shaft portion and discharging a lower processing material to the lower portion of the substrate.

[0021] The lower processing part is characterized in that it includes: a lower storage part, which stores more than one lower processing material; a lower guide part, which is installed on the rotating shaft part and guides more than one lower processing material; and a lower nozzle part, which is formed on the upper part of the lower guide part and discharges more than one lower processing material.

[0022] Effects of the Invention

[0023] According to the substrate processing apparatus of the present invention, the plurality of processing parts are arranged around the rotation shaft part, so that the size of the chamber part can be optimized.

[0024] According to the substrate processing apparatus of the present invention, the detection unit measures the state of the substrate processing step in real time, and the damper unit maintains the pressure of the chamber unit at a fixed level, thereby suppressing substrate processing defects. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 FIG. 1 is a diagram briefly showing a substrate processing apparatus according to an embodiment of the present invention.

[0026] Figure 2 The figure briefly shows a processing unit according to an embodiment of the present invention.

[0027] Figure 3 The figure briefly shows a detection unit according to an embodiment of the present invention.

[0028] Figure 4 FIG. 1 is a diagram briefly showing a damper portion according to an embodiment of the present invention.

[0029] Figure 5 FIG. 1 is a diagram briefly showing an inspection unit according to an embodiment of the present invention.

[0030] Figure 6 FIG. 1 is a diagram briefly showing an inspection unit according to an embodiment of the present invention.

[0031] Figure 7 FIG. 1 is a diagram briefly showing a lower processing unit according to an embodiment of the present invention.

[0032] Figure 8 FIG. 1 is a diagram briefly showing a lower valve portion according to an embodiment of the present invention.

[0033] Description of Reference Numerals

[0034] 10: chamber portion; 20: base portion; 30: shaft portion; 40: processing portion; 41: first processing portion; 42: second processing portion; 43: third processing portion; 44: fourth processing portion; 45: fifth processing portion; 50: detection portion; 51: vibration detection portion; 52: temperature and humidity detection portion; 53: thermal imaging detection portion; 54: gas detection portion; 55: substrate detection portion; 60: damper portion; 61: damper tube portion; 62: damper opening and closing portion; 63: damper motor portion; 64: damper measuring portion; 65: damper control portion; 70: inspection portion; 71: inspection and measuring portion; 72: inspection pipeline portion; 73: inspection valve portion; 80: lower processing portion; 81: lower storage portion; 82: lower guide portion; 83: lower nozzle portion; 100: substrate. DETAILED DESCRIPTION

[0035] Hereinafter, an embodiment of a substrate processing apparatus according to the present invention will be described with reference to the accompanying drawings. In the process, the thickness of the lines shown in the drawings or the size of the constituent elements may be exaggerated for the sake of clarity and convenience of the description. In addition, the terms in the following text are defined in consideration of their functions in the present invention and may differ depending on the intention or convention of the user or operator. Therefore, these terms should be defined based on the overall content of the present invention.

[0036] Figure 1 FIG. 2 is a diagram briefly showing a substrate processing apparatus according to an embodiment of the present invention. Figure 1 , a substrate processing apparatus 1 according to an embodiment of the present invention includes a chamber portion 10 , a base portion 20 , a shaft portion 30 , a processing portion 40 , and a damper portion 60 .

[0037] The chamber part 10 is formed with a space in which the equipment is built. As an example, the upper side of the chamber part 10 is open to allow the substrate 100 to be loaded or unloaded, and the upper side can be closed as needed.

[0038] The base 20 is built in the chamber 10 . As an example, the base 20 is built in the chamber 10 , and the outer side surface thereof may be coupled to the outer wall of the chamber 10 .

[0039] The shaft portion 30 is rotatably mounted on the base portion 20 to rotate the substrate 100 placed on the shaft portion 30. As an example, the shaft portion 30 can rotate itself by a motor drive, and the substrate 100 loaded by a transfer robot can be placed.

[0040] The plurality of processing units 40 are rotatably mounted on the base unit 20, move between the substrate 100 and the base unit 20, and spray the processing material onto the substrate 100. As an example, each processing unit 40 is disposed at the edge of the base unit 20, and can be rotated and disposed above the substrate 100 as needed, and spray the processing material.

[0041] The damper 60 is mounted on the chamber 10 to keep the internal pressure of the chamber 10 constant. For example, the damper 60 communicates with the base 20 and discharges the internal air to the outside when the internal pressure of the chamber 10 rises, thereby guiding the internal pressure of the chamber 10 to be constant.

[0042] In addition, the substrate processing apparatus 1 according to an embodiment of the present invention may further include a detection unit 50. The detection unit 50 is installed in the chamber unit 10 to detect the internal state of the chamber unit 10 and the state of the substrate 100. As an example, the state of the chamber unit 10 and the substrate 100 can be measured in real time by the detection unit 50, and the process can be interrupted as needed.

[0043] Figure 2 FIG. 2 is a diagram briefly showing a processing unit according to an embodiment of the present invention. Figure 2 According to an embodiment of the present invention, the processing unit 40 includes a first processing unit 41 , a second processing unit 42 , a third processing unit 43 and a fourth processing unit 44 .

[0044] The first processing part 41 is rotatably mounted on the base part 20 and sprays the first processing substance onto the substrate 100. As an example, the first processing part 41 may include a first processing storage part for storing the first processing substance, a first processing guide part connected to the first processing storage part and rotatably mounted on the base part 20 to guide the first processing substance, a first processing rotating part that rotates the first processing guide part, and a first processing nozzle part formed in the first processing guide part and discharging the first processing substance. At this time, the first processing substance may be any one or more of DSP, DIW, and CO2. Observed from a plane Figure 2 When the first processing part 41 is disposed on the left side of the rotating shaft part 30 .

[0045] The second processing part 42 is rotatably mounted on the base part 20, and sprays the second processing substance onto the substrate 100. As an example, the second processing part 42 may include a second processing storage part for storing the second processing substance, a second processing guide part connected to the second processing storage part and rotatably mounted on the base part 20 to guide the second processing substance, a second processing rotating part that rotates the second processing guide part, and a second processing nozzle part formed in the second processing guide part and discharging the second processing substance. At this time, the second processing substance may be N2 (nitrogen gas), and the second processing nozzle part may include a vertical nozzle and an inclined nozzle. Observation from the plane Figure 2When the second processing unit 42 is disposed below the rotating shaft 30 .

[0046] The third processing part 43 is arranged in a manner opposite to the second processing part 42 and is rotatably mounted on the base part 20. The third processing part 43 moves upward without interfering with the second processing part 42, and sprays the third processing substance onto the substrate 100. As an example, the third processing part 43 may include a third processing storage part for storing the third processing substance, a third processing guide part connected to the third processing storage part and rotatably mounted on the base part 20 to guide the third processing substance, a third processing rotating part for rotating the third processing guide part, a third processing lifting part for moving the third processing guide part up and down, and a third processing nozzle part formed in the third processing guide part and discharging the third processing substance. At this time, the third processing substance may be any one or more of DHF and DIW. Observed from the plane Figure 2 When the third processing unit 43 is disposed below the rotating shaft 30 .

[0047] That is, the second processing section 42 and the third processing section 43 are arranged in a manner opposite to each other, and the third processing section 43 can be arranged outside the second processing section 42. Thus, when driven, the height of the third processing section 43 changes and rotates, so that it does not interfere with the second processing section 42, and the interval between the substrate 100 and the third processing section 43 can be kept constant.

[0048] The fourth processing unit 44 is rotatably mounted on the base unit 20 and sprays a fourth processing substance onto the substrate 100. As an example, the fourth processing unit 44 may include a fourth processing storage unit for storing a fourth processing substance, a fourth processing guide unit connected to the fourth processing storage unit and rotatably mounted on the base unit 20 to guide the fourth processing substance, a fourth processing rotating unit for rotating the fourth processing guide unit, and a fourth processing nozzle unit formed on the fourth processing guide unit and discharging the fourth processing substance. At this time, the fourth processing substance may be any one or more of DIW and HOT DIW. Observed from the plane Figure 2 When the fourth processing unit 44 is configured on the right side of the rotating shaft 30 .

[0049] The processing unit 40 according to an embodiment of the present invention may further include a fifth processing unit 45. The fifth processing unit 45 is installed on the base unit 20 to clean the substrate when a process error occurs so that the substrate 100 can be reused. As an example, the fifth processing unit 45 may include a fifth processing storage unit for storing a fifth processing substance, a fifth processing guide unit connected to the fifth processing storage unit and installed on the base unit 20 to guide the fifth processing substance, and a fifth processing nozzle unit formed in the fifth processing guide unit and discharging the fifth processing substance. In this case, the fifth processing substance may be DIW. Observed from the plane Figure 2When the fifth processing unit 45 is disposed between the third processing unit 43 and the fourth processing unit 44, if an error occurs, the first processing unit 41 to the fourth processing unit 44 can stop operating and return to their original positions. In addition, the fifth processing unit 45 can be disposed above the substrate 100 to spray the fifth processing substance. Thus, the substrate 100 can be reused after being cleaned.

[0050] Figure 3 FIG. 2 is a diagram briefly showing a detection unit according to an embodiment of the present invention. Figure 3 According to an embodiment of the present invention, the detection unit 50 may include any one or more of a vibration detection unit 51 , a temperature and humidity detection unit 52 , a thermal imaging detection unit 53 and a gas detection unit 54 .

[0051] The vibration detection unit 51 detects the vibration of the chamber unit 10. As an example, the vibration detection unit 51 may be mounted inside or outside the chamber unit 10 to detect the vibration of the chamber unit 10 as the shaft unit 30 is driven. In addition, the vibration detection unit 51 may be directly mounted on the shaft unit 30 to detect the vibration as the shaft unit 30 is driven.

[0052] The temperature and humidity detection unit 52 detects the temperature and humidity of the chamber 10. As an example, the temperature and humidity detection unit 52 may be installed inside the chamber 10 to measure the temperature and humidity inside the chamber 10.

[0053] The thermal imaging detection unit 53 detects the temperature of the substrate 100. As an example, the thermal imaging detection unit 53 can be installed on the upper part of the chamber unit 10 and arranged above the substrate 100 to become a thermal imaging camera for photographing the substrate 100. Through the thermal imaging detection unit 53, when the temperature of the substrate 100 is higher than the set temperature, the substrate processing process can be forcibly interrupted.

[0054] The gas detection unit 54 detects the gas in the chamber 10. For example, the gas detection unit 54 may be installed on the upper portion of the chamber 10 to detect ammonia. The gas detection unit 54 can forcibly interrupt the substrate processing process when the measured value of a specific harmful gas is higher than a set value.

[0055] The detection unit 50 according to an embodiment of the present invention may further include a substrate detection unit 55. The substrate detection unit 55 is installed in the chamber unit 10, and detects the state of the substrate 100 above the substrate 100. As an example, the substrate detection unit 55 may be installed in the upper part of the chamber unit 10, so as to detect the substrate 100 in real time in a manner independent of the up and down movement of the cup surrounding the peripheral part of the substrate 100.

[0056] Figure 4 FIG. 2 is a diagram briefly showing a damper portion according to an embodiment of the present invention. Figure 4The damper part 60 according to an embodiment of the present invention includes a damper pipe part 61 , a damper opening and closing part 62 , a damper motor part 63 , a damper measuring part 64 and a damper control part 65 .

[0057] The damper tube 61 is connected to the chamber 10 to discharge the internal gas of the chamber 10 to the outside. For example, one end of the damper tube 61 may be connected to the lower part of the chamber 10 or the base 20 , and the other end may be connected to the main discharge part 200 .

[0058] The damper opening and closing part 62 opens and closes the damper tube part 61. As an example, the damper tube part 61 may be cylindrical. Also, the damper opening and closing part 62 is in the shape of a disk and is rotatably mounted on the damper tube part 61 so as to open and close the damper tube part 61.

[0059] The damper motor part 63 operates the damper opening and closing part 62. As an example, the damper motor part 63 may be installed outside the damper pipe part 61 and connected to the rotating shaft of the damper opening and closing part 62 to rotate the rotating shaft.

[0060] The damper measuring unit 64 is mounted on the chamber 10 and measures the internal pressure of the chamber 10. As an example, the damper measuring unit 64 is mounted inside the chamber 10, and a plurality of damper measuring units 64 may be evenly arranged at the upper and lower parts of the chamber 10 as required.

[0061] The damper control unit 65 receives the measurement signal of the damper measurement unit 64 to control the damper motor unit 63. When the internal pressure of the chamber unit 10 exceeds the set range, the damper motor unit 63 is driven by the damper control unit 65, thereby guiding the internal pressure of the chamber unit 10 to maintain the set range.

[0062] Figure 5 FIG. 1 is a diagram briefly showing an inspection unit according to an embodiment of the present invention. Figure 6 FIG. 2 is a diagram briefly showing an inspection unit according to an embodiment of the present invention. Figure 5 and Figure 6 According to an embodiment of the present invention, the substrate processing apparatus 1 further includes an inspection unit 70. The inspection unit 70 is installed on the base unit 20 and determines whether the processing material with a set flow rate is discharged from the processing unit 40.

[0063] Specifically, the inspection portion 70 includes an inspection storage portion 71 , an inspection line portion 72 , and an inspection valve portion 73 .

[0064] The inspection storage unit 71 is mounted on the base unit 20 and stores the treated material discharged from the processing unit 40. The inspection storage unit 71 includes a transparent material and is formed with scales so that the operator can visually check it from the outside. As an example, the inspection storage unit 71 can be arranged below the processing unit 40 in a standby state, and is formed in a shape with an open upper side for the treated material to flow in.

[0065] The inspection line part 72 is connected to the inspection storage part 71. As an example, the inspection line part 72 may be connected to the lower end of the inspection storage part 71 and pass through the chamber part 10.

[0066] The inspection valve portion 73 is formed in the inspection pipeline portion 72, and opens and closes the inspection pipeline portion 72. As an example, the inspection valve portion 73 may be formed at the lower end portion of the inspection pipeline portion 72. Furthermore, when inspecting the discharge state of the treated substance of the processing portion 40, the inspection valve portion 73 may close the inspection pipeline portion 72. In addition, after the inspection of the discharge state of the treated substance of the processing portion 40 is completed, the inspection valve portion 73 may open the inspection pipeline portion 72 in order to discharge the stored treated substance.

[0067] In addition, the storage capacity a of the inspection storage unit 71 and the storage capacity of the inspection pipeline unit 72 can be added to obtain the discharge amount of the treatment substance discharged from the processing unit 40. That is, when 500cc of the treatment substance is discharged from the processing unit 40, 250cc of the treatment substance can be stored under the scale of the inspection storage unit 71, and 250cc of the treatment substance can be stored in the inspection pipeline unit 72.

[0068] In addition, the inspection part 70 may further include an inspection recovery part 74. The inspection recovery part 74 may be formed in the inspection storage part 71, and recovers the treated material discharged due to the upper end portion exceeding the set scale and exceeding the set capacity.

[0069] Figure 7 To briefly illustrate a diagram of a lower processing unit according to an embodiment of the present invention, Figure 8 FIG. 2 is a diagram briefly showing a lower valve portion according to an embodiment of the present invention. Figure 7 and Figure 8 The substrate processing apparatus 1 according to an embodiment of the present invention may further include a lower processing unit 80 . The lower processing unit 80 is installed on the rotating shaft unit 30 , and discharges the lower processing material to the lower part of the substrate 100 .

[0070] The lower processing part 80 according to an embodiment of the present invention includes a lower storage part 81 , a lower guide part 82 , and a lower nozzle part 83 .

[0071] The lower storage part 81 stores one or more lower treatment substances. As an example, the lower storage part 81 may include two kinds of chemical solutions, DIW and N2.

[0072] The lower guide 82 is mounted on the shaft 30 and guides one or more lower treatment substances. For example, the lower guide 82 may be connected to the lower storage 81, built in the shaft 30, and may be one or more flow paths that guide the lower treatment substances.

[0073] The lower nozzle unit 83 is formed on the upper part of the lower guide unit 82 to discharge one or more lower processing materials. As an example, the lower nozzle unit 83 includes four lower nozzles for discharging respective lower processing materials, and a part of the lower nozzle unit 83 is formed in an inclined manner to match the arrival position of the substrate 100.

[0074] In addition, the flow path that guides N 2 in the lower guide portion 82 discharges the processed material or the lower processed material to prevent it from infiltrating into the base portion 20 or the rotation shaft portion 30 .

[0075] The lower treatment part 80 according to an embodiment of the present invention may further include a lower valve part 84. The lower valve part 84 is connected to the lower guide part 82 and can remove the lower treatment material in the lower guide part 82.

[0076] As an example, the first lower guide part 821 and the second lower guide part 822 are connected to each other, the first lower guide part 821 is formed with a first lower valve part 841, and the second lower guide part 822 is formed with a second lower valve part 842. At this time, the upper ends of the first lower guide part 821 and the second lower guide part 822 are connected, so that different lower treatment substances can be discharged through the first lower guide part 821. In the above state, the first lower valve part 841 opens the first lower guide part 821, and the liquid medicine is supplied to the substrate 100 after passing through. And, after the liquid medicine is sprayed, the first lower valve part 841 closes the first lower guide part 821, and the second lower valve part 842 opens the second lower guide part 822. In this way, deionized water is supplied to the substrate 100 through the second lower guide part 822 and the first lower guide part 821. At this time, the first lower guide part 821 is diluted, thereby preventing the phenomenon of the liquid medicine fragments splashing through the nozzle formed at the end of the first lower guide part 821 during the subsequent cleaning operation. In addition, after the deionized water is discharged, the deionized water stored in the first lower guide part 821 and the second lower guide part 822 is sucked down by gravity drainage during the process of the second lower valve part 842 closing the second lower guide part 822, thereby suppressing the contamination of the discharge part of the first lower guide part 821. In addition, the liquid medicine existing in the first lower guide part 821 is sucked down by gravity drainage during the process of the first lower valve part 841 closing the first lower guide part 821, thereby suppressing the liquid medicine remaining in the first lower guide part 821.

[0077] The operation and effects of the substrate processing apparatus according to an embodiment of the present invention having the above-mentioned structure are described below.

[0078] When the upper side of the chamber portion 10 is opened, the substrate 100 is placed on the shaft portion 30 by the transfer robot. While the shaft portion 30 rotates, a processing material is sprayed from the processing portion 40 to perform cleaning and drying operations on the substrate 100 .

[0079] At this time, the first processing unit 41 to the fourth processing unit 44 are respectively arranged on the left and right sides and below the rotating shaft unit 30 on the plane, so that the size of the chamber unit 10 can be reduced. In addition, the first processing unit 41 arranged on the left side of the rotating shaft unit 30 rotates and sprays the first processing substance to the substrate 100, and the third processing unit 43 arranged on the lower side of the rotating shaft unit 30 rises and rotates in a manner that does not interfere with the second processing unit 42, and simultaneously sprays the third processing substance to the substrate 100. In addition, the third processing unit 43 arranged on the right side of the rotating shaft unit 30 rotates and sprays the third processing substance to the substrate 100. In addition, the second processing unit 42 arranged on the lower side of the rotating shaft unit 30 sprays the second processing substance to the substrate 100. The first processing substance and the third processing substance may be a liquid or gas for cleaning the substrate 100. In addition, the second processing substance and the fourth processing substance may be a liquid or gas for drying the substrate 100.

[0080] In addition, in the above process, the vibration detection unit 51 detects the vibration generated by the rotation of the shaft unit 30, the temperature and humidity detection unit 51 measures the temperature and humidity of the chamber unit 10, and the thermal imaging detection unit 53 measures whether the substrate 100 is heated. Thus, each detection unit 50 manually or automatically stops the process when it exceeds the set value. In addition, the process can be continued or interrupted by the amount of harmful gas measured by the gas detection unit 54 and the installation state of the substrate 100 measured by the substrate detection unit 55.

[0081] If the process of processing the substrate 100 is interrupted, the first processing unit 41 to the fourth processing unit 44 return to their original positions, and the fifth processing unit 45 cleans the substrate 100, thereby protecting the substrate 100 so that the substrate 100 can be reused.

[0082] According to the substrate processing apparatus 1 according to an embodiment of the present invention, the plurality of processing units 40 are disposed around the rotating shaft unit 30 , so that the size of the chamber unit 10 can be optimized.

[0083] According to the substrate processing apparatus 1 of an embodiment of the present invention, the detection unit 50 measures the state of the processing process of the substrate 100 in real time, and the damper unit 60 maintains a fixed pressure of the chamber unit 10 , thereby suppressing processing defects of the substrate 100 .

[0084] The present invention has been described with reference to the embodiments shown in the accompanying drawings, but this is only an example, and those skilled in the art will appreciate that various modifications and equivalent other embodiments are possible. Therefore, the true protection scope of the present invention should be defined according to the claims.

Claims

1. A substrate processing device, characterized in that: include: Chamber Department; A base portion, built into the chamber portion; A rotating shaft portion is rotatably mounted on the base portion and rotates the substrate placed on the rotating shaft portion; A plurality of processing parts are rotatably mounted on the base part, move between the substrate and the base part, and spray processing substances onto the substrate; a damper portion installed in the chamber portion to keep the internal pressure of the chamber portion constant; and The detection unit is mounted in the chamber unit and detects an internal state of the chamber unit and a state of the substrate.

2. The substrate processing device according to claim 1, characterized in that: The processing unit comprises: A first processing unit is rotatably mounted on the base unit and sprays a first processing substance toward the substrate; a second processing unit rotatably mounted on the base unit and configured to spray a second processing substance onto the substrate; a third processing unit arranged to face the second processing unit and rotatably mounted on the base unit, the third processing unit moving upward without interfering with the second processing unit and spraying a third processing substance onto the substrate; and The fourth processing unit is rotatably mounted on the base unit and sprays a fourth processing substance toward the substrate.

3. The substrate processing device according to claim 2, characterized in that: The processing unit also includes: The fifth processing unit is installed on the base unit and cleans the substrate when a process error occurs so that the substrate can be reused.

4. The substrate processing device according to claim 1, characterized in that: The detection unit comprises: The vibration detection unit detects vibration of the chamber unit.

5. The substrate processing apparatus according to claim 1, wherein: The detection unit comprises: The temperature and humidity detection unit detects the temperature and humidity of the chamber unit.

6. The substrate processing apparatus according to claim 1, wherein: The detection unit comprises: The thermal imaging detection unit detects the temperature of the substrate.

7. The substrate processing apparatus according to claim 1, wherein: The detection unit comprises: The gas detection unit detects the gas in the chamber.

8. The substrate processing apparatus according to claim 1, wherein: The damper portion comprises: a damper pipe portion connected to the chamber portion and discharging the internal gas of the chamber portion to the outside; A damper opening and closing portion, which opens and closes the damper tube portion; A damper motor unit to operate the damper opening and closing unit; a damper measuring portion installed in the chamber portion and measuring an internal pressure of the chamber portion; and The damper control unit receives the measurement signal of the damper measurement unit to control the damper motor unit.

9. The substrate processing apparatus according to claim 1, wherein: Also includes: The inspection unit is mounted on the base unit and determines whether the treatment material at a set flow rate is discharged from the treatment unit.

10. The substrate processing apparatus according to claim 1, wherein: Also includes: The lower processing part is installed on the rotating shaft part and discharges the lower processing material to the lower part of the substrate.

11. The substrate processing apparatus according to claim 10, wherein: The lower processing unit comprises: a lower storage section for storing one or more lower processing materials; a lower guide portion, mounted on the rotating shaft portion, and guiding one or more lower processing materials; and The lower nozzle portion is formed at an upper portion of the lower guide portion and discharges one or more of the lower treatment materials.

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